JP4729367B2 - Resin mold - Google Patents

Description

  The present invention relates to a resin mold, and more specifically, a resin mold for resin-molding one side of a substrate on which a semiconductor chip is mounted, and resin-molding a substrate having a recess formed on the back surface of a chip mounting portion The present invention relates to a resin mold.

FIG. 10 shows an example of a substrate in which a semiconductor chip 6 is mounted on a substrate 5 formed in a strip shape as a molded product to be resin-molded using a resin mold. 10A shows a case where a cavity 7 is arranged for each semiconductor chip 6 mounted on the substrate 5 and resin molding is performed. FIG. 10B shows a case where the entire surface of the substrate 5 is resin-molded with a single cavity 7. In this case, FIG. 10C shows an example in which the substrate 5 is divided into two regions, and cavities 7 are respectively arranged and resin molding is performed.
These molded products are obtained by mounting a semiconductor chip 6 on a substrate 5 formed in a flat shape (planar shape). The substrate is similar to these, and the portion on which the semiconductor chip 6 is mounted is stepped from the substrate surface. There is a substrate in which a recess is formed on the back surface of the chip mounting portion.

FIG. 11 shows a resin mold in which such a chip mounting portion 10a swells in a stepped shape, and a molded product in which the semiconductor chip 6 is mounted on the substrate 10 in a form in which the recess 10b is formed on the back surface of the chip mounting portion 10a. This is an example of a mold. This resin mold mold is formed by filling a resin into a cavity 12a formed by clamping a substrate 10 with an upper cavity block 12 supported by a chase block 11 and a lower cavity block 14 supported by a chase block 13. To do. The lower cavity block 14 is provided so as to be movable in the mold opening / closing direction with respect to the chase block 13 via the spring 15, even if the thickness of the substrate 10 varies, to absorb variations in the thickness of the substrate 10. This is because a resin flash is not generated during resin molding by clamping the substrate 10 with a required clamping force.
Japanese Patent Laid-Open No. 11-58436

  By the way, as shown in FIG. 12, in the case of the substrate in which the chip mounting portion 10a is formed so as to protrude in a step shape, and the concave portion A is formed on the back surface (surface opposite to the chip mounting surface) of the chip mounting portion 10a. The resin chip 8 receives the filling pressure of the resin 8 filled in the cavity 12a at the time of resin molding, and is curved and resin-molded so that the chip mounting portion 10a protrudes outward. There is a problem that the semiconductor chip 6 is warped and cracks occur.

Further, if the thickness of the substrate 10 to be molded varies, the height (concave portion A) of the chip mounting portion 10a varies, and this also causes deformation such as the semiconductor chip 6 warping during resin molding. The problem that it becomes easy to occur occurs.
The problem that the chip mounting portion 10a is curved by the resin pressure during resin molding is not limited to the case where the chip mounting portion 10a protrudes from the substrate surface in a stepped shape, and a recess is formed on the back surface of the chip mounting portion 10a. The case can occur as well.
The present invention has been made to solve these problems, and when a molded product in which a semiconductor chip is mounted on a substrate having a recess formed on the back surface of the chip mounting portion is resin-molded, there is a crack in the semiconductor chip. An object of the present invention is to provide a resin mold that can solve the problem of occurrence and accurately mold a semiconductor chip with a resin.

The present invention has the following configuration in order to achieve the above object.
That is, a resin mold mold in which a recess is formed on the back surface of the chip mounting portion, a substrate on which the semiconductor chip is mounted on the chip mounting portion is a molded product, and one side of the substrate on which the semiconductor chip is mounted is resin-molded A cavity recess for resin-molding the semiconductor chip is formed in one of a pair of molds for clamping the substrate, and the other mold is formed in alignment with the recess, and is formed during resin molding. A step receiving mechanism is provided that includes a contact piece that comes into contact with the bottom surface of the recess and a biasing mechanism that biases the contact piece toward the bottom surface of the recess. The cavity recess provided in the mold may be either an upper mold or a lower mold, and the step receiving mechanism is provided in either the upper mold or the lower mold.

In addition, a piece storage hole and a spring storage hole having a diameter larger than that of the piece storage hole are communicated and recessed on the clamp surface side of the other mold, and the contact piece is attached to the piece storage hole. As the biasing mechanism, the spring housing hole is provided with a pressing plate with which the end face of the contact piece abuts and a spring that urges and presses the pressing plate toward the contact piece. Features. According to this configuration, when the pressing plate abuts on the step surface of the spring housing hole, the protruding position of the abutting piece supported by the pressing plate can be accurately defined, and the abutting piece is elastically supported. Therefore, it is possible to suitably cope with variations in the height of the chip mounting portion formed on the substrate.
Further, a spacer for adjusting the protruding height of the contact piece is interposed between the contact piece and the pressing plate, and a spacer for adjusting the thickness of the pressing plate is provided on the pressing plate. Accordingly, the protruding height of the contact piece and the output (elasticity) of the contact piece can be adjusted more accurately.
In addition, an air suction hole for air-adsorbing the release film on the mold clamping surface and an air suction hole for air-adsorbing the release film on the inner surface of the cavity recess are connected to the one mold. It is possible to be provided.

In addition, by providing an elastic support mechanism that movably supports the other mold in the mold opening / closing direction and elastically clamps the molded article, the resin absorbs variations in the thickness of the substrate. Can be molded.
Also, a resin mold mold in which a concave portion is formed on the back surface of the chip mounting portion, a substrate on which the semiconductor chip is mounted on the chip mounting portion is a molded product, and one side of the substrate on which the semiconductor chip is mounted is resin-molded A cavity recess for resin-molding the semiconductor chip is formed in one of a pair of molds for clamping the substrate, and the other mold is supported movably in a mold opening and closing direction. A movable block formed in accordance with a planar region, a clamp block which is movably supported in the mold opening and closing direction and supported by being biased toward the one mold, and is formed in accordance with a clamping region of the substrate, A moving mechanism for moving the movable block in the mold opening / closing direction is provided, formed on the movable block so as to be aligned with the chip mounting portion, and at the time of resin molding It abuts the abutment piece on the bottom parts, wherein the step receiving mechanism and a biasing mechanism for biasing the abutment piece in the direction projecting toward the bottom surface of the recess.

  According to the resin mold according to the present invention, when the substrate is resin-molded, the chip mounting portion formed on the substrate is supported by the step receiving mechanism on the bottom surface of the recess formed on the back surface of the substrate and is resin-molded. Accordingly, the chip mounting portion is prevented from being bent or deformed during resin molding, and a suitable resin molding can be performed without damaging the semiconductor chip mounted on the substrate.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
(First embodiment)
5 and 6 show the configuration of the clamping surfaces of the upper mold 20 and the lower mold 30 in one embodiment of the resin mold according to the present invention.
As shown in FIG. 12, the resin mold according to the present invention has a substrate 10 in which a chip mounting portion 10a on which a semiconductor chip is mounted protrudes in a step shape, and a recess A is formed on the back surface of the chip mounting portion 10a. A product on which the semiconductor chip 6 is mounted is defined as a molded product. In the present embodiment, a resin mold is shown in which the substrate 10 is provided with four chip mounting portions 10a, and the substrate 10 on which the semiconductor chip 6 is mounted on the chip mounting portion 10a is resin-molded.

As shown in FIG. 5, the upper cavity block 22a is arranged in such a manner that a mold cull 21 provided in accordance with the planar arrangement of the pot provided in the lower mold 30 is sandwiched from both sides in the upper mold 20 of the resin mold. , 22b are supported by the chase block 11 and provided.
In the upper cavity blocks 22a and 22b, four cavity recesses 24 are formed in accordance with the mounting positions of the semiconductor chips 6 mounted on the substrate 10, respectively. The cavity recess 24 and the mold cull 21 are communicated with each other by a runner path 21a.

  In the resin mold according to this embodiment, the molded product is resin-molded by a resin molding method using a release film. Therefore, the air suction holes 26 of the release film are opened on the clamp surfaces of the upper cavity blocks 22 a and 22 b, and the air suction holes 27 are opened on the inner bottom surface of the cavity recess 24. The air suction holes 26 are provided so as to surround the cavity recess 24, and the air suction holes 27 are provided so as to open in a slit shape. The air suction hole 26 and the air suction hole 27 are connected to the air suction mechanism 60 through an air flow path provided in the upper mold 20.

  As shown in FIG. 6, lower cavity blocks 33 a and 33 b for setting a product to be molded are disposed in the lower mold 30 of the resin mold mold so as to sandwich the pot 31 provided in the center block 32. The lower cavity blocks 33a and 33b are guided movably in the mold opening / closing direction by the chase block 13 and the center block 32, and are supported by the spring 15 so as to be movable in the mold opening / closing direction as shown in FIG. In FIG. 6, the planar arrangement position of the spring 15 is indicated by a broken line. The spring 15 is disposed along the peripheral edge of the lower cavity blocks 33a and 33b.

When the molded product is set on the lower mold 30, the lower cavity blocks 33 a and 33 b are supported by adsorbing the molded product on the lower cavity blocks 33 a and 33 b while the molded product is aligned. Suction holes 34 are provided. The suction hole 34 is connected to an air suction mechanism arranged outside the mold.
A characteristic configuration of the resin mold of this embodiment is that the lower cavity blocks 33a and 33b mounted on the lower mold 30 are aligned with the recesses 10b formed on the back surface of the chip mounting portion 10a of the substrate 10. The step receiving mechanism 40 is provided. In the present embodiment, four step receiving mechanisms 40 are arranged in accordance with the arrangement of the recesses 10 b provided in the substrate 10.

FIG. 1 shows a configuration of a step receiving mechanism 40 provided in the lower mold 30. FIG. 1A is a cross-sectional view of the state in which the substrate 10 is clamped by the upper mold 20 and the lower mold 30, and FIG. 1B shows an enlarged view of the step receiving mechanism 40.
The step receiving mechanism 40 includes an abutment piece 42 formed on a block body having a size such that an upper end surface thereof abuts against a bottom surface of a recess 10b formed on the back surface of the chip mounting portion 10a, and the abutment piece 42 with a lower cavity block 33a. And an urging mechanism 45 that urges and supports the projection in a direction protruding from the clamp surface.

  As shown in FIG. 1 (b), in the present embodiment, a top storage hole 331 and a spring storage hole 332 communicating with the top storage hole 331 are provided so as to be recessed from the clamp surface side of the lower cavity block 33a. The abutment piece 42 is slidably provided in the piece accommodation hole 331, and the pressing plate 43 and the spring 44 are provided in the spring accommodation hole 332 so as to contact the end surface (lower surface) of the abutment piece 42. ing. The spring storage hole 332 is formed to have a larger diameter (wider) than the frame storage hole 331, and the movement position of the press plate 43 is restricted by the pressing plate 43 coming into contact with the step of the spring storage hole 332.

The height at which the contact piece 42 protrudes from the upper surface of the lower cavity block 33 a when the mold is opened is defined by the pressing plate 43 contacting the step of the spring accommodating hole 332 and the contact piece 42 contacting the pressing plate 43. Is done. The protruding height of the contact piece 42 is equal to the step height (the height of the recess A) of the chip mounting portion 10a formed on the substrate 10, or the protruding height of the contact piece 42 is slightly increased. Set to The protruding height of the contact piece 42 can be adjusted by mounting a spacer 42 a between the contact piece 42 and the pressing plate 43.
Further, by attaching a spacer 43 a between the pressing plate 43 and the spring 44, the urging force (output) by the spring 44 can be adjusted.
Although one lower cavity block 33a has been described as an example in FIG. 1, the configuration of the other lower cavity block 33b is the same.

  FIG. 1C shows another example of the substrate 10. In the substrate 10, the chip mounting portion 10 a is formed on the same height as the upper surface of the substrate 10, and a recess 10 b is formed on the back surface of the substrate 10. Also in this case, the step receiving mechanism 40 is arranged in accordance with the arrangement of the recesses 10b and resin molding is performed. As described above, as the substrate 10, the chip mounting portion 10 a is flat as shown in FIG. 1C in addition to the chip mounting portion 10 a that protrudes from the substrate surface as shown in FIG. 1B. In some cases, the chip mounting portion 10a is formed in a slightly concave shape.

2 to 4 show a process of resin-molding a molded product in which the semiconductor chip 6 is mounted on the substrate 10 using the resin mold of this embodiment.
FIG. 2 shows a state in which the release film 50 is air adsorbed on the upper mold 20 and the substrate 10 is set on the lower mold 30 with the mold opened. After the release film 50 is loaded into the resin mold and the clamp surface is covered with the release film 50, the release film 50 is sucked from the air suction hole 26 by the air suction mechanism 60 to air the release film 50 onto the clamp surface. Then, the release film 50 is air-sucked so as to follow the inner surface of the cavity recess 24 by sucking air from the air suction hole 27. The release film 50 is a film having flexibility that allows air to be easily adsorbed on the inner surface of the cavity recess 24 by air adsorption, heat resistance that can withstand the heating temperature of the resin mold, and releasability from the resin. .

  The substrate 10 is positioned by adsorbing air to the lower cavity blocks 33 a and 33 b through the suction holes 34 provided in the lower mold 30. The substrate 10 is placed in the lower mold in a state where the contact piece 42 of the step receiving mechanism 40 provided in the lower cavity blocks 33a and 33b is in contact with the bottom surface of the recess 10b on the back surface of the chip mounting portion 10a (the lower surface of the chip mounting portion 10a). Set to 30.

  FIG. 3 shows a state in which the substrate 10 is clamped by the upper mold 20 and the lower mold 30, that is, the release film 50 air-adsorbed on the upper cavity blocks 22a and 22b, and the substrate 10 set on the lower cavity blocks 33a and 33b. The state which contact | abutted is shown. The upper cavity blocks 22 a and 22 b abut against the substrate 10 to form cavities 24 a for each mounting position of the semiconductor chip 6.

  FIG. 4 shows a state where the upper mold 20 or the lower mold 30 is moved to the mold clamping position, and the resin 8 is filled from the pot 31 into the cavity 24a. When the resin 8 is filled in the cavity 24a, the resin pressure also acts on the chip mounting portion 10a on which the semiconductor chip 6 is mounted. However, in the case of the resin mold of this embodiment, the lower cavity of the lower mold 30 The step receiving mechanism 40 attached to the blocks 33a and 33b supports the concave portion 10b from the bottom surface side, and receives the resin pressure acting on the chip mounting portion 10a, so that the chip mounting portion 10a is bent or deformed by the resin pressure. Can be prevented. As a result, it is possible to solve the problem that the semiconductor chip 6 mounted on the chip mounting portion 10a is cracked.

Since the step receiving mechanism 40 is configured to receive the contact piece 42 in a movable state by the urging mechanism 45, even if the height (depth) of the recess 10b varies slightly, the step receiving mechanism 40 absorbs the variation, The chip mounting portion 10a can be accurately held and resin molded.
Further, by adjusting the thickness of the spacer 42a attached to the lower surface of the contact piece 42, or by finely adjusting the thickness of the spacer 43a attached between the pressing plate 43 and the spring 44, the chip mounting portion 10a is It is possible to more surely prevent bending or deformation. This enables a highly reliable and stable resin mold.

  When the substrate 5 on which a large number of semiconductor chips 6 are mounted on the substrate 5 as shown in FIGS. 10B and 10C is a product to be molded, all mounting positions of the respective semiconductor chips 6 are used. The resin mold is performed using a resin mold having the step receiving mechanism 40 disposed thereon. The end face shape, height, etc. of the contact piece 42 provided in the step receiving mechanism 40 are appropriately designed according to the height (depth), planar shape, etc. of the recess 10b formed on the back surface of the chip mounting portion 10a.

  In the resin mold of this embodiment, the lower cavity blocks 33a and 33b are supported by the spring 15 and the lower cavity blocks 33a and 33b are movable in the mold opening / closing direction. As a result, even when there is a variation in the thickness of the substrate 10, the variation in the thickness of the substrate 10 can be absorbed, and the resin can be generated without generating a resin flash by clamping the substrate 10 with a required clamping force. Can be molded.

(Second Embodiment)
However, even when the lower cavity blocks 33a and 33b are elastically supported by the spring 15, as shown in FIG. 11, the resin pressure when the cavity is filled with the resin acts to expand the cavity (dashed arrows). Therefore, there is another problem of weakening the clamping force of the molded product and causing resin flash during resin molding. On the other hand, increasing the clamp force to prevent resin flash will damage the substrate. Problems arise.

  As a method for solving this problem, as shown in FIG. 7, the movable block 70 formed by matching the lower cavity blocks 33 a and 33 b with the planar shape (region) of the resin mold region of the substrate 10 and the substrate 10 are clamped. The clamp block 72 is formed in accordance with the part (region), and the substrate 10 is elastically clamped by the clamp block 72, and a moving mechanism for moving the movable block 70 in the mold opening / closing direction is provided to move the resin pressure. A method of resin molding as received by the block 70 is effective.

In this embodiment, four resin mold regions are set on the substrate 10. Therefore, four movable blocks 70 are attached to the clamp block 72. Since the chip mounting portion 10a is formed on the substrate 10, in order to support the chip mounting portion 10a during resin molding, the step receiving mechanism 40 similar to that in the first embodiment is mounted on each movable block 70. .
The clamp block 72 is provided with a suction hole 34 for adsorbing the substrate 10 by air. Instead of the suction hole 34, a gap 34a may be provided between the side surface of the movable block 70 and the inner side surface of the mounting hole of the movable block 70 provided in the clamp block 72 to support the substrate 10 by suction to the lower mold side. .

  FIG. 8 shows a state in which the upper mold 20 and the lower mold 30 are opened, the release film 50 is air adsorbed on the clamp surface of the upper mold 20, and the substrate 10 that is a product to be molded is set on the lower mold 30. The step receiving mechanism 40 including the contact piece 42 and the urging mechanism 45 described in the first embodiment is attached to the movable block 70 guided by the clamp block 72. The upper end surface of the contact piece 42 of the step receiving mechanism 40 protrudes from the clamp surface of the movable block 70.

As a moving mechanism for moving the movable block 70 in the mold opening / closing direction, in this embodiment, a fixed taper block 74 is fixed to the lower surface of the movable block 70, and the fixed taper block 74 and a fixed block 75 fixed to the bottom of the chase block 13 Between them, the movable taper block 76 is inserted, and a drive unit 78 is provided for moving the movable taper block 76 back and forth in the longitudinal direction.
The fixed taper block 74 and the movable taper block 76 are arranged so that the taper surfaces are in sliding contact with each other in a through hole provided by penetrating the chase block 13 in the longitudinal direction. When the movable taper block 76 enters the mold, the fixed taper block 74 and the movable taper block 76 move in a direction in which the movable block 70 approaches the upper mold 20, and when the movable taper block 76 is moved out of the mold. The tapered surface is set so that the movable block 70 moves in a direction away from the upper mold 20.

The fixed taper block 74 and the movable taper block 76 are provided as a configuration that moves the four movable blocks 70 in the mold opening / closing direction as a whole, and can reliably hold the resin pressure or the clamp pressure at the moving position. Can be configured differently from the configuration of the illustrated example, such as by changing the arrangement of the fixed taper block 74 and the movable taper block 76.
A spring 15 is mounted between the lower surface of the clamp block 72 and the bottom of the chase block 13 so that the clamp block 72 can elastically clamp the substrate 10.
As the drive unit 78 for moving the movable taper block 76 back and forth in the longitudinal direction, a mechanism in which a ball screw is screwed to the movable taper block 76 and the ball screw is rotationally driven by a servo motor can be used. Of course, other drive mechanisms such as a hydraulic mechanism can be used.

  As shown in FIG. 7, the lower mold 30 is provided with a pair of clamp blocks 72 arranged so as to sandwich the pot 31, and a movable block 70 is attached to each clamp block 72. One fixed taper block 74 and one movable taper block 76 as moving mechanisms for moving the movable block 70 in the mold opening / closing direction are arranged on both sides of the pot 31, and a drive unit 78 is linked to each movable taper block 76. .

Next, a method for resin-molding the substrate 10 on which the semiconductor chip 6 is mounted on the chip mounting portion 10a using the resin mold of this embodiment will be described.
First, as shown in FIG. 8, the substrate 10 is set on the lower mold 30 in a state where the resin mold is opened, and the resin mold surface of the upper mold 20 is covered with the release film 50.
When the mold is opened, the clamp block 72 is supported at the upper position by the elastic force of the spring 15, the upper end surface of the clamp block 72 is slightly above the upper end surface of the movable block 70, and the substrate 10 is moved to the clamp block 72. In this state, the lower surface of the substrate 10 is separated from the upper end surface of the movable block 70.
The release film 50 is air-adsorbed by the air suction mechanism 60 to the clamp surface of the upper mold 20 through the air suction hole 26 and the air suction hole 27.

  The upper mold 20 or the lower mold 30 is moved from the state shown in FIG. 8, and the substrate 10 is clamped by the upper mold 20 and the lower mold 30. Next, the driving unit 78 is driven to move the movable taper block 76 into the mold, the movable block 70 is moved to the upper position, and the lower surface of the substrate 10 is supported by the upper end surface of the movable block 70. At this time, the chip mounting portion 10a formed on the substrate 10 is supported from the bottom side of the recess 10b by the step receiving mechanism 40 attached to the movable block 70. In this state, the upper mold 20 or the lower mold 30 is further moved to the mold clamping position, and the resin 8 is filled into the cavity 24a.

FIG. 9 shows a state where the cavity 24a is filled with the resin 8. The substrate 10 and the chip mounting portion 10a are supported by the movable block 70 and the step receiving mechanism 40, and the clamp area of the substrate 10 is clamped by the clamp block 72 and the upper mold 20 and is resin-molded.
According to the resin mold of the present embodiment, since the substrate 10 is supported by the movable block 70 and the step receiving mechanism 40, the chip mounting portion 10a of the substrate 10 is mounted as in the first embodiment. Resin molding can be performed without deformation, and resin molding can be performed without damaging the semiconductor chip 6 mounted on the chip mounting portion 10a.

  Further, since the clamping region of the substrate 10 is clamped by the clamp block 72 that is movably supported by the spring 15 in the mold opening / closing direction, the variation in the thickness of the substrate 10 can be eliminated and the clamping can be reliably performed. Further, since the cavity 24a is subjected to resin molding by receiving the resin pressure by the movable block 70 separately from the clamp block 72, the resin pressure when the resin 8 is filled in the cavity 24a is clamped to clamp the substrate 10. The resin can be molded without causing a resin flash by accurately clamping the substrate 10 without affecting the force and thereby damaging the substrate 10. The supporting action for supporting the substrate 10 by the movable block 70 can be appropriately adjusted by adjusting the entry position of the movable taper block 76.

In addition, since the resin film is molded using the release film 50 in the present embodiment, there is no advantage that the resin does not adhere to the mold surface and it is not necessary to provide the mold with an ejector pin for release. In addition, when the thickness of the substrate 10 varies partially within one substrate, there is an advantage that these variations can be absorbed and resin molding can be performed.
In the above embodiment, the resin film is molded using the release film 50. However, the resin mold mold provided with the step receiving mechanism 40 for supporting the chip mounting portion 10a formed on the substrate 10 does not use the release film. It can also be applied to a resin molding method of resin molding.

It is explanatory drawing which shows the structure of 1st Embodiment of a resin mold metal mold | die, and the structure of a level | step difference receiving mechanism. It is sectional drawing which shows the state which set the board | substrate to the resin mold metal mold | die of 1st Embodiment. It is sectional drawing which shows the state which clamped the board | substrate with the resin mold metal mold | die of 1st Embodiment. It is sectional drawing which shows the state which carried out the resin molding of the board | substrate with the resin mold metal mold | die of 1st Embodiment. It is a top view which shows the structure of the upper mold | type of the resin mold metal mold | die of 1st Embodiment. It is a top view which shows the structure of the lower mold | type of the resin mold metal mold | die of 1st Embodiment. It is a top view which shows the structure of the lower mold | type of the resin mold metal mold | die of 2nd Embodiment. It is sectional drawing which shows the state which set the board | substrate to the internal structure of the resin mold metal mold | die of 2nd Embodiment, and the resin mold metal mold | die. It is a judgment figure which shows the state which carried out the resin molding of the board | substrate with the resin mold metal mold | die of 2nd Embodiment. It is explanatory drawing which shows the example of mounting of the semiconductor chip to a board | substrate, and the resin mold area | region. It is sectional drawing which shows the structural example of the conventional resin mold metal mold | die. It is explanatory drawing which shows the state which resin-molded the board | substrate with which the chip mounting part was formed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate 10a Chip mounting part 10b Recess 11 Chase block 13 Chase block 15 Spring 20 Upper mold 22a, 22b Upper cavity block 24 Cavity recess 24a Cavity 26 Air suction hole 27 Air suction hole 30 Lower mold 31 Pot 33a, 33b Lower cavity block 40 Step receiving mechanism 42 Contact piece 42a, 43a Spacer 43 Pressing plate 45 Biasing mechanism 50 Release film 60 Air suction mechanism 70 Movable block 72 Clamp block 74 Fixed taper block 75 Fixed block 76 Movable taper block 78 Drive unit

Claims (6)

A resin mold mold in which a concave portion is formed on the back surface of the chip mounting portion, a substrate on which the semiconductor chip is mounted on the chip mounting portion is a molded product, and one side of the substrate on which the semiconductor chip is mounted is resin-molded. And
A cavity recess for resin-molding the semiconductor chip is formed in one of a pair of molds for clamping the substrate,
The other side of the mold is formed in alignment with the recess, and a contact piece that contacts the bottom surface of the recess during resin molding, and the contact piece is urged in a direction to protrude toward the bottom surface of the recess. A resin mold having a step receiving mechanism including an urging mechanism. On the clamp surface side of the other mold, a top storage hole and a spring storage hole larger in diameter than the top storage hole are communicated and recessed, and the contact top is attached to the top storage hole.
As the biasing mechanism, a pressing plate with which the end face of the contact piece abuts and a spring that urges and presses the pressing plate toward the contact piece are attached to the spring accommodation hole. The resin mold according to claim 1. A spacer for adjusting the protruding height of the contact piece is interposed between the contact piece and the pressing plate,
The resin mold according to claim 2, wherein a spacer for adjusting the thickness of the pressing plate is provided on the pressing plate.   An air suction hole for air-adsorbing the release film to the mold clamping surface and an air suction hole for air-adsorbing the release film to the inner surface of the cavity recess can be connected to the one mold. The resin mold according to any one of claims 1 to 3, wherein the resin mold is provided.   The elastic support mechanism which clamps the said to-be-molded product elastically while supporting the said other metal mold | die movably in a mold opening / closing direction is provided. Resin mold. A resin mold mold in which a concave portion is formed on the back surface of the chip mounting portion, a substrate on which the semiconductor chip is mounted on the chip mounting portion is a molded product, and one side of the substrate on which the semiconductor chip is mounted is resin-molded. And
A cavity recess for resin-molding the semiconductor chip is formed in one of a pair of molds for clamping the substrate,
A movable block that is movably supported in the mold opening / closing direction on the other side of the mold and is formed in accordance with a planar area of the cavity recess, and is movable in the mold opening / closing direction and biased toward the one mold. A clamp block formed in accordance with the clamp region of the substrate and a moving mechanism for moving the movable block in the mold opening and closing direction,
The movable block is formed so as to be aligned with the chip mounting portion, and abutment piece that abuts against the bottom surface of the recess during resin molding, and the corresponding contact piece is biased in a direction protruding toward the bottom surface of the recess. A resin mold having a step receiving mechanism including an urging mechanism.

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