JP2005026267A - Resin-sealing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin-sealing device from which a remaining resin can be removed easily and surely by freely setting gaps among molds as necessary even when the molds are three-plate type molds. <P>SOLUTION: A fixed mold 5, a first movable mold 6, and a second movable mold 7 are successively disposed in this order in connectable and separable states. An electronic component mounted on a substrate 40 is sealed with a resin M by pinching the substrate 40 by means of the first and second movable molds 6 and 7 and packing the resin M in a cavity. At the time of sealing the component with the resin M, the first and second movable molds 6 and 7 can be driven and controlled independently. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin-sealing device for resin-sealing an electronic component mounted on a substrate using a three-plate mold.
[0002]
[Prior art]
Conventionally, as a resin sealing device, there is one provided with a pair of molds and a molding plate (for example, see Patent Document 1). In this apparatus, in a state where the mold is clamped, the mold is moved to form a gap between the molded plate and the remaining resin is removed. When the mold is further moved, only the other mold continues to move by the guide pins connecting one mold and the molding plate, and the mold is opened. Thereby, the molded product can be taken out.
[0003]
In addition, as another resin sealing device, there is one provided with a lower mold, an intermediate mold, and an upper mold (for example, see Patent Document 2). In this apparatus, after the intermediate mold is mounted on the lower mold, the upper mold is moved and clamped, and when the molding is completed, the upper mold is opened and the intermediate mold is detached.
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 7-304077
[Patent Document 2]
JP 9-48041 A
[0005]
[Problems to be solved by the invention]
However, in the former resin sealing device, the stationary platen, the movable platen, and the molded plate are not configured to be driven independently. Therefore, the distance between adjacent members cannot be freely changed, and it is difficult to remove the residual resin.
[0006]
Further, in the latter resin sealing device, when the intermediate mold is attached / detached, a device for carrying in / out the intermediate mold is required separately from the resin sealing device.
[0007]
Therefore, the present invention provides a resin sealing device that can easily and surely remove residual resin by setting a gap between the molds as needed even if it is a three-plate mold. The issue is to provide.
[0008]
[Means for Solving the Problems]
According to the present invention, as a means for solving the above-described problems, the fixed-side mold, the first movable-side mold, and the second movable-side mold are sequentially arranged so as to be able to contact and separate from each other. The substrate is sandwiched between the movable mold or the first movable mold and the second movable mold, and the cavity is filled with resin so that the electronic component mounted on the substrate is sealed with resin. In the resin sealing device
The first movable side mold and the second movable side mold can be independently driven and controlled.
[0009]
With this configuration, the fixed mold and the first movable mold, and the distance between the first movable mold and the second movable mold can be freely and automatically changed. Therefore, the distance between the molds can be set with dimensions suitable for each work such as product removal and residual resin removal, and the workability can be greatly improved.
[0010]
A cleaning device for cleaning the mold,
When cleaning between the fixed mold and the first movable mold by the cleaning device, and when cleaning between the first movable mold and the second movable mold, between the molds. If the opening distance can be changed, it is preferable in that the cleaning device can smoothly enter between the molds without interfering with the molds, and the workability can be remarkably improved.
[0011]
A cleaning device for cleaning the mold,
The cleaning device includes a protruding member that protrudes residual resin in the pinpoint gate formed in the first movable side mold, and a suction port that communicates with an opening on the side opposite to the gate of the vertical runner that constitutes the pinpoint gate. Have
When the distance between the molds is changed so that the opening opposite to the gate of the vertical runner and the suction port of the cleaning device are in a sealed state, the residual resin is surely removed without being scattered around. Is preferable in that it becomes possible.
[0012]
The distance between the molds may be changed depending on whether the cleaning device is moved into or out of the mold, and the mold may be cleaned by the cleaning device when the distance is removed.
[0013]
If the molds can be clamped or opened in a synchronized manner, it is preferable in that the cycle time can be shortened and efficient molding can be realized.
[0014]
If the position of the first movable side mold can be adjusted manually, it is preferable in that the workability such as maintenance can be improved.
[0015]
It is preferable that the first movable mold is driven by an electric motor in that the mold can be moved smoothly with a simple and small configuration.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments according to the present invention will be described below with reference to the accompanying drawings.
[0017]
FIG. 1 shows a resin sealing device 200 according to this embodiment. In this resin sealing device 200, a fixed platen 3 and a movable platen 4 are arranged on a base 1 via four columns 2, and a fixed mold 5 and a first movable side mold are arranged on the fixed platen 3. The second movable side mold 7 is attached to the mold 6 and the movable platen 4.
[0018]
The fixed platen 3 is fixed to the upper end portion of the column 2 by bolts 2a. A servo motor 9 is attached to the side surface of the fixed platen 3 via a bracket 8. A drive pulley 10 is integrated with the rotation shaft of the servo motor 9.
[0019]
As shown in FIG. 2, a fixed mold 5 is attached to the lower surface of the fixed platen 3 via spacer blocks 11 disposed on both sides. A runner 12 is formed on the lower surface of the fixed mold 5. A first ejector plate 13 and a second ejector plate 14 are disposed between the spacer blocks 11.
[0020]
The first ejector plate 13 is formed by integrating two flat plates with screws or the like. As shown in FIGS. 5 and 10, the bottom surface of the concave portion 13a formed at four locations on the center line in the longitudinal direction is provided. A first stopper member 90 is disposed so as to penetrate therethrough. The upper end portion and the lower end side of the first stopper member 90 are respectively formed with flange portions 90 a and 90 b, and the lower end portion is fixed to the stationary mold 5. A spring 91 is disposed in the recess 13a, and the first ejector plate 13 is urged downward. The first ejector plate 13 is provided with a first return pin 15 penetrating the stationary mold 5 and a runner lock pin 16 is disposed so as to be movable up and down. The runner lock pin 16 is formed with a flange 16 a on the upper end side and is urged upward by a spring 13 c disposed in the housing recess 13 b of the first ejector plate 13. Further, the runner lock pin 16 is formed with a retaining portion 16b at the lower end portion, and can protrude from a resin passage portion that forms a runner or a cull of the fixed mold 5. The retaining portions 16 b are formed in a substantially V-shaped groove shape, and are all arranged in the same direction, that is, in a direction in which a cleaning unit 201 described later enters the resin sealing device 200. In FIG. 5, for the sake of explanation, the retaining portion 16 b is illustrated as opening in the shape of a groove toward the right side. However, the release direction and shape of the retaining portion 16b are not limited as long as unnecessary resin can be recovered by horizontal movement of the resin recovery plate 60.
[0021]
The second ejector plate 14 has a substantially frame shape, and is located around the first ejector plate 13 as shown in FIG. In the recesses 14a formed at the four corners of the second ejector plate 14, as shown in FIG. 7, similarly to the first stopper member 90, a second stopper member 92 having flanges 92a and 92b is fixed. The second ejector plate 14 is urged downward by a spring 93 disposed in the recess 14a. In the vicinity of each second stopper member 92, a second return pin 17 that penetrates the fixed mold 5 and the first movable mold 6 is provided. At four locations around each runner lock pin 16 disposed along both side surfaces of the second ejector plate 14, ejector rods 18 are disposed so as to be slidable within the fixed mold 5. . The ejector rod 18 penetrates the fixed mold 5 and the tip is located in the first movable mold 6.
[0022]
As shown in FIG. 1, a support base 19 and a nut plate 20 are provided on the upper surface of the fixed platen 3. A ball screw 21 is rotatably supported between the upper surface portion of the support base 19 and the fixed platen 3. A driven pulley 22 is integrated with the upper end of the ball screw 21. A timing belt 23 is stretched between the driven pulley 22 and the driving pulley 10. As a result, the power from the servo motor 9 is transmitted to the ball screw 21.
[0023]
The nut plate 20 is configured such that the ball screw 21 is screwed into a nut 24 provided at a central portion, and the nut plate 20 is moved up and down by the rotation of the ball screw 21. The nut plate 20 passes through the fixed platen 3, the spacer block 11, and the fixed side mold 5, and is connected to the first movable side mold 6 by a connecting rod 25 guided by a sliding member (not shown) so as to be movable up and down. It is connected. Therefore, the first movable mold 6 is moved up and down together with the nut plate 20 by driving the servo motor 9.
[0024]
As shown in FIG. 2, the first movable-side mold 6 is formed with an opening 26 at the center, and the position corresponding to each runner lock pin 16 disposed along both side surfaces of the first ejector plate 13. A vertical runner 27 is formed on the top. Further, on the lower surface of the first movable mold 6, a molding recess 28 is formed which forms a cavity with one surface of the substrate 40 sandwiched between the movable molds when the mold is clamped. A lower end opening of the vertical runner 27, that is, a pinpoint gate 29 is opened in the molding recess 28. Further, as shown in FIG. 7, the ejector pin 30 can appear and disappear in the molding recess 28. The ejector pin 30 is urged upward by a spring 30a and is pushed down by the ejector rod 18.
[0025]
As shown in FIG. 1, the movable platen 4 is slidably provided on the column 2, and is moved up and down by driving of a driving device 32. In other words, when the driving device 32 is driven, the moving member 33 moves up and down via the ball screw 31. Then, the movable platen 4 is moved up and down through the plurality of links 34 by the lifting and lowering operation of the moving member 33 (see, for example, JP 2000-37746 A for a mechanism for moving the movable platen 4 up and down).
[0026]
Further, the movable platen 4 is provided with a plunger device 211 so as to be movable up and down. The plunger device 211 has a structure in which a long plate 216 is disposed at the lower end thereof and is detachable. Further, a screw portion 214 is fixed to the plate 216. A nut 213 is screwed into the screw portion 214. The nut 213 is rotated via a pulley and a belt by driving of the driving device 212. Therefore, the plunger device 211 moves up and down by driving the drive device 212.
[0027]
A second movable side mold 7 is disposed on the upper surface of the movable platen 4 via a second spacer block 35. As shown in FIG. 2, a material supply recess 36 for supplying the resin material M is formed at the center of the second movable mold 7. The bottom surface of the material supply recess 36 is constituted by the upper surface of the plunger tip 37 engaged with the tip of the plunger device 211. In addition, a recess 7 a in which the substrate 40 is disposed is formed on the upper surface of the second movable-side mold 7. In the recess 7a, positioning pins 38 are provided so as to project through positioning holes (not shown) of the substrate 40 to position the substrate 40.
[0028]
A substrate 40 and a resin material M are supplied between the first movable side mold 6 and the second movable side mold 7 by the inloader unit 39 shown in FIG. The substrate 40 is clamped by moving the movable platen 4 and is resin-sealed with the resin material M as described later.
[0029]
The inloader unit 39 includes a plurality of substrate holding portions 41 that hold a substrate 40 on which an electronic component such as a semiconductor chip is mounted in advance, and a resin material holding portion 42 that holds a resin material M. The substrate holding part 41 is configured to open and close a pair of holding arms 45 by an actuator 44 provided in the unit main body 43. The side edge of the substrate 40 is supported by the holding piece 46 at the tip of the holding arm. The resin material holding portion 42 includes an accommodation recess 47 in which the resin material M is accommodated and a shutter 48 that closes the accommodation recess 47. When an electric motor (not shown) is driven, the inloader unit 39 moves in the horizontal direction by a guide mechanism (not shown) and is positioned inside and outside the mold.
[0030]
The fixed mold 5 and the first movable mold 6 are cleaned by the cleaning unit 201 shown in FIGS.
[0031]
The cleaning unit 201 includes an upper wall portion 50 and a lower wall portion 51 that face each other at a predetermined interval.
[0032]
As shown in FIG. 14, the upper wall portion 50 is provided with a first suction portion 52 and a second suction portion 53. As shown in FIG. 13, the first suction part 52 is vertically partitioned by a partition wall 54, and is located at a first suction passage 55 located on one side of the upper wall part 50 and a lower part of the upper wall part 50, A suction chamber 57 having a plurality of suction ports 56 formed on the lower surface is formed. Each suction port 56 is provided at a position corresponding to each vertical runner 27 of the first movable mold 6. The first suction passage 55 and the suction chamber 57 communicate with each other at the tip, and the partition wall 54 is gradually inclined upward as it approaches the communication portion. Thereby, air can flow smoothly from the suction chamber 57 to the first suction passage 55. As shown in FIG. 14, the second suction part 53 includes a second suction passage 58 located on the opposite side of the upper wall part 50 from the first suction part 52. In the suction passages 55 and 58 of the suction portions 52 and 53, guide tube portions 59 that communicate with a suction device (not shown) are respectively disposed. For this reason, even if the cleaning unit 201 reciprocates as described later, the communication state between the suction passages 55 and 58 and the suction device is maintained via the guide tube portion 59 regardless of the difference in position. . Further, as shown in FIG. 16, each guide tube portion 59 is formed with openings 87 and 88 that are opened and closed by a damper 86 on the lower surface on one end side. Thereby, if the damper 86 is rotated to the position A, the suction can be performed from the suction port 56 via the first suction part 52, and if the damper 86 is rotated to the position B, the second suction part 53 is interposed. Then, suction can be performed from the brushing portion 67. That is, it becomes possible to share the suction device by switching the flow path.
[0033]
Further, as shown in FIGS. 12 and 14, a resin recovery plate 60 is disposed on the upper surface portion of the upper wall portion 50. The resin recovery plate 60 is supported by a linear bush 98 slidably on a shaft portion 97 protruding from the four corners of the lower surface. Then, as shown in FIG. 12, by driving the actuator 62, the rotating plate 95 rotates about the support shaft 95a via the rod 62a, and the elevating member 96 moves up and down. Thereby, the resin collection | recovery plate 60 raises / lowers. On the upper surface of the resin recovery plate 60, a conical resin recovery recess 61 capable of holding a portion corresponding to each vertical runner 27 of unnecessary resin described later is formed.
[0034]
On the other hand, as shown in FIG.12 and FIG.13, the protrusion plate 63 is provided in the lower wall part 51 so that raising / lowering drive is possible. The protruding plate 63 includes a support plate 100 and a holding plate 101. As for the support plate 100, the shaft part 102 and the stopper volt | bolt 104 protrude from the lower surface four corners. The shaft portion 102 is supported by a linear bush 103 provided on the lower wall portion 51 so as to be movable up and down. The stopper bolt 104 penetrates the lower wall portion 51 and can come into contact with a part of the second movable side mold 7 (excluding the resin molding portion). Thereby, when the movable platen 4 is moved up and down, the support plate 100 can be moved up and down via the stopper bolt 104. In the holding plate 101, like the support plate 100, the shaft portion 105 protruding from the four corners of the lower surface can be moved up and down by a linear bush 106 provided on the support plate 100 and is elastically supported by a spring 107. The holding plate 101 is formed with a convex portion 108 at the center of the side edge. Each convex portion 108 is engaged with the concave portion 6a of the first movable mold 6 and aligns both the members 101 and 6. The support plate 100 is provided with gate protrusion pins 64 at positions corresponding to the pinpoint gates 29. The gate protruding pin 64 penetrates the holding plate 101 and protrudes and protrudes upward as the holding plate 101 moves up and down.
[0035]
As shown in FIGS. 11 and 12, the cleaning unit 201 is provided with a brushing portion 67 at the tip of the upper wall portion 50. As shown in FIG. 15A, the brushing portion 67 includes a first roller brush 65 that is rotatably disposed in the first cover 69 and a second roller brush 66 that is rotatably disposed in the second cover 73. And. As illustrated in FIG. 15C, the first roller brush 65 rotates via the coupling 71, the bevel gear 72 a, the gears 72 b and 72 c, and the belt 121 by driving the electric motor 70. Further, the first roller brush 65 rotates to the horizontal retracted position shown in FIG. 15B and the vertical cleaning position shown in FIG. 15A by driving the rotary actuator 120 and turning the arm 68. Is positioned. The first cover 69 is formed with a suction port 69 a that opens upward and a communication port 69 b that communicates with the communication port 74 a of the third cover 74 in a vertical position. The third cover 74 is in communication with the second suction passage 58. On the other hand, the second roller brush 66, like the first roller brush 65, drives the electric motor 70 to drive the coupling 71, bevel gear 72a, gear 72b, and belt 123 as shown in FIG. 15C. Rotate through. The brushing unit 67 collects residual resin scraped by the brushes 65 and 66 through the second suction passage 58 by driving a suction device (not shown).
[0036]
As shown in FIG. 14, the cleaning unit 201 has slide guides 75 fixed to both side surfaces thereof. The slide guide 75 is slidably guided by a ridge 77 provided on a side wall 76 standing from a base or the like. As shown in FIGS. 11 and 12, the cleaning unit 201 is configured such that the ball screw 78 is screwed into the nut 110, the electric motor 79 is driven, and the ball screw 78 is rotated via the pulley 80 and the belt 81. It reciprocates along the ridge 77.
[0037]
As shown in FIG. 17, the substrate 40 sealed with resin by the unloader unit 82 is taken out between the first movable mold 6 and the second movable mold 7.
[0038]
The unloader unit 82 is provided with a roller brush 83 at the tip and a holding arm 84 at the bottom. The unloader unit 82 reciprocates in the horizontal direction by driving the electric motor 85.
[0039]
Next, the operation of the resin sealing device 200 will be described.
[0040]
(Supply Processing) As shown in FIGS. 1 and 2, by driving the driving device 32, the movable platen 4 is lowered to a position where the inloader unit 39 can enter. Further, by driving the servo motor 9, the first movable mold 6 is moved to the vicinity of the fixed mold 5.
[0041]
In addition, the resin material M is accommodated in the accommodation recess 47 of the inloader unit 39 from the material supply unit (not shown), and the substrate 40 is held on the holding piece 46 of the holding arm 45 from the substrate alignment unit (not shown). Then, the inloader unit 39 is moved to a predetermined position in the resin sealing device 200 and the second movable mold 7 is raised. The second movable side mold 7 stops when the positioning pin 38 of the second movable side mold 7 is inserted into the positioning hole of the substrate 40 and opens the holding arm 45. As a result, the substrate 40 is supplied to the upper surface of the second movable mold 7. At this time, since the housing recess 47 is positioned above the material supply recess 36 of the second movable-side mold 7, the shutter 48 is opened and the resin material M is supplied to the material supply recess 36.
[0042]
When the supply of the substrate 40 and the resin material M is completed, the second movable mold 7 is lowered, the inloader unit 39 is moved in the horizontal direction, and is retracted from the resin sealing device 200.
[0043]
(Resin sealing process) Then, the drive device 32 is driven and the movable platen 4 is raised. As shown in FIG. 3, the raised second movable-side mold 7 abuts on the first movable-side mold 6 and sandwiches the supplied substrate 40. A cavity is formed by the upper surface of the substrate 40 and the molding recess 28 of the first movable-side mold 6, and the electronic component mounted on the substrate 40 is located in the cavity. At this time, the servo motor 9 is set free (no load state), and the first movable side mold 6 is set so as to freely move up and down. As a result, the second movable side mold 7 continues to rise together with the first movable side mold 6, comes into contact with the fixed side mold 5, and then a predetermined pressure is applied to complete the mold clamping.
[0044]
When the mold clamping is completed, the driving device 212 is then driven and the plunger tip 37 is raised. As a result, the resin material M in the material supply recess 36 is melted and pressurized in a mold maintained at a high temperature. As shown in FIG. 4, the extruded molten resin flows through the runner 12 of the fixed mold 5 and is filled into the cavity from the vertical runner 27 of the first movable mold 6 through the pinpoint gate 29. The
[0045]
When the filled resin is thermally cured and the electronic components mounted on the substrate 40 are sealed, the driving devices 32 and 9 are driven to drive the first movable mold 6 and the first mold as shown in FIG. 2 Lower the movable mold 7 integrally. At this time, the cured resin of the runner 12 of the fixed mold 5 and the vertical runner 27 of the first movable mold 6 is prevented by the retaining portion 16 b of the runner lock pin 16. For this reason, stress concentrates on the resin located at the pinpoint gate 29, and here, the resin that seals the surface of the substrate 40 and the resin of the runner portion are separated. The substrate 40 is lowered together with the first movable side mold 6 and the second movable side mold 7, and unnecessary resin in the runner portion remains in the fixed side mold 5.
[0046]
When the first movable mold 6 is lowered by a predetermined dimension, the first movable mold 6 is stopped, and only the second movable mold 7 is lowered. Then, the second movable side mold 7 is further lowered by a predetermined dimension. During this time, the return pin 17 is in contact with the second movable mold 7 by the urging force of the spring 93. Therefore, as shown in FIGS. 7 and 8, the second ejector plate 14 descends and causes the ejector pin 30 to protrude downward via the ejector rod 18. As a result, the resin sealing portion is pressed by the ejector pins 30, and the substrate 40 is reliably lowered together with the second movable side mold 7 without remaining in the first movable side mold 6. At this time, the substrate 40 is positioned by the positioning pin with the second movable mold 7.
[0047]
The first movable mold 6 and the second movable mold 7 are further lowered, and the second movable mold 7 is moved to the lowest position (initial position) as shown in FIG. Further, the first movable mold 6 is moved to a substantially intermediate position between the fixed mold 5 and the second movable mold 7 that has moved to the lowest position. Unnecessary resin remaining in the stationary mold 5 is separated from the stationary mold 5 by causing the runner lock pin 16 to protrude by the biasing force of the spring 91 that contacts the first ejector plate 13.
[0048]
(Cleaning Process) When the mold is opened, the cleaning unit 201 is moved into the mold so that the first movable mold 6 is positioned between the upper wall portion 50 and the lower wall portion 51, and FIG. As shown to (a), it stops at predetermined position (alpha) (position which made the centerline of the resin collection | recovery recessed part 61 of the resin collection | recovery plate 60 correspond to the centerline C1 of the runner lock pin 16). 18B, the actuator 62 is driven to raise the resin recovery plate 60, and the resin recovery recess 61 holds the portion corresponding to the unnecessary resin vertical runner 27. In this state, as shown in FIG. 18C, the cleaning unit 201 is moved horizontally to a predetermined position β (a position where the center line C1 of the gate protruding pin 64 is aligned with the center line C1 of the runner lock pin 16). Stop. Thereby, the unnecessary resin held on the runner lock pin 16 is released and held on the resin recovery plate 60.
[0049]
Next, at the predetermined position β, the first movable mold 6 is raised, and the upper surface of the second movable mold 6 is brought into close contact with the opening edge of the suction port 56. Then, a suction device (not shown) is driven to start suction through the suction port 56. Subsequently, the movable platen 4 is raised, and the protruding plate 63 is raised via the stopper bolt 104 as shown in FIG. The holding plate 101 is positioned in contact with the lower surface of the first movable mold 6 and the gate protruding pin 64 is inserted into the pinpoint gate 29, so that the resin waste remaining on the pinpoint gate 29 is contained in the vertical runner 27. Stick out. At this time, as shown in FIG. 16, the damper 86 is rotated to the position A, and driving of a suction device (not shown) is started. Thereby, the protruding resin waste is discharged from the suction port 56 through the suction part 52. If a cushioning material such as rubber or resin is provided at the opening edge of the suction port 56, it is possible to enhance the adhesion and improve the suction performance.
[0050]
When the cleaning of the mold by the cleaning unit 201 is thus completed, the first movable mold 6 is slightly lowered and the second movable mold 7 is moved to the lowest position (initial position). Then, the first roller brush 65 is rotated to the cleaning position shown in FIG. 15A. Subsequently, the first roller brush 65 and the second roller brush 66 are driven to rotate and a suction device (not shown) is driven. Further, the cleaning unit 201 is retracted from the resin sealing device 200. As a result, the first roller brush 65 and the second roller brush 66 scrape dirt and residual resin debris attached to the surfaces of the stationary mold 5 and the first movable mold 6 from the suction ports 69a and 73a. It is removed via the second suction passage 58. Note that the contact position of the second roller brush 66 with the mold surface may be adjusted by the raising / lowering position of the first movable mold 6. For example, if the second roller brush 66 is worn due to continuous use, the first movable side mold 6 is raised, and the second roller brush 62 is adjusted so that it can properly slide in contact with the surface of the first movable side mold 6. do it.
[0051]
(Removal process) If unnecessary resin is removed from the mold, the servo motor 9 is driven as shown in FIG. 17, and the first movable mold 6 is moved to the vicinity of the fixed mold 5 (position in the figure). (Indicated by D.) Then, the unloader unit 82 is moved between the first movable side mold 6 and the second movable side mold 7 and stopped at a predetermined position. Subsequently, the second movable-side mold 7 is further lowered, and an ejector plate provided in the second movable-side mold 7 is pressed by an ejector rod (not shown) fixed to the base 1, and the substrate 40 is interposed via the ejector pins. Extrude In this state, the unloader part 215 is lowered and the extruded substrate 40 is held. Thereafter, the unloader portion 215 is raised to the original position, the unloader unit 82 is retracted from the mold, and the lower surface of the first movable side mold 6 and the second movable side are removed by the roller brush 83 disposed at the tip. The upper surface of the mold 7 is cleaned.
[0052]
Hereinafter, similarly, a series of molding cycles including a supply process, a resin sealing process, a cleaning process, and a removal process are repeated.
[0053]
In the resin sealing device 200, cleaning processing is performed in each molding cycle, but periodic manual cleaning is indispensable.
[0054]
In this case, the resin sealing device 200 is put into a resting state, and the positions of the first movable side mold 6 and the second movable side mold 7 are first moved manually, and the first movable side mold 6 is moved to the fixed side mold. Contact the mold 5. Then, the lower surface of the first movable mold 6 and the upper surface of the second movable mold 7 are cleaned. When this cleaning is completed, the first movable mold 6 is moved to the vicinity of the second movable mold 7 and a gap is formed between the first movable mold 6 and the fixed mold 5. . Thereby, a gap similar to the case where the first movable side mold 6 and the second movable side mold 7 are cleaned can be formed between the first movable side mold 6 and the fixed side mold 5. The upper surface of the first movable mold 6 and the lower surface of the fixed mold 5 can be cleaned with high work efficiency.
[0055]
In the embodiment, the servo motor 9 is free (no load state) when the movable platen 4 is raised, but before the second movable side mold 7 comes into contact with the first movable side mold 6, the servo motor 9 may be driven to raise the first movable mold 6 in advance. As a result, the movable molds 6 and 7 can be operated at a higher speed, and the cycle time can be shortened to increase the molding efficiency.
[0056]
Moreover, in the said embodiment, although the 1st movable side metal mold | die 6 was raised / lowered by the drive of the servomotor 9, it is good also as raising / lowering operation | movement by other mechanisms, such as a cylinder.
[0057]
【The invention's effect】
As is clear from the above description, according to the present invention, the first movable side mold and the second movable side mold can be independently driven and controlled, so that the operation of each movable side mold can be freely performed. It can be set, and the distance between the molds can be freely and automatically changed. Therefore, the cycle time can be shortened and workability can be greatly improved.
[Brief description of the drawings]
FIG. 1 is a front view showing an outline of a resin sealing device according to an embodiment.
2 is a partial cross-sectional view showing a state in which a substrate and a resin material are supplied to the resin sealing device of FIG. 1 by an inloader unit.
FIG. 3 is a partial cross-sectional view showing a state in which mold clamping is started after a substrate and a resin material are supplied to the resin sealing device of FIG. 1;
4 is a partial cross-sectional view showing a state where mold clamping and resin filling of the resin sealing device of FIG. 1 are completed.
5 is a cross-sectional view showing a state where the resin at the pinpoint gate portion is cut immediately after the mold opening of the resin sealing device of FIG. 1 is started.
6 is a partially enlarged view of FIG. 5;
7 is a partial cross-sectional view showing a state in which the mold is further opened from the state shown in FIG. 5 and a molded product is protruded with an ejector pin. FIG.
FIG. 8 is a partially enlarged view of FIG. 7;
9 is a front cross-sectional view showing a state where the mold is completely opened after the resin sealing device of FIG. 1 is molded.
FIG. 10 is a plan view of first and second ejector plates.
FIG. 11 is a side view schematically showing a resin sealing device and a cleaning unit.
FIG. 12 is a partial cross-sectional view showing a state where residual resin is removed from a vertical runner portion in the resin sealing device.
FIG. 13 is a partial cross-sectional view showing a state in which resin waste remaining in the vertical runner is removed by the cleaning unit.
FIG. 14 is a perspective view of the cleaning unit with a brushing portion removed.
FIG. 15A is a partial cross-sectional view showing a state when the cleaning unit is retracted from the resin sealing device.
FIG. 15B is a partial cross-sectional view showing a state when the cleaning unit is made to enter the resin sealing device.
FIG. 15C is a plan sectional view showing a drive mechanism of the cleaning unit.
FIG. 16 is a schematic cross-sectional view showing a mechanism for switching each guide tube portion to a suction device.
FIG. 17 is a schematic front view showing a resin sealing device and an unloader unit.
FIG. 18 is a schematic explanatory diagram showing the order in which the residual resin in the vertical runner portion of the resin sealing device is removed by the cleaning unit.
[Explanation of symbols]
1 ... Base
2 ... post
2a ... Bolt
3 ... fixed platen
4 ... Moveable platen
5 ... Fixed side mold
6, 7 ... movable side mold
6a ... recess
8 ... Bracket
9. Servo motor
10 ... Drive pulley
11 ... Spacer block
12 ... Runner
13 ... 1st ejector plate
13a ... recess
13b ... Containing recess
13c ... Spring
14 ... Second ejector plate
14a ... recess
15 ... 1st return pin
16 ... Runner lock pin
16a ... buttocks
16b ... retaining part
17 ... Second return pin
18 ... Ejector rod
19 ... Support stand
20 ... Nut plate
21 ... Ball screw
22 ... driven pulley
23 ... Timing belt
24 ... Nut
25 ... Connecting rod
26 ... opening
27 ... Vertical runner
28: Recess for molding
29 ... Pinpoint gate
30 ... Ejector pin
30a ... Spring
31 ... Ball screw
32 ... Drive device
33 ... Moving member
34 ... Link
35 ... Spacer block
36 ... Material supply recess
37 ... Plunger tip
38 ... Positioning pin
39 ... Inloader unit
40 ... Board
41 ... Substrate holder
42. Resin material holding portion
43 ... Unit body
44 ... Actuator
45 ... Holding arm
46 ... holding piece
47. Containing recess
48 ... Shutter
50 ... Upper wall
51. Lower wall part
52, 53 ... Each suction part
54 ... Partition wall
55, 58 ... suction passage
56 ... Suction port
57 ... Suction chamber
59. Guide tube
60 ... Resin recovery plate
61 ... Resin recovery recess
62 ... Actuator
62a ... Rod
63 ... Projection plate
64 ... Gate protruding pin
65. First roller brush
66. Second roller brush
67 ... Brushing part
68 ... arm
69 ... Cover
69a ... Suction port
69b ... Communication entrance
70: Electric motor
71 ... Coupling
72a ... Bevel Gear
72b, 72c ... gear
73 ... Cover
73a ... Suction port
75 ... Slide guide
76 ... sidewall
77 ...
78 ... Ball screw
79 ... Electric motor
80 ... pulley
81 ... belt
82 ... Unloader unit
83 ... Roller brush
84: Holding arm
85 ... Electric motor
86 ... Damper
87, 88 ... opening
90 ... First stopper member
90a, 90b ... buttocks
91 ... Spring
92 ... Second stopper member
92a ... Buttocks
93 ... Spring
95 ... Rotating plate
95a ... support shaft
96 ... Lifting member
97 ... Shaft part
98 ... Linear bush
100 ... support plate
101 ... Holding plate
102 ... Shaft part
103 ... Linear bush
104 ... Stopper bolt
105 ... shaft part
106 ... Linear bush
107 ... Spring
108 ... convex portion
110 ... Nut
120: Rotary actuator
121 ... Belt
123 ... Belt
200: Resin sealing device
201 ... Cleaning unit
211 ... Plunger device
212 ... Drive device
213 ... Nut
214 ... Screw part
215: Unloader section
216 ... Plate
M ... Resin material

Claims (7)

The fixed side mold, the first movable side mold, and the second movable side mold are sequentially arranged so as to be able to contact and separate, and the fixed side mold and the first movable side mold, or the first movable side mold, In the resin sealing device in which the electronic component mounted on the substrate is sealed with resin by sandwiching the substrate with the second movable mold and filling the cavity with resin.
A resin sealing device, wherein the first movable side mold and the second movable side mold can be independently driven and controlled. A cleaning device for cleaning the mold,
When cleaning between the fixed mold and the first movable mold by the cleaning device, and when cleaning between the first movable mold and the second movable mold, between the molds. The resin sealing device according to claim 1, wherein the open distance can be changed. A cleaning device for cleaning the mold,
The cleaning device includes a protruding member that protrudes residual resin in the pinpoint gate formed in the first movable side mold, and a suction port that communicates with an opening on the side opposite to the gate of the vertical runner that constitutes the pinpoint gate. Have
The resin sealing device according to claim 1, wherein the distance between the molds is changed so that the opening portion on the opposite side of the vertical runner and the suction port of the cleaning device are sealed. The mold is cleaned by the cleaning device when the distance between the molds is changed depending on whether the cleaning apparatus enters the mold or when the cleaning apparatus is retracted. Item 4. The resin sealing device according to Item 2 or 3. The resin sealing device according to any one of claims 1 to 4, wherein the molds can be clamped or opened in a synchronized manner. The resin sealing device according to claim 1, wherein the position of the first movable-side mold can be adjusted manually. The resin sealing apparatus according to claim 1, wherein the first movable side mold is driven by an electric motor.

Images