JP6693798B2 - Resin molding apparatus and resin molding method - Google Patents

Description

  The present invention relates to a resin molding apparatus and a resin molding method for clamping a third mold together with a work between a first mold and a second mold to mold a resin.

  A technique having a vertical gate structure in which a gate is provided in a direction perpendicular to a cavity formed on a mold clamping surface is disclosed in Japanese Patent Laid-Open No. 4-269854 (Patent Document 1) and Japanese Patent Laid-Open No. 6-177191. It is described in Japanese Patent Laid-Open Publication No. H08-25424 (Patent Document 3), Japanese Patent Laid-Open No. 2003-11187 (Patent Document 4) and Japanese Patent Laid-Open No. 2007-130976 (Patent Document 5).

JP-A-4-269854 JP-A-6-177191 JP-A-8-25424 JP, 2003-11187, A JP 2007-130976 A

In a general molding die for transfer molding, a runner serving as a resin path is provided on the end face side on a substrate (a lead frame on which a semiconductor chip is mounted, a resin substrate, etc.) set in the mold. In such a molding die, since the runner serving as a resin path is formed so as to extend over the die and the substrate, the resin may leak from a gap between the die and the substrate.
Further, in the case of compression molding rubbing, a runner is not necessary, but it is difficult to transmit the resin pressure into the cavity, so that the resin is overflowed and molded. However, such an overflow tends to leave a resin residue on the outer periphery of the work after molding, which makes it difficult to handle in the subsequent process.

  In particular, a resin having a low molecular weight and a low viscosity in recent years or a transparent resin (low-viscosity resin for molding a lens) for a light emitting / receiving device such as an LED (Light Emitting Diode) is likely to cause resin leakage. Further, when the runner is installed on the substrate, it is necessary to secure a space for it. Furthermore, the resin remaining as the runner gate after molding needs to be removed separately from the unnecessary molded product (scrap resin) that has no added value as a molded product. On the other hand, in the intermediate type having the vertical gate structure, the runner gate does not run on the substrate, there is no problem that the molded product gate remains on the substrate, and the resin is directly filled on the semiconductor chip, so the bonding wire Since the resin spreads in the wire wiring direction, wire flow hardly occurs. Therefore, it is considered effective to use an intermediate mold having a vertical gate structure for transfer molding. Further, in compression molding, it is considered that the molded product and the mold can be easily separated by using the intermediate mold as a resin path for overflowing.

  An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide a novel resin molding apparatus having a molding die using an intermediate die and a novel resin molding method using the same.

The present invention has the following configuration in order to achieve the above object.
A first mold and a second mold that can be opened and closed, and a resin mold that is arranged between the first mold and the second mold and clamps a work between the first mold and the second mold. And a third mold formed with a cavity recess and a gate penetrating therewith in the mold opening / closing direction, and a first mold chuck provided on the first mold and detachably holding the third mold. a mechanism, provided in the second mold, a second mold chuck mechanism for holding the third mold detachably, the previous SL resin loaded in resin loading unit provided on the second mold A transfer mechanism that moves up and down together with a first actuator that switches the holding operation of the first mold chuck mechanism and a second actuator that switches the holding operation of the first mold chuck mechanism by filling the cavity recess through the gate; Equipped with, Serial 3 while placing the workpiece in a mold, said first mold and said second mold by performing a plurality of mold opening and closing operation, each row resin mold operation and the resin supply operation by said transfer mechanism The holding state of the third die by the first die chuck mechanism is released by raising the first actuator in accordance with the raising operation of the transfer mechanism, and the second die by raising the second actuator. The third die is held by the chuck mechanism, and the third die is held by the first die chuck mechanism by lowering the first actuator in accordance with the lowering operation of the transfer mechanism. 2 by releasing the held state of the third mold of the second mold chuck mechanism by lowering the actuator, the between the first mold and the second mold first And switches the holding state of the mold.

According to the above configuration, since the third mold is held in either the second mold or the first mold by repeating the operation of opening and closing the mold, the first and the first molds can be added to the existing transfer mold device. The resin mold using the third mold can be realized at a low cost and with a simple structure only by providing the two mold chuck mechanism. Therefore, transfer molding can be performed by holding the third mold in either the first mold or the second mold without requiring a special drive source.
Thus, the holding operation of the first mold chuck mechanism and the second mold chuck mechanism can be performed by raising and lowering the first actuator and the second actuator according to the raising and lowering operation of the transfer mechanism without providing a special drive source. The holding state of the third mold can be switched by switching each of the above.

With the work placed on the third mold supported by the second mold, the first mold chuck mechanism causes the third mold to move the third mold to the first mold by the raising operation of the second mold. Preferably, the work is clamped by the first mold and the third mold, and the resin loading part is opened by the lowering operation of the second mold .
Accordingly, the work can be supplied to the third mold and the resin can be supplied to the resin loading portion of the second mold by the first mold closing operation.

The plunger is lifted to perform resin molding, the first actuator is lifted to release the holding state of the third mold by the first mold chuck mechanism, and the second actuator is lifted to the second mold chuck. It is preferable that a mechanism is operated to hold the third mold by the second mold, and the third mold is transferred from the first mold to the second mold.
This makes it possible to fill the cavity recess with molten resin by the second mold opening / closing operation, perform resin molding, and transfer the third mold from the first mold to the second mold. Therefore, simply by opening the mold, the molded work can be taken out separately from the first mold while being placed on the third mold.

Wherein the second mold before Symbol third plurality of first ejector pin molds through projecting respectively toward the molded article to release is provided, wherein the first mold, the third A plurality of second ejector pins are provided, which penetrate the mold and project into the molded product in the cavity concave portion and the molded product remaining in the resin path connected to the resin loading portion of the second mold so as to be released from the mold. Preferably.

As a result, when the mold is opened after resin molding, the first ejector pin projects and the work is released from the first mold, and when the mold opening is completed, the second ejector pin penetrates the third mold. The molded product in the cavity recess can be released from the third mold and taken out.
Also, when the mold is opened and closed again, the first ejector pin penetrates the third mold and unnecessarily molds remaining in the resin path are released from the third mold, and the second ejector pin becomes the resin. By projecting into the path, unnecessary molded products can be released from the second mold.
Therefore, it is possible to efficiently perform the separation of the molded product from the third mold and the unnecessary removal of the molded product separated from the molded product simply by performing the mold opening / closing operation after the resin molding, which is a special feature for degate. There is no need to provide a unique device configuration or device area.

Further, in the resin molding method, a cavity concave portion which is disposed between a first mold and a second mold which are provided so as to be openable and closable, and which clamps a work between the first mold and the resin mold to mold the work. A step of preparing a third die having a gate penetrating therethrough in the die opening / closing direction, and the cavity recess of the third die while the third die is supported by the second die And the step of supplying the work, and the first mold and the second mold are closed for the first time so that the first mold chuck mechanism holds the third mold. and clamping the workpiece between the first mold, a step of loading the opened resin loading unit in the resin of the second mold and the mold is opened, the performing a second mold closing third Transfer machine with the mold being clamped to the first mold and the second mold. The plunger is raised by the increase of the first actuator to match the rising operation of the plunger as well as a resin molded by filling into the cavities of the loaded molten resin through the gate of the third mold to the resin loading portion The third mold is held by the second mold chuck mechanism by releasing the holding state of the third mold by the first mold chuck mechanism and raising the second actuator in accordance with the lifting operation of the plunger. A step of delivering the third mold from the first mold to the second mold; and a step of transferring the third mold on which the work is placed from the first mold while holding the third mold on the second mold. It is characterized by including a step of opening the mold and a step of releasing the molded work from the third mold by taking it out.

  According to the above resin molding method, the third mold is held in the second mold or the first mold by performing the mold opening / closing operation twice to supply the work and the resin, the resin molding operation, and the work after the molding. Since it is possible to take out the resin, it is possible to perform high-quality resin molding without using a waste resin, and without providing a resin path on the work, and to use the third mold as the second mold or the second mold. The operation of holding one die can be realized with a simple configuration using an existing transfer mold die without providing a special drive source. Further, the work after molding can be separated from the unnecessary molded product and taken out only by the mold opening / closing operation, and the equipment and space for mold release can be omitted.

The first die and the second die are closed for the third time to release the holding state of the third die by the second die chuck mechanism and operate the first die chuck mechanism. And holding the third mold in the first mold by separating the first mold and the second mold from each other to separate unnecessary molded products from the third mold to separate the third mold from the first mold. The method may further include a step of opening the mold while it is still attached to the second mold, and a step of releasing and removing the unnecessary molded product attached to the second mold.
As a result, by further performing the mold opening / closing operation after the resin molding, the unnecessary molded product is released from the third mold, and the mold is opened together with the second mold. Unnecessary molded products can be released. Therefore, the molded product can be separated from the third mold and the second mold only by the mold opening / closing operation.

  By using the resin molding apparatus and method described above, there is no problem that the molded product gate remains on the work, the molding quality is improved without the use of wasted resin, and the molded work or molded product can be easily removed from the mold. The separation can be easily performed. Further, it is possible to reduce the cost of the apparatus and improve the versatility of the apparatus simply by providing the chuck mechanism of the third mold in the existing molding apparatus.

It is a section explanatory view of a resin mold device of a mold opening state explaining resin molding operation. FIG. 3 is a cross-sectional explanatory view of the resin molding device showing the work supply operation following FIG. 1. FIG. 3 is a cross-sectional explanatory view of a resin molding device showing a third mold chuck operation for the first mold following FIG. 2. FIG. 4 is a cross-sectional explanatory view of the resin molding device showing the resin supply operation to the second mold following FIG. 3. FIG. 5 is a cross-sectional explanatory diagram of a resin molding device showing a resin molding operation following FIG. 4. FIG. 6 is a cross-sectional explanatory view of a resin molding device showing a third mold chuck operation for the second mold following FIG. 5. FIG. 7 is a cross-sectional explanatory view of the resin molding device showing the work separating operation from the first mold to the third mold following FIG. 6. FIG. 8 is a cross-sectional explanatory view of the resin molding device showing the operation of separating the molded product from the third mold following FIG. 7. FIG. 9 is a cross-sectional explanatory view of a resin molding device showing a third mold chuck operation for the first mold following FIG. 8. FIG. 10 is a cross-sectional explanatory view of a resin molding device showing an operation of separating an unnecessary molded product from the third mold following FIG. 9. FIG. 11 is a cross-sectional explanatory view of a resin molding device showing an operation of separating an unnecessary molded product from the second mold following FIG. 10. It is a section explanatory view showing resin mold operation of a compression molding device concerning other examples. FIG. 13 is a cross-sectional explanatory view showing a resin molding operation of the compression molding device following FIG. 12. It is sectional explanatory drawing which shows the resin molding operation of the compression molding apparatus following FIG. FIG. 15 is a cross-sectional explanatory view showing a resin molding operation of the compression molding device following FIG. 14. FIG. 16 is a cross-sectional explanatory view showing a resin molding operation of the compression molding device following FIG. 15.

  Hereinafter, preferred embodiments of a resin molding apparatus and a resin molding method according to the present invention will be described in detail with reference to the accompanying drawings of FIGS. 1 to 11. In the following, as the work W, for example, one in which the semiconductor chip 2 is mounted on one side (wire bonding mounting, flip chip mounting) on the substrate (lead frame) 1 is used (see FIG. 2).

  Further, the resin molding device is provided with a known mold opening / closing device for transmitting drive from a drive source using a toggle link or the like. Furthermore, in the following description, as an example, the upper mold (first mold) 3 is a fixed mold, the lower mold (second mold) 4 is a movable mold, and the upper mold 3 is an upper mold platen 5 (fixed platen). It is assumed that the lower die 4 is supported and is supported by the lower die platen 6 (movable platen). Thus, as shown in FIGS. 1 to 11, the resin molding apparatus opens and closes the upper mold 3 and the lower mold 4 while holding the intermediate mold 12 (third mold) in the upper mold 3 or the lower mold 4. It is configured to be possible. It should be noted that the upper mold 3 and the lower mold 4 are provided with a heater (not shown), and the intermediate mold 12 is heated and molded together with a work W and a resin 18 described later. The rectangular upper mold platen 5 is fixed to the upper ends of the guide posts 7 provided at the four corners, and the rectangular lower mold platen 6 is slidably connected to the guide posts 7 at the four corners.

  The upper mold 3 is supported by the upper mold platen 5. An upper die chuck mechanism 8 is provided on the upper die 3. Further, the upper mold 3 is provided with a first ejector pin 3a for separating the substrate and a second ejector pin 3b for separating the unnecessary molded product from the mold. The length of the second ejector pin 3b is longer than that of the first ejector pin 3a. The first ejector pin 3a and the second ejector pin 3b are always biased in a protruding direction by a coil spring or the like (not shown).

Here, an example of the upper die chuck mechanism 8 (first die chuck mechanism) will be described.
The upper die chuck arm 8a is provided so as to hang downward from the upper die surface. The upper die chuck arm 8a is provided on the upper die 3 such that one end portion (upper end portion) thereof is rotatable around a fulcrum 8b. The other end (lower end) of the upper die chuck arm 8a is provided with an upper die chuck claw 8c having a tip tapered shape (wedge shape) in which the lower surface side inclines toward the tip side and becomes narrow. In the vicinity of the fulcrum 8b of the upper die chuck arm 8a, an upper die actuating arm 8d intersecting (orthogonal to) the upper die chuck arm 8a is integrally formed. A coil spring 8e is resiliently provided on the upper side of the upper die actuating arm 8d and provided in the upper die 3, and the upper die actuating arm 8d is always biased counterclockwise about the fulcrum 8b in the illustrated portion. Has been done. A push pin 8f is provided on the lower side of the upper die actuating arm 8d so as to be prevented from falling off in the vertical direction, and the upper end is pushed by the upper die actuating arm 8d so that the lower end projects downward from the upper die 3. It is set up. An upper die claw holding portion 8g having an L-shaped cross section is provided in the vicinity of the upper die chuck arm 8a. The upper die claw holding portion 8g holds the upper die chuck claw 8c at a predetermined height when the upper die 3 and the lower die 4 are opened. The arm portion formed by bending the upper die claw holding portion 8g in the horizontal direction is provided with a through hole 8h into which a first actuator described later can be inserted. The position of the through hole 8h is provided immediately below the push pin 8f. Further, the lower surface of the upper die 3 is provided with an upper die escape recess 3c into which a lower die claw holding portion 9f described later enters.

  As described above, the upper die chuck mechanism 8 includes the plurality of sets of the above-described upper die chuck arm 8a, the upper die chuck claw 8c, and the like at a position along the edge of the intermediate die 12 to move the intermediate die 12 to the upper die. Can be held at 3. That is, the upper die chuck claw 8c held by the upper die claw holding portion 8g is moved back and forth through the upper die chuck arm 8a and the like to hold the intermediate die 12 in the upper die 3 and the intermediate die 12 in the lower die 4. It is possible to switch between a state in which the mold 12 can be delivered.

  The lower die 4 is supported separately from the lower die platen 6. The lower die 4 is provided with a plurality of lower die chuck mechanisms 9. Further, the lower mold 4 is provided with a first ejector pin 4a for releasing a molded product 19 molded in a cavity recess 12a, which will be described later, and a second ejector pin 4b for releasing an unnecessary molded product 20, which can be projected. There is. The length of the first ejector pin 4a is longer than the length of the second ejector pin 4b, and is erected on an ejector pin plate (not shown). A lower die cull 4c and a lower die runner 4d are engraved on the clamp surface of the lower die 4. A lower mold pot 10 is provided at the center of the lower mold cull 4c, and a lower mold plunger 11 is inserted so as to be able to move up and down (resin loading part).

Here, an example of the lower die chuck mechanism 9 (second die chuck mechanism) will be described.
A lower die chuck arm 9a is provided on the lower die 4 so as to project upward from the lower die surface. One end (upper end) of the lower die chuck arm 9a is provided with a lower die chuck claw 9c having a tapered tip (wedge shape) in which the upper surface side is inclined toward the tip side and becomes narrow. The other end (lower end) of the lower die chuck arm 9a is rotatably provided around a fulcrum 9b. In the vicinity of the fulcrum 9b of the lower die chuck arm 9a, a lower die actuating arm 9d intersecting (orthogonal to) the lower die chuck arm 9a is integrally formed. A coil spring 9e is resiliently provided on the lower side of the lower mold actuating arm 9d and provided in the lower mold 4. The lower mold actuating arm 9d is always biased in a clockwise direction about a fulcrum 9b in the illustrated portion. Has been done. A lower die claw holding portion 9f having an L-shaped cross section is provided on the lower die surface in the vicinity of the lower die chuck arm 9a. The lower die claw holding portion 9f holds the lower die chuck claw 9c at a predetermined height when the upper die 3 and the lower die 4 are opened. In addition, a lower die escape recess 4e into which the upper die claw holding portion 8g enters is provided on the upper surface of the lower die 4. Further, the lower die 4 is provided with a through hole 4f into which a first movable rod 14 described later is inserted. The position of the through hole 4f is formed so as to face the position of the through hole 8h formed in the upper die claw holding portion 8g.

  As described above, the lower die chuck mechanism 9 includes a plurality of sets of the above-described lower die chuck arm 9a, lower die chuck claws 9c, and the like at positions along the edge of the intermediate die 12, thereby lowering the intermediate die 12 to the lower die. Can be held at 4. That is, the lower die chuck claw 9c held by the lower die claw holding portion 9f is moved back and forth through the lower die chuck arm 9a and the like to hold the intermediate die 12 in the lower die 4 and the upper die 3 side. It is possible to switch between a state where the intermediate die 12 can be delivered.

  The intermediate die 12 is disposed between the upper die 3 and the lower die 4 and held by one of the dies. Further, resin molding is performed with the intermediate die 12 and the work W clamped between the upper die 3 and the lower die 4. In the present embodiment, the work W is clamped between the upper die 3 and the intermediate die 12 and is resin-molded. A cavity recess 12a and a vertical gate 12b which is continuous with the cavity recess 12a and which penetrates in the mold opening / closing direction are formed on the upper surface (the surface facing the upper mold) of the intermediate mold 12. Further, the intermediate die 12 is provided with an ejector pin through hole 12c into which the second ejector pin 3b is inserted. The ejector pin through hole 12c is formed at a position overlapping the lower mold cull 4c. Further, a locking portion 12d for locking the upper die chuck claw 8c and the lower die chuck claw 9c is provided on the outer peripheral edge of the intermediate die 12.

  A transfer mechanism 13 is integrally supported by the lower platen 6. The transfer mechanism 13 raises a plunger 11 provided with a single or a plurality of molten resin loaded in the pot 10 to raise a lower mold cull 4c, a lower mold runner 4d, and a vertical gate formed on the intermediate mold 12. The cavity recess 12a is filled through 12b.

  The lower die 4 corresponds to the operation of the transfer mechanism 13 (specifically, the lifting operation of the plunger 11) and switches the holding operation of the upper die chuck mechanism 8 with the first movable rod 14 (first actuator) and the lower die chuck. Second movable rods 15 (second actuators) that switch the holding operation of the mechanism 9 are provided. Specifically, the movable plate 16 is suspended and supported by the coil spring 17 on the opposite side (lower surface side) of the mounting position of the intermediate die 12 in the lower die 4 with a predetermined gap. The first movable rod 14 and the second movable rod 15 are erected on the movable plate 16. As a result, in the lower mold 4, by moving the movable plate 16 up and down, the first movable rod 14 and the second movable rod 15 can be moved up and down in conjunction with each other. The first movable rod 14 penetrates the through hole 4f of the lower mold 4 and is provided so as to project from the lower mold surface. The second movable rod 15 is inserted into the lower die 4, and is abutted against the other end of the lower die actuating arm 9d whose one end is biased clockwise by the coil spring 9e about the fulcrum 9b. The lower die chuck arm 9a is supported at a neutral position so as not to rotate further.

Further, the transfer mechanism 13 is provided with a drive pin 13a projecting around a block for moving the plunger 11 up and down. A driven pin 16a is provided on the lower surface of the movable plate 16 so as to face the drive pin 13a. When the lower platen 6 is raised, the drive pin 13a is pushed up while being in contact with the driven pin 16a, so that the movable plate 16 is pushed up and the first movable rod 14 and the second movable rod 15 are raised. (See Figure 6). That is, the first movable rod 14 and the second movable rod 15 can be moved up and down in conjunction with the lifting and lowering operation of the plunger 11.
As a result, without providing a special drive source, the first movable rod 14 and the second movable rod 15 are operated in accordance with the raising / lowering operation of the transfer mechanism 13 that is raised / lowered in accordance with the mold opening / closing operation, and the upper die chuck mechanism is operated. The holding operation of the intermediate die 12 can be switched by switching the holding operations of the lower die chuck mechanism 9 and the lower die chuck mechanism 9.

Here, an example of the resin molding operation will be described with reference to FIGS. 1 to 11.
In the resin molding apparatus shown in the present embodiment, in the initial state shown in FIG. 1, the intermediate die 12 is placed on the lower die 4 when the upper die 3 and the lower die 4 are opened. Here, the upper die chuck mechanism 8 (upper die chuck claw 8c) is in a chuck position where it can be engaged with the engaging portion 12d of the intermediate die 12. Further, since the lower die chuck mechanism 9 (lower die chuck claw 9c) is in a state in which the transfer mechanism 13 is not operating (stopped state), it does not move up, and the lower die chuck claw 9c locks the intermediate die 12. It is in a neutral position where it is not locked to the portion 12d. The first ejector pin 3a of the upper mold 3 is flush with the clamp surface or protrudes from the clamp surface, and the second ejector pin 3b protrudes from the clamp surface.

  Next, in FIG. 2, the work W is set (mounted) on the intermediate die 12 by a work loader (not shown). The workpiece W is aligned and supplied so that the semiconductor chip 2 is housed in the cavity recess 12a. Further, since the pot 10 formed on the lower mold 4 is closed by the intermediate mold 12, the resin cannot be supplied at this stage.

  Next, in FIG. 3, the mold opening / closing mechanism is driven to perform the first mold closing operation. The lower mold platen 6 is raised, and the lower mold 4 and the intermediate mold 12 are raised. At this time, the engaging portion 12d of the intermediate die 12 is raised while pressing the engaging portion 12d of the intermediate die 12 against the inclination of the tip of the upper die chuck pawl 8c, and the engaging portion 12d of the intermediate die 12 is retracted while retracting the upper die chuck pawl 8c. It can be moved to above the upper chuck claw 8c. As a result, the upper die chuck claw 8c is inserted below the locking portion 12d by the urging force of the coil spring 8e, and the upper die chuck claw 8c is locked to the locking portion 12d, so that the intermediate die 12 is moved to the upper die. Will be held at 3.

  Note that the push pin 8f may be pushed through the through hole 8h of the upper die claw holding portion 8g at the tip end side of the first movable rod 14 to resist the biasing force of the coil spring 8e. In this case, the upper die chuck arm 8a temporarily rotates clockwise around the fulcrum 8b, and the upper die chuck claw 8c moves to the retracted position as the intermediate die 12 moves up. In this state, the locking portion 12d of the intermediate die 12 is moved to a position above the upper die chuck claw 8c, and the upper die chuck arm 8a is rotated again in the counterclockwise direction so that the upper die chuck claw 8c moves. It is locked and held by a locking portion 12d provided at the outer peripheral edge of the. As a result, the intermediate mold 12 is transferred from the lower mold 4 to the upper mold 3. Since the lower die chuck claw 9c is in the neutral position, it does not interfere with the intermediate die 12.

  Further, since the upper die claw holding portion 8g enters the lower die escape recess 4e and the lower die claw holder 9f enters the upper die escape recess 3c, there is no interference. The second ejector pin 3b of the upper die 3 is inserted into the ejector pin through hole 12c of the intermediate die 12, and the first ejector pin 3a is pushed back into the upper die 3 together with the clamp of the substrate 1. When the work W (substrate 1) is clamped by the upper die 3 and the intermediate die 12, the die closing operation is completed.

Next, when the mold is opened by the mold opening / closing mechanism, the movable platen 6 descends and the intermediate mold 12 also descends along with the lower mold 4. However, since the upper die chuck claw 8c remains engaged with the engaging portion 12d of the intermediate die 12, the intermediate die 12 remains held by the upper die 3.
As shown in FIG. 4, when the mold opening of the upper mold 3 and the lower mold 4 is completed, only the lower mold 4 is lowered together with the lower mold platen 6. Therefore, the resin 18 (for example, tablet resin or liquid resin) is supplied to the pot 10 using the open space above the lower mold 4.

  Next, the second mold closing operation is performed by the mold opening / closing mechanism. Here, as in FIG. 3, the lower mold platen 6 is raised and the lower mold 4 is raised. Then, the work W (substrate 1) is clamped by the intermediate mold 12 and the lower mold 4 held by the upper mold 3, and the mold closing is completed.

Then, as shown in FIG. 5, the transfer mechanism 13 is operated to raise the plunger 11 in the pot 10 so that the molten resin 18 is passed through the lower mold cavity 4c, the lower mold runner 4d, and the vertical gate 12b to form the cavity recess 12a. To fill.
Next, as shown in FIG. 6, when the mold opening / closing mechanism is driven in the mold closing direction to further raise the lower mold platen 6, the filling of the resin 18 into the cavity recess 12a is completed. In this state, the resin 18 is heated and cured by the upper mold 3 and the intermediate mold 12.

  In this case, as shown in FIG. 6, the upper die chuck claw 8c is disengaged from the engaging portion 12d of the intermediate die 12 and the lower die chuck pawl 9c is engaged with the engaging portion of the intermediate die 12 in conjunction with the rise of the plunger 11. The intermediate die 12 held by the upper die 3 can be transferred to the lower die 4 by being locked to the 12d.

  Specifically, the drive pin 13a is pushed up while being in contact with the driven pin 16a, the coil spring 17 is compressed and the movable plate 16 is pushed up. As a result, the first movable rod 14 pushes the push pin 8f against the biasing force of the coil spring 8e, and the second movable rod 15 rises to resist the biasing force of the coil spring 9e on the lower die operating arm 9d. Rotate counterclockwise around the fulcrum 9b.

  At this time, the upper die chuck arm 8a rotates clockwise around the fulcrum 8b, the upper die chuck claw 8c disengages from the engaging portion 12d, and the lower die chuck arm 9a rotates counterclockwise around the fulcrum 9b. The lower die chuck claw 9c engages with the engaging portion 12d of the intermediate die 12 as it rotates. As a result, the intermediate mold 12 can be delivered from the upper mold 3 to the lower mold 4. Further, an ejector pin plate (not shown) is pushed, and the first ejector pin 3a of the upper die 3 is in a state of protruding from the clamp surface and pushes the substrate W side of the work W.

  Next, the mold opening / closing mechanism performs a mold opening operation to open the upper mold 3 and the lower mold 4. In this case, as shown in FIG. 7, the intermediate die 12 is opened by the lower die chuck mechanism 9 while being held by the lower die 4. Further, since the mold is opened while being pressed from above by the first ejector pin 3a, the work W is also opened while being held by the intermediate mold 12. Further, when the first movable rod 14 is separated from the push pin 8f, the upper die chuck mechanism 8 causes the upper die chuck arm 8a to rotate counterclockwise around the fulcrum 8b by the urging force of the coil spring 8e. The upper die chuck claw 8c returns to the chuck position.

  Next, as shown in FIG. 8, when the lower platen 6 is lowered and the ejector pin plate (not shown) is pushed, the first ejector pin 4a projects into the cavity recess 12a and separates the molded product 19 at the gate position. To do. The molded work W separated from the intermediate mold 12 is taken out of the mold by a conveying unit (unloader or the like) not shown. Further, in the resin path between the intermediate mold 12 and the lower mold 4, unnecessary molded products (molded product runner gates and molded product culls) 20 connected to the molded product 19 remain.

  Next, in FIG. 9, the third mold closing operation of the upper mold 3 and the lower mold 4 is performed by the mold opening / closing mechanism. Similarly to FIG. 3, the lower mold platen 6 is raised to raise the lower mold 4 and the intermediate mold 12. At this time, the upper die chuck claw 8c returning to the chuck position engages with the engaging portion 12d of the intermediate die 12 as in the first die closing operation, and the intermediate die moves from the lower die 4 to the upper die 3. The mold 12 is delivered. At this time, the second ejector pin 3b of the upper mold 3 is inserted into the ejector pin through hole 12c of the intermediate mold 12 and strengthens the pressing of the unnecessary molded product (molded product runner gate and molded product cull) 20. Further, in the lower die chuck mechanism 9, since the coil spring 17 extends as the lower die 4 rises, the position of the second movable rod 15 retreats, while the urging force of the coil spring 9e increases, so that the lower die chuck arm 9a. Rotates clockwise around the fulcrum 9b, and the lower die chuck claw 9c retracts from the engaging portion 12d of the intermediate die 12.

  Next, as shown in FIG. 10, the mold opening / closing mechanism performs a mold opening operation to open the upper mold 3 and the lower mold 4. The intermediate die 12 is chucked to the upper die 3 by the upper die chuck mechanism 8, and the second ejector pin 3b of the upper die 3 projects downward from the ejector pin through hole 12c of the intermediate die 12 and is an unnecessary molded product (molded product runner). The lower mold 4 is opened while the gate and molded product cull) 20 is released from the intermediate mold 12 and remains in the lower mold 4.

  Finally, as shown in FIG. 11, when the lower mold platen 6 is lowered and the ejector pin plate (not shown) is pushed, the first ejector pin 4a projects above the lower mold 4 and the second ejector pin 4b moves. The unnecessary molded product 20 is released from the lower mold 4 by protruding from the position of the lower mold runner 4d and pushing up the molded product runner gate. The unnecessary molded product 20 is taken out from the mold by a conveying means (not shown) (chuck hand, unloader, etc.) and discarded.

  As described above, according to the resin molding apparatus of the present embodiment, the intermediate die 12 can be held by any one of the upper die 3 to the lower die 4 when the die is closed by the operation of the transfer mechanism 13. As a result, the first mold closing operation holds the intermediate mold 12 from the lower mold 4 to the upper mold 3 to supply the work and the resin, and the second mold closing operation performs the resin molding. Since the intermediate die 12 is transferred from the lower die 3 to the lower die 4 and the workpiece after molding can be taken out, a resin mold using the intermediate die can be obtained by simply providing an upper die and a lower die chuck mechanism in the existing transfer molding equipment. It can be realized with an inexpensive and simple structure. Therefore, the mold opening / closing operation can be performed by holding the intermediate mold in either the upper mold 3 or the lower mold 4 without requiring a special drive source.

  Further, when the third mold closing operation is performed, the unnecessary molded product 20 remaining in the resin path of the intermediate mold is released, and when the mold is opened, the unnecessary molded product 20 is released from the lower mold 4. it can. Therefore, by simply repeating the mold opening / closing operation, the work W after molding can be efficiently separated from the intermediate mold 12 and the unnecessary molded product 20 separated from the work W can be separated and removed. There is no need to provide a special device configuration or device area.

In the above-described embodiment, the upper die chuck mechanism 8 and the lower die chuck mechanism 9 are provided so that the chuck arm is rotated by the bias of the coil spring, but a drive source such as a solenoid or an air cylinder transmits the drive. You may make it rotate by.
Further, rod members (first movable rod 14 and second movable rod 15) and pin members (for example, drive pins 13a and driven pins) used to control the timing of driving the upper die chuck mechanism 8 and the lower die chuck mechanism 9. The length of 16a) may be variable. For example, the driving (opening / closing) timings of the upper die chuck mechanism 8 and the lower die chuck mechanism 9 can be arbitrarily set by making the lengths of the rod member and the pin member variable. Thereby, even when the thickness of the intermediate die 12 or the work W is changed, the adjustment can be easily performed. As the variable length structure of these rod members and pin members, these members can be exchanged by changing the length by constructing these members by joining them together, or the supporting locations of these rod members and pin members and Various lengths can be changed by providing a combination of a male screw and a female screw in the middle to rotate and change the length, or by using a linear motion mechanism such as a ball screw and a motor to actively change the length. A structure can be adopted.
Further, the cavity recess 12a and the vertical gate 12b may be provided on the surface opposite to that of the above embodiment, and the work W may be clamped and resin-molded so that the lower mold 4 and the middle mold 12 sandwich the work. ..
Further, the upper mold platen 5 and the lower mold platen 6 are fixed on the upper mold side and movable on the lower mold side, but the upper mold side may be movable and the lower mold side may be fixed, or both may be movable. ..
Further, although the pot 10 and the plunger 11 and the transfer mechanism are provided in the lower mold 4, they may be provided in the upper mold 3.
Further, although the work W has been described as the one in which the semiconductor chip 2 is mounted on the substrate 1, it may be a work in which a reflector or the like is formed in advance on a lead frame, or a motor core or the like.

  Next, a compression molding device using an intermediate mold will be described with reference to FIGS. 12 to 16. Illustration of the upper mold platen and the lower mold platen is omitted, and the structure of the mold will be mainly described. As the work W, as an example, it is assumed that the semiconductor chips 2 are mounted in multiple layers on the silicon wafer substrate 1. The description of the upper die chuck mechanism 8 and the lower die chuck mechanism 9 is cited as being the same as the mechanism provided in the upper die 3 and the lower die 4 of the above-described embodiment.

  An upper die chuck mechanism 8 capable of holding the intermediate die 22 formed in an annular shape is provided on the outer peripheral edge of the clamp surface of the upper die 21. A plurality of upper die chuck mechanisms 8 are provided at positions where the upper die chuck claws 8c lock the intermediate die 22, and when the upper die chuck arm 8a is swung by a die closing operation or an operation of a transfer mechanism (not shown) or the like, The chuck claw 8c is adapted to be unlocked from the intermediate mold 22. At the lower end on the inner peripheral side of the intermediate die 22, a work holding claw 22a that supports the outer peripheral edge of the work is provided so as to protrude radially inward, and retains the outer peripheral edge of the work W. As a result, the outer periphery of the work W is protected by the work holding claws 22a, so that the resin can be prevented from adhering. A guide surface 22b that is inclined like a wedge is formed on the clamp surface side of the work holding claw 22a. The outer peripheral surface of the intermediate die 22 is provided with a locking portion 22c that is engaged with the upper die chuck claw 8c or the lower die chuck claw 9c.

  In the lower mold 23, a lower mold cavity piece 25 is supported by a lower mold base block 24. On the outer peripheral side of the lower die cavity piece 25, a lower die movable clamper 26 is floatingly supported by a lower die base block 24 by a coil spring 27. A lower mold cavity recess 28 is formed by the lower mold cavity piece 25 and the lower mold movable clamper 26 surrounding the lower mold cavity piece 25. On the clamp surface of the lower die movable clamper 26, a clamp portion 26a that abuts the work W (silicon wafer), an inclined groove 26b that communicates with the lower die cavity recess 28 and that forms a resin path facing the guide surface 22b, an inclination Overflow cavities 26c communicating with the grooves 26b are engraved respectively. A lower die guide block 29 is supported by the lower die base block 24 on the outer peripheral side of the lower die movable clamper 26. The lower die guide block 29 is provided with a lower die chuck mechanism 9 capable of holding the intermediate die 22. The lower die chuck mechanism 9 swings the lower die chuck arm 9a by the movement of a lower die platen (not shown) or a transfer mechanism (not shown), and the lower die chuck claw 9c provided at the tip portion of the lower die chuck mechanism 9c moves the intermediate die 22. Lock.

  The lower mold cavity recess 28 may be covered with a release film (not shown) (hereinafter simply referred to as “film”). The film has heat resistance, is easily peeled from the mold surface, and has flexibility and extensibility, for example, PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film. A single-layer film or a multi-layer film containing polyvinylidene chloride as a main component is preferably used.

An example of the resin molding operation will be described with reference to FIGS. 12 to 16.
As shown in FIG. 12, the work W is sucked and held by the opened upper die 21, and the intermediate die 22 is held by the upper die 21 by the upper die chuck arm 8 a of the upper die chuck mechanism 8. At this time, the upper die chuck claw 8c is engaged with the engaging portion 22c, and the work holding claw 22a of the intermediate die 22 holds the outer peripheral edge of the work W.

  Further, the resin 18 required for one molding is supplied to the lower mold cavity recess 28 of the lower mold 23. The amount of resin is larger than the volume of the lower mold cavity, and the form of the resin 18 may be solid, liquid, granular, powdery, or sheet-like. When the lower mold movable clamper 26 clamps the work W by closing the mold by the mold opening / closing mechanism, the lower mold chuck mechanism 9 swings the lower mold chuck arm 9a so that the lower mold chuck claw 9c moves the intermediate mold 22. You may make it chuck.

  As shown in FIG. 13, when the mold closing mechanism advances the mold closing, the coil spring 27 is compressed while the clamp part 26a of the lower mold movable clamper 26 is in contact with the work W, and the cavity volume is compressed to a predetermined volume. The molten resin 18 overflows from the lower mold cavity recess 28 into the overflow cavity 26c through the inclined groove 26b. Here, the molten resin 18 will flow to the lower side of the intermediate mold 22 through the inclined groove 26b. Therefore, it is possible to prevent the resin 18 from adhering to the side surface of the work W due to the resin 18 overflowing through the outer periphery of the work W like a normal die. In this way, the resin 18 is caused to overflow and then heat-cured while applying the final resin pressure to perform compression molding. By heating and pressurizing the resin 18 while causing the resin 18 to overflow, for example, with respect to the work W in which the plurality of semiconductor chips 2 are flip-chip mounted, the resin 18 is surely provided in the gap between the stacked chips or the gap between the chip and the work. Can be filled.

In this case, the intermediate die 22 is in a state of being locked by the upper die chuck claw 8c, and the lower die chuck claw 9c is in a state of being unlocked from the engaging portion 22c of the intermediate die 22.
When the mold is opened by the mold opening / closing mechanism, the intermediate mold 22 is opened while being chucked by the upper mold 21, as shown in FIG. The unnecessary molded product 20 (overflow resin) overflowing the mold movable clamper 26 is separated from the molded product 19 while remaining in the resin path (the inclined groove 26b, the overflow cavity 26c).

  Then, as shown in FIG. 15, the unnecessary molded product 20 remaining in the resin path (the inclined groove 26b, the overflow cavity 26c) provided on the clamp surface of the lower mold movable clamper 26 is released by an ejector pin or the like (not shown) and taken out. And discard.

Finally, as shown in FIG. 16, the second mold closing operation is performed by the mold opening / closing mechanism to clamp the upper mold 21 and the lower mold 23 as shown in FIG. At this time, the upper die chuck claw 8c of the upper die chuck mechanism 8 is unlocked with the engaging portion 22c of the intermediate die 22 by raising the lower die platen (not shown), and the lower die chuck pawl 9c of the lower die chuck mechanism 9 is moved. After locking with the locking portion 22c of the intermediate mold 22, the mold is opened again by the mold opening / closing mechanism.
Thereby, the mold opening is performed while the intermediate mold 22 is being transferred from the upper mold 21 to the lower mold 23 (lower mold movable clamper 26). After this, the suction of the molded work W suction-held by the upper mold 21 is released, and the work W is taken out by the conveying means (chuck hand, unloader, etc.), whereby the compression molding is completed.

  Therefore, the compression molding can be performed by holding the intermediate die 22 in either the upper die 21 or the lower die 23 without requiring a special drive source. Further, the work W after resin molding and the unnecessary molded product 20 (overflow resin) can be easily separated only by switching the holding state of the intermediate mold 22 and opening the mold.

  In the above-described embodiment, the configuration in which one intermediate die 12 and 22 is sandwiched between the upper and lower dies has been described, but a configuration in which a plurality of intermediate dies are sandwiched so as to be stacked may be used. Also in this case, the operation of the transfer mechanism 13 can hold a plurality of intermediate dies in arbitrary dies.

  W work 1 substrate 2 semiconductor chip 3 upper die 3a, 4a first ejector pin 3b, 4b second ejector pin 3c upper die relief recess 4 lower die 4c lower die cull 4d lower die runner 4e lower die relief recess 4f, 8h through hole 5 Upper die platen 6 Lower die platen 7 Guide post 8 Upper die chuck mechanism 8a Upper die chuck arm 8b Support point 8c Upper die chuck claw 8d Upper die actuating arm 8e Coil spring 8f Push pin 8g Upper die claw holder 9 Lower die chuck Mechanism 9a Lower die chuck arm 9b Support point 9c Lower die chuck claw 9d Lower die actuating arm 9e Coil spring 9f Lower die claw holding portion 10 Pot 11 Lower die plunger 12,22 Intermediate die 12a Cavity recess 12b Vertical gate 12c Ejector pin through hole 12 Locking part 13 Transfer mechanism 13a Drive pin 14 First movable rod 15 Second movable rod 16 Movable plate 16a Follower pin 17 Coil spring 18 Resin 19 Molded product 20 Unnecessary molded product 21 Upper mold 22a Work holding claw 22b Guide surface 23 Lower Mold 24 Lower mold base block 25 Lower mold cavity piece 26 Lower movable clamper 26a Clamp portion 26b Inclined groove 26c Overflow cavity 27 Coil spring 28 Lower mold cavity recess 29 Lower mold guide block

Claims (6)

A first mold and a second mold that can be opened and closed,
A cavity concave portion, which is arranged between the first mold and the second mold, clamps a work between the first mold and the resin and molds the resin, and a gate penetrating therethrough in the mold opening / closing direction. A third mold formed,
A first die chuck mechanism provided on the first die and detachably holding the third die;
A second die chuck mechanism provided on the second die and detachably holding the third die;
The resin is loaded into resin loading portion provided in front Symbol second mold, filled into the cavities through the gate, first actuator and the second gold switch the holding operation of the first mold chuck mechanism A transfer mechanism that moves up and down together with a second actuator that switches the holding operation of the die chuck mechanism .
By performing the mold opening and closing operations of the first mold and the second mold a plurality of times with the work placed on the third mold, the resin supply operation and the resin molding operation by the transfer mechanism are performed respectively. The holding state of the third die by the first die chuck mechanism is released by raising the first actuator in accordance with the raising operation of the transfer mechanism, and the second die by raising the second actuator. The third die is held by the chuck mechanism, and the third die is held by the first die chuck mechanism by lowering the first actuator in accordance with the lowering operation of the transfer mechanism. 2 by releasing the held state of the third mold of the second mold chuck mechanism by lowering the actuator, the between the first mold and the second mold first Resin molding apparatus characterized by switching the holding state of the mold. With the work placed on the third mold supported by the second mold, the first mold chuck mechanism causes the third mold to move the third mold to the first mold by the raising operation of the second mold. 2. The resin molding apparatus according to claim 1, wherein the resin mold unit is held by the first mold and the third mold to clamp the work, and the lowering operation of the second mold opens the resin loading unit . The plunger is lifted to perform resin molding, the first actuator is lifted to release the holding state of the third mold by the first mold chuck mechanism, and the second actuator is lifted to the second mold chuck. 3. The mechanism is operated to cause the second mold to hold the third mold, and the third mold is transferred from the first mold to the second mold. Resin molding equipment. Wherein the second mold before Symbol third plurality of first ejector pin molds through projecting respectively toward the molded article to release is provided, wherein the first mold, the third A plurality of second ejector pins are provided, which penetrate the mold and project into the molded product in the cavity concave portion and the molded product remaining in the resin path connected to the resin loading portion of the second mold so as to be released from the mold. The resin molding device according to any one of claims 1 to 3 . A cavity concave portion that is arranged between a first mold and a second mold that are openably and closably provided, and that clamps a work between the first mold and the resin mold, and a mold opening and closing direction that is continuous with the cavity concave part. A step of preparing a third mold having a gate penetrating therethrough,
Supplying the work by aligning the third mold with the cavity recess of the third mold while being supported by the second mold;
The first die and the second die are closed for the first time, and the first die chuck mechanism holds the third die to move the work between the first die and the first die. Clamping and opening the mold to load the resin into the opened resin loading portion of the second mold;
The mold of the second time is closed, and the plunger of the transfer mechanism is raised while the third mold is clamped by the first mold and the second mold, so that the molten resin loaded in the resin loading part is removed. The cavity is filled through the gate of the third mold and resin-molded , and the holding state of the third mold by the first mold chuck mechanism is released by raising the first actuator in accordance with the raising operation of the plunger. At the same time, by raising the second actuator in accordance with the raising movement of the plunger, the second die chuck mechanism holds the third die so that the first die moves to the second die. The process of handing over
A step of opening the third mold on which the work is placed from the first mold while holding the third mold on the second mold;
And a step of releasing the molded work from the third mold by taking it out, and a resin molding method. The first die and the second die are closed for the third time to release the holding state of the third die by the second die chuck mechanism and operate the first die chuck mechanism. Holding the third mold on the first mold,
A step of separating the first mold and the second mold to separate an unnecessary molded product from the third mold and performing mold opening with the second mold attached.
The resin molding method according to claim 5, further comprising a step of releasing and removing the unnecessary molded product attached to the second mold.

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