WO2018139631A1

WO2018139631A1 - Resin sealing device and resin sealing method

Info

Publication number: WO2018139631A1
Application number: PCT/JP2018/002656
Authority: WO
Inventors: 義和大谷; 寛治森; 光高橋
Original assignee: 信越エンジニアリング株式会社
Priority date: 2017-01-30
Filing date: 2018-01-29
Publication date: 2018-08-02
Also published as: TW201832892A; WO2018138915A1

Abstract

In order to accommodate various molded article type changes by merely exchanging a second molding die, the present invention is equipped with: a first molding die having a pressing section for a workpiece having a semiconductor element mounted thereon; a second molding die having a cavity to which an uncured resin is supplied and provided so as to face the workpiece mounting surface on which the semiconductor element is mounted; an openable/closable sealing chamber formed between the first molding die and the second molding die; a drive unit for moving the first molding die and/or the second molding die in a manner such that the first and second molding dies become closer relative to one another in the direction in which the dies face one another; a pressurization mechanism having a plunger for applying pressure to the uncured resin inside the cavity in the sealed chamber; and a control unit for controlling the operation of the drive unit and the plunger. Therein, the pressurization mechanism has an uncured resin overflow channel provided in the second molding die inside the sealed chamber so as to be continuous with the cavity, and a plunger provided in the second molding die so as to be capable of moving and projecting toward the overflow channel. The first molding die has a first covering section provided so as to face the cavity, a second covering section provided so as to face the overflow channel, and a third covering section provided so as to face the plunger. The first covering section, the second covering section, and the third covering section are continuously formed with one another. The control unit controls the drive unit so as to immerse the workpiece mounting surface and the semiconductor element in the uncured resin inside the cavity, by moving the first and second molding dies so as to approach one another, and while in a state where the uncured resin inside the cavity has flowed into the overflow channel in response to the immersion, causes the plunger to move and project into the overflow channel toward the third covering section.

Description

Resin sealing device and resin sealing method

The present invention relates to a resin sealing apparatus used for manufacturing a molded product in which a workpiece on which a semiconductor element is mounted is manufactured in order to create a package such as a semiconductor package, and a resin sealing for manufacturing the package. It relates to the stopping method.

Conventionally, as this type of resin sealing device, there is provided an upper mold having a holding mechanism for holding a substrate on the lower surface, and a lower mold having a cavity located below the upper mold, on which a semiconductor chip is mounted. There is a compression molding device that holds the upper mold and clamps the lower mold and the upper mold by lowering the upper mold with respect to the lower mold after the resin is supplied to the cavity (see, for example, Patent Document 1). .
Thus, molding is performed by heating and pressing the resin, and a sealing body made of the resin is formed on the lower surface side of the substrate. The substrate is transported to the lower surface of the upper mold by the carry-in transport unit, and the substrate is vacuum-sucked and held by the holding mechanism. The resin is an epoxy resin powder resin. After being supplied to the cavity by the powder resin metering unit and the powder resin supply unit, the resin is melted by heating.
The lower mold includes a pair of flow cavities formed of depressions positioned on the outside of a pair of long sides in a rectangular cavity, a plurality of flow gates formed of grooves communicating with the cavity and the flow cavities, and a pair of short sides on the cavity. And an air vent composed of a continuous groove. Resin melted by clamping the lower mold and the upper mold flows into the pair of flow cavities, and the air remaining in the cavities is discharged out of the cavities by the air vent.
The upper mold is provided with two (flow cavity) plungers facing the pair of flow cavities of the lower mold. After clamping the lower mold and the upper mold, the two plungers enter the pair of flow cavities. I am in control.
As a result, the melted resin in the pair of flow cavities is pressurized by the intrusion of the two plungers, so that the pressure of the resin in the cavities by mold clamping and the pressure of the resin in the pair of flow cavities are reduced. It is set to be the same. As a result, since the resin in the entire cavity is cured under an appropriate pressure, generation of bubbles (voids) inside the sealing body is suppressed.
After that, the sealing body is taken out by releasing the lower mold and the upper mold.

International Publication No. 2006/100765

By the way, there are not only many types of semiconductor elements and workpieces, but also various types of products with different external shapes and sizes. is there. In a resin sealing device, when a product type change occurs in molded products having different outer shapes and sizes, it is necessary to change the shape and size of the cavity and the arrangement and number of plungers.
However, in the compression molding apparatus described in Patent Document 1, since the cavity is provided in the lower mold and the plunger is provided in the upper mold, the lower mold and the upper mold must be exchanged when changing the type of the molded product. The shape and size of the cavity and the arrangement and number of plungers cannot be changed in accordance with the change in the type of the molded product.
As a result, when changing the type of the molded product, it takes time and labor to replace the lower mold and the upper mold, which is not only cumbersome, but also has a problem that the operation stoppage becomes longer due to longer operation stop time. When it is necessary to frequently change the type of the molded product, there has been a problem that the operation rate is remarkably lowered due to frequent operation stoppage accompanying the replacement work of the lower mold and the upper mold.
Furthermore, since it is necessary to provide not only the plunger but also a driving source for the plunger, the upper die becomes heavy. As a result, the drive unit for lowering the upper mold relative to the lower mold also becomes larger, so that there is a problem that the entire apparatus is increased in size and cost. There is also a problem that the maintenance of the plunger can be performed without removing the upper mold after removing the lower mold from the apparatus.
Also, in such a conventional resin sealing device, the resin is pressurized by inserting the flow cavity plunger into the melted resin in the flow cavity. Will flow into.
In particular, when holding the substrate by vacuum holding with the holding mechanism on the lower surface of the upper mold, a resin sheet or the like cannot be inserted between the lower surface of the upper mold and the substrate. Pressurized resin enters from the gap with the plunger.
In general, mold molding that forms a sealed body includes an epoxy resin that is thermally decomposed and melted by heating, increases in viscosity with time from the melted state, and is thermoset and solidified in a relatively short time. Used.
For this reason, if the resin that has entered the gap between the hole and the plunger is an epoxy resin, the resin hardens and solidifies in a short time, so that the smooth movement of the plunger is hindered, causing malfunction and causing failure. In addition, there is a problem that stable molding cannot be produced, and the yield decreases.
Since the resin that has entered the gap between the hole and the plunger and solidified adheres to the gap, even if the lower mold and upper mold are released, the molded molded body cannot be taken out smoothly, requiring a long tact time As a result, the productivity was inferior.
Therefore, in order to solve such problems, it is conceivable to remove the solidified resin that has entered the gap by disassembly and cleaning of the upper mold and the plunger. However, it is necessary to frequently disassemble and clean the upper mold and the plunger in order to prevent the adverse effects of the resin that has entered and solidified into the gap. For this reason, the entire apparatus has to be stopped for every disassembly and cleaning, resulting in a problem that the operation rate is lowered.
In addition, a pair of flow cavities are provided only on the pair of long sides in a rectangular cavity, and two plungers are inserted into the pair of flow cavities to pressurize from the pair of long side resins in the cavity. ing. For this reason, there is a problem that the pressure distribution of the resin in the cavity is easily biased, and the shape and quality of the manufactured package are likely to be unstable.
Furthermore, although the powder resin is melted after being supplied to the cavity as a resin, it is very difficult to supply the powder resin with a uniform thickness over the entire surface of the cavity, and the powder resin is concentrated and concentrated in a part of the cavity. Sometimes it was supplied. In this case, since the molten resin flows over a wide area toward the entire cavity, unevenness in the resin due to non-uniform flow friction (flow spots) occurs, or from the cavity due to mold clamping to the two flow cavities. There is a problem that a difference occurs in the amount of inflow of the resin or a cause of quality deterioration.
In addition to this, since the powder resin is weighed as a resin and supplied to the cavity separately from the carry-in and transfer of the substrate, the structure of the entire apparatus is as much as the substrate carry-in transfer unit, the powder resin weighing unit and the powder resin supply unit are necessary. There was also a problem that it was complicated and maintenance was troublesome.

In order to achieve such a problem, a resin sealing device according to the present invention is a resin sealing device that manufactures a molded product in which a workpiece on which a semiconductor element is mounted is resin-sealed. A first mold having a pressing portion of the workpiece, and a second mold having a cavity that is provided opposite to a mounting surface on which the semiconductor element of the workpiece is mounted and is supplied with uncured resin, An openable / closable sealed chamber formed between the first mold and the second mold, and either one or both of the first mold and the second mold are the first mold and the second mold. A drive unit that moves relatively close to the opposing direction of the second mold, a pressurizing mechanism that includes a plunger that pressurizes the uncured resin in the cavity in the sealed chamber, and controls the operation of the drive unit and the plunger. Control unit The pressurizing mechanism is provided with the uncured resin overflow channel provided continuously to the cavity in the second mold in the sealed chamber, and the second mold toward the overflow channel. The first mold is provided to face the cavity, and the second mold is provided to face the overflow channel. A lid part and a third covered part provided opposite to the plunger, wherein the first covered part, the second covered part and the third covered part are continuously formed, and the control The part is a relative approaching movement of the first mold and the second mold by the drive unit, and the placement surface of the workpiece and the semiconductor element are immersed in the uncured resin in the cavity, With this immersion, the uncured resin in the cavity is While flowing out the flow path, characterized in that the plunger is controlled to protrude to move to the overflow path towards the third tegmentum site.
The resin sealing method according to the present invention is a resin sealing method for manufacturing a molded product in which a workpiece on which a semiconductor element is mounted is resin-sealed, in the direction opposite to the first molding die and the second molding die. A loading step of supplying uncured resin into the cavity of the second mold that has moved relatively apart, and loading the workpiece on which the semiconductor element is mounted facing the uncured resin; and the first molding Either or both of the mold and the second mold are moved relatively close to each other in the opposing direction of the first mold and the second mold by the drive unit, and the first mold and the second mold A sealing chamber is formed between the molding dies, a mounting surface on which the semiconductor element of the workpiece is mounted, and an immersion step of immersing the semiconductor element in the uncured resin in the cavity; Continuously with the cavity The compression process of the uncured resin that pressurizes the uncured resin that has flowed into the overflow channel provided in the second mold by the protruding movement of the plunger provided in the second mold, and the uncured resin A curing step of resin-sealing the placement surface of the workpiece and the semiconductor element, and a unloading step of moving the first molding die and the second molding die apart by the drive unit, In the dipping step, the first mold part in which a first cover part facing the cavity, a second cover part facing the overflow channel, and a third cover part facing the plunger are continuously formed, The placement surface of the workpiece and the semiconductor element are immersed in the uncured resin in the cavity by relative movement with the second mold, and the workpiece and the uncured resin Press Clamping is performed, the the compression step, characterized in that the plunger protrudes moves to the third the overflow path towards tegmentum site.

It is explanatory drawing which shows the whole structure of the resin sealing apparatus which concerns on embodiment (1st embodiment) of this invention, and is a vertical front view of an initial state (carrying-in process). In the same plan view and cross-sectional view, (a) is a reduced cross-sectional plan view in which a workpiece, uncured resin, and a release sheet are omitted, and (b) is along line (2B)-(2B) in FIG. 2 (a). It is a vertical side view. FIG. 1 is a longitudinal sectional view taken along line (1)-(1) in FIG. It is explanatory drawing which shows the operation | movement process of the resin sealing method which concerns on embodiment of this invention, (a) is a longitudinal front view at the time of a pressure reduction start, (b) is a longitudinal front view during mold | die approaching movement. The subsequent operation | movement process is shown, (a) is a vertical front view of an immersion process, (b) is a vertical front view of a compression process and a hardening process. A subsequent operation process is shown, (a) is a longitudinal front view of the air release process, and (b) is a longitudinal front view of the unloading process. It is explanatory drawing which shows the modification of the resin sealing apparatus which concerns on embodiment of this invention, and is a vertical front view of an initial state (carrying-in process). It is explanatory drawing which shows the modification of the resin sealing apparatus which concerns on embodiment of this invention, and is a vertical front view of an initial state (carrying-in process). It is explanatory drawing which shows the resin sealing apparatus which concerns on 2nd embodiment of this invention, and is a vertical front view of an initial state carrying-in process). It is explanatory drawing which shows the resin sealing apparatus which concerns on 3rd embodiment of this invention, and is a vertical front view of an initial state (carrying-in process).

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 9, the resin sealing apparatus A according to the embodiment of the present invention includes a plurality of or a single semiconductor element C mounted on a work W in a semiconductor assembly process, and a substrate terminal and a semiconductor of the work W. This is an apparatus for manufacturing a molded product M in which a product in which the element C is connected by a connecting member C1 such as a wire is cured by being pressure sealed with an uncured resin R around the connecting member C1. Accordingly, the molded product M can protect the semiconductor element C and the connection member C1 of the product from factors such as impact, temperature, and humidity. In the semiconductor industry, such resin molding is called “mold molding (resin sealing, resin molding)”.
Examples of the workpiece W include a substrate made of silicon wafer, glass, metal sheet, glass cloth, BT resin, or the like, or a similar one.
Examples of the semiconductor element C include chip-shaped electronic components such as semiconductor chips. When the work W is mounted on the mounting surface W1 of the silicon wafer, a plurality of semiconductor elements C are mounted in rows or grids. Is done. Examples of the connection member C1 include bumps and wires.
As the uncured resin R, a sheet, powder, granule, gel or the like is used. Examples of the material of the uncured resin R include thermosetting resins such as epoxy resins. In the case of an epoxy resin, heating is started and pyrolyzed in a predetermined time, and the viscosity increases with the passage of time from the melted state, and is cured and solidified in a relatively short time. Yes.
As described above, the molded product M manufactured by the resin sealing device A is generally subjected to a dividing process such as dicing to complete a package such as a semiconductor package as a final product.

More specifically, the resin sealing device A according to the embodiment of the present invention is provided with the first mold 1 having the pressing portion 11 of the workpiece W and the mounting surface W1 of the workpiece W so as to face the cavity 21. The second mold 2, the openable / closable sealed chamber 31 formed between the first mold 1 and the second mold 2, and either the first mold 1 or the second mold 2, or A drive unit 4 for raising and lowering both of them relatively close to each other in the opposing direction of the first mold 1 and the second mold 2 to clamp the mold is provided as a main component.
Further, if necessary, the internal pressure of the sealed chamber 31 formed between the first mold 1 and the second mold 2 by relative approaching movement is changed from the atmospheric atmosphere AP to the reduced-pressure atmosphere DP having a predetermined degree of vacuum. It is preferable to adjust the internal pressure.
At least between the cavity 21 and the uncured resin R, it is preferable to provide a release sheet S (first release sheet S1) that can be deformed so as to be sandwiched therebetween. The release sheet S is a film made of a heat-resistant material having excellent elasticity such as fluororesin such as Aflex (registered trademark) or ETFE or silicone, and is formed to have a size larger than that of the workpiece W or the cavity 21, The thickness is set to about 20 μm to 150 μm.
Further, by pressurizing and compressing the uncured resin R in the cavity 21, it is possible to create a mold that does not generate bubbles (voids) inside the resin-sealed molded product M.

For this reason, the resin sealing device A according to the embodiment of the present invention is configured to adjust the pressure in the sealed chamber 31 by exhausting or supplying air to the sealed chamber 31 and the external space O, and the cavity 21. A positioning part 6 for the release sheet S (first release sheet S1) and a pressurizing mechanism 7 for compressing the uncured resin R are provided.
In addition to the drive unit 4 for raising and lowering, the pressure adjusting unit 5, the positioning unit 6, the pressurizing mechanism 7, etc. are electrically communicated with the control unit 8 and are controlled by the control unit 8.
The first mold 1 and the second mold 2 are usually arranged so as to face each other in the vertical direction as shown in FIGS. 1 to 9, and the upper first mold 1 and the lower second mold 2 are arranged. The direction in which the mold 2 approaches or isolates is hereinafter referred to as “Z direction”. A direction along the workpiece W that intersects the Z direction is hereinafter referred to as an “XY direction”.
In the example shown in FIGS. 1 to 9, a disk-shaped silicon wafer is used as the workpiece W.
In addition, although not shown as another example, instead of a silicon wafer as the workpiece W, a substrate made of glass, a metal sheet, a glass cloth, a BT resin, or the like or a similar one is held (suspended), The outer shape can be changed to a rectangular shape (a quadrilateral having a right angle including a rectangle and a square).

The first mold 1 is formed in a flat plate shape having a thickness that does not deform (bend) with a rigid body such as metal, and on the surface thereof, the non-mounting surface W2 and Z opposite to the mounting surface W1 of the workpiece W are formed. It has the press part 11 which opposes to a direction.
The pressing portion 11 of the first mold 1 comes into contact with the non-mounting surface W2 of the work W at a predetermined timing, and the mounting surface W1 of the work W and the semiconductor element C are cavities 21 of the second mold 2 described later. It pushes it toward Thereby, the mounting surface W1 of the workpiece W and the semiconductor element C are immersed in the uncured resin R in the cavity 21, and the mold clamping is performed to press the workpiece W and the uncured resin R.
Further, the pressing portion 11 of the first mold 1 is opposed to a cavity 21 described later and a first covered portion 11f provided in the Z direction, and an overflow channel 71 of the pressurizing mechanism 7 described later is opposed to the Z direction. And a second covered portion 11t provided opposite to a plunger 72 of the pressurizing mechanism 7 to be described later in the Z direction. The second lid portion 11s and the third lid portion 11t are formed in an annular shape or a frame shape on the outside of the first lid portion 11f, respectively.
The first covered part 11f, the second covered part 11s, and the third covered part 11t are continuously formed without mutual boundaries.

In the case of the example shown in FIGS. 1 to 9 as a specific example of the first mold 1, the first mold 1 is an upper mold arranged on the substrate side of the molding. A smooth pressing portion 11 is formed in the central portion or the entire inner surface of the upper mold so as to come into contact with the non-mounting surface W2 of the workpiece W.
Further, in the resin sealing device A according to the first embodiment of the present invention shown in FIGS. 1 to 7, the pressing portion 11 is used in the pressure reducing process described later in FIG. 3A from the initial state of FIGS. Is kept away from the non-mounting surface W2 of the workpiece W so that they are not in contact with each other. However, at least from the dipping process described later in FIG. 3B to the curing process described later in FIG. 4B, the pressing portion 11 is in contact with the non-mounting surface W2 of the workpiece W.
As shown in FIGS. 1 to 9, it is preferable to sandwich a release sheet S (second release sheet S2) between the pressing portion 11 and the non-mounting surface W2 of the workpiece W.
In the initial state shown in FIG. 1 and FIG. 2, the cavity of the second mold 2 to be described later with the workpiece W and the second release sheet S2 placed on the workpiece W. It is carried toward 21 and set on the uncured resin R in the cavity 21. As another loading method, the workpiece W and the second release sheet S2 are sequentially loaded into the cavity 21 of the second mold 2 and set on the uncured resin R in the cavity 21, respectively. It can be changed.

The second molding die 2 is formed as a flat plate having a thickness that does not deform (bend) with a rigid body such as metal, and is opposed to the mounting surface W1 of the workpiece W on which the semiconductor element C is mounted in the Z direction. The surface of 2 has a cavity 21 to which the uncured resin R is supplied.
The cavity 21 is formed in a concave shape having a volume that allows at least all of the semiconductor elements C mounted on the mounting surface W1 of the workpiece W to enter and has a depth that allows the mounting to the mounting surface W1 of the workpiece W.
At least the second mold 2 is provided with a heater (not shown) for heating the cavity 21 and its periphery. A heater for heating can also be provided in the first mold 1.
In the case of the example shown in FIGS. 1 to 9 as a specific example of the second mold 2, the second mold 2 is a lower mold disposed on the resin side of the molding. A circular concave cavity 21 into which the uncured resin R, all the semiconductor elements C, and the connection member C1 enter is integrally formed at the central portion of the inner surface of the lower mold. Further, a circular concave portion into which the entire work W is inserted is formed integrally with the cavity 21.
Further, although not shown as another example, the shape of the cavity 21 is changed to a rectangular concave shape corresponding to the outer shape of the workpiece W, or only the cavity 21 is formed without forming the concave portion into which the entire workpiece W enters. It is possible to change what to do.

Uncured resin R is supplied into the cavity 21. The structure of the cavity 21 is such that the mounting surface W1 of the workpiece W and the semiconductor element C are immersed in the uncured resin R in the cavity 21 so that the uncured resin R overflows from the cavity 21 and will be described later. It is comprised so that it may flow into the overflow channel 71.
That is, the uncured resin R in the cavity 21 overflows from the cavity 21 and flows out to the overflow channel 71 by the volume of the mounting surface W1 and the semiconductor element C immersed therein.
The supply amount of the thermosetting resin R 1 to the cavity 21 is set to be larger than the mounting surface W 1 of the workpiece W and the immersion capacity of the semiconductor element C with respect to the uncured resin R in the cavity 21.
As a specific example of the supply amount of the thermosetting resin R1, the volume of the cavity 21 is set to about 101 to 120% with respect to the volume obtained by subtracting the mounting surface W1 of the workpiece W and the immersion volume of the semiconductor element C. Is preferred.
This prevents the occurrence of molding defects due to insufficient supply of the thermosetting resin R1 and the generation of bubbles in the resin-sealed molded product M, and overflow due to excessive supply of the thermosetting resin R1. It is possible to prevent overflow from the road 71 at the same time.

In the case of the example shown in FIGS. 1 to 5 as a specific example of the uncured resin R, a sheet-like thermosetting resin R 1 having an outer shape corresponding to the shape and size of the cavity 21 is supplied into the cavity 21. It is melted with a heater for heating.
Further, as another example of the uncured resin R, as shown in FIG. 6, a powdered or granular thermosetting resin R2 is supplied into the cavity 21 and melted with a heater for heating, or FIG. The fiber-containing resin substrate R3 in which the uncured resin layer R31 is impregnated in the resin-impregnated fiber base R32 is supplied into the cavity 21 as shown in FIG. Other than that, although not shown, it is also possible to supply gel-like uncured resin into the cavity 21.
As shown in FIG. 6, the powdered or granular thermosetting resin R 2 easily adjusts the capacity of the uncured resin R more easily than the sheet-like thermosetting resin R 1 or the fiber-containing resin substrate R 3. There is an advantage that it can be performed and is excellent in workability.
The fiber-containing resin substrate R3 shown in FIG. 7 is a resin-impregnated fiber base made of carbon fiber, glass fiber, quartz glass fiber or the like whose linear expansion coefficient in the XY direction is smaller than 3 ppm, as described in Japanese Patent No. 5934078. A material R32 and an uncured resin layer R31 made of an uncured epoxy resin or the like formed on one surface of the resin-impregnated fiber substrate R32 are provided.
In the modification shown in FIG. 7, the shrinkage stress when the uncured resin layer R31 is cured can be suppressed. For this reason, when a large-diameter wafer or a large-diameter substrate such as metal is sealed as the workpiece W, even when a thin substrate is sealed, the workpiece W (wafer or substrate) warps, the workpiece W (wafer) The separation of the semiconductor element C from the substrate and the substrate and the damage of the workpiece W (wafer or substrate) can be suppressed, and the mounting surface W1 of the workpiece W (wafer or substrate) on which the semiconductor element C is mounted or the semiconductor element C is formed. There is an advantage that the mounting surface W1 of the workpiece W (wafer or substrate) can be collectively sealed at the level of the workpiece W (wafer or substrate) and the sealing performance such as heat resistance and moisture resistance is excellent after sealing.

Further, the second mold 2 is preferably divided into a central portion 22 constituting the bottom surface portion of the cavity 21 and an outer portion 23 serving as a side surface portion of the cavity 21.
It is preferable to form a suction slit 61 between the central portion 22 and the outer portion 23 as the positioning portion 6 of the release sheet S (first release sheet S1). The suction slit 61 communicates with an air suction device 62 such as a vacuum pump so that the release sheet S (first release sheet S1) having excellent stretchability is bent along the shape of the bottom surface and the side surface of the cavity 21. Position and hold so as to deform.
The outer portion 23 includes a driven portion 23a that is in contact with the first mold 1 regardless of the presence or absence of the release sheet S (first release sheet S1, second release sheet S2), and the first mold 1 and the driven portion 23a. A stopper 23b that restricts the movement of the follower in the Z direction and an elastic member 23c that constantly biases the driven portion 23a toward the first mold 1 are provided.
The driven portion 23a is supported so as to be capable of reciprocating in the Z direction, and the bottom surface of the cavity 21 from the pressing portion 11 of the first mold 1 with the first mold 1 in contact with the stopper 23b via the driven portion 23a. The distance to the part is set to be the same as the thickness of the molded product M including the workpiece W.
Although not shown as other examples, the second mold 2 is integrally formed without being divided into the central portion 22 and the outer portion 23, and the shape and structure of the outer portion 23 are changed to shapes and structures other than those shown in the drawing. It is also possible to change it.

In addition to this, it is preferable to provide a pressurizing mechanism 7 for the uncured resin R in the outer portion 23 of the second mold 2.
The pressurizing mechanism 7 for the uncured resin R includes an overflow channel 71 that is continuously formed outside the cavity 21, a plunger 72 that is provided so as to protrude toward the overflow channel 71, and an unfilled channel in the overflow channel 71. And a deformable separation portion 73 provided between the cured resin R and the plunger 72.
As shown in FIG. 2, the overflow channel 71 is preferably formed with a plurality of overflow channels 71 around the cavity 21 at predetermined intervals. A plurality of plungers 72 are respectively provided in the plurality of overflow channels 71, and the plurality of overflow channels 71 and the plurality of plungers 72 are preferably arranged symmetrically with respect to the shape of the cavity 21.
In the case of the example shown in FIG. 1 to FIG. 9 as specific examples of the cavity 21 and the overflow channel 71, a plurality of overflow channels 71 are respectively arranged at predetermined intervals in the circumferential direction on the outer periphery of the circular concave cavity 21. A plurality of plungers 72 are arranged at predetermined intervals in the circumferential direction at the top end of the bottom surface of each overflow channel 71 in a radial manner in the XY direction.
On the other hand, in the first mold 1, the first covered portion 11 f facing the cavity 21 in the Z direction corresponds to the same circular portion as the cavity 21, and the second portion facing the overflow channel 71 in the Z direction. The covered portion 11s and the third covered portion 11t facing the plunger 72 in the Z direction correspond to an annular (annular) portion along the outer edge of the circular first covered portion 11f. In the illustrated example, all of the first lid portion 11f, the second lid portion 11s, and the third lid portion 11t are continuously formed in a smooth shape.
Although not shown as another example, the shape of the cavity 21 can be changed to a rectangular concave shape or a polygonal concave shape, or the size of the cavity 21 can be changed to a size other than the illustrated example. When the shape of the cavity 21 is changed to a rectangular concave shape, a polygonal concave shape, or the like, a plurality of overflow channels 71 are arranged at predetermined intervals on each side or each corner of the cavity 21. It is possible to change not only the arrangement, number and shape of the plunger 72 but also the arrangement, number and shape of the plunger 72 other than the illustrated example.

The plunger 72 is supported so as to reciprocate in the Z direction with respect to the driven portion 23 a of the outer portion 23 and the like in order to vary the volume of the overflow channel 71. By causing the plunger 72 to project and move toward the overflow channel 71, the uncured resin R in the overflow channel 71 is pressurized and pushed back to the cavity 21 side.
The pressure applied to the uncured resin R by the plunger 72 may be set such that the pressure per unit area of pressing back from the plunger 72 is about 200 to 400% with respect to the pressure per unit area of the press at the time of clamping. preferable.
Thereby, generation | occurrence | production prevention of the bubble (void) in the molded product M sealed with resin can be achieved. At the same time, the flow of the uncured resin R pushed back from the overflow channel 71 toward the cavity 21 causes an adverse effect such as deformation of the connecting member C1 such as a wire connecting the substrate terminal of the workpiece W and the semiconductor element C. Prevention can also be achieved. Examples of adverse effects caused by deformation of the connection member C1 include positional displacement of the semiconductor element C with respect to the substrate of the workpiece W, disconnection of the connection member C1, damage to the semiconductor element C, and the like.
As a specific method for setting the pressure applied to the plunger 72, torque of a servo motor or the like serving as the drive source 72a of the plunger 72 is detected, and when the uncured resin R is pushed back from the overflow channel 71 toward the cavity 21 by the plunger 72. In addition, control is performed so that the torque falls within the set range. When the torque exceeds the set range, the operation of the plunger 72 is controlled to be stopped.
The separation portion 73 is preferably formed integrally with the outer peripheral portion of the release sheet S (first release sheet S1) supplied along the cavity 21. The first release sheet S 1 is preferably disposed across the cavity 21 and the overflow channel 71, and the part of the first release sheet S 1 along the overflow channel 71 and the covering portion of the plunger 72 is preferably the separation part 73.

The sealed chamber 31 is preferably formed inside the vacuum device 3 including a vacuum chamber and the like, and it is preferable that gas is exhausted (evacuated and evacuated) from the sealed chamber 31 by the operation of the pressure adjusting unit 5 such as a vacuum pump. Thereby, the sealed chamber 31 is configured to be capable of adjusting the transformation from the atmospheric atmosphere AP to the reduced-pressure atmosphere DP having a predetermined degree of vacuum.
The vacuum device 3 is configured to be openable and closable in whole or in part so that the workpiece W, the uncured resin R, the release sheet S, the molded product M, and the like can be taken in and out of the sealed chamber 31. Automation can be achieved by providing a transfer mechanism (not shown) such as a transfer robot across the sealed chamber 31 in the vacuum apparatus 3 and the external space O of the vacuum apparatus 3.
More specifically, when the sealed chamber 31 is the atmospheric atmosphere AP, the workpiece W, the uncured resin R, and the release sheet S are carried into the sealed chamber 31 by the transport mechanism. Molding is performed after the sealed chamber 31 is in a reduced pressure atmosphere DP having a predetermined degree of vacuum. After the molding is completed, the molded product M is returned from the sealed chamber 31 to the external space O by returning to the atmospheric atmosphere AP.
In the case of the example shown in FIGS. 1 to 9 as a specific example of the vacuum device 3, the peripheral wall portion 32 constitutes the lower side of the vacuum device 3 on the outer periphery of the first mold 1 constituting the upper side of the vacuum device 3. It is provided so as to be detachable and intimately attached to the outer periphery of the second mold 2. The peripheral wall portion 32 has a seal portion 32a that is in close contact with the outer peripheral portion of the second mold 2 in the Z direction, and a stretchable portion 32b that is elastically deformable in the Z direction.
Although not shown as other examples, instead of the peripheral wall portion 32 of the first mold 1, a peripheral wall portion may be provided on the outer periphery of the second mold 2, or the first mold 1 and the second mold 2. A change such as providing a peripheral wall portion separable in the Z direction on the outer periphery is possible.

The drive unit 4 for raising and lowering is configured by an actuator or the like that reciprocates either the first mold 1 or the second mold 2 or both the first mold 1 and the second mold 2 in the Z direction. The operation is controlled by the control unit 8 described later.
As an example of control of the drive unit 4 for raising and lowering by the control unit 8, at the time of carrying in the workpiece W and the uncured resin R shown by the solid line in FIG. 1 and at least carrying out the molded product M shown in FIG. Sometimes, the first mold 1 and the second mold 2 are relatively moved apart in the Z direction. Other than that, as FIG.3 (a) (b) and FIG.4 (a) (b) show, the 1st shaping | molding die 1 and the 2nd shaping | molding die 2 are moved relatively close to a Z direction. When particularly necessary, the first molding die 1 and the second molding die 2 move further closer to pressurize the workpiece W and the uncured resin R.
Explaining in detail, either the first molding die 1 or the second molding die 2 is relatively moved away from the other in the Z direction by the elevating drive unit 4 at the time of carry-in or carry-out, or the first Both the mold 1 and the second mold 2 are moved relatively apart from each other in the Z direction. Otherwise, either the first mold 1 or the second mold 2 is moved relatively close to the Z direction toward the other, or both the first mold 1 and the second mold 2 are moved to each other. Move relatively close to the Z direction.
In the case of the example shown in FIG. 1, as a specific example of the lifting drive unit 4, only the first mold 1 is linked to the lifting drive unit 4, and the first mold 1 side is second molded. It is moved close to the mold 2 side in the Z direction.
Although not shown in the drawings as another example, only the second mold 2 is linked to the drive unit 4 for raising and lowering, and the second mold 2 side is relatively close to the first mold 1 side in the Z direction. The first molding die 1 and the second molding die 2 are respectively linked to the raising / lowering drive unit 4 to move the first molding die 1 side and the second molding die 2 side simultaneously in the Z direction. It is possible to change things.

The control unit 8 includes not only the drive unit 4 for raising and lowering but also the pressure adjusting unit 5, the intake device 62 of the positioning unit 6, the drive source 72 a of the plunger 72 of the pressurizing mechanism 7, the workpiece W, the uncured resin R, and the mold release. It is a controller that is electrically connected to the transport mechanism of the sheet S and the like.
The controller serving as the controller 8 sequentially controls the operation at a preset timing in accordance with a preset program in its control circuit (not shown).

And the program set to the control circuit of the control part 8 is demonstrated as a resin sealing method for producing the molded article M. FIG.
In the resin sealing method according to the embodiment of the present invention, the work W, the uncured resin R, and the release sheet S are carried into the opened sealed chamber 31, the mounting surface W 1 of the work W, and the semiconductor element C. Immersion step of immersing in the uncured resin R in the cavity 21, compression step of the uncured resin R that pressurizes the uncured resin R that has flowed out into the overflow channel 71 by the protruding movement of the plunger 72, and curing of the uncured resin R The main process includes a curing process in which resin sealing is performed and an unloading process in which the sealed chamber 31 is opened and the molded product M is taken out.
In particular, between the carrying-in process and the dipping process, there is included a depressurizing process for depressurizing the sealed chamber 31 from the atmospheric atmosphere AP to the depressurized atmosphere DP having a predetermined degree of vacuum. preferable.
Furthermore, it is preferable to include an air release step for returning the sealed chamber 31 from the reduced pressure atmosphere DP to the air atmosphere AP between the curing step and the carry-out step.

In the carrying-in process, as shown in FIGS. 1 and 2, the first mold 1 and the second mold 2 are relatively moved apart in the Z direction and directed toward the cavity 21 of the second mold 2 in the atmospheric atmosphere AP. The release sheet S (first release sheet S1) and the uncured resin R are supplied by the transport mechanism. Thereby, the uncured resin R is set at a predetermined position of the cavity 21 via the first release sheet S1. Above the uncured resin R, the work W and the release sheet S (second release sheet S21) are supplied by the transport mechanism and set at a predetermined position above the uncured resin R.
In the decompression step, as shown in FIG. 3A, either one or both of the first mold 1 and the second mold 2 are moved relatively close to each other in the Z direction by the drive unit 4 for raising and lowering. A sealed chamber 31 is formed between the first mold 1 and the second mold 2. Following this, the pressure adjusting unit 5 discharges the gas in the sealed chamber 31 to the external space O (evacuation and evacuation) to reduce the pressure from the atmospheric atmosphere AP. At this time, the uncured resin R in the cavity 21 is melted by a heater for heating.
After that, as shown in FIG. 3B, when the first mold 1 and the second mold 2 move relatively close to each other and the sealed chamber 31 is in a high vacuum of about 100 Pa or less, the molten state The mounting surface W1 of the workpiece W and the semiconductor element C are pushed into the uncured resin R.
In the dipping process, as shown in FIG. 4 (a), the driven portion 23a of the outer portion 23 in contact with the first mold 1 moves closer in the Z direction until it abuts against the stopper 23b, and the mold is clamped. Resin R is pressurized. As a result, the uncured resin R flows into the overflow channel 71 and overflows as much as the volume in which the mounting surface W1 of the workpiece W and the semiconductor element C are immersed in the melted uncured resin R.
In the compression step, as shown in FIG. 4B, the plunger 72 projects and moves into the overflow channel 71 toward the third covered portion 11 t of the first mold 1. At this time, the plunger 72 projects and moves toward the overflow channel 71 through the covering portion of the plunger 72 that becomes the separation portion 73 in the release sheet S (first release sheet S1). As a result, the uncured resin R of a volume that protrudes the separating portion 73 into the overflow channel 71 is pushed back to the overflow channel 71 without flowing into the plunger 72, and the uncured resin in the cavity 21. R is pressurized and the uncured resin R is further compressed.
In the illustrated example, the operation of the plunger 72 is controlled in the initial state before the uncured resin R overflows the overflow channel 71 (before the dipping step shown in FIG. 3B). It moves in the opposite direction to the projecting movement direction toward 71 and stands by. As another control example, in the initial state, the plunger 72 protrudes toward the overflow channel 71 to stand by, and the plunger 72 is reversed by its weight as the uncured resin R overflows into the overflow channel 71. It is also possible to control the operation so as to move the direction.
In the subsequent curing process, the uncured resin R in the cavity 21 and the overflow channel 71 is cured together by heating with a heater or the passage of time, and the work surface W1 and the semiconductor element C are placed between the two. The gap C2 excluding the connection member C1 is integrally resin-sealed.
In the air release step after curing of the uncured resin R, as shown in FIG. 5A, the pressure adjusting unit 5 supplies air from the external space O to the sealed chamber 31 and returns it to the air atmosphere AP. At the same time, the plunger 72 moves backward to return to the initial state. At this time, the first mold 1 and the second mold 2 are moved apart by the drive unit 4 for raising and lowering, and the non-mounting surface W2 of the workpiece W is peeled from the pressing part 11 of the first mold 1. .
In the subsequent unloading process, as shown in FIG. 5 (b), when the first mold 1 and the second mold 2 are further moved away from each other and the vacuum device 3 is completely opened, the resin sealing is completed. The molded product M and the release sheet S are carried out from the sealed chamber 31 to the external space O by the transport mechanism. The molded product M and the release sheet S (first release sheet S1, second release sheet S2) are separated in the sealed chamber 31 or in the external space O.

Next, the resin sealing apparatus A which concerns on 2nd embodiment of this invention is demonstrated based on FIG.
In the resin sealing device A according to the second embodiment of the present invention, a holding chuck is provided as a pressing portion 11 on the surface of the first mold 1, and a workpiece is placed at a predetermined position on the surface of the first mold 1 by this holding chuck. A non-mounting surface W2 of W is detachably held (suspended). In the state in which the workpiece W is suspended from the pressing portion 11 of the first mold 1, the configuration in which the mold M is manufactured by clamping the mold in the same manner as in the first embodiment described above is the first described above. Unlike the embodiment, the other configurations are the same as those of the first embodiment.
Therefore, in the second embodiment, in the initial state shown in FIG. 8, the work W carried in by a transport mechanism such as a transport robot is received by the holding chuck, and the work W is dropped along the surface of the first mold 1. It is suspended impossible. Thereby, the pressing part 11 is made to contact the non-mounting surface W2 of the workpiece | work W from the initial state of FIG.
Thereafter, the operation of the second embodiment is controlled in the same manner as in FIGS. 3A, 3B, 5A, and 5B of the first embodiment described above.

An adhesive chuck 12 is preferably used as the holding chuck provided in the pressing portion 11. In this case, the workpiece W is directly adhered and held by the adhesive chuck 12 without sandwiching the release sheet S (second release sheet S2) between the pressing portion 11 and the non-mounting surface W2 of the workpiece W. The
The entire or part of the adhesive chuck 12 is made of, for example, an adhesive material such as fluorine rubber, elastomer, butyl rubber, photosensitive resin, acrylic or silicon, and is opposed to the non-mounting surface W2 of the workpiece W in the Z direction. It has a surface 12a.
In the case of the example shown in FIG. 8 as a specific example of the adhesive chuck 12, a plurality of adhesive surfaces 12 a formed in a sheet shape are respectively distributed and arranged on the pressing portions 11 of the first mold 1. In the initial state before holding the workpiece W, it is preferable that the adhesive surface 12a is protruded from the pressing portion 11 of the first mold 1 toward the sealed chamber 31 described later so as to be elastically deformable.
Thereby, even if the sealed chamber 31 is in a reduced pressure atmosphere DP having a predetermined degree of vacuum, the workpiece W cannot be dropped. As a result, even if the uncured resin R is foamed in the decompressed sealed chamber 31, gas can be efficiently exhausted to the outside of the decompression chamber 31 by the pressure adjusting unit 5, and at the same time, the mounting surface W 1 of the workpiece W and Exhaust can be reliably performed from the gap C2 of the semiconductor element C. For this reason, bubbles do not remain inside the resin seal, voids can be prevented, and a resin-sealed package can be realized with high accuracy, thereby improving quality.
Furthermore, since the non-mounting surface W2 of the workpiece W is held (suspended) by the pressing portion 11 of the first mold 1, the mounting surface W1 of the workpiece W and the semiconductor element C in the decompression step (not shown) The gas in the sealed chamber 31 is discharged to the external space O with a predetermined gap (gap) between the release sheet S (first release sheet S1) and the uncured resin R in the cavity 21. (Evacuation, evacuation) becomes possible. Thereby, the surface of the uncured resin R is sufficiently exposed to the vacuum in the sealed chamber 31, and the defoaming of the uncured resin R is promoted.
For this reason, in the decompression step shown in FIG. 3A as in the first embodiment, the placement surface W1 of the workpiece W, the semiconductor element C, the release sheet S (second release sheet S2), and the cavity 21 The entire gap C2 excluding the mounting surface W1 of the workpiece W and the connecting member C1 of the semiconductor element C, compared to the inner release sheet S (first release sheet S1) and the one having a narrow gap with the uncured resin R. Therefore, it is possible to stably produce a mold which is excellent in the invasion property of the uncured resin R with respect to the surface and in which bubbles (voids) are not generated.
Although not shown in the drawings as other examples, it is possible to use an electrostatic chuck instead of the adhesive chuck 12 as a holding chuck for the workpiece W, or to use an adsorption chuck or an electrostatic chuck in addition to the adhesive chuck 12. It is.

Further, in the case of the example shown in FIG. 8, the non-mounting surface W 2 of the workpiece W is moved toward the pressure-sensitive adhesive surface 12 a of the pressure-sensitive adhesive chuck 12 and forcedly brought into contact with the pressing portion 11 of the first mold 1. It is preferable to provide the abutting part 13 and a peeling part (not shown) for peeling the non-mounting surface W2 of the workpiece W from the adhesive surface 12a of the adhesive chuck 12.
The pressing force of the workpiece W by the abutting portion 13 is obtained by crushing the adhesive surface 12a of the adhesive chuck 12 slightly protruding from the pressing portion 11 of the first molding die 1 with the non-mounting surface W2 of the workpiece W, thereby performing the first molding. It is preferable to set so that the pressing portion 11 of the mold 1 and the non-mounting surface W2 of the workpiece W are in close contact with each other and no gap for the uncured resin R to enter between them is generated.
In the case of the illustrated example as a specific example of the abutting portion 13 shown in FIG. 8, the suction hole 13 a is opened in the pressing portion 11 of the first mold 1, and the size of the suction hole 13 a is approximately the size of the concave groove portion 11 a. The same setting is used for multiple distributed arrangements. Each suction hole 13a communicates with an actuator (not shown) such as a compressor for vacuum suction or gas injection. By vacuum suction from the suction hole 13a by the operation of the actuator, the non-mounting surface W2 of the workpiece W is drawn toward the adhesive chuck 12, and the non-mounting surface W2 is pressed against the adhesive surface 12a.
As the peeling portion, although not shown, a push pin provided so as to be reciprocally movable in the Z direction with respect to the first mold 1 is used, and the tip of the push pin pushes the non-mounting surface W2 of the workpiece W from the adhesive surface 12a. Peeling is preferable. As another example of the peeling portion, the non-mounting surface W2 of the workpiece W can be pushed off from the adhesive surface 12a by injecting compressed gas from the suction hole 13a.
Although not shown as another example, an electrostatic chuck is used in place of the suction hole 13a as the abutting portion 13 of the work W, and the non-mounting surface W2 of the work W is adhered to the adhesive chuck by electromagnetic attraction by the electrostatic chuck. For example, it is possible to make a change such as pulling it toward the surface 12 and pressing it, or pressing and peeling the non-mounting surface W2 of the workpiece W from the adhesive surface 12a with an electric repulsive force. It is also possible to use a push pin as the peeling portion and a jet of compressed gas from the suction hole 13a in combination. In addition to this, the sheet-like thermosetting resin R1 as the uncured resin R may be replaced with the powdery or granular thermosetting resin R2 shown in FIG. 6, or the uncured resin layer R31 shown in FIG. Can be changed such as replacing the fiber-containing resin substrate R3 impregnated with the resin-impregnated fiber base R32.

Next, a resin sealing device A according to a third embodiment of the present invention will be described with reference to FIG.
In the resin sealing device A according to the third embodiment of the present invention, the uncured resin R is supplied inside the cavity 21 with the plate-like spacer P interposed therebetween, and is clamped in the same manner as in the first embodiment described above. The configuration for manufacturing the molded product M that is molded is different from the first embodiment and the second embodiment described above, and other configurations are the same as those in the first embodiment and the second embodiment.
A plurality of types of spacers P having different thicknesses are prepared, and a spacer P having a thickness suitable for the thickness of the molded product M is used.
Therefore, in the third embodiment, in the initial state shown in FIG. 9, the spacer P is set inside the cavity 21, and the release sheet S (first release sheet S 1) is sandwiched between the uncured resin. R is supplied. Thereafter, the operation of the third embodiment is controlled in the same manner as in FIGS. 3 (a), 3 (b) to 5 (a), (b) of the first embodiment.
In the case shown in FIG. 9 as a specific example of the spacer P, the pressing portion 11 of the first mold 1 as in the first embodiment shown in FIG. 1 is initially in contact with the non-mounting surface W2 of the workpiece W. In the state, one spacer P is set inside the cavity 21.
Although not shown in the drawings as another example, a combination of a plurality of spacers P is set, or the pressing portion 11 of the first mold 1 as in the second embodiment shown in FIG. In the initial state of contact with the placement surface W2, it is possible to change such as setting the spacer P inside the cavity 21. In addition to this, the sheet-like thermosetting resin R1 as the uncured resin R may be replaced with the powdery or granular thermosetting resin R2 shown in FIG. 6, or the uncured resin layer R31 shown in FIG. Can be changed such as replacing the fiber-containing resin substrate R3 impregnated with the resin-impregnated fiber base R32.
Thereby, since the thickness of the molded product M is reduced by the thickness of the spacer P, a plurality of types of molded products M having different thicknesses can be easily manufactured even when the depth of the cavity 21 is constant.

According to the resin sealing device A and the resin sealing method according to the embodiments (first embodiment to third embodiment) of the present invention, the second mold 2 has the molded product M to be resin-sealed. Actuators such as a cavity 21 that has an outer shape and a plunger 72 that pushes back the uncured resin R that has flowed out of the cavity 21 into the overflow channel 71 to the cavity 21 are collectively arranged. The first mold 1 includes a first covered portion 11 f that faces the cavity 21, a second covered portion 11 s that faces the overflow channel 71, and a third covered portion 11 t that faces the plunger 72. It is continuously formed without mutual boundaries.
By preparing a plurality of types of second molds 2 having different shapes and sizes of the cavities 21 and different arrangements and numbers of plungers 72 in accordance with various types of molded products M in advance, the second type of mold M can be changed when the product type is changed. The first mold 1 can be shared only by exchanging the mold 2.
Therefore, it is possible to deal with various types of molded products M by changing the second mold 2 alone.
As a result, it is not necessary to replace the first mold 1 when changing the type of the molded product M, compared to the conventional type in which the lower mold is provided with a cavity and the upper mold is provided with a plunger. This is not only easy, but also shortens the downtime and improves the operating rate. Even when it is necessary to frequently change the product type of the molded product M, the working time can be significantly shortened by replacing only the second mold 2 so that the operating rate can be significantly improved.
In particular, when the first mold 1 is an upper mold and the second mold 2 is a lower mold, the structure of the first mold 1 serving as the upper mold can be simplified and the weight can be reduced. Since the drive unit 4 of the mold 1 can also be reduced in size, not only can the entire apparatus be made compact, but it is not necessary to remove the upper mold after removing the lower mold from the apparatus. Cost can be reduced.

Further, the plunger 72 is covered with the release sheet S: the first release sheet S1) between the cavity 21 and the uncured resin R and between the uncured resin R and the plunger 72 in the overflow channel 71. It is preferable to provide it.
In this case, after the uncured resin R overflows the overflow channel 71 as the mounting surface W1 of the workpiece W and the semiconductor element C are immersed in the uncured resin R in the cavity 21, the release sheet S is discharged. In (first release sheet S 1), the covered portion of the plunger 72 projects and moves into the overflow channel 71 by the operation of the plunger 72.
Thereby, in the release sheet S (first release sheet S1), the uncured resin R corresponding to the volume in which the covering portion of the plunger 72 protrudes into the overflow channel 71 flows without flowing into the plunger 72 side. The uncured resin R in the cavity 21 is pressurized by being pushed back to the path 71, and the uncured resin R is compressed.
Therefore, the covering member of the plunger 72 can be integrated with the release sheet S (first release sheet S1) that prevents the cavity 21 and the uncured resin R from adhering.
As a result, the release sheet S (between the uncured resin R in the overflow passage 71 and the plunger 72 is compared with the conventional one in which the uncured resin enters the plunger moving gap by pressurization of the plunger and solidifies. Since a part of the first release sheet S1) is sandwiched, the molded product M can be easily taken out.
Thereby, the tact time for peeling the molded product M can be shortened, and the productivity is excellent.

It is preferable that a plurality of overflow channels 71 are formed around the cavity 21 at predetermined intervals, and a plurality of plungers 72 are provided in the plurality of overflow channels 71. The plurality of overflow channels 71 and the plurality of plungers 72 are preferably arranged equally, such as symmetrically arranged with respect to the shape of the cavity 21.
In this case, as the mounting surface W1 of the workpiece W and the semiconductor element C are immersed in the uncured resin R in the cavity 21, the uncured resin R flows evenly into the plurality of overflow channels 71 and overflows. .
In this outflow state, by moving the plurality of plungers 72 projecting toward the plurality of overflow channels 71, an equal amount of uncured resin R is pushed from the plurality of overflow channels 71 to the symmetrical positions of the cavities 21. returned.
For this reason, the uncured resin R in the cavity 21 is uniformly pressurized as a whole.
Therefore, the uncured resin R in the cavity 21 can be pressurized with a uniform pressure distribution.
As a result, the pressure distribution of the uncured resin R in the cavity 21 is not biased and the shape is stable compared to the conventional one in which only a pair of long side resin is pressurized with a plunger in a rectangular cavity. A molded product M can be produced.

Furthermore, it is preferable that the uncured resin R is an outer sheet-shaped resin R1 corresponding to the shape and size of the cavity 21, and the second mold 2 has a heater for heating the sheet-shaped resin R1.
In this case, by supplying a sheet-shaped resin R1 of a set size as an uncured resin R to the cavity 21, the sheet-shaped resin R1 approaches the overflow channel 71 with a uniform thickness over the entire surface of the cavity 21. Even if the sheet-like resin R1 is melted by the heater for heating, it hardly flows in the cavity 21.
Therefore, a set amount of the uncured resin R can be supplied over the entire surface of the cavity 21 with a simple structure.
As a result, the melted uncured resin in the cavity compared to the conventional resin in which the resin flows in a wide range toward the entirety of the cavity by melting the powder resin that is concentrated and supplied to a part of the cavity. The flow of R becomes slight, and the resin internal spots (flow spots) due to non-uniform flow friction of the molten uncured resin R can be suppressed. Furthermore, the molten uncured resin R smoothly flows from the cavity 21 to the overflow channel 71 without a time lag with respect to the mounting surface W1 of the workpiece W and the semiconductor element C, and the uncured resin R by the subsequent mold clamping Even when pressure is applied or when the uncured resin R is pushed back into the cavity 21 from the overflow channel 71 by the plunger 72, connection of a wire or the like connecting the substrate terminal of the workpiece W and the semiconductor element C by the flow of the uncured resin R Generation of adverse effects such as deformation of the member C1 can be prevented. Examples of adverse effects caused by deformation of the connection member C1 include positional displacement of the semiconductor element C with respect to the substrate of the workpiece W, disconnection of the connection member C1, damage to the semiconductor element C, and the like. As a result, a high-quality molded product M having a more stable shape and quality can be produced.
In addition to this, the overall structure of the device can be simplified and the work piece can be simplified at least as much as the weighing unit is not required. It is also possible to share the loading of W and the supply of the sheet-like resin R1, and the maintenance can be simplified.

In the illustrated examples in the first embodiment to the third embodiment, the first mold 1 is an upper mold disposed on the mold substrate side, and the second mold 2 is the resin side of the mold. However, the present invention is not limited to this, and the first mold 1 is a lower mold disposed on the resin side of molding, and the second mold 2 is disposed on the substrate side of molding. It may be an upper mold.

A Resin sealing device 1 1st shaping | molding die 11 Press part 11f 1st lid | cover part 11s 2nd lid | cover part 11t 3rd lid | cover part 2 2nd shaping | molding die 21 Cavity 31 Sealing chamber 4 Drive part 7 Pressurization mechanism 71 Going over Flow path 72 Plunger 8 Control unit C Semiconductor element S Release sheet (S1: First release sheet)
R Uncured resin R1 Sheet resin W Work W1 Placement surface W2 Non-placement surface

Claims

A resin sealing device for manufacturing a molded product in which a workpiece on which a semiconductor element is mounted is resin-sealed,
A first mold having a pressing portion of the workpiece on which the semiconductor element is mounted;
A second mold having a cavity that is provided opposite to a mounting surface on which the semiconductor element of the workpiece is mounted and is supplied with uncured resin;
An openable / closable sealed chamber formed between the first mold and the second mold;
A drive unit that relatively moves one or both of the first mold and the second mold in the opposing direction of the first mold and the second mold; and
A pressurizing mechanism having a plunger for pressurizing the uncured resin in the cavity in the sealed chamber;
A control unit for controlling the operation of the drive unit and the plunger,
The pressurizing mechanism includes an overflow channel of the uncured resin provided continuously to the cavity in the second mold in the sealed chamber, and a projecting movement toward the overflow channel in the second mold. And the plunger provided in
The first mold includes a first covered portion provided to face the cavity, a second covered portion provided to face the overflow channel, and a third covered portion provided to face the plunger. A lid part, and the first covered part, the second covered part and the third covered part are continuously formed,
The control unit is configured such that the placement surface of the workpiece and the semiconductor element are immersed in the uncured resin in the cavity by relative movement of the first mold and the second mold by the drive unit. With this immersion, the plunger is controlled to project and move into the overflow path toward the third covered region in a state where the uncured resin in the cavity flows out into the overflow path. A resin sealing device characterized by that.
The release sheet is provided so as to cover the plunger from between the cavity and the uncured resin and between the uncured resin and the plunger in the overflow channel. 1. The resin sealing device according to 1.
3. The resin sealing device according to claim 1, wherein a plurality of overflow channels are formed around the cavity at predetermined intervals, and a plurality of plungers are provided in the plurality of overflow channels.
The uncured resin is a sheet-like resin having an outer shape corresponding to the shape and size of the cavity, and the second mold has a heater for heating the sheet-like resin. Or the resin sealing apparatus of 3.
A resin sealing method for manufacturing a molded product in which a workpiece on which a semiconductor element is mounted is resin-sealed,
The uncured resin is supplied into the cavity of the second mold that is relatively moved in the facing direction of the first mold and the second mold, and the semiconductor element is mounted facing the uncured resin. A loading step for loading the workpiece;
Either or both of the first mold and the second mold are moved relatively close to each other in the opposing direction of the first mold and the second mold by the drive unit, and the first mold And a dipping step of immersing the mounting surface of the workpiece on which the semiconductor element is mounted and the semiconductor element in the uncured resin in the cavity;
The uncured resin that pressurizes the uncured resin that has flowed out into the overflow channel provided in the second mold in the sealed chamber by the protruding movement of the plunger provided in the second mold. The compression process of
A curing step in which the uncured resin is cured and the placement surface of the workpiece and the semiconductor element are resin-sealed;
An unloading step of moving the first mold and the second mold apart by the drive unit,
In the dipping process, the first mold part in which a first cover part facing the cavity, a second cover part facing the overflow channel, and a third cover part facing the plunger are continuously formed; The placement surface of the workpiece and the semiconductor element are immersed in the uncured resin in the cavity by relative movement with the second mold, and the workpiece and the uncured The mold is pressed to press the resin,
In the compression step, the plunger is projected and moved into the overflow channel toward the third covered region.