JP6861609B2 - Resin molding equipment and manufacturing method of resin molded products - Google Patents

Description

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

As a method for producing a resin molded product, for example, a resin molding apparatus having a molding mold is used.

For example, in the resin molding apparatus (resin molding apparatus) described in Patent Document 1, a molded article is molded using a cavity (mold cavity) of a molding die (mold) to manufacture a resin molded article (package). Is described.

Japanese Unexamined Patent Publication No. 06-177190

However, when changing the height of the resin molded product (package), it is necessary to replace it with a molding mold having a different cavity depth, or to replace a part of the molding mold, which is costly and troublesome.

Therefore, an object of the present invention is to provide a resin molding apparatus capable of changing the depth of a mold cavity of a molding mold and a method for manufacturing a resin molded product.

In order to achieve the above object, the resin molding apparatus of the present invention is used.
Mold and
One type wedge-shaped mechanism and
Including one type cavity block drive mechanism
The molding mold includes one mold and the other mold.
The one mold includes one mold cavity block and one mold cavity frame member.
A sliding hole is formed in one of the cavity frame members.
The one mold cavity block can move in the sliding hole in the mold opening / closing direction of the molding mold.
One mold cavity can be formed by the surface of the one mold cavity block facing the other mold and the inner surface of the one mold cavity frame member.
It is possible to move the one mold cavity block in the mold opening / closing direction by using the one mold cavity block drive mechanism.
Further, the depth of the one mold cavity can be changed by fixing the position of the one mold cavity block in the mold opening / closing direction by using the one mold wedge shape mechanism.

The method for producing a resin molded product of the present invention is
Performed using a resin molding device including a molding mold,
The molding mold includes one mold and the other mold.
The one mold includes one mold cavity block and one mold cavity frame member.
A sliding hole is formed in one of the cavity frame members.
The one mold cavity block can move in the sliding hole in the mold opening / closing direction of the molding mold.
One mold cavity can be formed by the surface of the one mold cavity block facing the other mold and the inner surface of the one mold cavity frame member.
The process of supplying the object to be molded to the molding die and the process of supplying the object to be molded
One mold cavity depth changing step of changing the depth of the one mold cavity by changing the position of the one mold cavity block in the mold opening / closing direction of the molding mold.
A resin molding step of resin molding the object to be molded in the mold cavity, and
It is characterized by including.

According to the present invention, it is possible to provide a resin molding apparatus capable of changing the depth of a mold cavity of a molding mold and a method for manufacturing a resin molded product.

FIG. 1 is a cross-sectional view schematically showing an example of the resin molding apparatus of the present invention. FIG. 2 is a cross-sectional view schematically showing one step in an example of a method for manufacturing a resin molded product using the resin molding apparatus of FIG. FIG. 3 is a cross-sectional view schematically showing another step in the same method for producing a resin molded product as in FIG. FIG. 4 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 5 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 6 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 7 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 8 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 9 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 10 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 11 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 12 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 13 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 14 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 15 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 16 is a cross-sectional view schematically showing still another step in the same method for producing a resin molded product as in FIG. FIG. 17 is a cross-sectional view schematically showing one step in another example of the method for manufacturing a resin molded product using the resin molding apparatus of FIG. 1. FIG. 18 is a cross-sectional view schematically showing another step of the same method for producing a resin molded product as in FIG. FIG. 19 is a cross-sectional view schematically showing still another step of the same method for producing a resin molded product as in FIG. FIG. 20 is a cross-sectional view schematically showing the same resin molding apparatus as in FIG. FIG. 21 is a cross-sectional view schematically showing a state in which the upper mold and the lower mold are removed from the resin molding apparatus of FIG. FIG. 22 is a cross-sectional view schematically showing a state in which an upper die and a lower die different from those in FIG. 20 are attached to the resin molding apparatus of FIG. 20. FIG. 23 is a cross-sectional view schematically showing an example of a mechanism for adsorbing a release film on the upper mold in the resin molding apparatus of FIG.

Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

The resin molding apparatus of the present invention further includes, for example, a pressing force measuring mechanism, and the pressing force measuring mechanism measures the pressing force for pressing the one mold cavity block by using the one mold cavity block driving mechanism. It may be possible.

The resin molding apparatus of the present invention is, for example,
The one type wedge-shaped mechanism includes a pair of one type wedge-shaped members.
The pair of one mold wedge-shaped members include one mold first wedge-shaped member and one mold second wedge-shaped member.
The one mold first wedge-shaped member and the one mold second wedge-shaped member each have a tapered surface, and are arranged so that the tapered surfaces face each other.
By moving at least one of the one mold first wedge-shaped member and the one mold second wedge-shaped member, the said when the one mold first wedge-shaped member and the one mold second wedge-shaped member come into contact with each other. The length of the pair of mold wedge-shaped members in the mold opening / closing direction may be changed. The direction of moving the at least one wedge-shaped member may be, for example, the direction of the tip end direction or the rear end direction of the wedge shape of the wedge-shaped member to be moved.

The resin molding apparatus of the present invention is, for example,
The resin molding apparatus further includes the other mold wedge-shaped mechanism.
The other mold comprises the other mold cavity block.
The position of the other mold cavity block in the mold opening / closing direction may be fixed by using the other mold wedge-shaped mechanism.

The resin molding apparatus of the present invention is, for example,
The other mold wedge mechanism comprises a pair of other mold wedge members.
The pair of other mold wedge-shaped members includes the other mold first wedge-shaped member and the other mold second wedge-shaped member.
The other mold first wedge-shaped member and the other mold second wedge-shaped member each have a tapered surface, and are arranged so that the tapered surfaces face each other.
By moving at least one of the other mold first wedge-shaped member and the other mold second wedge-shaped member, the said when the other mold first wedge-shaped member and the other mold second wedge-shaped member come into contact with each other. The length of the pair of other mold wedge-shaped members in the mold opening / closing direction may be variable. The direction of moving the at least one wedge-shaped member may be, for example, the direction of the tip end direction or the rear end direction of the wedge shape of the wedge-shaped member to be moved.

In the resin molding apparatus of the present invention, for example, in the one mold wedge-shaped mechanism, the pair of one mold wedge-shaped members when the one mold first wedge-shaped member and the one mold second wedge-shaped member come into contact with each other. It may be possible to increase the depth of the one mold cavity by shortening the length in the mold opening / closing direction.

In the resin molding apparatus of the present invention, for example, in the one mold wedge-shaped mechanism, the pair of one mold wedge-shaped members when the one mold first wedge-shaped member and the one mold second wedge-shaped member come into contact with each other. It may be possible to reduce the depth of the one mold cavity by increasing the length in the mold opening / closing direction.

In the resin molding apparatus of the present invention, for example, the one mold may be an upper mold and the other mold may be a lower mold. Further, for example, on the contrary, in the resin molding apparatus of the present invention, the one mold may be a lower mold and the other mold may be an upper mold.

The resin molding apparatus of the present invention may be, for example, an apparatus for transfer molding. Further, the resin molding apparatus of the present invention is not limited to this, and may be, for example, an apparatus for compression molding or the like.

As described above, the method for producing a resin molded product of the present invention is carried out using a resin molding apparatus including a molding die. For example, the resin molding apparatus may be the resin molding apparatus of the present invention.

The method for producing a resin molded product of the present invention may further include, for example, a step of changing the position of the other mold cavity block in the mold opening / closing direction.

In the method for producing a resin molded product of the present invention, for example, the resin molding apparatus is the resin molding apparatus of the present invention, and the resin molding apparatus of the present invention further includes the other mold wedge-shaped mechanism. May be good.

In the method for producing a resin molded product of the present invention, for example, one of the mold cavity depth changing steps may be performed before the object to be molded product supply step is performed.

The method for producing a resin molded product of the present invention may further include, for example, one mold surface coating step of coating the mold surface of the one mold with a release film. Further, in this case, for example, the one mold cavity depth changing step may be performed before the one mold surface coating step is performed. In this way, unlike the case where the one mold cavity depth changing step is performed after the one mold surface coating step is performed, the release film expands and contracts with the one mold cavity depth changing step. There is nothing to do. By suppressing or preventing the expansion and contraction of the release film in this way, the occurrence of resin leakage due to the breakage of the release film, the phenomenon that wrinkles or slack of the release film are transferred to the resin molded product, and the like can be prevented. It is preferable because it can be suppressed or prevented.

In the method for producing a resin molded product of the present invention, for example, in the resin molding step, the object to be molded may be resin-molded by transfer molding. Further, the method for producing a resin molded product of the present invention is not limited to this, and for example, in the resin molding step, the object to be molded may be molded by compression molding or the like.

In the method for producing a resin molded product of the present invention, for example, the product to be molded may be resin-molded by including a plurality of substrates and sealing the substrates with a resin.

In the present invention, the "molding mold" is, for example, a mold, but is not limited to this, and may be, for example, a ceramic mold or the like.

In the present invention, the resin molded product is not particularly limited, and may be, for example, a resin molded product obtained by simply molding a resin, or a resin molded product in which a component such as a chip is resin-sealed. In the present invention, the resin molded product may be, for example, an electronic component or the like.

In the present invention, "resin molding" or "resin sealing" means, for example, a state in which the resin is cured (solidified).

In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. .. Further, it may be a thermosetting resin or a composite material containing a part of a thermoplastic resin. In the present invention, examples of the form of the resin material before molding include granule resin, fluid resin, sheet-like resin, tablet-like resin, powder-like resin and the like. In the present invention, the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include liquid resins and molten resins. In the present invention, the liquid resin means, for example, a resin that is liquid at room temperature or has fluidity. In the present invention, the molten resin refers to, for example, a resin that has become liquid or fluid due to melting. The form of the resin may be any other form as long as it can be supplied to the cavity or pot of the molding die.

Further, in general, the "electronic component" may refer to a chip before being resin-sealed or a state in which the chip is resin-sealed. In the present invention, the term "electronic component" is simply referred to as an "electronic component". Unless otherwise specified, it refers to an electronic component (electronic component as a finished product) in which the chip is resin-sealed. In the present invention, the "chip" refers to a chip before resin sealing, and specific examples thereof include chips such as ICs, semiconductor chips, and semiconductor elements for power control. In the present invention, the chip before resin sealing is referred to as "chip" for convenience in order to distinguish it from the electronic component after resin sealing. However, the "chip" in the present invention is not particularly limited as long as it is a chip before resin sealing, and may not be in the form of a chip.

In the present invention, the "flip chip" refers to an IC chip having a bump-shaped protruding electrode called a bump on an electrode (bonding pad) on the surface of the IC chip, or such a chip form. This chip is mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip is used, for example, as a chip for wireless bonding or one of mounting methods.

In the present invention, for example, a resin molded product may be manufactured by resin-sealing (resin molding) a component (for example, a chip, a flip chip, etc.) mounted on a substrate. In the present invention, the substrate (also referred to as an interposer) is not particularly limited, but may be, for example, a lead frame, a wiring substrate, a wafer, a ceramic substrate, or the like. The substrate may be, for example, a mounting substrate on which chips are mounted on one side or both sides as described above. The method for mounting the chip is not particularly limited, and examples thereof include wire bonding and flip chip bonding. In the present invention, for example, an electronic component in which the chip is resin-sealed may be manufactured by resin-sealing the mounting substrate. The application of the substrate resin-sealed by the resin-sealing device of the present invention is not particularly limited, and examples thereof include a high-frequency module substrate for a mobile communication terminal, a power control module substrate, and a device control substrate. ..

Further, in the present invention, "mounting" includes "mounting" or "fixing". Further, in the present invention, "mounting" includes "fixing".

Hereinafter, specific examples of the present invention will be described with reference to the drawings. For convenience of explanation, each figure is schematically drawn by omitting or exaggerating as appropriate.

In this embodiment, an example of the resin molding apparatus of the present invention and an example of a method for manufacturing a resin molded product using the same will be described.

The cross-sectional view of FIG. 1 schematically shows the configuration of the resin molding apparatus in this embodiment. As shown in the figure, this resin molding apparatus 1000 includes a molding mold including an upper mold (one mold) 1100 and a lower mold (the other mold) 1200, and an upper mold cavity block position changing mechanism installation portion (one mold cavity block position). The change mechanism installation part) 1300 and the lower mold cavity block position change mechanism installation part (the other mold cavity block position change mechanism installation part) 1400 are included as main components. Further, the resin molding apparatus 1000 further includes a release film adsorption mechanism (not shown in FIG. 1) and an air vent opening / closing mechanism 1330 as main components. In this embodiment, the air vent opening / closing mechanism 1330 is one of the components of the upper cavity block position changing mechanism installation portion 1300, but the present invention is not limited thereto. For example, the air vent opening / closing mechanism 1330 may be one of the components of the resin molding apparatus 1000, which is different from the upper die cavity block position changing mechanism installation portion 1300.

The upper mold (one mold) 1100 includes an upper mold cavity block (one mold cavity block) 1101 and an upper mold cavity frame member (one mold cavity frame member) 1102 and 1103. As shown in the figure, two upper cavity blocks 1101 are arranged in parallel. Among the members constituting the upper die cavity frame member, the upper die cavity frame member 1103 is arranged so as to be sandwiched between the two upper die cavity blocks 1101. As shown in the figure, the upper die cavity frame member 1102 is arranged outside the upper die cavity block 1101. A sliding hole 1105 is formed in the upper die cavity frame member so as to be surrounded by the upper die cavity frame members 1102 and 1103. The upper die cavity block 1101 can move in the sliding hole 1105 in the mold opening / closing direction of the molding die. The "mold opening / closing direction" is the opening / closing direction of the upper mold 1100 and the lower mold 1200 in FIG. 1, that is, the vertical direction in the figure. Further, as shown in the drawing, the upper die cavity (one of them) is formed by surrounding the space between the facing surface of the upper die cavity block 1101 with the lower die (the other die) 1200 and the inner side surfaces of the upper die cavity frame members 1102 and 1103. Mold cavity) 1106 can be formed. Then, as will be described later, the resin-molded object to be molded can be pressed by the upper die cavity block 1101 via the release film. Further, an air vent groove 1104 is formed at the lower end of the upper die cavity frame member 1102.

Although not shown in FIG. 1, the upper die cavity frame member 1103 further has a surplus resin portion (unnecessary resin portion or cal portion) which is a space for accommodating the surplus resin (unnecessary resin) at the time of resin molding. Also referred to as) may be formed.

The lower mold (the other mold) 1200 has a lower mold cavity block (the other mold cavity block) 1201, a lower mold side block (the other mold side block) 1202, and a pot block 1203 as main components, and further, a lower mold. Includes a cavity block pillar (the other mold cavity block pillar) 1204, a lower mold elastic member (the other mold elastic member) 1205, and a plunger 1212. The plunger 1212 may be one of the constituent elements of the lower mold 1200 as described above, but may be one of the constituent elements of the resin molding apparatus 1000 different from the lower mold 1200. There are two lower cavity blocks 1201 and each is arranged so that the upper surface faces the upper cavity block 1101. The pot block 1203 is arranged so as to be sandwiched between the two lower cavity blocks 1201. The lower mold side block 1202 is arranged outside the lower mold cavity block 1201 as shown in the figure. The two lower die cavity blocks 1201 are arranged so as to be sandwiched between the lower die side block 1202 and the pot block 1203, respectively. The pot block 1203 is formed with a pot 1211 which is a hole penetrating in the vertical direction. The plunger 1212 can move up and down in the pot 1211. As will be described later, by raising the plunger 1212, the fluid resin in the pot 1211 can be pushed into the upper die cavity 1106.

The lower cavity block pillar 1204 is attached to the lower surface of the lower cavity block 1201. The lower mold elastic member 1205 is arranged so as to surround the lower mold cavity block pillar 1204, and can be expanded and contracted in the mold opening / closing direction (vertical direction in the figure).

The upper die cavity block position change mechanism installation part (one type cavity block position change mechanism installation part) 1300 includes an upper die cavity block drive mechanism (one type cavity block drive mechanism) 1301 and an upper die cavity block holding member (one side). Mold cavity block holding member) 1302, load cell (pressing pressure measuring mechanism) 1303, upper mold cavity block pillar (one mold cavity block pillar) 1304, upper mold wedge mechanism (one mold wedge mechanism, or upper mold) 1310 (also referred to as a cotter mechanism) and an upper mold second wedge-shaped member holding member (also referred to as one mold second wedge-shaped member holding member, an upper mold second cotter holding member, or one mold second cotter holding member) 1321 The elastic member of the upper mold second wedge-shaped member holding member (the elastic member of the other mold second wedge-shaped member holding member) 1322, the air vent opening / closing mechanism 1330, and the upper mold cavity block position changing mechanism installation portion base member (one of them). Mold cavity block position change mechanism installation part base member) 1340, upper die cavity block position change mechanism installation part frame member (one mold cavity block position change mechanism installation part frame member) 1341, upper mold cavity block position change mechanism installation The bottom surface member (one type cavity block position change mechanism installation portion bottom surface member) 1342 and 1343 are included. The platen 1340 is a single plate-shaped member, and is arranged above the upper mold 1100 so as to cover the entire upper mold 1100. Further, as will be described later, other members of the upper die cavity block position changing mechanism installation portion 1300 are directly or indirectly attached to the platen 1340.

As shown in the figure, the upper cavity block holding member 1302 penetrates the platen 1340 in the vertical direction and can move up and down. An upper die cavity block pillar 1304 is attached to the lower end of one die cavity block holding member 1302. An upper cavity block 1101 is attached to the lower end of the upper cavity block pillar 1304. Further, as will be described later, the upper die cavity block 1101 is removable from the upper die cavity block pillar 1304. The upper die cavity block drive mechanism 1301 is connected to the upper end of the upper die cavity block holding member 1302. By moving the upper cavity block holding member 1302 up and down by the upper die cavity block drive mechanism 1301, the upper die cavity block 1101 can be moved up and down (that is, moved in the mold opening / closing direction).

As shown in the figure, the upper die wedge-shaped mechanism 1310 includes an upper die first wedge-shaped member (also referred to as one die first wedge-shaped member, an upper die first cotter, or one mold first cotter) 1311a and an upper die second wedge shape. Members (also referred to as one type second wedge-shaped member, upper type second cotter, or one type second cotter) 1311b and upper type wedge-shaped member power transmission member (one type wedge-shaped member power transmission member, upper type cotter power) Transmission member, or one type cotter power transmission member) 1312, and upper type wedge-shaped member drive mechanism (also referred to as one type wedge-shaped member drive mechanism, upper type cotter drive mechanism, or one type cotter drive mechanism) 1313. including. As shown in FIG. 1, one surface of the upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b in the thickness direction (vertical direction in the drawing) is a tapered surface. More specifically, as shown in the drawing, the lower surface of the upper die first wedge-shaped member 1311a and the upper surface of the upper die second wedge-shaped member 1311b are tapered surfaces, respectively. The upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b are arranged so that their tapered surfaces face each other.

Further, the upper die first wedge-shaped member 1311a is connected to the upper die wedge-shaped member driving mechanism 1313 via the upper die wedge-shaped member power transmission member 1312. Then, a pair of upper wedge-shaped members (a pair of one-sided wedge-shaped members; hereinafter, simply "a pair of one-shaped wedge-shaped members," which are formed by the upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b by the upper die wedge-shaped member driving mechanism 1313. By sliding in the taper direction (left-right direction in the figure) of the tapered surface of the "pair of upper wedge-shaped members", "upper wedge-shaped member", or "upper cotter"), the pair of upper wedge-shaped members The length in the thickness direction of is variable. For example, when the upper die first wedge-shaped member 1311a is slid toward the tip end thereof, the upper die second wedge-shaped member 1311b slides in a direction relatively opposite to the upper die first wedge-shaped member 1311a. Then, the length of the pair of upper wedge-shaped members in the thickness direction (vertical direction in the figure) becomes large. Further, for example, conversely, by sliding the upper die first wedge-shaped member 1311a toward the rear end direction, it is possible to reduce the length of the pair of upper die wedge-shaped members in the thickness direction (vertical direction in the figure). Is. As a result, as will be described later, the position of the upper die cavity block 1101 in the vertical direction (mold opening / closing direction) can be changed. That is, this makes it possible to adjust the depth of the upper die cavity 1106 to an appropriate depth.

In the example of FIG. 1, the upper die first wedge-shaped member 1311a on the upper side of the pair of upper die wedge members can be slid (sliding) in the horizontal (left and right) direction by the upper die wedge member drive mechanism 1313. it can. However, the present invention is not limited to this, and for example, the upper die second wedge-shaped member 1311b may be slidable by the upper die wedge-shaped member drive mechanism 1313, and the upper die first wedge-shaped member 1311a and the upper die first. 2 Both of the wedge-shaped members 1311b may be slidable. The upper wedge-shaped member drive mechanism 1313 is not particularly limited, but for example, a servomotor, an air cylinder, or the like can be used.

Further, in FIG. 1, one surface of each of the upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b is a tapered surface. However, the present invention is not limited to this, as long as at least one wedge-shaped member can be slid along the tapered surface. For example, in one or both of the upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b, only a part of one surface may be a tapered surface. More specifically, for example, in at least one of the upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b shown in the figure, only the tip end side (thin side) of one surface is a tapered surface, and the root side (the root side (thin side)). The thick side) may be a horizontal plane.

The upper surface of the upper die second wedge-shaped member holding member 1321 is in contact with the lower surface of the upper die second wedge-shaped member 1311b. On the other hand, the lower surface of the platen 1340 is in contact with the upper surface of the upper die first wedge-shaped member 1311a. That is, the pair of upper die wedge-shaped members are arranged so as to be sandwiched between the upper surface of the upper die second wedge shape member holding member 1321 and the lower surface of the upper die cavity block position change mechanism installation portion base member 1340. Then, by using the elastic member 1322 of the upper die second wedge-shaped member holding member and the upper die second wedge-shaped member holding member 1321, the upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b are kept in contact with each other. ing.

The bottom member of the upper cavity block position changing mechanism installation portion is formed by the upper member 1342 and the lower member 1343. As shown in the figure, the upper die cavity block position changing mechanism installation portion bottom surface member 1343 can have the upper die cavity frame members 1102 and 1103 attached to the lower surface thereof. As will be described later, the upper die cavity frame members 1102 and 1103 can be attached to and detached from the upper die cavity block position changing mechanism installation portion bottom surface member 1343. Further, the upper die cavity block pillar 1304 penetrates the bottom surface members 1342 and 1343 of the upper die cavity block position changing mechanism installation portion in the vertical direction, and can move up and down. The elastic member 1322 of the upper die second wedge-shaped member holding member is arranged so as to be sandwiched between the lower surface of the upper die second wedge-shaped member holding member 1321 and the upper surface of the upper die cavity block position changing mechanism installation portion bottom surface member 1342, and is vertically and vertically arranged. It can be expanded and contracted in the direction. The upper end of the upper cavity block position changing mechanism installation part frame member 1341 is connected to the lower surface of the platen 1340, and the lower end is connected to the upper surface of the lower surface member 1342 of the upper die cavity block position changing mechanism installation part. Further, the upper die cavity block position changing mechanism installation part frame member 1341 is arranged so as to surround the upper die second wedge-shaped member holding member 1321, the upper die cavity block holding member 1302, and the pair of upper die wedge-shaped members. ing.

The air vent opening / closing mechanism 1330 includes an air vent pin power mechanism 1331 and an air vent pin 1332. As shown in the figure, the air vent pin 1332 includes the upper part of the upper cavity frame member 1102, the lower surface members 1342 and 1343 of the upper cavity block position change mechanism installation part, the upper die cavity block position change mechanism installation part frame member 1341, and the platen 1340. It penetrates in the vertical direction and can move up and down. By moving the air vent pin 1332 up and down by the air vent pin power mechanism 1331, the air vent groove 1104 can be opened and closed, as will be described later. The air vent pin power mechanism 1331 is not particularly limited, but for example, a servomotor, an air cylinder, or the like can be used.

The "upper die cavity block position change mechanism (one die cavity block position change mechanism)" installed in the upper die cavity block position change mechanism installation section (one die cavity block position change mechanism installation section) 1300 is described in this article. In the embodiment, the upper die cavity block drive mechanism (one type cavity block drive mechanism) 1301 and the upper die wedge type mechanism (one type wedge shape mechanism) 1310 are included. However, the present invention is not limited to this, and for example, the upper die cavity block position changing mechanism (one die cavity block position changing mechanism) may further include other components.

As shown in the figure, the lower mold cavity block position change mechanism installation portion 1400 includes a lower mold wedge-shaped mechanism (the other mold wedge-shaped mechanism) 1410, a lower mold mounting member (the other mold mounting member) 1421, and a platen (lower mold second). It includes a wedge-shaped member holding member, or the other mold second wedge-shaped member holding member, the lower mold second cotter holding member, or the other mold second cotter holding member) 1422.

As shown in the figure, the lower mold first wedge-shaped member (also referred to as the other mold first wedge-shaped member, the lower mold first cotter, or the other mold first cotter) 1411a and the lower mold second wedge-shaped mechanism 1410 A member (also referred to as the other mold second wedge-shaped member, the lower mold second cotter, or the other mold second cotter) 1411b and the lower mold wedge-shaped member power transmission member (the other mold wedge-shaped member power transmission member, the lower mold cotter power). A transmission member, or the other mold cotter power transmission member) 1412, and a lower wedge-shaped member drive mechanism (also referred to as the other mold wedge-shaped member drive mechanism, the lower mold cotter drive mechanism, or the other mold cotter drive mechanism) 1413. including. As shown in FIG. 1, the lower die first wedge-shaped member 1411a and the lower die second wedge-shaped member 1411b each have a tapered surface on the other surface in the thickness direction (vertical direction in the drawing). More specifically, as shown in the drawing, the upper surface of the lower mold first wedge-shaped member 1411a and the lower surface of the lower mold second wedge-shaped member 1411b are tapered surfaces, respectively. The lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b are arranged so that their tapered surfaces face each other.

Further, the lower die first wedge-shaped member 1411a is connected to the lower die wedge-shaped member driving mechanism 1413 via the lower die wedge-shaped member power transmission member 1412. Then, a pair of lower wedge-shaped members (a pair of other lower wedge-shaped members; hereinafter simply referred to as "a pair of other lower-shaped wedge-shaped members" formed by the lower-mold first wedge-shaped member 1411a and the lower-mold second wedge-shaped member 1411b by the lower-mold wedge-shaped member driving mechanism 1413. By sliding in the taper direction (left-right direction in the figure) of the tapered surface of the pair of lower wedge-shaped members, the lower wedge-shaped member, or the lower cotter), the pair of lower wedge-shaped members The length in the thickness direction of is variable. For example, when the lower mold first wedge-shaped member 1411a is slid toward the tip end thereof, the lower mold second wedge-shaped member 1411b slides in a direction relatively opposite to the lower mold first wedge-shaped member 1411a. Then, the length of the pair of lower wedge-shaped members in the thickness direction (vertical direction in the figure) becomes large. Further, for example, conversely, by sliding the lower die first wedge-shaped member 1411a toward the rear end direction, it is possible to reduce the length of the pair of lower die wedge-shaped members in the thickness direction (vertical direction in the figure). Is. As a result, as will be described later, the position of the lower die cavity block 1201 in the vertical direction (mold opening / closing direction) can be changed. As a result, for example, even if the thickness of the substrate (object to be molded) 10 described later varies (for example, even if the thickness of the left and right substrates 10 in FIG. 6 described later is different), each lower die cavity block 1201 (for example, FIG. By appropriately changing (adjusting) the positions of the left and right lower cavity blocks 1201) in No. 6, the left and right substrates 10 can be clamped with an appropriate pressing force.

In the example of FIG. 1, the lower die first wedge-shaped member 1411a on the lower side of the pair of lower die wedge members is slid (sliding) in the horizontal (left and right) direction by the lower die wedge member drive mechanism 1413. Can be done. However, the present invention is not limited to this, and for example, the lower die second wedge-shaped member 1411b may be slidable by the lower die wedge-shaped member driving mechanism 1413, and the lower die first wedge-shaped member 1411a and the lower die second. Both wedge-shaped members 1411b may be slidable. The lower wedge-shaped member drive mechanism 1413 is not particularly limited, but for example, a servomotor, an air cylinder, or the like can be used.

Further, in FIG. 1, one surface of each of the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b is a tapered surface. However, the present invention is not limited to this, as long as at least one wedge-shaped member can be slid along the tapered surface. For example, in one or both of the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b, only a part of one surface may be a tapered surface. More specifically, for example, in at least one of the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b shown in the figure, only the tip end side (thin side) of one surface is a tapered surface, and the root side (the root side (thin side)). The thick side) may be a horizontal plane. Further, in FIG. 1, although the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b are not in contact with each other, the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411a are similar to the upper-mold wedge-shaped mechanism 1310. The state in which the member 1411b is in contact with the member 1411b may be maintained.

The upper surface of the lower mold second wedge-shaped member holding member 1422 is in contact with the lower surface of the lower mold first wedge-shaped member 1411a. On the other hand, the lower end of the lower die cavity block pillar 1204 is connected to the upper surface of the lower die second wedge-shaped member 1411b. That is, the pair of lower die wedge-shaped members are arranged so as to be sandwiched between the upper surface of the lower die second wedge shape member holding member 1422 and the lower end of the lower die cavity block pillar 1204. Then, the lower die cavity block 1201 can be moved up and down by changing the length of the pair of lower die wedge-shaped members in the thickness direction.

The lower mold mounting member 1421 is arranged above the lower mold second wedge-shaped member holding member 1422, and is fixed to the lower mold second wedge-shaped member holding member 1422 so as not to move up and down relatively. In the space sandwiched between the lower mold mounting member 1421 and the lower mold second wedge-shaped member holding member 1422, the pair of lower mold wedge-shaped members can be driven as described above to change the length in the thickness direction thereof. It is possible. A lower mold side block 1202 and a pot block 1203 are installed on the upper surface of the lower mold mounting member 1421. Further, the lower die cavity block pillar 1204 penetrates the lower die mounting member 1421 in the vertical direction and can move up and down. The lower mold elastic member 1205 is sandwiched between the lower surface of the lower mold cavity block 1201 and the upper surface of the lower mold mounting member 1421, and can be expanded and contracted in the mold opening / closing direction (vertical direction in the figure) as described above.

The "lower mold cavity block position change mechanism (the other mold cavity block position change mechanism)" installed in the lower mold cavity block position change mechanism installation part (the other mold cavity block position change mechanism installation part) 1400 is described in this article. In the embodiment, a lower wedge-shaped mechanism (the other type wedge-shaped mechanism) 1410 is included. However, the present invention is not limited to this, and for example, the lower mold cavity block position changing mechanism (the other mold cavity block position changing mechanism) may further include other components.

The method for producing a resin molded product using the resin molding apparatus of FIG. 1 can be performed, for example, as shown in FIGS. 2 to 16.

First, as shown in FIGS. 2 to 4, the depth of the upper mold cavity 1106 is changed (one mold cavity depth changing step). Specifically, it is as follows.

First, as shown in FIG. 2, the upper cavity block drive mechanism 1301 is used to lower the upper cavity block 1101 in the direction of arrow c1. At this time, the upper die cavity block 1101 is lowered until the upper die cavity 1106 becomes less than a predetermined (target) depth. As will be described later, the upper die cavity block 1101 is raised again to bring the upper die cavity 1106 to a predetermined (target) depth.

Next, as shown in FIG. 3, the left and right upper die first wedge-shaped members 1311a are moved in the direction of their tip ends (direction of arrow e1), respectively. As a result, the length of the pair of upper wedge-shaped members including the upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b increases in the thickness direction (mold opening / closing direction, vertical direction in the figure). Then, as shown in the drawing, the upper die second wedge-shaped member holding member 1321 is pushed down by the upper die second wedge-shaped member 1311b and lowered. At this time, the upper die second wedge-shaped member holding member 1321 is lowered to a position corresponding to the depth of the predetermined (target) upper die cavity 1106.

Next, as shown in FIG. 4, the upper die cavity block drive mechanism 1301 is used to raise the upper die cavity block 1101 in the direction of arrow d1. At this time, as shown in the drawing, the upper die cavity block holding member 1302 is raised until it comes into contact with the upper die second wedge-shaped member holding member 1321. As a result, each of the left and right upper die cavities 1106 has a target depth (D1 on the right side of the figure and D2 on the left side).

In this embodiment, for convenience of illustration and explanation, an example in which the depth of the upper die cavity 1106 is different on the left and right sides of the figure is shown. However, in the present invention, the example of changing the depth of the mold cavity of the molding mold is not limited to this. Specifically, for example, in one method of manufacturing a resin molded product, when the depths of the mold cavities of all the molding molds in one resin molding apparatus are made the same, and the method of manufacturing the resin molded product is performed again. If necessary, the depth of the mold cavity may be changed from that of the previous times.

After changing the depth of the upper die cavity 1106 as described above, resin molding can be performed, for example, as shown in FIGS. 5 to 16. Specifically, it is as follows.

First, as shown in FIG. 5, the release film 40 is supplied to the mold surface (upper mold surface) of the upper mold 1100. Then, the upper mold surface is covered with the release film 40 by adsorption or the like (one mold surface coating step). As will be described later, a release film adsorption mechanism (not shown in FIG. 5) may be used for adsorption. Further, as shown in the drawing, the "mold surface (upper mold surface)" of the upper mold 1100 to which the release film 40 is attracted includes the mold surface of the upper mold cavity 1106 and the lower surface of the upper mold cavity frame member 1102. Further, at this time, as shown in the drawing, the release film 41 is also supplied to the inside of the air vent groove 1104. In the state of FIG. 5, since the air vent groove 1104 is not closed, the release film 40 can be adsorbed through the air vent groove 1104.

The release film 40 can be adsorbed as shown in FIG. 23, for example. In FIG. 23, the resin molding apparatus 1000 has a release film adsorption mechanism 1351. The release film adsorption mechanism 1351 is not particularly limited, but for example, a suction pump or the like can be used. The platen 1340, the upper die cavity block position change mechanism installation part frame member 1341, the upper die cavity block position change mechanism installation part bottom surface members 1342 and 1343, and the upper die cavity frame members 1102 and 1103 are attracted to the release film. A pipe 1352 is provided. The release film suction pipe 1352 is branched, and one end of each branch is opened as a release film suction hole 1353 at the lower ends of the upper mold cavity frame members 1102 and 1103. Then, by sucking from the other end of the release film suction pipe 1352 by the release film suction mechanism 1351, the release films 40 and 41 are brought into the upper mold surface and the air vent groove 1104 through the release film suction hole 1353. Can be adsorbed.

Further, the release films 40 and 41 are conveyed to the position of the molding die by, for example, a release film conveying mechanism (not shown), and then on the mold surface (upper mold surface) of the upper mold 1100 as described above. May be supplied.

Further, in this embodiment, an example in which the release films 40 and 41 are used is shown. However, the present invention is not limited to this, and for example, a release film may not be used.

Next, as shown in FIG. 6, a tablet (resin material) 20a is supplied into the pot 1211. At the same time, as shown in the drawing, the product to be molded (object to be molded) 10 is supplied to the upper surface of the lower mold cavity block 1201 (process of supplying the product to be molded). The resin material 20a may be, for example, a thermosetting resin, but is not limited to this, and may be, for example, a thermoplastic resin. At this time, the upper die 1100 and the lower die 1200, or only the lower die 1200 may be heated in advance by a heater (not shown) to raise the temperature. Further, for example, the resin material 20a and the product 10 to be molded may be conveyed to the position of the molding die by a conveying mechanism (not shown) and supplied to the molding die.

Further, in this embodiment, the product to be molded (object to be molded) 10 is a substrate, and may be simply referred to as "substrate 10" below. As shown in the drawing, the chip 1 and the wire 2 are placed (fixed) on one surface of the substrate 10. In the method for manufacturing the resin molded product of this embodiment, as shown in the drawing, the fixing surface of the chip 1 and the wire 2 of the substrate 10 faces upward (the side of the upper die cavity 1006), and as will be described later, this surface Is sealed with resin to manufacture resin molded products (electronic parts). However, in the present invention, the product to be molded (molded product) is not limited to this. The product to be molded (molded product) may be, for example, a lead frame, a wiring board, a wafer, a ceramic substrate, or the like, or any other product to be molded (molded product), as described above. May be good.

Next, as shown in FIG. 7, the lower die 1200 is raised in the direction of the arrow X1 by a drive source (not shown), and the substrate 10 is sandwiched between the lower die cavity block 1201 and the upper die cavity frame member 1102. At this time, as shown in the drawing, the resin material 20a is melted and changed to the molten resin (fluid resin) 20b by the heat of the lower mold 1200 which has been heated in advance.

Next, as shown in FIG. 8, the lower mold 1200 is further raised in the direction of arrow X2. As a result, upward pressure is applied by the lower cavity block 1201 to the substrate 10 sandwiched between the lower cavity block 1201 and the upper cavity frame member 1102. In this way, the substrate 10 is sandwiched between the lower die cavity block 1201 and the upper die cavity frame member 1102 and clamped (step of fixing the object to be molded).

Next, as shown in FIG. 9, the lower mold first wedge-shaped member 1411a is moved in the direction of its tip (direction of arrow a1) and brought into contact with the lower mold second wedge-shaped member 1411b. By fixing the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b at this position, the vertical position of the lower mold cavity block 1201 is fixed at this position.

Next, as shown in FIG. 10, the lower mold 1200 is lowered in the direction of the arrow Y1 to open the mold once. As a result, the lower mold first wedge-shaped member 1411a is once separated from the lower mold second wedge-shaped member 1411b. This is done in order to facilitate the movement of the lower mold first wedge-shaped member 1411a in FIG. 11 below.

Next, as shown in FIG. 11, the lower mold first wedge-shaped member 1411a is slightly moved in the tip direction (direction of arrow a2). As a result, the length in the thickness direction of the pair of lower mold cotters including the lower mold first wedge-shaped member 1411a and the lower mold second wedge-shaped member 1411b is slightly increased in consideration of the tightening allowance of the substrate 10.

Next, as shown in FIG. 12, the lower mold 1200 is raised in the direction of arrow X3, and the molding mold is tightened again. Further, a depressurizing mechanism (not shown) is used to depressurize the inside of the molding die (inside the upper die cavity 1106, etc.). At this time, as shown in FIG. 13, an upward force is continuously applied to the lower mold 1200 in the direction of the arrow X4.

Next, as shown in FIG. 14, the plunger 1212 is moved upward (in the direction of arrow g1) to push the fluid resin 20b in the pot 1212 into the upper cavity 1106.

Further, as shown in FIG. 15, the air vent pin 1332 is pushed downward (in the direction of arrow h1) by the air vent pin power mechanism 1331 to close the air vent groove 1104. Then, as shown in the figure, the plunger 1212 is further raised in the direction of the arrow g2 to finally fill the upper die cavity 1106 with the fluid resin 20b. At this time, the upper die cavity block 1101 is fixed by using the upper die wedge shape mechanism 1310 (second one die cavity block fixing step). Further, the lower die cavity block 1201 is fixed by using the lower die wedge shape mechanism 1410. By fixing the upper cavity block 1101 and the lower cavity block 1201 in this way, even if resin pressure is applied to the upper cavity 1106, the upper cavity block 1101 and the lower cavity block 1201 open and close the mold. It is possible to suppress or prevent the movement in the direction.

Further, as shown in FIG. 16, after the fluid resin 20b is cured to become the cured resin (sealing resin) 20 and the surplus resin (unnecessary resin portion) 20d, the lower mold 1200 is lowered in the direction of the arrow Y2. Open the mold. The method of curing the fluid resin 20b to obtain the cured resin (sealing resin) 20 is not particularly limited. For example, when the fluid resin 20b is a thermosetting resin, it may be cured by continuing heating. Further, for example, when the fluid resin 20b is a thermoplastic resin, it may be cured by stopping heating to the molding die and allowing it to cool as it is. In this way, a resin molded product (electronic component) in which one surface (fixing surface of the chip 1 and the wire 2) of the substrate 10 is sealed with the cured resin (sealing resin) 20 can be manufactured. After that, the resin molded product is carried out of the resin molding apparatus 1000 by an unloader (not shown) or the like and collected.

In the method for producing a resin molded product of the present invention, the "resin molding step" is not limited to the method described with reference to FIGS. 2 to 16. For example, although transfer molding is shown in FIGS. 2 to 16, in the present invention, any other resin molding method such as compression molding can be used. Further, the transfer molding method is not limited to the methods shown in FIGS. 2 to 16, and is arbitrary.

In the present invention, for example, as described in the present embodiment, the depth of one mold cavity can be changed according to the thickness of the product to be molded. Further, according to the resin molding apparatus of the present invention, the number of parts of the molding die can be reduced, and the cost of the molding die can be reduced.

For changing the position of the one mold cavity block, for example, the one mold wedge-shaped mechanism may be used. Further, for the position change, for example, as described in this embodiment, the one mold cavity block drive mechanism, the other mold wedge shape mechanism, or the like may be used, if necessary.

Further, the present invention is not limited to the present embodiment, and any modification is possible. For example, in this embodiment, the "one mold" is the upper mold and the "other mold" is the lower mold. However, the present invention is not limited to this, and conversely, the "one type" may be a lower type and the "other type" may be an upper type.

[Example 2]
Next, another embodiment of the present invention will be described.

In this embodiment, another example of a method for manufacturing a resin molded product using the resin molding apparatus (FIG. 1) of Example 1 will be described. More specifically, an example will be described in which the "one mold cavity depth changing step" for changing the depth of the upper die cavity 1106 is performed by a method different from the method of Example 1 (FIGS. 2 to 4). ..

The "one mold cavity depth changing step" can be performed, for example, as shown in FIGS. 17 to 19. Specifically, first, as shown in FIG. 17, the same resin molding apparatus 1000 as in FIG. 1 is prepared. In FIG. 17, the initial depth of the upper die cavity 1006 is the same D0 on the left and right.

First, as shown in FIG. 18, the upper cavity block drive mechanism 1301 is used to lower the upper cavity block 1101 in the direction of arrow c101. As a result, the depths of the left and right upper mold cavities 1006 are set to predetermined (target) depths, respectively.

Next, as shown in FIG. 19, the left and right upper die first wedge-shaped members 1311a are moved in the direction of their tip ends (direction of arrow e101), respectively. As a result, the length of the pair of upper wedge-shaped members including the upper die first wedge-shaped member 1311a and the upper die second wedge-shaped member 1311b increases in the thickness direction (mold opening / closing direction, vertical direction in the figure). Then, as shown in the drawing, the upper die second wedge-shaped member holding member 1321 is pushed down by the upper die second wedge-shaped member 1311b and lowered. At this time,
As shown in the figure, the upper die second wedge-shaped member holding member 1321 is lowered until it comes into contact with the upper die cavity block holding member 1302. As described above, the "one-mold cavity depth changing step" for changing the depth of the upper die cavity 1106 can be performed. Subsequent resin molding can be performed, for example, in the same manner as in FIGS. 5 to 16 of Example 1.

Note that FIGS. 17 to 19 show an example in which the depth of the upper cavity 1106 is changed to a different depth on the left and right sides of the figure for convenience of illustration and explanation. However, as described in Example 1, in the present invention, the example of changing the depth of the mold cavity of the molding die is not limited to this. Specifically, for example, as described in Example 1, in the method of manufacturing a resin molded product once, the depths of the mold cavities of all the molding molds in one resin molding apparatus are made the same, and the resin molding is performed again. When the method of manufacturing the product is carried out, if necessary, the depth of the mold cavity may be changed from that of the previous times.

[Example 3]
Next, yet another embodiment of the present invention will be described.

In the resin molding apparatus of the present invention, for example, only the molding die can be replaced with another molding die. This makes it possible to easily handle resin molding using molding molds having different specifications.

FIG. 20 is a cross-sectional view showing the same configuration of the resin molding apparatus 1000 as in FIG. 1 (Example 1). The configuration of this resin molding apparatus is as described with reference to FIG.

In FIG. 21, the upper die 1100 and the lower die 1200 are removed from the resin molding apparatus 1000 of FIG. 20 (FIG. 1) to remove the upper die 1100 and the lower die 1200 to install the upper die cavity block position changing mechanism (one die cavity block position changing mechanism setting section) 1300 and FIG. It is sectional drawing which shows typically the state which left the lower mold cavity block position change mechanism installation part (the other type cavity block position change mechanism installation part) 1400. The configurations of the upper cavity block position changing mechanism installation unit 1300 and the lower cavity block position changing mechanism installation unit 1400 are as described with reference to FIG.

FIG. 22 is a cross-sectional view schematically showing the configuration of a resin molding apparatus in which an upper mold 1100a different from the apparatus of FIG. 20 (FIG. 1) and another lower mold 1200a are attached to FIG. 21. The upper mold (one mold) 1100a has an upper mold cavity block (one mold cavity block) 1101a in place of the upper mold cavity block (one mold cavity block) 1101 and has an upper mold cavity frame member (one mold). The upper die cavity frame member (one mold cavity frame member) 1102a is provided in place of the upper die cavity frame member (1102), and the upper die cavity frame member (one side) is provided in place of the upper die cavity frame member (one die cavity frame member) 1103. The mold cavity frame member) 1103a, the air vent groove 1104a instead of the air vent groove 1104, the sliding hole 1105a instead of the sliding hole 1105, and the upper mold cavity (one mold cavity) 1106. Instead, it has an upper mold cavity (one mold cavity) 1106a. The upper die 1100a is the same as the upper die 1100 of FIG. 20 (FIG. 1) except that the shapes, dimensions, and the like of each part (for example, the upper die cavity block and the upper die cavity frame member) are slightly different. Further, the lower mold (the other mold) 1200a has a lower mold cavity block (the other mold cavity block) 1201a in place of the lower mold cavity block (the other mold cavity block) 1201 and has a lower mold side block (the other mold). The lower mold side block (the other mold side block) 1202a is provided in place of the mold side block (1202), the pot block 1203a is provided in place of the pot block 1203, and the lower mold cavity block pillar (the other mold cavity block pillar). The lower mold cavity block pillar (the other mold cavity block pillar) 1204a is provided in place of 1204, and the lower mold elastic member (the other mold elastic member) 1205a is replaced by the lower mold elastic member (the other mold elastic member) 1205. Have. The lower mold 1200a is the same as the lower mold 1200 of FIG. 20 (FIG. 1) except that the shapes, dimensions, and the like of each part (for example, the lower mold cavity block and the pot block) are slightly different.

For example, as shown in FIGS. 20 to 22, by exchanging the molding die with a molding die having different specifications, it is possible to cope with resin molding having different specifications. Specifically, for example, as shown in FIGS. 20 to 22, the shape of the upper cavity block may be changed according to the required cavity shape. Further, for example, as shown in FIGS. 20 to 22, the shape of the lower cavity block may be changed according to the shape of the substrate to be used. Further, for example, as shown in FIGS. 20 to 22, the shape of the pot block may be changed according to the number and shape of the resin tablets (resin materials) used. Further, for example, the air vent opening / closing mechanism may be moved according to the shape of the molding die.

In the resin molding apparatus of the present invention, for example, as shown in FIGS. 1 to 22, the wedge-shaped mechanism (cotter mechanism) is not incorporated as a part of the molding die, and the molding die and the wedge-shaped mechanism (cotter mechanism) are separated. It is configured separately. Thereby, for example, as shown in FIGS. 20 to 22, the molding die can be easily replaced without replacing the wedge-shaped mechanism (cotter mechanism) or preparing another wedge-shaped member (cotter). Therefore, according to the resin molding apparatus of the present invention, for example, it is easy to replace the molding die for changing the type of the resin molded product.

Further, the present invention is not limited to the above-described embodiment, and can be arbitrarily and appropriately combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. It is a thing.

1 Chip 2 Wire 10 Substrate (object to be molded)
20 Cured resin (sealing resin)
20a tablet (resin material)
20b Molten resin (fluid resin)
20d surplus resin (unnecessary resin part)
40 Release film 41 Release film for air vent 1000 Resin molding device 1100, 1100a Upper mold (one mold)
1101, 1101a Upper mold cavity block (one mold cavity block)
1102, 1102a Upper mold cavity frame member (one mold cavity frame member)
1103, 1103a Upper mold cavity frame member (one mold cavity frame member)
1104, 1104a Air vent groove 1105, 1105a Sliding hole 1106, 1106a Upper mold cavity (one mold cavity)
1200, 1200a lower mold (the other mold)
1201, 1201a Lower mold cavity block (other mold cavity block)
1202, 1202a Lower type side block (other type side block)
1203, 1203a Pot block 1204, 1204a Lower mold cavity block pillar (the other mold cavity block pillar)
1205, 1205a Lower mold elastic member (the other mold elastic member)
1211 Pot 1212 Plunger 1300 Upper mold cavity block position change mechanism installation part (one mold cavity block position change mechanism installation part)
1301 Upper mold cavity block drive mechanism (one mold cavity block drive mechanism)
1302 Upper mold cavity block holding member (one mold cavity block holding member)
1303 load cell (pressing pressure measuring mechanism)
1304 Upper type cavity block pillar (one type cavity block pillar)
1310 Upper type wedge-shaped mechanism (one type wedge-shaped mechanism)
1311a Upper mold first wedge-shaped member (one mold first wedge-shaped member)
1311b Upper mold second wedge-shaped member (one mold second wedge-shaped member)
1312 Upper type wedge-shaped member power transmission member (one type wedge-shaped member power transmission member)
1313 Upper type wedge-shaped member drive mechanism (one type wedge-shaped member drive mechanism)
1321 Upper mold second wedge-shaped member holding member (one mold second wedge-shaped member holding member)
1322 Elastic member of the upper mold second wedge-shaped member holding member (elastic member of one mold second wedge-shaped member holding member)
1330 Air vent opening / closing mechanism 1331 Air vent pin Power mechanism 1332 Air vent pin 1340 Platen (upper mold cavity block position change mechanism installation part base member, or one type cavity block position change mechanism installation part base member)
1341 Upper mold cavity block position change mechanism installation part frame member (one mold cavity block position change mechanism installation part frame member)
1342, 1343 Upper mold cavity block position change mechanism installation part bottom member (one type cavity block position change mechanism installation part bottom member)
1351 Release film suction mechanism 1352 Release film suction pipe 1353 Release film suction hole 1400 Lower mold cavity block position change mechanism installation part (the other mold cavity block position change mechanism installation part)
1410 Lower wedge-shaped mechanism (the other type wedge-shaped mechanism)
1411a Lower mold first wedge-shaped member (other mold first wedge-shaped member)
1411b Lower mold second wedge-shaped member (the other mold second wedge-shaped member)
1412 Lower die wedge-shaped member power transmission member (the other die wedge-shaped member power transmission member)
1413 Lower type wedge-shaped member drive mechanism (the other type wedge-shaped member drive mechanism)
1421 Lower mold mounting member (the other mold mounting member)
1422 Platen (lower mold second wedge-shaped member holding member or other mold second wedge-shaped member holding member)
X1 to X4 Arrows Y1 to Y2 indicating the ascending direction or force applying direction of the lower mold (the other mold) 1200 Arrows a1 to a2 indicating the descending direction of the lower mold (the other mold) 1200 Lower mold first wedge-shaped member (the other) Arrows c1 to c2 indicating the forward direction of the mold first wedge-shaped member) 1411a, c101 Arrows indicating the downward direction of the upper cavity block (one mold cavity block) 1101 d1 Upper mold cavity block (one mold cavity block) 1101 Arrows e1 to e2 and e101 indicating the ascending direction of the arrow g1 to g2 indicating the forward direction of the upper mold first wedge-shaped member (one mold first wedge-shaped member) 1311a and descending the arrow h1 air vent pin 1332 indicating the pushing direction of the plunger 1212. Direction arrows D0, D1, D2 Depth of upper cavity 1006

Claims (16)

Mold and
One type wedge-shaped mechanism and
Including one type cavity block drive mechanism
The molding mold includes one mold and the other mold.
The one mold includes one mold cavity block and one mold cavity frame member.
A sliding hole is formed in one of the cavity frame members.
The one mold cavity block can move in the sliding hole in the mold opening / closing direction of the molding mold.
One mold cavity can be formed by the surface of the one mold cavity block facing the other mold and the inner surface of the one mold cavity frame member.
It is possible to move the one mold cavity block in the mold opening / closing direction by using the one mold cavity block drive mechanism.
Moreover, using said one of the mold cavity block drive mechanism, the moving one of the mold cavity block to a height position of interest, and using said one of the mold wedge mechanism, is moved to the height position A resin molding apparatus, characterized in that the depth of the one mold cavity can be changed by fixing the one mold cavity block so as to limit the position in the direction away from the other mold. In addition, it includes a pressing force measuring mechanism.
The resin molding apparatus according to claim 1, wherein the pressing force measuring mechanism can measure the pressing force for pressing the one mold cavity block by using the one mold cavity block driving mechanism. The one type wedge-shaped mechanism includes a pair of one type wedge-shaped members.
The pair of one mold wedge-shaped members include one mold first wedge-shaped member and one mold second wedge-shaped member.
The one mold first wedge-shaped member and the one mold second wedge-shaped member each have a tapered surface, and are arranged so that the tapered surfaces face each other.
By moving at least one of the one mold first wedge-shaped member and the one mold second wedge-shaped member, the said when the one mold first wedge-shaped member and the one mold second wedge-shaped member come into contact with each other. The resin molding apparatus according to claim 1 or 2, wherein the length of the pair of mold wedge-shaped members in the mold opening / closing direction can be changed. The resin molding apparatus further includes the other mold wedge-shaped mechanism.
The other mold comprises the other mold cavity block.
The resin molding apparatus according to any one of claims 1 to 3, wherein the position of the other mold cavity block in the mold opening / closing direction can be fixed by using the other mold wedge-shaped mechanism. The other mold is raised toward the one mold, and a part of the object to be molded is pressed by the one mold cavity frame member and the other mold cavity block, and the other mold is formed by the other mold wedge-shaped mechanism. 4. The position of the other mold cavity block can be fixed by setting the other mold cavity block to a position closer to the one mold than the fixed position of the other mold cavity block. Resin molding equipment. The other mold wedge mechanism comprises a pair of other mold wedge members.
The pair of other mold wedge-shaped members includes the other mold first wedge-shaped member and the other mold second wedge-shaped member.
The other mold first wedge-shaped member and the other mold second wedge-shaped member each have a tapered surface, and are arranged so that the tapered surfaces face each other.
By moving at least one of the other mold first wedge-shaped member and the other mold second wedge-shaped member, the said when the other mold first wedge-shaped member and the other mold second wedge-shaped member come into contact with each other. The resin molding apparatus according to claim 4, wherein the length of the pair of other mold wedge-shaped members in the mold opening / closing direction can be changed. In the one mold wedge-shaped mechanism, when the one mold first wedge-shaped member and the one mold second wedge-shaped member come into contact with each other, the length of the pair of one mold wedge-shaped members in the mold opening / closing direction is shortened. The resin molding apparatus according to any one of claims 3 to 6 , wherein the depth of one of the mold cavities can be increased. In the one mold wedge-shaped mechanism, when the one mold first wedge-shaped member and the one mold second wedge-shaped member come into contact with each other, the length of the pair of one mold wedge-shaped members in the mold opening / closing direction is increased. The resin molding apparatus according to any one of claims 3 to 7 , wherein the depth of one of the mold cavities can be made shallower. This is performed using a resin molding device including a molding mold , one mold cavity block drive mechanism, and one mold wedge shape mechanism.
The molding mold includes one mold and the other mold.
The one mold includes one mold cavity block and one mold cavity frame member.
A sliding hole is formed in one of the cavity frame members.
The one mold cavity block can be moved in the sliding hole in the mold opening / closing direction of the molding mold by the one mold cavity block drive mechanism.
By fixing the position of the one mold cavity block using the one mold wedge-shaped mechanism, the facing surface of the one mold cavity block with the other mold and the inner surface surface of the one mold cavity frame member. It is possible to form one mold cavity with and
The process of supplying the object to be molded to the molding die and the process of supplying the object to be molded
One mold cavity depth changing step of changing the depth of the one mold cavity by changing the position of the one mold cavity block in the mold opening / closing direction of the molding mold.
A resin molding step of resin molding the object to be molded in the mold cavity, and
Only including,
In the one mold cavity depth changing step, the one mold cavity block drive mechanism is used to move the one mold cavity block to a target height position, and the one mold wedge shape mechanism is used. A method for producing a resin molded product, which comprises fixing the one mold cavity block moved to the height position so as to limit the position in the direction away from the other mold. The method for producing a resin molded product according to claim 9 , wherein the resin molding device is the resin molding device according to any one of claims 1 to 8. The other mold comprises the other mold cavity block.
The method for producing a resin molded product according to claim 9 or 10 , further comprising a step of changing the position of the other mold cavity block in the mold opening / closing direction. The resin molding apparatus further includes the other mold wedge-shaped mechanism.
In the step of changing the position of the other mold cavity block, the other mold was raised toward the one mold, and a part of the object to be molded was pressed by the one mold cavity frame member and the other mold cavity block. The resin molded product according to claim 11, wherein in this state, the other mold cavity block is set at a position closer to the one mold than at a position where the other mold cavity block is fixed by the other mold wedge-shaped mechanism. Manufacturing method. The method for producing a resin molded product according to claim 11 , wherein the resin molding device is the resin molding device according to claim 4 or 6. The method for producing a resin molded product according to any one of claims 9 to 13 , wherein one of the mold cavity depth changing steps is performed before the product supply step is performed. Further, it includes a mold surface coating step of coating the mold surface of the one mold with a release film.
The method for producing a resin molded product according to any one of claims 9 to 14 , wherein the one mold cavity depth changing step is performed before the one mold surface coating step is performed. The object to be molded contains a plurality of substrates and contains a plurality of substrates.
The method for producing a resin molded product according to any one of claims 9 to 15 , wherein the object to be molded is resin-molded by sealing the resin between the substrates.

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