JP2001024016A - Resin-sealing device for semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin-sealing device for manufacturing a semiconductor device effectively, without causing various kinds of troubles caused by cutting of the resin molding material. SOLUTION: A resin-sealing device includes first, second and third members 11, 12, and 13 with their face movable near to each other and back from each other. A cavity 22 for forming resin is formed between parting faces 15 and 17 of the first and second members 11 and 12. A guide part 30 for guiding resin material for each cavity 22 is provided on the other opposite face 16 from one face 15 of the second member 12 that determines the cavity 22. In this case, unwanted parts 34a, 35a, 36a as resin mold parts at the guide part 30 can be removed easily, by separating the second member 12 and the third member 13 opposite to the second member 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin sealing device suitable for manufacturing a semiconductor package formed by resin sealing a semiconductor electronic component such as a semiconductor IC.

[0002]

2. Description of the Related Art In manufacturing a semiconductor package, a resin sealing device having a mold having an upper mold portion and a lower mold portion is generally used. A plurality of cavities for resin molding are formed between the parting surfaces which are opposite surfaces of both mold portions. For example, each semiconductor component held on a lead frame plate or a film-like tape substrate is held in the cavities. In this state, the molten resin material is guided from the pot in which the resin pallet is placed, through the guide portion including the cull, runner and gate, to each cavity by pushing out the plunger incorporated in one mold portion. You.

A package is formed by curing the resin material in the cavity, the package is taken out of the mold, and an unnecessary portion of the resin material cured by the guide is removed from the mold. In order to enable the unnecessary portion to be taken out of the mold, the guide portion is provided between the parting surfaces of the two mold portions, that is, the two mold portions are opposed to each other, similarly to the molding cavity. At least one of the two parting surfaces.

Incidentally, in order to manufacture an efficient package, it is desirable to arrange the cavities for resin molding of the mold in alignment with each other and close to each other. However, in order to properly guide the melting resin material to a large number of cavities arranged in a matrix, for example, it is necessary to arrange the guide portion formed between the parting surfaces between the aligned cavities. Therefore, the space between the cavities on both sides where the guide portion is provided cannot be reduced to 3 to 4 mm or less in order to form the guide portion.

In a chip size package referred to as a CSP, a relatively expensive polyimide tape is used as a film-like tape substrate. In order to enable the formation of a package, it is desired to arrange the cavities with high density. In order to enable the high-density arrangement described above in the CSP, it has been proposed to form a plurality of packages collectively as one continuous molded part and then cut the molded parts into a large number of packages. However, this raises various economic and environmental health problems due to the cutting of the resin material.

[0006]

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a resin encapsulation capable of efficiently manufacturing a semiconductor package without causing the above-mentioned various problems caused by cutting of a molding resin material. It is to provide a device.

[0007]

The present invention adopts the following constitution in order to solve the above points. <Structure> The present invention basically provides the first, second and third members such that the first and third members can abut on both sides of a second member at an intermediate position. A first, a second and a third member which are disposed and whose respective opposing surfaces are movable toward and away from each other; and the second member and the first member oppose each other. A plurality of cavities defined between opposing surfaces, in which electronic components to be resin-sealed are respectively arranged, and a plurality of cavities defined between mutually opposing surfaces of the third member and the first member; A guide portion for guiding a resin material melted for sealing to each of the cavities.

In the resin sealing device according to the present invention, the guide portion for guiding the resin material into each of the cavities is located on a side opposite to one surface of the second member in which the cavities are defined. Formed on the other surface side. The unnecessary portion formed of the resin molded portion formed in the guide portion can be easily taken out by separating the second member and the third member facing the member. Therefore, it is possible to suitably guide the molten resin material to the respective cavities via the guide portions without forming a conventional guide portion between the first and second members in which the cavities are formed. The cavity spacing can be set to be significantly smaller than before, for example, as small as 0.2 mm.

The present invention is suitable for manufacturing a package in which a semiconductor chip provided on a film-like substrate such as polyimide is used as the electronic component.
The substrate can be sandwiched between the first and second members prior to resin injection so that the plurality of semiconductor chips are located in the cavities between the members.

[0010] Each of the cavities may be formed by a recess formed in a surface of the second member facing the first member, and the substrate may be formed so as to close an opening of the recess. Be placed. In this case, the first member functions as a holding plate for the substrate.

The third member may be provided with a first pushing mechanism for pushing the semiconductor package molded in each molding cavity from the second member. Further, the third member may be provided with a second pushing mechanism for pushing the unnecessary portion formed of the resin molded portion formed on the guide portion from the guide portion.

The second pushing mechanism can be provided on a first member instead of the third member.

Each of the cavities may be entirely rectangular when viewed from the opposing surface of the second member facing the first member, and the guide portion may be formed by a side of the rectangle. Can be opened.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. <Specific Example> FIG. 1 shows a resin sealing device according to the present invention
An example applied to the manufacture of a semiconductor package called P (chip size package) will be described. In the CSP, as is well known in the art, a semiconductor chip 21 is mounted on a front surface 20 of a film-shaped substrate 19 described later, and a ball-shaped terminal group including connection terminals of the semiconductor chip 21 is provided on the back surface of the substrate 19. Have been.

As shown in FIG. 1, a resin sealing device 10 according to the present invention includes a first member 11 and a second member 12.
And a mold 14 comprising the third member 13.

Each of the members 11, 12 and 13 constituting the mold 14 is provided with a first member on both sides of the second member 12 with the second member 12 therebetween.
The member 11 and the third member 13 are arranged in pairs. The second member 12 arranged in the middle is
It has planes 15 and 16 parallel to each other. The first member 11 has a plane 17 facing one plane 15 of the second member 12, and the third member 13 has a second member 12.
And a flat surface 18 facing the other flat surface 16.

Each member 11, 12 and 13 has a plane 15 and 17, a plane 16 and 1 facing each other.
8 are held so as to be movable toward and away from each other. On the one flat surface 15 of the second member 12, cavities 22 for receiving a large number of semiconductor chips 21 mounted on a surface 20 of a substrate 19 made of, for example, a polyimide film are spaced apart from each other by a distance T.
Is formed. In the illustrated example, each cavity 22 has a rectangular shape (see FIG. 3) as a whole when viewed on one plane 15, and is formed of a recess that opens to the plane.

FIG. 1 shows a setting step in which a substrate 19 is arranged on one plane 15 of the second member 12 such that a semiconductor chip 21 as an electronic component to be sealed is in each cavity 22. Is shown. In this setting step, as described above, the substrate 1 is placed on one of the planes 15 so that the semiconductor chip 21 is located in the corresponding cavity 22.
The first member 11 and the second member 12 are held at positions separated from each other so as to allow the arrangement of the first member 9 and the second member 9.

Between the first member 11 and the second member 12, if necessary, such as an injection step described later, both members 11
In order to achieve a strong connection between
For example, there is provided a first clamp mechanism 26 including a clamp member 24 pivotally attached to the first member 11 via a pivot pin 23 and a locking groove 25 for releasably receiving the distal end of the clamp member. ing.

In the setting step shown in FIG. 1, the second member 12 and the third member 13 are
And the flat surface 18 are held in contact with each other. In the illustrated example, a second clamping mechanism 27 similar to the above is provided for firmly connecting the two members 12 and 13 as necessary, such as in the setting step. Clamp mechanism 27
Comprises a clamp member 29 pivotally attached to the third member 13 via a pivot pin 28. One of the clamp member 24 of the first clamp mechanism 26 and the clamp member 29 of the second clamp mechanism 27 can selectively engage with the locking groove 25.

A guide portion 30 for guiding the plasticized molten resin to each cavity 22 is provided between the flat surfaces 16 and 18 of the second member 12 and the third member 13. The third member 13 is provided with a pot 32 for accommodating a tablet 31 made of a thermosetting resin material containing, for example, silica and an epoxy resin as a binder. Thermosetting resin material 3 plasticized in pot 32
As is well known in the art, 1 is guided from the pot 32 to each cavity 22 through the guide portion 30 by the pushing action of the plunger 33 having the pot 32 as a cylinder.

The mold 14 of the resin sealing device 10 according to the present invention
Then, the guide portion 30 for guiding the plasticized thermosetting resin material 31 to each cavity 22 is provided on the other surface located on the opposite side to the one surface 15 on which the cavity 22 of the second member 12 is provided. 16 and a plane 18 of the third member 13 facing the plane.

In the illustrated example, the guide portion 30 is formed on the flat surface 18 of the third member 13, and is formed into a circular recess which is opened on the flat surface 18 to receive the thermosetting resin material 31 extruded from the pot 32. And a runner 35 extending from the cull on the plane 18 along the plane according to the arrangement of the cavities 22 in a matrix form, and each runner 35 formed on the plane 16 of the second member 12. And a gate 36 extending in the thickness direction of the second member 12 toward each of the corresponding cavities 22 and opening to each of the cavities 22. In the illustrated example, each gate 36 opens to a corresponding cavity 22 at a bottom edge 22a along one side of the rectangle of each cavity 22. In order to smoothly guide the plasticized thermosetting resin material 31 into each cavity 22, each gate 3 of each cavity 22
It is desirable to form air vent holes (not shown) at both ends of each of the bottom edges located on the opposite side to the bottom edge 22a where 6 opens.

The guide portion 30 including the cull 34, the runner 35 and the gate 36 is provided on the flat surface 16 on the opposite side to the flat surface 15 on which the cavity 22 of the second member 12 is provided and on the third surface facing the flat surface 16. Plane 1 of member 13 of
Specified between eight. For this reason, since the guide portion 30 is not located between the cavities 22 on the one plane 15, the mutual interval T of each cavity 22 on the one plane 15 is set to a small value such as 100 μm. Becomes possible.

In the third member 13, each package is provided with its own cavity 22 in a package discharging step described later.
And a second discharge mechanism 3 for discharging unnecessary molding portions remaining on the guide portion 30 from the third member 13 in a cull portion discharge step described later.
8 are provided.

The first discharge mechanism 37 includes a plurality of second members 12 and a third member 13 which are disposed in the respective cavities 22 so as to protrude along the guide holes 39 extending in the thickness direction thereof. It includes an extruding pin 40 and an actuating device 42, for example, a piston cylinder, which moves the pin between its pushing position and a retracted position from the cavity 22 defined by the stopper 41. Further, the second discharge mechanism 38 includes a plurality of push pins 44 that are disposed on the third member 13 so as to protrude into the runner 35 along the guide holes 43 extending in the thickness direction thereof, An actuating device 46 similar to the actuating device 42 is provided for operating between a pushing position and a retracted position from the runner 35 defined by the stopper 45.

Since the pins 40 and 44 of the discharge mechanisms 37 and 38 are air-tightly received in the guide holes 39 and 43, leakage passing through the guide holes 39 and 43 causes the cavity 22 and the runners to leak. 3
5 does not occur.

As shown in FIG. 1, in the setting step, the thermosetting resin material 31 is placed in the pot 32, and the semiconductor chips 21 to be sealed are positioned in the respective cavities 22. When the surface 19 of the substrate 19 on which the semiconductor chips 21 are mounted is arranged on one plane 15 of the second member 12, the first member 11 17 is held at a mold clamping position where the substrate 17 is brought into contact with the substrate 19.

After the mold clamping, in the resin injection step shown in FIG. 2, the thermosetting resin material 31 plasticized in the pot 32 is used.
Is injected into each cavity 22 from the bottom edge 22a thereof through the guide portion 30 including the cull 34, the runner 35 and the gate 36 by the operation of the plunger 33.

Due to the curing of the injected resin, a number of semiconductor packages 47 covering the respective semiconductor chips 21 and a gate molding portion 36a corresponding to the gate 36 are formed in the mold 14 as shown in FIG. , Runner 35
An unnecessary forming part including the runner forming part 35a corresponding to the squeezing part 34 and the cull forming part 34a corresponding to the cull 34 is integrally formed.

In the ejecting step of ejecting the semiconductor package 47 from the second member 12 among the integrated molding portions, the first member 11 is returned to the mold opening position in the setting step shown in FIG. It is. Thereafter, as shown in FIG. 4, when the pin 40 is pushed up to the pushing position by the operation of the actuator 42 of the first ejection mechanism 37, the semiconductor package 47 is separated from the gate molding portion 36a. Thereby, each semiconductor package 47 is pushed out to the push-up position separated from the second member 12 integrally with the substrate 19.

After the semiconductor package 47 is taken out of the mold 14 by the ejecting step, the unnecessary member is discharged in the step of discharging the unnecessary resin portion shown in FIG.
Is pushed up toward the first member 11,
The second member 12 is separated from the third member 13. After that, by the operation of the operating device 46 of the second discharge mechanism 38,
When the pin 44 is pushed up to the pushing position, the gate forming portion 36a and the runner forming portion 35a connected to the gate forming portion are formed.
Unnecessary forming portions 34a to 36a including the cull forming portion 34a connected to the runner forming portion are discharged from the third member 13.

As described above, the other surface 16 of the second member 12 located on the side opposite to the one surface 15 of the second member 12 in which the cavity 22 for the semiconductor package 47 which is a resin molded product is provided. And the plane 1 of the third member 13
6 is a parting surface for the guide portion 30, so that the guide portion 30 does not have to be positioned on one of the flat surfaces 15 on which the cavities 22 are provided.
2 enables the injection of a good thermosetting resin material 31 into
And unnecessary molding portions 34a to 36 hardened by the guide portion 30
a can be easily discharged from the mold 14.

Accordingly, it is not necessary to dispose the guide section 30 between the cavities 22 on the parting surface for the semiconductor package 47 in which the cavities 22 are provided. Significantly lower values, which
The arrangement of the cavities 22 at a high density and the effective use of the substrate 19 can be achieved.

In the above description, an example has been shown in which the substrate 19 is arranged so as to seal the cavity 22 in the resin injection step, and the first member 11 functions as a holding plate for supporting the substrate 19. Instead of an example, the first member 11 may be used to directly function as a part of a mold.
The first plane 17 is also provided with a recess forming a part of the cavity, and the plane 17 of the first member 11 and the one plane 15 of the second member 12 joined thereto are formed for the cavity. It can act as a parting surface.

In the illustrated example, the guide 30 is connected to the second
Plane 16 of member 12 and plane 18 of third member 13
Although the example in which both are formed is shown, the guide portion 30 can be formed only by the recess formed in the flat surface 16 of the second member 12. In addition, the guide portion 30 is opened to the cavity at the bottom edge portion 22a of the cavity 22. Alternatively, for example, the guide portion 30 may be opened to the cavity 22 at the central portion of the bottom portion of the cavity as needed. it can. Further, the first discharge mechanism 37 and the second discharge mechanism 38 can be appropriately combined with either the first member 11 or the third member 13 as needed.

As described above, the resin sealing device according to the present invention is applied to a film-like substrate having a semiconductor chip mounted on its surface and a ball-shaped terminal group comprising connection terminals of the semiconductor chip provided on its back surface. Although an example in which the present invention is applied to the manufacture of a CSP (chip size package) provided is described, the present invention can be applied to a sealing package of various electronic components other than the above-described CSP, whereby a large number of molds can be formed in one mold. Can be arranged at a high density, so that a packaged product can be manufactured efficiently.

[0038]

According to the present invention, as described above, the second member in which the cavity for resin molding is formed is associated with the other parting surface located on the side opposite to the one parting surface. Since the guide portion for guiding the molten resin material into each cavity is formed, it is not necessary to form a guide portion as in the related art on the parting surface where each cavity is provided. Since the guide portion does not intervene, the space between the cavities for resin molding can be set to be extremely small as compared with the related art. Therefore, it is possible to arrange a large number of cavities with a single mold at a high density without causing various problems caused by cutting the resin material, so that efficient resin molding can be performed.

According to the present invention, as described above,
Since the cavities can be arranged at a high density, by applying to the manufacture of a CSP using a film-like substrate such as an expensive polyimide, a semiconductor package can be manufactured at a high density on the substrate, Since the manufacturing cost of the product can be effectively reduced, it is possible to provide a less expensive semiconductor package.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically illustrating a resin sealing device according to the present invention in a setting step in which electronic components to be sealed are arranged.

FIG. 2 is a drawing similar to FIG. 1, schematically showing the resin sealing device shown in FIG. 1 in a resin injection step.

FIG. 3 is a perspective view schematically showing a molded product after resin curing.

FIG. 4 is a drawing similar to FIG. 1, schematically showing the resin sealing device shown in FIG. 1 in a package ejecting step.

FIG. 5 is a drawing similar to FIG. 1 schematically showing the resin sealing device shown in FIG. 1 in a step of discharging an unnecessary molding resin portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Resin sealing device 11 1st member 12 2nd member 13 3rd member 14 Die 15, 17 Opposing surface 16, 18 Opposing surface 21 (Semiconductor chip) Electronic component 22 Cavity 30 Guide part

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Hideo Sakamoto 105, Takamatsu 2nd Land, Hanamaki City, Iwate Prefecture F-term in Techno Create Co., Ltd. (Reference) 4F202 AH37 CA12 CB12 CB17 CK02 CK42 CK52 CK89 CM02 5F061 AA01 BA05 CA21 DA01 DA07 DA15 EA13

Claims (7)

[Claims] 1. The first, second and third members are respectively disposed on both sides of the second member at an intermediate position so as to be able to contact each other, First, second, and third members whose opposing surfaces are movably arranged in a direction approaching or moving away from each other, and are defined between opposing surfaces of the second member and the first member that oppose each other. A plurality of cavities in which electronic components to be resin-encapsulated are respectively disposed, and a plurality of cavities defined between mutually facing surfaces of the third member and the first member. A resin sealing device for a semiconductor package, comprising: a guide portion for guiding a molten resin material into each of the cavities. 2. The electronic component according to claim 1, wherein the electronic component is a semiconductor chip provided on a film-shaped substrate, and a plurality of the semiconductor chips are injected between the first and second members by resin injection so as to be positioned in each of the cavities. The resin sealing device according to claim 1, wherein the substrate is sandwiched between the first and second members beforehand. 3. Each of the cavities includes a recess formed on a surface of the second member facing the first member, and the substrate is disposed so as to close an opening of the recess. The resin sealing device according to claim 2, wherein the first member functions as a holding plate for the substrate. 4. A first extruding mechanism for extruding a semiconductor package formed in each cavity from the second member toward the first member spaced from the second member. The resin sealing device according to claim 1, further comprising: 5. The third member according to claim 4, wherein a second extruding mechanism for extruding an unnecessary portion formed of a resin molded portion formed on the guide portion from the guide portion is provided on the third member. Resin sealing device. 6. The first member according to claim 4, wherein a second pushing mechanism for pushing an unnecessary portion formed of a resin molded portion formed on the guide portion from the guide portion is provided on the first member. Resin sealing device. 7. Each of the cavities presents a rectangular shape as a whole when viewed from the facing surface of the second member facing the first member, and the guide portion is open to each cavity at a side portion of the rectangle. The resin sealing device according to claim 1.