JP5325933B2 - Resin mold - Google Patents

Description

  The present invention relates to a resin mold, and more particularly to a resin mold that can be reliably resin-molded without damaging a molded product and without generating a resin flash.

  The resin molding apparatus resin molds various products such as a lead frame, a resin substrate, and a semiconductor wafer as a molded product. Among these molded products, the resin substrate has a large variation in thickness. In particular, in a product formed by stacking multiple layers of electrically insulating layers such as a multilayer wiring substrate, for example, the total thickness of the substrate is 500 μm. At present, there is a considerable thickness variation such as a thickness variation of 50 to 60 μm.

In the resin molding apparatus, the product to be molded is clamped with a resin mold, and the resin is filled in the cavity while applying resin pressure in this state to mold the resin. Therefore, when filling the cavity with the resin, it is necessary to clamp the molded product with a sufficient clamping force so that the resin does not leak from the cavity. For this reason, in the resin mold mold, the clamping position of the mold is set in advance according to the thickness of the molded product, and is clamped with a predetermined clamping force when the molded product is clamped. .
For this reason, as described above, when there is a large variation in the thickness of the molded product, the clamping force on the molded product becomes too strong, causing damage to the molded product or insufficient clamping force. As a result, the resin leaks from the cavity, causing a problem that a resin flash is generated.

  To solve this problem, the cavity block that clamps the molded product can be moved in the mold opening and closing direction, a spring is provided on the back of the cavity block, or the cavity block is hydraulically controlled to be molded. A method of absorbing the thickness variation of the product (Patent Document 1) and a method of adjusting the clamping position of the mold by using a wedge or a screw to cope with the thickness variation of the molded product have been made.

JP-A-11-58435

However, for example, even when a spring is provided on the back surface of the cavity block to absorb the thickness variation of the molded product and resin molding is performed, as shown in FIG. 18A, the cavity 10 is filled with resin. In this case, since the resin pressure A acts in a direction to spread the mold (an action that weakens the clamping force of the molded product 12), the clamping force C of the molded product 12 is a pressing pressure when the resin pressure is not taken into consideration. It is necessary to set the pressure to a pressure that can counter the pressure when considering the resin pressure A in B.
As a result, as shown in FIG. 18 (b), in the conventional resin mold, the clamping force at the time of clamping the molded article 12 is a resin pressure A to a required pressing pressure B for preventing resin flash. Therefore, the pressure applied to the molded product 12 acts as it is, and an excessive clamping force acts on the molded product 12 to cause a problem that a crack is generated at a portion where the molded product 12 is clamped.

  In consideration of the fact that the clamping force acting on the molded product varies depending on the filling pressure of the resin that fills the cavity during resin molding, the mold clamping force is controlled appropriately during the molding process. It is possible to prevent excessive clamping force from acting on the molded product, and to prevent resin flash from occurring when resin molding is performed. It is difficult to control.

  In addition, the thickness may vary depending on the location in a single substrate, which is a molded product, such as a multilayer wiring substrate. In this case, even if the clamping force by the resin mold is accurately controlled, the substrate When the thickness of the substrate is thick, the clamping force acts strongly and the substrate is crushed, and when the substrate is thin, the clamping force is insufficient and the resin beam is generated.

Furthermore, it is desired to adjust the thickness of the resin mold portion according to the product (product) to be molded.

The present invention has been made to solve these problems, and in particular, an object of the present invention is to provide a resin mold mold capable of adjusting the thickness of a resin mold portion according to a product to be molded.

The present invention has the following configuration in order to achieve the above object.
That is, a resin mold that clamps and molds a molded product with an upper mold and a lower mold, the cavity recessed portion in which the molded product is resin-molded by filling with resin, and the inner bottom surface of the cavity recessed portion A cavity insert provided with a sliding hole that communicates with the cavity insert, a first movable block that is guided by the sliding hole of the cavity insert and is movable in the mold opening and closing direction, and that forms the inner bottom surface of the cavity recess, and in the mold opening and closing direction The first movable taper block and the first fixed taper block each having a taper surface that is in sliding contact with each other, and adjusting the advancing and retreating position of the first movable taper block, the first movable taper block through the first fixed taper block A depth adjusting mechanism that adjusts the position of the first movable block in the mold opening and closing direction and adjusts the depth of the cavity recess includes the upper mold and the lower mold. Wherein the one being provided on the side of.

Further, the first movable taper block is moved in a mold with respect to the first fixed taper block, and the first movable block is moved in a direction approaching the other side of the upper mold and the lower mold, The first movable taper block is moved out of the mold with respect to the first fixed taper block, and the first movable block is moved in a direction away from the other side of the upper mold and the lower mold. .
Further, a pot is provided on the other side of the upper mold and the lower mold, and a mold cull provided at a position facing the pot is provided on one side of the upper mold and the lower mold, and sandwiches the mold cull. The cavity insert is provided on both sides, the mold cull and each cavity recess of the cavity insert are provided in communication, and the cavity recess is filled with resin.
A second movable block for receiving a resin pressure acting on the cavity region defined by the molded product clamped at the time of resin molding and the cavity recess by contacting the molded product; A thickness adjusting mechanism that adjusts the position of the movable block in the mold opening / closing direction and adjusts the thickness of the molded product that is in contact with the second movable block, on the other side of the upper mold and the lower mold; It is characterized by being.
The thickness adjusting mechanism includes a second movable taper block and a second fixed taper block each having a tapered surface that slides in contact with each other in the mold opening / closing direction, and adjusts the advance / retreat position of the second movable taper block. Accordingly, the position of the second movable block in the mold opening / closing direction is adjusted via the second fixed taper block, and the thickness of the molded product is adjusted.
In addition, a clamp part provided with a set part in which the article to be molded is set and a sliding hole leading to the set part is provided on the other side of the upper mold and the lower mold, and the second movable block is It is guided by a sliding hole of the clamp block, is movable in the mold opening / closing direction, and is formed in a planar shape that matches the planar shape of the cavity recess.

According to the resin mold according to the present invention, in particular, the thickness of the resin mold portion can be adjusted according to the product to be molded.

It is a top view of the upper mold | type in 1st Embodiment of the resin mold metal mold | die. It is a top view of the lower mold | type in 1st Embodiment of a resin mold metal mold | die. It is side surface sectional drawing which shows the structure of 1st Embodiment of the resin mold metal mold | die. It is side surface sectional drawing in the state which made the upper mold | type contact the surface of the to-be-molded product. It is side surface sectional drawing in the state which clamped the to-be-molded product with the upper mold | type and the lower mold | type. It is side surface sectional drawing in the state which filled the cavity with resin. It is front sectional drawing in the state shown in FIG. It is front sectional drawing in the state shown in FIG. It is front sectional drawing in the state shown in FIG. It is front sectional drawing in the state shown in FIG. It is explanatory drawing which shows the cavity area | region in the case of resin-molding a to-be-molded product. It is side surface sectional drawing which shows the structure of 2nd Embodiment of the resin mold metal mold | die. It is sectional drawing which shows the structure of 3rd Embodiment of the resin mold metal mold | die. It is sectional drawing which shows the resin mold operation by a resin mold metal mold | die. It is sectional drawing which shows the resin mold operation by a resin mold metal mold | die. It is side surface sectional drawing which shows the structure of 4th Embodiment of the resin mold metal mold | die. It is front sectional drawing in the state shown in FIG. It is explanatory drawing which shows the magnitude | size of the clamping force which acts on a resin mold metal mold | die.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
(First embodiment)
1 and 2 are plan views of clamp surfaces of an upper mold 20 and a lower mold 30 according to an embodiment of a resin mold according to the present invention.
The resin mold mold according to the present embodiment is a resin mold in which a semiconductor device substrate on which four semiconductor chips are mounted at a predetermined interval in the longitudinal direction on a resin substrate formed in a flat strip shape is a molded product 50. The molded product 50 is provided with four resin mold portions according to the mounting position of the semiconductor chip mounted on the substrate. The upper mold 20 is provided with four cavity recesses. With the upper mold 20 and the lower mold 30 clamped the molded product 50, the cavity is filled with resin from the pot 31, and the molded product 50 is molded into the resin mold. Is done.

  The lower mold 30 is provided with a setting portion 39 for setting two molded products 50 so as to face each other so as to sandwich the pot 31. The upper mold 20 is provided with mold cavities 21 at positions facing the pots 31 provided on the lower mold 30, and cavity inserts 22 with cavity recesses 24 provided on both sides of the mold cul 21. The chase block 23 is supported and arranged. The cavity recess 24 is formed in a square bottom shape with a flat planar shape, and the cavity recess 24 and the mold cull 21 communicate with each other via a runner path 25. The runner path 25 is provided so as to be connected to the corner portion of the cavity recess 24.

The configuration of the upper mold 20 in the resin mold of the present embodiment is not basically different from the structure of the conventional resin mold. A characteristic configuration in the resin mold of this embodiment is the configuration of the lower mold 30.
That is, in a normal transfer mold type resin mold, the cavity inserts are arranged by being fixed to the chase block on both sides sandwiching the pot 31, but in the resin mold of this embodiment, the pot 31 of the lower mold 30 is disposed. A clamp block 32 is movably arranged in the mold opening / closing direction while being guided by the chase block 33 on both sides of the arrangement, and a movable block 34 is arranged movably in the mold opening / closing direction with respect to the clamp block 32.

The clamp block 32 is for clamping the molded product 50 between the upper mold 20 and the cavity insert used in the conventional resin mold. In the present embodiment, the planar shape of the clamp block 32 is made to coincide with the region portion excluding the resin mold portion of the molded product 50, and the planar shape and planar arrangement of the movable block 34 are arranged in the molded product 50. In other words, that is, the planar shape and the planar arrangement of the cavity recess 24 provided in the upper mold 20. The movable block 34 has a square shape in plan view.
The clamp block 32 is provided with four sliding holes 32a for movably guiding the movable block 34 in the mold opening / closing direction, and the clamp block 32 is formed as a lattice frame-shaped member. The clamp block 32 is provided with an air suction hole 32 b that opens at the end face of the clamp block 32, and the air suction hole 32 b communicates with an air suction mechanism via an internal channel provided in the clamp block 32. Instead of providing the air suction hole 32b in the clamp block 32, a gap 32c is provided between the inner side surface of the sliding hole 32a and the side surface of the movable block 34, and the gap 32c and the air suction mechanism are communicated to form the gap 32c. Can be used as air suction holes.

  The clamp block 32 clamps a region excluding the cavity in the planar region of the molded product 50 during resin molding. In the present embodiment, when the elastic spring 35 is mounted between the lower surface of the clamp block 32 and the chase block 33 and the molded product 50 is clamped by the upper mold 20 and the lower mold 30, the molded product 50 Is clamped via the elastic force of the elastic spring 35. As shown in FIG. 2, the elastic springs 35 are arranged uniformly in the circumferential direction of the clamp block 32.

  FIG. 3 shows a cross-sectional configuration of the upper mold 20 and the lower mold 30. Four cavity recesses 24 are provided in the cavity insert 22 of the upper die 20, the clamp block 32 is accommodated in the chase block 33 of the lower die 30, and the elastic force is generated between the lower surface of the clamp block 32 and the chase block 33. The spring 35 is mounted, the movable block 34 is provided in the same shape and arrangement as the cavity recess 24 of the upper mold 20, and the movable block 34 is guided movably in the mold opening / closing direction by the clamp block 32. It is shown.

  A fixed taper block 37 is fixed to the lower surface of the movable block 34, and a movable taper block 38 is disposed between the fixed taper block 37 and the fixed block 36 fixed to the chase block 33. The fixed taper block 37 and the movable taper block 38 are arranged in a through-hole penetrating in the longitudinal direction of the chase block 33 so that the taper surfaces 37a and 38a are in sliding contact with each other and the movable taper block 38 can be moved forward and backward in the longitudinal direction. ing. The tapered surfaces 37a, 38a move in a direction in which the movable taper block 38 moves into the mold and moves in a direction in which the movable block 34 approaches the upper mold 20, and move in a direction in which the movable taper block 38 moves outward from the mold. The block 34 is provided so as to move in a direction away from the upper mold 20. On one end side of the movable taper block 38, a drive unit 40 for moving the movable taper block 38 back and forth in the longitudinal direction is provided.

  In the resin mold of this embodiment, the fixed taper block 37 is fixed to the lower surface of the movable block 34. Instead of fixing the fixed taper block 37 to the movable block 34, the fixed taper block 37 The upper surface and the lower surface of the movable block 34 may be brought into contact with each other, and the fixed taper block 37 may be movable in the mold opening / closing direction in accordance with the advance / retreat operation of the movable taper block 38.

The drive unit 40 is for moving the movable taper block 38 back and forth in the longitudinal direction, and the movable taper block 38 is driven by rotating the ball screw with a servo motor and screwing the ball screw into the movable taper block 38. Can be moved forward and backward.
As shown in FIG. 2, in the present embodiment, a pair of fixed taper block 37 and movable taper block 38 is provided on each of one side and the other side across pot 31, and each movable taper block has a drive unit 40. Is provided.

Below, the method to resin mold the to-be-molded product 50 using the resin mold metal mold | die which concerns on the said structure is demonstrated.
3 to 6 are side cross-sectional views of the mold in each process of setting the molded product 50 in the resin mold, filling the cavity with resin, and resin molding, and FIGS. 7 to 10 are front views in each process. A cross-sectional view is shown.
FIG. 3 shows a state in which the molded product 50 is set on the lower mold 30 in a state where the resin mold is opened. In the lower mold 30, the end surface of the clamp block 32 protrudes from the end surface of the chase block 33 by the action of the elastic spring 35, and the movable block 34 is in a position retracted below the end surface of the clamp block 32.

In this state, the molded product 50 is set in alignment with the clamp block 32. In a state where the molded product 50 is aligned with the clamp block 32, the molded product 50 is air-suctioned from the air suction holes 32 b provided in the clamp block 32, thereby accurately and reliably clamping the molded product 50. Can be supported.
In FIG. 7, the product 50 is supported by the clamp block 32, the movable block 34 is supported by the fixed taper block 37 and the movable taper block 38, and is positioned below the product 50. It shows that.

FIG. 4 shows a state in which the upper mold 20 is lowered toward the lower mold 30 and the clamp surface of the cavity insert 22 is brought into contact with the upper surface of the molded product 50.
By bringing the clamping surface of the cavity insert 22 into contact with the molded product 50, the cavity region 24a is defined on the upper surface side (the upper mold 20 side) of the molded product 50, and the cavity insert 22 is surrounded so as to surround the cavity region 24a. The clamp surface comes into contact.
On the other hand, on the lower surface side (the lower mold 30 side) of the molded product 50, the end surface of the clamp block 32 contacts the molded product 50 in accordance with the peripheral edge of the cavity region 24 a.

In FIG. 8, the clamp surface of the cavity insert 22 of the upper mold 20 contacts the upper surface of the molded product 50, the clamp surface of the cavity insert 22 contacts the periphery of the cavity region 24a, and the end surface of the clamp block 32 is the molded product. The state which contact | abuts to the lower surface of 50 is shown. In this state, the elastic spring 35 is not compressed.
As described above, the molded product 50 has a large number of semiconductor chips mounted on a substrate (not shown in the figure), and the large number of semiconductor chips are accommodated in the respective cavity regions 24a. The workpiece is positioned.

FIG. 5 shows a state where the molded product 50 is clamped by the upper mold 20 and the lower mold 30. The upper mold 20 is moved downward, the elastic spring 35 is slightly compressed, and the molded product 50 is clamped by the cavity insert 22 and the clamp block 32. When the clamp block 32 is slightly pushed into the chase block 33 of the lower mold 30, the movable block 34 comes close to the lower surface of the molded product 50.
FIG. 9 shows a state where the molded product 50 is clamped by the clamp block 32 and the upper cavity insert 22 at the peripheral edge of the cavity region 24a.

  The clamping force for clamping the molded product 50 by the cavity insert 22 of the upper mold 20 and the clamp block 32 of the lower mold 30 is determined by the elastic force when the elastic spring 35 is compressed and clamped. In the present embodiment, the clamp block 32 is provided in the lower mold 30 so that the molded product 50 is clamped at the peripheral edge of the cavity region 24a. Therefore, when the resin is filled in the cavity region 24a, the resin pressure is clamped. It can be made not to act. The clamping force for clamping the molded product 50 by the clamp block 32 may be set to a pressure that does not damage the substrate even when the cavity region 24a is filled with resin.

  FIG. 6 shows a state in which the molded product 50 is clamped by the cavity insert 22 and the clamp block 32 and then the cavity 60 is filled with the resin 60. When filling the cavity region 24a with the resin 60, first, the drive unit 40 is operated to allow the movable taper block 38 to enter the mold, and the upper surface of the movable block 34 is brought into contact with the lower surface of the molded product 50. In this state, the resin 60 is filled from the pot 31 to the cavity region 24a. 6 and 10, the movable taper block 38 is fed into the back side of the mold, and the movable block 34 arranged corresponding to each cavity region 24 a comes into contact with the lower surface of the product 50 to be resin. A state where 60 is filled is shown.

  When the cavity region 24a is filled with the resin 60 with the upper surface of the movable block 34 being in contact with the lower surface of the molded product 50, the resin pressure acting on the molded product 50 at the time of resin filling is reduced on the lower mold side. Supported by the movable block 34, the fixed taper block 37, the movable taper block 38, the fixed block 36, and the chase block 33, the molded product 50 is resin-molded without being deformed.

After filling the cavity region 24a with the resin 60 and thermosetting the resin 60, the mold is opened, and the molded product is taken out from the lower mold 30 to complete the resin molding operation. The molded product has one surface on which a semiconductor chip is mounted resin-molded, and is cut into individual pieces by cutting the substrate together with the resin mold portion in accordance with the position of the semiconductor chip mounted on the substrate. A semiconductor device is obtained.
In this embodiment, an example in which one cavity region 24a is provided for each semiconductor chip mounted on the substrate and resin molding is described, but a case where a plurality of semiconductor chips are resin-molded in one cavity region 24a is described. Can be applied similarly. FIG. 11A shows an example in which the cavity region 24a is set for each semiconductor chip 51 mounted on the substrate 50a and resin molding is performed. FIG. 11B shows all the semiconductor chips 51 mounted on the substrate 50a in one cavity. FIG. 11C shows an example in which two cavity regions 24a are set for the semiconductor chip 51 mounted on the substrate and resin molding is performed.

  In the resin molding apparatus of the present embodiment, resin pressure acting on the cavity region 24a during resin molding is received by the movable block 34 and resin molding is performed. Therefore, the clamping force by the clamp block 32 that clamps the molded product 50 is It is only necessary to set so that no resin flash occurs at the peripheral edge of the cavity region 24a. The clamping force by the clamping block 32 is not affected by the resin pressure of the resin filled in the cavity region 24a during resin molding, so that it is not necessary to apply an excessive clamping force to the molded product 50, and a resin beam is generated. By setting the clamping pressure at which the molded product 50 can be resin-molded without being damaged, it is possible to perform resin molding without damaging the molded product 50.

  Even if the thickness of the molded product 50 itself varies, according to the method of resin molding using the resin mold of the present embodiment, the thickness of the molded product 50 is caused by the action of the elastic spring 35. Thus, the molded product 50 can be clamped by absorbing the variation. When setting the resilience of the resilience spring 35, even if the thickness of the molded product 50 varies, the resilience may be set so as to obtain a certain clamping force that does not cause resin flash during resin molding. . When the thickness of the molded product 50 varies, the support position of the molded product 50 by the movable block 34 varies. However, the position of the movable block 34 is adjusted by the drive unit 40 by the movable taper block 38. This can be done by adjusting the advance / retreat position.

As a method of controlling the height position of the movable block 34 by the drive unit 40, the movable taper block 38 can be adjusted by moving the taper block 38 forward and backward according to the thickness of the molded product 50 for each molded product 50. When the thickness of the molded product 50 varies for each lot, the height position of the movable block 34 may be adjusted for each lot.
The method of dealing with the variation in the thickness of the molded product 50 by moving the movable taper block 38 forward and backward corresponds to the variation in the thickness of the molded product 50, and the different types of products with different thicknesses of the molded product 50 itself. It can also be used in the case of resin molding.
The method of operating the drive unit 40 and using the movable taper block 38 to cope with thickness variations of molded products and different types of products with different thicknesses is set by exchanging the mold in the press device. Compared with such a method, the work is much easier.

In the above embodiment, the lower mold 30 is provided with the clamp block 32 and the movable block 34 to clamp the molded product 50. Instead of providing the lower mold 30 with the clamp block 32 and the movable block 34, A configuration in which the clamp block 32, the movable block 34, and the like are arranged on the upper mold 20 is also possible. When the clamp block 32 and the movable block 34 are disposed on the upper mold 20, the cavity insert is disposed on the lower mold 30 so as to face the clamp block 32.
Even when the upper block 20 is provided with the clamp block 32 and the movable block 34, as in the above-described embodiment, the clamping force acts on the molded product 50 independently of the resin pressure by the resin filling the cavity region 24a. Thus, the resin molding can be performed without damaging the molded product 50.

Further, in the present embodiment, as the position adjusting means of the movable block 34, the fixed taper block 37 is fixed to the movable block 34, and the taper surface 38a of the movable taper block 38 is slidably contacted with the taper surface 37a of the fixed taper block 37. However, it is also possible to fix the fixed taper block 37 to the fixed block 36 by inverting the arrangement of the fixed taper block 37 and the movable taper block 38 so that the movable taper block 38 slides on the lower surface of the movable block 34. It is.
Further, since the mold of this embodiment has a configuration in which four movable blocks 34 are arranged in series in the longitudinal direction, a method of collectively adjusting the position of the movable block 34 using a taper block is effective. As the position adjusting means for adjusting the position by moving the movable block 34 in the mold opening / closing direction, a method using a hydraulic pressure, a method using a servo motor, or the like can be used in addition to a method using a taper block.

(Second Embodiment)
FIG. 12 is a side sectional view showing the configuration of the second embodiment of the resin mold according to the present invention. The resin mold mold of this embodiment is provided with a clamp block 32 and a movable block 34 on a lower mold 30, and a movable taper block 38 and a drive unit 40 as a mechanism for adjusting the position of the movable block 34. 20, a movable block 341 constituting the inner bottom surface (ceiling surface) of the cavity region 24a, a fixed taper block 371, a movable taper block 381, and a movable taper block as a mechanism for adjusting the position of the movable block 341 in the mold opening / closing direction. 381 is provided with a drive unit 401 for moving the front and rear 381 back and forth in the longitudinal direction. The movable block 341 is provided so that the outer peripheral side surface is guided by the inner peripheral side surface of the sliding hole provided in the cavity insert 221 and is movable in the mold opening / closing direction.

The fixed taper block 371 is fixed to the back surface of the movable block 341. The taper surfaces 371a and 381a of the fixed taper block 371 and the movable taper block 381 are lowered when the movable taper block 381 enters the mold. The movable block 341 moves in a direction approaching the mold 30, and the movable block 341 is moved in a direction away from the lower mold 30 when the movable tapered block 381 moves outward from the mold.
When resin molding is performed using the resin mold of the present embodiment, after the product 50 is clamped by the upper mold 20 and the lower mold 30, the drive unit 401 is operated to move the movable taper block 381 to a predetermined position. Then, the position of the movable block 341 in the mold opening / closing direction is adjusted to fill the cavity region 24a with the resin 60 and mold the resin.

By adjusting the advance / retreat position of the movable taper block 381, the position of the movable block 341 in the mold opening / closing direction, that is, the depth of the cavity region 24a can be adjusted to perform resin molding. When different types of products are resin-molded as the molded product 50, the planar arrangement position of the resin mold portion may be common and the thickness of the resin mold portion, that is, the depth of the cavity region 24a may be different. In such a case, the depth of the cavity region 24a can be adjusted only by moving the movable taper block 381 forward and backward, and a dissimilar product can be resin-molded without changing the mold.
The resin mold mold of this embodiment can be resin-molded without causing a resin burr even when the thickness of the molded product 50 varies, as in the resin mold mold of the first embodiment. Furthermore, the thickness of the resin mold part can also be adjusted according to the product, and it is provided as a resin mold that can be used more generally.

(Third embodiment)
13-15 is sectional drawing which shows the structure of 3rd Embodiment of the resin mold metal mold | die which concerns on this invention. Also in the resin mold according to the present embodiment, the cavity insert 22 is attached to the upper mold 20, the clamp block 32 and the movable block 34, and the movable block 34 in the mold opening / closing direction, similarly to the above-described embodiment. A fixed taper block 37 and a movable taper block 38 to be moved are provided.
A characteristic feature of the resin mold of this embodiment is that a support block 321 is mounted between the clamp block 32 and the fixed taper block 37.

The support block 321 is disposed between the lower surface of the clamp block 32 and the upper surface of the fixed taper block 37. The support block 321 always abuts on the lower surface of the clamp block 32 by the urging force of the elastic spring 35, and the clamp block 32 is moved upward. It is provided so as to push up toward the mold 20. The other end of the elastic spring 35 is in contact with the chase block 33 and the like.
Similar to the above-described embodiment, the movable block 34 is supported by the fixed taper block 37 by being fixed to the fixed taper block 37 or by bringing the lower surface into contact with the upper surface of the fixed taper block 37. In this embodiment, a reduced diameter portion 34 a is provided below the movable block 34, the reduced diameter portion 34 a is slid into a guide hole 321 a provided in the support block 321, and the lower surface of the reduced diameter portion 34 a is fixed to the fixed taper block 37. The movable block 34 is supported by a fixed taper block 37 in contact with the upper surface.

As shown in FIG. 13, the diameter of the reduced diameter portion 34a is set to be higher than the thickness of the support block 321, and the position (parting line) of the upper end surface of the movable block 34 is clamped in the mold open state. It is set to be lower than the position (parting line) of the upper end surface of the block 32. The height or thickness of each of these members is such that there is a slight gap between the upper end surface of the movable block 34 and the lower surface of the molded product 50 when the molded product 50 is resin-molded by filling the cavity with resin. Is set to occur. This is because the molded product 50 is slightly bent by the resin pressure when the cavity is filled with the resin, and the resin pressure is released to the movable block 34 side.
That is, as shown in FIG. 13, the height difference between the upper end surface of the movable block 34 and the upper end surface of the clamp block 32 in the mold open state is S1, and the lower surface of the support block 321 and the upper surface of the fixed taper block 37 are If the interval is set to S2, the height or thickness dimension of each member is set so that S1 slightly exceeds S2.

FIG. 13 shows a state in which the molded product 50 is set on the clamp block 32 of the lower mold 30 in the mold open state.
FIG. 14 shows a state in which the upper mold 20 is moved downward relative to the lower mold 30 and the product 50 is clamped by the upper mold 20 and the clamp block 32. In this state, the elastic spring 35 is bent, and the molded product 50 is clamped by the spring pressure. The support block 321 and the fixed taper block 37 are separated from each other.

FIG. 15 shows a state where the upper mold 20 is then moved down to the mold clamping position and the cavity 60 is filled with the resin 60. In accordance with the resin filling operation, the movable taper block 38 is pushed in by the drive unit 40 so as to enter the mold, and the movable block 34 is pushed up via the fixed taper block 37.
As described above, the step S1 between the upper end surfaces of the movable block 34 and the clamp block 32 is set larger (wider) than the spacing S2 between the support block 321 and the fixed taper block 37. When contacting the lower surface of the support block 321, the push-up position of the movable block 34 is regulated, and the position of the upper end surface of the movable block 34 is slightly lower than the upper end surface of the clamp block 32. S in the figure indicates a gap formed between the lower surface of the molded product 50 and the upper end surface of the movable block 34.

  Thus, when the resin is filled into the cavity, the movable taper block 38 is pushed to the position where the fixed taper block 37 contacts the lower surface of the support block 321, so that the molding is performed when the resin pressure during the resin filling is applied. The product 50 can be resin-molded so as to bend toward the movable block 34 side. By bending the workpiece 50 toward the movable block 34, the resin pressure can be released to the movable block 34, and resin molding can be performed so that the resin pressure does not affect the clamping force of the clamp block 32. Thus, it is possible to perform resin molding without causing resin flash.

  In this embodiment, the support block 321 is disposed between the fixed taper block 37 and the clamp block 32. However, when the vertical arrangement of the fixed taper block 37 and the movable taper block 38 is reversed. The support block 321 may be interposed between the movable taper block 38 and the clamp block 32. Also in the case of this embodiment, arrangement | positioning etc. of each member are not limited to the form of the example of illustration. It is also possible to provide a hole in the support block 321 through which the spring spring 35 can penetrate so that the spring spring 35 acts on the clamp block 32.

  When the resin block is configured such that the support block 321 is interposed between the clamp block 32 and the fixed taper block 37 as in this embodiment, the fixed taper block 37 is movable by contacting the support block 321. Since the upper position of the block 34 is defined, the distance between the upper surface of the movable block 34 and the molded product 50 at the time of resin filling can be determined without controlling the movement position (movement amount) of the movable taper block 38 with high accuracy. There is an advantage that it can be controlled. When setting so that the resin pressure is released to the movable block 34 side, the distance between the upper surface of the movable block 34 and the molded product 50 is a slight distance of 10 μm or less, so the fixed taper block 37 is applied to the support block 321. The method of positioning the movable block 34 by contacting is effective as a method of setting such a narrow interval with high accuracy. In addition, according to this method, even when the movable block 34 is used in common, the use of the support block 321 having a different thickness enables the separation interval between the movable block 34 and the molded product 50 to be adjusted appropriately. is there.

(Fourth embodiment)
16 and 17 show the configuration of the fourth embodiment of the resin mold according to the present invention. In the resin mold according to this embodiment, air suction holes 22 a and 22 b for air-adsorbing the release film 70 are provided in the cavity insert 22 provided in the upper mold 20, and the air suction holes 22 a and 22 b are communicated with the air suction mechanism 72. It is characterized by that. The air adsorbing hole 22 a is provided so as to open at the inner bottom surface of the cavity recess 24, and the air adsorbing hole 22 b is provided so as to be opened at a clamp part that contacts the molded product 50.

When the molded product 50 is resin-molded using the resin mold of the present embodiment, the molded product 50 is set in the lower mold 30 while the mold is open, while the release film 70 is placed in the mold. 16 and 17, as shown in FIGS. 16 and 17, the release film 70 is air-adsorbed on the clamping surface including the cavity recess 24 of the upper mold 20, and the molded product 50 is clamped by the upper mold 20 and the lower mold 30. Resin mold. The release film 70 has a required heat resistance, and a film material that is easily air adsorbed to the inner surface of the cavity recess 24 by air suction from the air adsorbing holes 22a and 22b and has good releasability from the resin is used. It is done.
The method of clamping the workpiece 50 with the upper mold 20 and the lower mold 30 and operating the movable taper block 38 with the drive unit 40 to perform resin molding is exactly the same as in the case of the first embodiment described above.

When the molded product 50 is resin-molded using the resin mold of the present embodiment, a resin flash is generated on the molded product 50 or the molded product 50 is removed as in the above-described embodiment. In addition to the advantage that resin molding can be performed without damaging the resin, it is possible to perform resin molding without attaching resin to the mold surface as an effect of resin molding using the release film 70, release film Since the mold 70 is easily released from the mold, an ejector pin for releasing the molded product from the mold is not necessary, and the buffer film (cushioning) of the release film 70 makes the thickness within one substrate. Even if there is a variation in the thickness of the substrate, it absorbs the variation in the thickness of the substrate depending on the location, does not cause a resin flash, and does not damage the substrate. Advantage butter mold is obtained.
In this embodiment, the resin molding surface of the upper mold 20 is covered with the release film 70. However, when the cavity mold recess for the resin mold is formed in the lower mold 30, the resin molding surface of the lower mold 30 is released. What is necessary is just to coat with the film 70 and to perform resin molding.

According to the resin mold according to the present invention, in particular, the thickness of the resin mold portion can be adjusted according to the product to be molded. In addition, according to the resin mold according to the present invention, the resin filled into the cavity at the time of resin molding is configured by performing the resin mold by clamping along the peripheral edge of the cavity recess by the clamp block at the time of resin molding. Regardless of the resin pressure, the molded product can be clamped and molded with the clamp block, and the thickness variation of the molded product can be absorbed, and the molded product can be properly molded. It is possible to perform resin molding by clamping with a sufficient clamping force. As a result, resin molding can be performed without causing resin flash and without damaging the molded product. Further, by providing the movable block, it is possible to prevent the deformation of the substrate due to the resin pressure and the opening of the mold at the portion where the resin pressure of the substrate is applied, and to cope with the variation of the substrate.

20 Upper mold 21 Die cull 22, 221 Cavity insert 23, 33 Chase block 24 Cavity recess 24a Cavity area 25 Runner path 30 Lower mold 31 Pot 32 Clamp block 32a Sliding hole 32b Air suction hole 34, 341 Movable block 35 Bounce Spring 36 Fixed block 37, 371 Fixed taper block 37a, 38a Tapered surface 38, 381 Movable taper block 40, 401 Drive unit 50 Molded product 51 Semiconductor chip 60 Resin 70 Release film 72 Air adsorption mechanism 321 Support block

Claims (6)

A resin mold mold that clamps a molded product with an upper mold and a lower mold and molds the resin,
A cavity insert provided with a cavity recess in which resin is filled and the molded article is resin-molded, and a sliding hole leading to the inner bottom surface of the cavity recess;
A first movable block guided by a sliding hole of the cavity insert and movable in the mold opening and closing direction to form an inner bottom surface of the cavity recess;
The first fixed taper block has a first movable taper block and a first fixed taper block each having a taper surface that is in sliding contact with each other in the mold opening and closing direction, and adjusting the advancing and retreating position of the first movable taper block. A depth adjusting mechanism that adjusts the position of the first movable block in the mold opening and closing direction and adjusts the depth of the cavity recess,
A resin mold die provided on one side of the upper die and the lower die. The resin mold according to claim 1,
Moving the first movable taper block in the mold relative to the first fixed taper block, and moving the first movable block in a direction approaching the other side of the upper mold and the lower mold;
The first movable taper block is moved out of the mold with respect to the first fixed taper block, and the first movable block is moved in a direction away from the other side of the upper mold and the lower mold. Resin mold mold. In the resin mold die according to claim 1 or 2,
A pot is provided on the other side of the upper mold and the lower mold,
A mold cull provided at a position facing the pot is provided on one side of the upper mold and the lower mold,
The cavity inserts are provided on both sides of the mold cull, and the mold cull and each cavity recess of the cavity insert are provided in communication with each other.
A resin mold mold, wherein the cavity is filled with resin from the pot. The resin mold according to claim 1, 2, or 3,
A second movable block that receives a resin pressure acting on the cavity region defined by the molded product clamped at the time of resin molding and the cavity recess by contacting the molded product;
A thickness adjusting mechanism that adjusts the position of the second movable block in the mold opening and closing direction and adjusts the thickness of the molded product that is in contact with the second movable block;
A resin mold die provided on the other side of the upper die and the lower die. In the resin mold according to claim 4,
The thickness adjusting mechanism includes a second movable taper block and a second fixed taper block each having a taper surface that slides in contact with each other in the mold opening and closing direction, and adjusting the advance / retreat position of the second movable taper block. The resin mold mold is characterized in that the thickness of the molded product is adjusted by adjusting the position of the second movable block in the mold opening / closing direction via the second fixed taper block. In the resin mold die according to claim 4 or 5,
A clamp block provided with a set portion in which the article to be molded is set and a sliding hole leading to the set portion is provided on the other side of the upper die and the lower die,
The second movable block is guided by a sliding hole of the clamp block, is movable in a mold opening / closing direction, and is formed in a planar shape that matches the planar shape of the cavity recess. .

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