JP3404187B2 - Mold release equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed molded product and a mold releasing apparatus for a mold for releasing unnecessary resin from a mold.

[0002]

2. Description of the Related Art Conventionally, for example, in a molding die for sealing a semiconductor device with resin, an upper mold and a lower mold which are provided with cavities for molding a molded product on a parting surface and which can be relatively moved toward and away from each other. A mold is provided, and the molten resin is filled into the cavity through a resin path formed in the upper mold and / or the lower mold to perform resin sealing. For example, in the upper die 51 and the lower die 52 of the molding die shown in FIG.
3, gate 54, runner 55, cull 56 and pot 57
Molten resin is injected into the resin path provided with the pressure from a lower mold 52 side by a plunger (not shown).
6, each cavity 53 through the runner 55 and the gate 54
Then, the molded product 58 such as a semiconductor device is sealed with resin.

Further, as a mold releasing device for the molding die, the ejector pin 5 which can be ejected to the positions corresponding to the cavity 53, the runner 55, and the cull 56, respectively.
The upper mold 51 and / or the lower mold 52 are equipped with 9, 60 and 61, respectively. The ejector pins 59, 6 described above
Nos. 0 and 61 are integrally supported by an ejector pin plate (not shown), and by making the ejector pin plate movable, each pin can be projected into a resin path in the mold. After resin sealing, upper mold 51 and lower mold 52
When the mold is opened, the ejector pins 59, 60, 61
At the same time, a predetermined amount of each is ejected, and the molded product 58 is released from the mold while the unnecessary resin such as the molded product gate, the molded product runner, and the molded product cull are integrally attached. In addition, the molded product 58 is formed by the molded product gate,
Unnecessary resin such as molded product runner and molded product cull is removed.

[0004]

However, the above-mentioned conventional mold releasing apparatus for a mold has the following problems. That is, when the molded product 58 and unnecessary resin are released from the mold after resin sealing, the ejector pins 59, 6
Although 0 and 61 are abutted against the molded product 58 and the unnecessary resin and released from the mold, for example, when the power transistor or the like is resin-molded, the final cured portion of the sealing resin becomes the tip portion of each ejector pin. In some cases, the sealing resin may remain attached to the end surface of the ejector pin. Since the protruding amounts of the above-mentioned pins are the same, the tip surfaces of these pins are cured while being attached to the sealing resin. As described above, if the ejector pins 59, 60, 61 and the molded product 58 and the unnecessary resin cannot be separated from each other, the removal of the molded product 58 and the unnecessary resin may be hindered. Further, in the case of the mold release failure of the molded product 58 and the unnecessary resin, particularly in the automolding apparatus, the next operation (for example, the cleaning operation) is automatically performed, so that the molding process has to be interrupted.

An object of the present invention is to solve the above-mentioned problems of the prior art and, when releasing the resin sealing portion from the mold, release the resin sealing portion and the releasing means. Accordingly, it is an object of the present invention to provide a mold releasing device for a molding die capable of reliably and completely releasing the resin sealing portion.

[0006]

In order to solve the above problems, the present invention has the following constitution. That is, in a mold releasing apparatus for a mold for releasing a molded product and a resin sealing part having unnecessary resin from the mold when the mold is opened, the mold of the resin sealing part is separated from the mold. And a second releasing means for releasing the resin sealing portion and the first releasing means.

According to the above construction, for example, when the mold is opened after the resin is sealed, the molded product and the unnecessary resin integrally molded with the molded product are provided with the first and second molds as the first releasing means. Push the ejector pins against each other and release the molded product and unnecessary resin from the cavity and resin path. Further, by abutting the third ejector pin as the second releasing means against the molded product, it is possible to release the first and second ejector pins from the molded product and the unnecessary resin. In particular, the third ejector pin has a larger protrusion amount than the first and second ejector pins when the mold is opened, so that the mold product and the unnecessary resin and the first ejector pin are reliably released from the mold. It can be carried out.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The present embodiment will be described by using a mold release device for molding a semiconductor device with resin as an example of a mold release device. FIG. 1 is an explanatory view showing the structure of a mold releasing apparatus for a mold and the releasing operation.

In FIGS. 1 and 2, reference numeral 1 denotes a lower die plate, which is fixed to, for example, a lower die chase plate (not shown) of a transfer molding apparatus. An upper die plate 2 is fixed to an upper die chase plate (not shown). In this embodiment, a resin supply mechanism described later is provided on the lower die 1 side, and the lower die plate 1 is connected to a pressing device (for example, a motor pressing device) and can be moved up and down. Therefore, the lower mold plate 1 moves up and down with respect to the upper mold plate 2 to open or close the mold.

Reference numeral 3 denotes a pot which constitutes a resin supply mechanism and is provided in the lower mold plate 1. Above pot 3
Are arranged in a line in the lengthwise direction of the lower mold 1 at predetermined intervals, and a plunger (not shown) is arranged in each pot 3 so as to be vertically slidable. Plural plungers can simultaneously perform the same operation by a plunger drive mechanism (not shown) provided on the lower die press platen side. When resin molding is performed, a thermosetting resin tablet is put into the pot 3, melted in the pot 3, and the plunger moves upward to supply the molten resin into a resin passage described later.

Reference numeral 4 denotes a cavity for accommodating a semiconductor device and molding the resin, which is recessed on the surfaces (parting surfaces) of the lower mold plate 1 and the upper mold plate 2 facing each other. Reference numeral 5 denotes a cull, which is provided on the upper mold plate 2 corresponding to the pot 3. A runner 6 is horizontally formed on the upper surface of the lower mold plate 1. Reference numeral 7 denotes a gate, which serves as a communication port from the runner 6 to each of the cavities 4. A resin path is formed by the cull 5, the runner 6, and the gate 7.

Reference numeral 8 denotes a first ejector pin as a first releasing means, which is provided so as to be able to project to a portion corresponding to the cavity 4 of the lower mold plate 1 and the upper mold plate 2. Reference numeral 9 denotes a second ejector pin as a first releasing means, which is provided so as to be able to project to a portion of the lower die plate 1 corresponding to the runner 6 constituting the resin passage. The first and second ejector pins 8 and 9 are integrally supported by a movable ejector pin plate (not shown), and the plate can be moved to protrude.
Alternatively, a coil spring, a solenoid, a piezoelectric element, or the like provided in the mold may be always biased to be able to project.

Reference numeral 10 is a third ejector pin as a second releasing means, which is mounted at a predetermined position of the upper die plate 2.
It is arranged at a position where it can abut against the lead frame 12 of the molded product 11. The third ejector pin 1
0 has a coil spring 13 coaxially built in the upper mold plate 2, and is constantly urged by the coil spring 13 so as to be able to protrude downward. The lead frame 12 is arranged so as to abut, because the upper side of the lead frame 12 is not resin-sealed, and even if the ejector pin is abutted, the resin does not adhere and the mold can be easily released. Is.

In this embodiment, the protrusion amount a from the lower mold plate 1 and the upper mold plate 2 of the first and second ejector pins 8 and 9 is 2.5 mm, and the third ejector pin 10 is
The protrusion amount b of is set to 3.5 mm, and b-a
The protrusion amount b of the third ejector pin 10 is set to increase by 1.0 mm. As a result, the molded product 11 and unnecessary resin and the first and second ejector pins 8 and 9 are formed.
It is configured to reliably release the mold. The protruding structure of the third ejector pin 10 is not limited to the coil spring 13 and may be configured to be protruded by a solenoid, a piezoelectric element, or the like.

Next, a method of resin-sealing a semiconductor device using the mold releasing device of the molding die configured as described above,
The method of releasing the resin sealing portion will be described in detail with reference to FIG. In the mold open state, a resin tablet is put into the pot 3 and the lower mold plate 1 is moved upward with the semiconductor device set on the parting surface, and the upper mold is fixed as shown in FIG. The mold is closed with the plate 2. At this time, the tips of the first and second ejector pins 8 are substantially flush with the cavity 4 and the second ejector pin 9
Of the third ejector pin 1 is substantially flush with the resin path.
The end portions of 0 are held so as to be substantially flush with the lead frame 12. In this state, when the resin tablet in the pot 3 is melted and the plunger (not shown) moves upward, the molten resin is filled from the pot 3 into the cavity 4 through the resin path including the cull 5, runner 6 and gate 7.

When the resin molding is completed and the resin is solidified, the lower mold plate 1 is moved downward to open the mold. When the lower mold plate 1 starts moving downward, as shown in FIG.
The first ejector pin 8 is projected to hit the molded product 11, the second ejector pin 9 is projected to hit the molded product cull 5, and the third ejector pin 10 is further projected to hit the lead frame 12, respectively. The molded product 11 and unnecessary resin integrated with the molded product 11 are released from the mold.

When the lower die plate 1 further moves downward and becomes larger than the protrusion amount a of the first and second ejector pins 8 and 9, these are released from the molded product 11 and the unnecessary resin, but are temporarily sealed. As shown in FIG. 1C, since the third ejector pin 10 is in contact with the lead frame 12 even if it is attached to the stop resin, the molded product 11 and the unnecessary resin remain in the first and second ejector pins 8 and 8. Release from 9 more reliably.

When the lower mold plate 1 is further moved downward, the molded product 11 and the unnecessary resin are completely separated from the upper mold plate 2 and also separated from the lower mold plate 1. It can be taken out as it is mounted on the lower mold plate 1.

The semiconductor device may be set in and taken out from the lower mold plate 1 manually or automatically by providing a dedicated loading mechanism.

According to the above construction, the molded product 11 and the unnecessary resin integrally molded with the molded product 11 are abutted against the first, second and third ejector pins 8, 9 and 10, respectively, and the molded product 11 and the unnecessary product are eliminated. The resin is released from the mold. At this time,
By making the abutting amount of the third ejector pin 10 on the molded product 11 larger than the abutting amount of the first and second ejector pins 8 and 9, the molded product 11 and the first ejector pin 8 and the second ejector pin 9 are formed. Thus, it is possible to reliably and completely release the resin from the unnecessary resin, and it is possible to provide a highly reliable mold release device for a mold die that does not cause mold release defects.

In the above-mentioned embodiment, the first, second and third ejector pins 8, 9 and 10 in which the coil springs are coaxially built in the upper die plate 2 are used as the first and second releasing means, respectively. The number and pressing structure of each ejector pin are not limited to this, and other structures may be used.

For example, as shown in FIG. 2, a first plate 14 and a second plate 15 are movably provided above the upper mold plate 2 and the upper mold chase plate 13 that holds the upper mold plate 2. The first and second ejector pins 8 and 9 on the upper die side are integrally held by the first plate 14, respectively, and the third ejector pin 10 is integrally held by the second plate 15. The first and second plates 14 and 15 have coil springs 16 and 17 respectively.
Spring mounting bolts 18 and 19 which are coaxially built into the spring mounting bolts 18 and 1, respectively.
The tip portions of 9 are fitted in the concave portions of the upper chase plate 13, respectively. The first and second plates 14, 1
5 is constantly urged downward by the coil springs 16 and 17, and the first, second and third ejector pins 8 and
The tips of 9 and 10 are held so as to protrude into the resin passages formed in the upper mold plate 2, respectively.

The first and second plates 14 and 15 are also provided.
Return pins 20 and 21 are respectively fitted in the above, and the tips of these are held so as to project downward from the parting surface of the upper mold plate 2. Therefore, the return pins 20 and 21 are in pressure contact with the lower mold plate 1 when the mold is closed, and the return pins 20 and 21 resist the biasing force of the coil springs 16 and 17 by a movable amount.
It is configured to push up the plates 14 and 15. The movable amounts c and d of the first and second plates 14 and 15 by pushing up the return pins 20 and 21 are c <d.
Is set to be

Next, the mold releasing operation of the mold releasing device for the mold will be described. The lower die plate 1 moves upward, the return pins 20 and 21 are pushed up, the first and second plates 14 and 15 are pushed upward against the biasing forces of the coil springs 16 and 17, and the upper die plate 2 and The mold is closed in between. At this time, the first and second plates 1
The tips of the first and second ejector pins 8 and 9 are held substantially flush with the cavity 4 and the tips of the third ejector pin 10 are held flush with the lead frame 12 by pushing up the screws 4 and 15. Has been done.

When the resin molding is completed and the resin is solidified, the lower mold plate 1 is moved downward and the mold is opened. When the lower die plate 1 starts to move downward, the first ejector pin 8 is projected to abut the molded product cull 5, the second ejector pin 9 is projected to abut the molded product 11, and the third ejector pin 10 is further mounted. The molded product 11 and the unnecessary resin integrated with the molded product 11 are released from the upper mold plate 2 by protruding and abutting against the lead frame 12, respectively.

When the lower die plate 1 further moves downward and becomes larger than the protruding amount of the first and second ejector pins 8 and 9, that is, the movable amount c of the first plate 14, these tip surfaces are molded products. Although it is separated from the mold 11, even if it adheres to the sealing resin, the protrusion amount of the third ejector pin 10,
That is, since the movable amount d of the second plate 15 is large, the third ejector pin 10 is in contact with the lead frame 12, so that the molded product 11 has the first and second ejector pins 8 and 8.
Release from 9 more reliably.

When the lower mold plate 1 is further moved downward, the molded product 11 and the unnecessary resin are completely separated from the upper mold plate 2 and also separated from the lower mold plate 1. It can be taken out as it is mounted on the lower mold plate 1.

In the above embodiment, the structure using the first and second plates with the coil spring built in on the upper die side is adopted, but instead of this, an external drive mechanism (for example, a cylinder drive mechanism or a solenoid) is used. (The driving mechanism etc.) 22 movably holds the first and second plates 14 and 15, and changes the movable amount of the first and second plates 14 and 15 at the time of mold opening to change the molded product 11 and unnecessary resin. It is also possible to surely perform the mold release from the mold and the mold product 11 and the first and second ejector pins 8 and 9.

Although various preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and many modifications can be made without departing from the spirit of the invention. Of course. For example, the resin supply mechanism may be provided on the upper mold side, and the molding die for molding the molded product may be a double-sided mold as in this embodiment, or may be a single-sided mold such as BGA (ball / grid / array). It can be used for molding. Further, when there is no ejector pin in the cavity (molded part), for example, single-sided mold such as BGA, when it is not possible to provide an ejector pin in the cavity, for example, when the cavity is small even in double-sided mold, etc. In the above, since the unnecessary resin portion and the ejector pin are released from each other, the configuration of the present invention can be applied.

[0030]

EFFECTS OF THE INVENTION When the mold releasing device of the present invention is used, the first and second mold releasing means are abutted against the molded product and the unnecessary resin integrally molded with the molded product to seal the resin. Part is released from the mold. At this time, the abutting amount of the second releasing means with respect to the molded product is set to be larger than the abutting amount of the first releasing means, so that the resin sealing portion and the first releasing means can be released reliably and completely. Therefore, it is possible to provide a mold releasing apparatus for a mold die which is highly reliable and does not cause mold release failure.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a configuration and a releasing operation of a releasing apparatus for a mold die.

FIG. 2 is an explanatory diagram of a mold releasing device of a mold according to another example.

FIG. 3 is an explanatory view of a conventional mold releasing device for a mold die.

[Explanation of symbols]

1 Lower mold plate 2 Upper mold plate 3 pots 4 cavities 5 cal 6 runners 7 gates 8 First ejector pin 9 Second ejector pin 10 Third ejector pin 11 molded products 12 lead frame 13 Upper model chase plate 14 First plate 15 Second plate 16,17 Coil spring 18, 19 Spring mounting bolt 20,21 Return pin 22 External drive mechanism

Claims (4)

(57) [Claims] 1. A mold releasing apparatus for a mold for releasing a molded product and a resin sealing part having an unnecessary resin from the mold when the mold is opened, comprising: A first mold releasing means for releasing the mold from the mold; and a second mold releasing means for releasing the resin sealing portion and the first mold releasing means. Mold releasing device for mold. 2. The mold release of the resin sealing portion and the first mold release unit by the second mold release unit having a larger protrusion amount than the first mold release unit when the mold is opened. The mold releasing apparatus for a mold according to claim 1, wherein 3. The mold according to claim 2, wherein the second mold releasing means abuts against a molded article of a semiconductor device to separate the resin sealing portion from the first mold releasing means. Mold release device. 4. The mold is opened by integrally supporting the first mold releasing means on a movable first plate and integrally supporting the second mold releasing means on a movable second plate. 2. When performing, the mold release between the resin sealing portion and the first mold release means is performed by making the move amount of the second plate larger than the move amount of the first plate. Mold releasing device for mold.