JP5958505B2 - Resin sealing device and sealing method thereof - Google Patents

Description

  The present invention relates to a resin sealing device and a resin sealing method for sealing an electronic component with a sealing resin.

Electronic components such as semiconductor elements, resistance elements, and capacitors are sealed with a sealing resin for the purpose of protection.
For example, DIP (Dual Inline Package), QFP (Quad Flat Package), PLCC (Plastic leaded chip carrier) and other semiconductor devices with semiconductor elements mounted on them, BGA (Ball grid array) and LGA (Land grid array) In a semiconductor device in which a semiconductor element is mounted on a resin substrate such as a substrate, the entire semiconductor element is sealed with a sealing resin.

When sealing a semiconductor element mounted on a resin substrate with a sealing resin, the sealing resin is injected into the cavity where the semiconductor element is located with the resin substrate sandwiched between the upper mold and the lower mold. To do.
A semiconductor element is covered with a sealing resin to seal the entire electronic component, but a semiconductor element that generates a large amount of heat exposes a part of the semiconductor element or a heat sink provided in the semiconductor element from the sealing resin. May be sealed.
As a conventional resin sealing device for sealing such an electronic component, a device described in Patent Document 1 is known.

In the method of manufacturing a semiconductor device described in Patent Document 1, as shown in FIG. 15A, a semiconductor element 1101 is interposed between a pair of opposing metal plates 1102 and 1103, and the respective metal plates 1102 and 1103 and the semiconductor element 1101 are interposed. The member 1110 connected to each other is placed in the mold 1200, and the member 1110 is molded by injecting the resin 1105.
In the molding step, as shown in FIG. 15B, the outer surface 1102a of one metal plate 1102 and the mold 1200 are brought into close contact with each other, and the resin injected between the outer surface 1103a of the other metal plate 1103 and the mold 1200 is injected. In a state where a gap 1106 of a size capable of flowing 1105 is provided, the resin 1105 is injected to fill the gap 1106 with the resin 1105, and then the resin 1105 covering the outer surface 1103a of the other metal plate 1103 is removed. The outer surface 1103a is exposed.

  In the method of manufacturing a semiconductor device described in Patent Document 1, there is a gap 1106 of a size that allows the injected resin 1105 to flow between the outer surface 1103 a of the other metal plate 1103 and the mold 1200. Therefore, when the mold 1200 is clamped between the upper mold and the lower mold, a compressive force that sandwiches the member 1110 is not applied. Therefore, the member 1110 can be sealed without destroying the semiconductor element 1101 positioned between the metal plates 1102 and 1103.

However, in the method of manufacturing the semiconductor device described in Patent Document 1, a gap 1106 is provided between the outer surface 1103a of the other metal plate 1103 and the mold 1200 as shown in FIG. The outer surface 1103 a of the plate 1103 is covered with the resin 1105. Therefore, after the molding process for sealing the semiconductor element with the sealing resin, a removal process for removing the resin 1105 covering the outer surface 1103a is necessary. Therefore, in the method for manufacturing a semiconductor device described in Patent Document 1, an extra step is required, and thus the number of steps for manufacturing a semiconductor device is increased.
Thus, a resin sealing device that seals by directly sandwiching a resin substrate with upper and lower molds is known as Patent Document 2.

  A resin sealing mold apparatus 1000 described in Patent Document 2 shown in FIG. 16 has a substrate 100 sandwiched between an upper mold cavity block 1001 and a lower mold cavity bar 1002, and a plunger 1004 provided on the lower mold set 1003. The solid resin for sealing is fluidized in a mold in a high temperature state, and the electronic component mounted on the surface of the substrate is resin-sealed.

  Here, the configuration of the resin sealing mold apparatus 1000 will be described in detail. The resin sealing mold apparatus 1000 includes an upper mold set 1010 incorporating an upper mold chess 1020 and a lower mold set 1003 incorporating a lower mold chess 1050.

The upper mold set 1010 is configured by arranging side blocks 1012 and 1012 at both side edges of the lower surface of the upper mold base plate 1011.
In the upper mold chess 1020, a pin plate 1022 and an ejector plate 1023 are sequentially stacked at the center of the upper surface of the holder base plate 1021, and chess space blocks 1024 and 1024 are respectively arranged on both sides thereof. Upper mold cavities 1001 and 1001 are disposed on both sides of a cull block 1026 disposed at the center of the lower surface of the holder base plate 1021.

  The lower mold set 1003 is obtained by assembling the lower mold chess base plate 1033 via space blocks 1032 and 1032 respectively arranged on both side edges of the upper surface of the lower mold base plate 1031. In the lower mold set 1003, a plunger isobaric cylinder block 1034 is disposed in the center between the space blocks 1032 and 1032. Piston cylinder blocks 1006 and 1006 are arranged on both sides of the plunger isobaric cylinder block 1034, respectively.

  Space blocks 1052 and 1052 are disposed on both side edges of the lower surface of the lower holder base plate 1051, and a center block 1054 is disposed at the center of the upper surface. Detachable blocks 1055 are arranged on both sides of the center block 1054 and at positions where they can be slidably fitted to the rod 1045 of the piston 1005.

  In the resin sealing mold apparatus 1000, the lower mold cavity bar 1002 is supported by a plurality of pistons 1005 arranged side by side, and the piston 1005 is slidably inserted into a hydraulic cylinder block 1006 provided in the lower mold set 1003. doing.

  Next, the sealing process of the resin sealing mold apparatus 1000 configured as described above will be described. A resin substrate (not shown) is disposed on the lower mold cavity bar 1002. The lower mold set 1003 is pushed up via a drive mechanism (not shown), so that the upper mold set 1010 is clamped. In this clamped state, the gap between the lower mold cavity bar 1002 and the guide block 1062 holds a gap (0.001 to 0.015 mm) in which the lower mold cavity bar 1002 can slide. Therefore, it is possible to ensure the vertical movement of the lower mold cavity bar 1002 that absorbs the variation in the thickness dimension of the substrate.

  Next, the piston 1005 is pushed up by the supply of oil to raise the lower mold cavity bar 1002, whereby the resin substrate is primarily clamped by the lower mold cavity bar 1002 and the upper mold cavity block 1001. Further, the plunger 1004 of the constant pressure cylinder block 1034 for the plunger is raised, the fluid resin is injected into the cavity, and the resin substrate is sealed and molded.

In this way, the resin sealing mold apparatus 1000 adjusts the clamping pressure of the lower mold cavity bar 1002 as the piston 1005 slides up and down, so that the upper mold cavity block 1001 and the lower mold cavity bar 1002 Thus, even if the thickness of the resin substrate varies, the resin substrate can be sandwiched without being damaged.
Also, the resin sealing mold apparatus 1000 protrudes the plunger 1004 to inject fluid resin into the cavity, and immediately before the resin is filled into the cavity, the lower mold cavity bar 1002 is not lowered due to the resin filling pressure. The pressure in the hydraulic cylinder block 1006 is increased. This prevents resin from leaking out of the cavity and becoming burrs. The pressure at this time is set with a force that does not damage the resin substrate.
The mold apparatus 1000 for resin sealing described in Patent Document 2 has the above-described structure, and can also be used for resin-sealing a member of a resin substrate with a metal plate that easily varies in thickness as shown in FIG. .

JP 2007-73583 A JP 2001-179882 A

However, in the resin sealing mold apparatus 1000 described in Patent Document 2, the pressure in the hydraulic cylinder block 1006 immediately before the sealing resin is filled in the cavities (the upper mold cavity block 1001 and the lower mold cavity bar 1002). However, when a chip is bonded on a resin substrate as shown in FIG. 17 and a semiconductor device having an exposed type metal plate (heat sink) is formed on the chip, the chip or the like is damaged. Since only a pressure not to be applied can be applied, the piston 1005 may be pushed back at the moment when the injection pressure when the sealing resin is filled in the cavity is applied to the lower mold cavity bar 1002.
This is because the injection pressure of the sealing resin is higher than the pressure with which the piston 1005 pushes the lower mold cavity bar 1002.

Here, the details will be described in detail based on the schematic diagram shown in FIG.
In FIG. 17, a semiconductor element S is mounted on a resin substrate B as an electronic component D, and a heat sink H is provided on the upper surface of the semiconductor element S.
Both ends of the resin substrate B are sandwiched between the upper mold 1101 and the movable block (lower mold cavity bar) 1103 of the lower mold 1102. Since the heat sink H is sealed so as to be exposed from the sealing resin R in order to dissipate heat generated by the semiconductor element S, the heat sink H is in contact with the semiconductor element S and the upper mold 1101. The electronic component D is clamped by being sandwiched by the movable block 1103 together with the resin substrate B. The upper mold 1101 and the lower mold 1102 are clamped by a mold clamping device (not shown).

For example, the piston 1104 that supports the movable block 1103 pushes up the movable block 1103 in a state where it is suppressed to about 4.9 × 10 ⁶ Pa (50 kgf / cm ² ) or less in consideration of protection of the fragile electronic component D. The electronic component D is soft clamped. On the other hand, the injection pressure of the sealing resin R injected into the cavity C is about 9.8 × 10 ⁶ Pa (100 kgf / cm ² ).

Therefore, when the sealing resin R is injected into the cavity C, the injection pressure of the sealing resin R is applied to each of the resin substrate B, the semiconductor element S, and the heat sink H as indicated by arrows in FIG. As a result, the movable block 1103 may be pushed down and the electronic component D may be unclamped. Then, since a gap is easily formed between the heat sink H and the upper mold 1101, the sealing resin is turned on the upper surface of the heat sink H, the heat sink H is peeled off from the semiconductor element S, or the semiconductor element S is resin. There is a risk of peeling from the substrate B. Moreover, there is a concern that the semiconductor element S is damaged by this peeling.
If the pressure by the piston 1104 is increased too much so as not to lose the injection pressure of the sealing resin, the electronic component D may be broken.

  Accordingly, an object of the present invention is to provide a resin sealing device that can seal an electronic component without breaking even if the injection pressure of the sealing resin is strong in a situation where strong clamping cannot be performed, and a method for manufacturing the same.

In the resin sealing device of the present invention, an electronic component disposed in a cavity formed by a first mold and a second mold is transferred to a movable block formed in the second mold via a pressure medium. A pressure is applied between the first mold and the first mold, and the sealing resin supplied to the pot disposed in the second mold is injected into the cavity by the plunger and sealed. In the resin sealing device, the pressure applying unit sandwiches the electronic component between the first mold and the movable block, and blocks the flow of the pressure medium when the sealing resin is injected into the cavity. And a restricting member that protrudes from the movable block and prevents the movable block from being displaced in a direction away from the first mold.
In the resin sealing method of the resin sealing device of the present invention, an electronic component disposed in a cavity formed by clamping the first mold and the second mold is used as the second mold. Resin for sealing supplied to a pot disposed in the second mold by applying pressure to the formed movable block via a pressure medium and sandwiching it with the first mold by a pressure applying means. In a resin sealing method of a resin sealing device that seals by injecting into a cavity with a plunger, the step of sandwiching the electronic component by the first mold and the movable block, and the movable block is the first mold Projecting a restricting member that prevents displacement in a direction away from the movable block, and a step of blocking the flow of the pressure medium when the sealing resin is injected into the cavity. And wherein the Mukoto.

According to the onset bright, with the electronic component by the movable block first mold is sandwiched by light pressure, even if applied high injection pressure by the sealing resin to the electronic component and the movable block, of the pressure medium Since the flow is interrupted and does not flow, the pressure applying means does not fluctuate even when the injection pressure changes, and the movable block can be maintained in a supported state immediately. In addition, a restricting member that protrudes from the movable block and prevents the movable block from being displaced downward is provided. The restricting member supports the movable block, so that not only the control by the pressure medium but also the movement of the movable block is mechanical. Can be prevented.

  The pressure applying means includes a hydraulic pump that pumps hydraulic oil as the pressure medium, a hydraulic piston that applies pressure to the movable block by the hydraulic oil from the hydraulic pump, and a hydraulic pressure switch that blocks a circuit of the hydraulic oil It is desirable to provide a valve. When the pressure applying means is configured in this way, the hydraulic piston that supports the movable block is in a state in which the hydraulic oil does not flow by the hydraulic switching valve, so that the state in which the hydraulic piston is pushed back is suppressed. Can do.

  If the regulating member is formed with an inclined surface that changes the push-up position of the movable block in accordance with the protruding amount, the height of the movable block can be varied by adjusting the protruding amount of the regulating member. The restriction member can be made to correspond.

  Since the present invention can maintain the state where the movable block is supported, even if the injection pressure of the sealing resin is high, the electronic component can be sealed without being broken, so that the yield can be maintained.

It is sectional drawing of the resin sealing apparatus which concerns on Embodiment 1 of this invention. It is a figure for demonstrating operation | movement of the resin sealing apparatus shown in FIG. 1, and is sectional drawing of the state which clamped the lower mold | type to the upper mold | type. It is a figure for demonstrating operation | movement of the resin sealing apparatus following FIG. 2, and is sectional drawing of the state which clamped the electronic component with the movable block. It is a figure for demonstrating operation | movement of the resin sealing apparatus following FIG. 3, and is sectional drawing of the state which switched the hydraulic switching valve. It is a figure for demonstrating operation | movement of the resin sealing apparatus following FIG. 4, and is sectional drawing of the state by which sealing resin was extruded from the cull by the plunger to the resin channel | path. It is a figure for demonstrating operation | movement of the resin sealing apparatus following FIG. 5, and is sectional drawing of the state by which sealing resin was inject | poured into the cavity with the plunger. FIG. 7 is a schematic view for explaining the influence of the injection pressure of the sealing resin in the resin sealing device shown in FIG. 6. It is a figure for demonstrating operation | movement of the resin sealing apparatus following FIG. 6, and is lower part lowering | lowering, opening a type | mold, and sectional drawing of the state which took out the resin-sealed electronic component. It is sectional drawing of the resin sealing apparatus which concerns on Embodiment 2 of this invention. It is a figure for demonstrating operation | movement of the resin sealing apparatus shown in FIG. 9, Comprising: It is sectional drawing of the state which switched the hydraulic switching valve, after clamping a lower mold | die to an upper mold | type and clamping an electronic component with a movable block is there. It is a figure for demonstrating operation | movement of the resin sealing apparatus following FIG. 10, and is sectional drawing of the state which supported the movable block with the taper block. It is a figure for demonstrating operation | movement of the resin sealing apparatus following FIG. 11, and is sectional drawing of the state by which sealing resin was inject | poured into the cavity with the plunger. It is a figure for demonstrating operation | movement of the resin sealing apparatus following FIG. 12, and is sectional drawing of the state which made the taper block detach | leave from a movable block. It is a figure for demonstrating the operation | movement of the resin sealing apparatus following FIG. 14, and is sectional drawing of the state which lowered | hung the lower mold | type and opened the mold and took out the resin-sealed electronic component. It is a figure for demonstrating the manufacturing method of the semiconductor device of patent document 1, and is a figure of the state before performing a molding process. It is a figure for demonstrating the manufacturing method of the semiconductor device following FIG. 15A, and is a figure of the state in which resin is inject | poured in the molding process. It is a figure for demonstrating the manufacturing method of the semiconductor device following FIG. 15B, and is a figure of the state which inject | poured resin at the molding process. It is sectional drawing which shows the metal mold | die apparatus for resin sealing of patent document 2. FIG. It is the schematic for demonstrating the influence by the injection pressure of resin for sealing in the conventional resin sealing apparatus.

(Embodiment 1)
A resin sealing device according to Embodiment 1 of the present invention will be described with reference to the drawings. 1 to 8, the hydraulic device is shown only on one side on the left side in the drawing, but is also provided on the other side on the right side, and is omitted for convenience.
The resin sealing device 10 shown in FIG. 1 is for sealing with the semiconductor element S with the heat dissipation plate mounted on the lead frame L as an electronic component D, with the heat dissipation surfaces of the heat dissipation plates H1 and H2 exposed. The semiconductor element S is sealed with a resin to obtain a molded product.
The resin sealing device 10 includes an upper mold 20, a lower mold 30, and a hydraulic device 40.

  A recess 21 is formed on the lower surface of the upper mold 20 (first mold). The recess 21 constitutes a cavity C together with the recess 31 on the upper surface of the lower mold 30. Further, a resin passage 22 and a cull portion 23 are formed on the lower surface of the upper mold 20 to serve as a sealing resin flow path to the cavity C.

The lower mold 30 (second mold) includes a movable block 32 as a part of the bottom of the recess 31. The movable block 32 is disposed in the through hole 33 at the bottom of the concave portion 31 and moves up and down, and clamps the electronic component D disposed in the cavity C together with the upper surface of the concave portion 21 of the upper mold 20.
The lower mold 30 is provided with a pot 34 for charging the sealing resin, and a plunger 35 for pushing up the molten sealing resin into the cavity C is provided in the pot 34. The lower mold 30 is moved up and down by lifting means (not shown).

The hydraulic device 40 (pressure applying means) includes a hydraulic pump 41, a hydraulic cylinder 42, a hydraulic piston 43, a hydraulic circuit 44, and a hydraulic pressure switching valve 45.
The hydraulic pump 41 pumps hydraulic oil as a pressure medium. The hydraulic piston 43 fitted in the hydraulic cylinder 42 applies pressure to the movable block 32 in accordance with the hydraulic oil pumped by the hydraulic pump 41. The hydraulic circuit 44 is a circulation line through which hydraulic oil circulates between the hydraulic pump 41 and the hydraulic piston 43. The hydraulic switching valve 45 is interposed between the hydraulic pump 41, the hydraulic cylinder 42, and the hydraulic piston 43 to cut off or open the flow of hydraulic oil.

The operation and use state of the resin sealing device 10 according to Embodiment 1 of the present invention configured as described above will be described with reference to the drawings.
As shown in FIG. 1, first, the electronic component D is disposed in the recess 31 of the lower mold 30. Next, the lower mold 30 is lifted by lifting means (not shown), and the lower mold 30 is stacked on the upper mold 20 and clamped as shown in FIG. The lifting means may be mounted on the upper mold 20 side, the upper mold 20 may be lowered, and the upper mold 20 may be stacked on the lower mold 30 and clamped.
When the upper mold 20 and the lower mold 30 are clamped, the lead frame L is clamped. The mold clamping force at this time is clamped with a strong force so that the upper mold 20 and the lower mold 30 do not open against the injection pressure of the sealing resin.

  Next, as shown in FIG. 3, the hydraulic pump 41 is operated, and the hydraulic oil is pressure-fed to the hydraulic cylinder 42 via the open hydraulic switching valve 45. The hydraulic piston 43 fitted to the hydraulic cylinder 42 raises the movable block 32 in accordance with the hydraulic fluid fed. As the movable block 32 rises, the movable block 32 comes into contact with the heat radiating plate H2. In this state, when the movable block 32 is further raised, the lead frame L is slightly bent, and the heat radiating plate H1 is pressed against the upper mold 20. In this way, the electronic component D does not damage the semiconductor element S by the upper mold 20 and the movable block 32, and further, between the heat sink H1 and the surface of the recess 21, and between the heat sink H2 and the surface of the recess 31. The sealing resin to be injected is clamped and clamped with such a force that it does not rotate.

  Next, as shown in FIG. 4, the hydraulic pressure switching valve 45 is switched from open to shut off at the position where the plunger 35 is raised and the sealing resin is injected into the cull portion 23. By this switching, the hydraulic circuit 44 is shut off, and the hydraulic oil between the lower end of the hydraulic piston 43 and the lower end of the hydraulic cylinder 42 and the hydraulic circuit 44 from the hydraulic switching valve 45 to the hydraulic cylinder 42 are in a sealed state. After switching the hydraulic pressure switching valve 45, the hydraulic pump 41 is stopped.

  As shown in FIG. 5, when the hydraulic circuit 44 is in a sealed state, the plunger 35 is further raised, and the sealing resin of the cull portion 23 passes through the resin passage 22 as shown in FIG. 6. Injected into cavity C.

  A high injection pressure is applied to the inside of the cavity C and the electronic component D by the extrusion of the sealing resin R by the plunger 35. In particular, as shown in FIG. 7, since the sealing resin R is also injected between the semiconductor element S, the heat sinks H1 and H2 disposed above and below the semiconductor element S, and the lead frame L, Due to the injection pressure, a vertical pressure is applied to the heat sinks H1 and H2, and a force that damages the semiconductor element S is generated.

For example, a sensor or the like (not shown) senses that the sealing resin R is injected and the movable block 32 is pushed down by the high injection pressure, and the hydraulic pump 41 (see, for example, FIG. 6) is operated to make hydraulic pressure. It is conceivable to increase the pressure applied to the movable block 32 by the piston 43.
However, it is difficult to detect the displacement of the movable block 32 and change the pressure setting of the hydraulic pump 41 so that the pressure applied to the movable block 32 by the hydraulic piston 43 immediately responds to the change in the injection pressure. is there. Therefore, there is a possibility that the movable block 32 is pushed back and the resin wraps around the exposed portions of the heat radiation plates H1 and H2 to form a resin burr. In addition, during this time lag, a high injection pressure is applied to the electronic component D, which may cause the heat radiation plates H1 and H2 to peel off and damage the semiconductor element S.

  The resin sealing device 10 according to the first embodiment is configured such that the heat sinks H1 and H2 together with the upper surface of the recess 21 of the upper mold 20 and the movable block 32 are clamped even when a high injection pressure is applied to the movable block 32. The hydraulic oil to the hydraulic piston 43 that supports 32 is sealed by the hydraulic switching valve 45. Therefore, the hydraulic piston 43 is not pushed back because it does not fluctuate due to a change in pressure. Therefore, even when the upper surface of the concave portion 21 of the upper mold 20 and the movable block 32 are clamped with a force that does not break the electronic component D, the hydraulic piston 43 supports the movable block 32. Can be maintained.

  As shown in FIG. 8, when the sealing resin is injected into the cavity C, the lower mold 30 is separated from the upper mold 20 and the mold is opened. Further, the hydraulic pressure switching valve 45 is returned to the open state in preparation for the next resin sealing. Then, the resin-sealed electronic component D is taken out and the sealing process is completed.

  As described above, according to the resin sealing device 10 according to the first embodiment, the upper surface of the concave portion 21 of the upper mold 20 and the movable block 32 are clamped with a force that does not break the electronic component D. Thus, even if a high injection pressure by the sealing resin is applied to the cavity, the hydraulic switching valve 45 does not flow the hydraulic oil, so that the hydraulic piston 43 can be prevented from falling. Therefore, since the hydraulic piston 43 can maintain the state in which the movable block 32 is supported, the resin sealing device 10 can seal the electronic component D without damaging the electronic component D.

(Embodiment 2)
A resin sealing device according to Embodiment 2 of the present invention will be described with reference to the drawings. 9 to FIG. 14, the same components as those in FIG. 1 to FIG.
The resin sealing device 10x shown in FIG. 9 includes a lock device 50 that functions as a restricting member that prevents displacement of the movable block 32. Note that, like the hydraulic device 40, the locking device 50 is shown only on one side on the left side in the drawing, but is also provided on the other side on the right side, and is omitted for convenience.

  The lock device 50 includes a taper block 51 that projects to the lower surface end of the movable block 32 and a taper block drive device 52 that projects and returns the taper block 51. The tapered block 51 is formed with an inclined surface 51 s at the tip so that the taper block 51 can come into contact with the lower end surface of the movable block 32 even if the push-up position of the movable block 32 changes according to the protruding amount.

  As shown in FIG. 10, when the hydraulic pressure switching valve 45 is switched from open to shut off at the position where the plunger 35 is raised and the sealing resin is injected into the cull portion 23, the lock device 50 is shown in FIG. It operates as shown in Specifically, the taper block driving device 52 projects the taper block 51 until the inclined surface 51 s of the taper block 51 contacts the lower end surface of the movable block 32.

  As shown in FIG. 12, the plunger 35 is raised and the sealing resin of the cull portion 23 is injected into the cavity C through the resin passage 22, and the injection pressure by the sealing resin is applied to the movable block 32. However, since the taper block 51 supports the lower end surface of the movable block 32, it is possible not only to control the hydraulic piston 43 by hydraulic pressure but also to mechanically prevent the movable block 32 from being lowered.

  For example, since the thickness of the heat sink H and the semiconductor element S varies, the height position of the movable block 32 varies. However, since the inclined surface 51s is formed in the taper block 51, the push-up position of the movable block 32 changes according to the protrusion amount. Therefore, the taper block drive device 52 adjusts the protruding amount of the taper block 51, so that the taper block 51 can be made to cope with variations in the height position of the movable block 32. The protruding amount at this time is detected by, for example, a pressure sensor.

As shown in FIG. 13, when the sealing resin is injected into the cavity C, the plunger 35 is lowered and the taper block 51 is pulled in by the taper block driving device 52.
Then, as shown in FIG. 14, the lower mold 30 is separated from the upper mold 20 and the mold is opened. Then, the resin-sealed electronic component D is taken out and the sealing process is completed.

  In the first and second embodiments, the electronic component D in which the heat radiating plate H is provided in the semiconductor element S has been described as an example. However, for example, light in which a window portion for daylighting is formed on the upper surface of the semiconductor element. Even if it is a semiconductor element, since it is necessary to expose a window part from resin for sealing, this resin sealing device 10 and 10x is effective.

  The present invention is suitable for a resin sealing device that seals a semiconductor element with a sealing resin, and is particularly suitable for a resin sealing device that performs sealing that exposes a part of an electronic component from the sealing resin. It is.

10, 10x Resin sealing device 20 Upper mold 21 Recess 22 Resin passage 23 Cull part 30 Lower mold 31 Recess 32 Movable block 33 Through hole 34 Pot 35 Plunger 40 Hydraulic device 41 Hydraulic pump 42 Hydraulic cylinder 43 Hydraulic piston 44 Hydraulic circuit 45 Hydraulic pressure Switching valve 50 Locking device 51 Tapered block 51s Inclined surface 52 Tapered block driving device C Cavity D Electronic component L Lead frame S Semiconductor element H Heat sink R Sealing resin

Claims (4)

An electronic component disposed in a cavity formed by clamping the first mold and the second mold is subjected to pressure via a pressure medium on a movable block formed in the second mold, A resin sealing device that is sandwiched by a pressure applying means between the first mold and injects a sealing resin supplied to a pot disposed in the second mold into a cavity by a plunger and seals the resin. In
The pressure applying means includes a mechanism for sandwiching the electronic component between the first mold and the movable block, and blocking the flow of the pressure medium when the sealing resin is injected into the cavity ,
A resin sealing device provided with a regulating member that protrudes from the movable block and prevents the movable block from being displaced in a direction away from the first mold .   The pressure applying means includes a hydraulic pump that pumps hydraulic oil as the pressure medium, a hydraulic piston that applies pressure to the movable block by the hydraulic oil from the hydraulic pump, and a hydraulic pressure switch that blocks a circuit of the hydraulic oil The resin sealing device according to claim 1, further comprising a valve. Wherein the regulating member is in accordance with the projection amount, the resin sealing apparatus according to claim 1, wherein the inclined surfaces push position changes is formed of the movable block. An electronic component disposed in a cavity formed by clamping the first mold and the second mold is subjected to pressure via a pressure medium on a movable block formed in the second mold, A resin sealing device that is sandwiched by a pressure applying means between the first mold and injects a sealing resin supplied to a pot disposed in the second mold into a cavity by a plunger and seals the resin. In the resin sealing method,
Sandwiching the electronic component between the first mold and the movable block;
Projecting a regulating member that prevents the movable block from being displaced in a direction away from the first mold from the movable block;
And a step of blocking the flow of the pressure medium by the pressure means when the sealing resin is injected into the cavity.