JP2017193078A - Resin molding device and resin molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a novel resin mold device having a mold die using an intermediate die, and a novel resin mold method using the same.SOLUTION: Multiple die-closing operations on an upper die 3 and a lower die 4 are performed with a workpiece W placed on an intermediate die 12, thereby performing both resin supply operation and resin molding operation by operating a transfer mechanism 13. Also, holding action by an upper die chuck mechanism 8 and a lower die chuck mechanism 9 is switched, thereby switching a holding state of the intermediate die 12 from the upper die 3 to the lower die 4.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin molding apparatus and a resin molding method in which, for example, a third mold is clamped together with a workpiece between a first mold and a second mold to perform resin molding.

  Japanese Patent Application Laid-Open No. 4-269854 (Patent Document 1) and Japanese Patent Application Laid-Open No. 6-177191 are technologies having a vertical gate structure in which a gate is provided in a direction perpendicular to a cavity formed on a mold clamping surface. JP-A-8-25424 (Patent Document 3), JP-A-2003-11187 (Patent Document 4) and JP-A-2007-130976 (Patent Document 5).

JP-A-4-269854 JP-A-6-177191 JP-A-8-25424 JP 2003-11187 A JP 2007-130976 A

In a general molding die in transfer molding, a runner serving as a resin path is provided on the end surface side on a substrate (a lead frame, a resin substrate, or the like on which a semiconductor chip is mounted) set in the die. In such a molding die, the runner serving as a resin path is formed across the die and the substrate, so that the resin may leak from the gap between the die and the substrate.
In the case of rubbing with compression molding, a runner is not necessary, but since resin pressure is difficult to be transmitted into the cavity, molding is performed by overflowing the resin. However, such an overflow tends to cause a resin residue on the outer periphery of the workpiece after molding, making it difficult to handle in the subsequent process.

  In particular, a resin having a low molecular weight and a low viscosity in recent years, and a transparent resin (low-viscosity resin for lens molding) for a light receiving and emitting device such as an LED (Light Emitting Diode) are likely to cause resin leakage. Moreover, when installing a runner on a board | substrate, it is necessary to ensure the space for it. Furthermore, the resin remaining as a runner gate after molding needs to be removed separately from unnecessary molded products (scrap resin) without added value as molded products. On the other hand, in the intermediate mold having the vertical gate structure, the runner gate does not run on the substrate, so there is no problem that the molded product gate remains on the substrate, and the resin is directly filled on the semiconductor chip. In addition, since the resin spreads in the wire wiring direction, wire flow hardly occurs. For this reason, it is considered effective to use an intermediate mold having a vertical gate structure for transfer molding. In addition, it is considered that the molded product and the mold can be easily separated by using the resin path for overflowing the intermediate mold for compression molding.

  An object of the present invention is to solve the above-mentioned problems of the prior art and provide a novel resin molding apparatus having a mold using an intermediate mold and a novel resin molding method using the same.

In order to achieve the above object, the present invention comprises the following arrangement.
A resin that is disposed between the first mold and the second mold and the first mold and the second mold that are provided so as to be openable and closable, and clamps the workpiece between any one of the molds. A third mold in which a cavity recess to be molded and a gate penetrating in the mold opening / closing direction are formed, and a first mold provided in the first mold and detachably holding the third mold A chuck mechanism, a second mold chuck mechanism provided in the second mold and detachably holding the third mold, and a resin provided in either the first mold or the second mold A transfer mechanism that fills the cavity recess through the gate with the resin loaded in the loading unit, and the first mold and the second mold while the workpiece is placed on the third mold. The resin supply operation and the above-mentioned tr Each of the resin mold operations by the spher mechanism is performed, and the holding operation by the first mold chuck mechanism and the second mold chuck mechanism is switched to switch the third mold between the first mold and the second mold. The holding state is switched.

  According to the above configuration, since the third mold is held in either the second mold or the first mold by the opening and closing operation of the mold, the first and second molds are added to the existing transfer mold apparatus. The resin mold using the third mold can be realized at a low cost and with a simple configuration simply by providing the chuck mechanism. Therefore, transfer molding can be performed by holding the third mold in either the first mold or the second mold without requiring a special drive source.

The transfer mechanism includes a first actuator that switches a holding operation of the first mold chuck mechanism according to an opening / closing operation of the first mold and the second mold, and a holding operation of the second mold chuck mechanism. It is desirable that a second actuator for switching between is provided.
Accordingly, the holding operation of the first mold chuck mechanism and the second mold chuck mechanism is switched by operating the first actuator and the second actuator in accordance with the mold opening / closing operation without providing another driving source. Thus, the holding state of the third mold can be switched.

While the work is placed on the third mold supported by the second mold, the first mold chuck mechanism is operated by a first mold closing operation to move the third mold to the first mold. It is preferable that the workpiece is clamped by being held by a mold and the resin is supplied to the resin loading portion provided in the second mold.
Thus, the workpiece can be supplied to the third mold and the resin can be supplied to the resin loading portion of the second mold by the first mold closing operation.

The transfer mechanism is operated by the second mold closing operation to perform resin molding, and the holding state by the first mold chuck mechanism is released by the further mold closing operation, and the second mold chuck mechanism is operated to operate the second mold chuck mechanism. It is preferable that the third mold is transferred from the first mold to the second mold while holding the third mold.
As a result, the molten resin is filled in the cavity recess by the second mold opening and closing operation, and the third mold can be transferred from the first mold to the second mold. Therefore, by simply opening the mold, the molded workpiece can be separated and removed from the first mold while being placed on the third mold.

  The first mold is provided with a plurality of first ejector pins that pass through the workpiece and the third mold and protrude toward the molded product, and are released from the mold. There are provided a plurality of second ejector pins that project through the third mold and protrude from the molded product in the cavity recess and the molded product remaining in the resin path connected to the resin loading portion of the second mold. It is preferable.

Thus, when the mold is opened after resin molding, the first ejector pin protrudes to release the workpiece from the first mold, and when the mold opening is completed, the second ejector pin penetrates the third mold. The molded product in the cavity recess can be released from the third mold.
Further, when the mold is opened and closed again, the first ejector pin passes through the third mold and the unnecessary molded product remaining in the resin path is released from the third mold, and the second ejector pin becomes the resin. By protruding into the path, an unnecessary molded product can be released from the second mold.
Therefore, by simply performing the mold opening / closing operation after resin molding, separation of the molded product from the third mold and separation / removal of the unnecessary molded product separated from the molded product can be performed efficiently, and it is exceptional for delegation. It is not necessary to provide a simple device configuration and device area.

Further, as another resin molding apparatus, the first mold and the second mold that are provided so as to be openable and closable are disposed between the first mold and the second mold. A third mold that is clamped while holding the held work; a first mold chuck mechanism that is provided in the first mold and holds the third mold in a detachable manner; and the second mold. A second die chuck mechanism that detachably holds the third die, and is provided in either the first die or the second die, and is disposed so as to surround the cavity piece. A cavity recess formed by the movable clamper, and an overflow cavity formed in the movable clamper and communicating with the cavity recess, and the first mold or the second mold and the third mold While holding the workpiece, the first mold By performing a plurality of times of opening / closing the second mold, a resin supply operation and a compression molding operation are respectively performed on the cavity recess, and a holding operation by the first mold chuck mechanism and the second mold chuck mechanism. And the holding state of the third mold is switched between the first mold and the second mold.
As a result, the third mold is held by either the second mold or the first mold by the opening and closing operation of the mold mold, and therefore the existing compression molding apparatus is provided with the first and second mold chuck mechanisms. The resin mold using the third mold can be realized with an inexpensive and simple configuration. Therefore, compression molding can be performed by holding the third mold in either the first mold or the second mold without requiring a special drive source. Further, the work after the resin molding and the overflow resin can be easily separated by simply switching the holding state of the third mold and opening the mold.

  Further, in the resin molding method, a cavity recess that is disposed between a first mold and a second mold that are provided so as to be openable and closable, and clamps a workpiece between one of the molds and resin molds. And a step of preparing a third mold in which a gate penetrating in the mold opening / closing direction is formed, and the cavity of the third mold while the third mold is supported by the second mold The step of supplying the workpiece in alignment with the recess, and the first mold and the second mold are closed for the first time, and the third mold is held by the first mold chuck mechanism. The workpiece is clamped between the first mold and the resin is loaded into the resin loading portion provided in the second mold, and the mold is closed for the second time. While being clamped to the first mold and the second mold, the transfer The molten resin loaded in the resin loading portion by operating the structure is filled into the cavity recess through the gate of the third mold and resin molded, and further by the mold closing operation by the first mold chuck mechanism. The step of releasing the holding state and operating the second die chuck mechanism to hold the third die in the second die, and the third die on which the workpiece is placed as the second die And a step of opening the mold from the first mold, and a step of releasing the molded workpiece from the third mold and taking it out.

  According to the resin molding method, by performing the mold opening / closing operation twice, the third mold is held in the second mold or the first mold, the workpiece and the resin are supplied, the resin molding operation, and the molded workpiece. Therefore, it is possible to perform resin molding with high quality without using wasteful resin and without providing a resin path on the workpiece, and the third mold can be used as the second mold or the second mold. The operation to be held in one mold can be realized with a simple configuration using an existing transfer mold without providing a special drive source. In addition, the work after molding can be separated and removed from an unnecessary molded product only by the mold opening / closing operation, and facilities and space for mold release can be omitted.

The third mold is closed for the third time to release the holding state by the second mold chuck mechanism and the first mold chuck mechanism is operated to move the third mold. A step of holding a mold in the first mold, and separating the first mold and the second mold to separate unnecessary molded products from the third mold, thereby forming the second mold. You may further have the process of performing mold opening with adhering, and the process of releasing and removing the said unnecessary molded product adhering to the said 2nd metal mold | die.
Thus, by performing a mold opening / closing operation after the resin molding, an unnecessary molded product is released from the third mold, and the mold is opened together with the second mold. Unnecessary molded products can be released. Therefore, the molded product can be separated from the third mold and the second mold only by the mold opening / closing operation.

  By using the above-described resin molding apparatus and method, there is no problem that the molded product gate remains on the workpiece, the molding quality is improved without using useless resin, and the molded workpiece or molded product from the mold is used. Separation can be performed easily. In addition, it is possible to improve the versatility of the apparatus by reducing the apparatus cost simply by providing the chuck mechanism of the third mold in the existing mold apparatus.

It is sectional explanatory drawing of the resin mold apparatus of the mold open state explaining a resin mold operation | movement. It is a cross-sectional explanatory view of the resin mold device showing the work supply operation following FIG. FIG. 5 is a cross-sectional explanatory view of a resin mold apparatus showing a third mold chucking operation to the first mold following FIG. 2. FIG. 4 is a cross-sectional explanatory view of a resin molding apparatus showing a resin supply operation to a second mold following FIG. 3. FIG. 5 is a cross-sectional explanatory view of a resin molding apparatus showing a resin molding operation following FIG. 4. FIG. 6 is a cross-sectional explanatory view of the resin mold apparatus showing a third mold chucking operation to the second mold following FIG. 5. FIG. 7 is a cross-sectional explanatory view of a resin mold apparatus showing a workpiece separating operation from the first mold to the third mold following FIG. 6. FIG. 8 is a cross-sectional explanatory view of a resin mold device showing a separation operation of a molded product from a third mold following FIG. 7. FIG. 9 is a cross-sectional explanatory view of a resin mold apparatus showing a third mold chucking operation to the first mold following FIG. 8. FIG. 10 is a cross-sectional explanatory view of a resin mold device showing an operation of separating an unnecessary molded product from the third mold following FIG. 9. FIG. 11 is a cross-sectional explanatory view of a resin mold device showing an operation of separating an unnecessary molded product from the second mold following FIG. 10. It is sectional explanatory drawing which shows the resin mold operation | movement of the compression molding apparatus which concerns on another example. FIG. 13 is a cross-sectional explanatory view showing a resin molding operation of the compression molding apparatus following FIG. 12. It is sectional explanatory drawing which shows the resin mold operation | movement of the compression molding apparatus following FIG. It is sectional explanatory drawing which shows the resin mold operation | movement of the compression molding apparatus following FIG. FIG. 16 is a cross-sectional explanatory view showing a resin molding operation of the compression molding apparatus following FIG. 15.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a resin molding apparatus and a resin molding method according to the present invention will be described in detail with reference to the accompanying drawings of FIGS. In the following, for example, a workpiece W having a semiconductor chip 2 mounted on one side (wire bonding mounting, flip chip mounting) on a substrate (lead frame) 1 is used (see FIG. 2).

  Moreover, the resin mold apparatus is provided with a known mold opening / closing apparatus that transmits driving from a driving source using a toggle link or the like. Further, in the following description, as an example, the upper mold (first mold) 3 is a fixed mold, the lower mold (second mold) 4 is a movable mold, and the upper mold 3 is an upper mold platen 5 (fixed platen). The description will be made assuming that the lower die 4 is supported by the lower die platen 6 (movable platen). As described above, the resin mold apparatus opens and closes the upper mold 3 and the lower mold 4 with the intermediate mold 12 (third mold) held by the upper mold 3 or the lower mold 4 as shown in FIGS. It is configured to be possible. In addition, the upper mold | type 3 and the lower mold | type 4 are provided with the heater which is not shown in figure, and the intermediate mold | type 12 shall be heated and shape | molded with the workpiece | work W and resin 18 which are mentioned later. The rectangular upper platen 5 is fixed to the upper ends of guide posts 7 provided at the four corners, and the rectangular lower platen 6 is slidably connected to the guide posts 7 at the four corners.

  The upper mold 3 is supported by the upper mold platen 5. The upper die 3 is provided with an upper die chuck mechanism 8. The upper die 3 is provided with a first ejector pin 3a for separating a substrate and a second ejector pin 3b for releasing an unnecessary molded product so as to protrude. The length of the second ejector pin 3b is longer than that of the first ejector pin 3a. The first ejector pin 3a and the second ejector pin 3b are always urged in a protruding direction by a coil spring or the like (not shown).

Here, an example of the upper mold chuck mechanism 8 (first mold chuck mechanism) will be described.
The upper die chuck arm 8a is provided so as to hang downward from the upper die surface. One end (upper end) of the upper die chuck arm 8a is provided on the upper die 3 so as to be rotatable about a fulcrum 8b. The other end portion (lower end portion) of the upper chuck arm 8a is provided with an upper chuck claw 8c having a tip tapered shape (wedge shape) whose bottom surface is inclined toward the tip side and becomes narrower. Further, in the vicinity of the fulcrum 8b of the upper mold chuck arm 8a, an upper mold operation arm 8d intersecting (orthogonal to) the upper mold chuck arm 8a is integrally formed. On the upper side of the upper mold operating arm 8d, a coil spring 8e is elastically provided in the upper mold 3. The upper mold operating arm 8d is always urged counterclockwise around the fulcrum 8b in the illustrated portion. Has been. On the lower side of the upper mold operating arm 8d, a push pin 8f is provided so as to be prevented from coming off in the vertical direction, and the upper end is pushed by the upper mold operating arm 8d and the lower end projects below the upper mold 3. It is installed. Further, an upper mold claw holding portion 8g having an L-shaped cross section is provided in the vicinity of the upper mold chuck arm 8a. The upper mold claw holding portion 8g holds the upper mold claw 8c at a predetermined height when the upper mold 3 and the lower mold 4 are opened. A through hole 8h into which a first actuator, which will be described later, can be inserted is provided in the arm portion formed by bending the upper claw holding portion 8g in the horizontal direction. The position of the through hole 8h is provided directly below the push pin 8f. Further, an upper die escape recess 3c into which a lower die claw holding portion 9f described later enters is provided on the lower surface of the upper die 3.

  As described above, the upper die mechanism 8 includes a plurality of sets of the upper die chuck arm 8a, the upper die chuck claw 8c, and the like described above at the position along the edge of the intermediate die 12, so that the intermediate die 12 is changed to the upper die. 3 can be held. That is, the upper mold claw 8c held by the upper mold claw holding portion 8g is moved back and forth via the upper mold chuck arm 8a and the like, and the upper mold 3 holds the intermediate mold 12 and the lower mold 4 has an intermediate The state in which the mold 12 can be delivered can be switched.

  The lower mold 4 is supported to be separated from the lower mold platen 6. The lower die 4 is provided with a plurality of lower die chuck mechanisms 9. The lower mold 4 is provided with a first ejector pin 4a for releasing a molded product 19 formed in a cavity recess 12a, which will be described later, and a second ejector pin 4b for releasing an unnecessary molded product 20 so as to protrude. Yes. The length of the first ejector pin 4a is longer than the length of the second ejector pin 4b, and is erected on an ejector pin plate (not shown). Further, a lower mold cull 4 c and a lower mold runner 4 d are engraved on the clamp surface of the lower mold 4. A lower mold pot 10 is provided at the center of the lower mold cull 4c, and a lower mold plunger 11 is inserted so as to be movable up and down (resin loading section).

Here, an example of the lower mold chuck mechanism 9 (second mold chuck mechanism) will be described.
The lower die 4 is provided with a lower die chuck arm 9a protruding upward from the lower die surface. At one end (upper end) of the lower chuck arm 9a, there is provided a lower chuck claw 9c having a tip tapered shape (wedge shape) whose upper surface side is inclined toward the tip side and becomes narrower. The other end (lower end) of the lower chuck arm 9a is provided to be rotatable about a fulcrum 9b. Further, in the vicinity of the fulcrum 9b of the lower mold chuck arm 9a, a lower mold operation arm 9d intersecting (orthogonal to) the lower mold chuck arm 9a is integrally formed. A coil spring 9e is resiliently provided below the lower mold operating arm 9d and is provided in the lower mold 4. The lower mold operating arm 9d is always urged clockwise around the fulcrum 9b in the illustrated portion. Has been. Further, on the lower mold surface, a lower mold claw holding portion 9f having an L-shaped cross section is provided in the vicinity of the lower mold chuck arm 9a. The lower mold claw holding portion 9f holds the lower mold chuck claw 9c at a predetermined height when the upper mold 3 and the lower mold 4 are opened. Further, on the upper surface of the lower mold 4, there is provided a lower mold escape recess 4 e into which the upper mold nail holder 8 g enters. Furthermore, the lower mold 4 is provided with a through hole 4f into which a first movable rod 14 described later is inserted. The position of the through hole 4f is formed so as to oppose the position of the through hole 8h formed in the upper mold nail holder 8g.

  Thus, the lower mold chuck mechanism 9 includes a plurality of sets of the lower mold chuck arm 9a, the lower mold chuck claw 9c, and the like described above at a position along the edge of the intermediate mold 12. 4 can be held. That is, the lower mold claw 9c held by the lower mold claw holding portion 9f is moved back and forth via the lower mold chuck arm 9a and the like, and the intermediate mold 12 is held by the lower mold 4 and the upper mold 3 side The state in which the intermediate mold 12 can be handed over can be switched.

  The intermediate mold 12 is disposed between the upper mold 3 and the lower mold 4 and is held by one of the molds. The resin mold is performed in a state where the intermediate mold 12 and the workpiece W are clamped between the upper mold 3 and the lower mold 4. In the present embodiment, the resin mold is performed with the workpiece W clamped between the upper mold 3 and the intermediate mold 12. A cavity recess 12a and a vertical gate 12b penetrating in the mold opening / closing direction are formed on the upper surface (upper mold facing surface) of the intermediate mold 12. Further, the intermediate mold 12 is provided with an ejector pin through hole 12c into which the second ejector pin 3b is inserted. The ejector pin through hole 12c is formed at a position overlapping the lower mold cull 4c. Further, a locking portion 12d for locking the upper die chuck claw 8c and the lower die chuck claw 9c is provided on the outer peripheral edge portion of the intermediate die 12.

  A transfer mechanism 13 is integrally supported on the lower platen 6. The transfer mechanism 13 raises the plunger 11 provided with one or a plurality of molten resins loaded in the pot 10 to raise the lower mold 4c, the lower runner 4d, and the vertical gate formed on the intermediate mold 12. The cavity recess 12a is filled through 12b.

  The lower mold 4 includes a first movable rod 14 (first actuator) and a lower mold chuck that switch the holding operation of the upper chuck mechanism 8 corresponding to the operation of the transfer mechanism 13 (specifically, the lifting and lowering operation of the plunger 11). A second movable rod 15 (second actuator) for switching the holding operation of the mechanism 9 is provided. Specifically, the movable plate 16 is suspended and supported by a coil spring 17 in a state where a predetermined gap is opened on the opposite side (lower surface side) of the lower die 4 to the mounting position of the intermediate die 12. A first movable rod 14 and a second movable rod 15 are erected on the movable plate 16. Thereby, in the lower mold | type 4, the 1st movable rod 14 and the 2nd movable rod 15 can be raised / lowered interlock | cooperated by raising / lowering the movable plate 16. FIG. The first movable rod 14 protrudes from the lower mold surface through the through hole 4 f of the lower mold 4. The second movable rod 15 is inserted into the lower mold 4 and abutted against the other end of the lower mold operating arm 9d whose one end is urged clockwise around the fulcrum 9b by the coil spring 9e. The lower chuck arm 9a is supported in a neutral position so as not to rotate any further.

Further, the transfer mechanism 13 has a drive pin 13a protruding around a block for moving the plunger 11 up and down. A driven pin 16a is provided on the lower surface of the movable plate 16 so as to face the drive pin 13a. When the lower mold platen 6 is raised, the drive pin 13a is pushed up while being in contact with the driven pin 16a, whereby the movable plate 16 is pushed up, and the first movable rod 14 and the second movable rod 15 are raised. (See FIG. 6). That is, the first movable rod 14 and the second movable rod 15 can be raised and lowered in conjunction with the raising and lowering operation of the plunger 11.
Thus, the upper mold chuck mechanism can be operated by operating the first movable rod 14 and the second movable rod 15 in accordance with the lifting / lowering operation of the transfer mechanism 13 that moves up / down in accordance with the mold opening / closing operation without providing a special drive source. The holding state of the intermediate mold 12 can be switched by switching the holding operation of each of the 8 and the lower mold chuck mechanisms 9.

Here, an example of the resin molding operation will be described with reference to FIGS.
In the resin mold apparatus shown in the present embodiment, in the initial state shown in FIG. 1, the intermediate die 12 is placed on the lower die 4 when the upper die 3 and the lower die 4 are opened. Here, the upper chuck mechanism 8 (upper chuck claw 8c) is in a chuck position where it can be locked to the locking portion 12d of the intermediate mold 12. Further, since the lower mold chuck mechanism 9 (lower mold chuck claw 9c) is in a state where the transfer mechanism 13 is not operated (stopped), it is not raised, and the lower mold chuck claw 9c is engaged with the intermediate mold 12. It is in a neutral position where it is not locked to the portion 12d. The first ejector pin 3a of the upper die 3 is flush with the clamp surface or protrudes from the clamp surface, and the second ejector pin 3b protrudes from the clamp surface.

  Next, in FIG. 2, the work W is set (mounted) on the intermediate mold 12 by a work loader (not shown). The workpiece W is supplied after being aligned so that the semiconductor chip 2 is accommodated in the cavity recess 12a. Moreover, since the pot 10 formed in the lower mold 4 is closed by the intermediate mold 12, the resin cannot be supplied at this stage.

  Next, in FIG. 3, the mold opening / closing mechanism is driven to perform the first mold closing operation. The lower mold platen 6 is raised, and the lower mold 4 and the intermediate mold 12 are raised. At this time, the locking portion 12d of the intermediate mold 12 is lifted while pressing the locking portion 12d of the intermediate mold 12 against the inclination of the tip of the upper chuck claw 8c. It can be moved over the upper chuck claw 8c. As a result, the upper die chuck claw 8c is inserted below the locking portion 12d by the bias of the coil spring 8e, and the upper die chuck claw 8c is locked to the locking portion 12d. 3 is held.

  Alternatively, the push pin 8f may be pushed against the biasing force of the coil spring 8e by inserting the through hole 8h of the upper claw holding portion 8g on the distal end side of the first movable rod 14. In this case, the upper die chuck arm 8a temporarily rotates clockwise around the fulcrum 8b, and the upper die chuck claw 8c moves to the retracted position as the intermediate die 12 is raised. In this state, the locking portion 12d of the intermediate die 12 is moved onto the upper die chuck claw 8c, and the upper die chuck arm 8a is rotated again counterclockwise so that the upper die chuck claw 8c is moved to the intermediate die 12. It latches and holds in the latching | locking part 12d provided in the outer peripheral edge part. As a result, the intermediate mold 12 is transferred from the lower mold 4 to the upper mold 3. Since the lower die chuck claw 9c is in the neutral position, it does not interfere with the intermediate die 12.

  Further, since the upper mold claw holding portion 8g enters the lower mold escape recess 4e and the lower mold claw holding portion 9f enters the upper mold escape recess 3c, there is no interference. The second ejector pin 3 b of the upper mold 3 is inserted into the ejector pin through hole 12 c of the intermediate mold 12, and the first ejector pin 3 a is pushed back into the upper mold 3 together with the clamp of the substrate 1. When the workpiece W (substrate 1) is clamped by the upper mold 3 and the intermediate mold 12, the mold closing operation is completed.

Next, when the mold is opened by the mold opening / closing mechanism, the movable platen 6 is lowered and the intermediate mold 12 is also lowered along with the lower mold 4. However, since the upper mold chuck claw 8c remains locked to the locking portion 12d of the intermediate mold 12, the intermediate mold 12 remains held by the upper mold 3.
As shown in FIG. 4, when the upper mold 3 and the lower mold 4 are completely opened, only the lower mold 4 is lowered together with the lower mold platen 6. Therefore, the resin 18 (for example, tablet resin or liquid resin) is supplied to the pot 10 using the open space above the lower mold 4.

  Next, a second mold closing operation is performed by the mold opening / closing mechanism. Here, as in FIG. 3, the lower platen 6 is raised and the lower die 4 is raised. Then, the workpiece W (substrate 1) is clamped by the intermediate mold 12 and the lower mold 4 held by the upper mold 3, and the mold closing is completed.

Then, as shown in FIG. 5, the plunger 11 is raised in the pot 10 by operating the transfer mechanism 13, and the molten resin 18 passes through the lower mold 4c, the lower mold runner 4d, and the vertical gate 12b to the cavity recess 12a. To fill.
Next, as shown in FIG. 6, when the mold opening / closing mechanism is driven in the mold closing direction to further raise the lower mold platen 6, the filling of the resin 18 into the cavity recess 12a is completed. In this state, the resin 18 is heated and cured by the upper mold 3 and the intermediate mold 12.

  In this case, as shown in FIG. 6, the upper chuck claw 8 c is detached from the locking portion 12 d of the intermediate mold 12 in conjunction with the raising of the plunger 11, and the lower chuck claw 9 c is connected to the locking portion of the intermediate mold 12. The intermediate mold 12 held on the upper mold 3 can be transferred to the lower mold 4 by being locked to 12d.

  Specifically, the drive pin 13a is pushed up while being in contact with the driven pin 16a, the coil spring 17 is compressed and the movable plate 16 is pushed up. As a result, the first movable rod 14 pushes the push pin 8f against the biasing force of the coil spring 8e, and the second movable rod 15 rises to resist the biasing force of the coil spring 9e. And rotate in the counterclockwise direction around the fulcrum 9b.

  At this time, the upper chuck arm 8a rotates clockwise around the fulcrum 8b, the upper chuck claw 8c is disengaged from the locking portion 12d, and the lower chuck arm 9a rotates counterclockwise around the fulcrum 9b. Therefore, the lower die chuck claw 9c is engaged with the engaging portion 12d of the intermediate die 12. As a result, the intermediate mold 12 can be delivered from the upper mold 3 to the lower mold 4. In addition, an ejector pin plate (not shown) is pushed, and the first ejector pins 3a of the upper mold 3 protrude from the clamp surface and press the substrate 1 side of the workpiece W.

  Next, a mold opening operation is performed by a mold opening / closing mechanism to open the upper mold 3 and the lower mold 4. In this case, as shown in FIG. 7, the intermediate die 12 is opened while being held by the lower die 4 by the lower die chuck mechanism 9. In addition, since the mold is opened while being pressed from above by the first ejector pins 3 a, the work W is also opened while being held by the intermediate mold 12. In the upper chuck mechanism 8, when the first movable rod 14 is separated from the push pin 8f, the upper chuck arm 8a rotates counterclockwise around the fulcrum 8b by the urging force of the coil spring 8e. The upper die claw 8c returns to the chuck position.

  Next, as shown in FIG. 8, when the lower mold platen 6 descends and an ejector pin plate (not shown) is pushed, the first ejector pin 4a protrudes into the cavity recess 12a, and the molded product 19 is separated at the gate position. To do. The molded workpiece W released from the intermediate mold 12 is taken out from the mold by a conveyance means (unloader or the like) not shown. Further, unnecessary molded products (molded product runner gate and molded product cal) 20 that have been connected to the molded product 19 remain in the resin path between the intermediate mold 12 and the lower mold 4.

  Next, in FIG. 9, a third mold closing operation of the upper mold 3 and the lower mold 4 is performed by the mold opening / closing mechanism. Similarly to FIG. 3, the lower mold platen 6 is raised, and the lower mold 4 and the intermediate mold 12 are raised. At this time, the upper die claw 8c returning to the chuck position is engaged with the engaging portion 12d of the intermediate die 12 in the same manner as in the first die closing operation, and the intermediate portion from the lower die 4 to the upper die 3 is intermediated. The mold 12 is delivered. At this time, the second ejector pin 3b of the upper mold 3 is inserted into the ejector pin through-hole 12c of the intermediate mold 12 to increase the pressure on the unnecessary molded product (molded product runner gate and molded product cal) 20. In the lower chuck mechanism 9, the coil spring 17 is extended as the lower mold 4 is raised, so that the position of the second movable rod 15 is retracted while the urging force of the coil spring 9e is increased. Is rotated clockwise around the fulcrum 9b, and the lower die claw 9c is retracted from the locking portion 12d of the intermediate die 12.

  Next, as shown in FIG. 10, a mold opening / closing mechanism is used to open the upper mold 3 and the lower mold 4. The intermediate die 12 is chucked to the upper die 3 by the upper die chuck mechanism 8, and the second ejector pin 3 b of the upper die 3 protrudes downward from the ejector pin through hole 12 c of the intermediate die 12 and is an unnecessary molded product (molded product runner). The lower mold 4 is opened while the gate 20 and the molded product Cull) 20 are released from the intermediate mold 12 and remain in the lower mold 4.

  Finally, as shown in FIG. 11, when the lower mold platen 6 descends and an ejector pin plate (not shown) is pushed, the first ejector pin 4a protrudes above the lower mold 4 and the second ejector pin 4b The unnecessary molded product 20 is released from the lower mold 4 by protruding from the position of the lower mold runner 4d and pushing up the molded product runner gate. The unnecessary molded product 20 is taken out from the mold by a conveying means (chuck hand, unloader, etc.) (not shown) and discarded.

  As described above, according to the resin molding apparatus in the present embodiment, the intermediate mold 12 can be held on either the upper mold 3 or the lower mold 4 when the mold is closed by the operation of the transfer mechanism 13. As a result, the workpiece and resin are supplied by holding the intermediate mold 12 from the lower mold 4 to the upper mold 3 in the first mold closing operation, and the resin mold is performed by the second mold closing operation. Since the intermediate mold 12 is transferred from 3 to the lower mold 4 and the workpiece after molding can be taken out, the resin mold using the intermediate mold can be obtained simply by providing the upper mold and the lower mold chuck mechanism in the existing transfer mold equipment. It can be realized with an inexpensive and simple configuration. Therefore, the mold opening / closing operation can be performed while holding the intermediate mold in either the upper mold 3 or the lower mold 4 without requiring a special drive source.

  Further, when the mold closing operation is performed for the third time, the unnecessary molded product 20 remaining in the intermediate resin path is released, and when the mold is opened, the unnecessary molded product 20 is released from the lower mold 4. it can. Therefore, it is possible to efficiently perform separation and removal of the molded product W from the intermediate mold 12 and separation and removal of the unnecessary molded product 20 separated from the workpiece W only by repeatedly performing the mold opening / closing operation. There is no need to provide a special device configuration or device area.

In the above embodiment, the upper chuck mechanism 8 and the lower chuck mechanism 9 are provided such that the chuck arm is rotated by the bias of the coil spring. However, a drive source such as a solenoid or an air cylinder transmits the drive. May be rotated.
Also, rod members (first movable rod 14 and second movable rod 15) and pin members (for example, drive pin 13a and driven pin) used to control the timing of driving the upper mold chuck mechanism 8 and the lower mold chuck mechanism 9 are used. The length of 16a) may be variable. For example, by making the lengths of these rod members and pin members variable, the drive (open / close) timing of the upper mold chuck mechanism 8 and the lower mold chuck mechanism 9 can be arbitrarily set. Thereby, for example, even when the thickness of the intermediate mold 12 or the workpiece W is changed, it can be easily adjusted. As the variable structure of the lengths of these rod members and pin members, these members can be exchanged by changing the length by connecting a plurality of parts, or the supporting positions of these rod members and pin members can be changed. Various lengths can be varied, such as rotating the length by changing the combination of male and female screws in the middle, or making the length actively variable by a linear motion mechanism such as a ball screw and motor. A structure can be adopted.
Further, the cavity recess 12a and the vertical gate 12b may be provided on the surface opposite to the above embodiment, and clamped and resin-molded so that the workpiece W is sandwiched between the lower mold 4 and the intermediate mold 12. .
Further, although the upper mold platen 5 and the lower mold platen 6 are fixed on the upper mold side and movable on the lower mold side, the upper mold side may be movable and the lower mold side may be fixed, or both may be movable. .
Further, although the pot 10, the plunger 11, and the transfer mechanism are provided in the lower mold 4, the upper mold 3 may be provided.
Furthermore, although the workpiece W has been described as having the semiconductor chip 2 mounted on the substrate 1, a reflector or the like may be formed in advance on the lead frame, or a motor core or the like.

  Next, a compression molding apparatus using an intermediate mold will be described with reference to FIGS. The upper platen and the lower platen are not shown, and the configuration of the mold will be mainly described. As an example, the workpiece W is assumed to have a multilayer structure in which semiconductor chips 2 are mounted on a silicon wafer substrate 1. The upper die chuck mechanism 8 and the lower die chuck mechanism 9 are the same as the mechanisms provided in the upper die 3 and the lower die 4 in the embodiment described above, and the description is incorporated herein.

  An upper die chuck mechanism 8 capable of holding an annular intermediate die 22 is provided on the outer peripheral edge of the clamp surface of the upper die 21. A plurality of upper mold chuck mechanisms 8 are provided at positions where the upper mold chuck claws 8c engage with the intermediate mold 22. When the upper mold chuck arm 8a is swung by an operation of a mold closing operation, a transfer mechanism (not shown), or the like, The chuck claw 8c is unlocked from the intermediate die 22. A work holding claw 22a that supports the outer peripheral edge of the work is provided at the lower end on the inner peripheral side of the intermediate mold 22 so as to protrude radially inward, and holds the outer peripheral edge of the work W. As a result, the outer periphery of the workpiece W is protected by the workpiece holding claws 22a, thereby preventing the resin from adhering. Further, a guide surface 22b inclined in a wedge shape is formed on the clamp surface side of the work holding claw 22a. On the outer peripheral surface of the intermediate mold 22, a locking portion 22 c that locks the upper mold claw 8 c or the lower mold claw 9 c is projected.

  In the lower mold 23, a lower mold cavity piece 25 is supported by a lower mold base block 24. On the outer peripheral side of the lower mold cavity piece 25, a lower mold movable clamper 26 is floatingly supported by a lower mold base block 24 by a coil spring 27. A lower mold cavity recess 28 is formed by the lower mold cavity piece 25 and the lower mold movable clamper 26 surrounding the lower mold cavity piece 25. The clamp surface of the lower mold movable clamper 26 includes a clamp portion 26a that comes into contact with the workpiece W (silicon wafer), an inclined groove 26b that communicates with the lower mold cavity recess 28, and that forms a resin path facing the guide surface 22b. Each overflow cavity 26c communicating with the groove 26b is engraved. A lower mold guide block 29 is supported by the lower mold base block 24 on the outer peripheral side of the lower mold movable clamper 26. The lower mold guide block 29 is provided with a lower mold chuck mechanism 9 that can hold the intermediate mold 22. The lower mold chuck mechanism 9 is provided with a lower mold chuck claw 9c provided at the tip by swinging the lower mold chuck arm 9a by raising a lower mold platen (not shown) or an operation of a transfer mechanism (not shown). Lock.

  The lower mold cavity recess 28 may be covered with a release film (hereinafter simply referred to as “film”) (not shown). The film has heat resistance and is easily peeled off from the mold surface and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film. A monolayer film or a multi-layer film mainly composed of polyvinylidine chloride or the like is preferably used.

An example of the resin molding operation will be described with reference to FIGS.
As shown in FIG. 12, the workpiece W is sucked and held on the upper die 21 that is opened, and the intermediate die 22 is held on the upper die 21 by the upper die chuck arm 8 a of the upper die chuck mechanism 8. At this time, the upper die claw 8c is engaged with the engaging portion 22c, and the work holding claw 22a of the intermediate die 22 holds the outer peripheral edge of the workpiece W.

  Further, the resin 18 necessary for one molding is supplied to the lower mold cavity recess 28 of the lower mold 23. The amount of the resin is greater than the volume of the lower mold cavity, and the form of the resin 18 may be any of solid, liquid, granule, powder, and sheet. When the lower mold movable clamper 26 clamps the workpiece W by closing the mold by the mold opening / closing mechanism, the lower mold chuck mechanism 9 swings the lower mold chuck arm 9a, and the lower mold chuck claw 9c causes the intermediate mold 22 to move. You may make it chuck.

  As shown in FIG. 13, when the mold closing is advanced by the mold opening / closing mechanism, the coil spring 27 is compressed while the clamp portion 26a of the lower mold movable clamper 26 is in contact with the workpiece W, and the cavity volume is compressed to a predetermined volume. The molten resin 18 overflows from the lower mold cavity recess 28 to the overflow cavity 26c through the inclined groove 26b. Here, the molten resin 18 flows to the lower side of the intermediate mold 22 through the inclined groove 26b. For this reason, it can prevent that the resin 18 adheres to the side surface of the workpiece | work W because the resin 18 overflows through the outer periphery of the workpiece | work W like a normal metal mold | die. Thus, after the resin 18 is overflowed, compression molding is performed by heating and curing while applying the final resin pressure. By heating and pressurizing the resin 18 while overflowing the resin 18 in this manner, for example, the resin 18 can be reliably placed in the gap between the stacked chips or the gap between the chips and the workpiece with respect to the workpiece W on which the plurality of semiconductor chips 2 are flip-chip mounted. Can be filled.

In this case, the intermediate mold 22 is in a state of being locked by the upper mold chuck claw 8c, and the lower mold chuck claw 9c is in a state of being unlocked from the locking portion 22c of the intermediate mold 22.
Next, when the mold is opened by the mold opening / closing mechanism, as shown in FIG. 14, the intermediate mold 22 is opened while being chucked by the upper mold 21. Unnecessary molded product 20 (overflow resin) overflowed to mold movable clamper 26 is separated from molded product 19 while remaining in the resin path (inclined groove 26b, overflow cavity 26c).

  Next, as shown in FIG. 15, the unnecessary molded product 20 remaining in the resin path (the inclined groove 26b and the overflow cavity 26c) provided on the clamping surface of the lower mold movable clamper 26 is removed by an unillustrated ejector pin or the like and taken out. Discard it.

Finally, as shown in FIG. 16, a second mold closing operation is performed by the mold opening / closing mechanism to clamp the upper mold 21 and the lower mold 23 as shown in FIG. At this time, the upper die claw 8c of the upper die chuck mechanism 8 is brought into an unlocked state with the engaging portion 22c of the intermediate die 22 by raising the lower die platen (not shown), and the lower die chuck claw 9c of the lower die chuck mechanism 9 is released. After engaging with the locking portion 22c of the intermediate mold 22, the mold is opened again by the mold opening / closing mechanism.
Thereby, the mold opening is performed while the intermediate mold 22 is transferred from the upper mold 21 to the lower mold 23 (lower mold movable clamper 26). After that, the compression molding is completed by releasing the suction of the molded workpiece W held by suction on the upper die 21 and taking it out by a conveying means (chuck hand, unloader, etc.).

  Therefore, compression molding can be performed by holding the intermediate mold 22 in either the upper mold 21 or the lower mold 23 without requiring a special drive source. Further, the workpiece W after resin molding and the unnecessary molded product 20 (overflow resin) can be easily separated by simply switching the holding state of the intermediate mold 22 and opening the mold.

  In the above-described embodiment, the configuration in which the single intermediate molds 12 and 22 are sandwiched between the upper and lower molds has been described. However, a configuration in which a plurality of intermediate molds are stacked may be employed. Also in this case, a plurality of intermediate molds can be held in an arbitrary mold by the operation of the transfer mechanism 13.

  W Work 1 Substrate 2 Semiconductor chip 3 Upper die 3a, 4a First ejector pin 3b, 4b Second ejector pin 3c Upper die relief recess 4 Lower die 4c Lower die kull 4d Lower runner 4e Lower die relief recess 4f, 8h Through hole 5 Upper mold platen 6 Lower mold platen 7 Guide post 8 Upper mold chuck mechanism 8a Upper mold chuck arm 8b Support point 8c Upper mold claw 8d Upper mold operating arm 8e Coil spring 8f Pushing pin 8g Upper mold claw holder 9 Lower mold chuck Mechanism 9a Lower mold chuck arm 9b Support point 9c Lower mold chuck claw 9d Lower mold operation arm 9e Coil spring 9f Lower mold claw holder 10 Pot 11 Lower mold plunger 12, 22 Intermediate mold 12a Cavity recess 12b Vertical gate 12c Ejector pin through hole 12 Locking portion 13 Transfer mechanism 13a Drive pin 14 First movable rod 15 Second movable rod 16 Movable plate 16a Follower pin 17 Coil spring 18 Resin 19 Molded product 20 Unnecessary molded product 21 Upper mold 22a Work holding claw 22b Guide surface 23 Lower Mold 24 Lower mold base block 25 Lower mold cavity piece 26 Lower mold movable clamper 26a Clamp part 26b Inclined groove 26c Overflow cavity 27 Coil spring 28 Lower mold cavity recess 29 Lower mold guide block

Claims (8)

A first mold and a second mold provided so as to be openable and closable;
A cavity recess disposed between the first mold and the second mold and clamping the workpiece between the molds and resin-molding, and a gate penetrating in the mold opening / closing direction is connected to the cavity recess. A third mold formed;
A first mold chuck mechanism provided on the first mold and detachably holding the third mold;
A second mold chuck mechanism provided in the second mold and detachably holding the third mold;
A transfer mechanism that fills the cavity recess through the gate with a resin loaded in a resin loading section provided in either the first mold or the second mold;
The resin supply operation and the resin mold operation by the transfer mechanism are performed by performing the mold opening / closing operation a plurality of times while the workpiece is placed on the third die. The holding operation of the third mold is switched between the first mold and the second mold by switching the holding operation by the first mold chuck mechanism and the second mold chuck mechanism. Resin mold device.   The transfer mechanism includes a first actuator for switching an opening / closing operation of the first mold chuck mechanism according to an opening / closing operation of the first mold and the second mold, and an opening / closing operation of the second mold chuck mechanism. The resin mold apparatus of Claim 1 with which the 2nd actuator which switches is provided.   While the work is placed on the third mold supported by the second mold, the first mold chuck mechanism is operated by a first mold closing operation to move the third mold to the first mold. The resin mold apparatus according to claim 1 or 2, wherein the resin is supplied to the resin loading unit provided in the second mold while being held by a mold to clamp the workpiece.   The transfer mechanism is operated by the second mold closing operation to perform resin molding, and the holding state by the first mold chuck mechanism is released by the further mold closing operation, and the second mold chuck mechanism is operated to operate the second mold chuck mechanism. The resin mold apparatus according to claim 3, wherein the third mold is transferred from the first mold to the second mold while holding the third mold.   The first mold is provided with a plurality of first ejector pins that pass through the workpiece and the third mold and protrude toward the molded product, and are released from the mold. There are provided a plurality of second ejector pins that project through the third mold and protrude from the molded product in the cavity recess and the molded product remaining in the resin path connected to the resin loading portion of the second mold. The resin mold apparatus of any one of Claim 1 thru | or 4 which has. A first mold and a second mold provided so as to be openable and closable;
A third mold which is disposed between the first mold and the second mold and is clamped while holding a work held by any one of the molds;
A first mold chuck mechanism provided on the first mold and detachably holding the third mold;
A second mold chuck mechanism provided in the second mold and detachably holding the third mold;
A cavity recess formed in either the first mold or the second mold and formed by a cavity piece and a movable clamper disposed so as to surround the cavity piece;
An overflow cavity formed in the movable clamper and communicating with the cavity recess,
The cavity is obtained by performing a plurality of mold opening / closing operations of the first mold and the second mold while holding the workpiece between the first mold or the second mold and the third mold. A resin supply operation and a compression molding operation are respectively performed on the concave portion, and the holding operation by the first mold chuck mechanism and the second mold chuck mechanism is switched to switch the third mold between the first mold and the second mold. A resin molding apparatus characterized by switching a holding state of a mold. Cavity recess disposed between a first mold and a second mold that can be opened and closed, and clamps a workpiece between one mold and resin molding, and a mold opening / closing direction connected thereto Preparing a third mold in which a gate penetrating through is formed;
Supplying the workpiece by aligning with the cavity recess of the third mold while the third mold is supported by the second mold;
The first mold and the second mold are closed for the first time, the third mold is held by the first mold chuck mechanism, and the workpiece is moved between the first mold and the first mold. Clamping and loading resin into a resin loading section provided in the second mold;
The mold is closed for the second time, and the third mold is clamped by the first mold and the second mold, and the transfer mechanism is operated so that the molten resin loaded in the resin loading section is moved to the first mold. Filling the cavity recess through the gate of the three molds and resin molding, releasing the holding state by the first mold chuck mechanism and operating the second mold chuck mechanism by further mold closing operation. Holding the three molds in the second mold;
Opening the third mold on which the workpiece is placed from the first mold together with the second mold;
Releasing the molded workpiece from the third mold and taking it out. The first mold and the second mold are closed a third time to release the holding state by the second mold chuck mechanism, and the first mold chuck mechanism is operated to move the third mold. Holding in the first mold,
Separating the first mold and the second mold to separate unnecessary molded products from the third mold and performing mold opening while adhering to the second mold;
The resin molding method according to claim 7, further comprising: removing the unnecessary molded product attached to the second mold by releasing the mold.

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