TWI787417B - Mold for compression molding and compression molding device - Google Patents
Mold for compression molding and compression molding device Download PDFInfo
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- TWI787417B TWI787417B TW107145823A TW107145823A TWI787417B TW I787417 B TWI787417 B TW I787417B TW 107145823 A TW107145823 A TW 107145823A TW 107145823 A TW107145823 A TW 107145823A TW I787417 B TWI787417 B TW I787417B
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- 238000000748 compression moulding Methods 0.000 title claims abstract description 142
- 229920005989 resin Polymers 0.000 claims abstract description 138
- 239000011347 resin Substances 0.000 claims abstract description 138
- 230000007246 mechanism Effects 0.000 claims abstract description 108
- 238000000465 moulding Methods 0.000 claims description 55
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 85
- 239000000758 substrate Substances 0.000 description 31
- 230000002093 peripheral effect Effects 0.000 description 24
- 239000004065 semiconductor Substances 0.000 description 17
- 235000012431 wafers Nutrition 0.000 description 16
- 238000003825 pressing Methods 0.000 description 13
- 239000000725 suspension Substances 0.000 description 13
- 238000007667 floating Methods 0.000 description 12
- 238000003780 insertion Methods 0.000 description 12
- 230000037431 insertion Effects 0.000 description 12
- 210000000078 claw Anatomy 0.000 description 10
- 230000006835 compression Effects 0.000 description 10
- 238000007906 compression Methods 0.000 description 10
- 238000000605 extraction Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 6
- 238000005381 potential energy Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 230000006837 decompression Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000000638 solvent extraction Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000037339 smooth wrinkles Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
提供一種壓縮成形用模具裝置,其通用性高且可一邊吸收在將複數個工件並列配置而個別進行壓縮成形時的工件之厚度偏差或樹脂量之偏差,一邊高精度地進行壓縮成形。 Provided is a mold device for compression molding which is highly versatile and capable of performing compression molding with high precision while absorbing variations in the thickness of workpieces or variations in the amount of resin when a plurality of workpieces are arranged in parallel to perform compression molding individually.
壓縮成形用模具裝置具備:上模2,具有將複數個工件W個別地保持之工件保持部2a;及下模3,藉由與工件保持部2a對向配置以夾持工件W之按每個工件獨立地配置之夾持器5e及在保持被插入夾持器5e內的狀態進行相對移動而加壓樹脂之模腔件5d來形成複數個下模模腔凹部3a,上模2係按每個工件W各自具備個別進行高度調整之調整機構8。 The mold device for compression molding includes: an upper mold 2 having a workpiece holding portion 2a for individually holding a plurality of workpieces W; The holder 5e that the workpiece is independently configured and the mold cavity part 5d that presses the resin and moves relatively while being inserted into the holder 5e to form a plurality of lower mold cavity recesses 3a, and the upper mold 2 is set according to each Each of the workpieces W is provided with an adjustment mechanism 8 for individual height adjustment.
Description
本揭示係有關在將並列配置的複數個工件個別地夾持並同時進行壓縮成形時所用的模具用模座、模具用模套單元、壓縮成形用模具及使用此等之壓縮成形裝置。 This disclosure relates to a mold base for a mold, a mold case unit for a mold, a mold for compression molding, and a compression molding apparatus using the same for individually clamping and simultaneously compressing and molding a plurality of workpieces arranged in parallel.
將設於下模的下模模腔凹部以離型薄膜覆蓋,下模模腔凹部被供給模製樹脂(顆粒樹脂、液狀樹脂、粉狀樹脂等),夾持在上模保持有工件的模製模具進行壓縮成形之裝置係被開發出各種裝置並被實用化(參照日本特開2010-36542號公報)。 Cover the concave portion of the lower mold cavity of the lower mold with a release film, and the concave portion of the lower mold cavity is supplied with molding resin (granular resin, liquid resin, powdery resin, etc.), and is clamped on the upper mold to hold the workpiece. Various devices have been developed and put into practical use by molding dies for compression molding (refer to Japanese Patent Application Laid-Open No. 2010-36542).
關於下模腔可動模壓縮成形用模製模具,由於主流是以1個模具對1個工件進行樹脂模製的裝置,所以從減少設置面積以提高生產性的觀點,亦提案有在高度方向使用了上下2層的壓縮成形用模具之壓縮成形裝置(參照日本特開2010-94931號公報)。 As for the molding dies for compression molding of the lower cavity movable die, since the mainstream is a device for resin molding one workpiece with one die, it is also proposed to use it in the height direction from the viewpoint of reducing the installation area and improving productivity. A compression molding device with a two-layer compression molding mold (refer to Japanese Patent Laid-Open No. 2010-94931).
然而,在例如對作為工件的狹條狀的帶材(strip)基板進行壓縮成形之情況,在樹脂基板的情況,相較於導線架,厚度的偏差大,且搭載於1個帶材基板上的半導體晶片的數量,係有因半導體晶片的不良而發生搭載數偏差的情況。又,在1個帶材基板上的半導體晶片的搭載數改變的情況,當模製樹脂的供給量亦不變化時,因為壓縮成形的關係,會導致最終封裝部(樹脂密封部)的成形厚度改變。難以一邊就此等作總體地調整一邊縮短成形時間進行壓縮成形。 However, for example, in the case of compression molding a strip-shaped substrate as a workpiece, in the case of a resin substrate, the variation in thickness is greater than that of a lead frame, and it is mounted on a single strip substrate. The number of semiconductor wafers in the system may vary due to defective semiconductor wafers. In addition, when the number of semiconductor chips mounted on one tape substrate changes, if the supply amount of molding resin does not change, the molded thickness of the final package part (resin sealing part) will be reduced due to compression molding. Change. It is difficult to perform compression molding while shortening the molding time while making overall adjustments to these.
於是,提案有幾個如同轉移成形(transfer moulding)用模具般,將帶材基板平行配置2列以進行壓縮成形的壓縮成形裝置(參照日本特開2011-143730號公報、日本特開2012-40843號公報)。 Therefore, several compression molding devices have been proposed that arrange strip substrates in two rows in parallel to perform compression molding like a mold for transfer molding (refer to JP-A-2011-143730, JP-A-2012-40843 Bulletin).
專利文獻1 日本特開2010-36542號公報
專利文獻2 日本特開2010-94931號公報
專利文獻3 日本特開2011-143730號公報
專利文獻4 日本特開2012-40843號公報
上述日本特開2011-143730號公報的壓縮成形裝置,係搭載有一對的壓縮成形用的成形模,在可動盤上支撐下模,在下模支撐形成有2個模腔的夾持構件及2個滑動構件。在構成模腔底部的滑動構件的裏側(下側)設有安裝棒,各安裝棒上分別被纏繞有彈性構件。藉此,各滑動構件被支撐為對將其包圍的夾持構件可滑動。而且,作成承接各滑動構件的安裝棒之調整手 段係透過以被支撐於可動盤的一根軸為中心呈天秤狀轉動而可對熔融樹脂均等的按壓。然而,因為成為藉由調整手段僅以設於可動盤的一根軸為中心呈天秤狀轉動來吸收供給到左右的模腔的左右的樹脂量之偏差的構造,故在調整手段上有強度的問題。調整手段的強度不足時有破損之虞,在滑動構件未發揮作用下無法吸收樹脂量之偏差。又,在進行模具的維修作業之情況、或將不同工件壓縮成形之情況,有必要從壓縮成形裝置卸下上模及下模的作業。在這情況,有將保持一對的工件的上模整體從固定盤卸下,且有必要從可動盤卸下具有2個模腔的下模整體,故而作業的規模龐大。 The above-mentioned compression molding device of Japanese Patent Application Laid-Open No. 2011-143730 is equipped with a pair of molding dies for compression molding, the lower die is supported on the movable plate, and the clamping member forming two cavities and two dies are supported on the lower die. Slide widget. Mounting rods are provided on the inner side (lower side) of the sliding member constituting the bottom of the cavity, and elastic members are wound around the respective mounting rods. Thereby, each sliding member is supported slidably with respect to the clamping member surrounding it. Moreover, the adjusting hand for receiving the mounting rods of each sliding member is made The segment system can press the molten resin evenly by rotating in a balance around a shaft supported by the movable plate. However, since the adjustment means only rotates in a balance around one axis provided on the movable plate to absorb the deviation in the amount of resin supplied to the left and right cavities, there is a need for strength in the adjustment means. question. If the strength of the adjustment means is insufficient, there is a risk of damage, and the deviation in the amount of resin cannot be absorbed when the sliding member is not functioning. In addition, when performing maintenance work on the mold, or when compressing and molding different workpieces, it is necessary to remove the upper mold and the lower mold from the compression molding apparatus. In this case, it is necessary to remove the entire upper die holding the pair of workpieces from the fixed platen, and it is necessary to remove the entire lower die having two cavities from the movable platen, so the scale of the work is huge.
又,在日本特開2012-40843號的壓縮成形用模具,吸附保持帶材基板之2個上壓縮模是隔介緩衝彈簧分別被懸掛支撐於上主模。在2個上壓縮模的周圍,1個上框模是隔介彈簧被懸掛支撐於上主模。又,在與上主模對向配置的下主模,支撐有構成下模模腔的2個下壓縮模及供此等插入的下框模。相對於下主模,下壓縮模係被支撐固定,下框模係隔介彈簧被浮動支撐。1片離型薄膜被吸附保持於2個下壓縮模及下框模的表面。在上壓縮模分別被吸附保持的帶材基板的板厚誤差係藉由緩衝彈簧之撓曲而吸收。板厚誤差雖能用上壓縮模吸收,但存在於2個帶材間的下框模係共通且會夾入帶材,故而有因帶材厚度差而在夾持時造成下框模傾斜之虞。再者,當因供給到下模模腔的樹脂量之偏差使左右的模具的高度變化時,會有在單側未填充或未達 目標的樹脂壓力的事例或者沖壓機裝置整體(特別是屬可動模的下模)傾斜之虞。又,因為對2個帶材基板進行壓縮成形要使用覆蓋2個下模模腔(2個下壓縮模及下框模)的1片離型薄膜,所以在將離型薄膜吸附保持時,相互拉扯離型薄膜而難以在適當的位置吸附。又,因為要以1片離型薄膜覆蓋2個下模模腔的表面,故處理(handling)困難,會產生無助於壓縮成形之無謂的使用區域。又,在進行模具的維修作業之情況,或對不同種類的工件進行壓縮成形之情況,有將隔介緩衝彈簧被懸掛支撐於上主模的2個上壓縮模一體作交換之必要,因為有將被支撐於下主模的2個下壓縮模及被插入此等且被浮動支撐的下框模一體卸下作交換作業之必要,所以模具交換作業變得很費工。 Also, in the mold for compression molding of JP-A-2012-40843, the two upper compression molds that absorb and hold the strip substrate are respectively suspended and supported by the upper main mold through buffer springs. Around the two upper compression molds, one upper frame mold is suspended and supported on the upper main mold by a spacer spring. In addition, the lower main mold arranged opposite to the upper main mold supports two lower compression molds constituting the cavity of the lower mold and a lower frame mold into which these are inserted. Relative to the lower main mold, the lower compression mold system is supported and fixed, and the lower frame mold system is supported floatingly through spacer springs. One piece of release film is adsorbed and held on the surfaces of the two lower compression molds and the lower frame mold. The plate thickness error of the strip substrates held by suction on the upper compression die is absorbed by the deflection of the buffer spring. Although the plate thickness error can be absorbed by the upper compression mold, the lower frame mold system between the two strips is common and will sandwich the strips, so the lower frame mold may be tilted during clamping due to the thickness difference of the strips Yu. Furthermore, when the height of the left and right molds changes due to the difference in the amount of resin supplied to the cavity of the lower mold, one side may not be filled or not reached. Examples of target resin pressure or the possibility of inclination of the entire press machine (especially the lower die which is a movable die). Also, since a release film covering two lower die cavities (two lower compression dies and a lower frame die) is used for compression molding of two tape substrates, when the release film is adsorbed and held, mutual Pulling the release film makes it difficult to stick in place. In addition, since the surfaces of the two lower mold cavities must be covered with one release film, handling is difficult, and an unnecessary use area that does not contribute to compression molding occurs. In addition, in the case of maintenance of the mold or compression molding of different types of workpieces, it is necessary to replace the two upper compression molds suspended and supported by the buffer spring on the upper main mold as a whole. It is necessary to remove the two lower compression molds supported by the lower main mold and the lower frame mold inserted into them and supported by the float for integral removal, so the mold exchange work becomes labor-intensive.
應用於以下所述幾個實施形態之揭示係為解決上述課題而作的。 The disclosure applied to several embodiments described below is made to solve the above-mentioned problems.
第一目的在於提供一種通用性高的壓縮成形用模具及使用其而生產性高且維持成形品質之通用性高的壓縮成形裝置,其可一邊吸收在將複數個工件並列配置以個別地進行壓縮成形時之工件的厚度的偏差、樹脂量之偏差,一邊高精度地進行壓縮成形。 The first object is to provide a highly versatile compression molding mold and a highly versatile compression molding device using the same, which can maintain high productivity and maintain molding quality, and can compress individually while absorbing a plurality of workpieces arranged in parallel. Compression molding is performed with high precision while taking into account variations in the thickness of the workpiece and variations in the amount of resin during molding.
第二目的在於提供一種壓縮成形模具用的模座,其可容易地進行複數個模具模套單元之交換作業且通用性高。又,提供一種壓縮成形用模具,其可調整在藉由於上述模座橫向排列地並列配置的複數模具模套單元同時 進行壓縮成形時之模具夾持時的模具高度之偏差,以高精度地進行壓縮成形。 The second object is to provide a mold holder for a compression molding mold, which can easily perform the exchange operation of a plurality of mold sets and has high versatility. In addition, there is provided a mold for compression molding, which can be adjusted at the same time by a plurality of mold sets arranged side by side with the above mold bases arranged side by side. Compression molding can be performed with high precision due to the variation in mold height when the mold is clamped during compression molding.
第三目的在於提供一種模具模套單元,其在進行壓縮成形時容易進行薄膜的處理且減少無謂的使用區域,且以薄膜不易產生皺紋使封裝部的厚度成為一定地提升成形品質。又,提供一種壓縮成形用模具,即便複數個模具模套單元橫向排列地並列配置於模座,也可吸收工件的板厚、樹脂量之偏差使成形品質高以提升模具模套交換作業性。 The third object is to provide a mold case unit, which is easy to handle the film during compression molding and reduces unnecessary use area, and makes the thickness of the sealing part constant to improve the molding quality because the film is not easy to produce wrinkles. Also, to provide a mold for compression molding, even if a plurality of mold housing units are arranged side by side in the mold base, it can absorb the deviation of the thickness of the workpiece and the amount of resin, so that the molding quality is high, and the exchange workability of the mold housing is improved.
有關以下所述幾個實施形態之揭示係至少具備以下構成。亦即,一種壓縮成形用模具,係將橫向排列地並列配置的複數個工件個別地夾持並同時進行壓縮成形,其特徵為具備:第一模具,具有將前述複數個工件個別地保持之工件保持部;及第二模具,與前述工件保持部對向配置,且藉由夾持前述工件之按每個工件獨立地配置之夾持器及透過保持被插入前述夾持器內的狀態進行相對移動而加壓樹脂之模腔件來形成複數個模腔凹部,前述第一模具係具備按每個前述工件作個別地高度調整之調整機構。 The disclosure concerning several embodiments described below has at least the following configurations. That is, a mold for compression molding that individually clamps a plurality of workpieces arranged side by side in a horizontal direction and performs compression molding at the same time, is characterized by comprising: a first mold having a workpiece for individually holding the plurality of workpieces a holding part; and a second mold, which is disposed opposite to the workpiece holding part, and is opposed to each other by holding a holder independently configured for each workpiece and maintaining a state of being inserted into the holder The mold cavity part of moving and pressurizing the resin forms a plurality of mold cavity recesses, and the aforementioned first mold is equipped with an adjustment mechanism for individually adjusting the height of each of the aforementioned workpieces.
依據上述構成,模製樹脂被供給到形成於第二模具的複數個模腔凹部,可在將工件保持於第一模具的複數個工件保持部的狀態閉模而按每個工件進行壓縮成形。此時,就算在複數個工件有板厚之偏差或供給 到複數個模腔凹部的樹脂量有偏差,因為按每個工件個別地調整藉由設於第一模具的調整機構將模具夾持時的模具高度之偏差,所以能對樹脂密封部(封裝部)的厚度高精度地進行壓縮成形。 According to the above configuration, molding resin is supplied to the plurality of cavity recesses formed in the second mold, and compression molding can be performed for each workpiece by closing the mold with the workpiece held by the plurality of workpiece holding portions of the first mold. At this time, even if there are deviations in the thickness of the plurality of workpieces or supply The amount of resin to the recesses of the plurality of cavities varies, and the deviation of the height of the mold when the mold is clamped by the adjustment mechanism provided in the first mold is adjusted individually for each workpiece, so the resin sealing part (sealed part) can be adjusted ) The thickness is compressed and molded with high precision.
又,在因為工具更換(tooling change)進行模具交換時,由於設在第一模具的調整機構可共用,故通用性提升。 In addition, when the dies are exchanged due to tooling change, since the adjustment mechanism provided on the first die can be used in common, the versatility is improved.
較佳為:前述第一模具為,在第一模座具有前述工件保持部的第一模套單元被個別橫向排列地並列配置,前述調整機構係具備從前述第一模座將前述第一模套單元各自往與模具開閉方向疏離的方向偏置的彈簧單元,個別地進行在前述第一模座並列配置的前述第一模套單元於模具夾持時的模具高度之偏差調整。 Preferably, the first mold is such that the first mold case units having the workpiece holding portion on the first mold base are individually arranged side by side in a row, and the adjustment mechanism is configured to move the first mold from the first mold base. Each of the cover units is biased in a direction away from the mold opening and closing direction by spring units, which individually adjust the deviation of the mold height of the first mold cover units arranged side by side on the first mold holder when the mold is clamped.
藉此,由於調整機構所具備的彈簧單元按個別橫向排列地並列配置的第一模套單元個別地進行模具夾持時的模具高度之偏差調整,所以可按第一模套單元調整工件的板厚之偏差、樹脂量之偏差。又,即便交換第一模套單元,仍可照舊使用設於第一模座的調整機構。 Thereby, since the spring unit included in the adjustment mechanism individually adjusts the deviation of the mold height at the time of mold clamping for each of the first die set units arranged in parallel in the lateral direction, it is possible to adjust the plate of the workpiece according to the first die set unit. Deviation of thickness, deviation of resin amount. Moreover, even if the first mold set unit is replaced, the adjustment mechanism provided on the first mold base can still be used as usual.
亦可為:前述第二模具為,在第二模座具有前述模腔凹部的第二模套單元被橫向排列地並列配置,各第二模套單元為,形成前述模腔凹部的底部之模腔件與包圍前述模腔件的周圍而形成前述模腔凹部的側部之前述夾持器是被支撐成可對前述第二模座相對移動。 Alternatively, the second mold may be such that the second mold case units having the cavity concave portion on the second mold base are arranged side by side in a horizontal manner, and each second mold case unit may be a mold forming the bottom of the cavity concave portion. The cavity part and the clamper surrounding the cavity part and forming the side part of the concave part of the cavity are supported so as to be relatively movable to the second mold base.
藉此,因為在第一模具上複數橫向排列且並列配置的第一模套單元的工件保持部所保持的工件是將對向配置的第二模套單元的夾持器對模腔件相對地壓下並各自被夾持,所以藉由工件的板厚之偏差、樹脂量之偏差,可在第一模具或第二模具整體未傾斜下按每個工件個別地進行壓縮成形。 Thereby, because the workpieces held by the workpiece holders of the plurality of first mold case units arranged side by side and arranged side by side on the first mold are opposed to the mold cavity parts by the holders of the second mold case units arranged oppositely, Since it is pressed and clamped individually, it is possible to carry out compression molding individually for each workpiece without tilting the whole of the first mold or the second mold due to the deviation of the plate thickness of the workpiece and the deviation of the amount of resin.
較佳為:覆蓋含有前述模腔凹部的下模夾持面之薄膜是按各前述第二模套單元被吸附保持。 Preferably, the film covering the clamping surface of the lower mold containing the concave portion of the mold cavity is sucked and held by each of the aforementioned second mold casing units.
如此,當按各第二模套單元使用覆蓋下模夾持面的薄膜時,在含有下模模腔凹部之下模夾持面進行吸附保持時處理容易,能盡可能地避免如長形薄膜般產生無助於壓縮成形之浪費的使用區域。 In this way, when the film covering the clamping surface of the lower mold is used for each second mold set unit, it is easy to handle when the clamping surface of the lower mold containing the concave part of the cavity of the lower mold is sucked and held, and the thin film such as a long film can be avoided as much as possible. Typically results in wasted use area that does not contribute to compression molding.
亦可為:壓縮成形用模具,具有:上模模座;上模模套單元,隔介調整機構以可裝卸地組裝於前述上模模座,且在上模夾持面具有工件保持部;下模模座,與前述上模模座對向地設置;及下模模套單元,可插拔地組裝於前述下模模座,藉由與前述工件保持部對向配置的下模模腔件及以包圍前述下模模腔件且可相對移動地支撐的夾持器來形成下模模腔凹部。 It can also be: a mold for compression molding, which has: an upper mold mold base; an upper mold mold cover unit, a spacer adjustment mechanism that can be detachably assembled on the aforementioned upper mold mold base, and has a workpiece holding part on the clamping surface of the upper mold; The lower mold base is arranged opposite to the aforementioned upper mold base; and the lower mold cover unit is pluggably assembled on the aforementioned lower mold base, and the lower mold cavity configured opposite to the aforementioned workpiece holding portion The cavity part of the lower mold is formed by the part and the holder which surrounds the cavity part of the lower mold and is relatively movably supported.
因為藉由設於上模模座的調整機構將模具夾持時的模具高度之偏差按每個工件個別地進行調整,所以能對樹脂密封部(封裝部)的厚度高精度地進行壓縮成形。 Since the variation in mold height when the mold is clamped is individually adjusted for each workpiece by the adjustment mechanism provided in the upper mold base, compression molding can be performed with high precision for the thickness of the resin sealing part (sealed part).
亦可為:橫向排列地一對的前述上模模套單元是隔介前述調整機構可各自裝卸地被支撐於前述上模模座,前述上模模套單元各自具備與前述調整機構重疊組裝之具有前述工件保持部之第一上模板與第二上模板,與一對的前述上模模套單元對向而橫向排列地一對的下模模套單元是各自可裝卸地設置在前述下模模座,前述下模模套單元係各自具備:與前述第一上模板對向配置之前述下模模腔件;藉由包圍前述下模模腔件且被支撐成可相對移動的夾持器所形成的第一下模模腔凹部;與前述第二上模板對向配置且包圍下模模腔件與前述下模模腔件並被支撐成可相對移動的夾持器所形成的第二下模模腔凹部。 It can also be: a pair of the above-mentioned upper mold cover units arranged horizontally are supported on the above-mentioned upper mold base in such a way that the adjustment mechanism is separated from each other. The first upper mold plate and the second upper mold plate having the aforementioned workpiece holding portion, and the pair of lower mold mold sleeve units arranged laterally opposite to the pair of aforementioned upper mold mold sleeve units are respectively detachably arranged on the aforementioned lower mold mold. The mold base and the aforementioned lower mold cover unit are respectively equipped with: the aforementioned lower mold cavity part arranged opposite to the aforementioned first upper template; by surrounding the aforementioned lower mold cavity part and being supported to be relatively movable The formed first lower mold cavity concave part; the second mold formed by the clamper that is arranged opposite to the aforementioned second upper template and surrounds the lower mold cavity and the aforementioned lower mold cavity and is supported to be relatively movable. The concave part of the lower mold cavity.
藉此,即便在上模模座配置有橫向排列地一對的上模模套單元,在下模模座配置有與一對的上模模套單元對向而橫向排列地一對的下模模套單元,也可吸收被並列配置的每個模具模套單元在模具夾持時的模具高度之偏差以進行調整。上模模套單元或下模模套單元可單獨由上模模座或下模模座裝卸作交換,即便交換模套,仍可照舊使用設於上模模座的調整機構。 Thereby, even if a pair of upper mold cover units arranged horizontally are arranged on the upper mold base, a pair of lower mold molds arranged laterally opposite to the pair of upper mold cover units are arranged on the lower mold base. The set unit can also absorb the deviation of the mold height of each mold set unit arranged side by side when the mold is clamped for adjustment. The upper die set unit or the lower die set unit can be independently loaded and unloaded by the upper die base or the lower die base for exchange. Even if the die set is exchanged, the adjustment mechanism located on the upper die base can still be used as usual.
一種壓縮成形用模具,係搭載有將單數個工件夾持並將樹脂壓縮成形之複數個橫向排列的模具,且藉由共同的模具開閉機構開閉,其特徵為具備: 第一模具,具有保持前述工件之工件保持部;及第二模具,藉由與前述工件保持部對向配置而夾持前述工件的夾持器與透過被插入前述夾持器內進行相對移動而加壓樹脂的模腔件來形成模腔凹部,在前述第一模具或前述第二模具任一者的模具具備進行高度調整之調整機構。 A mold for compression molding is equipped with a plurality of horizontally arranged molds for clamping a singular number of workpieces and compressing and molding resin, and is opened and closed by a common mold opening and closing mechanism, and is characterized in that it has: The first mold has a workpiece holding part that holds the workpiece; and the second mold is configured by a holder that clamps the workpiece and that is inserted into the holder and moves relative to the workpiece. The cavity part of the resin is pressurized to form the cavity recess, and the mold of either the first mold or the second mold is equipped with an adjustment mechanism for height adjustment.
在這情況,例如即便是一定無法複數橫向排列且並列配置的大尺寸的工件,也能使用具備有複數橫向排列地搭載且藉由共同的模具開閉機構開閉的高度調整機構之第一模具或第二模具的構成,調整與模具夾持時的大尺寸的工件對應的模具高度之偏差而高精度地進行壓縮成形。 In this case, for example, even for large-sized workpieces that must not be arranged side by side in a plurality of horizontal rows, it is possible to use the first mold or the second mold with a height adjustment mechanism that is mounted in a plurality of horizontal rows and opened and closed by a common mold opening and closing mechanism. The structure of the two molds adjusts the deviation of the mold height corresponding to the large-sized workpiece when the mold is clamped, and performs compression molding with high precision.
一種壓縮成形用模具,係將橫向排列地並列配置的複數個工件個別地夾持並同時進行壓縮成形,其特徵為具備:第一模具,在第一模座所具備的第一底座部將保持前述工件之工件保持部予以橫向排列地支撐;及第二模具,係在第二模座所具備的第二底座部,將利用與前述工件保持部對向配置以夾持前述工件之夾持器及在保持被插入前述夾持器內的狀態下作相對移動以加壓樹脂的模腔件所形成之模腔凹部橫向排列地支撐,前述模腔件係對模具板獨立地支撐固定,前述夾持器係按每個工件獨立地偏置支撐於前述模具板,在前述模具板與前述第二底座部間設有按每個工件獨立地進行高度調整之調整機構。 A mold for compression molding, which individually clamps a plurality of workpieces arranged side by side in a horizontal direction and performs compression molding at the same time, and is characterized in that it includes: a first mold, and the first base part of the first mold base will hold The workpiece holding parts of the aforementioned workpieces are supported in a horizontal arrangement; and the second mold, which is attached to the second base part of the second mold base, will use the clamper arranged opposite to the aforementioned workpiece holding parts to clamp the aforementioned workpieces And while keeping being inserted into the aforementioned clamper, relatively moving to support the mold cavity recesses formed by the mold cavity parts of the pressurized resin in a horizontal arrangement, the aforementioned mold cavity parts are independently supported and fixed to the mold plate, and the aforementioned clamps The holder is independently biased and supported on the mold plate according to each workpiece, and an adjustment mechanism for independently adjusting the height of each workpiece is provided between the mold plate and the second base portion.
藉此,在利用於第一底座部設置橫向排列地工件保持部之第一模具、及於第二底座部與工件保持部對向地設置橫向排列地配置的模腔凹部之第二模具將複數個工件個別地夾持時,藉由被偏置支撐於模具板的夾持器及設在模具板與第二底座部間之調整機構,按每個工件來吸收模具高度之偏差,故而可在模具未傾斜下進行夾持。 In this way, a plurality of molds can be combined by using the first mold with the workpiece holding parts arranged in a horizontal line on the first base part and the second mold with the cavity recesses arranged in a horizontal line in the second base part and facing the workpiece holding parts. When each workpiece is clamped individually, the deviation of mold height can be absorbed for each workpiece by the clamper biasedly supported on the mold plate and the adjustment mechanism provided between the mold plate and the second base part, so it can be The mold is clamped without tilting.
在具備上述任一壓縮成形用模具之壓縮成形裝置中,因為能使用將複數個帶材基板並列配置的模具模套單元將板厚及夾持位置之偏差個別地吸收並同時進行壓縮成形,故生產性、成形品質提升。 In the compression molding apparatus provided with any of the compression molding molds described above, since the variation in plate thickness and clamping position can be individually absorbed and compression molding can be performed at the same time by using the mold set unit in which a plurality of strip substrates are arranged in parallel, Improved productivity and molding quality.
一種模座,係將橫向排列地並列配置的複數個模具模套單元可裝卸地支撐之上下一對的模座,其特徵為:在上下任一者的模座,調整機構是與底座部一體設置,該調整機構係吸收起因於藉各模具模套單元所夾持的工件的板厚、模製樹脂的樹脂量及覆蓋夾持面的薄膜厚的合計之偏差所致模具夾持時的模具高度之偏差。 A mold base, which is a pair of upper and lower mold bases that can be detachably supported by a plurality of mold mold cover units arranged side by side in a horizontal arrangement. Set, the adjustment mechanism absorbs the deviation caused by the total deviation of the plate thickness of the workpiece clamped by each mold set unit, the resin amount of the molding resin, and the thickness of the film covering the clamping surface when the mold is clamped. height deviation.
依據上述構成,因為在上下任一方的模座,調整機構是與底座部一體設置,故能吸收起因於被橫向排列地並列配置的複數個模具模套單元所夾持之工件的板厚、模製樹脂的樹脂量及覆蓋夾持面的薄膜厚之合計的偏差所致模具夾持時的模具高度之偏差。 According to the above-mentioned structure, since the adjustment mechanism is provided integrally with the base portion on either the upper or lower die base, it is possible to absorb the plate thickness and die caused by the workpiece clamped by the plurality of die set units arranged in parallel in the horizontal direction. The difference in the height of the mold when the mold is clamped is caused by the total deviation of the resin amount of the resin and the thickness of the film covering the clamping surface.
又,在交換模具模套單元時,無需交換模座,容易進行交換作業,即便交換模具模套單元,仍可照舊使用調整機構,故通用性高。 In addition, when exchanging the mold case unit, there is no need to replace the mold base, and the replacement operation is easy. Even if the mold case unit is replaced, the adjustment mechanism can still be used as usual, so the versatility is high.
亦可為:具備:第一模套導引件,與自第一底座部垂下設置之第一導引塊的模具開閉面側鄰接設置;及第二模套導引件,與自第二底座部豎立設置之第二導引塊的模具開閉面側鄰接設置,藉前述第一導引塊與前述第一模套導引件插拔前述第一模套單元的階差部是各自形成於兩側,藉前述第二導引塊與前述第二模套導引件插拔前述第二模套單元的階差部係各自形成於兩側。 Alternatively, it may be provided with: a first die sleeve guide, which is adjacent to the mold opening and closing surface side of the first guide block suspended from the first base; and a second die sleeve guide, which is connected to the second base The side of the mold opening and closing surface of the second guide block vertically arranged adjacent to each other is arranged, and the step difference parts for inserting and pulling out the first mold sleeve unit by the aforementioned first guide block and the aforementioned first mold sleeve guide are respectively formed on the two sides. On the side, the step difference parts for inserting and pulling out the second mold casing unit through the second guide block and the second mold casing guide are respectively formed on both sides.
藉此,第一模套單元係能以藉由配置在兩側的第一導引塊與第一模套導引件所形成的階差部為導引件而從近前側插拔。第二模套單元係能以藉由配置在兩側的第二導引塊與第二模套導引件所形成的階差部為導引件而從近前側插拔。因此,減少模具的交換零件並可容易地進行交換作業。 Thereby, the first mold case unit can be inserted and removed from the near side by using the step portion formed by the first guide blocks arranged on both sides and the first mold case guide as a guide. The second mold casing unit can be inserted and removed from the near side by using the step portion formed by the second guide blocks arranged on both sides and the second mold casing guide as a guide. Therefore, replacement parts of the die can be reduced and replacement work can be easily performed.
亦可為:自第一底座部垂下設置的框狀的第一底座側部與自第二底座部豎立設置的框狀的第二底座側部是對向配置,區劃出被前述第一底座側部包圍的第一模具空間部之第一導引塊與被前述第二底座側部所包圍以區劃出第二模具空間部的第二導引塊是對向配置。 It can also be: the frame-shaped first base side part suspended from the first base part and the frame-shaped second base side part erected from the second base part are arranged opposite to each other, and the first base side defined by the first base part The first guide block of the first mold space part surrounded by the upper part and the second guide block surrounded by the second base side part to delineate the second mold space part are arranged oppositely.
藉此,第一底座部與框狀的第一底座側部,第二底座部與框狀的第二底座側部是對向配置,故在夾持狀態下將模具內關閉可形成減壓空間。又,因為區劃第一模具空間部的第一導引塊與區劃第二模具空間部的第二導 引塊是對向配置,故可容易對以可插拔方式收納於第一模具空間部的第一模套單元及以可插拔方式收納於第二模具空間部的第二模套單元進行對位。 In this way, the first base part and the frame-shaped first base side part, and the second base part and the frame-shaped second base side part are arranged oppositely, so closing the inside of the mold in the clamped state can form a decompression space . Also, because the first guide block that partitions the first mold space and the second guide block that partitions the second mold space The lead blocks are arranged facing each other, so it is easy to align the first mold case unit that is detachably accommodated in the first mold space and the second mold unit that is detachably accommodated in the second mold space. bit.
亦可為:第一底座側部係在第一模套單元插拔方向裏側透過鉸鏈可對第一底座部轉動地連結,第二底座側部係在第二模套單元插拔方向裏側透過鉸鏈可對第二底座部轉動地連結。 It can also be: the side of the first base is rotatably connected to the first base through a hinge on the inner side of the insertion and removal direction of the first mold casing unit, and the second base side is connected to the inner side of the insertion and removal direction of the second mold casing unit through a hinge. It is rotatably connected to the second base part.
藉此,當將第一底座側部相對於第一底座部以設在第一模套單元插拔方向裏側的鉸鏈為中心旋轉規定量時,第一底座部所保持的第一模套單元會在插拔方向近前側露出,故而可將第一模套單元往插拔方向近前側拉出作交換。 Thereby, when the side part of the first base is rotated by a predetermined amount relative to the first base part around the hinge provided on the inner side of the first mold case unit in the insertion and extraction direction, the first mold case unit held by the first base part will be The front side in the plugging and pulling direction is exposed, so the first mold cover unit can be pulled out to the near side in the plugging and pulling direction for replacement.
又,當將第二底座側部相對於第二底座部以設在第二模套單元插拔方向裏側的鉸鏈為中心旋轉規定量時,保持在第二底座部的第二模套單元會在插拔方向近前側露出,故而可將第二模套單元在插拔方向近前側拉出作交換。 In addition, when the second base side part is rotated by a predetermined amount relative to the second base part around the hinge provided on the inner side of the second mold case unit in the insertion and extraction direction, the second mold case unit held on the second base part will be The near front side in the plugging and pulling direction is exposed, so the second mold cover unit can be pulled out at the near side in the plugging and pulling direction for replacement.
亦可為:前述調整機構具備彈簧單元,該彈簧單元將第一模套板相對於第一模座或將第二模套板相對於第二模座往模具開閉方向偏置,或者在第一模座與第一模套板之間或第二模座與第二模套板之間以可滑動的方式設置錐型面彼此重合的滑動板。 It can also be: the aforementioned adjusting mechanism is equipped with a spring unit, and the spring unit biases the first mold cover plate relative to the first mold base or the second mold cover plate relative to the second mold base in the direction of mold opening and closing, or in the first Between the mold base and the first mold cover plate or between the second mold base and the second mold cover plate, sliding plates with conical surfaces overlapping each other are set in a slidable manner.
藉此,透過簡易構成可吸收並調整並列配置的每個模具模套單元在模具夾持時的模具高度之偏差,即便交換模具模套單元,仍可照舊使用調整機構。 In this way, the deviation of the mold height of each mold set unit arranged side by side can be absorbed and adjusted through the simple structure when the mold is clamped. Even if the mold set unit is replaced, the adjustment mechanism can still be used.
一種模具用模套單元,係以第一模套單元與第二模套單元夾持工件而對樹脂進行壓縮成形,其特徵為:在前述第一模套單元與前述第二模套單元之任一者的夾持面設有工件保持部,在另一者的夾持面,藉由與前述工件保持部對向配置以夾持前述工件的夾持器與透過被插入前述夾持器內進行相對移動以加壓樹脂的模腔件來形成模腔凹部,在前述夾持器的夾持面,設有具有將覆蓋前述模腔凹部的薄膜之外周緣部吸附保持之薄膜吸引孔或吸引孔的吸引溝,在具有前述薄膜吸引孔或吸引孔之吸引溝與前述模腔凹部之間設有環形溝,在前述環形溝的溝底部,設有複數個吸引孔。 A mold cover unit for a mold, which compresses and molds a resin by clamping a workpiece with a first mold cover unit and a second mold cover unit, and is characterized in that: One of the clamping surfaces is provided with a workpiece holding portion, and on the other clamping surface, the clamper disposed opposite to the workpiece holding portion to clamp the workpiece is inserted into the clamper. The mold cavity part is relatively moved to pressurize the resin to form the mold cavity cavity, and the clamping surface of the aforementioned holder is provided with a film suction hole or a suction hole that absorbs and holds the outer peripheral part of the film covering the cavity cavity The suction groove is provided with an annular groove between the suction groove having the aforementioned film suction hole or the suction hole and the concave portion of the mold cavity, and a plurality of suction holes are arranged at the groove bottom of the aforementioned annular groove.
若使用上述模具模套單元,則透過在設於任一模套單元之含有模腔凹部的夾持器的夾持面,將薄膜的外周緣部吸附保持於具有薄膜吸引孔或吸引孔的吸引溝且由設於具有薄膜吸引孔或吸引孔的吸引溝與模腔凹部之間的環形溝的溝底部所設之吸引孔進行吸引,可將薄膜的過剩份量收容於環形溝而順利進行薄膜之吸附固定與展平皺紋。 If the above-mentioned mold case unit is used, the outer peripheral edge of the film is sucked and held by the film suction hole or the suction hole with the suction hole through the clamping surface of the holder containing the mold cavity concave part provided on any mold case unit. The film is sucked by the suction hole provided at the bottom of the annular groove between the suction groove with the film suction hole or the suction hole and the concave part of the mold cavity. Absorbs to fix and smooth wrinkles.
因此,在以橫向排列地並列配置的模具模套單元將複數個工件個別地夾持並同時進行壓縮成形時,可防止因在薄膜產生皺紋所致之成形品質降低。又,薄膜的處理容易且沒有薄膜浪費使用區域。 Therefore, when a plurality of workpieces are individually clamped by the mold case units arranged side by side in the lateral direction and compression-molded simultaneously, it is possible to prevent the deterioration of the molding quality due to the generation of wrinkles in the film. Also, the handling of the film is easy and there is no area for film waste.
前述環形溝係也可兼用作為將設於第一模套單元與第二模套單元之任一者的夾持面之薄膜壓入的薄膜推動銷的凹部。藉此,在以一對的模具模套單元夾持工件及薄膜時,藉由使薄膜推動銷進入環形溝內,可將薄膜的過剩份量確實地誘導至環形溝內並展平皺紋。 The above-mentioned annular groove system can also be used as a concave portion of a film pushing pin for pressing the film provided on the clamping surface of any one of the first mold case unit and the second mold case unit. Thereby, when the workpiece and the film are clamped by a pair of die-casing units, the film pushing pin enters the annular groove, so that the excess amount of the film can be reliably induced into the annular groove and wrinkles can be flattened.
前述環形溝亦可兼用作供工件保持部的夾盤爪脫退。 The above-mentioned annular groove can also be used concurrently for the chuck claws of the workpiece holding part to escape.
藉此,即便在工件保持部設置將工件進行機械性保持的夾盤爪,因為在夾持工件及薄膜時夾盤爪會進入環形溝,故第二模具模套單元變得不與夾持面干涉。又,在工件保持部不僅是進行空氣吸引,還可藉由夾盤爪保持工件,故能確實地進行工件的授受。 In this way, even if the chuck claws for mechanically holding the workpiece are provided in the workpiece holding part, the chuck claws will enter the annular groove when clamping the workpiece and the film, so the second mold set unit becomes out of contact with the clamping surface. put one's oar in. In addition, not only the air suction is performed in the workpiece holding part, but also the workpiece can be held by the chuck claws, so the workpiece can be reliably transferred.
一種模具用模套單元,係在一對的模套單元夾持工件以對樹脂進行壓縮成形,該壓縮成形模具用模套單元之特徵為: 在構成一模套單元的矩形狀的夾持面之各邊緣部或模套板,突設有第一鎖定塊,在對向的另一模套單元的夾持面或模套板對向面,突設有與前述第一鎖定塊相互咬合的第二鎖定塊。 A mold case unit for a mold, which is tied to a pair of mold case units to clamp a workpiece to compress and form resin. The characteristics of the mold case unit for a compression molding mold are: On each edge of the rectangular clamping surface or the mold cover plate that constitutes a mold cover unit, a first locking block is protrudingly provided, and on the clamping surface of the opposite mold cover unit or the opposite surface of the form cover plate , a second locking block interlocking with the aforementioned first locking block is protrudingly provided.
藉此,在一對的模套單元夾持工件時,透過第一鎖定塊與第二鎖定塊的凹凸嵌合可進行對向之夾持面彼此的對位。因此,可有助於成形品質之提升。 Thereby, when the pair of die sets units clamp the workpiece, the opposing clamping surfaces can be aligned through the concave-convex fitting between the first locking block and the second locking block. Therefore, it can contribute to the improvement of molding quality.
亦可為,第一模套單元係具備第一卡止部,係可插拔地卡止於對第一模座豎立形成的第一導引塊,第二模套單元係具備第二卡止部,係可插拔地卡止於對第二模座豎立形成的第二導引塊。 It can also be that the first mold cover unit is equipped with a first locking part, which is pluggably locked to the first guide block formed upright to the first mold base, and the second mold cover unit is provided with a second locking part. The part is detachably fastened to the second guide block formed upright to the second mold base.
藉此,開啟壓縮成形用模具,透過將第一卡止部卡止於從第一模座往兩側豎立第一導引塊的狀態插拔第一模具模套單元而可容易地進行模具交換作業。 Thereby, the mold for compression molding is opened, and the mold can be easily exchanged by inserting and pulling out the first mold set unit by locking the first locking part in the state where the first guide block is erected from the first mold base to both sides. Operation.
又,透過將第二卡止部卡止於從第二模座往兩側豎立的第二導引塊的狀態插拔第二模具模套單元而可容易地進行模具交換作業。 In addition, the mold exchange operation can be easily performed by inserting and removing the second mold set unit in a state where the second locking portion is locked to the second guide blocks erected on both sides from the second mold base.
亦可在第一模套單元及第二模套單元的對向位置設置用以修正夾持面彼此的傾斜之整平(leveling)機構。 A leveling mechanism for correcting the inclination of the clamping surfaces may also be provided at the opposing positions of the first mold case unit and the second mold case unit.
藉此,在閉模時可維持被對向配置的第一模套單元與第二模套單元的夾持面彼此的平行度。 Thereby, the parallelism between the clamping surfaces of the first mold case unit and the second mold case unit arranged oppositely can be maintained when the mold is closed.
一種模具用模套單元,係具備具有保持工件之工件保持部的第一模套單元、及具有被供給模製樹脂的模腔凹部之第二模套單元,其特徵為:前述第二模套單元為,形成前述模腔凹部的底部之模腔件與形成前述模腔凹部的側部之夾持器是配置成可相對移動,在前述夾持器的夾持面的相反面設有規定該夾持器的高度位置之制動器。 A mold case unit for a mold, comprising a first case unit having a workpiece holding portion for holding a workpiece, and a second case unit having a concave portion of a cavity supplied with molding resin, wherein the second case unit is characterized in that: The unit is that the mold cavity part forming the bottom of the cavity concave part and the holder forming the side part of the cavity cavity are configured to be relatively movable, and the clamping surface of the aforementioned clamp is provided on the opposite surface. Stopper for the height position of the holder.
藉此,由於因應於工件的板厚、供給到模腔凹部的樹脂量之偏差,夾持器對模腔件之相對的高度位置是藉由制動器所規定,所以吸收工件的板厚、供給到模腔凹部的樹脂量之偏差,能以所期望的厚度進行壓縮成形。 In this way, since the relative height position of the clamper to the cavity part is determined by the stopper according to the deviation of the amount of resin supplied to the concave part of the cavity in response to the thickness of the workpiece, the thickness of the workpiece is absorbed and the resin supplied to the cavity is regulated. Variation in the amount of resin in the concave portion of the cavity enables compression molding with a desired thickness.
亦可沿著前述模腔件的外周緣部設置複數個溢流模腔。 A plurality of overflow cavities may also be provided along the outer peripheral edge of the cavity part.
藉此,即便未正確地計量按每個工件供給至模腔凹部的樹脂量,也可透過將過剩樹脂收容於溢流模腔而將成形品的厚度保持一定地進行壓縮成形。 Thereby, even if the amount of resin supplied to the concave portion of the cavity is not accurately measured for each workpiece, compression molding can be performed with the thickness of the molded product kept constant by storing excess resin in the overflow cavity.
較佳為:於壓縮成形用模具中的上述任一模具模套單元對模座橫向排列地並列配置,前述模具模套單元可對前述模座獨立地插拔設置。 Preferably, in the compression molding mold, any one of the mold housing units described above is arranged side by side with respect to the mold base, and the mold housing unit can be independently inserted and removed from the mold base.
藉此,可將對模座橫向排列地並列配置的複數個模具模套單元中之必要的模具模套單元自模座取出以進行維修或模具交換,交換零件少且可容易地進行模具交換作業。又,可按每個模具模套單元在包含模腔凹部的夾持面展平薄膜的皺紋地進行吸附保持,處理容易且沒有薄膜浪費使用區域。 Thereby, the necessary mold set unit among the plurality of mold set units arranged in parallel to the mold base can be taken out from the mold base for maintenance or mold exchange, and the replacement parts are few and the mold exchange work can be easily performed. . Moreover, the wrinkles of the film can be flattened on the clamping surface including the recessed part of the cavity for each mold case unit, and the film is easy to handle and there is no waste use area of the film.
可提供一種壓縮成形用模具,其通用性高且可一邊吸收在將複數個工件橫向排列地並列配置並個別地進行壓縮成形時的工件的厚度的偏差或起因於所供給的樹脂量之偏差所致模具夾持時的模具高度之偏差,一邊進行高精度壓縮成形。 It is possible to provide a mold for compression molding that is highly versatile and capable of absorbing variations in the thickness of the workpieces or variations in the amount of resin supplied when a plurality of workpieces are arranged side by side in a lateral direction and individually compressed and molded. High-precision compression molding is performed while causing the deviation of the mold height when the mold is clamped.
又使用上述壓縮成形用模具可提供一種生產性高且維持成形品質之通用性高的壓縮成形裝置。 Furthermore, by using the mold for compression molding described above, it is possible to provide a highly versatile compression molding apparatus that is highly productive and maintains molding quality.
在上下任一者的模座,因位調整機構是與底座部一體設置,故能吸收起因於被橫向排列地並列配置的複數個模具模套單元所夾持之工件的板厚、模製樹脂的樹脂量及覆蓋夾持面的薄膜厚的合計之偏差所致模具夾持時的模具高度之偏差。 Since the position adjustment mechanism is provided integrally with the base in either the upper or lower mold base, it can absorb the plate thickness and molding resin caused by the workpiece clamped by the plurality of mold set units arranged side by side in the horizontal direction. The deviation of the mold height when the mold is clamped is caused by the total deviation of the amount of resin and the thickness of the film covering the clamping surface.
又,在交換模具模套單元時,無需交換模座,交換作業容易,即使交換模具模套單元仍可照舊使用調整機構,故通用性高。 In addition, when exchanging the mold case unit, there is no need to replace the mold base, and the replacement operation is easy. Even if the mold case unit is replaced, the adjustment mechanism can still be used, so the versatility is high.
可提供一種模具模套單元,其容易進行於進行壓縮成形時的薄膜處理以減少無謂的使用區域,且吸收工件的板厚、樹脂量之偏差使封裝部的厚度成為一定地提升成形品質。 It is possible to provide a mold set unit that is easy to perform film processing during compression molding to reduce unnecessary use areas, and absorbs the deviation of the thickness of the workpiece and the amount of resin to make the thickness of the package part constant and improve the molding quality.
1‧‧‧壓縮成形用模具 1‧‧‧Mold for compression molding
2‧‧‧上模 2‧‧‧upper mold
2a‧‧‧工件保持部 2a‧‧‧Workpiece Holder
2b‧‧‧吸附孔 2b‧‧‧Adsorption hole
3‧‧‧下模 3‧‧‧Lower mold
3a‧‧‧下模模腔凹部 3a‧‧‧The concave part of the lower mold cavity
4‧‧‧上模模套單元 4‧‧‧Upper die set unit
4a‧‧‧上模模套板 4a‧‧‧Upper mold set plate
4b‧‧‧支撐塊 4b‧‧‧support block
4c‧‧‧上模板 4c‧‧‧on template
4d‧‧‧夾盤爪 4d‧‧‧Chuck jaw
4d1‧‧‧水平部 4d1‧‧‧horizontal part
4d2‧‧‧垂直部 4d2‧‧‧vertical part
4d3‧‧‧卡止部 4d3‧‧‧locking part
4e‧‧‧支點 4e‧‧‧Fulcrum
4f、4i、5g、8e、10c‧‧‧螺旋彈簧 4f, 4i, 5g, 8e, 10c‧‧‧coil spring
4g‧‧‧推動銷 4g‧‧‧Push pin
4h‧‧‧薄膜推動銷 4h‧‧‧Film push pin
4j‧‧‧上模鎖定塊 4j‧‧‧Upper mold locking block
4k‧‧‧上模調整銷 4k‧‧‧upper mold adjustment pin
5‧‧‧下模模套單元 5‧‧‧Lower mold set unit
5a‧‧‧下模底座板 5a‧‧‧Lower mold base plate
5b‧‧‧支撐柱 5b‧‧‧support column
5c‧‧‧支撐板 5c‧‧‧support plate
5d‧‧‧下模模腔件 5d‧‧‧Lower mold cavity
5d1‧‧‧階差部 5d1‧‧‧step difference department
5d2‧‧‧貫通孔 5d2‧‧‧through hole
5e‧‧‧下模可動夾持器 5e‧‧‧Moveable holder for lower die
5e1‧‧‧脫退溝 5e1‧‧‧Retreat ditch
5e2‧‧‧環形溝 5e2‧‧‧ring groove
5e3、5e5‧‧‧吸引孔 5e3, 5e5‧‧‧Attraction hole
5e4‧‧‧薄膜吸引溝 5e4‧‧‧Film suction groove
5e6‧‧‧吸引路 5e6‧‧‧Attraction Road
5f‧‧‧推動銷 5f‧‧‧Push pin
5h‧‧‧緣部 5h‧‧‧Fate
5i‧‧‧制動器 5i‧‧‧brake
5j‧‧‧下模模套板 5j‧‧‧Lower mold set plate
5k、7b2‧‧‧密封材 5k, 7b2‧‧‧Sealing material
5m‧‧‧階梯部 5m‧‧‧stairs
5n‧‧‧下模鎖定塊 5n‧‧‧Lower mold locking block
5p‧‧‧下模調整銷 5p‧‧‧Lower mold adjustment pin
5r‧‧‧下模板 5r‧‧‧down template
6‧‧‧上模模座 6‧‧‧upper die base
6a‧‧‧上模底座部 6a‧‧‧The base of the upper mold
6b‧‧‧上模底座側部 6b‧‧‧The side of the upper mold base
6c‧‧‧上模空間部 6c‧‧‧upper mold space department
6d‧‧‧上模導引塊 6d‧‧‧Upper die guide block
6e‧‧‧上模模套導引件 6e‧‧‧Upper die sleeve guide
6f‧‧‧階差部 6f‧‧‧step difference department
6g、7g‧‧‧鉸鏈 6g, 7g‧‧‧hinge
7‧‧‧下模模座 7‧‧‧Lower mold base
7a‧‧‧下模底座部 7a‧‧‧The base of the lower mold
7b‧‧‧下模底座側部 7b‧‧‧The side part of the lower mold base
7b1‧‧‧減壓用吸引孔 7b1‧‧‧Suction hole for decompression
7c‧‧‧下模空間部 7c‧‧‧Lower mold space
7d‧‧‧下模導引塊 7d‧‧‧Lower mold guide block
7e‧‧‧下模模套導引件 7e‧‧‧Lower mold sleeve guide
7f‧‧‧階差部 7f‧‧‧step difference department
W‧‧‧工件 W‧‧‧workpiece
8‧‧‧調整機構 8‧‧‧Adjustment mechanism
8a‧‧‧銷懸掛板 8a‧‧‧Pin hanging plate
8b‧‧‧懸掛銷 8b‧‧‧Suspension pin
8c‧‧‧銷孔 8c‧‧‧Pin hole
8d‧‧‧壓抵板 8d‧‧‧Pressure plate
9‧‧‧片狀薄膜 9‧‧‧Flake film
10‧‧‧溢流模腔 10‧‧‧Overflow cavity
10a‧‧‧浮動件 10a‧‧‧floating parts
10b‧‧‧連結板 10b‧‧‧connecting plate
11、13‧‧‧驅動機構 11, 13‧‧‧Drive mechanism
11a、13a、14f、21a‧‧‧伺服馬達 11a, 13a, 14f, 21a‧‧‧Servo motor
11b、13b、21b‧‧‧動力傳達部 11b, 13b, 21b‧‧‧Power transmission department
12‧‧‧可動連結板 12‧‧‧movable connecting plate
14‧‧‧楔機構 14‧‧‧Wedge mechanism
14a‧‧‧可動滑動板 14a‧‧‧Movable sliding plate
14b‧‧‧楔板 14b‧‧‧Wedge
14c‧‧‧錐型面 14c‧‧‧Conical Surface
14d‧‧‧高度調整板 14d‧‧‧height adjustment plate
14e‧‧‧螺桿軸 14e‧‧‧Screw shaft
15‧‧‧沖壓部 15‧‧‧Stamping Department
16‧‧‧工件供給收納部 16‧‧‧Workpiece supply and storage department
17‧‧‧工件搬送機構 17‧‧‧Workpiece conveying mechanism
18‧‧‧薄膜樹脂供給部 18‧‧‧Film resin supply department
19‧‧‧樹脂搬送機構 19‧‧‧Resin transfer mechanism
R‧‧‧顆粒樹脂 R‧‧‧Granular Resin
20‧‧‧沖壓機驅動機構 20‧‧‧Punching machine driving mechanism
20a‧‧‧沖壓機底座 20a‧‧‧Punching machine base
20b‧‧‧導引柱 20b‧‧‧Guide column
20c‧‧‧固定平台 20c‧‧‧fixed platform
20d‧‧‧可動平台 20d‧‧‧movable platform
20e‧‧‧中間平台 20e‧‧‧intermediate platform
圖1係開模之壓縮成形用模具的正視剖面說明圖。 Fig. 1 is an explanatory front sectional view of a mold for compression molding in which the mold is opened.
圖2係圖1的上模的一部分切口剖面說明圖。 Fig. 2 is an explanatory diagram of a cutout section of a part of the upper mold of Fig. 1 .
圖3係圖2的上模的側視剖面說明圖。 Fig. 3 is a side cross-sectional explanatory view of the upper mold of Fig. 2 .
圖4係將圖2的上模從夾持面側觀看的平面圖。 Fig. 4 is a plan view of the upper mold of Fig. 2 viewed from the clamping surface side.
圖5係圖1的下模的剖面說明圖。 Fig. 5 is a cross-sectional explanatory view of the lower mold of Fig. 1 .
圖6係圖5的下模的側視剖面說明圖。 Fig. 6 is a side cross-sectional explanatory view of the lower mold of Fig. 5 .
圖7A係將圖5的下模從夾持面側觀看的平面圖,圖7B係表示下模模腔件與下模可動夾持器在閉模前後的狀態之部分剖面圖。 7A is a plan view of the lower mold of FIG. 5 viewed from the side of the clamping surface, and FIG. 7B is a partial cross-sectional view showing the state of the lower mold cavity and the lower mold movable clamper before and after closing the mold.
圖8係圖1的壓縮成形用模具的閉模狀態之正視剖面說明圖。 Fig. 8 is a front cross-sectional explanatory view of the closed state of the compression molding die of Fig. 1 .
圖9係模座的正視剖面說明圖及自模座取出的模具模套單元的剖面說明圖。 Fig. 9 is a front sectional explanatory diagram of the mold base and a sectional explanatory diagram of the mold cover unit taken out from the mold base.
圖10A係表示自模座卸下模具模套單元之前後狀態的正視剖面說明圖,圖10B係自模座卸下的模具模套單元之側視剖面說明圖。 Fig. 10A is a front sectional explanatory diagram showing the state before and after the mold cover unit is removed from the mold base, and Fig. 10B is a side sectional explanatory view of the mold cover unit removed from the mold base.
圖11A係其他例的壓縮成形模具之正視剖面圖,圖11B係將下模從夾持面側觀看的平面圖。 Fig. 11A is a front sectional view of a compression molding die of another example, and Fig. 11B is a plan view of the lower die viewed from the clamping surface side.
圖12係對大尺寸的工件進行壓縮成形之情況的壓縮成形模具之正視剖面說明圖。 Fig. 12 is an explanatory front sectional view of a compression molding die for compression molding a large-sized workpiece.
圖13係對圖12的其他例的大尺寸的工件進行壓縮成形之情況的壓縮成形模具之側視剖面說明圖。 Fig. 13 is a side sectional explanatory view of a compression molding die for compression molding a large-sized workpiece of another example shown in Fig. 12 .
圖14A係從用以模製矩形基板的上模之夾持面側觀看的平面圖,圖14B係從下模之夾持面側觀看的平面圖。 Fig. 14A is a plan view viewed from the clamping surface side of an upper mold for molding a rectangular substrate, and Fig. 14B is a plan view viewed from the clamping surface side of a lower mold.
圖15A係從用以模製圓形基板的上模之夾持面側觀看的平面圖,圖15B係從下模之夾持面側觀看的平面圖。 Fig. 15A is a plan view viewed from the clamping surface side of the upper mold for molding a circular substrate, and Fig. 15B is a plan view viewed from the clamping surface side of the lower mold.
圖16係其他例的壓縮成形用模具之正視剖面說明圖。 Fig. 16 is a front sectional explanatory view of another compression molding die.
圖17係其他例的壓縮成形用模具之正視剖面說明圖。 Fig. 17 is a front sectional explanatory view of another compression molding die.
圖18係對一個帶材基板進行壓縮成形之情況的壓縮成形用模具之正視剖面說明圖。 Fig. 18 is an explanatory front sectional view of a compression molding die for compression molding one strip substrate.
圖19係對三個帶材基板進行壓縮成形之情況的壓縮成形用模具之正視剖面說明圖。 Fig. 19 is an explanatory front sectional view of a compression molding die for compression molding three strip substrates.
圖20A係表示設於上模的調整機構的其他例之正視剖面說明圖,圖20B係其調整機構側視剖面說明圖。 Fig. 20A is a front sectional explanatory view showing another example of the adjustment mechanism provided on the upper die, and Fig. 20B is a side sectional explanatory view of the adjustment mechanism.
圖21係表示使用壓縮成形用模具的樹脂模製裝置之一例的平面配置圖。 Fig. 21 is a plan view showing an example of a resin molding apparatus using a mold for compression molding.
圖22係表示壓縮成形裝置的其他例之說明圖。 Fig. 22 is an explanatory view showing another example of the compression molding device.
圖23係表示繼圖22之後的壓縮成形裝置的其他例之說明圖。 Fig. 23 is an explanatory diagram showing another example of the compression molding apparatus following Fig. 22 .
圖24係表示壓縮成形模具的其他例之說明圖。 Fig. 24 is an explanatory view showing another example of a compression molding die.
圖25係表示壓縮成形模具的其他例之說明圖。 Fig. 25 is an explanatory view showing another example of a compression molding die.
以下,針對用以實施發明的一實施形態,依據附件圖面作詳細地說明。此外,在稱為模具模套單元時,係指模腔凹部或構成工件保持部的模具構件被一體組裝者。又,在稱為壓縮成形用模具時,係指模具模套單元被一體組裝於模座且係去掉模具開閉機構者。 Hereinafter, an embodiment for implementing the invention will be described in detail based on the accompanying drawings. In addition, when called a mold case unit, it means the thing which integrally assembled the mold member which comprises a cavity recessed part or a workpiece|work holding part. Also, when it is called a mold for compression molding, it means that the mold housing unit is integrally assembled to the mold base and the mold opening and closing mechanism is removed.
圖1係將複數個工件W個別地進行壓縮成形之壓縮成形用模具1,具備以下的構成。此外,假設工件W係成為矩形狀的長條帶材基板(導線架、金屬基板、陶瓷基板、樹脂基板等)。假設工件W的大小係達到100mm×300mm程度(以下僅稱為「工件W」)。 FIG. 1 shows a compression molding die 1 for individually compression molding a plurality of workpieces W, and has the following configuration. In addition, it is assumed that the workpiece W is a long rectangular strip substrate (lead frame, metal substrate, ceramic substrate, resin substrate, etc.). It is assumed that the size of the workpiece W is approximately 100 mm×300 mm (hereinafter simply referred to as “work W”).
壓縮成形用模具1係具備上模2(第一模具)及下模3(第二模具)。具備在上模2具有保持工件W之工件保持部2a的上模模套單元4(第一模套單元),且與在下模3具有被供給模製樹脂之下模模腔凹部3a的下模模套單元5(第二模套單元)是有複數個呈對向配置。
The
又,在上模模座6(第一模座)的複數部位(圖1中為2個部位)有上模模套單元4橫向排列地併排設置著。在下模模座7(第二模座)的複數部位(圖1中為2個部位)有下模模套單元5橫向排列地併排設置著。上模模套單元4與下模模套單元5係分別對向地配置。上模模
座6具備調整複數個工件保持部2a所保持之工件W的板厚之偏差(係指工件W各個的板厚之差異與在1片工件平面內之局部的厚度及傾斜之差異兩者。以下總稱為「偏差」。)或複數個上模模套單元4及下模模套單元5在夾持時的模具高度之偏差(除了前述「偏差」以外,亦包含供給到下模模腔凹部3a的樹脂量的差異所產生的模具高度之差,僅稱為「偏差」。)的調整機構8(係用以使複數模具的總高度相同的機構,即使是1個模具亦可調整具有前述偏差的工件W,以下稱為「調整機構8」)。關於利用調整機構8進行模具高度之偏差調整的結果,亦能對齊利用壓縮成形所用的複數個模具進行壓縮成形後之模具總高度,避免沖壓機構之傾斜。
In addition, upper
依據上述構成,模製樹脂被供給到對下模模座7併排設置的複數個下模模套單元5上所分別設置的下模模腔凹部3a,可在維持將工件W保持在對上模模座6併排設置的複數個上模模套單元4上所分別設置的工件保持部2a的狀態下閉模而按每個工件W進行壓縮成形。
According to the above configuration, the molding resin is supplied to the lower
此時,在是複數個工件W有板厚之偏差或因所供給的樹脂量的差異而有模具夾持時的模具高度之偏差,因為藉由設於上模模座6的調整機構8按對向配置的上模模套單元4及下模模套單元5作調整,所以能對樹脂密封部(封裝部)的厚度以高精度進行壓縮成形。
At this time, there is a deviation in the thickness of the plurality of workpieces W or a deviation in the mold height when the mold is clamped due to the difference in the amount of resin supplied, because the
又,上模模座6及下模模座7因為在單層設置複數個模套單元,所以藉由確保模座的厚度,因彎曲剛性高且熱容量大,故可抑制在成形週期中的溫度變化。
In addition, since the
又,即便因工具更換而交換上模模套單元4或下模模套單元5,由於設在上模模座6的調整機構8可共用,故通用性提升。
Also, even if the upper
調整機構8係配置在上模模座6與上模模套單元4之間。因此即便交換上模模套單元4,仍可照舊使用調整機構8。作為調整機構8的一例,係具備相對於上模模座6將上模模套單元4往模具開閉方向偏置之彈簧單元。藉此,透過簡易構成可調整複數橫向排列地並列配置(以工件的長邊成為平行之方式在旁邊配置別的工件之配置形態)的模具模套單元的模具高度之偏差。
The
此處,針對構成壓縮成形用模具1的上模2與下模3之構成例具體地作說明。針對上模2之構成例,參照圖2作說明。上模模座6具有:矩形板狀的上模底座部6a(第一底座部);及沿著上模底座部6a外周緣部垂下設置的矩形框狀的上模底座側部6b(第一底座側部)。在上模底座部6a垂設有區劃被上模底座側部6b所包圍的上模空間部6c(第一模具空間部)之上模導引塊6d(第一導引塊)。在藉上模導引塊6d所區劃的上模空間部6c(參照圖9)分別設有調整機構8。
Here, a configuration example of the
在上模導引塊6d的下端部,有上模模套導引件6e(第一模套導引件)各自鄰接地設置。在上模導引塊6d與上模模套導引件6e之間(連續的壁面間)插拔上模模套單元4的階差部6f是各自形成在兩側。可將此一對的階差部6f作為導軌而如後述般插拔上模模套單元4。
On the lower end portion of the upper
如圖10B所示,上模底座部6a與上模底座側部6b係在鄰接的一側面側(上模模套單元插拔方向裏側)透過鉸鏈6g以可轉動的方式連結。在交換上模模套單元4時,能使上模底座側部6b的插拔方向近前側端部與上模底座部6a疏離地以鉸鏈6g為中心往規定方向(圖10B的繞逆時鐘方向)旋轉。藉此,可將上模模套單元4以階差部6f為導軌往近前側拉出作交換。又,在上模模座6並列配置的上模模套單元4因為可各自獨立地從上模模座6插拔,所以維修的作業性良好。此外,以在上模底座部6a與上模底座側部6b之間連結有限制上模底座部6a的開放角度之未圖示的連桿材者較佳。又,亦可為僅形成於矩形框體狀的上模底座側部6b的近前側側面部是透過鉸鏈對上模底座部6a可轉動(圖10B的繞順時鐘方向)地連結。在這情況,成為在插拔方向裏側抽出上模模套單元4。
As shown in FIG. 10B , the upper
又,雖例示了使模套單元在裏側、近前側橫向滑動插拔的構成,但未必限定為橫向滑動的插拔,只要是模座與模套單元可在上下方向分離地進行裝卸即可。 Also, although a structure in which the mold case unit is laterally slidable on the back side and the near side is illustrated, it is not necessarily limited to lateral sliding insertion and extraction, as long as the mold base and the mold case unit can be separately attached and detached in the vertical direction.
此外,區劃上模空間部6c的中間部(圖2的中間部)的上模導引塊6d及上模模套導引件6e亦能設置成可對上模底座部6a裝卸。藉此,如後述之圖12及圖13所示,即便工件W是一片大尺寸的基板,僅替換上模模套單元4,上模模座6及調整機構8仍可共用。
In addition, the upper
圖2及圖9中,針對調整機構8之構成例作說明。於上模底座部6a重疊設置有銷懸掛板8a。在銷
懸掛板8a,複數個懸掛銷8b被插入在左右方向(參照圖2)及前後方向(參照圖3)等間隔設置的銷孔8c使銷頭部8b1(上端部)分別卡止。各懸掛銷8b的前端部8b2(下端部)係與壓抵板8d連結。螺旋彈簧(只要是彈性體即可,未特別限定螺旋彈簧。)8e從自由長度被壓縮並插入各銷懸掛板8a與壓抵板8d之間。藉此,壓抵板8d及懸掛銷8b係始終朝向垂直下方偏置。壓抵板8d的左右兩側端面係成為被上模導引塊6d所導引並維持著平行度升降。
In Fig. 2 and Fig. 9, a configuration example of the
針對上模模套單元4之構成例,參照圖2至圖4作說明。
Regarding the configuration example of the upper die set
上模模套單元4係在上端部具備上模模套板4a(第一模套板)。此上模模套板4a係與調整機構8的壓抵板8d的下面重疊地裝設。上模模套板4a的外形尺寸係與壓抵板8d相同,且左右兩側端面係成為被上模導引塊6d所導引並維持著平行度地升降。在上模模套板4a的下面重疊設置比其外形尺寸大的上模支撐塊4b。上模支撐塊4b的左右兩端部(第一卡止部)係維持著與階差部6f卡止而相對於上模導引塊6d在近前側可插拔地組裝(參照圖2)。又在上模支撐塊4b的下面,重疊設置比其外形尺寸小的上模板4c。如圖4所示,上模板4c的下面中央部的成為工件保持部2a的吸附孔2b是沿著工件外周緣部在複數部位穿孔。又,夾盤爪4d在上模板4c的工件保持部2a的周圍的複數部位(圖4中例如6個部位)設置成可轉動。
The upper die set
圖2中,夾盤爪4d作成水平部4d1與垂直部4d2連續的L字形狀。將此水平部4d1的中途部以能以支點4e為中心轉動的方式組裝於上模支撐塊4b。於此水平部4d1的端部近旁,在與上模模套板4a之間螺旋彈簧4f是從自由長度被壓縮的方式裝設。又,在水平部4d1一體設置有貫通上模板4c的推動銷4g。因為水平部4d1是藉螺旋彈簧4f而始終朝下方偏置,所以推動銷4g的前端部係從上模板4c的夾持面往下方突設。又,在垂直部4d2的下端,卡止部4d3形成朝向工件外周緣部的內側。夾盤爪4d係藉由螺旋彈簧4f之反彈而以支點4e為中心往以垂直部4d2夾入工件W的外周緣部的方向偏置。因此,各卡止部4d3成為以各自進入工件W的外周緣部下方而可進行保持的狀態。在放開夾盤爪4d將工件W卸下的情況,只要抵抗螺旋彈簧4f的勢能將推動銷4g壓入即可。又,在比上模板4c的工件保持部2a還外周側,突設有薄膜推動銷4h。薄膜推動銷4h係在與上模模套板4a之間有螺旋彈簧4i以從自由長度被壓縮的方式裝設。藉此,薄膜推動銷4h的前端部係由上模板4c的夾持面往下方突設。薄膜推動銷4h如後述般,係為了將覆蓋下模3的夾持面而被吸附保持的片狀薄膜9的過剩份量展平而設。
In FIG. 2, the
其次針對下模3之構成例作說明。
Next, an example of the configuration of the
圖5中的下模模座7具有:矩形板狀的下模底座部7a(第二底座部);及沿著下模底座部7a的外周緣部豎立設置之矩形框狀的下模底座側部7b(第二底座側部)。在
下模底座部7a,豎立設置有區劃被下模底座側部7b包圍的下模空間部7c(第二模具空間部:參照圖9)之下模導引塊7d(第二導引塊)。下模模套單元5以可插拔地組裝於在藉下模導引塊7d所區劃的下模空間部7c(參照圖9)。
The
圖5中,在下模導引塊7d的上端部,分別鄰接設置有下模模套導引件7e(第二模套導引件)。在下模導引塊7d與下模模套導引件7e之間(連續的壁面間)插拔下模模套單元5的階差部7f是在兩側各自形成(參照圖9)。能以此一對的階差部7f為導軌對下模模套單元5進行插拔。在下模底座側部7b的側壁設有減壓用吸引孔7b1,連接於未圖示的空氣吸引機構。又,在下模底座側部7b的模具開閉面,設有於閉模時與上模底座側部6b的對向面抵接以密封模具空間的密封材7b2(O環等)。
In FIG. 5 , lower die case guides 7 e (second die case guides) are provided adjacent to the upper ends of the lower
如圖10B所示,下模底座部7a與下模底座側部7b係在鄰接的一側面側(下模模套單元插拔方向裏側)透過鉸鏈7g以可轉動的方式連結。在交換下模模套單元5時,可使下模底座側部7b的插拔方向近前側端部由下模底座部7a疏離地以鉸鏈7g中心往規定方向(圖10B的繞順時鐘方向)旋轉。因此,可將下模模套單元5以階差部7f為導軌往近前側拉出作交換。又,在下模模座7並列配置的下模模套單元5因為可各自獨立地從下模模座7插拔,故維修的作業性佳。此外,較佳為:在下模底座部7a與下模底座側部7b之間連結有限制下模底座側部7b的開放角度之未圖示的連桿材。又,僅形成
矩形框體狀的下模底座側部7b的近前側側面部相對於下模底座部7a可透過鉸鏈轉動(圖10B的繞逆時鐘方向)地連結。在這情況,成為在插拔方向裏側抽出下模模套單元5。
As shown in FIG. 10B , the lower
此外,區劃下模空間部7c的中間部(圖5的中間部)的下模導引塊7d及下模模套導引件7e亦可設置成可對下模底座部7a裝卸。藉此,如後述之圖12及13所示,即便工件W是一片大(寬幅)尺寸的基板,僅連同上模模套單元4一起替換下模模套單元5,下模模座7仍可共用。
In addition, the lower
針對下模模套單元5之構成例,參照圖5至圖7作說明。
Regarding the configuration example of the lower die set
下模模套單元5在下端部具備下模底座板5a。此下模底座板5a係在下模底座部7a上面重疊裝設。下模底座板5a係以左右兩側端面被下模導引塊7d導引且維持著平行度從圖5的近前側分別可插拔地裝設。在下模底座板5a的上面且是下模模腔件(cavity piece)5d的鉛直下方投影面內豎立形成有複數個支撐柱(支柱)5b。藉此,防止下模模腔件5d的翹曲同時透過改變支撐柱5b之配置或改變配置之粗密,可對夾持壓作微調整。藉此,在對大尺寸(寬幅)的工件W、例如是超過300mm×300mm的面板或直徑300mm的半導體晶圓等進行壓縮成形時可提升TTV(Total Thickness Variation;總厚度變異值)。所指大(寬幅)尺寸係寬度比100mm×300mm程度的長條狀帶材基板還寬的基板且未必一定是矩形。
The lower die set
在支撐柱5b支撐有支撐板5c。支撐板5c係與下模底座板5a同樣地以左右兩側端面被下模導引塊7d導引的方式設置。在支撐板5c的上面中央部積層支撐下模模腔件5d。下模模腔件5d構成下模模腔凹部3a的底部。在下模模腔件5d的周圍,構成下模模腔凹部3a的側部的下模可動夾持器5e被支撐成可移動於模具開閉方向。具體言之,推動銷5f貫通支撐板5c而被壓抵於下模可動夾持器5e的下面。推動銷5f係藉由從自由長度被壓縮並插入與下模底座板5a之間的螺旋彈簧5g使得比推動銷5f大徑的緣部5h始終被壓抵於支撐板5c的下面側。因此,推動銷5f上端從支撐板5c突出,處在將下模可動夾持器5e始終朝上方偏置的狀態。此外,下模模腔件5d係亦可如後述般未隔介支撐板5c而是直接被支撐柱5b所支撐。
The
本實施例中的夾持,雖例示以工件保持部2a與可動夾持器5e夾入工件W的情況,但是全封裝模製(Full package mold)的情況係以工件保持部2a的吸附孔2b吸引保持工件W,在未直接夾入工件W下利用下模可動夾持器5e夾持上模板4c的情況,意即,即便是平面視圖中將工件W的外側整體進行樹脂模製的情況亦稱為夾持。
The clamping in this embodiment exemplifies the case where the workpiece W is clamped by the
又,以包圍下模可動夾持器5e的外周側之方式設置矩形框狀的下模模套板5j(第二模套板)。下模模套板5j係被積層支撐於支撐板5c。在下模可動夾持器5e與下模模套板5j之間隙係藉由密封材5k(例如O環等)
密封。下模可動夾持器5e係設置成將內周側往下模模腔件5d導引且將外周側一邊往下模模套板5j導引一邊進行升降。
Furthermore, a rectangular frame-shaped lower die set
在下模模套板5j的外周面側,形成有與階差部7f對應之階梯部5m(第二卡止部)。階差部7f係如前述的圖9所示,窄幅的下模導引塊7d與較其寬幅的下模模套導引件7e連結所形成。階梯部5m係以夾持面側會沿著此階差部7f變窄幅之方式沿著左右兩側面形成。能以與此階梯部5m對向的階差部7f為導軌將下模模套單元5對下模模座7作插拔。此外,在上模模套單元4與上模模座6之間、下模模套單元5與下模模座7之間,設有用以插拔各單元的餘隙(clearance)。因此,在上模模套單元4與上模模座6及下模模套單元5與下模模座7,設有在裝設狀態下用以解消高度方向的餘隙之鎖停機構者較佳。
A stepped
如圖7A所示般,在下模可動夾持器5e的夾持面的周圍方向的複數部位設置脫退溝5e1,用以避免從內周側與夾盤爪4d的卡止部4d3干涉。又,如圖7A所示,與脫退溝5e1連接且繞其外周側周圍設置收容片狀薄膜(脫模片)9(參照圖7B)的鬆弛份量之環形溝5e2。在環形溝5e2的底部的周圍方向的複數部位設置吸引孔5e3。環形溝5e2未必需要如一筆劃般繋接著,有吸引孔5e3即可,亦可局部分割。又,吸附保持片狀薄膜9的外周緣部之薄膜吸引溝5e4繞環形溝5e2的外周側周圍設置。在薄膜吸引溝5e4的底部周圍方向的複數部位
設置吸引孔5e5。在實現薄膜吸附上雖亦可僅設置吸引孔5e5,但以併用薄膜吸引溝5e4與吸引孔5e5者較能更確實地實現。薄膜吸引溝5e4未必需要如一筆劃般繋接著,有吸引孔5e5即可,亦可局部分割。吸引孔5e3、5e5係連接於未圖示的空氣吸引機構。
As shown in FIG. 7A , relief grooves 5e1 are provided at plural positions in the peripheral direction of the clamping surface of the lower mold
如圖7B所示,片狀薄膜9係被供給於覆蓋下模模腔凹部3a的下模夾持面並被形成於下模可動夾持器5e的夾持面最外周之薄膜吸引溝5e4的吸引孔5e5所吸附保持。又,片狀薄膜9係被沿著設於下模模腔凹部3a的底部外周(下模模腔件5d的外周)之吸引路5e6所吸附保持。當在此狀態下關閉模具時,從上模板4c往下方突設的薄膜推動銷4h會進入對向的環形溝5e2。此時,薄膜推動銷4h藉由螺旋彈簧4i(參照圖2)的勢能將片狀薄膜9的鬆弛份量壓入環形溝5e2並被吸引孔5e3吸引而收容。又,保持工件W的外周緣部之夾盤爪4d的卡止部4d3(參照圖2),係可避免被收容於對向的脫退溝5e1(參照圖7A)與下模可動夾持器5e干涉。此外,因為片狀薄膜9被吸引於環形溝5e2內的吸引孔5e3,所以在開模時使貼於成形品的片狀薄膜9被吸引到下模3而順利進行離型。此時,因為薄膜推動銷4h藉由螺旋彈簧4i的撓曲將片狀薄膜9往下模3按住,可按住片狀薄膜9直到薄膜推動銷4h從下模3離開,成為更不易產生剝離不良的構造。片狀薄膜(脫模片)9係例如厚度50μm左右且具有耐熱性者,容易從模具面剝離且具柔軟性、伸展性者,例如,以PTFE、ETFE、PET、FEP薄膜、氟含
浸玻璃布、聚丙烯薄膜、聚偏二氯乙烯等作為主成分的單層或複數層膜。
As shown in FIG. 7B, the
如此,當覆蓋含有下模模腔凹部3a的下模夾持面之片狀薄膜9按下模模套單元5被吸附保持時,在含有下模模腔凹部3a的下模夾持面進行吸附保持時容易處理,亦能盡可能地避免如長形薄膜般產生與壓縮成形無關的浪費使用區域。
In this way, when the sheet-
圖4中,在形成矩形狀的上模板4c的四方的邊緣部中央的夾持面,上模鎖定塊4j(第一鎖定塊)分別突設在4個部位。又,圖7A中,在形成矩形狀的下模可動夾持器5e的四方的邊緣部中央的夾持面或下模模套板5j,一對的下模鎖定塊5n(第二鎖定塊)以2個一對分別突設於4個部位。上模鎖定塊4j係與對向的下模鎖定塊5n透過凹凸嵌合而相互咬合的方式配置。藉此,可按各模具模套單元進行形成有工件保持部2a的上模板4c與構成下模模腔凹部3a的下模可動夾持器5e或下模模套板5j之對位而閉模。此外,上模鎖定塊4j與下模鎖定塊5n之形態亦可為上下成對調換。
In FIG. 4 , upper
圖9中,在上模模套單元4的上模板4c及下模模套單元5的下模模套板5j的對向位置,分別突設上模調整銷4k(參照圖2)及下模調整銷5p(參照圖5)(整平機構)。上模調整銷4k係被支撐於上模模套板4a且貫通支撐塊4b及上模板4c而從上模夾持面往下方突設。又,下模調整銷5p係隔介螺旋彈簧5q支撐於下模底座板5a且貫通支撐板5c及下模模套板5j而從下模夾持面往上方突設。
In Fig. 9, at the opposing positions of the
如圖4所示,上模調整銷4k係沿著上模板4c的長邊側的邊緣部以等間隔各設置複數根(各4根,左右兩側共8根)。又,如圖7A所示,下模調整銷5p係沿著下模模套板5j的長邊側的邊緣部以等間隔各設置複數根(各4根,左右兩側共8根)。上模調整銷4k及下模調整銷5p的支數係任意且亦可設於短邊側。上下的調整銷4k、5p係配置在平面視圖中的同一位置。
As shown in FIG. 4 , a plurality of upper die adjustment pins 4k are provided at equal intervals along the edge of the
自上述的上模板4c突設的上模調整銷4k與自下模模套板5j突設的下模調整銷5p是相互對向地配置。因此,於閉模時,在複數部位對向的上模調整銷4k與下模調整銷5p比起模具面還先碰撞,利用螺旋彈簧5q的撓曲來吸收按壓力之偏差,所以修正對向配置的上模模套單元4與下模模套單元5的夾持面彼此之平行度,之後模具面可平面接觸,故而可防止部分接觸。
The upper
此處,針對調整機構8之動作,參照圖8進行說明。作為一例,圖8的左半圖係表示工件板厚比通常的工件W薄或模製樹脂的樹脂量少的情況下之模具夾持狀態。又,圖8的右半圖係表示工件板厚比通常的工件W厚或模製樹脂的樹脂量多的情況下之模具夾持狀態。
Here, the operation of the
圖8左半圖的情況,係工件板厚比通常的工件W薄或相對於模製樹脂的目標樹脂量(成為成形後適當的最終封裝厚度之樹脂量)所供給的樹脂量少。或為其兩者的情況。在這情況,插入銷懸掛板8a與壓抵板8d之間的螺旋彈簧8e係處於反彈的狀態,可藉由螺旋
彈簧8e的撓曲來吸收工件W的板厚之偏差。又,在模製樹脂量少的情況,吸附保持工件W之上模板4c係抵抗螺旋彈簧5g的勢能將下模可動夾持器5e壓下。藉此,因應工件W的板厚、供給到模腔凹部3a的樹脂量,使下模可動夾持器5e對下模模腔件5d之相對的高度位置決定成一樣,故而可吸收工件W的板厚t1薄的情況或供給到模腔凹部3a的樹脂量之偏差t2。這樣的調整動作是按複數(本實施例中為2個部位)設置的上模模套單元4與下模模套單元5來進行。
In the case of the left half of FIG. 8 , the thickness of the workpiece is thinner than that of the normal workpiece W or the amount of resin supplied is small relative to the target resin amount of the molding resin (resin amount to obtain an appropriate final package thickness after molding). or the case of both. In this case, the
又,圖8右半圖的情況,係工件板厚比左半圖的工件W厚或相對於模製樹脂的目標樹脂量(成為成形後適當的最終封裝厚度之樹脂量)所供給的樹脂量多。抑或在有關左右的差較大的事例方面,有其兩者的情況。在這情況,上模模套單元4中被螺旋彈簧4f偏置的推動銷4g的高度位置會產生誤差t3。然而,插入銷懸掛板8a與壓抵板8d之間的螺旋彈簧8e係被壓縮,懸掛銷8b被壓回而成為頭部8b1從銷懸掛板8a僅稍疏離間隙t4的狀態,藉由螺旋彈簧8e的撓曲來吸收工件W的板厚之偏差。
In addition, in the case of the right half of Fig. 8, the thickness of the workpiece is thicker than that of the workpiece W in the left half of the figure, or the amount of resin supplied relative to the target resin amount of the molding resin (resin amount that becomes an appropriate final package thickness after molding) many. Or there may be cases of both in cases where there is a large difference between the left and the right. In this case, an error t3 occurs in the height position of the
又,下模模套單元5中,推動銷5f的高度位置因螺旋彈簧5g之勢能而僅變化t5,下模可動夾持器5e係成為自支撐板5c產生若干疏離的間隙t6的狀態。如此,因應供給到模腔凹部3a的樹脂量使下模可動夾持器5e對下模模腔件5d之相對的高度位置決定成一樣。藉此,吸收樹脂厚t7之偏差。
Also, in the lower die set
如以上,起因於複數個壓縮成形用模具1中的工件W的板厚之偏差或供給於模腔凹部3a的樹脂量之偏差等的、在模具夾持時的模具高度(圖8的銷懸掛板8a與下模底座板5a間之距離)之偏差,可藉由下模可動夾持器5e的偏置機構或調整機構8來吸收。這樣的模具高度之偏差調整動作是按橫向排列地設於複數部位(本實施例中為2個部位)的上模模套單元4及下模模套單元5來進行。
As described above, the mold height at the time of mold clamping (pin suspension in FIG. The deviation of the distance between the
又,因為設於上模模座6的調整機構8係按模具模套單元設置,所以在左右的模具模套單元,不僅是圖8左半圖(在工件W的板厚薄且所供給的樹脂量比目標樹脂量少的情況)與圖8右半圖(工件W的板厚度厚且所供給的樹脂量比目標樹脂量多的情況)之情況,也可以是左右相反的情況,即便是在左邊是工件W的板厚度厚而所供給的樹脂量少之情況且在右邊是工件W的板厚度薄而所供給的樹脂量多的情況,也可在模具未傾斜的情況下進行調整。藉此,因為複數個模具的總高度始終可成為一定,所以可在沖壓面未傾斜的情況下對樹脂密封部(封裝)的厚度以高精度進行壓縮成形。
Again, because the
如此,即便起因於在複數個工件W的板厚之偏差或供給到各下模模腔凹部3a的樹脂量之偏差等而在上模2與下模3的模具開閉方向的高度上有偏差,藉由按在上模模座6並列配置的上模模套單元4所設置的調整機構8,按工件W作調整上模2與下模3在模具夾持時之模具高度之偏差,所以能高精度地進行壓縮成
形。此外,圖8中,因為將2個上模模套單元4橫向排列地並列配置在上模底座部6a,所以調整機構8亦與其配合以2個橫向排列地設置,但在至少任一者的上模底座部6a與上模模套單元4之間介設即可。在這情況,於另一者的上模2介設間隔件以取代調整機構8即可。又,於上模模座6設置3個以上的上模模套單元4的情況,以比模套單元的數量少1個的調整機構8獨立地搭載於上模底座部6a者較佳。在這情況,成為高度配合被固定的上模模套單元4的高度來調整設有調整機構8的剩餘的上模模套單元4的高度。此外,在固定側的上模底座部6a與上模模套單元4之間亦可設置固定高度的支撐塊等。
In this way, even if there is a variation in the height of the
又,在伴隨著交換工件W的品種而進行模具交換之情況,如圖10A、圖10B所示,在壓縮成形用模具1開模的狀態下,以比上模模座6的上模底座部6a還裏側的鉸鏈6g為中心使上模底座側部6b往近前側壓下地旋轉規定量。此時,如圖10A所示,在由往上模底座部6a垂下的上模導引塊6d及上模模套導引件6e所形成的階差部6f,各上模模套單元4是在支撐塊4b的左右兩端部以凹凸嵌合的狀態下各自被保持。在此狀態下,如圖10B所示般,可按上模模套單元4將階差部6f作為導引件往近前側拉出而與其他的上模模套單元4作交換。圖9顯示從上模模座6取出的上模模套單元4。
In addition, when exchanging molds accompanying the type of workpiece W, as shown in FIG. 10A and FIG. The
又,在壓縮成形用模具1開模的狀態下,如圖10A、圖10B所示般,以比下模模座7的下模底座
部7a還裏側的鉸鏈7g為中心使下模底座側部7b從近前側往上壓地旋轉規定量。此時,如圖10A所示,各下模模套單元5是在下模模套板5j的左右兩端部的階梯部5m凹凸嵌合後的狀態下各自被保持於藉由豎立於下模底座部7a的下模導引塊7d及下模模套導引件7e所形成的階差部7f。在此狀態下,如圖10B所示般,可按下模模套單元5將階差部7f作為導引件往近前側拉出與其他的下模模套單元5作交換。圖9顯示從下模模座7取出的下模模套單元5。
Also, in the state where the
如此,在進行模具交換之情況,上模模座6及調整機構8以及下模模座7係可不交換而進行使用,故通用性高,可迅速地進行工具更換或維修。又,上模模座6及下模模座7為,上模底座部6a及上模底座側部6b透過裏側的鉸鏈6g、下模底座部7a及下模底座側部7b透過裏側的鉸鏈7g各自可轉動地連結,故容易將上模模套單元4、下模模套單元5從模具近前側拉出,可容易地進行交換作業。
In this way, in the case of mold exchange, the
圖11A、圖11B表示壓縮成形用模具1的其他構成例。對與第一實施例所揭示之壓縮成形用模具1相同構件賦予相同編號並援用說明,以下則以不同構成為中心作說明。 11A and 11B show other configuration examples of the compression molding die 1 . The same reference numerals are assigned to the same components as those in the compression molding die 1 disclosed in the first embodiment, and the explanations are cited, and the following description will focus on different configurations.
在工件W會搭載複數個半導體晶片,但例如在晶片搭載部發生不良等之情況,會有在工件W上發生半導體 晶片的欠損部分之情況。在這情況,雖然對各工件W正確地計測半導體晶片的欠損數並變更要供給的樹脂量即可,但會耗費時間與工時,且有必要進行藉由精密計量的樹脂供給。因此,在本實施例中設有後述之溢流模腔,使得即便模製樹脂的供給量未必正確一致也能在模具側作調整。 A plurality of semiconductor chips will be mounted on the workpiece W, but for example, if a defect occurs in the wafer mounting part, semiconductor chips may be generated on the workpiece W. The condition of the defective portion of the wafer. In this case, it is sufficient to accurately measure the number of defects of the semiconductor wafer for each workpiece W and change the amount of resin to be supplied, but it takes time and man-hours, and it is necessary to supply the resin by precise metering. Therefore, in this embodiment, an overflow cavity to be described later is provided so that even if the supply amount of the molding resin is not necessarily consistent, it can be adjusted on the mold side.
如圖11A所示,模腔底部的高度高的階差部5d1是繞著設於各下模模套單元5的下模模腔件5d的上面側外周緣部周圍設置,在階差部5d1設有複數個溢流模腔10。溢流模腔10係收容(吸收樹脂量之偏差)供給到下模模腔凹部3a的模製樹脂當中之過剩份量。因此,供給到下模模腔凹部3a的樹脂量係有必要比最終封裝部的厚度所需的樹脂量還多供給溢流模腔份量。
As shown in FIG. 11A, the high step portion 5d1 at the bottom of the mold cavity is arranged around the upper side outer peripheral edge portion of the lower
如圖11A所示,在下模模腔件5d的階差部5d1設有複數個貫通孔5d2。浮動件10a以可升降地插入各貫通孔5d2。各浮動件10a係豎立在下模底座板5a與支撐板5c之間以水平姿勢配置的連結板10b的上面而被支撐。各浮動件10a係貫通支撐板5c並被插入下模模腔件5d的貫通孔5d2。連結板10b與下模底座板5a之間設有螺旋彈簧10c,隔介連結板10b將各浮動件10a朝上方偏置支撐。如圖11B所示,藉由各浮動件10a的上端面與貫通孔5d2的孔壁面以形成溢流模腔10。此外,浮動件10a亦可為塊形狀,亦可為細長的銷形狀。各溢流模腔10之上的端面(平面)形狀可為矩形,亦可為圓形等之其他形狀。
As shown in FIG. 11A , a plurality of through-holes 5d2 are provided in the step portion 5d1 of the
在連結板10b的下面,推動銷10d朝鉛直下方突設。推動銷10d亦可貫通下模底座板5a及下模模座7(下模底座部7a)而被支撐於未圖示的模具開閉機構(例如可動平台(platen)等)。又,於此推動銷10d的下端部,亦可設置有例如壓力感測器(荷重元(load cell)等)。藉此,透過利用壓力感測器直接實時地測定既閉模時之流入溢流模腔10的樹脂壓力,能實時控制模製樹脂的樹脂壓力。此外,未必需要推動銷10d,沒有亦可。
On the lower surface of the
又,如圖11A所示,在比支撐下模可動夾持器5e的推動銷5f的緣部5h還下方,也可突設制動器5i。制動器5i係透過於下模可動夾持器5e被上模2壓下時制動器5i下端抵接於底座板5a而可制止往下移動。制動器5i係為了規定下模可動夾持器5e的下動限界位置而設置。藉此,因為決定了下模模腔凹部3a的高度,所以可使在複數部位被壓縮成形的各封裝部(樹脂密封部)的厚度成為一定地進行管理。
Also, as shown in FIG. 11A, a
此處,針對在壓縮成形動作中之浮動件10a的行為,參照圖11A作說明。雖然半導體晶片通常應該全數會被搭載於工件W,但在前工程中發現有半導體晶片本身不良等之情況,會有半導體晶片的一部分未搭載於工件的情況。亦即,有半導體晶片的一部分欠缺的情況。又,在工件W有發生半導體晶片欠缺或半導體晶片欠損、或樹脂搬送中有樹脂一部分掉落、或因何種原因使供給到下模模腔凹部3a的模製樹脂量比目標樹脂量還不足的情況,當將壓縮成形用模具1閉模時,藉螺旋
彈簧10c之勢能而貫通支撐板5c並被插入下模模腔件5d的貫通孔5d2之各浮動件10a,係從階差部5d1進入下模模腔凹部3a內而被壓縮成形。藉以吸收下模模腔容積的大小與所供給的模製樹脂的樹脂量之差分。
Here, the behavior of the floating
又,在對工件W供給到下模模腔凹部3a的模製樹脂量比目標樹脂量多的情況,浮動件10a藉樹脂壓力抵抗螺旋彈簧10c的勢能而被壓下,以過剩樹脂是維持被收容於貫通孔5d2的情況下進行壓縮成形。藉以吸收下模模腔容積的大小與模製樹脂的樹脂量之差分。
Also, when the amount of molding resin supplied to the lower
此外,因為樹脂量過少時會有最終封裝的成形厚度薄之虞,故以最初供給比目標樹脂量還多的樹脂為目標且利用各浮動件10a的壓下量進行調整者較佳。
Also, since the molded thickness of the final package may be thin if the amount of resin is too small, it is preferable to initially supply more resin than the target amount of resin and to adjust by the amount of reduction of each
因此,即便按每個工件W正確地計測模製樹脂的供給量,也可將成形品的厚度保持一定地進行壓縮成形。又,成形品所形成的凹部或凸部係位在與最終製品無關的工件W的外周緣部,故而不會影響成形品質。又,由於浮動件10a係朝向模腔凹部3a內的模製樹脂而始終被偏置,故樹脂壓力施加於模腔凹部3a內的模製樹脂,可壓壞空隙(void)提升成形品質。此外,溢流模腔10雖設於下模模腔件5d,但亦可設於下模可動夾持器5e的夾持面。
Therefore, even if the supply amount of the molding resin is accurately measured for each workpiece W, compression molding can be performed with the thickness of the molded product kept constant. Also, since the recesses or protrusions formed in the molded product are located on the outer peripheral edge of the workpiece W which is not related to the final product, the quality of the molding will not be affected. Moreover, since the floating
其次,參照圖12至圖15說明圖1的壓縮成形用模具1之對應於工件W的變形使用例。圖1之壓縮成形用
模具1係就在對工件W、例如2片300mm×100mm的矩形帶材基板同時進行壓縮成形的情況所作的例示,也可使用比其還大尺寸的工件W一片一片壓縮成形。
Next, a modified usage example corresponding to the workpiece W of the compression molding die 1 of FIG. 1 will be described with reference to FIGS. 12 to 15 . Figure 1 for compression molding
The
圖12及圖13係對大尺寸的工件進行壓縮成形之情況的壓縮成形模具之正視剖面說明圖及側視剖面圖。表示從圖1所示的上模2的構成,除去設於上模模座6的中間部分的上模導引塊6d及上模模套導引件6e,將上模模套單元4更換成大尺寸的工件W用的實施例。又,表示從圖1所示的下模3的構成除去設於下模模座7的中間部分的下模導引塊7d及下模模套導引件7e,下模模套單元5更換成大尺寸的工件W用的實施例。在這情況亦是,上模模座6及調整機構8以及下模模座7可共用。
12 and 13 are front sectional explanatory views and side sectional views of a compression molding die for compression molding a large-sized workpiece. It shows that from the composition of the
在圖12的情況,因為壓抵板8d被割斷且存在2個調整機構8,所以即便是工件W本身左右厚度稍有不同的情況或是供給到下模模腔凹部3a的樹脂量在左右稍有供給不同的情況,與圖13所示的壓抵板8d是一體的情況相比,調整機構8可將模具高度個別作調整。
In the case of FIG. 12, since the
圖14A、圖14B係對作為工件W之例如300mm×300mm的大型矩形面板進行壓縮成形之情況的上模2及下模3之平面圖。在圖14A中的上模2,夾盤爪4d在被上模板4c所吸附的工件W的四邊各設置相同數量(例如3個部位)。又,上模導引塊6d及上模模套導引件6e僅設在上模模座6的左右兩端部。在上模板4c的外周緣部,上模調整銷4k在複數個部位(例如每一邊4
個部位)突設。此外,形成於工件保持部2a上的複數個工件W的吸附孔2b係省略了圖示。
14A and 14B are plan views of the
圖14B中,在下模3的下模可動夾持器5e,脫退溝5e1對應上模2的夾盤爪4d在下模模腔凹部3a的周圍各設置相同數量(例如3個部位)。又,下模導引塊7d及下模模套導引件7e僅設在下模模座7的左右兩端部。於下模可動夾持器5e的外周緣部,在上模調整銷4k對向位置的複數部位(例如每一邊4個部位)突設。此外,繞下模可動夾持器5e周圍設置的薄膜吸引溝5e4的溝底部所設之複數個吸引孔5e5及環形溝5e2與吸引孔5e3係省略了圖示。
In Fig. 14B, in the lower mold
圖15A、圖15B係對作為工件W的例如直徑 300mm的半導體晶圓及圓形的載體、基板進行壓縮成形之情況的上模2及下模3的平面圖。在圖15A中的上模2,夾盤爪4d在被上模板4c所吸附之工件W的周圍以等間隔(例如錯開各90度相位的4個部位)設置。又,上模導引塊6d及上模模套導引件6e僅設在上模模座6的左右兩端部。於上模板4c的外周緣部,上模調整銷4k在複數部位(例如每一邊4個部位)突設。此外,於工件保持部2a形成有複數個的工件W之吸附孔2b係省略圖示。
Fig. 15A, Fig. 15B are for example diameter as workpiece W A plan view of the
圖15B中,在下模3的下模可動夾持器5e,脫退溝5e1是對應上模2的夾盤爪4d在下模模腔凹部3a的周圍等間隔(例如錯開各90度相位的4個部位)設置。又,下模導引塊7d及下模模套導引件7e僅設於下
模模座7的左右兩端部。於下模可動夾持器5e的外周緣部,在上模調整銷4k的對向位置於複數部位(例如每一邊4、個部位)突設。此外,繞下模可動夾持器5e周圍設置的薄膜吸引溝5e4的溝底部所設之複數個吸引孔5e5及環形溝5e2與吸引孔5e3係省略了圖示。又,作為工件W,除了圓形狀的半導體晶圓以外,亦可為粒接(die bonding)有複數個半導體晶片T的eWLB等之圓形載體或基板。
In Fig. 15B, in the
如圖14及圖15所示,亦可為壓縮成形用模具1,其具備:上模2,具有保持1片工件W的工件保持部2a;下模3,其藉由和工件保持部2a對向配置且將工件W夾持的夾持器5e及被插入夾持器5e內且透過相對移動以加壓樹脂的模腔件5d而形成下模模腔凹部3a,上模2具備調整模具夾持時的厚度方向之偏差的調整機構8(未圖示)。在這情況,例如即便是必定無法橫向排列且並列配置的大尺寸的工件W,也能使用具備調整機構8的上模2調整與模具夾持時的大尺寸的工件W對應的模具高度之偏差而高精度地進行壓縮成形。
As shown in FIGS. 14 and 15 , it may also be a
圖16係於圖1所示的壓縮成形用模具1中變更了下模模套單元5的模腔件5d及支撐板5c的形態者。亦即,支撐板5c係未支撐下模模腔件5d而以支撐下模可動夾持器5e及下模模套板5j之方式設置。下模模腔件5d形成被直接支撐於在下模底座板5a豎立形成複數根的支撐柱5b。此外,繞下模可動夾持器5e周圍設置的薄膜吸引溝5e4的溝底部所設之複數個吸引孔5e5及環形溝5e2與吸引孔5e3等係省略了圖示。
Fig. 16 is a case in which the configurations of the
在這情況,由於能加厚下模模腔件5d的板厚,且藉由支撐柱5b支撐下模模腔件5d的正下方,故變得不易受到翹曲等之影響,可更高精度進行利用支撐柱5b的高度調整。
In this case, since the plate thickness of the lower
圖17的左半圖,係於圖1所示的壓縮成形用模具1中變為下模模套單元5的下模可動夾持器5e,下模夾持器5e被支撐板5c所固定支撐,將下模模腔件5d連接於驅動機構11且設成可直接升降。驅動機構11可為伺服馬達11a與動力傳達部11b,亦可為油壓致動器。在這情況,可高精度地控制下模模腔凹部3a的容積,容易將樹脂壓力施加於被供給到下模模腔凹部3a之模製樹脂。
The left half of Fig. 17 is the
圖17的右半圖,以上端部支撐下模可動夾持器5e的推動銷5f的下端部是被可動連結板12所支撐。可動連結板12係在下模底座板5a所形成的切口以水平姿勢設置。可動連結板12係連接於驅動機構13設成可直接升降。驅動機構13可為伺服馬達13a與動力傳達部13b,亦可為油壓致動器。此外,繞下模可動夾持器5e周圍設置的薄膜吸引溝5e4的溝底部所設之複數個吸引孔5e5及環形溝5e2與吸引孔5e3等係省略圖示。
In the right half of FIG. 17 , the lower end of the
藉此,也可將自昔使用的處理2片的轉移成形用沖壓機的轉移驅動機構(柱塞驅動機構)作為下模可動夾持器5e的驅動機構使用。
Thereby, the transfer driving mechanism (plunger driving mechanism) of the conventionally used transfer molding press machine for handling two sheets can also be used as the driving mechanism of the lower mold
圖18並非例示僅對圖14A、圖14B所示的矩形面板或圖15A、圖15B所示的圓形的半導體晶圓等
之大尺寸的工件W單體進行壓縮成形,而係例示亦可為對1個帶材基板進行壓縮成形的壓縮成形用模具1之情況。
FIG. 18 is not an example only for the rectangular panel shown in FIG. 14A and FIG. 14B or the circular semiconductor wafer shown in FIG. 15A and FIG. 15B .
The large-sized workpiece W is compression-molded alone, and the case where the compression-
圖19表示取代圖1所示的2個帶材基板用的壓縮成形用模具1,改為3個帶材基板用的壓縮成形用模具1。模具構成係與圖1同樣且例示對共同的模座(上模模座6及下模模座7)作插拔的模具模套單元(上模模套單元4及下模模套單元5)的數量為3組的情況。此外,亦可設置4組以上的模具模套單元。
FIG. 19 shows a
圖20A、圖20B表示調整機構8的其他構成。圖1中作為調整機構8是設置使用了螺旋彈簧8e的彈簧機構,但亦可使用楔機構14。於圖20A、圖20B中,在上模模座6的上模底座部6a與上模模套單元4的上模模套板4a之間,可動滑動板14a與楔板14b使錐型面14c彼此重疊並被積層。楔板14b係隔介高度調整板14d而與上模模套板4a重疊地組裝。
20A and 20B show other configurations of the
又,如圖20B所示,在矩形框狀的上模底座側部6b裏側的側部,安裝有螺桿軸14e及伺服馬達14f。螺桿軸14e係與設於可動滑動板14a的螺帽螺嵌。透過使伺服馬達14f往規定方向旋轉驅動規定量,可動滑動板14a係沿著上模底座部6a在水平方向移動。此時,透過隔介著錐型(taper)面14c積層的楔板14b來調整上模模套單元4的高度位置。亦即,如圖20A所示般,亦可做成利用供上模模套單元4的支撐塊4b卡止的階差部6f的模具開閉方向的餘隙來吸收工件W的板厚差。
Also, as shown in FIG. 20B, a
圖21的平面布置圖顯示搭載著上述的任一壓縮成形用模具1之樹脂模製裝置的一例。工件W係100mm×300mm的矩形帶材基板,模製樹脂雖可為薄片(tablet)樹脂(固形樹脂)、片狀樹脂、顆粒狀樹脂、粉狀樹脂及液狀樹脂中任一者,但作為一例是使用顆粒樹脂。搭載著壓縮成形用模具1的沖壓部15被設於3個部位。平均一沖壓部15為處理2片,1次的沖壓動作可對合計6片工件W進行壓縮成形。此外,當考慮基於供給、沖壓的成形、收納等之時間時,為了提高生產性,在沖壓機的數量多的情況,各沖壓機也可依序進行成形。
FIG. 21 is a plan view showing an example of a resin molding apparatus equipped with any one of the compression molding dies 1 described above. The workpiece W is a rectangular strip substrate of 100 mm × 300 mm. Although the molding resin can be any one of tablet resin (solid resin), sheet resin, granular resin, powder resin and liquid resin, as One example is the use of granular resins. The
在3個併排設置的沖壓部15的左端側設有供給工件W並在成形後收納於卡槽(magazine)的工件供給收納部16。工件搬送機構17係往復移動於工件供給收納部16與沖壓部15之間,在朝已開模的壓縮成形用模具1進退移動時進行成形後的工件W之取出與成形前的工件W之供給。進入到沖壓部15的工件載入器(loader)17係接收2片為一組之成形後的工件W(成形品),將2片為一組之成形前的工件W遞交給壓縮成形用模具1(上模2的工件保持部2a:參照圖1)。
On the left end side of the three
在沖壓部15的右端側設有薄膜樹脂供給部18。在薄膜樹脂供給部18,對應於各帶材基板而被供給各薄膜,且被切割成為片狀薄膜9。於片狀薄膜9上,從在工件供給收納部16偵測出的結果算出目標樹脂量而在與模腔平面視圖中尺寸大致同形狀上,例如平坦地撒上顆粒樹脂。又,前述樹脂及片狀薄膜9係藉由樹脂
搬送機構19從薄膜樹脂供給部18搬送到沖壓部15,成形後僅片狀薄膜9被回收。
A film
在上述的樹脂模製裝置中,各沖壓部15中,因為可按複數(例如2片為一組)個帶材基板及基板將片狀薄膜9及樹脂對並列配置的模具模套單元各別供給並一邊吸收工件W的板厚、樹脂量之偏差一邊個別地進行壓縮成形,所以生產性、處理會提升。沖壓部15的數量未受限於3個沖壓機,亦可比其多或少。
In the above-mentioned resin molding apparatus, in each punching
此外,壓縮成形裝置,例如上模2及下模3任一者能為可動模且另一者為固定模,或者雙方為可動模。又開閉壓縮成形用模具1之模具開閉機構,可使用利用伺服馬達及螺桿軸者、利用伺服馬達及肘節連桿者、或利用油壓驅動機構者等各式各樣的驅動機構。
In addition, in the compression molding apparatus, for example, either one of the
又,壓縮成形用模具1係在下模3形成模腔凹部3a且在上模2形成工件保持部2a,但也可在下模3形成工件保持部,且在上模2形成模腔凹部。在這情況,調整機構8可與下模模座7一體設置,片狀薄膜9亦可被吸附保持於上模模套單元4。在這情況,模製樹脂並非供給到片狀薄膜9上而是供給到工件W上。又,本實施例係使用片狀薄膜9的實施例,但亦可使用長形薄膜。
Also, in the compression molding die 1 , the
再者,本實施例雖係使用薄膜的實施例,但亦可為未使用薄膜的情況。 Furthermore, although this embodiment is an embodiment using a thin film, it may also be a case where no thin film is used.
上述的壓縮成形用模具1係例示了處理1片或處理2片工件W的模具,但亦可設成模製3片以上的工件W。 The aforementioned compression molding die 1 is an example for processing one or two workpieces W, but it may also be configured to mold three or more workpieces W.
針對壓縮成形裝置的其他構成作說明。 Other configurations of the compression molding device will be described.
如圖22所示,例如亦可為處理1片工件W用的壓縮成形用模具1橫向排列地搭載複數個,且藉由共同的沖壓機驅動機構20(模具開閉機構)開閉。圖22中,於矩形狀的沖壓機底座20a的各角落部豎立設置導引柱20b。導引柱20b的上端連結於固定平台20c,在中間部有可動平台20d以可滑移地連繋著。可動平台20d係成為藉由設於沖壓機底座20a的伺服馬達21a及動力傳達部21b而升降。上模2被橫向排列地支撐於固定平台20c,下模3被橫向排列地支撐可動平台20d。在構成上模2的上模模套單元,設有與圖9同樣的調整機構8(未圖示)。
As shown in FIG. 22 , for example, a plurality of
圖23係表示壓縮成形裝置的另一其他的構成。亦可為處理1片工件W的壓縮成形用模具1在高度方向重疊複數層(本實施例中為2層)地搭載,且藉由共同的沖壓機驅動機構20(模具開閉機構)開閉。圖23中,於矩形狀的沖壓機底座20a的各角落部豎立設置導引柱20b。導引柱20b的上端連結於固定平台20c,在中間部有可動平台20d及中間平台20e是可滑移地各別連繋著。可動平台20d係成為透過設於沖壓機底座20a的伺服馬達21a及動力傳達部21b而升降。中間平台20e係透過與可動平台20d的升降動作連動之齒條及小齒輪機構等(未圖示)以不同衝程(例如可動平台20d與中間平台20e的移動比2:1)升降動作的方式連繋。
Fig. 23 shows another configuration of the compression molding device. The compression molding die 1 for processing one workpiece W may be mounted in a plurality of stacked layers (two layers in this embodiment) in the height direction, and opened and closed by a common press drive mechanism 20 (die opening and closing mechanism). In FIG. 23 , guide
在固定平台20c及中間平台20e的下面各自支撐有上模2,在可動平台20d及中間平台20e的上面各自支撐有下模3。在構成上模2的上模模套單元,各自設有與圖9同樣的調整機構8(未圖示)。
藉此,即使是例如大尺寸的工件般處理1片的工件W,藉由複數片同時進行壓縮成形使生產性提升,且被並列配置或多層配置的每個模具模套單元在模具夾持時的模具高度之偏差係藉由調整機構8吸收而在模具無傾斜的情況下高精度地進行壓縮成形。
In this way, even if one piece of workpiece W is processed such as a large-sized workpiece, productivity is improved by performing compression molding of multiple pieces at the same time, and each mold set unit arranged in parallel or in multiple layers is clamped when the mold is clamped. The deviation of the mold height is absorbed by the
此處,參照圖24及圖25說明壓縮成形模具1的其他例。壓縮成形用模具1係將橫向排列地並列配置的複數個工件W個別地夾持並同時進行壓縮成形者。對與第一實施例相同構件賦予相同編號並援用說明。
Here, another example of the compression molding die 1 will be described with reference to FIGS. 24 and 25 . The
針對上模2(第一模具)之構成,參照圖24作說明。本圖係以最小構成作概念性記載。在構成上模模座6(第一底座部)的底部的上模底座部6a,複數個工件W各設有調整機構8(螺旋彈簧8e)。隔介此調整機構8保持工件W之上模板4c橫向排列且被懸掛支撐。在上模板4c形成有將工件W個別地吸附保持之工件保持部2a。此外,在上模底座部6a雖未圖示有區劃上模底座側部6b(第一底座側部)或上模空間部6c(第一模具空間部)的上模導引塊6d(第一導引塊)、吸引機構及減壓機構,但設置此等亦可。
The structure of the upper mold 2 (the first mold) will be described with reference to FIG. 24 . This figure is a conceptual record with the minimum composition. An adjustment mechanism 8 (
針對下模3(第二模具)的構成作說明。構成下模模座7(第二底座部)的底部的下模底座部7a上,下
模模腔件5d與工件保持部2a對向配置且橫向排列地支撐固定著。又,在下模模腔件5d的周圍,夾持工件W之下模可動夾持器5e是透過螺旋彈簧5g而按每個工件獨立地浮動支撐。藉由下模模腔件5d與下模可動夾持器5e形成下模模腔凹部3a。下模模腔件5d係透過維持插入下模可動夾持器5e內的狀態進行相對移動而加壓樹脂。此外,在下模底座部7a,亦可豎立設置用以區劃下模底座側部7b(第二底座側部)或下模空間部7c(第二模具空間部)的下模導引塊7d(第二導引塊)等。
The structure of the lower die 3 (second die) will be described. The lower
透過以上的構成,在以上模2與下模3夾持複數個工件W時,由調整機構8及螺旋彈簧5g來吸收在藉由具有在上模底座部6a橫向排列地設置的工件保持部2a之上模板4c(第一上模板及第二上模板)及形成與其等對向配置的下模模腔凹部3a(第一下模模腔凹部及第二下模模腔凹部)之下模可動夾持器5e進行夾持每工件W時的模具高度之偏差,故而可在模具未傾斜下進行夾持。
With the above structure, when the
圖25表示壓縮成形用模具1的又另一其他例。壓縮成形用模具1係將橫向排列地並列配置的複數個工件W個別地夾持並同時進行壓縮成形者。對與第一實施例相同構件賦予相同編號並援用說明。
FIG. 25 shows still another example of the
針對上模2(第一模具)之構成,參照圖25作說明。本圖係以最小構成作概念性記載。在構成上模模座6(第一模座)的底部的上模底座部6a(第一底座部),將複數個工件W獨立地保持之上模板4c(第一上模板及第二上模
板)是被橫向排列地支撐著。在上模板4c形成有將工件W個別地吸附保持之工件保持部2a。此外,在上模底座部6a,雖未圖示有用以區劃上模底座側部6b(第一底座側部)或上模空間部6c(第一模具空間部)的上模導引塊6d(第一導引塊)、吸引機構及減壓機構,但此等亦可被設置。
The structure of the upper mold 2 (the first mold) will be described with reference to FIG. 25 . This figure is a conceptual record with the minimum composition. In the upper
針對下模3的構成作說明。在構成下模模座7(第二模座)的底部的下模底座7a(第二底座部),與工件保持部2a對向配置而夾持工件W之下模可動夾持器5e、及藉由保持被插入下模可動夾持器5e內的狀態相對移動而加壓樹脂的下模模腔件5d所形成之下模模腔凹部3a(第一下模模腔凹部及第二下模模腔凹部)是被橫向排列地支撐。
The structure of the
具體言之,下模模腔件5d按各工件W獨立地支撐固定於下模板5r(模具板)上。下模可動夾持器5e隔介螺旋彈簧5g按各工件W獨立地偏置支撐於下模板5r。在下模板5r與下模底座部7a間設有按工件W而獨立的調整機構8(螺旋彈簧8e)。
Specifically, the
此外,在下模底座部7a,雖未圖示有區劃下模底座側部7b(第二底座側部)或下模空間部7c(第二模具空間部)的下模導引塊7d(第二導引塊)等,但此等亦可被設置。
In addition, in the lower
藉此,在以上模2與下模3將複數個工件W個別地夾持時,因為透過下模可動夾持器5e的螺旋彈簧5g及設於下模板5r與下模底座部7a間之調整機構
8,按每個工件W進行吸收模具高度之偏差,所以可在模具未傾斜下進行夾持,其中該上模2係於上模底座部6a橫向排列地設置具有工件保持部2a的上模板4c,下模3係於下模底座部7a設置與工件保持部2a對向且橫向排列地配置的下模模腔凹部3a。
Thereby, when the
1‧‧‧壓縮成形用模具 1‧‧‧Mold for compression molding
2‧‧‧上模 2‧‧‧upper mold
2a‧‧‧工件保持部 2a‧‧‧Workpiece Holder
3‧‧‧下模 3‧‧‧Lower mold
3a‧‧‧下模模腔凹部 3a‧‧‧The concave part of the lower mold cavity
4‧‧‧上模模套單元 4‧‧‧Upper die set unit
5‧‧‧下模模套單元 5‧‧‧Lower mold set unit
6‧‧‧上模模座 6‧‧‧upper die base
6a‧‧‧上模底座部 6a‧‧‧The base of the upper mold
6b‧‧‧上模底座側部 6b‧‧‧The side of the upper mold base
6d‧‧‧上模導引塊 6d‧‧‧Upper die guide block
6e‧‧‧上模模套導引件 6e‧‧‧Upper die sleeve guide
7‧‧‧下模模座 7‧‧‧Lower mold base
7a‧‧‧下模底座部 7a‧‧‧The base of the lower mold
7b‧‧‧下模底座側部 7b‧‧‧The side part of the lower mold base
7d‧‧‧下模導引塊 7d‧‧‧Lower mold guide block
7e‧‧‧下模模套導引件 7e‧‧‧Lower mold sleeve guide
8‧‧‧調整機構 8‧‧‧Adjustment mechanism
W‧‧‧工件 W‧‧‧workpiece
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JP2018022385A JP7092513B2 (en) | 2018-02-09 | 2018-02-09 | Mold base for compression molding dies |
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JP2018022396A JP7092514B2 (en) | 2018-02-09 | 2018-02-09 | Chase unit for compression molding dies and dies for compression molding |
JP2018-022371 | 2018-02-09 | ||
JP2018-022396 | 2018-02-09 | ||
JP2018022371A JP7060390B2 (en) | 2018-02-09 | 2018-02-09 | Compression mold and compression molding equipment |
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CN113547025A (en) * | 2021-06-29 | 2021-10-26 | 成都长之琳航空制造有限公司 | Universal bending die for different equipment |
JP2024014263A (en) * | 2022-07-22 | 2024-02-01 | Towa株式会社 | Transport device, resin molding device, and method for manufacturing resin molded product |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012035433A (en) * | 2010-08-04 | 2012-02-23 | Sumitomo Heavy Ind Ltd | Compression mold and compression molding method |
TW201524735A (en) * | 2013-11-28 | 2015-07-01 | Towa Corp | Compression molding apparatus and method for adjusting mold surface parallelism, method for adjusting mold height |
CN105283289A (en) * | 2013-06-14 | 2016-01-27 | 山田尖端科技株式会社 | Resin-molding die and resin-molding device |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2226852Y (en) * | 1995-05-12 | 1996-05-15 | 锋泰模业有限公司 | Forming mould for sole |
JPH1131706A (en) * | 1997-07-11 | 1999-02-02 | Toshiba Corp | Method for forming mold of semiconductor device and metallic mold for forming mold of semiconductor device |
JP4875927B2 (en) * | 2006-06-02 | 2012-02-15 | アピックヤマダ株式会社 | Resin molding equipment |
JP2009124012A (en) * | 2007-11-16 | 2009-06-04 | Towa Corp | Compression molding method of electronic component, and die |
JP5153509B2 (en) | 2008-08-08 | 2013-02-27 | Towa株式会社 | Electronic component compression molding method and mold apparatus |
JP5312897B2 (en) | 2008-10-20 | 2013-10-09 | Towa株式会社 | Compression molding equipment |
JP5409549B2 (en) * | 2010-08-23 | 2014-02-05 | 住友重機械工業株式会社 | Mold for compression molding and compression molding method |
JP5562273B2 (en) * | 2011-03-02 | 2014-07-30 | Towa株式会社 | Optoelectronic component manufacturing method and manufacturing apparatus |
JP5285737B2 (en) | 2011-04-15 | 2013-09-11 | Towa株式会社 | Resin sealing molding method and resin sealing molding apparatus for electronic parts |
JP5906528B2 (en) * | 2011-07-29 | 2016-04-20 | アピックヤマダ株式会社 | Mold and resin molding apparatus using the same |
SG191479A1 (en) * | 2011-12-27 | 2013-07-31 | Apic Yamada Corp | Method for resin molding and resin molding apparatus |
JP2015162553A (en) * | 2014-02-27 | 2015-09-07 | アサヒ・エンジニアリング株式会社 | Resin molding device and resin molding method of semiconductor device |
JP6491508B2 (en) * | 2015-03-23 | 2019-03-27 | Towa株式会社 | Resin sealing device and method of manufacturing resin molded product |
JP6020667B1 (en) * | 2015-06-19 | 2016-11-02 | 第一精工株式会社 | Transfer molding machine and method of manufacturing electronic component |
JP6430342B2 (en) * | 2015-08-11 | 2018-11-28 | Towa株式会社 | Resin molding apparatus, resin molding method, and mold |
JP6236486B2 (en) * | 2016-03-07 | 2017-11-22 | Towa株式会社 | A position adjusting mechanism, a resin sealing device, a resin sealing method, and a resin sealing product manufacturing method. |
JP6349447B2 (en) * | 2017-08-10 | 2018-06-27 | Towa株式会社 | Method for manufacturing resin-encapsulated electronic component and apparatus for manufacturing resin-encapsulated electronic component |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012035433A (en) * | 2010-08-04 | 2012-02-23 | Sumitomo Heavy Ind Ltd | Compression mold and compression molding method |
CN105283289A (en) * | 2013-06-14 | 2016-01-27 | 山田尖端科技株式会社 | Resin-molding die and resin-molding device |
TW201524735A (en) * | 2013-11-28 | 2015-07-01 | Towa Corp | Compression molding apparatus and method for adjusting mold surface parallelism, method for adjusting mold height |
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