JP4861749B2 - Mold apparatus and method for manufacturing molded product - Google Patents

Mold apparatus and method for manufacturing molded product Download PDF

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JP4861749B2
JP4861749B2 JP2006151175A JP2006151175A JP4861749B2 JP 4861749 B2 JP4861749 B2 JP 4861749B2 JP 2006151175 A JP2006151175 A JP 2006151175A JP 2006151175 A JP2006151175 A JP 2006151175A JP 4861749 B2 JP4861749 B2 JP 4861749B2
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mold
molding
slide
molded
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JP2007320102A (en
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誠 川口
修一 田中
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アピックヤマダ株式会社
トヨタ自動車株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Description

本発明は,半導体装置を樹脂によってモールド成形するモールド装置およびそれによって製造されるモールド品の製造方法に関する。さらに詳細には,半導体素子およびその両面に取り付けられた放熱板を有する半導体装置を樹脂モールド成形するためのモールド装置およびモールド品の製造方法に関するものである。   The present invention relates to a molding apparatus for molding a semiconductor device with a resin and a method for manufacturing a molded product manufactured by the molding apparatus. More specifically, the present invention relates to a molding apparatus for molding a semiconductor device having a semiconductor element and a heat radiating plate attached to both surfaces thereof, and a method for manufacturing a molded product.

従来より,両面に放熱板が取り付けられ,その間に半導体素子や電子回路等が装着されている半導体装置に対し,樹脂モールド成形により封止することが行われている。樹脂モールド成形の際には一般に,半導体装置を挟んで上下の金型を型締めし,それらの間にプランジャで樹脂を供給する。その時,型締め力をそのまま半導体装置に加えると,半導体装置の電子回路等が破壊されるおそれがある。一方,型締めが緩いと,金型と放熱板との間に樹脂が侵入し,放熱板の外側の面に樹脂が付着して放熱性が低下するおそれがある。あるいは,樹脂圧によって放熱板が外向きに押圧されて電子回路等から剥離されるおそれがある。   2. Description of the Related Art Conventionally, a semiconductor device in which a heat radiating plate is attached on both sides and a semiconductor element, an electronic circuit, or the like is mounted therebetween is sealed by resin molding. In resin molding, generally, upper and lower molds are clamped with a semiconductor device interposed therebetween, and resin is supplied between them with a plunger. At this time, if the clamping force is applied to the semiconductor device as it is, the electronic circuit of the semiconductor device may be destroyed. On the other hand, if the mold clamping is loose, the resin may enter between the mold and the heat radiating plate, and the resin may adhere to the outer surface of the heat radiating plate, thereby reducing the heat dissipation. Or there exists a possibility that a heat sink may be pressed outward by resin pressure, and may peel from an electronic circuit etc.

これに対し,両放熱板の間に複数個のスペーサを設置し,このスペーサで型締め力を受ける技術が開示されている(特許文献1参照。)。本文献に記載の半導体装置によれば,半導体素子の損傷を防ぐとともに,放熱板の外面に樹脂が回り込むことも防止できるとされている。あるいは,放熱板の外側に弾力のある絶縁性シートを貼って型締めする製造方法も開示されている(特許文献2参照。)。本文献の製造方法によれば,絶縁性シートの弾力性によって押圧力を緩和でき,素子の損傷を防止できるとされている。
特開2004−303900号公報特開2002−324816号公報
これに対し,両放熱板の間に複数個のスペーサを設置し,このスペーサで型締め力を受ける技術が開示されている(特許文献1参照。)。本文献に記載の半導体装置によれば,半導体素子の損傷を防ぐとともに,放熱板の外面に樹脂が回り込むことも防止できるとされている。あるいは,放熱板の外側に弾力のある絶縁性シートを貼って型締めする製造方法も開示されている(特許文献2参照。)。本文献の製造方法によれば,絶縁性シートの弾力性によって押圧力を緩和でき,素子の損傷を防止できるとされている。
特開2004−303900号公報特開2002−324816号公報
これに対し,両放熱板の間に複数個のスペーサを設置し,このスペーサで型締め力を受ける技術が開示されている(特許文献1参照。)。本文献に記載の半導体装置によれば,半導体素子の損傷を防ぐとともに,放熱板の外面に樹脂が回り込むことも防止できるとされている。あるいは,放熱板の外側に弾力のある絶縁性シートを貼って型締めする製造方法も開示されている(特許文献2参照。)。本文献の製造方法によれば,絶縁性シートの弾力性によって押圧力を緩和でき,素子の損傷を防止できるとされている。
特開2004−303900号公報特開2002−324816号公報
On the other hand, a technique is disclosed in which a plurality of spacers are installed between the heat radiating plates and a mold clamping force is received by the spacers (see Patent Document 1). According to the semiconductor device described in this document, the semiconductor element can be prevented from being damaged, and the resin can be prevented from entering the outer surface of the heat sink. Or the manufacturing method which affixes the insulating sheet which has elasticity on the outer side of a heat sink, and clamps is also disclosed (refer patent document 2). According to the manufacturing method of this document, the pressing force can be relaxed by the elasticity of the insulating sheet, and damage to the element can be prevented. On the other hand, a technique is disclosed in which a plurality of spacers are installed between the heat radiating plates and a mold clamping force is received by the spacers (see Patent Document 1). According to the semiconductor device described in this document, the Or the manufacturing method which affixes the insulating sheet which has elasticity on the outer side of a heat sink, and clamps is also semiconductor element can be prevented from being damaged, and the resin can be prevented from entering the outer surface of the heat sink. disclosed (refer patent document 2). According to the manufacturing method of this document, the pressing force can be relaxed by the elasticity of the insulating sheet, and damage to the element can be prevented.
JP 2004-303900 A JP 2004-303900 A JP 2002-324816 A JP 2002-324816 A

しかしながら,前記した従来の技術には,それぞれ以下のような問題点があった。特許文献1の技術では,放熱板にスペーサを受ける凹部を形成する必要がある。また,成型のつど毎回複数個のスペーサを設置することが必要となる。そのため,設置のための作業が大変に煩雑である。さらには,外部への樹脂漏れ防止のために半導体装置の周辺に設けられているリードフレームの厚さとスペーサの長さとの関係を厳密に管理しないと,外部への樹脂漏れを起こすおそれがあるという問題点があった。   However, the conventional techniques described above have the following problems. In the technique of Patent Document 1, it is necessary to form a recess for receiving the spacer on the heat sink. In addition, it is necessary to install a plurality of spacers each time for molding. Therefore, the installation work is very complicated. Furthermore, if the relationship between the thickness of the lead frame provided around the semiconductor device and the length of the spacer is not strictly controlled to prevent resin leakage to the outside, there is a risk of resin leakage to the outside. There was a problem.

また,特許文献2に記載の技術では,絶縁シートを貼り付ける工程が必要である。また,絶縁シートの柔軟性が大きいと,モールド樹脂の樹脂圧によって放熱板が外向きに押され,放熱板の剥離等のおそれがあるという問題点があった。   Moreover, in the technique described in Patent Document 2, a step of attaching an insulating sheet is necessary. Moreover, if the insulating sheet is flexible, the heat sink is pushed outward by the resin pressure of the mold resin, and there is a problem that the heat sink may be peeled off.

本発明は,前記した従来のモールド装置が有する問題点を解決するためになされたものである。すなわちその課題とするところは,半導体装置の破損および,放熱板外面への樹脂の付着をともに防止するモールド装置およびモールド品の製造方法を提供することにある。   The present invention has been made to solve the problems of the conventional molding apparatus. That is, it is an object of the present invention to provide a molding apparatus and a method for manufacturing a molded product that prevent both damage to the semiconductor device and adhesion of resin to the outer surface of the heat sink.

この課題の解決を目的としてなされた本発明のモールド装置は,第1の金型と,第1の金型とともにモールド室を構成する第2の金型と,1および第2の金型により構成されるモールド室にモールド材を供給するモールド材供給部とを有し,第2の金型は,型締め方向に移動するとともに,一方の面が,モールド対象物に接触する接触面であるスライド部材と,スライド部材のモールド対象物への押圧力を調整する調整部材とを有するものである。   The molding apparatus of the present invention made for the purpose of solving this problem includes a first mold, a second mold that forms a mold chamber together with the first mold, and the first and second molds. A mold material supply section for supplying the mold material to the mold chamber, and the second mold moves in the mold clamping direction, and one surface is a slide that is a contact surface in contact with the object to be molded It has a member and the adjustment member which adjusts the pressing force to the molding target object of a slide member.

本発明のモールド装置によれば,第1の金型と第2の金型とによってモールド室が構成され,そこにモールド材供給部によってモールド材が供給されるので,モールド室内に配置される対象物をモールド成形することができる。ここで,本発明では,第2の金型がスライド部材と調整部材とを有している。スライド部材は,型締め方向に移動されるものであり,その接触面が対象物に接触される。このスライド部材のモールド対象物への押圧力は,調整部材によって調整されるので,適切な押圧力で押圧することが出来る。従って,半導体装置の破損および,放熱板外面への樹脂の付着をともに防止するように,適切に押圧力を選択することができる。   According to the molding apparatus of the present invention, the mold chamber is constituted by the first mold and the second mold, and the mold material is supplied thereto by the mold material supply unit. Objects can be molded. Here, in this invention, the 2nd metal mold | die has a slide member and an adjustment member. The slide member is moved in the mold clamping direction, and its contact surface comes into contact with the object. Since the pressing force of the slide member to the molding object is adjusted by the adjusting member, it can be pressed with an appropriate pressing force. Accordingly, the pressing force can be appropriately selected so as to prevent both the damage of the semiconductor device and the adhesion of the resin to the outer surface of the heat sink.

さらに本発明では,スライド部材の接触面の裏面が,モールド対象物へ向かう押圧力を受ける被押圧面であり,調整部材は,スライド部材の被押圧面に摺動可能に接触する押圧面を有するとともに,型締め方向と交差する方向に移動する移動部材であり,スライド部材の被押圧面および移動部材の押圧面は,型締め方向と交差する方向に設けられており,かつ,移動部材の移動方向に対して傾斜している。このため,スライド部材の接触面の裏面が被押圧面であり,調整部材の押圧面によって押圧力を受ける。このとき,これらの面が,型締め方向と交差する方向で,かつ,移動部材の移動方向に対して傾斜しているので,移動部材を移動方向に移動させることによって接触面に型締め方向に押圧させることができる。 Furthermore, in the present invention, the back surface of the contact surface of the slide member is a pressed surface that receives a pressing force toward the object to be molded, and the adjustment member has a pressing surface that slidably contacts the pressed surface of the slide member. And a moving member that moves in a direction that intersects the clamping direction, and the pressed surface of the slide member and the pressing surface of the moving member are provided in a direction that intersects the clamping direction, and the movement of the moving member It is inclined with respect to the direction. For this reason , the back surface of the contact surface of the slide member is a pressed surface, and receives a pressing force by the pressing surface of the adjustment member. At this time, since these surfaces are inclined with respect to the moving direction of the moving member in a direction intersecting with the clamping direction, the moving surface is moved in the moving direction to bring the contact surface into the clamping direction. Can be pressed.

さらに本発明では,スライド部材が,モールド対象物に接触する接触面を有するスイベル部材と,スイベル部材の裏面の一箇所に接するとともに,裏面の複数箇所をバネで押圧するバック部材とを有するモールド装置であ。このため,スライド部材は,接触面と傾斜面とのなす角をある程度の範囲内で変えることができる。従って,対象物がある程度傾斜していても,接触面を対象物に確実に接触させることができる。 Further, in the present invention, the slide device includes a swivel member having a contact surface that comes into contact with the object to be molded, and a back member that is in contact with one place on the back surface of the swivel member and presses a plurality of places on the back surface with a spring. der Ru. For this reason , the slide member can change the angle formed by the contact surface and the inclined surface within a certain range. Therefore, even if the object is inclined to some extent, the contact surface can be reliably brought into contact with the object.

さらに本発明は,第1および第2の金型により構成されるモールド室にモールド対象物を配置し,モールド室内にモールド材を供給するモールド品の製造方法であって,第2の金型として,型締め方向に移動するとともに,一方の面が,モールド対象物に接触する接触面であるスライド部材と,スライド部材のモールド対象物への押圧力を調整する調整部材とを有するものを用い,第1の金型のモールド室にモールド対象物の一面を接触させて載置し,第1および第2の金型をモールド対象物の一部を挟んで型締めし,調整部材によりスライド部材をモールド対象物の他面のうち一部以外の箇所に接触するまで移動させることによって,モールド対象物に押し付けて密着させ,その状態でモールド室内にモールド材を供給するモールド品の製造方法にも及ぶ。Furthermore, the present invention is a method of manufacturing a molded product in which a molding object is arranged in a mold chamber constituted by first and second molds, and a molding material is supplied into the mold chamber. , Using a slide member that moves in the mold clamping direction, and whose one surface is a contact surface that contacts the object to be molded, and an adjustment member that adjusts the pressing force of the slide member to the object to be molded, One surface of the molding object is placed in contact with the mold chamber of the first mold, the first and second molds are clamped with a part of the molding object sandwiched, and the slide member is moved by the adjusting member. By moving the other side of the mold object until it touches a part other than a part of the mold object, the mold object is pressed and brought into close contact with the mold object, and the mold material is supplied to the mold chamber in that state. Also extends to a method.

さらに本発明は,第1および第2の金型により構成されるモールド室にモールド対象物を配置し,モールド室内にモールド材を供給するモールド品の製造方法であって,第2の金型として,型締め方向に移動するとともに,一方の面が,モールド対象物に接触する接触面であるスイベル部材と,スイベル部材の裏面の一箇所に接し,裏面の複数箇所をバネで押圧するとともに,スイベル部材の側の面の裏側の面が,モールド対象物へ向かう押圧力を受ける被押圧面であるバック部材と, バック部材の被押圧面に摺動可能に接触する押圧面を有するとともに,型締め方向と交差する方向に移動することによりスイベル部材のモールド対象物への押圧力を調整する調整部材とを有し,バック部材の被押圧面および調整部材の押圧面は,型締め方向と交差する方向に設けられており,かつ,調整部材の移動方向に対して傾斜しているものを用い,第1の金型のモールド室にモールド対象物を載置し,第1および第2の金型を型締めし,調整部材によりスライド部材をモールド対象物に押し付けて密着させ,その状態でモールド室内にモールド材を供給するモールド品の製造方法にも及ぶ。 Furthermore, the present invention is a method of manufacturing a molded product in which a molding object is arranged in a mold chamber constituted by first and second molds, and a molding material is supplied into the mold chamber. The swivel member moves in the clamping direction, and one surface is in contact with a swivel member that is a contact surface that contacts the object to be molded , and one position on the back surface of the swivel member, and a plurality of positions on the back surface are pressed by a spring, and the swivel The back side surface of the member side surface has a back member that is a pressed surface that receives a pressing force toward the object to be molded, a pressing surface that slidably contacts the pressed surface of the back member, and mold clamping It possesses an adjustment member for adjusting a pressing force to the mold object of the swivel member by moving in a direction intersecting the direction, the pressing surface of the pressing surface and the adjustment member of the back member, the mold clamping direction And is provided in a direction crossing the, using shall inclined with respect to the movement direction of the adjusting member, the mold object was placed on the mold chamber of the first mold, the first and second The mold is clamped, the slide member is pressed against the object to be molded by the adjusting member, and the mold material is supplied into the mold chamber in this state.

本発明のモールド装置およびモールド品の製造方法によれば,半導体装置の破損および,放熱板外面への樹脂の付着をともに防止することができる。 According to the molding apparatus and the method for manufacturing a molded product of the present invention, it is possible to prevent both damage to the semiconductor device and adhesion of resin to the outer surface of the heat sink.

「第1の形態」
以下,本発明を具体化した第1の形態について,添付図面を参照しつつ詳細に説明する。 Hereinafter, the first embodiment embodying the present invention will be described in detail with reference to the accompanying drawings. 本形態は,半導体素子を含む電子回路とその両側に放熱板が配置された装置をモールド成形して,半導体装置を製造するモールド装置に本発明を適用したものである。 In this embodiment, the present invention is applied to a molding device for manufacturing a semiconductor device by molding an electronic circuit including a semiconductor element and a device in which heat radiation plates are arranged on both sides thereof. "First form" "First form"
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present embodiment, the present invention is applied to a molding apparatus for manufacturing a semiconductor device by molding an electronic circuit including a semiconductor element and a device in which a heat sink is arranged on both sides thereof. In the present embodiment, the present invention is applied to a molding apparatus for manufacturing a semiconductor device by molding an electronic circuit including a semiconductor element and in the present invention, a first embodiment of the present invention will be described in detail with reference to the accompanying drawings. a device in which a heat sink is arranged on both sides thereof.

本形態のモールド装置1は,図1に示すように,下金型11と上金型12とでモールド室13が構成され,そのモールド室13内にモールド樹脂Mを供給するプランジャ14を有している。さらに,上金型12は,その内側(モールド室13側)にスライド部材21と移動部材22とを有している。移動部材22の図中右面にはネジ23が螺合されている。ネジ23は上金型12を回転可能に貫通して,その頭部は上金型12の図中右外部に突出されている。   As shown in FIG. 1, the molding apparatus 1 according to the present embodiment includes a lower mold 11 and an upper mold 12 to form a mold chamber 13, and a plunger 14 that supplies mold resin M into the mold chamber 13. ing. Further, the upper mold 12 has a slide member 21 and a moving member 22 inside thereof (on the mold chamber 13 side). A screw 23 is screwed onto the right surface of the moving member 22 in the figure. The screw 23 passes through the upper mold 12 in a rotatable manner, and its head protrudes to the right outside of the upper mold 12 in the figure.

上金型12は,下金型11に対して接離する方向(図1中上下方向)に移動する。モールド成形時には,これらの間にモールドされる対象物Wを挟んで型締めされ,モールド室13内にモールド樹脂Mが供給される。従って,図中上下方向が型締め方向である。なお,対象物Wは一般にその上下面が平行なものであり,下金型11上に配置されると上面は水平面となる。また,型締めのために上金型12が上下に移動されると,スライド部材21と移動部材22とは,上金型12とともに図中上下方向に移動される。   The upper mold 12 moves in a direction in which the upper mold 12 is in contact with or separated from the lower mold 11 (vertical direction in FIG. 1). At the time of molding, the object W to be molded is sandwiched between them, and the mold resin M is supplied into the mold chamber 13. Therefore, the vertical direction in the figure is the mold clamping direction. Note that the upper and lower surfaces of the object W are generally parallel, and when the object W is disposed on the lower mold 11, the upper surface becomes a horizontal plane. When the upper mold 12 is moved up and down for clamping, the slide member 21 and the moving member 22 are moved in the vertical direction in the drawing together with the upper mold 12.

スライド部材21は,上金型12に対して,図中上下方向,すなわち型締めと平行な方向にスライド可能に取りつけられている。スライド部材21は,その図中下面が対象物Wの上面に接する接触面である。その接触面は,上下金型11,12の型締め方向に対して垂直な面(図中水平面)となっている。スライド部材21の図中上面は接触面に対して傾斜しており,図中では右上から左下へと向かう傾斜面となっている。この傾斜面が,対象物Wへ向かう押圧力を受ける被押圧面である。   The slide member 21 is attached to the upper mold 12 so as to be slidable in the vertical direction in the figure, that is, in a direction parallel to the mold clamping. The slide member 21 is a contact surface whose lower surface in the drawing is in contact with the upper surface of the object W. The contact surface is a surface (horizontal plane in the figure) perpendicular to the clamping direction of the upper and lower molds 11 and 12. The upper surface of the slide member 21 in the drawing is inclined with respect to the contact surface, and in the drawing, the inclined surface is directed from the upper right to the lower left. This inclined surface is a pressed surface that receives a pressing force toward the object W.

移動部材22は,スライド部材21と上金型12とに挟まれて,その両方に接触しつつ図中左右方向へ移動可能にされている。そのために,移動部材22の内部には,図中左右方向のネジ穴が形成されている。ネジ23の回転によって移動部材22は,上金型12の内面に沿って図中左右方向に移動される。このとき,移動部材22の図中下面は,スライド部材21の被押圧面(傾斜面)に接触する押圧面であり,この押圧面は,スライド部材21の被押圧面に平行な傾斜面である。これらスライド部材21の被押圧面と移動部材22の押圧面とは,型締め方向と交差する方向に設けられており,互いに滑らかに摺動する。さらに,移動部材22の上面は,上金型12の内面に対して滑らかに摺動する。   The moving member 22 is sandwiched between the slide member 21 and the upper mold 12 and is movable in the left-right direction in the figure while being in contact with both. For this purpose, screw holes in the left-right direction in the figure are formed inside the moving member 22. The moving member 22 is moved in the left-right direction in the drawing along the inner surface of the upper mold 12 by the rotation of the screw 23. At this time, the lower surface of the moving member 22 in the drawing is a pressing surface that contacts the pressed surface (inclined surface) of the slide member 21, and this pressing surface is an inclined surface parallel to the pressed surface of the slide member 21. . The pressed surface of the slide member 21 and the pressing surface of the moving member 22 are provided in a direction intersecting the mold clamping direction, and slide smoothly with each other. Further, the upper surface of the moving member 22 slides smoothly with respect to the inner surface of the upper mold 12.

これらから,移動部材22の移動方向は型締め方向と交差する方向であるとともに,スライド部材21の被押圧面および移動部材22の押圧面に対しても平行でなく傾斜している。そして,移動部材22の移動によって,移動部材22の下面に接触しているスライド部材21が図中上下方向にスライドされる。移動部材22の図中左右方向の移動量に対して,スライド部材21の図中上下方向の移動量は小さい。従って,ネジ23の回転による移動部材22の移動によって,スライド部材の図中上下方向の位置を微調整することは容易である。そして,このスライド部材の微調整により,対象物Wへの押圧力も微調整される。   From these, the moving direction of the moving member 22 is a direction intersecting the mold clamping direction, and is inclined not parallel to the pressed surface of the slide member 21 and the pressing surface of the moving member 22. As the moving member 22 moves, the slide member 21 in contact with the lower surface of the moving member 22 is slid in the vertical direction in the figure. The movement amount of the slide member 21 in the vertical direction in the drawing is smaller than the movement amount of the movement member 22 in the horizontal direction in the drawing. Therefore, it is easy to finely adjust the position of the slide member in the vertical direction in the drawing by moving the moving member 22 by the rotation of the screw 23. The pressing force on the object W is also finely adjusted by fine adjustment of the slide member.

本形態のモールド装置1によってモールド成形される対象物Wは,図1に示すように,上部電極W1と下部電極W2とで半導体素子W3等が挟み込まれたものである。対象物Wの周囲には,リードフレームW4が設けられている。上部電極W1と下部電極W2とは,互いに平行な平板であり,放熱板として機能する。モールド成形時には,下部電極W2の図中下面が下金型11の図中上面に接して置かれる。また,スライド部材21の図中下面が上部電極W1の上面に接するように配置される。さらに,型締め時には図1のように,リードフレームW4が下金型11と上金型12とで挟まれる。これにより,樹脂の外部への漏れが防止されている。   As shown in FIG. 1, the object W molded by the molding apparatus 1 of this embodiment has a semiconductor element W3 and the like sandwiched between an upper electrode W1 and a lower electrode W2. A lead frame W4 is provided around the object W. The upper electrode W1 and the lower electrode W2 are flat plates parallel to each other and function as a heat sink. At the time of molding, the lower electrode W2 in the drawing is placed in contact with the upper surface of the lower mold 11 in the drawing. Further, the slide member 21 is arranged so that the lower surface in the drawing is in contact with the upper surface of the upper electrode W1. Furthermore, at the time of mold clamping, the lead frame W4 is sandwiched between the lower mold 11 and the upper mold 12 as shown in FIG. This prevents the resin from leaking outside.

次に,本形態のモールド装置1によるモールド成形方法,すなわちモールド品の製造方法について説明する。まず,図2に示すように,上下の金型11,12を開いた状態で,これらの間に対象物Wを載置する。このとき,スライド部材21および移動部材22は,上金型12とともに上方に配置されている。また,ネジ23は最もゆるめた位置とされ,移動部材22は図中左端部に配置されている。従って,スライド部材21は上金型12に対する移動範囲内の上方に配置されている。   Next, a mold forming method by the mold apparatus 1 of the present embodiment, that is, a method for manufacturing a molded product will be described. First, as shown in FIG. 2, the upper and lower molds 11 and 12 are opened, and the object W is placed between them. At this time, the slide member 21 and the moving member 22 are disposed upward together with the upper mold 12. Further, the screw 23 is in the most loosened position, and the moving member 22 is disposed at the left end portion in the figure. Therefore, the slide member 21 is disposed above the movement range with respect to the upper mold 12.

次に,図2中に矢印で示すように,上下の金型11,12を型締めする。すなわち,上金型12と,スライド部材21,移動部材22を一体的に図中下方へ移動させる。これにより,図3に示すように,リードフレームW4が,上下の金型11,12によって挟まれて型締めされる。一方,上部電極W1の上面とスライド部材21の下面との間にはわずかに隙間がある状態となる。図では大げさに示しているが,この隙間は1mmに満たない程度あれば十分である。このとき,型締め力は,リードフレームW4にはかかるが対象物Wの本体部分にはかからない。   Next, the upper and lower molds 11 and 12 are clamped as indicated by arrows in FIG. That is, the upper mold 12, the slide member 21, and the moving member 22 are integrally moved downward in the drawing. As a result, as shown in FIG. 3, the lead frame W4 is sandwiched between the upper and lower molds 11 and 12 and clamped. On the other hand, there is a slight gap between the upper surface of the upper electrode W1 and the lower surface of the slide member 21. Although it is shown exaggeratedly in the figure, it is sufficient if this gap is less than 1 mm. At this time, the clamping force is applied to the lead frame W4 but not to the main body portion of the object W.

次に,図3中に矢印で示すように,金型11,12の外部からネジ23を回転させる。それによって移動部材22を図中右方へ移動させる。これにより,移動部材22の押圧面がスライド部材21の傾斜面を押し下げ,図4に示すように,スライド部材21が図中下方へスライドされる。こうして,スライド部材21の下面が対象物Wの上面に接するまでネジ23が回転される。傾斜面を介して移動させるので,スライド部材21の対象物Wへの押圧力を微調整することができる。   Next, as indicated by an arrow in FIG. 3, the screw 23 is rotated from the outside of the molds 11 and 12. Thereby, the moving member 22 is moved rightward in the figure. Thereby, the pressing surface of the moving member 22 pushes down the inclined surface of the slide member 21, and the slide member 21 is slid downward in the figure as shown in FIG. Thus, the screw 23 is rotated until the lower surface of the slide member 21 contacts the upper surface of the object W. Since it moves via an inclined surface, the pressing force to the target object W of the slide member 21 can be finely adjusted.

このとき,移動部材22を右向きに移動させればさせるほど押圧力は大きくなるが,上記のように,移動部材22の図中左右方向の移動量に対してスライド部材21の図中上下方向の移動量は小さいので,押圧力の立ち上がりは緩やかなものとなる。従って,スライド部材21の下面と対象物Wの上面との間に隙間が無く,かつ,対象物Wが損傷しない程度に押圧力を調整することは容易である。なお,このときのスライド部材による対象物Wへの押圧力は,型締め力の1/100程度あるいは樹脂圧の1/10程度で良い。   At this time, as the moving member 22 is moved to the right, the pressing force increases. However, as described above, the sliding member 21 moves in the vertical direction in the drawing with respect to the moving amount in the horizontal direction in the drawing. Since the amount of movement is small, the rise of the pressing force becomes gradual. Therefore, it is easy to adjust the pressing force to such an extent that there is no gap between the lower surface of the slide member 21 and the upper surface of the object W and the object W is not damaged. The pressing force applied to the object W by the slide member at this time may be about 1/100 of the mold clamping force or about 1/10 of the resin pressure.

続いて,プランジャ14を操作して,モールド室13内へ樹脂を供給する。このとき,対象物Wの上面はスライド部材21の接触面に隙間無く接しているので,樹脂が侵入するおそれはない。また,対象物Wの上部電極W1には樹脂圧による上向きの力が加えられるが,上面がスライド部材21に接していることから上部電極W1の上向きの移動は防止されている。従って,上部電極W1が対象物Wから剥離するおそれもない。   Subsequently, the plunger 14 is operated to supply resin into the mold chamber 13. At this time, since the upper surface of the object W is in contact with the contact surface of the slide member 21 without a gap, there is no possibility that the resin enters. Further, an upward force due to the resin pressure is applied to the upper electrode W1 of the object W, but since the upper surface is in contact with the slide member 21, the upward movement of the upper electrode W1 is prevented. Therefore, there is no possibility that the upper electrode W1 is peeled off from the object W.

これにより,図5に示すように,モールド室13内がモールド樹脂で満たされる。このままの状態で所定時間保持し,あるいは所定の加熱処理を行ってモールド樹脂を硬化させる。モールド樹脂の硬化が終了したら,型開きを行う。すなわち,上金型12を図中上方へ移動させ,モールド樹脂によって固められた対象物Wを取り出す。これによりモールド品が得られた。これで,モールド成形方法の各工程は終了である。   Thereby, as shown in FIG. 5, the mold chamber 13 is filled with the mold resin. In this state, the mold resin is held for a predetermined time, or a predetermined heat treatment is performed to cure the mold resin. When the mold resin has been cured, open the mold. That is, the upper mold 12 is moved upward in the figure, and the object W solidified by the mold resin is taken out. Thereby, a molded product was obtained. This completes each step of the molding method.

以上詳細に説明したように本形態のモールド装置1によれば,対象物Wを間に下金型11と上金型12とが型締めされて構成されたモールド室に,プランジャ14を操作して樹脂が供給される。このとき,上金型12の内部には,上金型12とともに上下に移動するスライド部材21と移動部材22とが設けられている。スライド部材21の下面は対象物Wに接触し,上面は傾斜面であって,移動部材22の押圧面に接触している。従って,移動部材22を左右に移動させることにより,スライド部材21の上下位置の微調整が容易にでき,スライド部材21の下面を型締め力に比較してごく小さい圧力で対象物Wの上面に接触させることができる。従って,対象物Wを破損することなく,上面にモールド樹脂が付着することを防止できる。これにより,半導体装置の破損および,放熱板外面への樹脂の付着をともに防止するモールド装置となっている。   As described above in detail, according to the molding apparatus 1 of the present embodiment, the plunger 14 is operated in the mold chamber formed by clamping the object W with the lower mold 11 and the upper mold 12 interposed therebetween. Resin is supplied. At this time, a slide member 21 and a moving member 22 that move up and down together with the upper die 12 are provided inside the upper die 12. The lower surface of the slide member 21 is in contact with the object W, and the upper surface is an inclined surface that is in contact with the pressing surface of the moving member 22. Therefore, by moving the moving member 22 to the left and right, the vertical position of the slide member 21 can be easily finely adjusted, and the lower surface of the slide member 21 is applied to the upper surface of the object W with a very small pressure compared to the clamping force. Can be contacted. Therefore, it is possible to prevent the mold resin from adhering to the upper surface without damaging the object W. As a result, the mold apparatus prevents damage to the semiconductor device and adhesion of the resin to the outer surface of the heat sink.

「第2の形態」
以下,本発明を具体化した第2の形態について,添付図面を参照しつつ詳細に説明する。本形態は,半導体素子を含む電子回路とその両側に放熱板が配置された装置をモールド成形して,半導体装置を製造するモールド装置に本発明を適用したものである。なお,本形態のモールド装置2は,第1の形態のモールド装置1と比較して,上金型12の内部に設けられるスライド部材21および移動部材22の部分が変更されているのみであり,同一の部分には同一の符号を付して説明を省略する。
"Second form"
Hereinafter, a second embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present embodiment, the present invention is applied to a molding apparatus for manufacturing a semiconductor device by molding an electronic circuit including a semiconductor element and a device in which a heat sink is arranged on both sides thereof. In addition, the molding apparatus 2 of this embodiment is different from the molding apparatus 1 of the first embodiment in that only the slide member 21 and the moving member 22 provided in the upper mold 12 are changed. The same parts are denoted by the same reference numerals and description thereof is omitted. In the present embodiment, the present invention is applied to a molding apparatus for manufacturing a semiconductor device by molding an electronic circuit including a semiconductor element and in the present invention, a second embodiment of the present invention will be described in detail with reference to the accompanying drawings. a device in which a heat sink is arranged on both sides thereof. In addition, the molding apparatus 2 of this embodiment is different from the molding apparatus 1 of the first embodiment in that only the slide member 21 and the moving member 22 provided in the upper mold 12 are changed. The same parts are semiconductor by the same reference numerals and description thereof is omitted.

本形態のモールド装置2は,図6に示すように,第1の形態におけるスライド部材21に相当する部分に,スイベル構造を有するスライド部材30が設けられている。スライド部材30は,バック部材31とスイベル部材32とを有している。バック部材31の下面には,中央部に凸部33が形成されており,この凸部33がスイベル部材32の上面の一箇所に接している。また,凸部33の周囲の数カ所にバネ34が配置され,その両端部はバック部材31とスイベル部材32とにそれぞれ固定されている。   As shown in FIG. 6, the molding apparatus 2 of this embodiment is provided with a slide member 30 having a swivel structure at a portion corresponding to the slide member 21 in the first embodiment. The slide member 30 has a back member 31 and a swivel member 32. A convex portion 33 is formed at the center of the lower surface of the back member 31, and this convex portion 33 is in contact with one place on the upper surface of the swivel member 32. Further, springs 34 are arranged at several places around the convex portion 33, and both end portions thereof are fixed to the back member 31 and the swivel member 32, respectively.

本形態では,スイベル部材32の下面が対象物Wに接触する接触面であり,バック部材31の上面が傾斜面である。移動部材22は,第1の形態と同様である。バネ34が適宜伸縮するので,接触面は,必ずしも水平面でなく,水平面に対してある程度の角度範囲内でいずれの方向へも傾くことができる。そのため,対象物Wの上面がもし傾いていても,接触面は対象物Wの上面に倣って傾き,隙間無く接触することができる。   In this embodiment, the lower surface of the swivel member 32 is a contact surface that contacts the object W, and the upper surface of the back member 31 is an inclined surface. The moving member 22 is the same as in the first embodiment. Since the spring 34 is appropriately expanded and contracted, the contact surface is not necessarily a horizontal plane, and can be inclined in any direction within a certain angle range with respect to the horizontal plane. Therefore, even if the upper surface of the object W is inclined, the contact surface is inclined following the upper surface of the object W and can be contacted without a gap.

本形態のモールド装置2によってモールド成形する方法は,第1の形態と同様である。すなわち,上金型12を型開きした状態で対象物Wを配置し,型締めする。このとき,移動部材22とスライド部材30とは上金型12とともに図6中上下に移動する。その後,ネジ23を回転させて移動部材22を図6中右方へ移動させる。これにより,バック部材31が図中下方へ押し付けられる。さらに,凸部33を介してスイベル部材32も図中下向きの力を受ける。この力によってスイベル部材32は対象物Wの上面に倣って押し付けられる。   The method of molding with the molding apparatus 2 of this embodiment is the same as that of the first embodiment. That is, the object W is arranged with the upper mold 12 opened, and the mold is clamped. At this time, the moving member 22 and the slide member 30 move up and down in FIG. 6 together with the upper mold 12. Thereafter, the screw 23 is rotated to move the moving member 22 to the right in FIG. Thereby, the back member 31 is pressed downward in the figure. Further, the swivel member 32 also receives a downward force in the figure through the convex portion 33. By this force, the swivel member 32 is pressed along the upper surface of the object W.

これ以降の工程は第1の形態と同様である。すなわち,この状態で,第1の形態と同様に樹脂を供給し,硬化させればよい。対象物Wの上面はスイベル部材32によって覆われているので,樹脂の付着は防止されている。また,樹脂圧による上部電極W1の剥離も防止されている。   The subsequent steps are the same as in the first embodiment. That is, in this state, the resin may be supplied and cured as in the first embodiment. Since the upper surface of the object W is covered with the swivel member 32, adhesion of the resin is prevented. Further, peeling of the upper electrode W1 due to resin pressure is also prevented.

以上詳細に説明したように本形態のモールド装置2によっても,対象物Wを破損することなく,上面にモールド樹脂が付着することを防止できる。さらに,対象物Wの上面が多少傾いていても,バック部材31とスイベル部材32との間の傾きによって対象物Wの上面に倣うことができる。従って,上下の電極W1,W2の平行性があまり良好でない対象物Wについても同様の効果が得られる。   As described above in detail, the molding apparatus 2 of the present embodiment can also prevent the molding resin from adhering to the upper surface without damaging the object W. Furthermore, even if the upper surface of the object W is slightly inclined, the upper surface of the object W can be imitated by the inclination between the back member 31 and the swivel member 32. Therefore, the same effect can be obtained for the object W in which the parallelism of the upper and lower electrodes W1, W2 is not very good.

なお,本形態は単なる例示にすぎず,本発明を何ら限定するものではない。したがって本発明は当然に,その要旨を逸脱しない範囲内で種々の改良,変形が可能である。例えば,上記の形態では,移動部材22をネジ23の方へ引き寄せることによりスライド部材21が対象物Wに押圧される構成としているが,これは逆でも良い。すなわち,押圧面と被押圧面の傾き方向を逆にしたり,あるいはネジの取り付け側を逆にすれば,移動部材をネジから遠ざけるように押してスライド部材を押圧させることもできる。   In addition, this form is only a mere illustration and does not limit this invention at all. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, in the above embodiment, the slide member 21 is pressed against the object W by pulling the moving member 22 toward the screw 23, but this may be reversed. That is, if the inclination direction of the pressing surface and the pressed surface is reversed, or the screw attachment side is reversed, the moving member can be pushed away from the screw to press the slide member.

また例えば,上記の形態ではスライド部材21をウェッジ形とし,移動部材22の移動方向を水平としたが,平板状のスライド部材に対して移動部材を傾斜方向に移動させることによっても,押圧力の調整は可能である。さらに,スライド部材21,30の接触面は平面であるとしたが,上部電極W1の上面が平面でない対象物Wを対象とする場合には,適宜形状を変更すればよい。少なくとも,対象物Wの上面の周囲に接触するようにすればよい。また,本形態ではスライド部材および移動部材を上型に設けているが,下型に設けてもよい。また,本形態のモールド装置1,2によってモールド成形される対象物Wとしては,半導体装置に限らない。上下面を除いてモールドする対象物Wであれば使用できる。   Further, for example, in the above-described embodiment, the slide member 21 is wedge-shaped and the moving direction of the moving member 22 is horizontal. Adjustment is possible. Furthermore, although the contact surfaces of the slide members 21 and 30 are flat, when the upper surface of the upper electrode W1 is a target object W that is not flat, the shape may be changed as appropriate. What is necessary is just to contact at least the periphery of the upper surface of the target object W. In this embodiment, the slide member and the moving member are provided on the upper die, but may be provided on the lower die. In addition, the object W molded by the molding apparatuses 1 and 2 according to the present embodiment is not limited to a semiconductor device. Any object W to be molded except for the upper and lower surfaces can be used.

第1の形態に係るモールド装置を示す断面図である。 It is sectional drawing which shows the molding apparatus which concerns on a 1st form. モールド成形方法を示す説明図である。 It is explanatory drawing which shows a mold forming method. モールド成形方法を示す説明図である。 It is explanatory drawing which shows a mold forming method. モールド成形方法を示す説明図である。 It is explanatory drawing which shows a mold forming method. モールド成形方法を示す説明図である。 It is explanatory drawing which shows a mold forming method. 第2の形態に係るモールド装置を示す断面図である。 It is sectional drawing which shows the molding apparatus which concerns on a 2nd form.

符号の説明Explanation of symbols

1,2 モールド装置
11 下金型
12 上金型
13 モールド室
14 プランジャ
21,30 スライド部材
22 移動部材
31 バック部材
32 スイベル部材
DESCRIPTION OF SYMBOLS 1, 2 Mold apparatus 11 Lower mold 12 Upper mold 13 Mold chamber 14 Plunger 21, 30 Slide member 22 Moving member 31 Back member 32 Swivel member

Claims (3)

  1. 第1の金型と,
    前記第1の金型とともにモールド室を構成する第2の金型と,
    前記第1および第2の金型により構成されるモールド室にモールド材を供給するモールド材供給部とを有し,
    前記第2の金型は,
    型締め方向に移動するとともに,一方の面が,モールド対象物に接触する接触面であるスイベル部材と,
    前記スイベル部材の裏面の一箇所に接し,裏面の複数箇所をバネで押圧するとともに,前記スイベル部材の側の面の裏側の面が,モールド対象物へ向かう押圧力を受ける被押圧面であるバック部材と,
    前記バック部材の被押圧面に摺動可能に接触する押圧面を有するとともに,型締め方向と交差する方向に移動することにより前記スイベル部材のモールド対象物への押圧力を調整する調整部材とを有し, An adjusting member that has a pressing surface that slidably contacts the pressed surface of the back member and that adjusts the pressing force of the swivel member on the molded object by moving in a direction that intersects the mold clamping direction. Yes, and
    前記バック部材の被押圧面および前記調整部材の押圧面は,型締め方向と交差する方向に設けられており,かつ,前記調整部材の移動方向に対して傾斜していることを特徴とするモールド装置。 Pressing surface of the pressing surface and the adjustment member of the back member is provided in a direction crossing the clamping direction, and characterized that you have inclined to the direction of movement of the adjusting member mold apparatus. A first mold, A first mold,
    A second mold constituting a mold chamber together with the first mold; A second mold gradually a mold chamber together with the first mold;
    A mold material supply unit for supplying a mold material to a mold chamber constituted by the first and second molds; A mold material supply unit for supplying a mold material to a mold chamber composed by the first and second molds;
    The second mold is The second mold is
    A swivel member that moves in the mold clamping direction and whose one surface is in contact with the object to be molded ; A swivel member that moves in the mold clamping direction and whose one surface is in contact with the object to be molded ;
    A back which is in contact with one place on the back surface of the swivel member and presses a plurality of places on the back surface with a spring, and the back side surface of the swivel member side is a pressed surface that receives a pressing force toward the molding object. Members, A back which is in contact with one place on the back surface of the swivel member and presses a plurality of places on the back surface with a spring, and the back side surface of the swivel member side is a pressed surface that receives a pressing force toward the molding object. Members,
    An adjusting member that has a pressing surface that slidably contacts the pressed surface of the back member, and that adjusts the pressing force of the swivel member against the molding object by moving in a direction intersecting the mold clamping direction. Yes, and An adjusting member that has a pressing surface that slidably contacts the pressed surface of the back member, and that adjusts the pressing force of the swivel member against the molding object by moving in a direction intersecting the mold clamping direction. Yes, and
    Pressing surface of the pressing surface and the adjustment member of the back member is provided in a direction crossing the clamping direction, and characterized that you have inclined to the direction of movement of the adjusting member mold apparatus. Pressing surface of the pressing surface and the adjustment member of the back member is provided in a direction crossing the clamping direction, and characterized that you have inclined to the direction of movement of the adjusting member mold apparatus.
  2. 第1および第2の金型により構成されるモールド室にモールド対象物を配置し,モールド室内にモールド材を供給するモールド品の製造方法において,
    前記第2の金型として,
    型締め方向に移動するとともに,一方の面が,モールド対象物に接触する接触面であるスライド部材と,
    前記スライド部材のモールド対象物への押圧力を調整する調整部材とを有するものを用い,
    前記第1の金型のモールド室にモールド対象物の一面接触させて載置し,
    前記第1および第2の金型を前記モールド対象物の一部を挟んで型締めし,
    前記調整部材により前記スライド部材を前記モールド対象物の他面のうち前記一部以外の箇所に接触するまで移動させることによって,モールド対象物に押し付けて密着させ, By moving the slide member by the adjusting member until it comes into contact with a portion of the other surface of the mold object other than the part thereof, the slide member is pressed against the mold object and brought into close contact with the object.
    その状態でモールド室内にモールド材を供給することを特徴とするモールド品の製造方法。 A method for manufacturing a molded product, which comprises supplying a molding material into a molding chamber in that state. In a method for manufacturing a molded product, in which a molding object is arranged in a mold chamber constituted by first and second molds, and a molding material is supplied into the mold chamber, In a method for manufacturing a molded product, in which a molding object is arranged in a mold chamber composed by first and second molds, and a molding material is supplied into the mold chamber,
    As the second mold, As the second mold,
    A slide member that moves in the mold clamping direction and whose one surface is in contact with the object to be molded; A slide member that moves in the mold clamping direction and whose one surface is in contact with the object to be molded;
    Using an adjustment member that adjusts the pressing force of the slide member to the molding object, Using an adjustment member that adjusts the pressing force of the slide member to the molding object,
    Placing one surface of the molding object in contact with the mold chamber of the first mold, Placing one surface of the molding object in contact with the mold chamber of the first mold,
    The first and second molds are clamped with a part of the molding object interposed therebetween , The first and second molds are clamped with a part of the molding object susceptible ,
    By moving the slide member by the adjusting member until it contacts a portion other than the part of the other surface of the molding object, it is pressed against the molding object to be brought into close contact therewith , By moving the slide member by the adjusting member until it contacts a portion other than the part of the other surface of the molding object, it is pressed against the molding object to be brought into close contact therewith ,
    In this state, a mold material is supplied into the mold chamber. In this state, a mold material is supplied into the mold chamber.
  3. 第1および第2の金型により構成されるモールド室にモールド対象物を配置し,モールド室内にモールド材を供給するモールド品の製造方法において,
    前記第2の金型として,
    型締め方向に移動するとともに,一方の面が,モールド対象物に接触する接触面であるスイベル部材と,

    前記スイベル部材の裏面の一箇所に接し,裏面の複数箇所をバネで押圧するとともに,前記スイベル部材の側の面の裏側の面が,モールド対象物へ向かう押圧力を受ける被押圧面であるバック部材と, A back surface that is in contact with one location on the back surface of the swivel member, presses a plurality of locations on the back surface with springs, and the surface on the back surface of the side surface of the swivel member is a pressed surface that receives a pressing force toward a mold object. Members and
    前記バック部材の被押圧面に摺動可能に接触する押圧面を有するとともに,型締め方向と交差する方向に移動することにより前記スイベル部材のモールド対象物への押圧力を調整する調整部材とを有し, An adjusting member that has a pressing surface that slidably contacts the pressed surface of the back member and that adjusts the pressing force of the swivel member on the molded object by moving in a direction that intersects the mold clamping direction. Yes, and
    前記バック部材の被押圧面および前記調整部材の押圧面は,型締め方向と交差する方向に設けられており,かつ,前記調整部材の移動方向に対して傾斜しているものを用い, Pressing surface of the pressing surface and the adjustment member of the back member is provided in a direction crossing the clamping direction, and, using shall inclined with respect to the direction of movement of the adjusting member,
    前記第1の金型のモールド室にモールド対象物を載置し, The object to be molded is placed in the mold chamber of the first mold.
    前記第1および第2の金型を型締めし, The first and second molds are molded and molded,
    前記調整部材により前記スライド部材をモールド対象物に押し付けて密着させ, The slide member is pressed against the object to be molded by the adjusting member to bring it into close contact with the object.
    その状態でモールド室内にモールド材を供給することを特徴とするモールド品の製造方法。 A method for manufacturing a molded product, which comprises supplying a molding material into a molding chamber in that state. In a method for manufacturing a molded product, in which a molding object is arranged in a mold chamber constituted by first and second molds, and a molding material is supplied into the mold chamber, In a method for manufacturing a molded product, in which a molding object is arranged in a mold chamber composed by first and second molds, and a molding material is supplied into the mold chamber,
    As the second mold, As the second mold,
    A swivel member that moves in the mold clamping direction and whose one surface is in contact with the object to be molded ; A swivel member that moves in the mold clamping direction and whose one surface is in contact with the object to be molded ;
    A back which is in contact with one place on the back surface of the swivel member and presses a plurality of places on the back surface with a spring, and the back side surface of the swivel member side is a pressed surface that receives a pressing force toward the molding object. Members, A back which is in contact with one place on the back surface of the swivel member and presses a plurality of places on the back surface with a spring, and the back side surface of the swivel member side is a pressed surface that receives a pressing force toward the molding object. Members,
    An adjusting member that has a pressing surface that slidably contacts the pressed surface of the back member, and that adjusts the pressing force of the swivel member against the molding object by moving in a direction intersecting the mold clamping direction. Yes, and An adjusting member that has a pressing surface that slidably contacts the pressed surface of the back member, and that adjusts the pressing force of the swivel member against the molding object by moving in a direction intersecting the mold clamping direction. Yes, and
    Pressing surface of the pressing surface and the adjustment member of the back member is provided in a direction crossing the clamping direction, and, using shall inclined with respect to the direction of movement of the adjusting member, Pressing surface of the pressing surface and the adjustment member of the back member is provided in a direction crossing the clamping direction, and, using shall inclined with respect to the direction of movement of the adjusting member,
    Placing the object to be molded in the mold chamber of the first mold; Placing the object to be molded in the mold chamber of the first mold;
    Clamping the first and second molds; Clamping the first and second molds;
    The slide member is pressed against the object to be molded by the adjustment member, The slide member is pressed against the object to be molded by the adjustment member,
    In this state, a mold material is supplied into the mold chamber. In this state, a mold material is supplied into the mold chamber.
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JP5621146B2 (en) * 2010-07-20 2014-11-05 アピックヤマダ株式会社 Mold drive device
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