JP2015162553A - Resin molding device and resin molding method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve quality of resin molding of a semiconductor device.SOLUTION: A resin molding device of a semiconductor device comprises: a mold having an upper die and a bottom die; a clamp plate which is provided on the upper die or the bottom die, for clamping the semiconductor device and which is energized by an energizing member in a clamping direction; and one and a plurality of stoppers which are provided on the upper die or the bottom die, for stopping the clamp plate at a predetermined position at the time of clamping.

Description

  The present invention relates to a resin molding apparatus, and more particularly to a resin molding apparatus for a semiconductor device.

  The present invention relates to a resin molding method, and more particularly to a resin molding method for a semiconductor device.

  In order to realize miniaturization of semiconductor devices, semiconductor devices are produced by semiconductor resin batch resin molding. Examples of such a resin molding technique are described in Patent Documents 1-3.

  In the method of manufacturing a semiconductor device described in Patent Document 1, a semiconductor wafer 11 is fixed to a first mold 100 with a clamp 110, a film-like member 40 is disposed on a second mold 200, and a resin 50 is placed in a predetermined region. After the first and second molds are heated, the mold is clamped by the mold lifting mechanism, the inside of the mold cavity is decompressed and the volume of the mold cavity is reduced, thereby the surface of the semiconductor wafer 11 A sealing portion is formed thereon (FIG. 6, paragraphs 0074-0096).

  In the resin coating method of a semiconductor wafer described in Patent Document 2, the semiconductor wafer 4 is placed in the lower mold cavity 5, the semiconductor wafer 4 is sucked and fixed to the bottom surface of the cavity by the suction fixing means 31, and the semiconductor wafer 4 is mounted with bumps Resin 6 is supplied onto the surface, and upper and lower molds 1 and 2 are clamped. Thereafter, the cavity 5 is evacuated and the resin is heated and melted, and the film 7 is pressed against the tip of the bump 3 of the semiconductor wafer 4 by the pressing member 8 provided on the upper mold 1. The bump mounting surface is covered with resin (FIG. 1-3 of Patent Document 2, paragraph 0014).

  In the resin coating method for a semiconductor wafer described in Patent Document 3, the inclination of the bump mounting surface due to the uneven thickness of the semiconductor wafer 4 is corrected by the horizontal adjustment means 21 provided on the bottom surface of the lower mold cavity 5, The bump mounting surface is adjusted horizontally (FIGS. 1-2, paragraph 0016).

JP-A-2005-64456 JP 2000-260796 A JP 2000-254933 A

In the techniques of Patent Documents 1 to 3 described above, (1) the problem of damage to the semiconductor wafer surface during wafer clamping occurs, and (2) damage to the semiconductor wafer surface due to undissolved resin during resin molding occurs. Problems, (3) problems of voids or resin burrs in molded products, (4) problems of variations in thickness after molding due to low accuracy of the amount of molding resin supplied to the mold, (5) top and bottom There are problems such as damage to the semiconductor wafer due to the fact that the mold is not clamped in parallel with high accuracy, and the problem that resin molding that is parallel and uniform to the semiconductor wafer cannot be performed.
An object of the present invention is to improve at least a part of the above problems and to improve the quality of resin molding of a semiconductor device.

A resin molding apparatus for a semiconductor device according to one aspect of the present invention is a mold having an upper mold and a lower mold, and a clamp plate that is provided in the upper mold or the lower mold and clamps the semiconductor device. A clamp plate urged in a mold clamping direction by a biasing member, and one or a plurality of stoppers provided on the upper mold or the lower mold and stopping the position of the clamp plate at a predetermined position during mold clamping, Is provided. Here, the semiconductor device includes a semiconductor wafer on which a circuit is formed, individual semiconductor devices separated from the semiconductor wafer, a substrate on which the semiconductor device is mounted, and the like.
In the conventional clamping method, there was no stopper with only a spring structure and an unstable clamping state only with the spring pressure, but according to the resin molding apparatus for a semiconductor device according to one aspect of the present invention, the clamping direction by the biasing member The clamp plate urged by can be stopped at a desired position with high accuracy by the stopper. As a result, it is possible to prevent an excessive load from being applied to the semiconductor device such as a semiconductor wafer by clamping, and to suppress or prevent damage to the surface of the semiconductor device. Further, according to this resin molding apparatus, the upper and lower molds are accurately clamped in parallel, so that damage to the semiconductor device due to not being clamped in parallel, or resin molding that is parallel and uniform to the semiconductor device Can solve the problem that can not be.

In the resin molding apparatus of the semiconductor device, the stopper can be configured to allow fine adjustment of height and inclination. For example, the height and inclination can be finely adjusted by attaching a plurality of stoppers to the mold so as to be detachable and changing each stopper to a different height. Thereby, the inclination of the crank plate at the time of mold clamping can be suppressed or prevented.
According to this resin molding apparatus, the upper and lower molds can be accurately clamped in parallel by adjusting the height and inclination of the stopper. For this reason, it is possible to solve the problem that the semiconductor device is damaged due to the fact that the molds are not clamped in parallel, and the problem that resin molding that is parallel and uniform to the semiconductor device cannot be performed.

In the resin molding apparatus of the semiconductor device, the outer peripheral portion of the semiconductor device can be uniformly pressed by the clamp plate and the stopper.
The clamp plate presses the outer periphery of the semiconductor device evenly against the mold on the opposite side, eliminating the gap between the semiconductor device and the mold, thereby preventing the resin from entering the back side of the semiconductor device and forming resin burrs. Or it can be prevented.
Further, since the inside of the cavity is sealed at the clamp position, if the inside of the cavity is further evacuated, it is possible to suppress or prevent air accumulation more accurately and to prevent generation of voids.

The resin molding apparatus of the semiconductor device further includes a press mechanism that raises and lowers at least one of the upper mold and the lower mold, and the press mechanism is inserted into the slide guide through a moving platen having a main body and a slide guide. A shaft for guiding the moving platen in the vertical direction, and the slide guide may have a length larger than a thickness of a portion other than the slide guide arrangement portion of the main body.
It is possible to improve the elevating slide guide property of the moving platen of the press mechanism that drives the raising and lowering of the die, and to improve the parallel accuracy between the upper and lower die. Accordingly, the outer peripheral portion of the semiconductor device is uniformly clamped to prevent damage to the semiconductor device, and the molten resin in the resin molding process is spread evenly and parallel to the semiconductor device to form a uniform resin layer.

In the resin molding apparatus of the semiconductor device, one of the upper mold and the lower mold is configured such that the position in the vertical direction is fixed and the other is configured to be movable up and down in the vertical direction, and the semiconductor device has a position in the vertical direction. It can be set as the structure hold | maintained at the type | mold fixed.
In order to hold the back surface of the semiconductor device and the mold surface uniformly with an appropriate pressure without any gaps, the semiconductor device is held on the ascending / descending mold surface by holding the back surface of the semiconductor device in close contact with the fixed mold surface that does not move up and down. Therefore, the semiconductor device can be securely fixed with a low-cost and simple structure.

In the resin molding apparatus of the semiconductor device, the stopper may be arranged in a mold different from a mold in which the clamp plate is provided.
During clamping, the clamp plate can be accurately stopped at a desired position by a stopper provided on the mold opposite to the mold on which the clamp plate is disposed. The molding resin can be accurately formed in parallel with the semiconductor device with a predetermined thickness.

In the resin molding apparatus for the semiconductor device, the stopper may be arranged in a mold provided with the clamp plate.
It is also possible to stop at a fixed position with high accuracy by incorporating a stopper in the crank plate placement mold. Also in this case, the molding resin can be accurately formed in parallel with the semiconductor device with a predetermined thickness.

The resin molding apparatus of the semiconductor device may further include a resin metering unit that supplies resin to the semiconductor device before supplying the semiconductor device to a mold.
The resin is supplied onto the surface of the semiconductor device at the resin metering stage before the mold is supplied, and then the semiconductor device supplied with the resin is supplied into the mold. As described above, since the semiconductor device to which the resin has been supplied in advance is supplied to the mold by a single transfer, compared to the individual transfer method in which the resin is supplied to the mold after the semiconductor device is supplied to the mold as in the past, Cycle time can be shortened, leading to improved productivity. In addition, there is an effect that the resin supply is not restricted by the mold opening space and can be supplied accurately and efficiently.

In the resin molding apparatus of the semiconductor device, the resin weighing unit is measured by a resin feeder that supplies resin to the semiconductor device, a resin meter that measures the resin supplied to the semiconductor device, and the resin meter. And a control unit that feedback-controls the supply amount of the resin supply unit according to the value of weight.
In this case, it is possible to accurately supply the resin to the semiconductor device while measuring the coating amount and feeding back to the liquid resin supply machine. Thereby, the dispersion | variation in the thickness dimension after shaping | molding by the low precision of the amount of molding resin supply to a metal mold | die can be suppressed thru | or prevented.

In the resin molding apparatus for the semiconductor device, the resin may be a liquid resin.
By using a liquid molding resin as compared with a granular shape or a tablet shape, it is possible to suppress or prevent damage to the surface of the semiconductor device due to unmelted resin during mold clamping and molding.

A resin molding method for a semiconductor device according to one aspect of the present invention includes a step of pressing the outer peripheral portion of the semiconductor device with a clamp plate and clamping the clamp plate at a predetermined position with a stopper when the mold is clamped. And a step of resin-molding the semiconductor device.
In the conventional clamping method, there was no stopper with only a spring structure and an unstable clamping state only with the spring pressure, but according to the resin molding apparatus for a semiconductor device according to one aspect of the present invention, the clamping direction by the biasing member The clamp plate urged by can be stopped at a desired position with high accuracy by the stopper. Thereby, it is possible to prevent an excessive load from being applied to a semiconductor device such as a semiconductor wafer, and to suppress or prevent damage to the surface of the semiconductor device. Further, according to this resin molding apparatus, the upper and lower molds are accurately clamped in parallel, so that damage to the semiconductor device due to not being clamped in parallel, or resin molding that is parallel and uniform to the semiconductor device Can solve the problem that can not be.

In the resin molding method of the semiconductor device, the stopper may further include a step of finely adjusting a height and an inclination. For example, the height and inclination can be finely adjusted by attaching a plurality of stoppers to the mold so as to be detachable and changing each stopper to a different height. Thereby, the inclination of the crank plate at the time of mold clamping can be suppressed or prevented.
According to this resin molding apparatus, the upper and lower molds can be accurately clamped in parallel by adjusting the height and inclination of the stopper. For this reason, it is possible to solve the problem that the semiconductor device is damaged due to the fact that the molds are not clamped in parallel, and the problem that resin molding that is parallel and uniform to the semiconductor device cannot be performed.
Further, since the inside of the cavity is sealed at the clamp position, if the inside of the cavity is further evacuated, it is possible to suppress or prevent air accumulation more accurately and to prevent generation of voids.

In the resin molding method of the semiconductor device, in the step of stopping the clamp plate at a predetermined position by a stopper, the outer peripheral portion of the semiconductor device can be uniformly pressed by the clamp plate and the stopper.
The clamp plate presses the outer periphery of the semiconductor device evenly against the mold on the opposite side, eliminating the gap between the semiconductor device and the mold, thereby preventing the resin from entering the back side of the semiconductor device and forming resin burrs. Or it can be prevented.
Further, since the inside of the cavity is sealed at the clamp position, if the inside of the cavity is further evacuated, it is possible to suppress or prevent air accumulation more accurately and to prevent generation of voids.

The resin molding method of the semiconductor device further includes a step of raising and lowering at least one of the upper die and the lower die of the mold by a press mechanism. In this step, the moving platen of the press mechanism is moved except for the slide guide arrangement portion. At least one of the upper mold and the lower mold of the mold can be moved up and down by being guided in the vertical direction by a slide guide having a length larger than the thickness of the platen main body.
It is possible to improve the elevating slide guide property of the moving platen of the press mechanism that drives the raising and lowering of the mold, and to improve the parallel accuracy between the upper and lower molds. Accordingly, the outer peripheral portion of the semiconductor device is uniformly clamped to prevent damage to the semiconductor device, and the molten resin in the resin molding process is spread evenly and parallel to the semiconductor device to form a uniform resin layer.

In the resin molding method for the semiconductor device, one of the upper mold and the lower mold is configured such that a position in the vertical direction is fixed and the other is movable up and down in the vertical direction. The mold can be held in a fixed position.
In order to hold the back surface of the semiconductor device and the mold surface uniformly with an appropriate pressure without any gaps, the semiconductor device is held on the ascending / descending mold surface by holding the back surface of the semiconductor device in close contact with the fixed mold surface that does not move up and down. Therefore, the semiconductor device can be securely fixed with a low-cost and simple structure.

In the resin molding method of the semiconductor device, the stopper is disposed in a different mold from the mold in which the clamp plate is provided, and the clamp plate is stopped by the stopper on the different mold side when the mold is clamped. Can do.
During clamping, the clamp plate can be accurately stopped at a desired position by a stopper provided on the mold opposite to the mold on which the clamp plate is disposed. The molding resin can be accurately formed in parallel with the semiconductor device with a predetermined thickness.

In the resin molding method of the semiconductor device, the stopper is disposed in a mold provided with the clamp plate, and the clamp plate is stopped by the stopper even in the mold provided with the clamp plate when the mold is clamped. Can do.
It is also possible to stop at a fixed position with high accuracy by incorporating a stopper in the crank plate placement mold. Also in this case, the molding resin can be accurately formed in parallel with the semiconductor device with a predetermined thickness.

In the resin molding method of the semiconductor device, the resin can be supplied to the semiconductor device before the semiconductor device is supplied to the mold.
The resin is supplied onto the surface of the semiconductor device at the resin metering stage before the mold is supplied, and then the semiconductor device supplied with the resin is supplied into the mold. As described above, since the semiconductor device to which the resin has been supplied in advance is supplied to the mold by a single transfer, compared to the individual transfer method in which the resin is supplied to the mold after the semiconductor device is supplied to the mold as in the past, Cycle time can be shortened, leading to improved productivity. Resin supply is not restricted by the mold opening space, and there is an effect that the resin can be supplied accurately and efficiently.

In the resin molding method of the semiconductor device, in the step of supplying the resin, in a state where the semiconductor device is mounted on the resin weighing machine, the resin is fed onto the semiconductor device by the liquid resin feeding machine, and the resin weighing machine A resin molding method for a semiconductor device, wherein feedback control is performed to control a supply amount of the resin feeder in accordance with a weight value measured in (1).
In this case, it is possible to accurately supply the resin to the semiconductor device while measuring the coating amount and feeding back to the liquid resin supply machine. Thereby, the dispersion | variation in the thickness dimension after shaping | molding by the low precision of the amount of molding resin supply to a metal mold | die can be suppressed thru | or prevented.

In the semiconductor device resin molding method of the semiconductor device, the resin may be a liquid resin.
By using a liquid molding resin as compared with a granular shape or a tablet shape, it is possible to suppress or prevent damage to the surface of the semiconductor device due to unmelted resin during mold clamping and molding.

A resin molding apparatus for a semiconductor device according to one aspect of the present invention includes a mold having an upper mold and a lower mold, and a resin weighing unit that supplies resin to the semiconductor apparatus before supplying the semiconductor apparatus to the mold. .
The resin is supplied onto the surface of the semiconductor device at the resin metering stage before the mold is supplied, and then the semiconductor device supplied with the resin is supplied into the mold. As described above, since the semiconductor device to which the resin has been supplied in advance is supplied to the mold by a single transfer, compared to the individual transfer method in which the resin is supplied to the mold after the semiconductor device is supplied to the mold as in the past, Cycle time can be shortened, leading to improved productivity.

In the resin molding apparatus of the semiconductor device, the resin measurement unit is measured by the resin supply machine that supplies the resin to the semiconductor device, the resin measurement machine that measures the semiconductor device supplied with the resin, and the resin measurement machine. And a control unit that feedback-controls the supply amount of the resin supply unit according to the value of weight.
In this case, it is possible to accurately supply the resin to the semiconductor device while measuring the coating amount and feeding back to the liquid resin supply machine. Thereby, the dispersion | variation in the thickness dimension after shaping | molding by the low precision of the amount of molding resin supply to a metal mold | die can be suppressed thru | or prevented.

According to one aspect of the present invention, there is provided a resin molding method for a semiconductor device, the step of supplying resin to the semiconductor device before supplying the semiconductor device to a mold, and the semiconductor device supplied with the resin to the mold And a step of clamping the mold and resin-molding the semiconductor device.
The resin is supplied onto the surface of the semiconductor device at the resin metering stage before the mold is supplied, and then the semiconductor device supplied with the resin is supplied into the mold. As described above, since the semiconductor device to which the resin has been supplied in advance is supplied to the mold by a single transfer, compared to the individual transfer method in which the resin is supplied to the mold after the semiconductor device is supplied to the mold as in the past, Cycle time can be shortened, leading to improved productivity.

In the resin molding method of the semiconductor device, in the step of supplying the resin, the resin is supplied to the semiconductor device by the resin feeder while the semiconductor device is placed on the resin meter, and the resin meter The supply amount of the liquid resin feeder can be fed back according to the measured weight value.
In this case, it is possible to accurately supply the resin to the semiconductor device while measuring the coating amount and feeding back to the liquid resin supply machine. Thereby, the dispersion | variation in the thickness dimension after shaping | molding by the low precision of the amount of molding resin supply to a metal mold | die can be suppressed thru | or prevented.

It is explanatory drawing which shows resin supply to the semiconductor wafer in a resin measurement stage. It is a longitudinal cross-sectional view at the time of semiconductor wafer carrying-in of the resin molding apparatus which concerns on one Embodiment. It is a longitudinal cross-sectional view at the time of the mold clamping of the resin molding apparatus which concerns on one Embodiment. It is a longitudinal cross-sectional view at the time of cavity volume reduction | decrease of the resin molding apparatus which concerns on one Embodiment. It is a longitudinal cross-sectional view of the resin molding apparatus which concerns on a modification. It is a longitudinal cross-sectional view of the conventional press mechanism. It is a longitudinal cross-sectional view of the press mechanism which concerns on one Embodiment. It is a cross-sectional view of the resin molding apparatus for demonstrating the positional relationship of a semiconductor wafer and a stopper.

  Hereinafter, a resin molding apparatus and a resin molding method according to an embodiment of the present invention will be described with reference to the drawings. In this specification, the semiconductor device includes a semiconductor wafer on which a circuit is formed, individual semiconductor devices separated from the semiconductor wafer, a substrate on which the semiconductor device is mounted, and the like. In the following description, a semiconductor wafer is taken as an example, but the present invention can be similarly applied to individual semiconductor devices, substrates and the like.

FIG. 1 is a diagram showing resin supply to a semiconductor wafer 1 in a resin weighing stage (resin weighing unit). The resin metering stage is provided separately from the die press machine in the resin molding apparatus. The resin weighing stage may be arranged in the same system as the mold press machine or may be arranged in another system.
In the present embodiment, the resin supply to the semiconductor wafer 1 is performed before the semiconductor wafer 1 is supplied to the mold 104. The resin weighing stage includes a liquid resin supply machine 102 and a resin weighing machine 103. The liquid resin supply machine 102 is a liquid resin supply device such as a dispenser. The resin weighing machine 103 has a mounting portion for mounting the semiconductor wafer 1, measures the weight of the semiconductor wafer 1 before and after the liquid resin is supplied, and compares the two to compare the weight of the resin (amount of application). Is calculated. The calculated resin weight is transmitted to a control unit (not shown). The control unit can be built in the liquid resin feeder 102 or can be provided separately. The control unit receives the weight of the resin output from the resin weighing machine 103, and feeds back the discharge amount of the liquid resin supply machine 102 so that a preset resin amount is supplied to the semiconductor wafer 1 based on the weight. Control.

  After supplying a predetermined amount of resin to the semiconductor wafer 1, the semiconductor wafer 1 is unloaded from the resin weighing stage by the transfer robot 101, inverted 180 degrees up and down, and loaded into the mold 104 as shown in FIG.

  2 to 4 are longitudinal sectional views of a resin molding apparatus according to an embodiment, FIG. 2 is a longitudinal sectional view when a semiconductor wafer is carried in, FIG. 3 is a longitudinal sectional view when a mold is clamped, and FIG. 4 is a cavity volume. The longitudinal cross-sectional view at the time of reduction is shown. As shown in FIGS. 2 to 4, the resin molding apparatus according to the present embodiment includes a mold 104 having an upper mold 105 and a lower mold 106, and a lower mold 106 in a mold clamping direction by a first spring 108. A clamp plate 107 that is urged and a plurality of upper stoppers 112 that surround the cavity 113 in the upper mold 105 are provided. An upper mold holder 110 that is urged in the mold clamping direction by the second spring 111 is provided in the upper mold 105 inside the upper stopper 112. In the upper mold 105, a wafer receiver 109 is disposed inside the upper mold holder 110.

  The clamp plate 107 is arranged in an annular shape so as to surround the outer periphery of the cavity 113, and has an annular protrusion 107 a on the cavity 113 side. The annular protrusion 107 a comes into contact with the back surface of the semiconductor wafer 1 during clamping and clamps the semiconductor wafer 1, and is provided over substantially the entire outer periphery of the semiconductor wafer 1. Note that a part of the annular protrusion 107a may be omitted as long as the outer peripheral portion of the semiconductor wafer 1 can be pressed substantially uniformly. That is, a configuration may be employed in which a part of the annular protrusion 107a is not continuous and does not contact the semiconductor wafer 1 at that part. A first spring 108 is installed below the clamp plate 107 between the clamp plate 107 and the lower mold 106 so as to urge the clamp plate 107 in the mold clamping direction.

  FIG. 8 is a cross-sectional view of the resin molding apparatus for explaining the positional relationship between the semiconductor wafer 1 and the stopper. As shown in the drawing, eight upper stoppers 112 are arranged at equal intervals so as to surround the outer periphery of the semiconductor wafer 1. Each upper stopper 112 is detachably attached to the upper mold 105. By preparing a plurality of upper stoppers 112 having different heights and replacing them with the upper stoppers 112 having different heights, the height of the upper stopper 112 can be changed. Further, it is possible to finely adjust the height, inclination, etc. of the upper stopper 112 by replacing a part of the plurality of upper stoppers 112 with those slightly different in height. For example, in FIG. 2, when the distance between the upper mold 105 and the lower mold 106 at the time of clamping is wider on the left side of the paper than on the right side of the paper (the lower mold 106 has the left side of the paper below the right side). In the case of tilting in such a manner, the tilt of the clamp plate at the time of clamping can be adjusted by replacing the upper stopper 112 on the right side of the paper with a higher height.

  The upper mold holder 110 is provided on the upper mold 105 inside the upper stopper 112. A second spring 111 is arranged between the upper mold holder 110 and the upper mold 105 so as to urge the upper mold holder 110 in the mold clamping direction. A seal member such as an O-ring is attached to the lower surface of the upper mold holder 110. When the mold is clamped, the upper mold holder 110 is in close contact with the clamp plate 107 and hermetically seals the cavity 113 as shown in FIG. .

  The wafer receiver 109 is disposed inside the upper mold holder 110 in the upper mold 105. The wafer receiver 109 is a mechanism for receiving and holding the semiconductor wafer 1 from the wafer transfer robot 101 as shown in FIG. The wafer receiver 109 holds the portion of the semiconductor wafer 1 where the circuit 2 is not formed on the outer periphery of the circuit 2 formation surface, and moves to the side opposite to the cavity 113 (the direction opposite to the mold clamping direction). 1 Temporarily press and hold the back surface of the upper mold 105 (see the state of FIG. 3). At this time, the semiconductor wafer 1 may be held on the upper mold 105 by vacuum suction of the back surface of the wafer 1 to the upper mold 105 surface by air suction.

  Hereinafter, the resin forming method of the semiconductor device according to the present embodiment will be described with reference to FIGS. 1 to 4.

1. Molding resin measurement and supply process (Fig. 1)
In the present embodiment, the resin supply to the semiconductor wafer 1 is performed before the semiconductor wafer 1 is placed on the mold 104. The resin is supplied at a resin weighing stage (FIG. 1) before the semiconductor wafer is supplied to the mold. As shown in FIG. 1, the semiconductor wafer 1 is placed on a resin weighing machine 103 of the resin weighing stage with the surface of the semiconductor wafer 1 on the side where the circuit 2 such as the protruding electrodes and wirings is formed facing up. Then, a preset supply amount of the liquid resin 3 is supplied to the surface of the semiconductor wafer 1 where the circuit 2 is formed, and is held by coating adhesive or the like. The supply of the liquid resin 3 can be performed by a liquid resin supply machine 102 such as a dispenser, for example. The resin supply amount is set by setting the discharge amount of the liquid resin supply machine 102. The semiconductor wafer 1 is placed on the resin weighing machine 103, and the resin is applied while weighing. The discharge amount of the liquid resin supply machine 102 is automatically finely adjusted while feeding back the actual application quantity information to the control unit of the liquid resin supply machine 102. adjust.

  The viscosity of the liquid resin 3 is so high that it does not hinder the conveyance of the wafer 1 after coating. Although a liquid resin is used here, the molding resin may be a sheet-like resin. The holding of the molding resin on the surface of the wafer 1 may be held by a cage in addition to coating adhesion. As the cage, for example, a strip-shaped film is adopted, and the coating resin on the wafer is covered with the strip-shaped film. Thereafter, after the wafer 1 is conveyed to the mold 104, the strip-shaped film is resin-molded as it is, and the strip-shaped film is used for releasing after the resin molding. In this case, the strip-shaped film can be used for both holding and releasing of the resin, and there is no need to provide a separate release film (film 4 in FIG. 2).

  In this embodiment, since the resin supply is applied to the surface of the wafer 1 before supplying the mold of the wafer 1, the resin supply is restricted to the mold opening space as in the case of supplying the resin to the wafer after being installed on the mold. There is an effect that can be supplied accurately and efficiently.

2. Mold supply process for resin-supplied wafer (Figure 2)
The opposite surface (back surface) of the wafer 1 coated and adhered with the liquid resin 3 is held by a transfer machine, for example, a vacuum suction type wafer transfer robot 101, as shown in FIG. 1, and the wafer as shown in FIG. The wafer 1 is rotated up and down 180 degrees so that the circuit 2 formation / resin application surface of 1 is on the molding cavity 113 side, and is transferred to the mold 104 with the back surface of the wafer 1 facing up, and is built in the upper mold 105 Is placed on the wafer receiver 109.

  As shown in FIG. 2, the wafer receiver 109 holds a portion where the circuit 2 is not formed on the outer periphery of the circuit 2 formation surface of the semiconductor wafer 1. The wafer receiver 109 is moved to the side opposite to the cavity 113, and the back surface of the wafer 1 is temporarily pressed and held on the surface of the upper mold 105 (see the state of FIG. 3). At this time, the wafer 1 may be held on the upper mold 105 by vacuum suction of the back surface of the wafer 1 to the upper mold 105 surface by air suction.

  According to such a semiconductor wafer mold supply method, the wafer 1 and the liquid resin 3 can be supplied to the mold 104 by a single operation, so that the effect of shortening the molding cycle time and rationalizing or simplifying the apparatus structure can be realized. Yes.

3. Film tensioning process (Figure 2)
Further, the film 4 is stretched on the cavity 113 formed in the lower mold 106 as shown in FIG.

4). Clamping and wafer clamping process (Figure 3)
The film 4 is sucked into air through an air suction hole (not shown) and is brought into close contact with the cavity 113. After that, the lower mold 106 is raised by the press mechanism described later in FIG. 7 to close the mold 104, and the annular protrusion of the clamp plate 107 is pressed by the clamp mechanism 107 and the spring 1108 formed in the lower mold 106. The portion 107 a presses a portion that does not interfere with the wafer receiver 109 on the outer peripheral portion (outside the range of circuit formation) of the circuit 2 formation surface of the wafer 1. With this configuration, the wafer 1 is pressed and held by the upper mold 105 in a state of being accurately parallel to the lower surface of the cavity 113. At this time, a cavity 113 in which the upper mold 105 and the lower mold 106 are sealed in parallel with high accuracy without gap is formed by a pressing mechanism using the upper mold holder 110 and the second spring 111 configured in the upper mold 105.
Here, the case where the position of the upper mold 105 is fixed and the lower mold 106 is raised to close the mold 104 has been described, but the position of the lower mold 106 is fixed and the upper mold 105 is lowered. Then, the mold 104 may be closed.

  Further, the clamp plate 107 of the lower mold 106 is stopped on the stopper 112 of the upper mold 105, and the wafer 1 is not clamped, that is, not pressed beyond the set value. This has an effect of not damaging the wafer 1 by excessive clamping.

  At this time, the clamp plate 107 clamps the back surface of the semiconductor wafer 1 over the entire circumference of the wafer 1 by the annular protrusion 107a. Further, since the annular protrusion 107a of the clamp plate 107 presses the outer periphery of the wafer 1 properly and evenly over the entire periphery, there is an effect of preventing resin leakage to the back surface of the wafer 1. In addition, as long as the outer peripheral part of the wafer 1 can be pressed substantially uniformly, a configuration in which a part of the annular protrusion 107a is omitted may be employed. That is, a configuration may be employed in which a part of the annular protrusion 107a is not continuous and does not contact the semiconductor wafer 1 at that part.

  As shown in FIG. 8, a plurality of upper stoppers 112 (eight in FIG. 8) are arranged on the circumference so as to surround the wafer 1 outside the wafer 1, and each upper stopper 112 is detachable. It is configured. By preparing a plurality of upper stoppers 112 having different heights and replacing them with the upper stoppers 112 having different heights, the height of the upper stopper 112 can be changed. In addition, since each upper stopper 112 can be individually replaced with one having a slightly different height, a part of the plurality of upper stoppers 112 is replaced with one having a slightly different height so that the upper stopper 112 can be replaced. Fine adjustments such as height and inclination are possible.

  The cavity 113 can be brought into a predetermined vacuum state by sucking air with a vacuum drawing mechanism (not shown). This has the effect of preventing voids.

5. Resin Molding Step In FIG. 3, after the mold 104 is clamped and the semiconductor wafer 1 is clamped, the mold 104 is heated to start melting the liquid resin 3. As the mold is clamped, the molten liquid resin 3 is pressed and spread evenly in the cavity 113 by the cavity 113 formed by the upper mold 105 and the lower mold 106 which are accurately closed in parallel. Further, since the resin is liquid and melted, it has an effect of suppressing or preventing damage to the surface of the wafer 1 and the circuit 2.

  Thereafter, as shown in FIG. 4, the lower mold 106 is further raised to reduce the volume of the cavity 113, and is held at a predetermined molding thickness position until the resin is cured and molding is completed.

As another method, as shown in FIG. 5, a lower stopper 114 is further disposed below the clamp plate 107 of the lower mold 106, and the lower stopper 114 built in the lower mold 106 is fixed at the time of clamping. It may be brought into contact with the back surface of the clamp plate 107 and stopped at a certain position with high accuracy, and held at a predetermined molding thickness position until the molding is completed. At this time, the molding resin can be accurately formed in parallel with the wafer 1 with a predetermined thickness. As with the upper stopper 112 described above, the lower stopper 114 can be finely adjusted such as height and inclination.
5 illustrates the configuration in which the lower stopper 114 is provided in addition to the upper stopper 112, the upper stopper 112 may be omitted, and the lower stopper 114 may be provided instead of the upper stopper 112. Also in this case, when the mold is clamped, the lower stopper 114 comes into contact with the clamp plate 107 and can be accurately stopped at a certain position, and can be held at a predetermined molding thickness position until the molding is completed. Can be formed in parallel with the wafer 1.

6). Molded wafer removal step After the molding is completed, the mold 104 is opened, and the molded wafer 1 is released and removed.

7). Improving mold parallel accuracy (Figs. 6 and 7)
FIG. 6 is a longitudinal sectional view of a conventional pressing mechanism, and FIG. 7 is a longitudinal sectional view of a pressing mechanism according to an embodiment of the present invention. Conventionally, as shown in FIG. 6, a mold lifting guide of a molding press moves up and down while being held in parallel with a shaft (shaft) 203 by a slide guide 202A built in a moving platen 201A. However, in reality, the accuracy of the parallelism between the upper mold 105 and the lower mold 106 is reduced due to the accuracy of the press mechanism 200, the mold structure, the balance of the clamping fastening force, and the like, and the mold 104 is tilted. It was fastened and molded at the end, resulting in resin leakage. Therefore, in the present embodiment, the guide property is improved by taking a long guide (guide portion) with respect to the shaft 203 like a slide guide 202B built in the moving platen 201B shown on the right side of FIG. Maintain parallel accuracy. That is, the slide guide 202B having a length larger than the thickness of the moving platen main body other than the portion where the slide guide 202B is disposed is provided. As a result, the outer periphery of the wafer is clamped evenly to suppress or prevent damage to the wafer 1, and the molten resin in the resin molding process is spread evenly and parallel to the wafer to form a uniform resin layer. Can be prevented.

  In addition, you may divide | segment a guide into plurality like the slide guide 202C shown on the left side of FIG.

  In FIG. 7, the slide guide 202B and the slide guide 202C are shown in the same drawing for convenience of explanation. However, only the integral slide guide 202B is provided, the divided slide guide 202C is provided, and FIG. Any of the configurations in which both are mixed may be adopted.

  According to the embodiment, the clamp plate 107 urged in the mold clamping direction by the first spring 108 can be stopped at a desired position with high accuracy by the stopper 112. Thereby, it is possible to prevent an excessive load from being applied to the semiconductor wafer 1 by clamping, and to suppress or prevent damage to the surface of the semiconductor wafer 1. Further, according to this resin molding apparatus, since the upper and lower molds are clamped in parallel with high accuracy, damage to the semiconductor wafer 1 resulting from the fact that the molds are not clamped in parallel, or parallel to the semiconductor wafer 1 and even The problem that resin molding cannot be performed can be solved.

According to the above-described embodiment, a plurality of stoppers 112 or 114 are detachably attached to the mold 104, and each stopper 112 or 114 is individually changed to a different height so that the height and inclination can be finely adjusted. Is possible. Thereby, the inclination of the crank plate 107 during mold clamping can be suppressed or prevented.
Moreover, according to this resin molding apparatus, the upper and lower molds can be clamped in parallel with high accuracy by adjusting the height and inclination of the stopper 112 or 114. For this reason, it is possible to solve the problem of damage to the semiconductor wafer caused by not being clamped in parallel, and the problem that resin molding that is parallel and uniform to the semiconductor wafer cannot be performed.

According to the above embodiment, the clamp plate 107 uniformly presses the outer periphery of the semiconductor wafer 1 against the mold on the opposite side, eliminating the gap between the semiconductor wafer and the mold, so that the resin wraps around the back side of the semiconductor wafer. It is possible to suppress or prevent the formation of resin burrs.
Further, since the cavity 113 is hermetically sealed at the clamp position, if the inside of the cavity is further evacuated, it is possible to suppress or prevent air accumulation more accurately and to prevent generation of voids.

  According to the embodiment, it is possible to improve the elevating slide guide property of the moving platens 201B and 201C of the press mechanism 200 that drives the raising and lowering of the mold, and to improve the parallel accuracy between the upper and lower molds. Thereby, the outer peripheral part of the semiconductor wafer 1 is clamped uniformly, damage to the semiconductor wafer is suppressed, and the molten resin in the resin molding process is spread evenly and parallel to the semiconductor wafer to form a uniform resin layer.

  According to the above-described embodiment, in order to hold the back surface of the semiconductor wafer 1 and the mold surface uniformly with appropriate pressure without gaps, the back surface of the semiconductor wafer is held in close contact with the fixed mold surface that does not move up and down. Rather than holding the semiconductor wafer on the ascending / descending side mold surface, the semiconductor wafer can be securely fixed with a low cost and simple structure.

  According to the above embodiment, the clamp plate 107 is accurately stopped at a desired position by the stopper 112 provided on the mold 105 opposite to the mold 106 on which the clamp plate 107 is disposed, at the time of mold clamping. Can do. The molding resin can be accurately formed in parallel with the semiconductor wafer with a predetermined thickness.

  In addition, it is possible to stop at a fixed position with high accuracy by incorporating the stopper 114 in the crank plate placement mold 106. Also in this case, the molding resin can be accurately formed in parallel with the semiconductor wafer with a predetermined thickness.

  According to the embodiment, the resin is supplied onto the surface of the semiconductor wafer 1 at the resin metering stage before the mold is supplied, and then the semiconductor wafer 1 supplied with the resin is supplied into the mold 104. Thus, since the semiconductor wafer 1 to which the resin has been supplied in advance is supplied to the mold 104 by a single transfer, compared to the individual transfer system in which the semiconductor wafer is supplied to the mold and then the resin is supplied to the mold as in the past, Equipment cycle time can be shortened, leading to improved productivity. In addition, there is an effect that the resin supply is not restricted by the mold opening space and can be supplied accurately and efficiently.

  According to the embodiment, the resin can be supplied to the semiconductor wafer 1 with high accuracy while measuring the coating amount and feeding it back to the liquid resin supplier 102. Thereby, the dispersion | variation in the thickness dimension after shaping | molding by the low precision of the amount of molding resin supply to a metal mold | die can be suppressed thru | or prevented.

According to the above embodiment, since liquid molding resin is used, damage to the semiconductor wafer surface due to unmelted resin during mold clamping and molding is suppressed as compared with the case where granular or tablet resin is used. Can be prevented.
Although only a few embodiments of the present invention have been described above, various modifications or improvements can be made to the illustrated embodiments without substantially departing from the novel teachings and advantages of the present invention. Will be easily understood by those skilled in the art. Therefore, it is intended that the embodiment added with such changes or improvements is also included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Wafer 2 Circuit 3 Liquid resin 4 Film 101 Wafer transfer robot 102 Liquid resin supply machine 103 Resin metering machine 104 Mold 105 Upper mold 106 Lower mold 107 Clamp plate 108 First spring 109 Wafer receiver 110 Upper mold holder 111 Second Spring 112 Upper stopper 113 Cavity 114 Lower stopper 200 Press mechanism 201A, 201B Moving platen 202A, 202B, 202C Slide guide

Claims (26)

A resin molding apparatus for semiconductor devices,
A mold having an upper mold and a lower mold;
A clamp plate for clamping the semiconductor device, provided on the upper mold or the lower mold, and biased in a mold clamping direction by a biasing member;
One or a plurality of stoppers provided on the upper mold or the lower mold and stopping the position of the clamp plate at a predetermined position during mold clamping;
A resin molding apparatus for semiconductor devices. The resin molding apparatus for a semiconductor device according to claim 1,
The stopper is a resin molding apparatus for a semiconductor device, which is configured to allow fine adjustment of height and inclination. In the resin molding apparatus of the semiconductor device according to claim 1 or 2,
A resin molding apparatus for a semiconductor device, wherein the outer peripheral portion of the semiconductor device is uniformly pressed by the clamp plate and the stopper. In the resin molding apparatus of the semiconductor device according to claim 1 or 2,
A press mechanism for raising and lowering at least one of the upper mold and the lower mold;
The press mechanism includes a moving platen having a main body and a slide guide, and a shaft that passes through the slide guide and guides the moving platen in the vertical direction.
The resin molding apparatus for a semiconductor device, wherein the slide guide has a length larger than a thickness of a portion other than the slide guide arrangement portion of the main body. A resin molding apparatus for a semiconductor device according to any one of claims 1 to 4,
One of the upper mold and the lower mold is configured such that the vertical position is fixed and the other is movable up and down, and the semiconductor device is held by a mold whose vertical position is fixed. Resin molding equipment for semiconductor devices. In the resin molding apparatus of the semiconductor device in any one of Claims 1 thru | or 5,
The resin molding apparatus for a semiconductor device, wherein the stopper is disposed in a mold different from a mold in which the clamp plate is provided. In the resin molding apparatus of the semiconductor device in any one of Claims 1 thru | or 6,
The said stopper is a resin molding apparatus of a semiconductor device arrange | positioned at the type | mold with which the said clamp plate is provided. In the resin molding apparatus of the semiconductor device in any one of Claims 1 thru | or 7,
A resin molding apparatus for a semiconductor device, further comprising: a resin metering unit that supplies resin to the semiconductor device before the semiconductor device is supplied to the mold. The resin molding apparatus for a semiconductor device according to claim 8,
The resin metering unit is
A resin feeder for supplying resin to the semiconductor device;
A resin weighing machine for weighing a semiconductor device supplied with resin;
A control unit that feedback-controls the supply amount of the resin supply machine according to the weight value measured by the resin weighing machine;
A resin molding apparatus for a semiconductor device.   10. The resin molding apparatus for a semiconductor device according to claim 1, wherein the resin is a liquid resin.   11. The resin molding apparatus for a semiconductor device according to claim 1, wherein the semiconductor device includes a semiconductor wafer, individual semiconductor devices separated from the semiconductor wafer, and a substrate on which the semiconductor device is placed. A resin molding apparatus for semiconductor devices. A resin molding method for a semiconductor device,
A step of pressing the outer peripheral portion of the semiconductor device with a clamp plate at the time of mold clamping, and stopping the clamp plate at a predetermined position by a stopper;
A step of resin-molding the semiconductor device;
A resin molding method for a semiconductor device. The resin molding method for a semiconductor device according to claim 12,
The method of resin molding a semiconductor device, wherein the stopper further includes a step of finely adjusting the height and inclination. In the resin molding method of the semiconductor device according to claim 12 or 13,
A resin molding method for a semiconductor device, wherein in the step of stopping the clamp plate at a predetermined position by a stopper, an outer peripheral portion of the semiconductor device is uniformly pressed by the clamp plate and the stopper. In the resin molding method of the semiconductor device according to claim 12 or 13,
The method further includes the step of raising and lowering at least one of the upper die and the lower die of the mold by a press mechanism. In this step, the moving platen of the press mechanism is made thicker than the portion of the moving platen main body other than the slide guide arrangement portion. The resin molding method of the semiconductor device, wherein at least one of an upper mold and a lower mold of the mold is moved up and down by being guided in a vertical direction by a slide guide having a large length. A resin molding method for a semiconductor device according to any one of claims 12 to 15,
One of the upper mold and the lower mold is configured such that a position in the vertical direction is fixed, and the other is configured to be movable up and down in the vertical direction, and the semiconductor device holds the semiconductor device in a mold in which the position in the vertical direction is fixed Resin molding method for equipment. In the resin molding method of the semiconductor device according to claim 12,
The stopper is arranged in a mold different from the mold in which the clamp plate is provided,
A resin molding method for a semiconductor device, wherein the clamp plate is stopped by the stopper on the different mold side during mold clamping. In the resin molding method of the semiconductor device according to claim 12,
The stopper is arranged in a mold provided with the clamp plate,
A resin molding apparatus for a semiconductor device, wherein the clamp plate is stopped by the stopper even in a mold provided with the clamp plate during mold clamping. In the resin molding method of the semiconductor device according to claim 12,
A resin molding method for a semiconductor device, wherein a resin is supplied to the semiconductor device before the semiconductor device is fed to a mold. In the resin molding method of the semiconductor device according to claim 19,
In the step of supplying the resin,
While the semiconductor device is mounted on the resin weighing machine, the resin is supplied to the semiconductor device by the liquid resin supply machine, and the supply amount of the resin supply machine is set according to the weight value measured by the resin weighing machine. A resin molding method for a semiconductor device, which performs feedback control.   21. A resin molding method for a semiconductor device of a semiconductor device according to claim 12, wherein the resin is a liquid resin.   The resin molding method for a semiconductor device according to any one of claims 12 to 21, wherein the semiconductor device includes a semiconductor wafer, individual semiconductor devices separated from the semiconductor wafer, and a substrate on which the semiconductor device is mounted. A resin molding method for a semiconductor device. A resin molding apparatus for semiconductor devices,
A mold having an upper mold and a lower mold;
A resin molding apparatus for a semiconductor device, comprising: a resin metering unit that supplies resin to the semiconductor device before supplying the semiconductor device to a mold. The resin molding apparatus for a semiconductor device according to claim 23,
The resin metering unit is
A resin feeder for supplying resin to the semiconductor device;
A resin weighing machine for weighing a semiconductor device supplied with resin;
A control unit that feedback-controls the supply amount of the resin supply machine according to the weight value measured by the resin weighing machine;
A resin molding apparatus for a semiconductor device. A resin molding method for a semiconductor device,
Supplying a resin to the semiconductor device before supplying the semiconductor device to the mold;
Supplying a semiconductor device supplied with the resin to a mold;
Clamping the mold and resin-molding the semiconductor device;
A resin molding method for a semiconductor device. In the resin molding method of the semiconductor device according to claim 25,
In the step of supplying the resin,
While the semiconductor device is mounted on the resin weighing machine, the resin is fed onto the semiconductor device by the resin feeding machine, and the supply amount of the liquid resin feeding machine is set according to the weight value measured by the resin weighing machine. A method of resin molding of a semiconductor device for feedback.

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