CN202076267U - Light emitting diode (LED) with chip on board (COB) packaging structure - Google Patents
Light emitting diode (LED) with chip on board (COB) packaging structure Download PDFInfo
- Publication number
- CN202076267U CN202076267U CN2011201742725U CN201120174272U CN202076267U CN 202076267 U CN202076267 U CN 202076267U CN 2011201742725 U CN2011201742725 U CN 2011201742725U CN 201120174272 U CN201120174272 U CN 201120174272U CN 202076267 U CN202076267 U CN 202076267U
- Authority
- CN
- China
- Prior art keywords
- led
- hole
- substrate
- glue
- cob
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a light emitting diode (LED) with a chip on board (COB) packaging structure, which comprises a basal plate, a glue casing and an LED chip, wherein the glue casing is arranged on the basal plate, a through hole is arranged on the glue casing, and the LED chip is arranged on the basal plate; and moreover, the LED chip is positioned in the through hole, fluorescent powder glue is packaged in the through hole, and radiant paint is coated on the upper surface, the lower surface and the side face of the basal plate. The LED with the structure not only has high light effect but also is convenient for spot gluing. Meanwhile, the LED with the COB packaging structure is easy to process and has a low cost and a good heat-radiation effect.
Description
Technical field
The utility model relates to the LED of COB encapsulating structure.
Background technology
Along with the LED technology rapid development, LED almost has application in industry-by-industry, and in gradually replacement conventional light source.At present, in order to satisfy the needs in different application field, the LED encapsulation technology is in continuous progress, and packing forms becomes more diversified.Wherein, COB promptly is a kind of of packing forms.As being to be to be to have disclosed a kind of COB modularized LED encapsulation technology in the patent documentation on September 29th, 2010 in open day of on March 26th, 2,009 200910029883.8 applyings date at application number, related LED encapsulating structure comprises aluminium base, led chip and optical lens, the plurality of LEDs chip is directly solid brilliant on aluminium base, after applying fluorescent material, encapsulate an optical lens again in every LEDs chip outside.This LED encapsulating structure is fluorescent material and glue to be mixed into fluorescent glue directly be coated on the led chip, because fluorescent glue has certain fluidity, therefore, is inconvenient to put glue again, is difficult to guarantee the uniformity of fluorescent material, thereby influences the photochromic uniformity of LED.In addition, at application number is to be to disclose on September 28th, 2010 to disclose a kind of COB encapsulation aluminium base that can effectively improve light efficiency in the patent documentation that day is on April 6th, 2,011 201010506233.0 applyings date, comprise the aluminium base body, the pit that led chip is installed is set on the aluminium base body, and pit is tubaeform that the bottom is little, opening is big.Though the aluminium base of this structure can improve the light efficiency of led chip by pit,, pit is a blind hole, is adding inconvenience very in man-hour, thereby is improving processing cost.
Summary of the invention
The purpose of this utility model provides a kind of LED of COB encapsulating structure, and the LED of this structure is the light efficiency height not only, and is convenient to a glue, and simultaneously handling ease, cost are low.
For achieving the above object, a kind of LED of COB encapsulating structure comprises substrate, glue shell and led chip, described glue shell is located on the substrate, is provided with through hole in the glue shell, and led chip is located on the substrate, and led chip is positioned at through hole, is packaged with phosphor gel in the described through hole.
Above-mentioned LED structure, owing to be provided with through hole, and led chip is positioned at through hole, when led chip was luminous, through hole was equivalent to reflector, therefore, can improve the light efficiency of LED; Owing to be provided with through hole, when dot fluorescent powder glue, can determine the position of dot fluorescent powder glue accurately, therefore, convenient some glue, and through hole has restriction to phosphor gel mobile, like this, can not only save phosphor gel, and the good evenness of phosphor gel, therefore, led chip sends the uniformity of light; Owing to be provided with the glue shell separately, when moulding, the independent moulding of substrate, the independent moulding of glue shell, and the setting of glue shell is through hole, can directly pass through mould molding glue shell, like this, has then simplified the manufacturing process of LED, thereby has reduced manufacturing cost.
As improvement, described through hole is a back taper.The through hole of back taper can effectively reflect away light, thereby improves luminous efficiency.
As improvement, be coated with coating on the inwall of back taper through hole.After coating is set, can improve reflection of light efficient, thereby, light efficiency further improved.
As improvement, substrate is provided with the stationary positioned hole, and the bottom surface of glue shell is provided with the stationary positioned post, and described stationary positioned post is plugged in the stationary positioned hole.Stationary positioned post and stationary positioned hole are set, and on the one hand are for the glue shell is fixed on the substrate, and the dismounting after being convenient to install, and are to be installed to positional precision on the substrate in order to improve the glue shell on the other hand.
As improvement, be provided with bonding glue-line between substrate and the glue shell.After bonding glue-line is set, can improve the bonding strength of glue shell and substrate on the one hand, have waterproof and dampproof effect on the other hand, to improve reliability and the life-span of LED.
As improvement, corresponding each led chip is packaged with an optical lens respectively on the glue shell.It is in order to change rising angle and light spatial distribution, to be applicable to actual needs that optical lens is set.
As improvement, be coated with the radiation enamelled coating on the substrate.
As specializing, the radiation enamelled coating is coated on the lower surface of substrate.
As specializing, the radiation enamelled coating is coated on the upper surface of substrate.
As specializing, the radiation enamelled coating is coated on upper surface, lower surface and the side of substrate.
After the radiation enamelled coating is set, can not only dispel the heat by heat conduction, and, can dispel the heat by thermal radiation, thereby improve radiating efficiency, according to experimental data, set up the radiation enamelled coating after, temperature can reduce by 15% ~ 20%.
Description of drawings
Fig. 1 is the LED stereogram of COB encapsulating structure.
Fig. 2 is the A-A cutaway view of Fig. 3.
Fig. 3 is the LED vertical view of COB encapsulating structure.
Fig. 4 is the stereogram of glue shell.
Fig. 5 is the front view of glue shell.
Fig. 6 is the upward view of glue shell.
Fig. 7 is the vertical view of glue shell.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is further elaborated.
As shown in Figure 1 to Figure 3, the LED of COB encapsulating structure comprises substrate 1, glue shell 2, led chip 3, optical lens 4, phosphor gel 5.Described substrate 1 is provided with installing hole 11 and electrode 12, and the shape of substrate 1 can be circle, square or other arbitrary shapes; On substrate 1, be provided with stationary positioned hole (not shown).Led chip 3 is located on the substrate 1.To shown in Figure 7, described glue shell 2 is provided with the through hole 21 that equates with led chip quantity as Fig. 4, and described through hole 21 is a back taper, is coated with coating on the inwall inwall of through hole 21, to improve light efficiency; Be provided with stationary positioned post 6 in the bottom of glue shell 2, described stationary positioned post 6 by with the cooperating of stationary positioned hole, on the one hand be for the glue shell is fixed on the substrate, and the dismounting after being convenient to install, be to be installed to positional precision on the substrate on the other hand in order to improve the glue shell; In order to improve the bonding strength of glue shell 2 and substrate 1, and improve water resistance, between substrate 1 and glue shell 2, be provided with bonding glue-line.5 of described phosphor gel are in through hole.Described optical lens 4 is encapsulated on each led chip.
The LED of present embodiment owing to be provided with the through hole 21 of back taper, simultaneously, has applied coating in the inwall of through hole, and led chip 3 is positioned at through hole, and when led chip was luminous, through hole and coating were equivalent to reflector, therefore, can improve the light efficiency of LED; Owing to be provided with through hole 21, when dot fluorescent powder glue, can determine the position of dot fluorescent powder glue accurately, therefore, convenient some glue, and through hole has restriction to phosphor gel mobile, like this, can not only save phosphor gel, and the uniformity of phosphor gel is big, and therefore, the uniformity of the light that led chip sends might as well; Because the independent glue shell 2 that is provided with, when moulding, the independent moulding of substrate, the independent moulding of glue shell, and the setting of glue shell is through hole, can directly pass through mould molding glue shell, like this, has then simplified the manufacturing process of LED, thereby has reduced manufacturing cost.
In general, the COB encapsulating structure is generally great power LED, therefore, heat radiation is very big to the life-span influence of LED, in the utility model, in order to improve radiating effect, set up the radiation enamelled coating at upper surface of base plate or base lower surface or upper surface of base plate, lower surface and side, like this, can not only dispel the heat by heat conduction, and, can dispel the heat by thermal radiation, thereby improve radiating efficiency, according to experimental data, after setting up the radiation enamelled coating, temperature can reduce by 15% ~ 20%.
Claims (10)
1. the LED of a COB encapsulating structure, it is characterized in that: comprise substrate, glue shell and led chip, described glue shell is located on the substrate, the glue shell is provided with through hole, led chip is located on the substrate, and led chip is positioned at through hole, is packaged with phosphor gel in the described through hole.
2. the LED of COB encapsulating structure according to claim 1 is characterized in that: described through hole is a back taper.
3. the LED of COB encapsulating structure according to claim 2 is characterized in that: be coated with coating on the inwall of back taper through hole.
4. the LED of COB encapsulating structure according to claim 1 is characterized in that: substrate is provided with the stationary positioned hole, and the bottom surface of glue shell is provided with the stationary positioned post, and described stationary positioned post is plugged in the stationary positioned hole.
5. the LED of COB encapsulating structure according to claim 4 is characterized in that: be provided with bonding glue-line between substrate and the glue shell.
6. the LED of COB encapsulating structure according to claim 1 is characterized in that: corresponding each led chip is packaged with an optical lens respectively on the glue shell.
7. the LED of COB encapsulating structure according to claim 1 is characterized in that: be coated with the radiation enamelled coating on the substrate.
8. the LED of COB encapsulating structure according to claim 7 is characterized in that: the radiation enamelled coating is coated on the lower surface of substrate.
9. the LED of COB encapsulating structure according to claim 7 is characterized in that: the radiation enamelled coating is coated on the upper surface of substrate.
10. the LED of COB encapsulating structure according to claim 7 is characterized in that: the radiation enamelled coating is coated on upper surface, lower surface and the side of substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201742725U CN202076267U (en) | 2011-05-27 | 2011-05-27 | Light emitting diode (LED) with chip on board (COB) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201742725U CN202076267U (en) | 2011-05-27 | 2011-05-27 | Light emitting diode (LED) with chip on board (COB) packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202076267U true CN202076267U (en) | 2011-12-14 |
Family
ID=45114356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201742725U Expired - Fee Related CN202076267U (en) | 2011-05-27 | 2011-05-27 | Light emitting diode (LED) with chip on board (COB) packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202076267U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569619A (en) * | 2011-12-30 | 2012-07-11 | 广州市鸿利光电股份有限公司 | Method for making chip-on-board (COB) light source |
| CN106449950A (en) * | 2016-08-25 | 2017-02-22 | 深圳市晶台股份有限公司 | Manufacturing method of MLCOB light source |
-
2011
- 2011-05-27 CN CN2011201742725U patent/CN202076267U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569619A (en) * | 2011-12-30 | 2012-07-11 | 广州市鸿利光电股份有限公司 | Method for making chip-on-board (COB) light source |
| CN102569619B (en) * | 2011-12-30 | 2016-11-23 | 鸿利智汇集团股份有限公司 | A kind of manufacture method of COB light source |
| CN106449950A (en) * | 2016-08-25 | 2017-02-22 | 深圳市晶台股份有限公司 | Manufacturing method of MLCOB light source |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103022325B (en) | The LED encapsulation structure of application long distance formula phosphor powder layer and method for making thereof | |
| CN102777798B (en) | LED down light taking base bracket as mounting interface | |
| CN103199183A (en) | Packaging structure enhancing brightness of vertical light-emitting diode (LED) chip | |
| CN203760472U (en) | System-level LED packaging device | |
| CN201732785U (en) | LED module and LED lighting fixture | |
| CN201359209Y (en) | Flat-plate type lens integrated LED light source | |
| CN103094268A (en) | Light-emitting diode (LED) module used for commercial lighting and manufacturing method thereof | |
| CN202076267U (en) | Light emitting diode (LED) with chip on board (COB) packaging structure | |
| CN102927475A (en) | Light-emitting diode (LED) light source module | |
| CN102818174B (en) | Road lamp using mounting interface bracket structure | |
| CN103325926A (en) | LED packaging structure used in on-board chip and fluorescent powder coating method thereof | |
| CN103117352B (en) | A kind of LED encapsulation structure and realize the method for fluorescent material shape-preserving coating based on it | |
| CN202708751U (en) | Uniform-light type light-emitting diode (LED) tube light | |
| CN205081143U (en) | Two -sided luminous UV encapsulation of LED stereoplasm base plate | |
| CN102338292A (en) | LED (Light-emitting Diode) device | |
| CN204230295U (en) | A kind of LED matrix of COB encapsulation | |
| CN113745207A (en) | Manufacturing method of 2835 high-luminous-efficiency light source | |
| CN203099373U (en) | Light-emitting diode (LED) light source module | |
| CN202905789U (en) | High reflectivity heat dissipation line substrate and LED device thereof | |
| CN102818181B (en) | LED (Light-Emitting Diode) project lamp utilizing extrusion type heat radiator | |
| CN203055985U (en) | LED packaging structure | |
| CN102818183B (en) | LED (Light-Emitting Diode) tunnel lamp using lamp shell as mounting interface bracket structure | |
| CN202674896U (en) | White light light-emitting diode (LED) light source module with build-in convex lens | |
| CN203351649U (en) | COB (Chip On Board) LED packaging structure | |
| CN208418198U (en) | A kind of LED lamp bead module of perfect heat-dissipating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: 510800 Dongfeng Road West, automobile city, Huadu District, Guangdong, Guangzhou Patentee before: Guangzhou Hongli Tronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111214 Termination date: 20190527 |