CN201673932U - Packaging structure for LED indicating lamp on membrane switch - Google Patents
Packaging structure for LED indicating lamp on membrane switch Download PDFInfo
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- CN201673932U CN201673932U CN2010201853757U CN201020185375U CN201673932U CN 201673932 U CN201673932 U CN 201673932U CN 2010201853757 U CN2010201853757 U CN 2010201853757U CN 201020185375 U CN201020185375 U CN 201020185375U CN 201673932 U CN201673932 U CN 201673932U
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Abstract
The utility model provides a packaging structure for an LED indicating lamp on a membrane switch, which has simple production process and high yield, and does not affect the view-angle coverage of light emitted by an LED and product pressing handfeel. The packaging structure comprises an LED lamp fixed on the membrane switch, and is characterized in that the LED lamp is of a cuboid, the middle part of the upper surface of which is formed with a spherical bulge in a protruding way, the outer surface of the LED lamp is coated with a shading layer except for the spherical bulge, and the bottom end of the shading layer is fixedly attached to the membrane switch. The shading layer is of a black epoxy resin layer, a black polyester resin layer, a black polyurethane resin layer, a black acrylic resin layer or a black silicone rubber layer. The packaging structure is simple, realizes elevation direction of the packaging and light emission of the LED by only one process, and lead the emitted light to focus on a lighted part more collectively due to the arrangement of the spherical bulge on an light-emitting area, so that a larger view-angle coverage can be obtained from the upper end of the irradiated part.
Description
Technical field
The utility model relates to a kind of thin film switch LED light encapsulating structure.
Background technology
The LED light of computer membrane keyboard is encapsulated on the thin film switch usually, and they are at Thin-film key
Provide during dish work vertically to the point-source of light indicative function.
The LED that generally adopts in the industry is encapsulated as the complete encapsulating structure of UV resin at present, as shown in fig. 1.It is on thin film switch 1, with UV resin 2 rectangular-shaped LED lamp 3 is sealed fully, and then through UV-irradiation, UV resin 2 solidifies immediately, thereby reaches the encapsulation purpose.This encapsulating structure is when keyboard is worked, and the LED lamp vertically to having bigger light intensity, has played indicative function at keyboard.But with the keyboard parallel direction on, each contiguous orientation of LED lamp also is illuminated, and has influenced keyboard and bring user's specialty sense and attractive in appearance when work.
For addressing the above problem, produced technology as shown in Figure 2, this technology is after with UV resin 2 ' LED lamp 3 ' being sealed fully, to paste a black shading silica gel lampshade 4 ' more in the top, it can be limited in the light guide of LED lamp 3 ' from light hole 5 ' and penetrate, as shown in Figure 2.But this structure implementing process is loaded down with trivial details, and the volume production rate of finished products is low, and the introducing of lampshade increased the local height of thin film switch greatly, and the angular field of view that this had both dwindled the bright dipping of LED lamp has influenced the feel of product again.
Summary of the invention
The utility model provides a kind of thin film switch LED light encapsulating structure, and purpose is to solve the prior art problem, provides that a kind of production technology is simple, rate of finished products is high, and does not influence LED bright dipping angular field of view and product is pushed the LED lamp encapsulation structure of feel.
The utility model technical scheme that adopts of dealing with problems is:
Thin film switch LED light encapsulating structure, include cuboid LED lamp, the LED lamp is fixed on the thin film switch, the outstanding hemisphere jut that forms of this cuboid upper surface pars intermedia, on LED lamp outer surface, except that the hemisphere jut zone, all be covered with light shield layer, and the bottom of light shield layer is adhered to and is fixed on the thin film switch.
Described light shield layer is black epoxy layer or black polyester resin bed or black polyurethane resin bed or black acrylate resin layer or black silicon rubber layer.
Described light shield layer is light-cured resin or heat reactive resin or cold setting resin.
The beneficial effects of the utility model: the utility model is selected the LED lamp of rectangular-shaped dribbling shape projection for use, and hemisphere jut can limit the directivity of LED lamp bright dipping effectively, and emergent ray is concentrated in the high spot performance.Adopt light shield layer that the zone except that hemisphere jut around the LED lamp of rectangular-shaped dribbling shape projection is sealed, solidified.Not entrapped hemisphere jut then is the bright dipping zone of LED lamp.The encapsulation that this encapsulating structure has only promptly been realized the LED lamp by a step operation and bright dipping vertical to, and the bright dipping zone has hemisphere jut, emergent ray can be invested illuminated position than the concentrated area, can obtain bigger angular field of view on illuminated position.And whole encapsulating structure is succinct, and implementing process is simple, and volume production efficient height also has good feel simultaneously.
Description of drawings
Fig. 1 is the cutaway view of prior art 1;
Fig. 2 is the cutaway view of prior art 2;
Fig. 3 is a cutaway view of the present utility model.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Thin film switch LED light encapsulating structure as shown in Figure 3 includes LED lamp 10, and LED lamp 10 is fixed on the thin film switch 20.Described LED lamp 10 is a cuboid, and the outstanding hemisphere jut 12 that forms of these cuboid upper surface 11 pars intermedias, all is covered with shading resin 30 on LED lamp 10 outer surfaces except that hemisphere jut 12 zones, and the bottom of shading resin 30 is adhered to and is fixed on the thin film switch 20.Described shading resin 30 can be black epoxy layer or black polyester resin bed or black polyurethane resin bed or black acrylic resin, and it can be light-cured resin or heat reactive resin or cold setting resin.Except aforesaid shading resin, can also adopt other materials with similar functions, as black silicon rubber, and more than black, other color with shaded effect also can adopt.
When the light of LED lamp 10 penetrates, because except hemisphere jut 12 zones of LED lamp upper surface, the outer surface of LED lamp 10 is all sealed, is covered by shading resin 30, so light can not see through these and seal the zone and penetrate, and can only penetrate by non-encapsulated hemisphere jut 12 zones.Hemisphere jut 12 is positioned at upper surface 11 pars intermedias of LED lamp simultaneously, so light can only upwards penetrate.Hemisphere jut 12 not only can limit the directivity of LED lamp 10 bright dippings effectively, and emergent ray can be concentrated the increase luminous intensity in the performance of protruding 12 places.The encapsulation that this encapsulating structure has only promptly been realized LED lamp 10 by a step operation and bright dipping vertical to, and the bright dipping zone has hemisphere jut 12, emergent ray can be invested illuminated position than the concentrated area, and can obtain bigger angular field of view in upper end, illuminated position.The utility model encapsulating structure is succinct, and implementing process is simple, and volume production efficient height also has good feel simultaneously.
Claims (3)
1. thin film switch LED light encapsulating structure, include the LED lamp, the LED lamp is fixed on the thin film switch, it is characterized in that: described LED lamp is a cuboid, and the outstanding hemisphere jut that forms of this cuboid upper surface pars intermedia, on LED lamp outer surface, except that the hemisphere jut zone, all be covered with light shield layer, and the bottom of light shield layer is adhered to and is fixed on the thin film switch.
2. the thin film switch LED light encapsulating structure described in claim 1, it is characterized in that: described light shield layer is black epoxy layer or black polyester resin bed or black polyurethane resin bed or black acrylate resin layer or black silicon rubber layer.
3. the thin film switch LED light encapsulating structure described in claim 1, it is characterized in that: described light shield layer is light-cured resin or heat reactive resin or cold setting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201853757U CN201673932U (en) | 2010-05-11 | 2010-05-11 | Packaging structure for LED indicating lamp on membrane switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201853757U CN201673932U (en) | 2010-05-11 | 2010-05-11 | Packaging structure for LED indicating lamp on membrane switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201673932U true CN201673932U (en) | 2010-12-15 |
Family
ID=43331340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201853757U Expired - Fee Related CN201673932U (en) | 2010-05-11 | 2010-05-11 | Packaging structure for LED indicating lamp on membrane switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201673932U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104103746A (en) * | 2013-04-03 | 2014-10-15 | 弘凯光电(深圳)有限公司 | Packaging structure for light-emitting diode and manufacturing method |
| CN104465968A (en) * | 2013-09-23 | 2015-03-25 | 弘凯光电(深圳)有限公司 | Light-emitting diode packaging structure and manufacturing method thereof |
| CN106157824A (en) * | 2015-04-13 | 2016-11-23 | 弘凯光电(深圳)有限公司 | Led display panel |
| US9525113B2 (en) | 2013-09-23 | 2016-12-20 | Brightek Optoelectronic (Shenzhen) Co., Ltd. | Method of manufacturing a LED package structure for preventing lateral light leakage |
-
2010
- 2010-05-11 CN CN2010201853757U patent/CN201673932U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104103746A (en) * | 2013-04-03 | 2014-10-15 | 弘凯光电(深圳)有限公司 | Packaging structure for light-emitting diode and manufacturing method |
| CN104103746B (en) * | 2013-04-03 | 2017-03-08 | 弘凯光电(深圳)有限公司 | Package structure for LED and preparation method thereof |
| CN104465968A (en) * | 2013-09-23 | 2015-03-25 | 弘凯光电(深圳)有限公司 | Light-emitting diode packaging structure and manufacturing method thereof |
| US9525113B2 (en) | 2013-09-23 | 2016-12-20 | Brightek Optoelectronic (Shenzhen) Co., Ltd. | Method of manufacturing a LED package structure for preventing lateral light leakage |
| CN104465968B (en) * | 2013-09-23 | 2017-08-29 | 弘凯光电(深圳)有限公司 | Package structure for LED and preparation method thereof |
| CN106157824A (en) * | 2015-04-13 | 2016-11-23 | 弘凯光电(深圳)有限公司 | Led display panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 Termination date: 20180511 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |