JP3144714B2 - Transfer mold equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer mold apparatus, and more particularly, to a lower mold chase detachably fixed to a lower mold base of a mold that opens and closes in a vertical direction, and the lower mold. A plunger that slides into a through hole provided in the chase, an upper space of the through hole is formed in a pot into which the resin tablet is put, and the resin tablet put into the pot is melted, and the plan is melted. The present invention relates to a transfer molding apparatus for feeding a molten resin in a pot into a cavity by driving a jar to seal a semiconductor chip or the like with a resin.

[0002]

2. Description of the Related Art Conventionally, a multi-plunger mold having a lower mold chase provided with a plurality of pots has been frequently used in a transfer molding apparatus used for sealing a resin of an IC chip. In the transfer molding apparatus using the multi-plunger mold, when filling the cavity with the molten resin, it is important to fill the resin with a uniform filling pressure for each cavity. As a transfer molding apparatus for obtaining this uniform filling pressure, there is a technique disclosed in Japanese Patent Application No. 2-331361 already filed by the present applicant. In this transfer molding apparatus, a plurality of plungers are provided, a pot communication path is provided for communicating between the pots, and when the resin is injected into the cavity, the pot is not filled until a certain amount of resin is filled in the cavity. It is characterized in that a pot communication path is shut off so that molten resin does not flow between them, and a pot communication path opening / closing mechanism that opens the pot communication path when the cavity is filled with resin to a certain extent or more.

According to this transfer molding apparatus,
When the molten resin is extruded from the pot into the cavity by the plunger, the pot communication path is shut off by the opening and closing mechanism of the pot communication path during the initial stage of resin filling. Then, when the molten resin is filled from each pot into a cavity provided for each pot and the pot communication path is opened by the shut-off / release mechanism, the molten resin between the pots communicates, so that the pressing force of the plunger is increased. Is uniformly applied to each cavity, and thereafter the resin can be filled with an equal pressure. As described above, each cavity can be filled with the resin evenly and the resin can be filled with the uniform pressure, so that accurate resin molding can be performed.
Further, by using a plurality of plungers, resin sealing can be performed efficiently, and processing efficiency of resin sealing can be improved.

Further, in the conventional transfer molding apparatus, a dovetail portion provided on a lower mold chase is fitted into a dovetail groove provided on an inner wall surface of a lower mold base in a horizontal direction, so that a lower mold is provided. In some cases, a chase can be attached to and detached from a lower mold base so as to be able to be inserted and removed in a horizontal direction. According to this, the lower mold chase can be mounted on the lower mold simply by sliding the lower mold chase and fixing it by the fixing means, and the lower mold chase can be easily and reliably attached to and detached from the lower mold base. A T-shaped groove having an inverted T-shaped cross section is provided at the upper end of the drive mechanism disposed in the lower mold, and a plurality of plungers are fixed to the T-shaped groove at a predetermined interval. T can be freely inserted and removed from a T-shaped ridge projecting from the lower surface of the pushing member for pushing the plunger. With this pushing member, the plurality of plungers can be easily connected to the drive mechanism. In this transfer molding apparatus, the lower mold chase and the plunger for changing the type are replaced by moving the plunger unit including the plunge and the pushing member downward, and moving the entire plunger into the lower mold chase. , And the lower mold chase and the plunger unit are separately pulled out from the side of the lower mold.

When the mold is opened, the plunger is made to protrude above the parting line (the tip of the plunger is protruded above the surface of the lower mold chase), so that the worker or the robot can move the plunger. In some cases, the plunger can be individually removed by pinching and rotating the tip of the plunger. According to this mold, it is possible to individually replace only the plunger in which a defect has occurred. At this time, when exchanging the pushing member for fixing the plurality of plungers, after extracting all of the plurality of plungers from the lower mold chase, pull out only the pushing member from the side of the lower mold. Is going.
With this configuration, it is possible to replace the pushing member by pulling it out from the side of the lower mold without having to pull down the pushing member by an amount corresponding to the length of the plunger.

[0006]

By the way, when small-lot production of many kinds is performed, not only the direct processing efficiency such as resin encapsulation is improved, but also a mold apparatus for each kind of molded product. It is important to reduce the time required for replacing the resin in order to improve the overall processing efficiency of resin sealing and the like. In the above-mentioned conventional transfer molding apparatus, the lower mold chase and the plunger unit can be detachably attached to and detached from the lower mold composed of the lower mold base and the driving mechanism of the plunger. Can be improved. However, in this transfer molding apparatus, when exchanging the mold for changing the type, it is necessary to separately insert and remove the lower mold chase and the plunger unit with respect to the lower mold. .

Further, the plunger is lowered, and the plunger is pulled out from the through hole of the lower mold chase. Then, the plunger unit and the lower mold chase are separately inserted into and removed from the lower mold. For replacement, there is a problem that the size of the lower mold is increased so that a large opening corresponding to the length of the plunger can be formed on the side surface of the lower mold. In the case of a transfer molding apparatus having a configuration in which the pressing member can be replaced while the plunger is removed from the pressing member, the size of the lower mold can be reduced. However, there is a problem that the workability is poor because the lower mold chase needs to be mounted on the lower mold base, and the plunger is disjointed, which makes storage management difficult. Therefore, an object of the present invention is to easily and suitably exchange a plunger and a lower mold chase, to shorten the type change time of a molded product, and to easily store the plunger and the lower mold chase. An object of the present invention is to provide a transfer molding apparatus capable of reducing costs by downsizing or the like.

[0008]

To achieve the above object, the present invention has the following arrangement. That is, the transfer mold apparatus of the present invention slides on a lower mold chase that is removably fixed to a lower mold base that opens and closes in a vertical direction, and a through hole provided in the lower mold chase. A plunger is formed, and an upper space of the through hole is formed in a pot into which the resin tablet is put, and the resin tablet put into the pot is melted, and the molten resin in the pot is driven by driving the plunger. Is transferred to the cavity and the semiconductor chip and the like are sealed with a resin.In the transfer molding apparatus, the lower mold chase and the plunger are moved downward while the plunger is still inserted into the through hole of the lower mold chase. When the plunger is inserted into a predetermined position of the through hole so that it can be inserted and removed inside the mold base, the plunger falls out of the lower mold chase. Characterized by including a locking means engaged in the lower die chase the odd plunger.

A lower mold chase detachably fixed to a lower mold base that opens and closes in a vertical direction, and a plurality of plungers sliding into a plurality of through holes provided in the lower mold chase. And the upper space of the through-hole is formed in a pot into which the resin tablet is put, and the resin tablet put into the plurality of pots is melted, and the plurality of pots are driven by driving the plurality of plungers. A plurality of cavities, the plurality of cavities being pressure-fed to a plurality of cavities for resin-sealing a plurality of semiconductor chips and the like, wherein the plurality of plungers are formed by being fixed to a pushing member pushed by a driving mechanism. When the resin is injected into the cavity, the cavity is filled with the resin to some extent. During the period, the pot communication paths are shut off so that the molten resin does not flow between the pots, and when the resin is filled in the cavities to a certain extent, the pot communication paths are opened in conjunction with the operation of the plunger. An opening / closing mechanism for the communication path, an interlocking drive member provided in the pushing member to drive the opening / closing mechanism in conjunction with the operation of the plunger, and a through hole in the lower mold chase. With the plunger still inserted, the lower mold chase and the plunger unit can be inserted into and removed from the lower mold base. When the plunger is inserted into a predetermined position of the through hole, the plunger is lowered. There is also provided a transfer molding apparatus comprising a locking means for locking the interlocking drive member to the lower mold chase so as not to fall off the mold chase.

[0010]

According to the transfer mold apparatus of the present invention,
When the plunger is fitted into a predetermined position of the through hole of the lower mold chase, the plunger is locked to the lower mold chase by the locking means so as not to fall off the lower mold chase. For this reason, the lower mold chase and the plunger can be inserted into and removed from the lower mold base together with the plunger being fitted into the through hole of the lower mold chase. Can be easily and efficiently performed. Further, since the plunger can be pulled out while being fitted into the lower die chase, it is not necessary to secure a large opening for separately pulling out the plunger, and the die can be downsized.

In addition, a uniform opening and closing mechanism is provided for opening and closing the pot communication passage in accordance with the operation of the plunger under predetermined conditions, corresponding to the pot communication hole communicating between the pots. In a transfer molding apparatus capable of filling a resin with pressure, an interlocking driving member provided to drive the shutoff / opening mechanism in conjunction with the operation of the plunger is provided so as to be lockable by a locking means on the lower mold chase. The plunger unit and the lower mold chase can be efficiently inserted inside the lower mold base while the plunger is locked to the lower mold chase without making the mold structure complicated and large. It can be replaced by pulling it out.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view for explaining a state in which a lower mold chase and a plunger unit of a transfer molding apparatus according to the present invention are exchanged, and FIG. 2 is a diagram for locking a plunger unit to a lower mold chase. It is explanatory drawing which shows one Example of a means. As shown in FIG. 1, reference numeral 10 denotes a lower mold chase, which can be detachably fixed to a lower mold base 30 of a mold that opens and closes in a vertical direction. The lower mold chase 10 is provided with a plurality of through holes 14, and the plurality of plungers 2
4 is inserted. The upper space of the through hole 14 is formed in a pot 14a into which the resin tablet is put. The resin tablet put into the pot 14a is melted by the heating means, and driven by the plunger 24, the pot 14a is put into the pot 14a. The molten resin in the cavity 1
The semiconductor chip and the like can be resin-sealed by pressure-feeding.

Reference numeral 20 denotes a plunger unit. A plunger 24 is disposed and fixed on the upper surface of the pushing member 22 via a plunger holder in accordance with the position of each pot 14a provided in the lower mold chase 10. It is configured. The plunger unit 20 can be locked to the lower mold chase 10 by locking means to be described later to such an extent that it can be easily pulled out. The pushing member 22 is elongated so that the plungers 24 are arranged at a predetermined interval, and a T-shaped ridge portion 23 is formed at a lower portion thereof, which has an inverted T-shape in cross section and a streak-like projection in the longitudinal direction. I have. The T ridge 23 has a T-shaped cross section formed at the tip of a drive mechanism 50 for pushing the pushing member 22.
It is provided in the groove 52 so as to be removable. That is, the plunger unit 20 can be easily connected to the distal end of the drive mechanism 50 by sliding the plunger unit 20 in the longitudinal direction and fitting the T ridge 23 into the T groove 52. The plunger 24 is easily and detachably fixed to the pressing member 22 via a plunger holder. When the plunger 24 protrudes from the upper surface of the lower mold chase as shown in FIGS. They can be individually attached and detached by being pinched and rotated by a person or the like. Therefore, when a defect occurs in a part of the plunger 24, only the plunger 24 needs to be replaced.

Reference numeral 26 denotes a lower interlocking pin, which constitutes an interlocking drive member provided on the pushing member 22 so as to drive a shutoff / opening mechanism 70 described later in conjunction with the operation of the plunger 24. A ring-shaped outer peripheral groove 27 is provided on the outer periphery of the lower portion of the lower interlocking pin 26.

A lower mold base 30 is provided with a dovetail groove 32 in a horizontal direction on an inner wall surface as shown in FIG. 1 so that the lower mold chase 10 can be suitably fixed therein. . By inserting the dovetail portion 16 provided in the lower mold chase 10 into the dovetail groove 32, the lower mold chase 10 can be detachably attached to and detached from the lower mold base 30 in the horizontal direction. Thereby, the lower mold chase 10
Can be mounted on the lower mold simply by being fixed by the fixing means, and the lower mold chase 10 can be easily attached to and detached from the lower mold base 30. 35 is a door member,
The lower mold chase 10 is fixed to the lower mold base 30 and is rotatably provided around a shaft 37 so that the side surface of the lower mold base 30 can be opened. Also, the lower mold base 3
A groove 36 is engraved at a substantially central portion serving as an inner wall portion of the zero. 1 and 3, the groove 36 is slidably attached to and detached from the lower mold base 30 by sliding the plunger unit 20 together with the lower mold chase.
The pushing member 22 is provided so as not to interfere.

Reference numeral 40 denotes locking means, which is the lower mold chase 1
The lower mold chase 10 and the plunger unit 20 remain with the respective plungers 24 fitted in the respective through holes 14 of the lower mold 0.
When the plunger 24 is inserted into a predetermined position of the through hole 14 so that the plunger 24 can be inserted into and removed from the lower mold base 30,
The lower interlocking pin 26 can be locked to the lower mold chase 10 so that the plunger 24 does not fall off the lower mold chase 10. For example, as shown in FIG.
And an outer peripheral groove 27 provided on the outer periphery of the lower interlocking pin 26 fixed to the lower mold chase 10 and two ball plungers provided on the lower mold chase 10 side. This ball plunger is provided with a ball 41 that is locked in the outer peripheral groove 27.
And a spring 42 for urging the ball 41 to protrude inward of the through hole so as to lock the ball 41 in the outer peripheral groove 27.
And the like. According to this locking means, the plunger unit 20 is easily locked by the lower mold chase 10 and is easily released from the lower mold chase 10 by the urging force of the spring 42. It is locked as described above.

FIGS. 4 and 5 show another embodiment of a transfer mold apparatus having a lower mold equivalent to the lower mold shown in FIG. 1 (in which the upper and lower molds are closed). FIG. The transfer molding apparatus for performing resin sealing of the semiconductor device includes an upper mold chase 60 and a lower mold chase 10 which are resin molding sections, and an upper mold base 90 and a lower mold base 30 supporting these chase.
And a driving mechanism 50 of the plunger 24 for filling the molten resin into the mold cavity 12 by the plunger 24.
And The drive mechanism 50 of the present embodiment can be driven by, for example, a servomotor (not shown), similarly to the related art (the technique described in Japanese Patent Application No. 2-331361 already filed by the present applicant). That is, the pushing member 22 on which the plunger holder 22a for fixing the plunger 24 is fixed is screwed to a ball screw attached to the lower surface of the pushing member 22 and rotated by the servomotor. , Can be reciprocated. The pushing member 22 is guided by a plurality of guide shafts so as to be able to advance and retreat in parallel with the direction in which the mold opens and closes.

The upper part of the plunger 24 fixed and supported by the pushing member 22 slides into the pot 14a provided in the upper space of the through hole 14 from below the lower mold chase 10. A cull portion 72 is provided at a position above the pot 14a of the upper mold chase 60, and the adjacent cull portions 72 are communicated with each other by a pot communication passage 74 as in the conventional example. Each cull part 72
From the runners that contact each cavity 12,
A gate is installed. In order to prevent the molten resin from flowing into the adjacent pot 14a from the other pot 14a by closing the pot communication path 74 halfway at the start of the resin injection, the following configuration is provided.

A shut-off pin 76 for blocking the resin path of the pot communication path 74 is slidably provided in a through-hole 78 vertically passing through the upper mold chase 60. The shut-off pin 76 is provided at a halfway position of each of the pot communication paths 74 communicating between the adjacent pots 14a so as to be able to shut off the pot communication paths 74. Shut-off pin 76
The upper end is fixed by a pin 63 to a support plate 62 attached to the upper die chase 60 so as to be urged by the spring 80 toward the lower die chase 10 and movable in the die opening and closing direction. It is normally urged to protrude from the parting surface of the upper mold chase 60. Also, as shown in FIG.
Are vertically slidably inserted into through-holes 68 provided in the vicinity of both outer edges of the upper mold chase 60 and penetrated in the up-down direction. The upper end of the upper connecting pin 66 is fixed to the lower surface of the support plate 62. The support plate 62, the upper interlocking pin 66, the shut-off pin 76, the spring 80, and the like constitute a blocking / opening mechanism 70.

As shown in FIGS. 4 and 5, the shut-off pins 76 provided on the upper mold chase 60 are arranged in a row corresponding to the pot communication passage 74. Also,
A cull portion 72 is provided at the center of the upper mold chase 60 so as to match the position of the cavity 12.
Are provided so as to communicate the adjacent cull portions 72. The shut-off pin 76 is set to have a larger diameter than the width of the pot communication passage 74 so as to block the pot communication passage 74. The cavities 72 communicate with the cavities 12 via runners and gates.

In the lower die chase 10, a lower interlocking pin 26 is vertically slidably inserted into a through hole 15 penetrating in a vertical direction at a position on an extension of the upper interlocking pin 66. The lower interlocking pin 26 has an upper
And is fixed to the upper surface of the pushing member 22 at the lower end, and serves as an interlocking driving member that drives the shutoff / opening mechanism 70 in conjunction with the operation of the plunger 24. A ring-shaped outer peripheral groove 27 is formed on the lower outer periphery of the lower interlocking pin 26.

The lower interlocking pin 26 drives the shut-off / opening mechanism 70 and, in addition, the lower mold chase 10 in the lower mold 1.
When exchanging the plunger unit 20 with the plunger unit 20, it also acts as a part of the locking means as follows. That is, as shown in FIG. 3, in a state where the upper mold 2 moves upward and the mold is opened, the plunger unit is arranged such that the tip end of the plunger 24 projects from the parting surface of the lower mold chase 10. 20 is raised, and the plunger 24 is moved to a predetermined position where processing such as resin sealing is not always performed. Then, both the lower mold chase 10 and the plunger unit 20 can be inserted into and removed from the inside of the lower mold base 30 so that the plungers 24 remain fitted in the respective through holes 14 of the lower mold chase 10 and do not fall off. As shown in FIG. 2, the plunger unit 20 is lowered by the locking means 40 in which a locking member such as a ball 41 disposed on the lower mold chase 10 is engaged with the outer peripheral groove 27 of the lower interlocking pin 26. Locked to the mold chase 10. For this reason, the lower mold chase 10 and the plunger unit 20 can be detached from the lower mold base in a state where the lower mold chase 10 and the plunger unit 20 are locked and integrated, and the lower mold chase 10 and the plunger unit 20 in the lower mold.
Can be easily exchanged. In addition, since the lower mold chase 10 and the plunger unit 20 are integrated, storage management after replacement can be easily performed.

Also, as shown in FIG.
Can be opened by the door member 35. This door member 3
5 is provided rotatably about a shaft 37, and a groove 36 is engraved in a substantially central portion serving as an inner wall portion of the lower mold base 30. 1 and 3, when the plunger unit 20 is slid into and removed from the lower mold base 30 together with the lower mold chase.
In particular, the pressing member 22 is provided so as not to interfere. The door member 35 is closed when the lower mold chase 10 is fitted into the lower mold base 30, and serves as a fixing member for fixing the lower mold chase 10. The fixing member for fixing the lower mold chase 10 to the lower mold base 30 is not limited to the above-described door member 35,
Needless to say, a fitting-type block-shaped opening / closing member or a pin-shaped member that is automatically operated by a driving device may be used.

Next, the operation of the mold according to the embodiment shown in FIGS. 4 and 5 when the IC chip is sealed with resin will be described. First, after a resin tablet is put into the pot 14 provided in the lower mold chase 10 and the IC chip is positioned at a predetermined position on the lower mold chase 10,
The upper mold 2 and the lower mold 1 are clamped. 4 and 5
Is a state in which the upper mold 2 and the lower mold 1 are clamped. The shut-off pin 76 protruding from the parting surface of the upper mold 2 comes into contact with the parting surface of the lower mold 1 when the upper mold 2 and the lower mold 1 are clamped. The communication path 74 is shut off. The servomotor is driven in accordance with the dissolution timing and timing of the resin tablet, and a driving mechanism 50 including a ball screw or the like is used.
The pushing member 22 is pushed upward via the. Pushing member 2
2 is pushed upward, and the plunger 24 moves upward to push the molten resin toward the cull portion 72 side. The length of the lower interlocking pin 26 and the upper interlocking pin 66 and the movement of the pushing member 22 are set in advance so that the lower interlocking pin 26 does not come into contact with the upper interlocking pin 66 during a predetermined time when the molten resin is being pushed out to the cull portion 72. Set the position.

The state where the lower interlocking pin 26 and the upper interlocking pin 66 are not in contact is a state where the shut-off pin 76 is in contact with the upper surface of the lower mold chase 10 of the lower mold 1, that is, the pot communication passage. 74 is shut off.
Therefore, when the plunger 24 extrudes the molten resin in this state, the molten resin in each pot 14a is separated from the molten resin in the other pots 14a independently of the cavity 1 via a runner and a gate connected to each pot 14a.
2 is started. In this way, at the time of starting the filling of the resin, the flow of the molten resin from the other pots 14a is interrupted, and the resin is filled in the cavities 12 determined in advance in the respective pots 14a.

When the resin is filled, the pressing member 2
2 rises continuously, and at the same time, the plunger 24 rises in the pot 14a and pushes the resin toward the cavity 12, but when the pushing member 22 rises to a certain position, the lower interlocking pin 26 becomes the upper interlocking pin 66. Abut This allows
The support plate 62 moves upward against the spring 80 spring force, the shut-off pin 76 is lifted, the blockage of the pot communication path 74 is released, and the cull portion 72 is communicated by the pot communication path 74. When the molten resin in the cull portion 72 and the pot 14a communicate with each other through the pot communication path 74, the filling pressure of the resin applied by each plunger 24 is shared by all the cavities 12, and the resin is filled with an equal filling pressure. The right side of FIG. 4 shows a state in which the lower interlocking pin 26 pushes up the upper interlocking pin 66 to raise the shut-off pin 74, and the space between the pots 14a is communicated to complete the resin filling. As described above, various preferred embodiments of the present invention have been described. However, the present invention is not limited to these embodiments, and it goes without saying that many more modifications can be made without departing from the spirit of the invention. That is.

[0027]

According to the transfer molding apparatus of the present invention, when the plunger is inserted into a predetermined position of the through hole of the lower mold chase, the plunger is prevented from falling off from the lower mold chase by the locking means. Locked to the lower mold chase. For this reason, the lower mold chase and the plunger can be inserted into and removed from the inside of the lower mold base while the plunger is still fitted in the through hole of the lower mold chase. Accordingly, the lower mold chase and the plunger can be easily and suitably replaced in the lower mold, and the time required for changing the type of the molded product can be shortened. In addition, the lower mold chase and the plunger can be attached and detached in an integrated state, so that storage and management are easy, and the lower mold chase has a built-in plunger structure. Since the stroke length of the jar may be short, there is also an effect that the cost can be reduced through simplification of the structure and the drive mechanism.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a lower mold of a transfer molding apparatus according to the present invention.

FIG. 2 is an explanatory view showing details of locking means.

FIG. 3 is an explanatory view showing another embodiment of the lower mold of the transfer molding apparatus.

FIG. 4 is a longitudinal sectional view showing an embodiment of a mold including the lower mold of FIG. 3;

FIG. 5 is a cross-sectional view of the mold according to the embodiment of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lower mold 2 Upper mold 10 Lower mold chase 12 Cavity 14 Through hole 14a Pot 16 Dove part 20 Plunger unit 22 Pressing member 23 T ridge 24 Plunger 26 Lower interlocking pin 27 Outer peripheral groove part 30 Lower mold base 32 Dovetail part 35 Door member 36 Groove part 40 Locking means 50 Drive mechanism 52 T-groove part 60 Upper die chase 62 Support plate 66 Upper interlocking pin 70 Shut-off mechanism 74 Pot communication path 76 Shut-off pin 80 Spring

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) B29C 45/02

Claims (2)

(57) [Claims] 1. A lower mold chase that is detachably fixed to a lower mold base that opens and closes in a vertical direction, and has a plunger that slides into a through hole provided in the lower mold chase. The upper space of the through-hole is formed in a pot into which the resin tablet is put, and the resin tablet put into the pot is melted, and by driving the plunger,
In a transfer molding apparatus for feeding a molten resin in the pot to a cavity to seal a semiconductor chip or the like with a resin, the lower mold chase and the lower mold chase remain inserted in a through hole of the lower mold chase. When the plunger is inserted into a predetermined position of the through hole, the plunger is detachably inserted into the lower mold base so that the plunger does not fall out of the lower mold chase. A transfer molding apparatus, comprising: locking means for locking the transfer mold. 2. A lower mold chase detachably fixed to a lower mold base that opens and closes in a vertical direction, and a plurality of plungers slid into a plurality of through holes provided in the lower mold chase. And the upper space of the through-hole is formed in a pot into which the resin tablet is put, and the resin tablet put into the plurality of pots is melted, and the plurality of pots are driven by driving the plurality of plungers. In a transfer molding apparatus for resin-sealing a plurality of semiconductor chips and the like by feeding molten resin therein to a plurality of cavities, the plurality of plungers are formed by being fixed to a pushing member pushed by a driving mechanism. A plunger unit, a pot communication path communicating between the pots, and a step of injecting the resin into the cavities until a certain amount of resin is filled in each cavity. Between the pots, each pot communication path is shut off so that molten resin does not flow between the pots, and when the cavity is filled with the resin to a certain degree or more, the pot communication path opens each pot communication path in conjunction with the operation of the plunger. An opening / closing mechanism, an interlocking driving member provided in the pushing member to drive the opening / closing mechanism in conjunction with the operation of the plunger, and each of the plungers in each through hole of the lower mold chase. When the plunger is inserted into a predetermined position of the through-hole so that the lower mold chase and the plunger unit can be inserted and removed inside the lower mold base while the is inserted,
A transfer molding apparatus, comprising: locking means for locking the interlocking drive member to the lower mold chase so that the plunger does not fall off the lower mold chase.