JP2008265020A - Resin sealing device and method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain the transfer of an intermediate mold with a simple and inexpensive constitution. <P>SOLUTION: A resin sealing device comprises an upper mold 12, a lower mold 13 relatively contactable/separable with respect to the upper mold 12, and an intermediate mold 14 detachably disposed on the lower mold 13. Electronic components mounted on a substrate 9 are resin-sealed by holding the substrate 9 between the lower mold 13 and the intermediate mold 14 and casting the resin into a cavity formed by the substrate 9 placed on the lower mold 13 and a recess 27 of the intermediate mold 14. The resin sealing device is equipped with a transfer means for transferring the lower mold 13 to a molding position opposing to the upper mold 12, and a non-molding position moved to the side part, and a control means 46 which drives and controls the transfer means in such a state that the intermediate mold 14 is placed on the lower mold 13 after molding at the molding position, and conveys the intermediate mold 14 and the lower mold 13 to the non-molding position. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a resin sealing device and a resin sealing method.

  Conventionally, as a resin sealing device, an intermediate mold that is not mechanically coupled to the upper mold and the lower mold is separated between the molds by an intermediate mold transfer hand, and an intermediate mold cleaning unit and an intermediate mold preheating unit provided separately. The structure which enabled conveyance to each unit of these etc. is disclosed (for example, refer patent document 1).

JP 2002-334893 A

  However, in the conventional resin sealing device, a medium-sized transport hand is essential for medium-sized transport. Moreover, it is necessary to provide a plurality of units separately from the mold. For this reason, there exists a problem that an apparatus will enlarge and a component part will increase and it will raise a cost.

  Then, this invention makes it a subject to provide the resin sealing apparatus and the resin sealing method which can implement | achieve transfer of an intermediate metal mold | die by a simple and cheap structure.

As a means for solving the above problems, the present invention provides:
An upper die, a lower die that can be moved toward and away from the upper die, and an intermediate die that is detachably disposed on the lower die, the lower die and the intermediate die Resin sealing that holds the substrate between the molds and fills the resin formed in the substrate with resin by filling the resin formed in the cavity formed by the lower mold and the intermediate mold A device,
Transfer means for transferring the lower mold to a molding position facing the upper mold and a non-molding position moved laterally;
After the molding at the molding position, with the intermediate mold placed on the lower mold, the transfer means is driven and controlled, and the intermediate mold and the lower mold are transported to the non-molding position,
It is equipped with.

  With this configuration, when resin sealing of the electronic component mounted on the substrate is completed, the intermediate mold can be placed on the lower mold and transferred to the non-molding position on the side, so that the substrate can be taken out, etc. It is possible to easily perform the work. In addition, since the intermediate mold can be transferred in a state of being placed on the lower mold, it is possible to equip existing equipment at low cost without complicating the structure or requiring an expensive configuration. be able to.

The intermediate mold includes a recess that constitutes a part of the cavity, and a gate portion that communicates with the recess.
The upper mold includes a pot portion to which a resin material is supplied, and a plunger chip that pushes the resin material supplied to the pot portion to the gate portion,
The plunger tip includes a connecting portion that forms a connected state with the solidified resin by solidifying the resin in the gate portion,
It is preferable that the connecting portion causes the resin in the gate portion to be detached from the intermediate mold when the plunger tip moves up in the pot portion.

Further, instead of providing a connecting portion on the plunger tip, the pot portion includes an engaging portion that forms an engaging state with the solidified resin by solidifying the resin in the gate portion,
The engaging portion may cause the resin in the gate portion to be separated from the intermediate die by lowering the lower die from the closed state.

  With these configurations, the resin in the gate portion can be removed in advance at the molding position, and the intermediate mold can be transferred to the non-molding position with only the resin-sealed portion remaining. Become. Therefore, in the non-molding position, it is only necessary to remove and carry out the substrate, and the configuration can be simplified.

In the non-molding position where the lower mold and the intermediate mold are transferred by the transfer means, a substrate transfer position where the substrate is carried in and out of the lower mold, and the molded substrate is detached from the intermediate mold. Including separation position,
At the separation position, a separation device for separating the molded substrate from the intermediate mold is provided,
It is preferable that the separation device includes a holding unit that holds the intermediate mold and a detachment unit that releases the molded substrate from the intermediate mold held by the holding unit.

  With this configuration, when the resin sealing is completed at the molding position, the intermediate mold can be transported to the separation position while being placed on the lower mold, and the substrate can be detached from the intermediate mold by the separation device. Since it is only necessary to add a transfer means and a separation device to the existing equipment, it is possible to cope with a low cost. In addition, the separation device can have a simple configuration including only a holding means for holding the intermediate mold and a detaching means for detaching the substrate from the intermediate mold.

The intermediate mold is provided with an ejector pin for releasing the resin solidified in the recess from the recess,
It is preferable that the detaching means of the separating device includes an extrusion pin that detaches the molded substrate from the intermediate mold by pressing the ejector pin.

  With this configuration, when the extrusion pin is operated in a state where the intermediate mold is held by the holding means, the ejector pin is pressed, the resin-sealed portion can be detached from the recess, and the substrate can be removed from the intermediate mold. Become.

  The lower mold preferably includes a heating unit capable of heating the intermediate mold even during transfer by the transfer unit.

  With this configuration, since the intermediate mold can be heated even during the transfer, it is possible to smoothly shift to the molding process. Moreover, it is not necessary to provide a separate facility for heating the intermediate mold, and the facility cost can be reduced.

First cleaning means for cleaning the upper mold at the molding position;
A second cleaning means for cleaning the lower mold at the substrate transfer position;
A third cleaning means for cleaning the intermediate mold at the separation position;
Is preferably further provided.

Further, the present invention provides a means for solving the above-described problems,
In a resin sealing device comprising an upper mold and a lower mold that can be opened and closed relatively, and an intermediate mold disposed between both molds, the lower mold and the intermediate mold are formed. A resin sealing method in which an electronic component mounted on a substrate held by the lower mold and the intermediate mold is resin-sealed by filling a resin in a cavity,
The intermediate mold is provided separately from the upper mold and the lower mold,
After molding at the molding position,
A first transfer step of transferring the intermediate mold from a molding position facing the upper mold to a side separation position while being placed on the lower mold;
A separation step of separating the intermediate mold from the lower mold transferred to the separation position, and detaching the substrate after molding from the intermediate mold and placing it on the lower mold,
A second transfer step of transferring the lower mold on which the substrate is placed to the substrate transfer position in the separation step;
An unloading step of unloading the substrate from the lower mold transferred to the substrate transfer position;
Is included.

A third transfer step of unloading the molded substrate at the substrate transfer position and transferring the unmolded substrate to the separation position;
A placing step of placing an intermediate mold on the lower mold at the separation position;
A fourth transfer step of transferring the lower mold on which the intermediate mold is placed to a molding position;
Further including
In the fourth transfer step, the intermediate mold is preferably heated by a heating means provided in the lower mold.

  According to the present invention, since the intermediate mold can be transferred to the side non-molding position with the intermediate mold placed on the lower mold by the transfer means, the upper mold, the intermediate mold, and the lower mold Despite having a three-plate structure, the resin-sealed substrate can be smoothly carried out without complicating, upsizing, or becoming expensive. be able to.

  Embodiments according to the present invention will be described below with reference to the accompanying drawings.

(1. Configuration)
FIG. 1 is a schematic plan view of a resin sealing device according to the present embodiment, and FIG. 2 is a front view thereof. The resin sealing device generally includes a supply unit 1, a molding unit 2, and a discharge unit 3.

(1.1. Supply unit 1)
As shown in FIGS. 1 and 2, the supply unit 1 includes a substrate supply device 4, an arrangement device 5, an inloader 6, a resin supply device 7, and a resin transport device 8. The substrate supply device 4 transfers the magazine 10 accommodated in a state where a plurality of substrates 9 are stacked from the position A to the position B. Then, the substrates 9 are conveyed one by one from the magazine 10 at the position B to the array device 5 by a pusher (not shown). The arrangement device 5 receives the substrate 9 from the magazine 10 at the position B at the position C and delivers it to the inloader 6 at the position D. The inloader 6 includes a chuck claw 11 that holds the substrate 9 and transports the substrate 9 received at the position D to each lower mold 13 of the molding unit 2 at the substrate transport position E or F. The resin supply device 7 delivers the tablet-shaped resin material to the resin transport device 8. The resin transfer device 8 reciprocates between the position K and the position L, and supplies the transferred resin material to each upper mold 12.

(1.2. Molding unit 2)
As shown in FIGS. 1 and 2, the molding unit 2 includes an upper mold 12, a lower mold 13 that is in contact with and separated from the upper mold 12 in the Z-axis direction, and a gap between the two molds. A mold set including the intermediate mold 14 to be arranged is provided at two locations.

  As shown in FIG. 6A, the upper mold 12 is one in which a cavity plate 16 is integrated with a base plate 15. As shown in FIG. 2, each upper mold 12 is fixed to the support frame 2a. A resin supply path 17 is formed in the base plate 15, and the resin material conveyed by the resin conveyance device 8 is supplied. The base plate 15 and the cavity plate 16 are formed with a through hole 18 penetrating vertically, and a bush 19 made of a material having excellent heat resistance is fitted therein to form a pot portion 20. The pot unit 20 is heated by a cartridge heater (not shown) built in the base plate 15 to melt the supplied resin material. A plunger tip 21 is disposed in the pot portion 20. The plunger tip 21 is moved up and down via a plunger rod 22 by a lifting device (not shown), and the resin material supplied into the pot portion 20 is pumped to the intermediate mold 14. A connecting pin 23 projects from the tip of the plunger tip 21. The connecting pin 23 is inclined toward the central axis side of the plunger tip 21 so as to follow a conical surface constituting the gate portion 26 described later.

  The lower mold 13 is configured such that the substrate 9 is placed on the upper surface. As shown in FIG. 1, the lower mold 13 reciprocates between the molding position M and the separation position O and between the molding position N and the separation position P by a driving mechanism (not shown). The lower mold 13 includes a cartridge heater (not shown), and heats and solidifies the resin material filled in the cavity during resin sealing.

  As shown in FIG. 6A, the intermediate mold 14 is obtained by integrating a first intermediate plate 24 and a second intermediate plate 25. A conical gate portion 26 whose cross-sectional area gradually decreases downward from the center of the upper surface of the intermediate mold 14 is formed. In addition, a recess 27 is formed on the lower surface of the second intermediate plate 25 to form a cavity with the upper surface of the substrate 9 placed on the lower mold 13. The lower end portion of the gate portion 26 is open at the central portion of the recess 27. The first intermediate plate 24 has stepped holes 28 at a plurality of locations. A through hole 29 is formed in the second intermediate plate 25 at a position corresponding to the stepped hole 28. The stepped hole 28 and the through hole 29 constitute a holding portion for the ejector pin 30. As for the ejector pin 30, the collar part 30a is formed in the upper end. In the state where the ejector pin 30 is held by the holding portion, the flange portion 30 a is disposed at the lower large diameter portion of the stepped hole 28, and the lower end portion is disposed at the through hole 29 of the second intermediate plate 25. A spring 31 is disposed between the lower surface of the flange portion 30 a of the ejector pin 30 and the upper surface of the second intermediate plate 25. As a result, the ejector pin 30 is urged upward, and its lower end surface is flush with the bottom surface of the recess 27.

  The molding unit 2 includes a first cleaning device 32 and a separation device 33.

  As shown in FIG. 1, in the first cleaning device 32, a roller brush 36a is rotatably provided in a cover 35a provided at the tip of a duct 34a. The upper surface of the cover 35a is opened, and a part of the roller brush 36a protrudes upward therefrom. Then, by driving a suction device (not shown) and driving the drive device (not shown) and rotating the roller brush 36a, the residual resin is removed by sliding contact with the lower surface of the upper mold 12, via the duct 34a. It comes to collect.

  As shown in FIGS. 8 and 9, the separating device 33 is a press composed of two plates fixed with bolts for sandwiching the push-out pins 37 for pushing down the ejector pins 30 between the unillustrated separation bodies. A plate 38 and a chuck claw 39 for holding the intermediate mold 14 are provided, and the plate 38 is moved up and down by a driving mechanism (not shown). When the intermediate mold 14 is held by the chuck claw 39, the upper surface of the intermediate mold 14 comes into contact with the lower surface of the pressing plate 38, the push pins 37 are inserted into the small diameter holes of the stepped holes 28, and the ejector pins 30. The (protrusion 30a) can be pushed down against the urging force of the spring 31. As a result, the resin sealing portion (package portion) Mb of the concave portion 27 is pushed down, and the substrate 9 is detached from the intermediate mold 14. Further, the separation device 33 is provided so as to be reciprocally movable in the X-axis direction by a driving means (not shown), and a second cleaning device 40 is provided at a lateral position thereof. As shown in FIG. 3, the second cleaning device 40 includes a duct 34b having a substantially L-shaped cross section, and a roller brush 36b covered with a cover 35b that opens upward. The second cleaning device 40 is slidably moved by being guided by the slide unit 47 with respect to the separation device 33 holding the intermediate mold 14, and the roller brush 36 b that is rotationally driven is slidably contacted to clean the separation device 33.

(1.3. Discharge unit 3)
As shown in FIGS. 1 and 2, the discharge unit 3 includes an unloader 41, a receiving device 42, and a substrate discharge device 43. The unloader 41 has substantially the same configuration as the inloader 6 and includes a chuck claw 41 a that holds the substrate 9. The unloader 41 transports the molded substrate 9 from the lower mold 13 located at the position E or F to the position G. . Further, the unloader 41 is provided with a third cleaning device 44 having the same configuration as the first cleaning device 32, and the upper surface of the lower die 13 and the upper surface of the intermediate die 14 placed on the lower die 13 are provided. It can be cleaned. The receiving device 42 is provided so as to be capable of reciprocating between the position G and the position H, receives the molded substrate 9 conveyed by the unloader 41 at the position G, and transfers it to the position H. The substrate discharging device 43 conveys the molded substrate 9 transferred to the receiving position H by the receiving device 42 to the position I by a pusher (not shown) and stores it in the magazine 10, and positions the magazine 10 storing the substrate 9 in the position. Transfer from I to position J.

  In the resin sealing device having the above configuration, as shown in FIG. 10, the drive mechanism of each of the units 1, 2, 3 is driven and controlled by the control device 46 based on the coordinate data stored in the storage device 45.

(2. Operation)
Next, the operation of the resin sealing device having the above configuration will be described.

(2.1. Preparation process)
The upper mold 12 and the lower mold 13 are each heated to a predetermined temperature in advance by an upper mold heater and a lower mold heater (not shown). At this time, the intermediate mold 14 is placed on the lower mold 13. Thereby, the intermediate mold 14 is heated to a temperature (about 170 ° C.) at which molding is possible by the heat of the lower mold heater that heats the lower mold 13. Therefore, first, the lower mold 13 is moved to the separation position O, and the separation device 33 is lowered. Then, the intermediate mold 14 is held by the chuck claw 39. Subsequently, the separation device 33 is raised to separate the intermediate mold 14 from the lower mold 13. Thereafter, the lower mold 13 is moved to the substrate transport position E (if the lower mold 13 is located at the molding position N, the lower mold 13 is moved to the separation position P and the separation device 33 is lowered. The intermediate mold 14 is held by the chuck claw 39. Subsequently, the separation device 33 is raised to separate the intermediate mold 14 from the lower mold 13. Thereafter, the lower mold 13 is moved to the substrate transfer position F. .)

(2.2. Material supply process)
The substrate 9 and the resin material are supplied from the supply unit 1 to the molding unit 2. That is, the magazine 10 at the position A is transferred to the position B, and the substrate 9 is transferred from the magazine 10 at the position B to the position C and then to the position D. Then, by driving and controlling the inloader 6, the substrate 9 is transferred from the position D to the substrate transfer position E and placed on the lower mold 13. Subsequently, the lower mold 13 is moved to the separation position O, the intermediate mold 14 held by the chuck claw 39 by the separating device 33 is placed on the lower mold 13, and the substrate 9 is sandwiched between the both molds 13 and 14. To do. Thereafter, the lower mold 13 on which the intermediate mold 14 is placed is moved to the molding position M. At this time, the resin transfer device 8 at the position K is driven, and the resin material is supplied to the resin supply path 17 of the upper mold 12 located at the molding position M as shown in FIG. Is located at the molding position N, the substrate 9 is transported from the position D to the substrate transport position F and placed on the lower mold 13. Subsequently, the lower mold 13 is moved to the separation position P. Then, the intermediate mold 14 held by the chuck claw 39 by the separating device 33 is placed on the lower mold 13, and the substrate 9 is sandwiched between both molds 13, 14. At this time, the intermediate mold 14 is placed. The lower mold 13 is moved to the molding position N. Further, the resin sealing device 8 at the position K is driven, and the resin material of the upper mold 12 located at the molding position N as shown in FIG. Supply to the resin supply path 17).

(2.3. Molding process)
Subsequently, the lower mold 13 is raised, the intermediate mold 14 is clamped between the upper mold 12 and the substrate 9 is clamped between the intermediate mold 14 and the lower mold 13 with a constant pressure. Here, the resin material supplied to the resin supply path 17 of the upper mold 12 is sent into the pot portion 20 and melted. As shown in FIG. 6 (b), the molten resin was formed by the concave portion 27 of the intermediate mold 14 and the upper surface of the substrate 9 by lowering the plunger tip 21 and clamping it through the gate portion 26. Fill into the cavity. Thereby, the electronic component mounted on the substrate 9 is resin-sealed.

(2.4. Discharge process)
When the resin sealing is completed, the discharging process is started. Hereinafter, the discharging process will be described with reference to the flowchart of FIG.

  That is, as shown in FIG. 7, the plunger tip 21 is raised while the mold is closed (step S1). A connecting pin 23 having a reverse taper is formed at the tip of the plunger tip 21 and integrated with the resin solidified by the gate portion 26. For this reason, the resin (gate molding part) Ma solidified in the gate part 26 is separated from the resin (package part) Mb on the cavity side at the gate port by the rise of the plunger chip 21, and is detached from the gate part 26.

  Subsequently, the lower mold 13 is lowered as shown in FIG. 3 (step S2), and is moved to the substrate transfer position E or F together with the intermediate mold 14 as shown in FIG. 4A (step S3). . Then, the unloader is moved in the X-axis direction, and the upper surface of the intermediate mold 14 is cleaned by the third cleaning device 44 (step S4). At the same time, the lower surface of the upper mold 12 is cleaned by the first cleaning device 32 (step S5). At this time, the gate forming portion Ma integrated with the connecting pin 23 of the plunger tip 21 is collected by the first cleaning device 32.

  Further, as shown in FIG. 4B, the lower mold 13 and the intermediate mold 14 are moved to the separation position O or P (step S6). Then, as shown in FIG. 8, the separation device 33 is moved to the separation position O or P where the intermediate mold 14 has been moved (step S7), and the chuck claw 39 is lowered to the middle as shown in FIG. The mold 14 is held (step S8). Thereafter, the chuck claw 39 is raised, and the upper surface of the intermediate mold 14 is brought into contact with the lower surface of the pressing plate 38 (step S9). Thereby, the ejector pin 30 is pushed down by the push pin 37, and the package part Mb in the recess 27 is pressed by the ejector pin 30. The substrate 9 pressed against the package part Mb is detached from the intermediate mold 14 and placed on the lower mold 13 (of course, the lower mold 13 has a relief for avoiding interference with the chuck claws 39. A recess is formed.)

  Next, as shown in FIG. 5A, the lower mold 13 is transferred to the substrate transfer position E or F (step S10). During this time, the second cleaning device 40 is driven to clean the lower surface of the intermediate mold 14 (step S11). On the other hand, at the molding position E or F, the molded substrate 9 is held by the unloader 41 and is carried out to the position G (step S12).

  Thereafter, as shown in FIG. 5B, the lower mold 13 is moved to the separation position O or P (step S13), and the intermediate mold 14 held by the chuck claw 39 of the separation device 33 is moved over the lower mold 13. (Step S14). Then, the lower mold 13 is moved to the substrate transfer position E or F (step S15) and returned to the initial position shown in FIG. In the meantime, if the intermediate mold 14 is heated by the lower mold 13, it is possible to smoothly shift to the next molding step and improve the processing efficiency. Further, in Step 12, if the substrate 9 before molding is placed on the lower mold 13 by the inloader 6 immediately after the substrate 9 before molding is discharged by the unloader 41, continuous molding becomes possible.

  In the above embodiment, the lower mold 13 is moved up and down with respect to the upper mold 12, but the upper mold 12 may be moved up and down with respect to the lower mold 13. It is also possible to adopt a configuration in which both can be raised and lowered.

  Further, in the above embodiment, the package part Mb is detached from the recess 27 of the intermediate mold 14 by the ejector pin 30, but the substrate may be positioned on the lower mold 13 by other means. For example, if the suction port is formed in the lower mold 13 and the placed substrate is sucked, the ejector pin 30 or the like becomes unnecessary. Further, after the resin sealing is completed, as a means for separating the gate molding portion Ma and the package portion Mb, instead of the connecting pin 23 formed on the plunger chip 21, as shown in FIGS. You may make it form the engaging part 47 formed in the reverse taper inside the gate part of the bush 19 (the gate part side of the pot part 20).

It is a top view which shows the outline of the resin sealing apparatus which concerns on this embodiment. It is a front view of FIG. It is a side view which shows the shaping | molding unit of FIG. 3A shows a state where the lower mold and the intermediate mold are moved to the substrate transfer position from FIG. 3, and FIG. 3B shows a state where the lower mold and the intermediate mold are further moved from the substrate transfer position to the separation position. FIG. 4A shows a state in which the intermediate mold is held by the separation device from FIG. 4B and the lower mold is moved to the substrate transfer position, and FIG. 4B shows the state where the lower mold is moved again to the separation position. It is a side view which shows the state which mounted the type | mold on the lower metal mold | die, respectively. (A) Sectional drawing which shows the resin material supply state of the metal mold | die set of FIG. 1, (b) is sectional drawing which shows the state which filled the resin further in the cavity. It is sectional drawing which shows the state which raised the plunger chip | tip from the state of FIG.6 (b). It is sectional drawing which shows the separation apparatus of FIG. 1, an intermediate mold, and a lower mold. It is a figure which shows the state which hold | maintained the intermediate metal mold | die with the separation apparatus from FIG. It is a block diagram of the resin sealing device concerning this embodiment. It is a flowchart figure which shows the discharge process by the control apparatus of FIG. (A) is sectional drawing which shows the state which filled the resin in the cavity of the metal mold | die set which concerns on other embodiment, (b) is sectional drawing which shows the state which dropped the lower metal mold from the state shown to (a) It is.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Supply unit 2 ... Molding unit 3 ... Discharge unit 4 ... Substrate supply apparatus 5 ... Arrangement apparatus 6 ... Inloader 7 ... Resin supply apparatus 8 ... Resin conveyance apparatus 9 ... Substrate 10 ... Magazine 11 ... Chuck claw 12 ... Upper metal mold 13 ... Lower mold 14 ... Intermediate mold 15 ... Base plate 16 ... Cavity plate 17 ... Resin supply path 18 ... Communication hole 19 ... Bush 20 ... Pot part 21 ... Plunger tip 22 ... Plunger rod 23 ... Connecting pin 24 ... First intermediate plate 25 ... 2nd intermediate plate 26 ... Gate part 27 ... Recessed part 28 ... Stepped hole 29 ... Through hole 30 ... Ejector pin 30a ... Gutter part 31 ... Spring 32 ... 1st cleaning apparatus 33 ... Separation apparatus 34a, 34b ... Duct 35a, 35b ... Cover 36a, 36b ... Roller brush 37 ... Extrusion pin 38 ... Pressing play 39 ... chuck claws 40 ... second cleaning device 41 ... unloader 41a ... chuck claws 42 ... receiving device 43 ... substrate discharge device 44 ... third cleaning device 45 ... storage device 46 ... control device (control means)
47 ... engaging part Ma ... gate molding part Mb ... package part

Claims (9)

An upper die, a lower die that can be moved toward and away from the upper die, and an intermediate die that is detachably disposed on the lower die, the lower die and the intermediate die Resin sealing that holds the substrate between the molds and fills the resin formed in the substrate with resin by filling the resin formed in the cavity formed by the lower mold and the intermediate mold A device,
Transfer means for transferring the lower mold to a molding position facing the upper mold and a non-molding position moved laterally;
After the molding at the molding position, with the intermediate mold placed on the lower mold, the transfer means is driven and controlled, and the intermediate mold and the lower mold are transported to the non-molding position,
A resin sealing device comprising: The intermediate mold includes a recess that constitutes a part of the cavity, and a gate portion that communicates with the recess.
The upper mold includes a pot portion to which a resin material is supplied, and a plunger chip that pushes the resin material supplied to the pot portion to the gate portion,
The plunger tip includes a connecting portion that forms a connected state with the solidified resin by solidifying the resin in the gate portion,
2. The resin sealing device according to claim 1, wherein the connecting portion causes the resin in the gate portion to be detached from the intermediate mold when the plunger tip moves up in the pot portion. The intermediate mold includes a recess that constitutes a part of the cavity, and a gate portion that communicates with the recess.
The upper mold includes a pot portion to which a resin material is supplied, and a plunger chip that pushes the resin material supplied to the pot portion to the gate portion,
The pot portion includes an engagement portion that forms an engagement state with the solidified resin by solidifying the resin in the gate portion,
2. The resin sealing device according to claim 1, wherein the engaging portion causes the resin in the gate portion to be detached from the intermediate die by lowering the lower die from the closed state. 3. In the non-molding position where the lower mold and the intermediate mold are transferred by the transfer means, a substrate transfer position where the substrate is carried in and out of the lower mold, and the molded substrate is detached from the intermediate mold. Including separation position,
At the separation position, a separation device for separating the molded substrate from the intermediate mold is provided,
4. The separation device according to claim 1, further comprising: a holding unit that holds the intermediate mold; and a detaching unit that releases the molded substrate from the intermediate mold held by the holding unit. The resin sealing apparatus of any one of Claims. The intermediate mold is provided with an ejector pin for releasing the resin solidified in the recess from the recess,
5. The resin sealing device according to claim 4, wherein the separation means of the separation device includes an extrusion pin that releases the molded substrate from the intermediate mold by pressing the ejector pin.   6. The resin sealing device according to claim 1, wherein the lower mold includes a heating unit capable of heating the intermediate mold even during transfer by the transfer unit. . First cleaning means for cleaning the upper mold at the molding position;
A second cleaning means for cleaning the lower mold at the substrate transfer position;
A third cleaning means for cleaning the intermediate mold at the separation position;
The resin sealing device according to claim 4, further comprising: An upper die, a lower die that can be moved toward and away from the upper die, and an intermediate die that is detachably disposed on the lower die, the lower die and the intermediate die Resin sealing that holds the substrate between the molds and fills the resin formed in the substrate with resin by filling the resin formed in the cavity formed by the lower mold and the intermediate mold A method,
After molding at the molding position,
A first transfer step of transferring the intermediate mold from a molding position facing the upper mold to a side separation position while being placed on the lower mold;
A separation step of separating the intermediate mold from the lower mold transferred to the separation position, and detaching the substrate after molding from the intermediate mold and placing it on the lower mold,
A second transfer step of transferring the lower mold on which the substrate is placed to the substrate transfer position in the separation step;
An unloading step of unloading the substrate from the lower mold transferred to the substrate transfer position;
A resin sealing method comprising: A third transfer step of unloading the molded substrate at the substrate transfer position and transferring the unmolded substrate to the separation position;
A placing step of placing an intermediate mold on the lower mold at the separation position;
A fourth transfer step of transferring the lower mold on which the intermediate mold is placed to a molding position;
Further including
9. The resin sealing method according to claim 8, wherein in the fourth transfer step, the intermediate mold is heated by a heating means provided in the lower mold.

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