MY154178A - Optoelectronic part producing method,optoelectronic part producing system,and optoelectronic part - Google Patents

Optoelectronic part producing method,optoelectronic part producing system,and optoelectronic part

Info

Publication number
MY154178A
MY154178A MYPI2012000931A MYPI2012000931A MY154178A MY 154178 A MY154178 A MY 154178A MY PI2012000931 A MYPI2012000931 A MY PI2012000931A MY PI2012000931 A MYPI2012000931 A MY PI2012000931A MY 154178 A MY154178 A MY 154178A
Authority
MY
Malaysia
Prior art keywords
sealed substrate
optoelectronic part
sealed
carrier
lower die
Prior art date
Application number
MYPI2012000931A
Inventor
Kawakubo Kazuki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY154178A publication Critical patent/MY154178A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PROVIDED IS A TECHNIQUE FOR FACILITATING THE HANDLING OF A PRE-SEALED OR SEALED SUBSTRATE SO AS TO PRODUCE LED PACKAGES (38) (OR OTHER TYPES OF OPTOELECTRONIC PARTS) WITH HIGH PRODUCTIVITY. AFTER A PRE-SEALED SUBSTRATE (1) IS FITTED IN A CARRIER (14), THE CARRIER IS FIXED TO AN UPPER DIE (18). NEXT, A LOWER DIE (17) AND THE UPPER DIE (18) ARE CLOSED, WHEREBY LED CHIPS (13) MOUNTED ON THE PRE-SEALED SUBSTRATE ARE IMMERSED IN A FLUID RESIN (26) STORED IN THE CAVITIES OF THE LOWER DIE. SUBSEQUENTLY, THE FLUID RESIN IS HARDENED INTO A CURED RESIN (28). THUS, THE LED CHIPS ARE COLLECTIVELY SEALED WITH RESIN. AFTER THAT, THE LOWER DIE AND THE UPPER DIES ARE OPENED, AND THE CARRIERS WITH THE SEALED SUBSTRATE (29) HELD THEREIN IS REMOVED. THEN, THE SEALED SUBSTRATE IS PUSHED OUT OF THE CARRIER, AND THE SEALED SUBSTRATE IS CUT. AS A RESULT, THE SEALED SUBSTRATE IS DIVIDED INTO INDIVIDUAL LED PACKAGES EACH OF WHICH HAS ONE LED CHIP.
MYPI2012000931A 2011-03-02 2012-03-01 Optoelectronic part producing method,optoelectronic part producing system,and optoelectronic part MY154178A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011044817A JP5562273B2 (en) 2011-03-02 2011-03-02 Optoelectronic component manufacturing method and manufacturing apparatus

Publications (1)

Publication Number Publication Date
MY154178A true MY154178A (en) 2015-05-15

Family

ID=46730782

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012000931A MY154178A (en) 2011-03-02 2012-03-01 Optoelectronic part producing method,optoelectronic part producing system,and optoelectronic part

Country Status (6)

Country Link
JP (1) JP5562273B2 (en)
KR (1) KR101296349B1 (en)
CN (1) CN102655189B (en)
MY (1) MY154178A (en)
SG (1) SG183652A1 (en)
TW (1) TWI463707B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5658108B2 (en) * 2011-08-23 2015-01-21 Ｔｏｗａ株式会社 Manufacturing method and manufacturing apparatus for substrate with reflector
JP5764821B2 (en) * 2011-08-25 2015-08-19 アピックヤマダ株式会社 Compression molding method and apparatus
CN103237412B (en) * 2013-03-27 2016-03-23 苏州远创达科技有限公司 A kind of soft copy mounting structure and manufacture method, soft copy product
DE102013220960A1 (en) * 2013-10-16 2015-04-30 Osram Opto Semiconductors Gmbh Optoelectronic component and method for its production
KR102396332B1 (en) 2015-09-22 2022-05-12 삼성전자주식회사 Fine interval coating member for led dispaly and coating method using the same
TWI575620B (en) * 2016-03-10 2017-03-21 南茂科技股份有限公司 Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure
GB2551770B (en) * 2016-06-30 2018-09-26 Shu Hung Lin Chip scale LED packaging method
TWI787417B (en) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 Mold for compression molding and compression molding device
US11103937B2 (en) * 2019-02-28 2021-08-31 The Boeing Company Methods and devices for machining a chilled workpiece
CN111162012B (en) * 2019-12-31 2022-03-22 中芯集成电路（宁波）有限公司 Wafer level packaging method and wafer level packaging structure
KR102643433B1 (en) * 2023-09-20 2024-03-06 주식회사 아이엘사이언스 Line type LED array manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2787388B2 (en) * 1992-03-06 1998-08-13 シャープ株式会社 Light emitting device lens molding method
JPH091596A (en) * 1995-06-20 1997-01-07 Hitachi Ltd Molding device
JP2001160564A (en) * 1999-12-03 2001-06-12 Apic Yamada Corp Resin sealing apparatus
JP5004410B2 (en) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 Optical element resin sealing molding method and resin sealing molding apparatus
JP2006027098A (en) * 2004-07-16 2006-02-02 Apic Yamada Corp Resin molding method and resin molding device
JP5128047B2 (en) 2004-10-07 2013-01-23 Ｔｏｗａ株式会社 Optical device and optical device production method
US9061450B2 (en) 2007-02-12 2015-06-23 Cree, Inc. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
JP2008227119A (en) * 2007-03-13 2008-09-25 Shin Etsu Chem Co Ltd Integral structure of light-emitting diode chip and lens, and its manufacturing method
JP4744573B2 (en) 2008-01-23 2011-08-10 サンユレック株式会社 Manufacturing method of electronic device
JP5174630B2 (en) * 2008-11-26 2013-04-03 Ｔｏｗａ株式会社 Compression molding method for optical molded products
KR100920335B1 (en) * 2009-04-29 2009-10-07 우리마이크론(주) Device for molding of semi-conductor and controlling method for the same

Also Published As

Publication number Publication date
SG183652A1 (en) 2012-09-27
TW201238096A (en) 2012-09-16
KR101296349B1 (en) 2013-08-14
JP2012182345A (en) 2012-09-20
TWI463707B (en) 2014-12-01
CN102655189B (en) 2014-11-05
KR20120100793A (en) 2012-09-12
JP5562273B2 (en) 2014-07-30
CN102655189A (en) 2012-09-05

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