JP6804275B2 - Molding mold, resin molding equipment and resin molding method - Google Patents

Description

The present invention is a molding die, a resin molding apparatus used for resin-sealing chip-shaped electronic components such as transistors, integrated circuits (ICs), and light emitting diodes (LEDs). And the resin molding method.

Conventionally, a semiconductor chip mounted on a support member (for example, a lead frame, a substrate, a semiconductor wafer, etc.) is resin-sealed by using a resin molding apparatus by a transfer molding method. In the resin molding apparatus, the semiconductor chips mounted on the support members are resin-sealed by molding the molding dies arranged so as to face each other. For example, a molding die and a lead frame used in a resin molding apparatus by a transfer molding method are disclosed (see Patent Document 1).

Japanese Unexamined Patent Publication No. 8-25401

However, the molding mold disclosed in Patent Document 1 has the following problems. As shown in FIG. 2 of Patent Document 1, the molten resin may leak from a portion where the upper mold runners 36a and 36b intersect the side edges of the lead frames 10A and 10B during resin molding. As a countermeasure against this, a resin stopper 42 is installed further outside than the outermost runner on the lead frames 10A and 10B. The resin stopper 42 is arranged so as to straddle the ends of the lead frames 10A and 10B. When the molding die is compacted, the resin stopper 42 crushes and deforms the ends of the lead frames 10A and 10B. By doing so, the deformed portions of the lead frames 10A and 10B suppress the leakage of the molten resin. However, there is a possibility that appearance defects and reliability defects may occur due to deformation of the lead frame.

The present invention solves the above problems, and an object of the present invention is to suppress deformation of support members such as lead frames and substrates.

In order to solve the above problems, the molding mold according to the present invention is provided in at least one of the first mold, the second mold arranged to face the first mold, and the first mold and the second mold. The elastic member and the attachment member provided in the first mold so as to be movable in the vertical direction and to which the elastic member is attached are provided, and the support member is arranged in the first mold or the second mold. By molding the second mold, the mounting member is moved in the vertical direction, and the elastic member is pressed against the facing surface on the second mold side to elastically deform the end face of the support member and the first mold or the second mold. Closes the gap formed by and.

In order to solve the above problems, the resin molding method according to the present invention uses a molding mold having a first mold and a second mold arranged opposite to each other, and is used in at least one of the first mold and the second mold. It is a resin molding method in which a fluid resin is introduced into a provided cavity and resin is molded on a support member arranged in the first mold or the second mold. An elastic member is attached to the first mold. The mounting member is provided so that it can move in the vertical direction. The molding die is molded, and the mounting member presses the elastic member against the facing surface on the second mold side to elastically deform the end face of the support member. And the gap formed by the first type or the second type.

According to the present invention, deformation of support members such as lead frames and substrates can be suppressed.

It is a schematic diagram which shows the outline of the resin molding apparatus which concerns on this invention. It is the schematic which shows the molding die which concerns on Embodiment 1, (a) is the plan view of the lower die, (b) is the cross-sectional view taken along line AA of the molding die including the upper die. It is the schematic which shows the molding die of Embodiment 1, (a) is a partial plan view of the lower die, (b) is the BB line sectional view of the molding die including the upper die. (A) to (b) are schematic cross-sectional views showing an operation of resin-sealing a semiconductor chip mounted on a lead frame in the first embodiment. (A) to (b) are schematic cross-sectional views showing an operation of suppressing leakage of the molten fluid resin in the first embodiment. (A) to (b) are schematic cross-sectional views showing an operation of suppressing leakage of molten fluid resin by using the molding die of the second embodiment. It is a schematic diagram which shows the molding die of Embodiment 3, (a) is a partial plan view of the lower die, (b) is a CC line sectional view of the molding die including the upper die. FIG. 3 is a schematic cross-sectional view showing a state in which a molding die is molded and a semiconductor chip mounted on a substrate is resin-sealed in the third embodiment. FIG. 3 is a schematic cross-sectional view showing a state in which a molding die is opened and a resin molded product is taken out from the molding die in the third embodiment. (A) to (b) are schematic cross-sectional views showing an operation of suppressing leakage of molten fluid resin even when resins are molded on substrates having different thicknesses in the fourth embodiment. is there.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. All figures in the application documents are schematically drawn with omission or exaggeration for the sake of clarity. The same components are designated by the same reference numerals and the description thereof will be omitted as appropriate. In the application documents, the "support member" is a member that supports the chip, and is a general substrate such as a glass epoxy substrate, a ceramic substrate, a resin substrate, or a metal substrate, a lead frame, a semiconductor wafer, or the like. Can be mentioned.
[Embodiment 1]

(Structure of resin molding equipment)
The configuration of the resin molding apparatus according to the present invention will be described with reference to FIG. The resin molding apparatus 1 shown in FIG. 1 is, for example, a resin molding apparatus by a transfer molding method. The resin molding apparatus 1 has a base 2. Four holding members 3 are fixed at the four corners of the base 2. A fixed platen 4 facing the base 2 is fixed to the upper part of the four holding members 3 extending upward. Between the base 2 and the fixed platen 4, the movable platen 5 facing each of the base 2 and the fixed platen 4 is fitted into the four holding members 3. A mold clamping mechanism 6 for raising and lowering the movable platen 5 is provided on the base 2. The mold clamping mechanism 6 raises and lowers the movable platen 5 to open and clamp the mold. The mold clamping mechanism 6 is composed of a combination of a drive source and a transmission member. For example, as the mold clamping mechanism 6, a combination of a servomotor and a ball screw, a combination of a hydraulic cylinder and a rod, and the like are used.

The upper mold 7 is fixed to the lower surface of the fixed platen 4. A lower mold 8 is provided directly below the upper mold 7 so as to face the upper mold 7. The lower mold 8 is fixed to the upper surface of the movable platen 5. The upper mold 7 and the lower mold 8 together form a molding mold 9. The upper mold 7 and the lower mold 8 are appropriately provided with a heater (not shown) as a heating means.

The lower mold 8 is provided with a support member arranging portion 10 on which a support member to be a resin-molded object is arranged. As the support member, for example, a lead frame on which a semiconductor chip is mounted, a substrate on which the semiconductor chip is mounted, or the like is arranged in the support member arrangement portion 10. Further, the lower mold 8 may be provided with the lower mold cavity 11 which is a space for molding the cured resin, corresponding to the object to be resin-molded.

The lower mold 8 is provided with, for example, a pot 13 that houses a resin tablet 12 that has been tablet-molded as a resin material. A plunger 14 is provided in the pot 13 for heating the housed resin tablet 12 and pressing the molten fluid resin. The plunger 14 is connected to the drive mechanism 15 via a transmission member. The drive mechanism 15 is provided inside the movable platen 5 or outside the movable platen 5. The drive mechanism 15 causes the plunger 14 to move up and down in the bot 13.

The upper mold 7 is provided with an upper mold cavity 16 that serves as a space in which the cured resin is formed so as to face the support member arranging portion 10 or the lower mold cavity 11. Further, the upper mold 7 is provided with a cal recess 17 at a position facing the pot 13. The cal recess 17 and the upper cavity 16 communicate with each other via a runner 18 serving as a resin passage. The molten fluid resin is injected from the pot 13 into the upper die cavity 16 via the caracal recess 17 and the runner 18.

(Composition of molding mold)
The configuration of the molding die according to the first embodiment will be described with reference to FIGS. The molding die shown in FIG. 2 is a molding die used in the resin molding apparatus by the transfer molding method shown in FIG. FIG. 2 is a schematic cross-sectional view showing a molding die as seen from the line AA, and shows a portion where a semiconductor chip mounted on a support member such as a lead frame or a substrate is resin-sealed. FIG. 3 is a cross-sectional view showing a molding die as seen from the line BB, and shows a portion that suppresses leakage of the molten fluid resin during molding.

As shown in FIG. 2B, the molding die 9 includes an upper die 7 and a lower die 8 arranged to face the upper die 7. In the resin molding apparatus 1, for example, the upper mold 7 is a fixed type, and the lower mold 8 is a movable type that can move up and down with respect to the upper mold 7.

As shown in FIGS. 2A and 2B, the lower mold 8 has a lower mold base 19, a pot block 20 arranged on the lower mold base 19, a lower mold cavity block 21, and a lower mold side block. 22 and a lower end block 23 are provided. The pot block 20 is arranged in the center of the lower mold base 19, and the lower mold cavity blocks 21 are arranged on both sides of the pot block 20. The pot block 20 and the two lower cavity blocks 21 are surrounded by the lower side block 22 and the lower end block 23.

The pot block 20 is provided with a plurality of pots 13 (4 in FIG. 2) for accommodating the lock-molded resin tablet 12. A plunger 14 for pressing the housed resin tablet 12 is provided in the pot 13. The plunger 14 moves up and down in the pot 13 by a drive mechanism 15 (see FIG. 1).

The lower die cavity block 21 is provided with a lower die cavity 11 in which the fluid resin supplied from the pot 13 is cured to form the cured resin. The space surrounded by the upper surface of the lower die cavity block 21 and the side surfaces of the pot block 20, the lower die side block 22, and the lower die end block 23 is the support member arranging portion 10 for arranging the support member. For example, the lead frame 25 on which the semiconductor chip 24 is mounted is arranged in the support member arranging portion 10. The depth of the support member arranging portion 10 from the mold surface may be set to be substantially equal to, for example, the thickness of the lead frame 25, or may be shallower than the thickness of the lead frame 25. In the first embodiment, an example in which a plurality of semiconductor chips 24 mounted on the lead frame 25 are resin-sealed will be described.

As shown in FIG. 2A, the lead frame 25 is a support member arranging portion by aligning the alignment pin 26 provided in the lower cavity block 21 with the guide hole provided in the lead frame 25. It is arranged at 10. When the lead frame 25 is arranged in the support member arranging portion 10, even if a slight gap 27 is formed between the end portion of the lead frame 25 and the pot block 20 as a lead frame arranging margin (alignment margin). good. If a gap 27 is formed, the fluid resin may leak along the gap 27. Therefore, at both ends (outermost) of the pot block 20, a lower mold resin stopper is used to prevent the fluid resin from leaking from the gap 27 formed between the end of the lead frame 25 and the pot block 20. A recess 28 (see FIG. 3) is provided.

As shown in FIG. 2B, the upper mold 7 has an upper mold base 29, a cal block 30 provided on the upper mold base 29, an upper mold cavity block 31, an upper mold side block 32, and an upper mold end. It includes a block (not shown). The cal block 30 is arranged at a position facing the pot block 20. The upper cavity block 31 is arranged at a position facing the lower cavity block 21. The upper mold 7 may be provided with a relief hole for the alignment pin 26.

The cal block 30 is provided with a cal recess 17 and a runner 18a that serves as a resin passage for the fluid resin in which the resin tablet 12 is heated and melted. The cal recesses 17 are provided at positions facing the plurality of pots 13 provided in the pot block 20.

The upper die cavity block 31 is provided with an upper die cavity 16 in which the fluid resin supplied from the pot 13 is cured to form a cured resin, and a runner 18b serving as a resin passage for the fluid resin. In the upper mold 7, the runner 18a and the runner 18b communicate with each other to form a runner 18 communicating the cal recess 17 and the upper mold cavity 16. In addition, in order to make it easy to understand the resin passage where the fluid resin is supplied from the pot 13 to the upper die cavity 16 and the lower die cavity 11, in the plan view of the lower die 8 shown in FIG. The runner 18 is shown by a virtual line (dashed line).

As shown in FIGS. 2 and 3, at least both ends of the pot block 20 are to be prevented from leaking the fluid resin from the gap 27 formed between the end of the lead frame 25 and the pot block 20. Lower mold resin fixing recesses 28 are provided at (4 locations in FIG. 2A). As shown in FIG. 3B, the cal block 30 is provided with the upper resin fixing member 33 at a position facing the lower resin fixing recess 28 provided in the pot block 20. An elastomer 34, which is an elastic member that can be elastically deformed, is provided at the tip of the upper resin stopper member 33.

The elastomer 34 is a rubber-like elastic member, and for example, silicone rubber or fluororubber having heat resistance is used. When the molding die 9 is molded, the elastomer 34 is compressed and elastically deformed. By elastically deforming, the elastomer 34 contracts in the vertical direction and expands in the horizontal direction. Therefore, in a plan view, the flat area of the lower resin fixing recess 28 may be set to be substantially equal to the flat area of the elastomer 34, or may be set to be larger than the flat area of the elastomer 34. May be good.

The length L of the elastomer 34 may be set arbitrarily. For example, it may be set to be thicker than the thickness t of the lead frame 25. Even if the thickness of the lead frame 25 varies when the molding die 9 is compacted, or even if the end face accuracy of the lead frame 25 varies, the elastomer 34 is pressed and elastically deformed. It suffices if the gap 27 formed between the end of the lead frame 25 and the pot block 20 can be closed.

As shown in FIG. 3B, in order to arrange the upper resin fixing member 33, the cal block 30 is provided with a through hole 35 penetrating the cal block 30 and a recess 36 connecting to the through hole 35. The upper mold resin fixing member 33 and the elastomer 34 are inserted into the through holes 35. In FIG. 3, the elastomer 34 is set so as to protrude from the mold surface of the upper mold 7. A spring 37 for supporting the upper mold resin fixing member 33 is provided between the upper mold base 29 and the upper mold resin fixing member 33. The spring 37 is, for example, a spiral spring. The upper mold resin fixing member 33 and the elastomer 34 move in the vertical direction with respect to the through hole 35. Further, when the upper mold resin stopper member 33 and the elastomer 34 become slidable due to resin clogging or the like, a push-down pin 38 capable of pushing down the upper mold resin stopper member 33 is provided in the recess 36. The push-down pin 38 is arranged inside the spiral spring 37.

(Molding operation)
With reference to FIGS. 4 to 5, the operation of mold-clamping the molding die 9 and sealing the resin and the operation of suppressing the leakage of the molten fluid resin when the mold is compacted will be described.

The operation of molding and sealing the molding die 9 with reference to FIG. 4 will be described. As shown in FIG. 4A, in the molding die 9, the upper die 7 and the lower die 8 are opened. Next, using a substrate transport mechanism (not shown), the two lead frames 25 are transported to a predetermined position between the upper mold 7 and the lower mold 8. Next, by inserting (aligning) the guide hole provided in the lead frame 25 into the alignment pin 26 provided in the lower mold 8, the lead frame 25 is inserted into the support member arranging portion 10 provided in the lower mold 8. To place. In this state, a slight gap 27 may be formed between the end of the lead frame 25 and the pot block 20.

Next, using a resin transfer mechanism (not shown), four resin tablets 12 (see FIG. 2A) are supplied to the respective pots 13 provided in the lower mold 8. At this time, the upper die 7 and the lower die 8 are brought to a temperature at which the resin tablet 12 can be heated and melted by using the heaters (not shown) provided in the upper die 7 and the lower die 8. It is preferable that the temperature has already been raised.

Next, as shown in FIG. 4B, the mold clamping mechanism 6 (see FIG. 1) is used to raise the movable platen 5 (see FIG. 1). The lower mold 8 is raised by the movable platen 5, and the upper mold 7 and the lower mold 8 are molded.

Next, the drive mechanism 15 (see FIG. 1) is used to raise the plunger 14 and press the molten fluid resin. The fluid resin is injected from the pot 13 into the upper die cavity 16 and the lower die cavity 11 via the caracal recess 17 and the runner 18. The cured resin 39 is formed by further heating the fluid resin in a state where the upper cavity 16 and the lower cavity 11 are filled with the fluid resin. As a result, the semiconductor chip 24 mounted on the lead frame 25 is resin-sealed with the cured resin 39.

Next, the mold clamping mechanism 6 is used to lower the movable platen 5, and the upper mold 7 and the lower mold 8 are opened. The resin sealing is completed by taking out the resin-sealed resin molded product from the molding die 9 and digging the unnecessary resin-molded portion molded into the cal recess 17 and the runner 18.

Next, with reference to FIG. 5, an operation of suppressing leakage of the molten fluid resin when the molding die 9 is molded will be described. As shown in FIG. 5A, in the molding die 9, the lead frame 25 is arranged in the support member arranging portion 10 provided in the lower die 8 with the upper die 7 and the lower die 8 opened. .. A slight gap 27 may be formed between the end of the lead frame 25 and the pot block 20.

Next, the mold clamping mechanism 6 is used to mold the upper mold 7 and the lower mold 8. By raising the lower mold 8, the elastomer 34 at the tip of the upper mold resin fixing member 33 is inserted into the lower mold resin fixing recess 28, and the elastomer 34 is brought into contact with the bottom surface of the lower mold resin fixing recess 28. Further, by raising the lower mold 8 and molding the mold, the elastomer 34 is compressed and elastically deformed by the upper mold resin fixing member 33 and the bottom surface of the lower mold resin fixing recess 28.

As shown in FIG. 5B, when the elastomer 34 is compressed and elastically deformed, the elastomer 34 contracts in the vertical direction and expands in the horizontal direction. Even if the thickness of the lead frame 25 varies, or even if the end face accuracy of the lead frame 25 varies, the elastomer 34 elastically deforms, so that the end portion of the lead frame 25 and the pot block 20 The gap 27 formed between the two can be closed. Therefore, the fluid resin leaks from the gap 27 formed between the end of the lead frame 25 and the pot block 20 to the lower end block 23 side (see FIG. 2A) of the upper resin fixing member 33. It can be suppressed. In addition, since the upper mold resin fixing member 33 is configured to be movable in the vertical direction, it is possible to further cope with variations in the size of the gap 27.

When the upper mold resin stopper 33 presses the elastomer 34 against the bottom surface of the lower resin stopper 28, a reaction force is generated in which the elastomer 34 tries to push back the upper resin stopper 33. By this reaction force, the upper mold resin fixing member 33 is pushed upward and supported by the spring 37.

With the elastically deformed elastomer 34 closing the gap 27 formed between the end of the lead frame 25 and the pot block 20, the plunger 14 is raised and the molten fluid resin is applied to the upper die cavity 16 and the lower die cavity Cavity. Inject into No. 11 (see FIG. 4B). Since the elastically deformed elastomer 34 closes the gap 27 formed between the end of the lead frame 25 and the pot block 20, it is possible to prevent the fluid resin from leaking out. By elastically deforming the elastomer 34 provided at the tip of the upper resin fixing member 33, it is possible to suppress the deformation of the lead frame 25 and prevent the fluid resin from leaking out. Since leakage of the fluid resin is suppressed, a predetermined amount of the fluid resin can be supplied to the upper die cavity 16 and the lower die cavity 11 to seal the resin.

(Action effect)
The molding die 9 of the present embodiment is formed on at least one of the upper die 7 which is the first die, the lower die 8 which is the second die which is arranged to face the upper die 7, and the upper die 7 and the lower die 8. The upper mold 7 or the upper mold 7 is provided with an elastomer 34 which is an elastic member provided and an upper mold resin fixing member 33 which is a mounting member provided on the upper mold 7 so as to be movable in the vertical direction and to which the elastomer 34 is mounted. A lead frame 25 as a support member is arranged on the lower mold 8, and by molding the upper mold 7 and the lower mold 8, the upper mold resin fixing member 33 is moved in the vertical direction and is placed on the facing surface on the lower mold 8 side. The elastomer 34 is pressed and elastically deformed to close the gap 27 formed by the end face of the lead frame 25 and the upper mold 7 or the lower mold 8.

With such a configuration, when the upper mold 7 and the lower mold 8 are molded, the upper mold resin fixing member 33 can press the elastomer 34 to elastically deform the elastomer 34. Therefore, the gap 27 formed between the end of the lead frame 25 and the pot block 20 can be closed by the elastically deformed elastomer 34. As a result, it is possible to suppress the deformation of the lead frame 25 and prevent the molten fluid resin from leaking out.

The resin molding method of the present embodiment uses a molding mold 9 having a first mold upper mold 7 and a second mold lower mold 8 arranged opposite to each other, and at least the upper mold 7 and the lower mold 8 are used. A fluid resin is introduced into the upper die cavity 16 or the lower die cavity 11 which is a cavity provided on one side, and resin molding is performed on the lead frame 25 which is a support member arranged in the upper die 7 or the lower die 8. In a resin molding method, the upper mold 7 is provided with an upper mold resin fixing member 33, which is a mounting member to which an elastomer 34, which is an elastic member, is mounted, so as to be movable in the vertical direction. The elastomer 34 is pressed against the facing surface on the lower mold 8 side by the upper mold resin fixing member 33 to elastically deform the mold, and the gap formed by the end surface of the lead frame 25 and the upper mold 7 or the lower mold 8 is formed. Block 27.

According to this method, when the upper mold 7 and the lower mold 8 are molded, the gap 27 formed between the end portion of the lead frame 25 and the pot block 20 is closed by the elastically deformed elastomer 34. Can be done. Therefore, it is possible to suppress the deformation of the lead frame 25 and prevent the molten fluid resin from leaking out. It is possible to suppress the leakage of the fluid resin, supply a predetermined amount of the fluid resin to the upper die cavity 16 and the lower die cavity 11, and apply resin pressure to the fluid resin to seal the resin.

According to the present embodiment, the upper mold 7 is provided with the upper mold resin fixing member 33 that moves in the vertical direction. The lower mold 8 is provided with a lower mold resin fixing recess 28 so as to face the upper mold resin fixing member 33. An elastomer 34, which is an elastic member that can be elastically deformed, is provided at the tip of the upper resin stopper member 33. When the upper mold 7 and the lower mold 8 are molded, the upper mold resin fixing member 33 elastically deforms the elastomer 34 by pressing the elastomer 34 against the bottom surface of the lower mold resin fixing recess 28. The gap 27 formed between the end of the lead frame 25 and the pot block 20 is closed by the elastically deformed elastomer 34. Therefore, even if the fluid resin produced by melting the resin tablet 12 leaks from the gap 27 formed between the end of the lead frame 25 and the pot block 20, it is more than the upper resin fixing member 33. It is possible to prevent the fluid resin from leaking to the lower end block 23 side.

According to this embodiment, the elastomer 34 is elastically deformed to close the gap 27 formed between the end of the lead frame 25 and the pot block 20. Therefore, even if the thickness of the lead frame 25 varies, or even if the end face accuracy of the lead frame 25 varies, the gap 27 can be closed by the elastically deformed elastomer 34.

According to this embodiment, the gap 27 formed between the end portion of the lead frame 25 and the pot block 20 can be closed by elastically deforming the elastomer 34. Therefore, even when a resin material having a low viscosity and easily flowing can be used, it is possible to prevent the molten fluid resin from leaking out.

According to this embodiment, it is possible to suppress the deformation of the lead frame 25 and prevent the molten fluid resin from leaking out. It is possible to suppress the leakage of the fluid resin, supply a predetermined amount of the fluid resin to the upper die cavity 16 and the lower die cavity 11, and apply resin pressure to the fluid resin to seal the resin. Therefore, it is possible to prevent the amount of resin supplied to the cavity from being insufficient and the filling failure from occurring.

According to the present embodiment, the gap 27 formed between the end of the support member such as the lead frame or the substrate arranged in the support member arrangement portion 10 and the pot block 20 is closed by the elastically deformed elastomer 34. Therefore, it is possible to perform resin molding on the support member while suppressing mechanical damage to the support member arranged in the support member arrangement portion 10. Therefore, it is possible to suppress the occurrence of poor appearance and poor reliability.

In the present embodiment, the upper mold 7 is provided with the upper mold resin fixing member 33 that moves in the vertical direction, and the lower mold 8 is provided with the lower mold resin fixing recess 28. Then, an elastically deformable elastomer 34 was provided at the tip of the upper resin fixing member 33. Not limited to this, the lower mold 8 may be provided with a lower mold resin fixing member that moves in the vertical direction, and the upper mold 7 may be provided with an upper mold resin fixing recess. In this case, an elastomer can be provided at the tip of the lower resin fixing member to elastically deform it.

In the present embodiment, the lower mold resin fixing recess 28 is provided on the outermost side of the pot block 20 and the upper mold resin fixing member 33 is provided on the outermost side of the cal block 30 in a plan view. Not limited to this, the lower mold resin fixing recess 28 and the upper mold resin fixing member 33 may be provided on both sides of each runner 17 in a plan view. In this case, the gap 27 formed between the end of the lead frame 25 and the pot block 20 can be closed with the elastomer 34 at short intervals.
[Embodiment 2]

(Composition of molding mold)
The configuration of the molding die according to the second embodiment will be described with reference to FIG. The difference from the first embodiment is that the lower mold 8 is also provided with the lower mold resin fixing member. Since the other configurations are the same as those in the first embodiment, the same components are designated by the same reference numerals and the description thereof will be omitted. An example of resin-sealing the semiconductor chip 24 mounted on the lead frame 25 will be described in the same manner as in the first embodiment.

As shown in FIG. 6A, the lower mold 8 is provided with the lower mold resin stopper 40 at a position facing the upper resin stopper 33. In order to arrange the lower resin fixing member 40, the pot block 20 is provided with a through hole 41 penetrating the pot block 20 and a recess 42 connecting to the through hole 41. The lower mold resin fixing member 40 is inserted into the through hole 41. A spring 43, which is an elastic body that supports the lower resin stopper 40, is provided between the lower base 19 and the lower resin stopper 40. The spring 43 is a spiral spring. The lower mold resin fixing member 40 moves in the vertical direction with respect to the through hole 41. Further, when the lower mold resin fixing member 40 becomes slidable due to resin clogging or the like, a push-up pin 44 capable of pushing up the lower mold resin fixing member 40 is provided in the recess 42. The push-up pin 44 is arranged inside the spiral spring 43.

Similar to the first embodiment, the elastomer 34 is provided at the tip of the upper resin fixing member 33. When the molding die 9 is molded, the elastomer 34 is compressed and elastically deformed. By elastically deforming, the elastomer 34 contracts in the vertical direction and expands in the horizontal direction. Therefore, when viewed in a plan view, the flat area of the lower resin fixing member 40 (the flat area of the through hole 41) is the same as the flat area of the upper resin fixing member 33 (the flat area of the through hole 35 or the flat area of the elastomer 34). It may be set to be substantially equal, or may be set to be larger than the flat area of the upper mold resin fixing member 33.

FIG. 6 shows a case where the elastomer 34 is provided at the tip of the upper resin fixing member 33, but the present invention is not limited to this. The elastomer 34 may be provided at the tip of the lower resin fixing member 40, or may be provided at both the tip of the upper resin fixing member 33 and the tip of the lower resin fixing member 40. Any configuration or form may be used as long as it is possible to close the gap 27 formed between the end of the lead frame 25 and the pot block 20 when the elastomer 34 is elastically deformed.

The lower mold resin fixing member 40 is supported by the spring 43, and the upper mold resin fixing member 33 is supported by the spring 37. The elastomer 34 provided on the upper mold resin fixing member 33 and the lower mold resin fixing member 40 are in contact with each other by the mold clamping operation, and the springs 37 and 43, respectively, are configured to bend. That is, the pressing force of the lower type resin stopping member 40 using the repulsive force (elastic restoring force) of the spring 43 acts on the spring 37 by the upper type resin stopping member 33, and the repulsive force (elastic restoring force) of the spring 37 is used. The pressing force of the upper mold resin fixing member 33 acts on the spring 43 by the lower mold resin stopping member 40. Therefore, the pressing force of the upper mold resin fixing member 33 and the pressing force of the lower mold resin fixing member 40 do not directly affect the upper mold cavity block 31 and the lower mold cavity block 21. As a result, for example, in a molding die adopting a floating mechanism in which an elastic body is provided above the upper die cavity block 31 and below the lower die cavity block 21, it is possible to prevent the mold contact balance from becoming poor. it can.

The push-up pin 44 provided on the lower mold 8 may be moved in the vertical direction in conjunction with, for example, a plunger unit (see FIG. 7) or a lower mold ejector pin (not shown). The push-down pin 38 provided on the upper die 7 may be moved in the vertical direction in conjunction with the upper die ejector pin (not shown).

(Operation to suppress leakage of fluid resin)
With reference to FIG. 6, an operation of suppressing leakage of the molten fluid resin when the molding die 9 is molded will be described. Since the operation of molding and sealing the molding die 9 with resin is the same as that of the first embodiment, the description thereof will be omitted.

As shown in FIG. 6A, in the molding die 9, the lead frame 25 is arranged in the support member arranging portion 10 provided in the lower die 8 with the upper die 7 and the lower die 8 opened. .. A slight gap 27 may be formed between the end of the lead frame 25 and the pot block 20.

Next, the mold clamping mechanism 6 (see FIG. 1) is used to mold the upper mold 7 and the lower mold 8. By raising the lower mold 8, the elastomer 34 at the tip of the upper mold resin fixing member 33 provided in the upper mold 7 is inserted into the through hole 41 provided in the lower mold 8. Further, by raising the lower mold 8, the elastomer 34 is relatively lowered and brought into contact with the lower mold resin fixing member 40. Further, by raising the lower mold 8 and clamping the mold, the elastomer 34 is compressed and elastically deformed by the upper mold resin fixing member 33 and the lower mold resin fixing member 40.

As shown in FIG. 6B, when the elastomer 34 is compressed and elastically deformed, the elastomer 34 contracts in the vertical direction and expands in the horizontal direction. Even if the thickness of the lead frame 25 varies, or even if the end face accuracy of the lead frame 25 varies, the elastomer 34 elastically deforms, so that the end portion of the lead frame 25 and the pot block 20 The gap 27 formed between the two can be closed. Therefore, from the gap 27 formed between the end of the lead frame 25 and the pot block 20, the fluidized resin is closer to the lower end block 23 than the upper resin stopper 33 or the lower resin stopper 40. Leakage can be suppressed.

When the elastomer 34 is compressed by the upper mold resin stopper 33 and the lower resin stopper 40, the reaction force that the elastomer 34 tries to push back the upper resin stopper 33 and the lower resin stopper 40, respectively, is generated. Occurs. By this reaction force, the upper mold resin fixing member 33 is pushed upward and supported by the spring 37. The lower mold resin fixing member 40 is pushed downward and supported by the spring 43.

With the elastically deformed elastomer 34 closing the gap 27 formed between the end of the lead frame 25 and the pot block 20, the resin tablet 12 is heated to melt the fluid resin into the upper cavity 16 and the lower part. It is injected into the mold cavity 11 (see FIG. 4B). Since the elastically deformed elastomer 34 closes the gap 27 formed between the end of the lead frame 25 and the pot block 20, it is possible to prevent the fluid resin from leaking out. By elastically deforming the elastomer 34 provided at the tip of the upper resin fixing member 33, it is possible to suppress the deformation of the lead frame 25 and prevent the fluid resin from leaking out. Since leakage of the fluid resin is suppressed, a predetermined amount of the fluid resin can be supplied to the upper die cavity 16 and the lower die cavity 11 to seal the resin.

(Action effect)
According to the present embodiment, the upper mold 7 is provided with the upper mold resin fixing member 33 that moves in the vertical direction. The lower mold 8 is provided with a lower mold resin fixing member 40 that moves in the vertical direction. An elastomer 34, which is an elastic member that can be elastically deformed, is provided at the tip of the upper resin stopper member 33. When the upper mold 7 and the lower mold 8 are molded, the elastomer 34 is compressed and elastically deformed by the upper mold resin fixing member 33 and the lower mold resin fixing member 40. The gap 27 formed between the end of the lead frame 25 and the pot block 20 is closed by the elastically deformed elastomer 34. Therefore, even if the fluid resin leaks from the gap 27 formed between the end portion of the lead frame 25 and the pot block 20, it is lower than the upper mold resin stopper 33 or the lower resin stopper 40. It is possible to prevent the fluid resin from leaking to the mold end block 23 side.

According to this embodiment, it is possible to suppress the deformation of the lead frame 25 and prevent the molten fluid resin from leaking out. It is possible to suppress the leakage of the fluid resin, supply a predetermined amount of the fluid resin to the upper die cavity 16 and the lower die cavity 11, and apply resin pressure to the fluid resin to seal the resin. Therefore, it is possible to prevent the amount of resin supplied to the cavity from being insufficient and the filling failure from occurring.

According to the present embodiment, the upper mold resin fixing member 33 is supported by the spring 37, and the lower mold resin fixing member 40 is supported by the spring 43. Therefore, the pressing force of the upper mold resin fixing member 33 and the pressing force of the lower mold resin fixing member 40 do not directly affect the upper mold cavity block 31 and the lower mold cavity block 21. As a result, it is possible to prevent the mold contact balance from becoming poor in the molding mold adopting the floating mechanism in which the elastic body is provided above the upper mold cavity block 31 and below the lower mold cavity block 21.

According to the present embodiment, the lower mold 8 is provided with a push-up pin 44 capable of pushing up the lower mold resin fixing member 40. The upper mold 7 is provided with a push-down pin 38 capable of pushing down the upper mold resin fixing member 33. As a result, even if the lower mold resin stopper 40 or the upper resin stopper 33 has a sliding defect due to resin clogging or the like, the push-up pin 44 or the push-down pin 38 can be used to smoothly slide the resin stopper member. Can be made to.
[Embodiment 3]

(Composition of molding mold)
The configuration of the molding die according to the third embodiment will be described with reference to FIG. 7. In the third embodiment, an example is shown in which the push-up pin 44 of the lower mold resin fixing member 40 is connected to the plunger unit and the lower mold cavity block 21 has a floating structure. Since the basic configuration of the molding mold 9 (upper mold 7 and lower mold 8) is the same as that of the second embodiment, the same components are designated by the same reference numerals and the description is omitted, and the configuration is newly added to the lower mold 8. Only the elements will be described. As the support member, for example, an example in which the substrate 46 on which the semiconductor chip 45 is mounted is resin-sealed will be described. In FIG. 7A, the cal recess 17, the runner 18, and the upper die cavity 16 provided in the upper die 7 are shown by a virtual line (dashed line).

As shown in FIG. 7B, the plunger 14 and the push-up pin 44 are connected to the plunger unit 47. The plunger unit 47 is moved in the vertical direction by the drive mechanism 15 (see FIG. 1). The tip of the push-up pin 44 is inserted into a through hole 48 provided in the lower mold base 19. The push-up pin 44 moves in the vertical direction with respect to the through hole 48. The plunger 14 and the push-up pin 44 move up and down in conjunction with the plunger unit 47.

A floating spring 49 is provided between the lower die cavity block 21 and the lower die base 19. The spring 49 is, for example, a spiral spring. A pillar (rigid body member) 50 is connected to the bottom surface of the lower cavity block 21. The pillar 50 is arranged inside the spiral spring 49 and is inserted into the through hole 51 provided in the lower mold base 19. The lower end of the pillar 50 projects from the lower surface of the lower mold base 19. The pillar 50 moves in the vertical direction together with the lower cavity block 21. Since the third embodiment is an example in which the substrate 46 on which the semiconductor chip 45 is mounted is resin-sealed, the lower cavity is not formed in the lower cavity block 21.

A pair of tapered members 52 and 53 are provided below the pillar 50. The tapered member 52 provided in the upper stage has a tapered surface on the lower surface. The tapered member 53 provided in the lower stage has a tapered surface on the upper surface. The tapered surface on the lower surface of the tapered member 52 and the tapered surface on the upper surface of the tapered member 53 are in contact with each other. The lower taper member 53 moves in the horizontal direction by the moving mechanism 54. As the moving mechanism 54, a servomotor, an air cylinder, or the like is used.

By moving the lower taper member 53 in the horizontal direction, the height position of the upper taper member 52 can be adjusted. The pair of tapered members 52, 53 function as a height position adjusting mechanism, a so-called cotter. By moving the lower taper member 53 in the left direction (from right to left in FIG. 7B), the upper taper member 52 rises. By moving the lower taper member 53 in the right direction (from left to right in FIG. 7B), the upper taper member 52 is lowered.

(Molding operation)
With reference to FIGS. 7 to 9, the operation of mold-clamping the molding die 9 to seal the resin and the operation of suppressing the leakage of the molten fluid resin when the mold is compacted will be described.

As shown in FIG. 7, in the molding die 9, the substrate 46 in which the semiconductor chip 45 is mounted on the support member arranging portion 10 provided in the lower die 8 with the upper die 7 and the lower die 8 opened. To place. The substrate 46 is arranged in the support member arranging portion 10 so that the surface of the substrate 46 slightly protrudes from the mold surface of the lower mold 8. A slight gap 27 may be formed between the end of the substrate 46 and the pot block 20. The resin tablet 12 is supplied to the pot 13 provided in the lower mold 8.

Next, as shown in FIG. 8, the mold clamping mechanism 6 (see FIG. 1) is used to raise the lower mold 8 to mold the upper mold 7 and the lower mold 8. In this state, the spring 49 is compressed, and the force that pushes up the lower cavity block 21 acts by the extension force (elastic restoring force) that the spring 49 tries to extend, and the substrate 46 moves to the upper cavity block 31 and the lower cavity. It is clamped with the block 21.

Next, the upper taper member 52 is raised by moving the lower taper member 53 in the left direction (from right to left in FIG. 8) by the moving mechanism 54. As a result, the upper surface of the upper tapered member 52 and the lower surface of the pillar 50 come into contact with each other, and the pillar 50 supports the lower cavity block 21. Then, the resin injection pressure is received by the pillar 50 via the lower cavity block 21. By adjusting the height position of the upper taper member 52, the upper surface of the taper member 52 and the lower surface of the pillar 50 are brought into contact with each other at a position corresponding to the height position of the lower cavity block 21 that clamps the substrate 46. Can be made to.

Next, the drive mechanism 15 (see FIG. 1) is used to raise the plunger unit 47. The plunger 14 and the push-up pin 44 are raised in conjunction with the plunger unit 47. The fluid resin melted by the plunger 14 is pressed. In this state, the push-up pin 44 is not in contact with the lower surface of the lower resin fixing member 40.

The fluid resin is injected from the pot 13 into the upper die cavity 16 via the caracal recess 17 and the runner 18. The cured resin 39 is formed by further heating the fluid resin in a state where the upper die cavity 16 is filled with the fluid resin. As a result, the semiconductor chip 45 mounted on the substrate 46 is resin-sealed with the cured resin 39.

As shown in FIG. 8, by molding the molding die 9, the elastomer 34 is compressed and elastically deformed by the upper mold resin fixing member 33 and the lower mold resin fixing member 40. The elastically deformed elastomer 34 closes the gap 27 formed between the end of the substrate 46 and the pot block 20. This prevents the fluid resin from leaking from the gap 27 formed between the end of the substrate 46 and the pot block 20.

Next, as shown in FIG. 9, the upper mold 7 and the lower mold 8 are mold-opened. First, the lower mold 8 is lowered, and the resin molded product 55 is released from the upper mold 7 by an upper mold ejector pin (not shown) provided on the upper mold 7. Further, by lowering the lower mold 8, the molding mold 9 is completely opened. The lower cavity block 21 and the pillar 50 return to their original height positions due to the elastic restoring force of the spring 49.

Next, the plunger unit 47 is raised with the molding die 9 opened. By raising the plunger unit 47, the plunger 14 and the push-up pin 44 are raised. By raising the plunger 14 further above the mold surface of the lower mold 8, the resin molded product 55 can be released from the lower mold 8. In this case, the plunger 14 can release the resin molded product 55 from the lower mold 8. That is, the plunger 14 has a function of releasing the resin molded product 55 from the lower mold 8.

As the plunger 14 rises, so does the push-up pin 44. The push-up pin 44 can be brought into contact with the lower surface of the lower mold resin fixing member 40, and the lower mold resin fixing member 40 can be raised by the push-up pin 44. As a result, even if the lower mold resin fixing member 40 has a sliding defect due to resin clogging or the like, the lower mold resin fixing member 40 can be forcibly slid by the push-up pin 44. Therefore, by raising the plunger unit 47, the mold release of the resin molded product 55 and the sliding of the lower resin stopper member 40 can be performed at the same time.

Next, the resin-sealed resin molded product 55 is taken out from the molding mold 9, and the unnecessary cured resin 39 molded in the cal recess 17 and the runner 18 is degate. Resin sealing is completed by the steps up to this point.

After the resin molded product 55 is taken out from the molding mold 9, the plunger unit 47 is lowered and returned to the original position. As a result, the push-up pin 44 also descends and returns to its original position. In conjunction with this, the lower mold resin fixing member 40 returns to the original position (above the spring 43) in the recess 42. Therefore, even if there is resin clogging or the like, the lower resin fixing member 40 can be smoothly slid.

(Action effect)
According to the present embodiment, when the upper mold 7 and the lower mold 8 are molded, the elastomer 34 is compressed and elastically deformed by the upper mold resin fixing member 33 and the lower mold resin fixing member 40. The gap 27 formed between the end of the substrate 46 and the pot block 20 is closed by the elastically deformed elastomer 34. Therefore, it is possible to prevent the fluid resin from leaking from the gap 27 formed between the end portion of the substrate 46 and the pot block 20.

According to this embodiment, the plunger 14 and the push-up pin 44 are connected to the plunger unit 47. The push-up pin 44 is configured to move in the vertical direction in conjunction with the plunger 14. The plunger 14 is raised to release the resin molded product 55, and the push-up pin 44 is raised. Therefore, even if the lower mold resin fixing member 40 has a sliding defect due to resin clogging or the like, the sliding defect can be eliminated by the push-up pin 44.

According to the present embodiment, the push-up pin 44 is connected to the plunger unit 47, and the push-up pin 44 moves in the vertical direction in conjunction with the plunger 14. It is not necessary to newly provide a drive mechanism for moving the push-up pin 44 in the vertical direction. Therefore, the configuration of the resin molding apparatus 1 can be simplified and the equipment cost can be suppressed.

According to this embodiment, a floating spring 49 is provided between the lower die cavity block 21 and the lower die base 19. Further, a pair of tapered members 52 and 53 (cotters) capable of adjusting the height position of the lower cavity block 21 are provided. Therefore, even if the thickness of the substrate 46 arranged in the support member arranging portion 10 varies, or even when substrates having different thicknesses are used, the height position of the upper tapered member 52 is adjusted. By doing so, the height position of the lower die cavity block 21 can be adjusted and the clamping pressure applied to the substrate can be optimized.

In the present embodiment, the push-up pin 44 is connected to the plunger unit 47, and the push-up pin 44 is moved in the vertical direction in conjunction with the plunger 14. Not limited to this, the push-up pin 44 may be moved in the vertical direction in conjunction with an ejector pin (not shown) provided on the lower mold 8. Further, regarding the push-down pin 38 provided on the upper die 7, the push-down pin 38 may be moved in the vertical direction in conjunction with the ejector pin (not shown) provided on the upper die 7.
[Embodiment 4]

(Molding operation)
The resin molding method according to the fourth embodiment will be described with reference to FIG. In the fourth embodiment, the molding die 9 shown in the third embodiment is used to seal the resin on substrates having different thicknesses, and to prevent the molten fluid resin from leaking when the molding die is molded. Will be described. Since the configuration of the molding die 9 is the same as that of the third embodiment, the description thereof will be omitted. As the support member, the case where the substrate on which the semiconductor chip is mounted is resin-sealed as in the third embodiment will be described.

As shown in FIG. 10A, in the molding die 9, the upper die 7 and the lower die 8 are opened. The substrate 57 on which the semiconductor chip 56 is mounted is arranged on the support member arranging portion 10a (left side in the drawing) provided on the lower mold 8. Similarly, the substrate 58 on which the semiconductor chip 56 is mounted is arranged on the support member arrangement portion 10b (right side in the drawing). In the lower mold 8, the depths of the support member arranging portions 10a and 10b from the mold surface are the same. In the fourth embodiment, the case where the thickness of the substrate 58 is thicker than the thickness of the substrate 57 is shown. Therefore, the height of the surface of the substrate 58 is higher than the height of the surface of the substrate 57 with reference to the mold surface of the lower mold 8. A slight gap 27 may be formed between the ends of the substrates 57 and 58 and the pot block 20.

Next, as shown in FIG. 10 (b), the upper mold 7 and the lower mold 8 are molded by using the mold clamping mechanism 6 (see FIG. 1). In this state, the springs 49a and 49b are compressed, respectively, and a force for pushing up the lower cavity blocks 21a and 21b acts by an extension force (elastic restoring force) that the springs 49a and 49b try to extend. As a result, the substrate 57 is clamped by the upper cavity block 31a and the lower cavity block 21a. Similarly, the substrate 58 is clamped by the upper cavity block 31b and the lower cavity block 21b.

Next, the lower taper member 53a (left side in the drawing) is moved to the right (from left to right in FIG. 10B) to raise the upper taper member 52a. The upper surface of the upper tapered member 52a and the lower surface of the pillar 50a come into contact with each other, and the pillar 50a supports the lower cavity block 21a. By adjusting the height position of the upper tapered member 52a, the height position of the lower die cavity block 21a clamping the substrate 57 can be adjusted.

Similarly, the lower taper member 53b (right side in the drawing) is moved to the left (from right to left in FIG. 10B) to raise the upper taper member 52b. The upper surface of the upper tapered member 52b and the lower surface of the pillar 50b come into contact with each other, and the pillar 50b supports the lower cavity block 21b. By adjusting the height position of the upper tapered member 52b, the height position of the lower die cavity block 21b clamping the substrate 58 can be adjusted.

The thickness of the substrate 57 is thinner than the thickness of the substrate 58. Therefore, the height position of the lower cavity block 21a must be higher than the height position of the lower cavity block 21b. Therefore, the moving distance of the tapered member 53a is made larger than the moving distance of the tapered member 53b, and the height position of the lower cavity block 21a is higher than the height position of the lower cavity block 21b.

As shown in FIG. 10B, the elastomer 34 is compressed and elastically deformed by the upper type resin fixing member 33 and the lower type resin fixing member 40. The elastically deformed elastomer 34 closes the gaps 27 formed between the ends of the substrates 57 and 58 and the pot block 20, respectively. This prevents the fluid resin from leaking from the gap 27 formed between the ends of the substrates 57 and 58 and the pot block 20.

According to the present embodiment, in the molding die 9, floating springs 49a and 49b are provided between the lower die cavity blocks 21a and 21b and the lower die base 19. Further, a pair of tapered members 52a, 53a and 52b, 53b whose height positions of the lower cavity blocks 21a and 21b can be adjusted are provided. Therefore, even if the thicknesses of the substrates 57 and 58 arranged in the support member arranging portions 10a and 10b are different, the height positions of the lower cavity blocks 21a and 21b are adjusted to join the substrates 57 and 58. The clamp pressure can be optimized respectively.

In each embodiment, the molding mold 9 in which the upper mold 7 is a fixed mold and the lower mold 8 is a movable mold has been described. Not limited to this, a molding mold in which the upper mold is a movable mold and the lower mold is a fixed mold may be used. Further, both the upper mold and the lower mold can be made movable.

In each embodiment, the case where the pot 13 is provided in the lower mold 8 is shown. Not limited to this, the pot may be provided on the upper mold. In this case, the cal recess and the runner are provided in the lower mold.

In each embodiment, a case where a lock-molded resin tablet 12 is used as the resin material has been described. Not limited to this, as the resin material, a solid resin such as powder, granule, or sheet, or a resin (liquid resin) that is liquid at room temperature can be used.

As described above, the molding molds of the above-described embodiment include the first mold, the second mold arranged to face the first mold, and the elastic members provided in at least one of the first mold and the second mold. , A mounting member provided in the first mold so as to be movable in the vertical direction and to which an elastic member is mounted, and a support member is arranged in the first mold or the second mold, and the first mold and the second mold are provided. By mold clamping, the mounting member is moved in the vertical direction, and the elastic member is pressed against the facing surface on the second mold side to be elastically deformed, and is formed by the end surface of the support member and the first mold or the second mold. It is configured to close the gap.

According to this configuration, the elastically deformed elastic member closes the gap formed by the end face of the support member and the first type or the second type. Therefore, the deformation of the support member can be suppressed, and the leakage of the fluid resin can be suppressed.

Further, the molding die of the above embodiment is provided in the second mold so as to be movable in the vertical direction, and is provided with a pressing member for pressing the elastic member.

According to this configuration, the elastic member is pressed by the mounting member and the pressing member to be elastically deformed. The pressing force of the mounting member and the pressing member does not directly affect the molding die. Therefore, it is possible to prevent the mold contact balance from becoming poor.

Further, in the molding mold of the above embodiment, the plunger that can be moved in the vertical direction and the mounting member or pressing member are pushed up so as to introduce the fluid resin into the cavities provided in at least one of the first mold and the second mold. Alternatively, the structure is provided with an interlocking movement mechanism that moves by interlocking the sliding stabilizing member that pushes down and the plunger.

According to this configuration, the slide stabilizing member that pushes up or pushes down the mounting member or the pressing member and the plunger are interlocked with each other. Therefore, by moving the plunger, it is possible to suppress sliding defects of the mounting member or the pressing member.

Further, the molding die of the above embodiment is configured to include a cavity block elastic member provided above or below the cavity block constituting the cavity so that the cavity block can be moved in the vertical direction.

According to this configuration, the height position of the cavity block can be adjusted by the cavity block elastic member even if the thickness of the support member varies. Therefore, the clamping pressure applied to the support member can be optimized.

The resin molding apparatus of the above embodiment is configured to include any of the above molding molds.

According to this configuration, by using any of the above molding molds in the resin molding apparatus, it is possible to suppress the deformation of the support member and prevent the fluid resin from leaking out.

In the resin molding method of the above embodiment, a molding mold having a first mold and a second mold arranged opposite to each other is used, and a fluid resin is placed in a cavity provided in at least one of the first mold and the second mold. It is a resin molding method that is introduced and resin-molded on the support member arranged in the first mold or the second mold. In the first mold, the mounting member to which the elastic member is mounted can move in the vertical direction. The molding mold is molded in such a way, and the elastic member is pressed against the facing surface on the second mold side by the mounting member to elastically deform the end face of the support member and the first mold or the second mold. Close the gap formed by.

According to this resin molding method, the elastically deformed elastic member closes the gap formed between the end face of the support member and the first mold or the second mold. Therefore, the deformation of the support member can be suppressed, and the leakage of the fluid resin can be suppressed.

Further, in the resin molding method of the above embodiment, the molding mold is provided with a plunger that can move in the vertical direction so as to introduce the fluid resin into the cavity, and the second mold is a pressing member that presses the elastic member. Is provided so as to be movable in the vertical direction, and the sliding stabilizing member that pushes up or pushes down the mounting member or the pressing member and the plunger are moved in conjunction with each other.

According to this resin molding method, the slide stabilizing member that pushes up or pushes down the mounting member or the pressing member and the plunger are interlocked with each other. Therefore, by moving the plunger, it is possible to suppress sliding defects of the mounting member or the pressing member.

Further, in the resin molding method of the above embodiment, the mounting member or the pressing member is moved in the vertical direction by using the sliding stabilizing member.

According to this resin molding method, the mounting member or the pressing member is moved in the vertical direction by the sliding stabilizing member. Therefore, it is possible to suppress sliding defects of the mounting member or the pressing member.

Further, in the resin molding method of the above embodiment, the cavity block elastic member is set above or below the cavity block constituting the cavity so that the cavity block can be moved in the vertical direction.

According to this resin molding method, the height position of the cavity block can be adjusted by the cavity block elastic member even if the thickness of the support member varies. Therefore, the clamping pressure applied to the support member can be optimized.

The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. Is.

1 Resin molding device 2 Base 3 Holding member 4 Fixed platen 5 Movable platen 6 Mold tightening mechanism 7 Upper mold (1st mold, 2nd mold)
8 Lower type (2nd type, 1st type)
9 Molding mold 10, 10a, 10b Support member placement part 11 Lower mold cavity (cavity)
12 Resin tablet 13 Pot 14 Plunger 15 Drive mechanism 16, 16a, 16b Upper mold cavity (cavity)
17 Cal recesses 18, 18a, 18b Runner 19 Lower mold base 20 Pot block 21, 21a, 21b Lower mold cavity block (cavity block)
22 Lower type side block 23 Lower type end block 24, 45, 56 Semiconductor chip 25 Lead frame (support member)
26 Alignment pin 27 Gap 28 Lower mold resin retaining recess 29 Upper mold base 30 Calblock 31, 31a, 31b Upper mold cavity block (cavity block)
32 Upper mold side block 33 Upper mold resin fixing member (mounting member)
34 Elastomer (elastic member)
35, 41 Through holes 36, 42 Recesses 37, 43 Spring 38 Push-down pin (sliding stabilizer)
39 Cured resin 40 Lower mold resin stopping member (pressing member)
44 Push-up pin (sliding stabilizer)
46, 57, 58 Substrate (support member)
47 Plunger unit (interlocking movement mechanism)
48 Through holes 49, 49a, 49b Spring (cavity block elastic member)
50, 50a, 50b Pillar 51 Through hole 52, 52a, 52b Taper member 53, 53a, 53b Taper member 54 Movement mechanism 55 Resin molded product

Claims (6)

Type 1 and
The second type, which is arranged to face the first type, and
A plunger that can be moved in the vertical direction so as to introduce the fluid resin into the cavities provided in at least one of the first type and the second type.
An elastic member provided on at least one of the first type and the second type, and
A mounting member provided on the first mold so as to be movable in the vertical direction and to which the elastic member is mounted, and a mounting member .
A pressing member provided on the second mold so as to be movable in the vertical direction and pressing the elastic member, and a pressing member.
A sliding stabilizing member that pushes up or pushes down the mounting member or the pressing member and an interlocking movement mechanism that moves the plunger in an interlocking manner are provided.
A support member is arranged in the first mold or the second mold, and the support member is arranged.
By molding the first mold and the second mold, the mounting member is moved in the vertical direction, and the elastic member is pressed against the facing surface on the second mold side to elastically deform the support member. A molding die that closes the gap formed by the end face of the mold and the first mold or the second mold. The molding die according to claim 1, further comprising a cavity block elastic member provided above or below the cavity block constituting the cavity so that the cavity block can be moved in the vertical direction. A resin molding apparatus comprising the molding die according to claim 1 or 2 . Using a molding mold having a first mold and a second mold arranged to face each other, a fluid resin is introduced into a cavity provided in at least one of the first mold and the second mold, and the first mold is introduced. A resin molding method for resin molding a mold or a support member arranged in the second mold.
The molding die is provided with a plunger that can move up and down so as to introduce the fluid resin into the cavity.
Wherein the first type, provided we are such that the attachment member to which the elastic member is mounted movable in a vertical direction,
The second mold is provided with a pressing member for pressing the elastic member so as to be movable in the vertical direction.
The molding die is molded, and the elastic member is elastically deformed by pressing the elastic member against the facing surface on the second mold side by the mounting member, and the end surface of the support member and the first mold or the second mold are used. busy skill gaps to be formed,
A resin molding method in which a sliding stabilizing member that pushes up or pushes down the mounting member or the pressing member and the plunger are moved in conjunction with each other . The resin molding method according to claim 4 , wherein the mounting member or the pressing member is moved in the vertical direction by using the sliding stabilizing member. The resin molding method according to claim 4 or 5 , wherein a cavity block elastic member is set above or below the cavity block constituting the cavity so that the cavity block can be moved in the vertical direction.

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