TWI787417B - Mold for compression molding and compression molding device - Google Patents

Abstract

Provided is a mold device for compression molding which is highly versatile and capable of performing compression molding with high precision while absorbing variations in the thickness of workpieces or variations in the amount of resin when a plurality of workpieces are arranged in parallel to perform compression molding individually.

The mold device for compression molding includes: an upper mold 2 having a workpiece holding portion 2a for individually holding a plurality of workpieces W; The holder 5e that the workpiece is independently configured and the mold cavity part 5d that presses the resin and moves relatively while being inserted into the holder 5e to form a plurality of lower mold cavity recesses 3a, and the upper mold 2 is set according to each Each of the workpieces W is provided with an adjustment mechanism 8 for individual height adjustment.

Description

Mold for compression molding and compression molding device

This disclosure relates to a mold base for a mold, a mold case unit for a mold, a mold for compression molding, and a compression molding apparatus using the same for individually clamping and simultaneously compressing and molding a plurality of workpieces arranged in parallel.

Cover the concave portion of the lower mold cavity of the lower mold with a release film, and the concave portion of the lower mold cavity is supplied with molding resin (granular resin, liquid resin, powdery resin, etc.), and is clamped on the upper mold to hold the workpiece. Various devices have been developed and put into practical use by molding dies for compression molding (refer to Japanese Patent Application Laid-Open No. 2010-36542).

As for the molding dies for compression molding of the lower cavity movable die, since the mainstream is a device for resin molding one workpiece with one die, it is also proposed to use it in the height direction from the viewpoint of reducing the installation area and improving productivity. A compression molding device with a two-layer compression molding mold (refer to Japanese Patent Laid-Open No. 2010-94931).

However, for example, in the case of compression molding a strip-shaped substrate as a workpiece, in the case of a resin substrate, the variation in thickness is greater than that of a lead frame, and it is mounted on a single strip substrate. The number of semiconductor wafers in the system may vary due to defective semiconductor wafers. In addition, when the number of semiconductor chips mounted on one tape substrate changes, if the supply amount of molding resin does not change, the molded thickness of the final package part (resin sealing part) will be reduced due to compression molding. Change. It is difficult to perform compression molding while shortening the molding time while making overall adjustments to these.

Therefore, several compression molding devices have been proposed that arrange strip substrates in two rows in parallel to perform compression molding like a mold for transfer molding (refer to JP-A-2011-143730, JP-A-2012-40843 Bulletin).

prior art literature patent documents

Patent Document 1 Japanese Unexamined Patent Publication No. 2010-36542

Patent Document 2 Japanese Unexamined Patent Application Publication No. 2010-94931

Patent Document 3 Japanese Patent Laid-Open No. 2011-143730

Patent Document 4 Japanese Unexamined Patent Application Publication No. 2012-40843

The above-mentioned compression molding device of Japanese Patent Application Laid-Open No. 2011-143730 is equipped with a pair of molding dies for compression molding, the lower die is supported on the movable plate, and the clamping member forming two cavities and two dies are supported on the lower die. Slide widget. Mounting rods are provided on the inner side (lower side) of the sliding member constituting the bottom of the cavity, and elastic members are wound around the respective mounting rods. Thereby, each sliding member is supported slidably with respect to the clamping member surrounding it. Moreover, the adjusting hand for receiving the mounting rods of each sliding member is made The segment system can press the molten resin evenly by rotating in a balance around a shaft supported by the movable plate. However, since the adjustment means only rotates in a balance around one axis provided on the movable plate to absorb the deviation in the amount of resin supplied to the left and right cavities, there is a need for strength in the adjustment means. question. If the strength of the adjustment means is insufficient, there is a risk of damage, and the deviation in the amount of resin cannot be absorbed when the sliding member is not functioning. In addition, when performing maintenance work on the mold, or when compressing and molding different workpieces, it is necessary to remove the upper mold and the lower mold from the compression molding apparatus. In this case, it is necessary to remove the entire upper die holding the pair of workpieces from the fixed platen, and it is necessary to remove the entire lower die having two cavities from the movable platen, so the scale of the work is huge.

Also, in the mold for compression molding of JP-A-2012-40843, the two upper compression molds that absorb and hold the strip substrate are respectively suspended and supported by the upper main mold through buffer springs. Around the two upper compression molds, one upper frame mold is suspended and supported on the upper main mold by a spacer spring. In addition, the lower main mold arranged opposite to the upper main mold supports two lower compression molds constituting the cavity of the lower mold and a lower frame mold into which these are inserted. Relative to the lower main mold, the lower compression mold system is supported and fixed, and the lower frame mold system is supported floatingly through spacer springs. One piece of release film is adsorbed and held on the surfaces of the two lower compression molds and the lower frame mold. The plate thickness error of the strip substrates held by suction on the upper compression die is absorbed by the deflection of the buffer spring. Although the plate thickness error can be absorbed by the upper compression mold, the lower frame mold system between the two strips is common and will sandwich the strips, so the lower frame mold may be tilted during clamping due to the thickness difference of the strips Yu. Furthermore, when the height of the left and right molds changes due to the difference in the amount of resin supplied to the cavity of the lower mold, one side may not be filled or not reached. Examples of target resin pressure or the possibility of inclination of the entire press machine (especially the lower die which is a movable die). Also, since a release film covering two lower die cavities (two lower compression dies and a lower frame die) is used for compression molding of two tape substrates, when the release film is adsorbed and held, mutual Pulling the release film makes it difficult to stick in place. In addition, since the surfaces of the two lower mold cavities must be covered with one release film, handling is difficult, and an unnecessary use area that does not contribute to compression molding occurs. In addition, in the case of maintenance of the mold or compression molding of different types of workpieces, it is necessary to replace the two upper compression molds suspended and supported by the buffer spring on the upper main mold as a whole. It is necessary to remove the two lower compression molds supported by the lower main mold and the lower frame mold inserted into them and supported by the float for integral removal, so the mold exchange work becomes labor-intensive.

The disclosure applied to several embodiments described below is made to solve the above-mentioned problems.

The first object is to provide a highly versatile compression molding mold and a highly versatile compression molding device using the same, which can maintain high productivity and maintain molding quality, and can compress individually while absorbing a plurality of workpieces arranged in parallel. Compression molding is performed with high precision while taking into account variations in the thickness of the workpiece and variations in the amount of resin during molding.

The second object is to provide a mold holder for a compression molding mold, which can easily perform the exchange operation of a plurality of mold sets and has high versatility. In addition, there is provided a mold for compression molding, which can be adjusted at the same time by a plurality of mold sets arranged side by side with the above mold bases arranged side by side. Compression molding can be performed with high precision due to the variation in mold height when the mold is clamped during compression molding.

The third object is to provide a mold case unit, which is easy to handle the film during compression molding and reduces unnecessary use area, and makes the thickness of the sealing part constant to improve the molding quality because the film is not easy to produce wrinkles. Also, to provide a mold for compression molding, even if a plurality of mold housing units are arranged side by side in the mold base, it can absorb the deviation of the thickness of the workpiece and the amount of resin, so that the molding quality is high, and the exchange workability of the mold housing is improved.

The disclosure concerning several embodiments described below has at least the following configurations. That is, a mold for compression molding that individually clamps a plurality of workpieces arranged side by side in a horizontal direction and performs compression molding at the same time, is characterized by comprising: a first mold having a workpiece for individually holding the plurality of workpieces a holding part; and a second mold, which is disposed opposite to the workpiece holding part, and is opposed to each other by holding a holder independently configured for each workpiece and maintaining a state of being inserted into the holder The mold cavity part of moving and pressurizing the resin forms a plurality of mold cavity recesses, and the aforementioned first mold is equipped with an adjustment mechanism for individually adjusting the height of each of the aforementioned workpieces.

According to the above configuration, molding resin is supplied to the plurality of cavity recesses formed in the second mold, and compression molding can be performed for each workpiece by closing the mold with the workpiece held by the plurality of workpiece holding portions of the first mold. At this time, even if there are deviations in the thickness of the plurality of workpieces or supply The amount of resin to the recesses of the plurality of cavities varies, and the deviation of the height of the mold when the mold is clamped by the adjustment mechanism provided in the first mold is adjusted individually for each workpiece, so the resin sealing part (sealed part) can be adjusted ) The thickness is compressed and molded with high precision.

In addition, when the dies are exchanged due to tooling change, since the adjustment mechanism provided on the first die can be used in common, the versatility is improved.

Preferably, the first mold is such that the first mold case units having the workpiece holding portion on the first mold base are individually arranged side by side in a row, and the adjustment mechanism is configured to move the first mold from the first mold base. Each of the cover units is biased in a direction away from the mold opening and closing direction by spring units, which individually adjust the deviation of the mold height of the first mold cover units arranged side by side on the first mold holder when the mold is clamped.

Thereby, since the spring unit included in the adjustment mechanism individually adjusts the deviation of the mold height at the time of mold clamping for each of the first die set units arranged in parallel in the lateral direction, it is possible to adjust the plate of the workpiece according to the first die set unit. Deviation of thickness, deviation of resin amount. Moreover, even if the first mold set unit is replaced, the adjustment mechanism provided on the first mold base can still be used as usual.

Alternatively, the second mold may be such that the second mold case units having the cavity concave portion on the second mold base are arranged side by side in a horizontal manner, and each second mold case unit may be a mold forming the bottom of the cavity concave portion. The cavity part and the clamper surrounding the cavity part and forming the side part of the concave part of the cavity are supported so as to be relatively movable to the second mold base.

Thereby, because the workpieces held by the workpiece holders of the plurality of first mold case units arranged side by side and arranged side by side on the first mold are opposed to the mold cavity parts by the holders of the second mold case units arranged oppositely, Since it is pressed and clamped individually, it is possible to carry out compression molding individually for each workpiece without tilting the whole of the first mold or the second mold due to the deviation of the plate thickness of the workpiece and the deviation of the amount of resin.

Preferably, the film covering the clamping surface of the lower mold containing the concave portion of the mold cavity is sucked and held by each of the aforementioned second mold casing units.

In this way, when the film covering the clamping surface of the lower mold is used for each second mold set unit, it is easy to handle when the clamping surface of the lower mold containing the concave part of the cavity of the lower mold is sucked and held, and the thin film such as a long film can be avoided as much as possible. Typically results in wasted use area that does not contribute to compression molding.

It can also be: a mold for compression molding, which has: an upper mold mold base; an upper mold mold cover unit, a spacer adjustment mechanism that can be detachably assembled on the aforementioned upper mold mold base, and has a workpiece holding part on the clamping surface of the upper mold; The lower mold base is arranged opposite to the aforementioned upper mold base; and the lower mold cover unit is pluggably assembled on the aforementioned lower mold base, and the lower mold cavity configured opposite to the aforementioned workpiece holding portion The cavity part of the lower mold is formed by the part and the holder which surrounds the cavity part of the lower mold and is relatively movably supported.

Since the variation in mold height when the mold is clamped is individually adjusted for each workpiece by the adjustment mechanism provided in the upper mold base, compression molding can be performed with high precision for the thickness of the resin sealing part (sealed part).

It can also be: a pair of the above-mentioned upper mold cover units arranged horizontally are supported on the above-mentioned upper mold base in such a way that the adjustment mechanism is separated from each other. The first upper mold plate and the second upper mold plate having the aforementioned workpiece holding portion, and the pair of lower mold mold sleeve units arranged laterally opposite to the pair of aforementioned upper mold mold sleeve units are respectively detachably arranged on the aforementioned lower mold mold. The mold base and the aforementioned lower mold cover unit are respectively equipped with: the aforementioned lower mold cavity part arranged opposite to the aforementioned first upper template; by surrounding the aforementioned lower mold cavity part and being supported to be relatively movable The formed first lower mold cavity concave part; the second mold formed by the clamper that is arranged opposite to the aforementioned second upper template and surrounds the lower mold cavity and the aforementioned lower mold cavity and is supported to be relatively movable. The concave part of the lower mold cavity.

Thereby, even if a pair of upper mold cover units arranged horizontally are arranged on the upper mold base, a pair of lower mold molds arranged laterally opposite to the pair of upper mold cover units are arranged on the lower mold base. The set unit can also absorb the deviation of the mold height of each mold set unit arranged side by side when the mold is clamped for adjustment. The upper die set unit or the lower die set unit can be independently loaded and unloaded by the upper die base or the lower die base for exchange. Even if the die set is exchanged, the adjustment mechanism located on the upper die base can still be used as usual.

A mold for compression molding is equipped with a plurality of horizontally arranged molds for clamping a singular number of workpieces and compressing and molding resin, and is opened and closed by a common mold opening and closing mechanism, and is characterized in that it has: The first mold has a workpiece holding part that holds the workpiece; and the second mold is configured by a holder that clamps the workpiece and that is inserted into the holder and moves relative to the workpiece. The cavity part of the resin is pressurized to form the cavity recess, and the mold of either the first mold or the second mold is equipped with an adjustment mechanism for height adjustment.

In this case, for example, even for large-sized workpieces that must not be arranged side by side in a plurality of horizontal rows, it is possible to use the first mold or the second mold with a height adjustment mechanism that is mounted in a plurality of horizontal rows and opened and closed by a common mold opening and closing mechanism. The structure of the two molds adjusts the deviation of the mold height corresponding to the large-sized workpiece when the mold is clamped, and performs compression molding with high precision.

A mold for compression molding, which individually clamps a plurality of workpieces arranged side by side in a horizontal direction and performs compression molding at the same time, and is characterized in that it includes: a first mold, and the first base part of the first mold base will hold The workpiece holding parts of the aforementioned workpieces are supported in a horizontal arrangement; and the second mold, which is attached to the second base part of the second mold base, will use the clamper arranged opposite to the aforementioned workpiece holding parts to clamp the aforementioned workpieces And while keeping being inserted into the aforementioned clamper, relatively moving to support the mold cavity recesses formed by the mold cavity parts of the pressurized resin in a horizontal arrangement, the aforementioned mold cavity parts are independently supported and fixed to the mold plate, and the aforementioned clamps The holder is independently biased and supported on the mold plate according to each workpiece, and an adjustment mechanism for independently adjusting the height of each workpiece is provided between the mold plate and the second base portion.

In this way, a plurality of molds can be combined by using the first mold with the workpiece holding parts arranged in a horizontal line on the first base part and the second mold with the cavity recesses arranged in a horizontal line in the second base part and facing the workpiece holding parts. When each workpiece is clamped individually, the deviation of mold height can be absorbed for each workpiece by the clamper biasedly supported on the mold plate and the adjustment mechanism provided between the mold plate and the second base part, so it can be The mold is clamped without tilting.

In the compression molding apparatus provided with any of the compression molding molds described above, since the variation in plate thickness and clamping position can be individually absorbed and compression molding can be performed at the same time by using the mold set unit in which a plurality of strip substrates are arranged in parallel, Improved productivity and molding quality.

A mold base, which is a pair of upper and lower mold bases that can be detachably supported by a plurality of mold mold cover units arranged side by side in a horizontal arrangement. Set, the adjustment mechanism absorbs the deviation caused by the total deviation of the plate thickness of the workpiece clamped by each mold set unit, the resin amount of the molding resin, and the thickness of the film covering the clamping surface when the mold is clamped. height deviation.

According to the above-mentioned structure, since the adjustment mechanism is provided integrally with the base portion on either the upper or lower die base, it is possible to absorb the plate thickness and die caused by the workpiece clamped by the plurality of die set units arranged in parallel in the horizontal direction. The difference in the height of the mold when the mold is clamped is caused by the total deviation of the resin amount of the resin and the thickness of the film covering the clamping surface.

In addition, when exchanging the mold case unit, there is no need to replace the mold base, and the replacement operation is easy. Even if the mold case unit is replaced, the adjustment mechanism can still be used as usual, so the versatility is high.

Alternatively, it may be provided with: a first die sleeve guide, which is adjacent to the mold opening and closing surface side of the first guide block suspended from the first base; and a second die sleeve guide, which is connected to the second base The side of the mold opening and closing surface of the second guide block vertically arranged adjacent to each other is arranged, and the step difference parts for inserting and pulling out the first mold sleeve unit by the aforementioned first guide block and the aforementioned first mold sleeve guide are respectively formed on the two sides. On the side, the step difference parts for inserting and pulling out the second mold casing unit through the second guide block and the second mold casing guide are respectively formed on both sides.

Thereby, the first mold case unit can be inserted and removed from the near side by using the step portion formed by the first guide blocks arranged on both sides and the first mold case guide as a guide. The second mold casing unit can be inserted and removed from the near side by using the step portion formed by the second guide blocks arranged on both sides and the second mold casing guide as a guide. Therefore, replacement parts of the die can be reduced and replacement work can be easily performed.

It can also be: the frame-shaped first base side part suspended from the first base part and the frame-shaped second base side part erected from the second base part are arranged opposite to each other, and the first base side defined by the first base part The first guide block of the first mold space part surrounded by the upper part and the second guide block surrounded by the second base side part to delineate the second mold space part are arranged oppositely.

In this way, the first base part and the frame-shaped first base side part, and the second base part and the frame-shaped second base side part are arranged oppositely, so closing the inside of the mold in the clamped state can form a decompression space . Also, because the first guide block that partitions the first mold space and the second guide block that partitions the second mold space The lead blocks are arranged facing each other, so it is easy to align the first mold case unit that is detachably accommodated in the first mold space and the second mold unit that is detachably accommodated in the second mold space. bit.

It can also be: the side of the first base is rotatably connected to the first base through a hinge on the inner side of the insertion and removal direction of the first mold casing unit, and the second base side is connected to the inner side of the insertion and removal direction of the second mold casing unit through a hinge. It is rotatably connected to the second base part.

Thereby, when the side part of the first base is rotated by a predetermined amount relative to the first base part around the hinge provided on the inner side of the first mold case unit in the insertion and extraction direction, the first mold case unit held by the first base part will be The front side in the plugging and pulling direction is exposed, so the first mold cover unit can be pulled out to the near side in the plugging and pulling direction for replacement.

In addition, when the second base side part is rotated by a predetermined amount relative to the second base part around the hinge provided on the inner side of the second mold case unit in the insertion and extraction direction, the second mold case unit held on the second base part will be The near front side in the plugging and pulling direction is exposed, so the second mold cover unit can be pulled out at the near side in the plugging and pulling direction for replacement.

It can also be: the aforementioned adjusting mechanism is equipped with a spring unit, and the spring unit biases the first mold cover plate relative to the first mold base or the second mold cover plate relative to the second mold base in the direction of mold opening and closing, or in the first Between the mold base and the first mold cover plate or between the second mold base and the second mold cover plate, sliding plates with conical surfaces overlapping each other are set in a slidable manner.

In this way, the deviation of the mold height of each mold set unit arranged side by side can be absorbed and adjusted through the simple structure when the mold is clamped. Even if the mold set unit is replaced, the adjustment mechanism can still be used.

A mold cover unit for a mold, which compresses and molds a resin by clamping a workpiece with a first mold cover unit and a second mold cover unit, and is characterized in that: One of the clamping surfaces is provided with a workpiece holding portion, and on the other clamping surface, the clamper disposed opposite to the workpiece holding portion to clamp the workpiece is inserted into the clamper. The mold cavity part is relatively moved to pressurize the resin to form the mold cavity cavity, and the clamping surface of the aforementioned holder is provided with a film suction hole or a suction hole that absorbs and holds the outer peripheral part of the film covering the cavity cavity The suction groove is provided with an annular groove between the suction groove having the aforementioned film suction hole or the suction hole and the concave portion of the mold cavity, and a plurality of suction holes are arranged at the groove bottom of the aforementioned annular groove.

If the above-mentioned mold case unit is used, the outer peripheral edge of the film is sucked and held by the film suction hole or the suction hole with the suction hole through the clamping surface of the holder containing the mold cavity concave part provided on any mold case unit. The film is sucked by the suction hole provided at the bottom of the annular groove between the suction groove with the film suction hole or the suction hole and the concave part of the mold cavity. Absorbs to fix and smooth wrinkles.

Therefore, when a plurality of workpieces are individually clamped by the mold case units arranged side by side in the lateral direction and compression-molded simultaneously, it is possible to prevent the deterioration of the molding quality due to the generation of wrinkles in the film. Also, the handling of the film is easy and there is no area for film waste.

The above-mentioned annular groove system can also be used as a concave portion of a film pushing pin for pressing the film provided on the clamping surface of any one of the first mold case unit and the second mold case unit. Thereby, when the workpiece and the film are clamped by a pair of die-casing units, the film pushing pin enters the annular groove, so that the excess amount of the film can be reliably induced into the annular groove and wrinkles can be flattened.

The above-mentioned annular groove can also be used concurrently for the chuck claws of the workpiece holding part to escape.

In this way, even if the chuck claws for mechanically holding the workpiece are provided in the workpiece holding part, the chuck claws will enter the annular groove when clamping the workpiece and the film, so the second mold set unit becomes out of contact with the clamping surface. put one's oar in. In addition, not only the air suction is performed in the workpiece holding part, but also the workpiece can be held by the chuck claws, so the workpiece can be reliably transferred.

A mold case unit for a mold, which is tied to a pair of mold case units to clamp a workpiece to compress and form resin. The characteristics of the mold case unit for a compression molding mold are: On each edge of the rectangular clamping surface or the mold cover plate that constitutes a mold cover unit, a first locking block is protrudingly provided, and on the clamping surface of the opposite mold cover unit or the opposite surface of the form cover plate , a second locking block interlocking with the aforementioned first locking block is protrudingly provided.

Thereby, when the pair of die sets units clamp the workpiece, the opposing clamping surfaces can be aligned through the concave-convex fitting between the first locking block and the second locking block. Therefore, it can contribute to the improvement of molding quality.

It can also be that the first mold cover unit is equipped with a first locking part, which is pluggably locked to the first guide block formed upright to the first mold base, and the second mold cover unit is provided with a second locking part. The part is detachably fastened to the second guide block formed upright to the second mold base.

Thereby, the mold for compression molding is opened, and the mold can be easily exchanged by inserting and pulling out the first mold set unit by locking the first locking part in the state where the first guide block is erected from the first mold base to both sides. Operation.

In addition, the mold exchange operation can be easily performed by inserting and removing the second mold set unit in a state where the second locking portion is locked to the second guide blocks erected on both sides from the second mold base.

A leveling mechanism for correcting the inclination of the clamping surfaces may also be provided at the opposing positions of the first mold case unit and the second mold case unit.

Thereby, the parallelism between the clamping surfaces of the first mold case unit and the second mold case unit arranged oppositely can be maintained when the mold is closed.

A mold case unit for a mold, comprising a first case unit having a workpiece holding portion for holding a workpiece, and a second case unit having a concave portion of a cavity supplied with molding resin, wherein the second case unit is characterized in that: The unit is that the mold cavity part forming the bottom of the cavity concave part and the holder forming the side part of the cavity cavity are configured to be relatively movable, and the clamping surface of the aforementioned clamp is provided on the opposite surface. Stopper for the height position of the holder.

In this way, since the relative height position of the clamper to the cavity part is determined by the stopper according to the deviation of the amount of resin supplied to the concave part of the cavity in response to the thickness of the workpiece, the thickness of the workpiece is absorbed and the resin supplied to the cavity is regulated. Variation in the amount of resin in the concave portion of the cavity enables compression molding with a desired thickness.

A plurality of overflow cavities may also be provided along the outer peripheral edge of the cavity part.

Thereby, even if the amount of resin supplied to the concave portion of the cavity is not accurately measured for each workpiece, compression molding can be performed with the thickness of the molded product kept constant by storing excess resin in the overflow cavity.

Preferably, in the compression molding mold, any one of the mold housing units described above is arranged side by side with respect to the mold base, and the mold housing unit can be independently inserted and removed from the mold base.

Thereby, the necessary mold set unit among the plurality of mold set units arranged in parallel to the mold base can be taken out from the mold base for maintenance or mold exchange, and the replacement parts are few and the mold exchange work can be easily performed. . Moreover, the wrinkles of the film can be flattened on the clamping surface including the recessed part of the cavity for each mold case unit, and the film is easy to handle and there is no waste use area of the film.

It is possible to provide a mold for compression molding that is highly versatile and capable of absorbing variations in the thickness of the workpieces or variations in the amount of resin supplied when a plurality of workpieces are arranged side by side in a lateral direction and individually compressed and molded. High-precision compression molding is performed while causing the deviation of the mold height when the mold is clamped.

Furthermore, by using the mold for compression molding described above, it is possible to provide a highly versatile compression molding apparatus that is highly productive and maintains molding quality.

Since the position adjustment mechanism is provided integrally with the base in either the upper or lower mold base, it can absorb the plate thickness and molding resin caused by the workpiece clamped by the plurality of mold set units arranged side by side in the horizontal direction. The deviation of the mold height when the mold is clamped is caused by the total deviation of the amount of resin and the thickness of the film covering the clamping surface.

In addition, when exchanging the mold case unit, there is no need to replace the mold base, and the replacement operation is easy. Even if the mold case unit is replaced, the adjustment mechanism can still be used, so the versatility is high.

It is possible to provide a mold set unit that is easy to perform film processing during compression molding to reduce unnecessary use areas, and absorbs the deviation of the thickness of the workpiece and the amount of resin to make the thickness of the package part constant and improve the molding quality.

1‧‧‧Mold for compression molding

2‧‧‧upper mold

2a‧‧‧Workpiece Holder

2b‧‧‧Adsorption hole

3‧‧‧Lower mold

3a‧‧‧The concave part of the lower mold cavity

4‧‧‧Upper die set unit

4a‧‧‧Upper mold set plate

4b‧‧‧support block

4c‧‧‧on template

4d‧‧‧Chuck jaw

4d1‧‧‧horizontal part

4d2‧‧‧vertical part

4d3‧‧‧locking part

4e‧‧‧Fulcrum

4f, 4i, 5g, 8e, 10c‧‧‧coil spring

4g‧‧‧Push pin

4h‧‧‧Film push pin

4j‧‧‧Upper mold locking block

4k‧‧‧upper mold adjustment pin

5‧‧‧Lower mold set unit

5a‧‧‧Lower mold base plate

5b‧‧‧support column

5c‧‧‧support plate

5d‧‧‧Lower mold cavity

5d1‧‧‧step difference department

5d2‧‧‧through hole

5e‧‧‧Moveable holder for lower die

5e1‧‧‧Retreat ditch

5e2‧‧‧ring groove

5e3, 5e5‧‧‧Attraction hole

5e4‧‧‧Film suction groove

5e6‧‧‧Attraction Road

5f‧‧‧Push pin

5h‧‧‧Fate

5i‧‧‧brake

5j‧‧‧Lower mold set plate

5k, 7b2‧‧‧Sealing material

5m‧‧‧stairs

5n‧‧‧Lower mold locking block

5p‧‧‧Lower mold adjustment pin

5r‧‧‧down template

6‧‧‧upper die base

6a‧‧‧The base of the upper mold

6b‧‧‧The side of the upper mold base

6c‧‧‧upper mold space department

6d‧‧‧Upper die guide block

6e‧‧‧Upper die sleeve guide

6f‧‧‧step difference department

6g, 7g‧‧‧hinge

7‧‧‧Lower mold base

7a‧‧‧The base of the lower mold

7b‧‧‧The side part of the lower mold base

7b1‧‧‧Suction hole for decompression

7c‧‧‧Lower mold space

7d‧‧‧Lower mold guide block

7e‧‧‧Lower mold sleeve guide

7f‧‧‧step difference department

W‧‧‧workpiece

8‧‧‧Adjustment mechanism

8a‧‧‧Pin hanging plate

8b‧‧‧Suspension pin

8c‧‧‧Pin hole

8d‧‧‧Pressure plate

9‧‧‧Flake film

10‧‧‧Overflow cavity

10a‧‧‧floating parts

10b‧‧‧connecting plate

11, 13‧‧‧Drive mechanism

11a, 13a, 14f, 21a‧‧‧Servo motor

11b, 13b, 21b‧‧‧Power transmission department

12‧‧‧movable connecting plate

14‧‧‧Wedge mechanism

14a‧‧‧Movable sliding plate

14b‧‧‧Wedge

14c‧‧‧Conical Surface

14d‧‧‧height adjustment plate

14e‧‧‧Screw shaft

15‧‧‧Stamping Department

16‧‧‧Workpiece supply and storage department

17‧‧‧Workpiece conveying mechanism

18‧‧‧Film resin supply department

19‧‧‧Resin transfer mechanism

R‧‧‧Granular Resin

20‧‧‧Punching machine driving mechanism

20a‧‧‧Punching machine base

20b‧‧‧Guide column

20c‧‧‧fixed platform

20d‧‧‧movable platform

20e‧‧‧intermediate platform

Fig. 1 is an explanatory front sectional view of a mold for compression molding in which the mold is opened.

Fig. 2 is an explanatory diagram of a cutout section of a part of the upper mold of Fig. 1 .

Fig. 3 is a side cross-sectional explanatory view of the upper mold of Fig. 2 .

Fig. 4 is a plan view of the upper mold of Fig. 2 viewed from the clamping surface side.

Fig. 5 is a cross-sectional explanatory view of the lower mold of Fig. 1 .

Fig. 6 is a side cross-sectional explanatory view of the lower mold of Fig. 5 .

7A is a plan view of the lower mold of FIG. 5 viewed from the side of the clamping surface, and FIG. 7B is a partial cross-sectional view showing the state of the lower mold cavity and the lower mold movable clamper before and after closing the mold.

Fig. 8 is a front cross-sectional explanatory view of the closed state of the compression molding die of Fig. 1 .

Fig. 9 is a front sectional explanatory diagram of the mold base and a sectional explanatory diagram of the mold cover unit taken out from the mold base.

Fig. 10A is a front sectional explanatory diagram showing the state before and after the mold cover unit is removed from the mold base, and Fig. 10B is a side sectional explanatory view of the mold cover unit removed from the mold base.

Fig. 11A is a front sectional view of a compression molding die of another example, and Fig. 11B is a plan view of the lower die viewed from the clamping surface side.

Fig. 12 is an explanatory front sectional view of a compression molding die for compression molding a large-sized workpiece.

Fig. 13 is a side sectional explanatory view of a compression molding die for compression molding a large-sized workpiece of another example shown in Fig. 12 .

Fig. 14A is a plan view viewed from the clamping surface side of an upper mold for molding a rectangular substrate, and Fig. 14B is a plan view viewed from the clamping surface side of a lower mold.

Fig. 15A is a plan view viewed from the clamping surface side of the upper mold for molding a circular substrate, and Fig. 15B is a plan view viewed from the clamping surface side of the lower mold.

Fig. 16 is a front sectional explanatory view of another compression molding die.

Fig. 17 is a front sectional explanatory view of another compression molding die.

Fig. 18 is an explanatory front sectional view of a compression molding die for compression molding one strip substrate.

Fig. 19 is an explanatory front sectional view of a compression molding die for compression molding three strip substrates.

Fig. 20A is a front sectional explanatory view showing another example of the adjustment mechanism provided on the upper die, and Fig. 20B is a side sectional explanatory view of the adjustment mechanism.

Fig. 21 is a plan view showing an example of a resin molding apparatus using a mold for compression molding.

Fig. 22 is an explanatory view showing another example of the compression molding device.

Fig. 23 is an explanatory diagram showing another example of the compression molding apparatus following Fig. 22 .

Fig. 24 is an explanatory view showing another example of a compression molding die.

Fig. 25 is an explanatory view showing another example of a compression molding die.

Hereinafter, an embodiment for implementing the invention will be described in detail based on the accompanying drawings. In addition, when called a mold case unit, it means the thing which integrally assembled the mold member which comprises a cavity recessed part or a workpiece|work holding part. Also, when it is called a mold for compression molding, it means that the mold housing unit is integrally assembled to the mold base and the mold opening and closing mechanism is removed.

[first embodiment]

FIG. 1 shows a compression molding die 1 for individually compression molding a plurality of workpieces W, and has the following configuration. In addition, it is assumed that the workpiece W is a long rectangular strip substrate (lead frame, metal substrate, ceramic substrate, resin substrate, etc.). It is assumed that the size of the workpiece W is approximately 100 mm×300 mm (hereinafter simply referred to as “work W”).

The die 1 for compression molding includes an upper die 2 (first die) and a lower die 3 (second die). An upper mold housing unit 4 (first mold housing unit) having a workpiece holding portion 2a for holding a workpiece W on the upper mold 2 and a lower mold having a lower mold cavity recess 3a supplied with molding resin to the lower mold 3 Die case unit 5 (the second die case unit) is that there are a plurality of facing configurations.

In addition, upper die housing units 4 are arranged side by side in a row at plural positions (two positions in FIG. 1 ) of the upper die holder 6 (first die holder). In plural positions (two positions in FIG. 1 ) of the lower die holder 7 (second die holder), lower die holder units 5 are arranged side by side side by side. The upper mold housing unit 4 and the lower mold housing unit 5 are arranged opposite to each other. upper mold The seat 6 is capable of adjusting the deviation of the thickness of the workpiece W held by the plurality of workpiece holding parts 2a (referring to both the difference in the thickness of the workpiece W and the difference in the local thickness and inclination within the plane of one workpiece. The following Collectively referred to as "deviation".) or the deviation of the mold height of a plurality of upper die set unit 4 and lower die set unit 5 when clamping (in addition to the aforementioned "deviation", it also includes the cavity supplied to the lower die cavity 3a The difference in the height of the mold caused by the difference in the amount of resin is only called "deviation". The workpiece W, hereinafter referred to as "adjustment mechanism 8"). As a result of adjusting the deviation of the mold height by the adjustment mechanism 8, it is also possible to align the overall height of the mold after compression molding with a plurality of molds used for compression molding, and to avoid inclination of the punching mechanism.

According to the above configuration, the molding resin is supplied to the lower mold cavity recesses 3a respectively provided on the plurality of lower mold housing units 5 arranged side by side with the lower mold holder 7, and the workpiece W can be held in the upper mold while maintaining the workpiece W. Compression molding is performed for each workpiece W by closing the mold with the workpiece holders 2 a respectively provided on the plurality of upper mold case units 4 arranged side by side with the mold base 6 .

At this time, there is a deviation in the thickness of the plurality of workpieces W or a deviation in the mold height when the mold is clamped due to the difference in the amount of resin supplied, because the adjustment mechanism 8 provided on the upper mold base 6 presses Since the upper mold housing unit 4 and the lower mold housing unit 5 arranged facing each other are adjusted, the thickness of the resin sealing part (sealed part) can be compressed and molded with high precision.

In addition, since the upper mold base 6 and the lower mold base 7 are provided with multiple mold housing units in a single layer, by ensuring the thickness of the mold base, the bending rigidity is high and the heat capacity is large, so the temperature during the molding cycle can be suppressed. Variety.

Also, even if the upper mold housing unit 4 or the lower mold housing unit 5 is exchanged due to tool replacement, since the adjustment mechanism 8 provided on the upper mold base 6 can be used in common, the versatility is improved.

The adjustment mechanism 8 is arranged between the upper die base 6 and the upper die cover unit 4 . Therefore, even if the upper die set unit 4 is replaced, the adjustment mechanism 8 can still be used. An example of the adjustment mechanism 8 is provided with a spring unit that biases the upper die holder unit 4 in the die opening and closing direction with respect to the upper die holder 6 . Thereby, it is possible to adjust the variation in mold height of a plurality of mold case units arranged side by side (an arrangement in which other workpieces are arranged side by side so that the long sides of the workpieces become parallel) arranged side by side with a simple configuration.

Here, a configuration example of the upper mold 2 and the lower mold 3 constituting the compression molding mold 1 will be specifically described. A configuration example of the upper mold 2 will be described with reference to FIG. 2 . Upper die base 6 has: upper die base part 6a (the first base part) of rectangular plate shape; side of base). An upper die guide block 6d (first guide block) is vertically provided on the upper die base portion 6a to partition the upper die space portion 6c (first die space portion) surrounded by the upper die base side portion 6b. Adjustment mechanisms 8 are respectively provided in upper die space portions 6 c (see FIG. 9 ) partitioned by upper die guide blocks 6 d.

On the lower end portion of the upper die guide block 6d, upper die case guides 6e (first die case guides) are provided adjacent to each other. Between the upper mold guide block 6d and the upper mold housing guide 6e (between continuous wall surfaces) the step portions 6f for inserting and detaching the upper mold housing unit 4 are respectively formed on both sides. Using the pair of step portions 6f as guide rails, the upper die case unit 4 can be inserted and removed as will be described later.

As shown in FIG. 10B , the upper mold base part 6 a and the upper mold base side part 6 b are connected in a rotatable manner through a hinge 6 g on the adjacent side (the inner side in the insertion and extraction direction of the upper mold housing unit). When exchanging the upper mold cover unit 4, the front side end portion of the upper mold base side portion 6b in the insertion and extraction direction can be spaced away from the upper mold base portion 6a in a predetermined direction centered on the hinge 6g (in the counterclockwise direction of FIG. 10B ). ) to rotate. In this way, the upper die set unit 4 can be pulled out to the near side by using the step portion 6f as a guide rail for replacement. In addition, since the upper die housing units 4 arranged in parallel on the upper die base 6 can be inserted and removed from the upper die base 6 independently, the maintenance workability is good. In addition, it is preferable that an unillustrated link member which restricts the opening angle of the upper die base part 6a is connected between the upper die base part 6a and the upper die base side part 6b. In addition, only the near side side part of the upper mold base side part 6b formed in the shape of a rectangular frame may be connected to the upper mold base part 6a rotatably (clockwise in FIG. 10B ) through a hinge. In this case, the upper mold case unit 4 is pulled out in the insertion/extraction direction.

Also, although a structure in which the mold case unit is laterally slidable on the back side and the near side is illustrated, it is not necessarily limited to lateral sliding insertion and extraction, as long as the mold base and the mold case unit can be separately attached and detached in the vertical direction.

In addition, the upper die guide block 6d and the upper die housing guide 6e that define the middle portion of the upper die space 6c (the middle portion in FIG. 2 ) can also be provided so as to be attachable to and detachable from the upper die base portion 6a. Thereby, as shown in FIG. 12 and FIG. 13 described later, even if the workpiece W is a large-sized substrate, only the upper die cover unit 4 is replaced, and the upper die holder 6 and the adjustment mechanism 8 can still be shared.

In Fig. 2 and Fig. 9, a configuration example of the adjustment mechanism 8 will be described. A pin suspension plate 8a is provided superimposed on the upper die base portion 6a. in pin The suspension plate 8a and the plurality of suspension pins 8b are inserted into pin holes 8c provided at equal intervals in the left-right direction (see FIG. 2 ) and the front-rear direction (see FIG. 3 ) to lock the pin heads 8b1 (upper ends) respectively. The front-end|tip part 8b2 (lower end part) of each suspension pin 8b is connected with the pressing board 8d. A coil spring (it is not particularly limited as long as it is an elastic body) 8e is compressed from a free length and inserted between each pin suspension plate 8a and the pressing plate 8d. Accordingly, the pressing plate 8d and the suspension pin 8b are always biased vertically downward. The left and right side end surfaces of the pressing plate 8d are guided by the upper mold guide block 6d and maintained parallelism.

Regarding the configuration example of the upper die set unit 4, it will be described with reference to Fig. 2 to Fig. 4 .

The upper die set unit 4 is equipped with an upper die set plate 4a (first die set plate) at the upper end. The upper mold cover plate 4a is installed overlapping the lower face of the pressing plate 8d of the adjustment mechanism 8 . The outer dimensions of the upper mold cover plate 4a are the same as those of the pressing plate 8d, and the left and right end surfaces are guided by the upper mold guide block 6d and raised and lowered while maintaining parallelism. The upper mold support block 4b larger than its external dimension is superimposedly arranged below the upper mold cover plate 4a. The left and right end portions (first locking portions) of the upper die support block 4b are detachably assembled on the near side with respect to the upper die guide block 6d while being engaged with the step portion 6f (see FIG. 2 ). Under the upper mold support block 4b, an upper template 4c smaller than its external dimension is overlapped. As shown in FIG. 4, the suction hole 2b which becomes the workpiece|work holding part 2a in the center part of the lower surface of the upper die plate 4c is perforated at several places along the outer peripheral edge part of a workpiece|work. Furthermore, the chuck claws 4d are rotatably provided at a plurality of locations (for example, six locations in FIG. 4 ) around the workpiece holding portion 2a of the upper die plate 4c.

In FIG. 2, the chuck claw 4d is formed in an L-shape in which the horizontal portion 4d1 and the vertical portion 4d2 are continuous. The middle portion of this horizontal portion 4d1 is assembled to the upper die support block 4b so as to be rotatable around the fulcrum 4e. Near the end of the horizontal portion 4d1, the coil spring 4f is installed between the upper mold set plate 4a and compressed from the free length. Moreover, the push pin 4g which penetrates the upper die plate 4c is integrally provided in the horizontal part 4d1. Since the horizontal portion 4d1 is always biased downward by the coil spring 4f, the front end of the push pin 4g protrudes downward from the clamping surface of the upper die plate 4c. Also, at the lower end of the vertical portion 4d2, a locking portion 4d3 is formed facing inwardly of the outer peripheral portion of the workpiece. The chuck claw 4d is biased in the direction of clamping the outer peripheral portion of the workpiece W with the vertical portion 4d2 around the fulcrum 4e by rebounding of the coil spring 4f. Therefore, each locking portion 4d3 enters below the outer peripheral portion of the workpiece W so as to be able to hold it. When releasing the chuck claw 4d to remove the workpiece W, it is only necessary to press the push pin 4g against the potential energy of the coil spring 4f. Further, film pushing pins 4h are protrudingly provided on the outer peripheral side of the workpiece holding portion 2a of the upper die plate 4c. The film pushing pin 4h is tied between the upper mold cover plate 4a and the coil spring 4i is installed in such a way that it is compressed from the free length. Thereby, the front-end|tip part of the film pushing pin 4h protrudes downward from the clamping surface of the upper die plate 4c. The film pushing pin 4h is provided to flatten the excess of the sheet-shaped film 9 that is sucked and held to cover the clamping surface of the lower die 3 as will be described later.

Next, an example of the configuration of the lower die 3 will be described.

The lower mold base 7 among Fig. 5 has: the lower mold base part 7a (second base part) of rectangular plate shape; Part 7b (second base side). exist The lower die base portion 7a is erected with a lower die guide block 7d (second guide block) defining a lower die space portion 7c (second die space portion: refer to FIG. 9 ) surrounded by the lower die base side portion 7b. The lower mold housing unit 5 is detachably assembled in the lower mold space portion 7c (refer to FIG. 9 ) partitioned by the lower mold guide block 7d.

In FIG. 5 , lower die case guides 7 e (second die case guides) are provided adjacent to the upper ends of the lower die guide blocks 7 d , respectively. Between the lower mold guide block 7d and the lower mold housing guide 7e (between continuous wall surfaces), the step portion 7f for inserting and detaching the lower mold housing unit 5 is formed on both sides (refer to FIG. 9 ). The pair of step portions 7f can be used as guide rails to insert and remove the lower die set unit 5 . The suction hole 7b1 for decompression is provided in the side wall of the lower die base side part 7b, and is connected to the air suction mechanism which is not shown in figure. Also, on the mold opening and closing surface of the lower mold base side portion 7b, a seal member 7b2 (O ring, etc.) that abuts against the opposing surface of the upper mold base side portion 6b to seal the mold space when the mold is closed is provided.

As shown in FIG. 10B , the lower mold base portion 7a and the lower mold base side portion 7b are rotatably connected on the adjacent side (the inner side in the insertion and removal direction of the lower mold housing unit) through a hinge 7g. When exchanging the lower mold cover unit 5, the end of the lower mold base side part 7b in the insertion and extraction direction can be separated from the lower mold base part 7a in a predetermined direction with the center of the hinge 7g (clockwise direction in FIG. 10B ) rotate. Therefore, the lower die set unit 5 can be pulled out to the near side by using the step portion 7f as a guide rail for replacement. In addition, since the lower die housing units 5 arranged in parallel on the lower die base 7 can be inserted and removed from the lower die base 7 independently, the maintenance workability is good. In addition, it is preferable that an unillustrated link member which restricts the opening angle of the lower die base side part 7b is connected between the lower die base part 7a and the lower die base side part 7b. Also, only form The near side side part of the rectangular frame-shaped lower mold base side part 7b is connected with respect to the lower mold base part 7a through a hinge so that it can rotate (in the counterclockwise direction of FIG. 10B). In this case, the lower mold case unit 5 is pulled out in the insertion/extraction direction.

In addition, the lower mold guide block 7d and the lower mold housing guide 7e that define the middle portion of the lower mold space portion 7c (the middle portion in FIG. 5 ) may be provided so as to be detachable from the lower mold base portion 7a. Thereby, as shown in Figures 12 and 13 described later, even if the workpiece W is a large (wide) size substrate, only the lower mold cover unit 5 is replaced together with the upper mold cover unit 4, and the lower mold base 7 remains the same. can be shared.

Regarding the configuration example of the lower die set unit 5, it will be described with reference to Fig. 5 to Fig. 7 .

The lower die set unit 5 includes a lower die base plate 5 a at the lower end. The lower die base plate 5a is stacked on the lower die base portion 7a. The bottom mold base plate 5a is guided by the bottom mold guide block 7d with the left and right side end surfaces and is installed in a pluggable and removable manner respectively from the front side in FIG. 5 while maintaining the parallelism. A plurality of support columns (pillars) 5b are erected and formed on the upper surface of the lower mold base plate 5a and in the vertically lower projection plane of the lower mold cavity piece (cavity piece) 5d. In this way, the warping of the cavity part 5d of the lower mold can be prevented, and the clamping pressure can be finely adjusted by changing the arrangement of the support columns 5b or changing the thickness of the arrangement. Thereby, TTV (Total Thickness Variation) can be improved when compression molding a large-sized (wide) workpiece W, such as a panel exceeding 300mm×300mm or a semiconductor wafer with a diameter of 300mm. The large (wide) size refers to a substrate wider than a strip-shaped substrate of approximately 100mm×300mm and does not necessarily have to be rectangular.

The support plate 5c is supported by the support column 5b. The support plate 5c is provided so that the left and right side end surfaces are guided by the lower die guide block 7d similarly to the lower die base plate 5a. The lower cavity part 5d is supported by stacking on the upper central part of the support plate 5c. The lower mold cavity part 5d constitutes the bottom of the lower mold cavity recess 3a. Around the lower mold cavity part 5d, the lower mold movable holder 5e constituting the side portion of the lower mold cavity concave portion 3a is supported so as to be movable in the mold opening and closing direction. Specifically, the push pin 5f penetrates the support plate 5c and is pressed against the lower surface of the lower mold movable clamper 5e. The push pin 5f is compressed from the free length and the coil spring 5g inserted between the lower mold base plate 5a keeps the edge portion 5h larger in diameter than the push pin 5f pressed against the lower surface of the support plate 5c. Therefore, the upper end of the push pin 5f protrudes from the support plate 5c, and is in a state of always biasing the lower mold movable clamper 5e upward. In addition, the cavity part 5d of the lower mold can also be directly supported by the support column 5b without interposing the support plate 5c as described later.

The clamping in this embodiment exemplifies the case where the workpiece W is clamped by the workpiece holding part 2a and the movable clamper 5e, but in the case of full package molding (Full package mold), the suction hole 2b of the workpiece holding part 2a The workpiece W is sucked and held, and the upper mold plate 4c is clamped by the lower mold movable clamper 5e without directly clamping the workpiece W. called clamping.

Furthermore, a rectangular frame-shaped lower die set plate 5j (second die set plate) is provided so as to surround the outer peripheral side of the lower die movable holder 5e. The lower mold cover plate 5j is supported by the support plate 5c by stacking. The gap between the movable clamper 5e of the lower mold and the cover plate 5j of the lower mold is provided by a sealing material 5k (such as an O ring, etc.) seal. The movable clamper 5e of the lower mold is provided to guide the inner peripheral side to the lower mold cavity 5d and lift the outer peripheral side while guiding the lower mold sleeve plate 5j.

A stepped portion 5m (second locking portion) corresponding to the stepped portion 7f is formed on the outer peripheral surface side of the lower die set plate 5j. The step portion 7f is formed by linking the narrow lower mold guide block 7d with the wider lower mold housing guide 7e as shown in FIG. 9 above. The stepped portion 5m is formed along the left and right side surfaces so that the clamping surface side becomes narrow along the stepped portion 7f. The lower mold cover unit 5 can be inserted and pulled out from the lower mold base 7 by using the step portion 7f facing the stepped portion 5m as a guide rail. In addition, between the upper mold cover unit 4 and the upper mold base 6 , and between the lower mold cover unit 5 and the lower mold base 7 , there are clearances for inserting and removing each unit. Therefore, in the upper mold cover unit 4 and the upper mold base 6 and the lower mold cover unit 5 and the lower mold base 7, it is better to be provided with a locking mechanism for canceling the clearance in the height direction under the installed state. good.

As shown in FIG. 7A , relief grooves 5e1 are provided at plural positions in the peripheral direction of the clamping surface of the lower mold movable clamper 5e to avoid interference with the locking portion 4d3 of the chuck claw 4d from the inner peripheral side. Also, as shown in FIG. 7A, an annular groove 5e2 is connected to the relief groove 5e1 and is provided around its outer periphery to accommodate the loose portion of the sheet film (release sheet) 9 (see FIG. 7B). Suction holes 5e3 are provided at plural locations in the peripheral direction of the bottom of the annular groove 5e2. The annular groove 5e2 does not necessarily need to be connected in a single stroke, it only needs to have the suction hole 5e3, and it can also be partially divided. Further, a film suction groove 5e4 for sucking and holding the outer peripheral portion of the sheet-shaped film 9 is provided around the outer peripheral side of the annular groove 5e2. Multiple locations in the direction around the bottom of the film suction groove 5e4 A suction hole 5e5 is provided. Although only the suction hole 5e5 can be provided to realize the film suction, it can be realized more reliably by using the film suction groove 5e4 and the suction hole 5e5 together. The film suction groove 5e4 does not necessarily need to be connected in a single stroke, it only needs to have the suction hole 5e5, and it can also be partially divided. The suction holes 5e3 and 5e5 are connected to an air suction mechanism not shown.

As shown in FIG. 7B, the sheet film 9 is supplied to the film suction groove 5e4 that covers the clamping surface of the lower mold cavity of the lower mold cavity 3a and is formed on the outermost periphery of the clamping surface of the movable clamper 5e of the lower mold. Suction hole 5e5 is adsorbed and held. Also, the sheet film 9 is sucked and held along the suction path 5e6 provided on the bottom periphery of the lower cavity recess 3a (the periphery of the lower cavity member 5d). When the mold is closed in this state, the film pushing pin 4h protruding downward from the upper die plate 4c enters the facing annular groove 5e2. At this time, the film pushing pin 4h presses the slack portion of the sheet film 9 into the annular groove 5e2 by the potential energy of the coil spring 4i (refer to FIG. 2 ), and is attracted and accommodated by the suction hole 5e3. Also, the retaining portion 4d3 (see FIG. 2 ) of the chuck jaw 4d holding the outer peripheral portion of the workpiece W can be prevented from being accommodated in the opposing escape groove 5e1 (see FIG. 7A ) and the movable clamper of the lower mold. 5e Interference. In addition, since the sheet film 9 is sucked into the suction hole 5e3 in the annular groove 5e2, the sheet film 9 attached to the molded product is sucked to the lower mold 3 when the mold is opened, and release is smoothly performed. At this time, because the film pushing pin 4h presses the sheet film 9 toward the lower die 3 by the deflection of the coil spring 4i, the sheet film 9 can be pressed until the film pushing pin 4h leaves the lower die 3, making it less likely to occur. Peel off bad constructs. The sheet film (release sheet) 9 is, for example, about 50 μm in thickness and has heat resistance, is easy to peel off from the mold surface, and has flexibility and stretchability. For example, it is made of PTFE, ETFE, PET, FEP film, fluorine-containing Single-layer or multi-layer film with impregnated glass cloth, polypropylene film, polyvinylidene chloride, etc. as the main component.

In this way, when the sheet-like film 9 covering the clamping surface of the lower mold containing the concave portion 3a of the cavity of the lower mold is sucked and held by the lower mold cover unit 5, it is adsorbed on the clamping surface of the lower mold containing the concave portion 3a of the cavity of the lower mold. It is easy to handle when holding, and it is possible to avoid as much as possible a wasteful use area that is not related to compression molding like a long film.

In FIG. 4 , upper mold locking pieces 4j (first locking pieces) are protrudingly provided at four places on the clamping surface at the center of the four sides of the rectangular upper mold plate 4c. Also, in FIG. 7A, a pair of lower mold locking pieces 5n (second locking pieces) are formed on the clamping surface or the lower mold cover plate 5j at the center of the four sides of the rectangular lower mold movable clamper 5e. Protrude in 4 locations in pairs of 2. The upper die locking block 4j and the opposing lower die locking block 5n are disposed so as to engage with each other through concave-convex fitting. Thereby, the upper mold plate 4c formed with the workpiece holding portion 2a can be aligned with the lower mold movable clamper 5e or the lower mold cover plate 5j forming the lower mold cavity cavity 3a for each mold housing unit, and the mold can be closed. . In addition, the form of the upper die locking block 4j and the lower die locking block 5n can also be exchanged in pairs.

In Fig. 9, at the opposing positions of the upper template 4c of the upper die set unit 4 and the lower die set plate 5j of the lower die set unit 5, the upper die adjustment pin 4k (refer to Fig. 2) and the lower die set are projected respectively. Adjustment pin 5p (refer to FIG. 5 ) (leveling mechanism). The upper mold adjustment pin 4k is supported by the upper mold cover plate 4a, penetrates the support block 4b and the upper mold plate 4c, and protrudes downward from the upper mold clamping surface. In addition, the lower mold adjustment pin 5p is supported by the lower mold base plate 5a through the coil spring 5q, penetrates through the support plate 5c and the lower mold cover plate 5j, and protrudes upward from the lower mold clamping surface.

As shown in FIG. 4 , a plurality of upper die adjustment pins 4k are provided at equal intervals along the edge of the upper die plate 4c on the long side (4 each, 8 in total on the left and right sides). Also, as shown in FIG. 7A , a plurality of lower die adjustment pins 5p are arranged at equal intervals along the edge of the lower die set plate 5j on the long side (4 for each, 8 in total on the left and right sides). The count system of upper mold adjustment pin 4k and lower mold adjustment pin 5p is arbitrary and also can be located at short side. The upper and lower adjustment pins 4k and 5p are arranged at the same position in plan view.

The upper die adjustment pin 4k protruding from the above-mentioned upper die plate 4c and the lower die adjustment pin 5p protruding from the lower die set plate 5j are arranged to face each other. Therefore, when the mold is closed, the upper mold adjustment pin 4k and the lower mold adjustment pin 5p that face each other at multiple positions collide with the mold surface earlier, and the deflection of the coil spring 5q is used to absorb the deviation of the pressing force, so the alignment is corrected. The parallelism between the clamping surfaces of the configured upper mold cover unit 4 and the lower mold cover unit 5 allows the mold surfaces to be in planar contact, thereby preventing partial contact.

Here, the operation of the adjustment mechanism 8 will be described with reference to FIG. 8 . As an example, the left half of FIG. 8 shows the clamping state of the mold when the thickness of the workpiece is thinner than that of the usual workpiece W or when the amount of the molding resin is small. Also, the right half of FIG. 8 shows the clamping state of the mold when the thickness of the workpiece is thicker than that of the usual workpiece W or the resin amount of the molding resin is large.

In the case of the left half of FIG. 8 , the thickness of the workpiece is thinner than that of the normal workpiece W or the amount of resin supplied is small relative to the target resin amount of the molding resin (resin amount to obtain an appropriate final package thickness after molding). or the case of both. In this case, the coil spring 8e between the insertion pin suspension plate 8a and the pressing plate 8d is in a rebound state, which can be The deflection of the spring 8e absorbs the variation in the plate thickness of the workpiece W. In addition, when the amount of molding resin is small, the mold plate 4c that absorbs and holds the workpiece W presses down the movable clamper 5e of the lower mold against the potential energy of the coil spring 5g. Thereby, the relative height position of the lower mold movable clamper 5e to the lower mold cavity part 5d is determined to be the same in accordance with the thickness of the workpiece W and the amount of resin supplied to the cavity recess 3a, so that the workpiece W can be absorbed. When the plate thickness t1 is thin, or the variation t2 of the amount of resin supplied to the cavity concave portion 3a. Such an adjustment operation is performed for plural (two parts in the present embodiment) upper mold housing units 4 and lower mold housing units 5 .

In addition, in the case of the right half of Fig. 8, the thickness of the workpiece is thicker than that of the workpiece W in the left half of the figure, or the amount of resin supplied relative to the target resin amount of the molding resin (resin amount that becomes an appropriate final package thickness after molding) many. Or there may be cases of both in cases where there is a large difference between the left and the right. In this case, an error t3 occurs in the height position of the push pin 4g biased by the coil spring 4f in the upper die housing unit 4. However, the coil spring 8e inserted between the pin suspension plate 8a and the pressing plate 8d is compressed, and the suspension pin 8b is pressed back to become the state where the head 8b1 is only slightly separated from the pin suspension plate 8a by the gap t4. 8e deflection to absorb the thickness deviation of the workpiece W.

Also, in the lower die set unit 5, the height position of the push pin 5f is changed by only t5 due to the potential energy of the coil spring 5g, and the lower die movable holder 5e is in a state where a gap t6 is slightly separated from the supporting plate 5c. In this way, the relative height position of the lower mold movable clamper 5e to the lower mold cavity part 5d is determined to be uniform in accordance with the amount of resin supplied to the cavity concave portion 3a. Thereby, the variation of resin thickness t7 is absorbed.

As described above, the mold height at the time of mold clamping (pin suspension in FIG. The deviation of the distance between the plate 8a and the base plate 5a of the lower mold) can be absorbed by the biasing mechanism or the adjusting mechanism 8 of the movable clamper 5e of the lower mold. Such an operation for adjusting the deviation of the mold height is performed by the upper mold housing unit 4 and the lower mold housing unit 5 arranged in a plurality of positions (in this embodiment, two positions) in a horizontal manner.

Again, because the adjusting mechanism 8 that is located at the upper mold base 6 is arranged according to the mold cover unit, so the mold cover unit on the left and right is not only the left half of Fig. 8 (the plate thickness of the workpiece W is thin and the supplied resin The amount is less than the target resin amount) and the right half of Figure 8 (the workpiece W has a thick plate and the supplied resin amount is more than the target resin amount), the situation may also be the opposite. On the left is the case where the workpiece W is thick and the amount of resin supplied is small, and on the right is the case where the workpiece W is thin and the amount of resin supplied is large. Adjustment can also be made without the mold being tilted. Thereby, since the total height of the plurality of dies can always be constant, the thickness of the resin sealing part (package) can be compression-molded with high precision without inclination of the press surface.

In this way, even if there is a variation in the height of the upper mold 2 and the lower mold 3 in the mold opening and closing direction due to the variation in the plate thickness of the plurality of workpieces W or the variation in the amount of resin supplied to the concave portion 3a of each lower mold cavity, etc., By adjusting the adjustment mechanism 8 provided by the upper mold cover unit 4 arranged side by side on the upper mold base 6, the deviation of the mold height between the upper mold 2 and the lower mold 3 when the mold is clamped can be adjusted according to the workpiece W, so it can compressed with high precision shape. In addition, in Fig. 8, because the two upper mold cover units 4 are horizontally arranged side by side on the upper mold base part 6a, so the adjustment mechanism 8 is also arranged in two horizontal rows in cooperation with it, but at least any one of them It only needs to be interposed between the upper mold base part 6a and the upper mold housing unit 4 . In this case, a spacer may be interposed in the other upper die 2 instead of the adjustment mechanism 8 . Also, when three or more upper die housing units 4 are provided on the upper die base 6, it is preferable to independently mount the adjustment mechanism 8 one less than the number of the die housing units on the upper die base portion 6a. In this case, the height of the remaining upper die case unit 4 provided with the adjustment mechanism 8 is adjusted in accordance with the height of the fixed upper die case unit 4 . In addition, a support block or the like of a fixed height may be provided between the upper die base portion 6 a on the fixed side and the upper die housing unit 4 .

In addition, when exchanging molds accompanying the type of workpiece W, as shown in FIG. 10A and FIG. The hinge 6g on the back side of 6a rotates by a predetermined amount so as to push down the upper mold base side portion 6b to the near side. At this time, as shown in FIG. 10A , at the step portion 6f formed by the upper die guide block 6d and the upper die sleeve guide 6e hanging down toward the upper die base portion 6a, each upper die sleeve unit 4 is The left and right end portions of the support block 4b are respectively held in a state of concave-convex fitting. In this state, as shown in FIG. 10B , the step portion 6f can be pulled out as a guide to the near side according to the upper die set unit 4 and exchanged with another upper die set unit 4 . FIG. 9 shows the upper die housing unit 4 taken out from the upper die holder 6 .

Also, in the state where the mold 1 for compression molding is opened, as shown in FIGS. 10A and 10B , the lower mold base of the lower mold base 7 The lower mold base side part 7b is rotated by a predetermined amount around the hinge 7g on the back side of the part 7a to press upward from the front side. At this time, as shown in FIG. 10A , each lower mold case unit 5 is held in a state where the step portions 5 m of the left and right ends of the lower mold case plate 5 j are concave-convexly fitted, and are held by standing on the lower mold base. The step portion 7f formed by the lower mold guide block 7d of the lower mold portion 7a and the lower mold sleeve guide 7e. In this state, as shown in FIG. 10B , the lower die set unit 5 can be pulled out to the front side by using the step portion 7f as a guide to exchange it with another lower die set unit 5 . FIG. 9 shows the lower die housing unit 5 taken out from the lower die holder 7 .

In this way, in the case of mold exchange, the upper mold base 6, the adjustment mechanism 8 and the lower mold base 7 can be used without exchange, so the versatility is high, and tool replacement or maintenance can be performed quickly. Also, the upper mold base 6 and the lower mold base 7 are, the upper mold base part 6a and the upper mold base side part 6b pass through the inner hinge 6g, the lower mold base part 7a and the lower mold base side part 7b pass through the inner hinge 7g Since each is rotatably connected, it is easy to pull out the upper mold housing unit 4 and the lower mold housing unit 5 from the front side of the mold, and the replacement work can be easily performed.

[Second embodiment]

11A and 11B show other configuration examples of the compression molding die 1 . The same reference numerals are assigned to the same components as those in the compression molding die 1 disclosed in the first embodiment, and the explanations are cited, and the following description will focus on different configurations.

A plurality of semiconductor chips will be mounted on the workpiece W, but for example, if a defect occurs in the wafer mounting part, semiconductor chips may be generated on the workpiece W. The condition of the defective portion of the wafer. In this case, it is sufficient to accurately measure the number of defects of the semiconductor wafer for each workpiece W and change the amount of resin to be supplied, but it takes time and man-hours, and it is necessary to supply the resin by precise metering. Therefore, in this embodiment, an overflow cavity to be described later is provided so that even if the supply amount of the molding resin is not necessarily consistent, it can be adjusted on the mold side.

As shown in FIG. 11A, the high step portion 5d1 at the bottom of the mold cavity is arranged around the upper side outer peripheral edge portion of the lower mold cavity part 5d of each lower mold cover unit 5, and the step portion 5d1 A plurality of overflow mold cavities 10 are provided. The overflow cavity 10 accommodates (deviation in the amount of absorbed resin) an excess amount of the molding resin supplied to the cavity recess 3a of the lower mold. Therefore, the amount of resin supplied to the cavity recess 3a of the lower mold needs to be larger than the amount of resin required for the thickness of the final package to be supplied to overflow the cavity.

As shown in FIG. 11A , a plurality of through-holes 5d2 are provided in the step portion 5d1 of the lower mold cavity 5d. The floating member 10a is inserted into each through-hole 5d2 so that it can ascend and descend. Each floating member 10a is erected and supported on the upper surface of the connecting plate 10b arranged in a horizontal posture between the lower mold base plate 5a and the support plate 5c. Each floating member 10a passes through the support plate 5c and is inserted into the through hole 5d2 of the lower mold cavity member 5d. A coil spring 10c is provided between the connecting plate 10b and the bottom mold base plate 5a, and each floating member 10a is biased and supported upwards through the connecting plate 10b. As shown in FIG. 11B , the overflow cavity 10 is formed by the upper end surface of each floating member 10 a and the hole wall surface of the through hole 5 d2 . In addition, the floating member 10a may be in the shape of a block, or may be in the shape of an elongated pin. The shape of the end surface (plane) on each overflow cavity 10 may be rectangular, or other shapes such as a circle.

On the lower surface of the connection plate 10b, a push pin 10d protrudes vertically downward. The push pin 10d may pass through the lower mold base plate 5a and the lower mold base 7 (lower mold base portion 7a) and be supported by a mold opening and closing mechanism not shown (for example, a movable platen). In addition, for example, a pressure sensor (load cell, etc.) may be provided at the lower end portion of the push pin 10d. Thereby, the resin pressure of the molding resin can be controlled in real time by directly measuring the pressure of the resin flowing into the overflow cavity 10 when the mold is closed by using the pressure sensor in real time. In addition, the push pin 10d is not necessarily required, and may be absent.

Also, as shown in FIG. 11A, a stopper 5i may be protrudingly provided below the edge 5h of the push pin 5f supporting the lower mold movable clamper 5e. The stopper 5i can stop the downward movement by abutting the lower end of the stopper 5i against the base plate 5a when the movable clamper 5e of the lower die is pressed down by the upper die 2 . The stopper 5i is provided to regulate the lower movement limit position of the lower die movable clamper 5e. Thereby, since the height of the cavity recessed part 3a of the lower mold is determined, the thickness of each sealing part (resin sealing part) compressed and molded at a plurality of places can be kept constant and managed.

Here, the behavior of the floating member 10a during the compression molding operation will be described with reference to FIG. 11A. Normally, all of the semiconductor wafers should be mounted on the workpiece W, but in the previous process, it was found that the semiconductor wafer itself was defective, and a part of the semiconductor wafer was not mounted on the workpiece. That is, a part of the semiconductor wafer may be missing. In addition, if there is a chip in the semiconductor wafer or chip in the semiconductor wafer in the workpiece W, or part of the resin falls during the resin transfer, or the amount of the molding resin supplied to the concave portion 3a of the lower mold cavity is insufficient for some reason than the target resin amount In the case of compression molding, when the compression molding mold 1 is closed, the screw The potential energy of the spring 10c penetrates the support plate 5c and is inserted into the through holes 5d2 of the lower mold cavity 5d. The floating elements 10a enter the lower mold cavity recess 3a from the step portion 5d1 and are compressed and formed. In order to absorb the difference between the volume of the cavity of the lower mold and the resin amount of the supplied molding resin.

Also, when the amount of molding resin supplied to the lower mold cavity recess 3a for the workpiece W is larger than the target resin amount, the floating member 10a is pushed down by the resin pressure against the potential energy of the coil spring 10c, and the excess resin is maintained. Compression molding is performed while being housed in the through hole 5d2. In order to absorb the difference between the cavity volume of the lower mold and the resin amount of the molding resin.

Also, since the molded thickness of the final package may be thin if the amount of resin is too small, it is preferable to initially supply more resin than the target amount of resin and to adjust by the amount of reduction of each float 10a.

Therefore, even if the supply amount of the molding resin is accurately measured for each workpiece W, compression molding can be performed with the thickness of the molded product kept constant. Also, since the recesses or protrusions formed in the molded product are located on the outer peripheral edge of the workpiece W which is not related to the final product, the quality of the molding will not be affected. Moreover, since the floating member 10a is always biased towards the molding resin in the cavity recess 3a, the resin pressure is applied to the molding resin in the cavity recess 3a, which can crush the void and improve the molding quality. In addition, although the overflow cavity 10 is set on the lower mold cavity part 5d, it can also be set on the clamping surface of the lower mold movable clamper 5e.

[modified example]

Next, a modified usage example corresponding to the workpiece W of the compression molding die 1 of FIG. 1 will be described with reference to FIGS. 12 to 15 . Figure 1 for compression molding The die 1 is an example of the case where the workpiece W, for example, two rectangular strip substrates of 300 mm x 100 mm are simultaneously compression-molded, but workpieces W larger in size may be used for compression molding one by one.

12 and 13 are front sectional explanatory views and side sectional views of a compression molding die for compression molding a large-sized workpiece. It shows that from the composition of the upper mold 2 shown in Figure 1, the upper mold guide block 6d and the upper mold cover guide 6e located at the middle part of the upper mold base 6 are removed, and the upper mold cover unit 4 is replaced with Example for large-sized workpiece W. Also, it shows that the lower mold guide block 7d and the lower mold cover guide 7e provided in the middle part of the lower mold base 7 are removed from the structure of the lower mold 3 shown in FIG. 1, and the lower mold cover unit 5 is replaced by Example for large-sized workpiece W. Also in this case, the upper mold base 6 and the adjustment mechanism 8 and the lower mold base 7 can be shared.

In the case of FIG. 12, since the pressing plate 8d is divided and there are two adjustment mechanisms 8, even if the thickness of the workpiece W itself is slightly different from the left to the right or the amount of resin supplied to the concave portion 3a of the lower mold cavity is slightly different from the left and right. In the case of different supply, compared with the case where the pressing plate 8d shown in FIG. 13 is integrated, the adjustment mechanism 8 can adjust the mold height individually.

14A and 14B are plan views of the upper mold 2 and the lower mold 3 when compression molding a large rectangular panel of, for example, 300 mm×300 mm as the workpiece W is performed. In the upper die 2 in FIG. 14A , the same number of chuck claws 4d (for example, three locations) are provided on each of the four sides of the workpiece W sucked by the upper die 4c. Also, the upper die guide block 6d and the upper die housing guide 6e are provided only at the left and right end portions of the upper die base 6 . On the outer peripheral portion of the upper template 4c, the upper mold adjustment pin 4k is in a plurality of positions (for example, each side 4 parts) breakout. Note that the suction holes 2b for the plurality of workpieces W formed in the workpiece holding portion 2a are not shown in the drawing.

In Fig. 14B, in the lower mold movable clamper 5e of the lower mold 3, the escape groove 5e1 corresponds to the chuck jaw 4d of the upper mold 2, and the same number (for example, 3 positions) are respectively provided around the cavity recess 3a of the lower mold. Also, the lower die guide block 7d and the lower die housing guide 7e are provided only at the left and right end portions of the lower die base 7 . On the outer peripheral portion of the lower mold movable clamper 5e, a plurality of locations (for example, four locations on each side) at positions facing the upper mold adjustment pin 4k are protruded. In addition, a plurality of suction holes 5e5, an annular groove 5e2 and a suction hole 5e3 formed at the bottom of the film suction groove 5e4 around the lower die movable holder 5e are not shown.

300mm的半導體晶圓及圓形的載體、基板進行壓縮成形之情況的上模2及下模3的平面圖。在圖15A中的上模2，夾盤爪4d在被上模板4c所吸附之工件W的周圍以等間隔(例如錯開各90度相位的4個部位)設置。又，上模導引塊6d及上模模套導引件6e僅設在上模模座6的左右兩端部。於上模板4c的外周緣部，上模調整銷4k在複數部位(例如每一邊4個部位)突設。此外，於工件保持部2a形成有複數個的工件W之吸附孔2b係省略圖示。 Fig. 15A, Fig. 15B are for example diameter as workpiece W

A plan view of the upper mold 2 and the lower mold 3 in the case of compression molding a 300 mm semiconductor wafer, a circular carrier, and a substrate. In the upper mold 2 in FIG. 15A , the chuck jaws 4 d are arranged at equal intervals (for example, 4 positions staggered by 90 degrees) around the workpiece W sucked by the upper mold 4 c. Also, the upper die guide block 6d and the upper die housing guide 6e are provided only at the left and right end portions of the upper die base 6 . Upper die adjustment pins 4k protrude from a plurality of places (for example, four places on each side) on the outer peripheral portion of the upper die plate 4c. In addition, the suction hole 2b which formed the several workpiece|work W in the workpiece|work holding part 2a is abbreviate|omitted from illustration.

In Fig. 15B, in the movable clamper 5e of the lower mold of the lower mold 3, the escape groove 5e1 corresponds to the chuck jaw 4d of the upper mold 2 at equal intervals around the concave part 3a of the lower mold cavity (for example, 4 phases staggered by 90 degrees). part) settings. Also, the lower mold guide block 7d and the lower mold mold cover guide 7e are only located on the lower The left and right ends of the mold base 7. On the outer peripheral portion of the movable clamper 5e of the lower mold, a plurality of places (for example, 4 places on each side) are projected at positions facing the upper mold adjustment pins 4k. In addition, a plurality of suction holes 5e5, an annular groove 5e2 and a suction hole 5e3 formed at the bottom of the film suction groove 5e4 around the lower die movable holder 5e are not shown. In addition, as the workpiece W, in addition to a circular semiconductor wafer, a circular carrier or substrate such as an eWLB on which a plurality of semiconductor wafers T are die bonded may be used.

As shown in FIGS. 14 and 15 , it may also be a mold 1 for compression molding, which includes: an upper mold 2 having a workpiece holding portion 2a for holding one workpiece W; The lower mold cavity recess 3a is formed toward the clamper 5e that is arranged to clamp the workpiece W and the cavity part 5d that is inserted into the clamper 5e and pressurizes the resin through relative movement. The upper mold 2 is equipped with an adjustment mold clamp The adjustment mechanism 8 (not shown) for the deviation in the thickness direction over time. In this case, for example, even for large-sized workpieces W that cannot be arranged horizontally and side by side, the upper mold 2 equipped with the adjustment mechanism 8 can be used to adjust the deviation of the mold height corresponding to the large-sized workpiece W at the time of mold clamping. Compression molding is performed with high precision.

Fig. 16 is a case in which the configurations of the cavity member 5d and the support plate 5c of the lower die case unit 5 are changed in the compression molding die 1 shown in Fig. 1 . That is, the supporting plate 5c is not supporting the cavity part 5d of the lower die, but is provided in such a way as to support the movable holder 5e of the lower die and the cover plate 5j of the lower die. The lower mold cavity part 5d is formed to be directly supported by a plurality of support columns 5b erected on the lower mold base plate 5a. In addition, the plurality of suction holes 5e5, the annular groove 5e2 and the suction hole 5e3 formed at the bottom of the film suction groove 5e4 around the movable clamper 5e of the lower mold are not shown.

In this case, since the plate thickness of the lower mold cavity part 5d can be thickened, and the support column 5b supports the lower mold cavity part 5d directly below, it becomes less susceptible to warping etc., and higher precision can be achieved. Height adjustment using the support column 5b is performed.

The left half of Fig. 17 is the movable clamper 5e of the lower die which becomes the lower die set unit 5 in the compression molding die 1 shown in Fig. 1, and the lower die holder 5e is fixedly supported by the support plate 5c. , the lower mold cavity part 5d is connected to the driving mechanism 11 and is set to be directly liftable. The driving mechanism 11 may be a servo motor 11a and a power transmission part 11b, or may be a hydraulic actuator. In this case, the volume of the lower mold cavity concave portion 3a can be controlled with high precision, and the resin pressure can be easily applied to the molding resin supplied to the lower mold cavity concave portion 3a.

In the right half of FIG. 17 , the lower end of the push pin 5f supporting the movable clamper 5e of the lower mold at the upper end is supported by the movable connecting plate 12 . The movable connecting plate 12 is installed in a horizontal posture in a cutout formed in the lower die base plate 5a. The movable connecting plate 12 is connected to the driving mechanism 13 and is configured to be directly liftable. The driving mechanism 13 may be a servo motor 13a and a power transmission part 13b, or may be a hydraulic actuator. In addition, a plurality of suction holes 5e5, an annular groove 5e2, and a suction hole 5e3 formed at the bottom of the film suction groove 5e4 formed around the movable clamper 5e of the lower mold are not shown.

Thereby, the transfer driving mechanism (plunger driving mechanism) of the conventionally used transfer molding press machine for handling two sheets can also be used as the driving mechanism of the lower mold movable gripper 5e.

FIG. 18 is not an example only for the rectangular panel shown in FIG. 14A and FIG. 14B or the circular semiconductor wafer shown in FIG. 15A and FIG. 15B . The large-sized workpiece W is compression-molded alone, and the case where the compression-molding die 1 for compression-molding one strip substrate is exemplified.

FIG. 19 shows a compression molding mold 1 for three strip substrates instead of the compression molding mold 1 for two strip substrates shown in FIG. 1 . The mold structure is the same as that in Fig. 1 and illustrates the mold case unit (upper die case unit 4 and lower die case unit 5) for inserting and pulling out the common die base (upper die base 6 and lower die base 7) The number of cases is 3 groups. In addition, it is also possible to set more than 4 sets of mold sets.

20A and 20B show other configurations of the adjustment mechanism 8 . In FIG. 1, a spring mechanism using a coil spring 8e is provided as the adjustment mechanism 8, but a wedge mechanism 14 may also be used. In Fig. 20A and Fig. 20B, between the upper die base part 6a of the upper die base 6 and the upper die set plate 4a of the upper die set unit 4, the movable sliding plate 14a and the wedge plate 14b make the tapered surface 14c overlap each other and be layered. The wedge plate 14b is assembled so as to overlap the upper mold set plate 4a through the height adjustment plate 14d.

Also, as shown in FIG. 20B, a screw shaft 14e and a servo motor 14f are attached to the rear side of the rectangular frame-shaped upper die base side portion 6b. The screw shaft 14e is screw-fitted to a nut provided on the movable slide plate 14a. By rotating and driving the servo motor 14f by a predetermined amount in a predetermined direction, the movable slide plate 14a moves in the horizontal direction along the upper mold base portion 6a. At this time, the height position of the upper mold housing unit 4 is adjusted through the wedge plate 14b laminated through the tapered surface 14c. That is, as shown in FIG. 20A , the difference in thickness of the workpiece W may be absorbed by the clearance in the mold opening and closing direction of the step portion 6f on which the support block 4b of the upper mold case unit 4 is locked.

FIG. 21 is a plan view showing an example of a resin molding apparatus equipped with any one of the compression molding dies 1 described above. The workpiece W is a rectangular strip substrate of 100 mm × 300 mm. Although the molding resin can be any one of tablet resin (solid resin), sheet resin, granular resin, powder resin and liquid resin, as One example is the use of granular resins. The press unit 15 on which the die 1 for compression molding is mounted is provided at three places. On average, one press unit 15 processes 2 pieces, and a total of 6 pieces of workpiece W can be compression-formed by one press operation. In addition, considering the time required for supply, forming by pressing, storage, etc., in order to improve productivity, when the number of press machines is large, each press machine may perform forming sequentially.

On the left end side of the three press parts 15 arranged side by side, there is provided a workpiece supply and storage unit 16 for supplying the workpiece W and storing it in a magazine after forming. The workpiece transfer mechanism 17 reciprocates between the workpiece supply and storage unit 16 and the press unit 15, and takes out the workpiece W after forming and supplies the workpiece W before forming when moving forward and backward toward the opened compression molding die 1. . The workpiece loader (loader) 17 that enters the press part 15 receives the workpiece W (formed product) formed in a set of 2 pieces, and delivers the unformed workpiece W in a set of 2 pieces to the compression molding mold 1 (the workpiece holding part 2a of the upper mold 2: refer to FIG. 1).

A film resin supply unit 18 is provided on the right end side of the press unit 15 . In the film resin supply part 18, each film is supplied corresponding to each tape board|substrate, and it cut|disconnects into the sheet-shaped film 9. As shown in FIG. On the sheet film 9, the target amount of resin is calculated from the result detected in the workpiece supply and storage unit 16, and the particle resin is sprinkled flatly, for example, on a shape substantially the same size as the cavity in plan view. Again, aforementioned resin and sheet-like film 9 are by resin The conveyance mechanism 19 conveys from the film resin supply part 18 to the press part 15, and after forming, only the sheet-shaped film 9 is collected.

In the above-mentioned resin molding apparatus, in each punching section 15, since the sheet-like film 9 and the resin pair are arranged side by side for a plurality of (for example, 2 sheets as a set) strip substrates and substrates, the die set units are respectively Supply and compression molding is performed individually while absorbing variations in the thickness of the workpiece W and the amount of resin, so productivity and handling can be improved. The number of punching units 15 is not limited to three punching machines, and may be more or less than that.

In addition, in the compression molding apparatus, for example, either one of the upper die 2 and the lower die 3 may be a movable die and the other may be a fixed die, or both may be movable dies. The mold opening and closing mechanism for opening and closing the compression molding mold 1 can use various drive mechanisms such as those using a servo motor and a screw shaft, those using a servo motor and a toggle link, or those using a hydraulic drive mechanism.

Also, in the compression molding die 1 , the cavity recess 3 a is formed on the lower die 3 and the workpiece holding portion 2 a is formed on the upper die 2 , but the workpiece holding portion may be formed on the lower die 3 and the cavity recess is formed on the upper die 2 . In this case, the adjusting mechanism 8 can be integrated with the lower mold base 7 , and the sheet film 9 can also be adsorbed and held on the upper mold housing unit 4 . In this case, the molding resin is supplied not onto the sheet film 9 but onto the workpiece W. As shown in FIG. In addition, the present embodiment is an embodiment using the sheet-shaped film 9, but a long film may also be used.

Furthermore, although this embodiment is an embodiment using a thin film, it may also be a case where no thin film is used.

The aforementioned compression molding die 1 is an example for processing one or two workpieces W, but it may also be configured to mold three or more workpieces W.

Other configurations of the compression molding device will be described.

As shown in FIG. 22 , for example, a plurality of compression molding molds 1 for processing one workpiece W may be mounted side by side and opened and closed by a common press drive mechanism 20 (die opening and closing mechanism). In FIG. 22, guide columns 20b are erected at each corner of a rectangular press base 20a. The upper end of the guide column 20b is connected to the fixed platform 20c, and a movable platform 20d is provided in the middle to be slidably connected. The movable platform 20d is raised and lowered by the servo motor 21a and the power transmission part 21b provided in the press base 20a. The upper mold 2 is supported on the fixed platform 20c in a horizontal arrangement, and the lower mold 3 is supported in a horizontal arrangement on the movable platform 20d. An adjustment mechanism 8 (not shown) similar to that shown in FIG. 9 is provided in the upper die housing unit constituting the upper die 2 .

Fig. 23 shows another configuration of the compression molding device. The compression molding die 1 for processing one workpiece W may be mounted in a plurality of stacked layers (two layers in this embodiment) in the height direction, and opened and closed by a common press drive mechanism 20 (die opening and closing mechanism). In FIG. 23 , guide columns 20 b are erected at respective corners of a rectangular press base 20 a. The upper end of the guide column 20b is connected to the fixed platform 20c, and the movable platform 20d and the middle platform 20e are respectively connected in a slidable manner in the middle part. The movable platform 20d is raised and lowered by the servo motor 21a and the power transmission part 21b provided on the press base 20a. The intermediate platform 20e is connected by a rack and pinion mechanism (not shown) linked with the lifting action of the movable platform 20d in a manner of lifting with different strokes (for example, the moving ratio between the movable platform 20d and the intermediate platform 20e is 2:1). .

Upper molds 2 are supported under the fixed platform 20c and the intermediate platform 20e, respectively, and lower molds 3 are respectively supported above the movable platform 20d and the intermediate platform 20e. Each of the upper die housing units constituting the upper die 2 is provided with an adjustment mechanism 8 (not shown) similar to that in FIG. 9 .

In this way, even if one piece of workpiece W is processed such as a large-sized workpiece, productivity is improved by performing compression molding of multiple pieces at the same time, and each mold set unit arranged in parallel or in multiple layers is clamped when the mold is clamped. The deviation of the mold height is absorbed by the adjustment mechanism 8, and the compression molding is performed with high precision without the mold tilting.

Here, another example of the compression molding die 1 will be described with reference to FIGS. 24 and 25 . The die 1 for compression molding clamps a plurality of workpieces W arranged side by side side by side individually, and performs compression molding at the same time. The same reference numerals are assigned to the same components as those in the first embodiment, and the explanations are cited.

The structure of the upper mold 2 (the first mold) will be described with reference to FIG. 24 . This figure is a conceptual record with the minimum composition. An adjustment mechanism 8 (coil spring 8e) is provided for each of the plurality of workpieces W on an upper die base portion 6a constituting the bottom of the upper die base 6 (first base portion). The adjustment mechanism 8 keeps the template 4c on the workpiece W arranged horizontally and supported by suspension. The workpiece holding part 2a which suction-holds the workpiece|work W individually is formed in the upper platen 4c. In addition, although the upper mold base portion 6a is not shown, there is an upper mold guide block 6d (first mold base side portion 6b (first base side portion) or an upper mold space portion 6c (first mold space portion) for partitioning the upper mold base portion 6a. guide block), suction mechanism and decompression mechanism, but these can also be set.

The structure of the lower die 3 (second die) will be described. The lower mold base part 7a constituting the bottom of the lower mold base 7 (second base part) is upper and lower. The mold cavity member 5d is disposed opposite to the workpiece holding portion 2a and is supported and fixed in a row in the lateral direction. In addition, around the lower mold cavity 5d, the movable lower mold clamper 5e that clamps the workpiece W is independently floating supported for each workpiece through the coil spring 5g. The lower mold cavity recess 3a is formed by the lower mold cavity part 5d and the lower mold movable holder 5e. The lower mold cavity 5d pressurizes the resin by relatively moving while being inserted into the lower mold movable holder 5e. In addition, on the lower mold base portion 7a, a lower mold guide block 7d (second mold space portion) for partitioning the lower mold base side portion 7b (second base side portion) or the lower mold space portion 7c (second mold space portion) can also be erected. Two guide blocks) and so on.

With the above structure, when the upper mold 2 and the lower mold 3 clamp a plurality of workpieces W, the adjusting mechanism 8 and the coil spring 5g absorb the workpieces W by having the workpiece holding parts 2a arranged laterally on the upper mold base part 6a. The upper mold plate 4c (the first upper mold plate and the second upper mold plate) and the lower mold cavity concave portion 3a (the first lower mold cavity concave portion and the second lower mold cavity concave portion) formed opposite to it are formed. The lower mold is movable Since the clamper 5e performs the deviation of the height of the mold when clamping each workpiece W, clamping can be performed without the mold being tilted.

FIG. 25 shows still another example of the mold 1 for compression molding. The die 1 for compression molding clamps a plurality of workpieces W arranged side by side side by side individually, and performs compression molding at the same time. The same reference numerals are assigned to the same components as those in the first embodiment, and the explanations are cited.

The structure of the upper mold 2 (the first mold) will be described with reference to FIG. 25 . This figure is a conceptual record with the minimum composition. In the upper die base part 6a (first base part) constituting the bottom of the upper die base 6 (first die base), a plurality of workpieces W are independently held on the upper die 4c (the first upper die and the second upper die). boards) are supported in a horizontal arrangement. The workpiece holding part 2a which suction-holds the workpiece|work W individually is formed in the upper platen 4c. In addition, in the upper mold base portion 6a, although not shown, there is an upper mold guide block 6d ( first guide block), suction mechanism and decompression mechanism, but these can also be set.

The structure of the lower die 3 will be described. In the lower mold base 7a (second base part) constituting the bottom of the lower mold base 7 (second mold base), the lower mold movable clamper 5e and the lower mold movable clamper 5e are disposed opposite to the workpiece holding part 2a to clamp the workpiece W. The lower mold cavity recess 3a (the first lower mold cavity recess and the second lower mold cavity) is formed by the lower mold cavity part 5d that pressurizes the resin by relatively moving while being inserted into the lower mold movable holder 5e. Cavity recesses) are supported laterally.

Specifically, the cavity part 5d of the lower mold is independently supported and fixed on the lower mold plate 5r (die plate) according to each workpiece W. The lower die movable clamper 5e is biased and supported on the lower die plate 5r for each workpiece W independently via a coil spring 5g. Between the lower die plate 5r and the lower die base portion 7a, an adjustment mechanism 8 (coil spring 8e) independent for each workpiece W is provided.

In addition, in the lower mold base portion 7a, although not shown, there is a lower mold guide block 7d (second mold base side portion 7b (second base side portion) or a lower mold space portion 7c (second mold space portion) for partitioning the lower mold base portion). boot block), etc., but these can also be set.

Thereby, when the upper mold 2 and the lower mold 3 clamp a plurality of workpieces W individually, because the coil spring 5g of the movable clamper 5e of the lower mold and the adjustment provided between the lower mold 5r and the base part 7a of the lower mold mechanism 8. Absorb the deviation of the height of the mold for each workpiece W, so it can be clamped without the mold tilting. The upper mold 2 is arranged laterally on the upper mold base part 6a and the upper mold plate 4c with the workpiece holding part 2a is arranged The lower mold 3 is provided with a lower mold cavity concave portion 3 a facing the workpiece holding portion 2 a and arranged side by side on the lower mold base portion 7 a.

1‧‧‧Mold for compression molding

2‧‧‧upper mold

2a‧‧‧Workpiece Holder

3‧‧‧Lower mold

3a‧‧‧The concave part of the lower mold cavity

4‧‧‧Upper die set unit

5‧‧‧Lower mold set unit

6‧‧‧upper die base

6a‧‧‧The base of the upper mold

6b‧‧‧The side of the upper mold base

6d‧‧‧Upper die guide block

6e‧‧‧Upper die sleeve guide

7‧‧‧Lower mold base

7a‧‧‧The base of the lower mold

7b‧‧‧The side part of the lower mold base

7d‧‧‧Lower mold guide block

7e‧‧‧Lower mold sleeve guide

8‧‧‧Adjustment mechanism

W‧‧‧workpiece

Claims (8)

A mold for compression molding, which individually clamps a plurality of workpieces arranged side by side in a horizontal direction and performs compression molding at the same time, and is characterized by comprising: a first mold having a workpiece holding part for individually holding the plurality of workpieces; And the second mold is added by a holder that is arranged opposite to the workpiece holding portion and that clamps the workpiece and that is independently arranged for each workpiece, and relatively moves while being inserted into the holder. A mold cavity part of resin is pressed to form a plurality of mold cavity recesses. The first mold is that the first mold cover unit with the workpiece holding part is arranged side by side on the first mold base, and the first mold has an adjustment mechanism that includes a spring unit that biases the first mold case unit from the first mold base in a direction away from the mold opening and closing direction, and individually arranges the first mold base in parallel. The deviation adjustment of the mold height of the first mold set unit when the mold is clamped. The mold for compression molding as claimed in claim 1, wherein the second mold is that the second mold housing units having the concave parts of the mold cavity are arranged side by side on the second mold base, and each second mold housing unit is formed to form the aforementioned The cavity part at the bottom of the cavity recess and the holder surrounding the cavity part and forming the sides of the cavity recess are supported in a relatively movable manner to the second mold base. Such as the compression molding mold of claim 2, wherein the film covering the clamping surface of the lower mold containing the concave part of the mold cavity is according to Each of the aforementioned second die sets is held by adsorption. Such as the mold for compression molding of claim 1, which has: an upper mold base; an upper mold cover unit; part; the lower mold base is arranged opposite to the aforementioned upper mold base; and the lower mold cover unit is assembled on the aforementioned lower mold base in a pluggable manner, and is arranged opposite to the aforementioned workpiece holding portion. The cavity part of the lower mold and the holder surrounding the cavity part of the lower mold and supported in a relatively movable manner form the concave part of the cavity of the lower mold. Such as the compression molding mold of claim 4, wherein in the above-mentioned upper mold base, a pair of the aforementioned upper mold mold cover units are respectively detachably supported by the aforementioned adjustment mechanism in a horizontal arrangement, and each of the aforementioned upper mold mold cover units has The first upper template and the second upper template, which are overlapped and assembled with the aforementioned adjustment mechanism and have the aforementioned workpiece holding portion, can be attached and detached to the aforementioned lower mold holder in such a way that they are opposite to and arranged laterally with a pair of aforementioned upper mold cover units. A pair of lower mold cover units are arranged on the ground, and the above-mentioned lower mold cover units are respectively provided with a first lower mold cavity concave portion and a second lower mold cavity concave portion, and the first lower mold cavity concave portion is connected with the first upper mold cavity. The above-mentioned lower mold cavity part of the template facing configuration, and the holder surrounding the aforementioned lower mold cavity part and supported in a relatively movable manner are formed. The second lower mold cavity concave part is formed by the aforementioned second The lower mold cavity of the upper mold plate facing the configuration, and the lower mold cavity surrounding the aforementioned lower mold cavity and with Relatively movable means are formed by supported holders. A mold for compression molding is equipped with a plurality of horizontally arranged molds for clamping a singular number of workpieces and compressing and molding resin, and is opened and closed by a common mold opening and closing mechanism. A workpiece holding portion of a workpiece; and a second mold, a holder for clamping the workpiece by being disposed opposite to the workpiece holding portion, and a cavity member for pressurizing resin by being inserted into the holder for relative movement , to form the concave part of the mold cavity, any mold of the aforementioned first mold or the aforementioned second mold is equipped with an adjustment mechanism for height adjustment, and the adjustment mechanism is equipped with a spring unit, and the spring unit sets the first mold cover plate relative to the first mold seat or bias the second mold cover plate relative to the second mold base in the mold opening and closing direction. A mold for compression molding, which individually clamps a plurality of workpieces arranged side by side in a horizontal direction and performs compression molding at the same time, is characterized in that it includes: a first mold, a first base part provided on a first mold base, The workpiece holding part for holding the aforementioned workpiece is supported horizontally; and the second mold is tied to the second base part of the second mold base to support the concave part of the mold cavity horizontally. The workpiece holding part is formed by a holder disposed opposite to hold the workpiece and a cavity member that relatively moves while being inserted into the holder to pressurize the resin, and the cavity member is formed by each The workpieces are independently supported and fixed on the mold plate, the aforementioned clamps are independently biased and supported on the aforementioned mold plate according to each workpiece, and adjustment is provided between the aforementioned mold plate and the aforementioned second base portion. The adjustment mechanism has a spring unit biased in the mold opening and closing direction, and the height adjustment is performed independently for each workpiece. A compression molding device comprising the compression molding mold according to any one of claims 1 to 7.

Images