JPS60251633A - Transfer mold forming method and resin tablet pressurizing device thereof - Google Patents
Transfer mold forming method and resin tablet pressurizing device thereofInfo
- Publication number
- JPS60251633A JPS60251633A JP10821384A JP10821384A JPS60251633A JP S60251633 A JPS60251633 A JP S60251633A JP 10821384 A JP10821384 A JP 10821384A JP 10821384 A JP10821384 A JP 10821384A JP S60251633 A JPS60251633 A JP S60251633A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plunger
- pressurizing
- pot
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 80
- 229920005989 resin Polymers 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000012530 fluid Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000000465 moulding Methods 0.000 claims description 16
- 239000012809 cooling fluid Substances 0.000 claims description 7
- 238000001721 transfer moulding Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、トランスファーモールド成形方法と、これ
に用いられる樹脂タグレットの加圧用１ランジヤーの改
良に関するものでア）、主として、半導体素子の樹脂モ
ールド成形技術産業の分野において利用されるものであ
る。Detailed Description of the Invention (Field of Industrial Application) This invention relates to a transfer molding method and an improvement in a single runger for pressurizing resin taglets used therein. It is used in the field of molding technology industry.
（従来技術とその問題点）
半導体素子を樹脂封入成形する場合は、通常、ボンド内
に供給した樹脂材料を加熱すると共に、これをプランジ
ャーにて加圧することによシ溶融樹脂をランナ及びゲー
ト等の移送経路を通して成形用キャビティ内に注入する
ようにしている。(Prior art and its problems) When molding a semiconductor element with resin, usually the resin material supplied into the bond is heated and the molten resin is applied to the runners and gates by pressurizing it with a plunger. The liquid is injected into the molding cavity through a transport path such as the following.
ところで、上記樹脂材料はパウダーを固化させた所要形
状のタブレットを用いることによシ、該材料のポット内
への供給を容易化することが行なわれている。この樹脂
タブレットは、上述したように、ポット内において加熱
・加圧されて溶融状態となるが、該ポット内部及びタブ
レット自体には空気と水分が存在すること、１だ、ポッ
トはタブレットの溶融化をスムーズに行なう目的で加熱
状態に維持されていること等から、投入供給されたタブ
レットはポット内において加熱膨張されることになる。Incidentally, the above-mentioned resin material can be easily supplied into the pot by using a tablet of a desired shape made of solidified powder. As mentioned above, this resin tablet is heated and pressurized in the pot to become molten, but there are two things: air and moisture exist inside the pot and in the tablet itself. Since the tablets are maintained in a heated state for the purpose of performing this process smoothly, the tablets introduced into the pot are heated and expanded in the pot.
従って、樹脂成形時においては、ボア）内の空気及び
タブレフト自体の空気・水分がキャビティ内に混入して
樹脂成形体にボイド（気泡）を成形し易い欠点があると
共に、タブレットの膨張を考慮して、所定の圧縮（密度
）精度に成形された樹脂タブレットを使用しなければな
らないといった成形上の制約を受けている。Therefore, during resin molding, there is a drawback that air inside the bore (bore) and air/moisture of the tablet left itself can easily enter the cavity and form voids (bubbles) in the resin molded product. Therefore, there are molding restrictions such as the need to use resin tablets molded to a predetermined compression (density) accuracy.
（本発明の目的）
本発明は、ポット内の樹脂タブレットをプラン′−によ
°て加圧する際に・該タブ″１内に含まれる空気・水分
をポット内から外部に排出させることによシ、溶融樹脂
中に上記空気等が混入するのを防止して、上述したよう
な従来の問題点を確実に解消することを目的とするもの
である。(Object of the present invention) The present invention is aimed at by discharging the air and moisture contained in the tab 1 from inside the pot to the outside when pressurizing the resin tablet in the pot according to the plan. Second, it is an object of the present invention to prevent the above-mentioned air, etc. from being mixed into the molten resin, and to reliably solve the above-mentioned conventional problems.
（本発明の方法及び構成）
本発明方法は、樹脂材料供給用のポット内に樹脂タブレ
ットを供給する工程と、ポット内の樹脂タグレットを所
要温度に冷却したプランジャーにより加圧して、該樹脂
タブレフトを順次溶融化させながら、該溶融樹脂中の空
気・水分をポットとプランジャーとの間隙から外部に排
出すると共に、該空気・水分を含まない溶融樹脂を成形
キャビティ内に加圧注入させる工程と、プラノジャーの
樹脂加圧工程終了後に該１ランジヤーを所要温度に加熱
する工程とから成るトランスファーモールド成形方法に
係るものである。(Method and structure of the present invention) The method of the present invention includes a step of supplying a resin tablet into a pot for supplying resin material, and pressurizing the resin taglet in the pot with a plunger cooled to a required temperature to release the resin tablet left. a step of sequentially melting the molten resin, expelling the air and moisture in the molten resin to the outside through the gap between the pot and the plunger, and injecting the molten resin that does not contain air and moisture into the molding cavity under pressure; The present invention relates to a transfer molding method comprising a step of heating the one plunger to a required temperature after the resin pressurization step of the plano jar is completed.
また、本発明装置は、先端加圧部内に流体の通路を形成
した樹脂タブレットの加圧用プランジャーと、上記流体
通路の両端連通日間に接続させる加熱流体の循環経路及
び冷却流体の循環経路とがら成）、上記両循環経路と上
記プランジャーの流体通路側とは切換バルブを介して夫
々交互に連通・遮閉可能に構成されていることを特徴と
する樹脂タブレットの加圧装置に係るものである。Furthermore, the device of the present invention comprises a plunger for pressurizing a resin tablet, which has a fluid passage formed in the tip pressurizing part, and a heating fluid circulation path and a cooling fluid circulation path connected to both ends of the fluid passage. ), the above-mentioned pressurizing device for a resin tablet is characterized in that the above-mentioned both circulation paths and the fluid passage side of the above-mentioned plunger are configured to be able to communicate with each other and close them alternately via a switching valve. .
また、本発明装置は、先端加圧部内に断・続切換可能な
加熱体を備えた樹脂タブレノ）の加圧用プランジャーと
、該プランジャ４の上記先端加圧部を冷却する送風冷却
器とから構成されていることを特徴とする樹脂タブレッ
トの加圧装置に係るものである。In addition, the device of the present invention includes a plunger for pressurizing a resin tableno (resin tableno) equipped with a heating element that can be switched on and off in the tip pressurizing section, and a blower cooler for cooling the tip pressurizing section of the plunger 4. The present invention relates to a pressurizing device for resin tablets characterized by the following configuration.
（実施例） 以下、本発明を実施例図に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on embodiment figures.
第１゛図は本発明方法に用いられる樹脂タブレットの加
圧装置Ａを備えた半導体素子の樹脂モールド成形用金型
Ｂを示［７ている。FIG. 1 shows a mold B for resin molding a semiconductor element, which is equipped with a pressurizing device A for resin tablets used in the method of the present invention.
上記金型Ｂは固定上型１と該上型に対設した可動下型２
とから構成されると共に、上型１側には糊ｌｌ旨〃ブレ
ηトＣのイ肚鉛田ゼー＋ｌ−Ｑふ 拮＋ｌＩ旨吋綴体の
上半体を成形する上キャピテイ４と、該上キャビティ内
の成形体を押出すためのエジェクタービン５等が設けら
れておち、また、下型２側には上記ポット３及び上キャ
ビティ４との各対向位置にカル部６及び下キャビティ７
が夫々設けられると共に、該カル部６と下キャビティ７
とはゲート８を介して連通形成されておシ、更に、下キ
ャビティ７の上面となる両型１・２のパーティングライ
ン（Ｐ−Ｌ）面には半導体素子を取シ付けたリードフレ
ーム９をセットするための係合凹所１０が設けられてお
シ（なお、上記したカル部６とゲート８との間に所要長
さの溶融樹脂移送用のランナーを構成した通常の成形用
金型を用いても差支えない、）、また、上記カル部６及
び下キャビティ７には樹脂成形体の押出用エジェクター
ビン１１−１２が夫々設けられている。The mold B consists of a fixed upper mold 1 and a movable lower mold 2 opposite to the upper mold.
In addition, the upper mold 1 side is filled with glue. Ejector turbines 5 and the like are provided for extruding the molded product in the upper cavity, and a cull portion 6 and a lower cavity 7 are provided on the lower mold 2 side at positions facing the pot 3 and the upper cavity 4, respectively.
are provided respectively, and the cull portion 6 and the lower cavity 7 are provided.
Furthermore, a lead frame 9 on which a semiconductor element is attached is formed on the parting line (PL) surface of both molds 1 and 2, which is the upper surface of the lower cavity 7. An engagement recess 10 is provided for setting the molten resin. ), and ejector turbines 11-12 for extruding resin moldings are provided in the cull portion 6 and the lower cavity 7, respectively.
また、上記加圧装置Ａはへ先端加圧部１３□内に流体の
通路１４を形成した樹脂タブレットＣの加圧用グランジ
ャー１３と、上記流体通路１４０両端両端口１４．・１
４、間に接続させる加熱流体りの循環経路１５及び冷却
流体Ｅの循環経路１６とから成シ、上記両循環経路１５
・１６と上記プランジャーの流体通路１４側とは切換バ
ルブ１７・１８を介して夫々交互に連通・遮閉可能に構
成されている。 なお、第１図において、符号Ｐ□ ・
Ｐ２で示すものは流体給送用のポンプ、同１９・２０は
加熱器及び冷却器、同２１はボット３とグランジャーの
先端加圧部１３１との間隙である。The pressurizing device A includes a grunger 13 for pressurizing the resin tablet C, which has a fluid passage 14 formed in the tip pressurizing part 13□, and an opening 14 at both ends of the fluid passage 140.・1
4. Consists of a heating fluid circulation path 15 and a cooling fluid E circulation path 16 connected between the two circulation paths 15.
16 and the fluid passage 14 side of the plunger are configured to be able to communicate and close alternately through switching valves 17 and 18, respectively. In addition, in Fig. 1, the symbol P□ ・
P2 is a pump for feeding fluid, 19 and 20 are heaters and coolers, and 21 is a gap between the bot 3 and the tip pressurizing part 131 of the granger.
次に本発明の詳細な説明する。Next, the present invention will be explained in detail.
マス、前記凹Ｐｆｒ１０内にリードフレーム９をセット
して両型１・２の型締めを行ない、次に、ボット８内に
樹脂タブレットＣを供給して該タブレフトを所要温度ま
で加熱すると共に、プランジャーの先端加圧部１３□に
よシ加圧して溶融化し、これをカル部６・ゲート８を通
して上下のキャビティ４・７内に加圧注入させるもので
ある。 しかしながら、上記したプランジャーの先端加
圧部１３□による樹脂タブレットＣの加圧時においては
、該先端加圧部の流体通路１４側□、と冷却流体Ｅの循
環経録１６とをバルブ１７・１８を介して連通させて、
該経路中のポンプＰ２によ）冷却流体（例えば、常温〜
約８０度の水）Ｅを流体通路１４に給送させておく。従
って、このとき、上記先端加圧部１３よけ所要温度に冷
却された状態で樹脂タブレットＣを加圧することになる
から、該タブレフトは、第２図の（Ａ）及び（Ｂ）に示
すように、金型の加熱部からの熱を最も多く受ける力ｐ
部６側から順次溶融化されていくことになる。このこと
は、上記樹脂タブレットＣのプランジャー１３側は時間
的に遅く溶融化されるということであシ、また、この加
圧溶融化作用は、第２図（Ｃ）に示すプランジャー１３
の加圧作用終了後まで略均−に行なわれるから、溶融化
された樹脂がゲート８を通して上下キャビティ４・７内
に順次加圧注入されることとも相俟って、上記溶融樹脂
Ｃ□がボット３と先端加圧部１３１との間隙２１を塞ぐ
ことがなく、従って、該間隙は樹脂タプレツ）Ｃの溶融
化の際に内部から流出した空気・水分を外部に排出する
一種のエアベントを構成するものである。The lead frame 9 is set in the concave Pfr10 and the molds 1 and 2 are clamped. Next, a resin tablet C is supplied into the bot 8 and the tablet left is heated to a required temperature, and the planar The tip of the jar is pressurized by the pressurizing part 13□ to melt it, and this is injected under pressure into the upper and lower cavities 4 and 7 through the cull part 6 and gate 8. However, when the resin tablet C is pressurized by the plunger tip pressurizing section 13□, the fluid passage 14 side □ of the tip pressurizing section and the circulation history 16 of the cooling fluid E are communicated via 18,
Cooling fluid (e.g., from room temperature to
Water (approximately 80 degrees Celsius) is supplied to the fluid passage 14. Therefore, at this time, the resin tablet C is pressurized while being cooled to the required temperature above the tip pressurizing part 13, so that the tablet left is as shown in (A) and (B) in FIG. , the force p that receives the most heat from the heated part of the mold
It will be sequentially melted from the part 6 side. This means that the plunger 13 side of the resin tablet C is melted later in time, and this pressurized melting action is caused by the plunger 13 side shown in FIG. 2(C).
This process is carried out almost evenly until the end of the pressurizing action of C□, so that the molten resin C□ is injected under pressure sequentially into the upper and lower cavities 4 and 7 through the gate 8. The gap 21 between the bot 3 and the tip pressurizing part 131 is not blocked, and therefore, the gap constitutes a type of air vent for discharging the air and moisture flowing out from the inside during melting of the resin tapelet (C) to the outside. It is something to do.
なお、上記した溶融樹脂Ｃ１中の空気・水分は上述した
樹脂タプレッ）Ｃの加熱加圧による溶融化の過程におい
て間隙２１から外部に排出されるため、該溶融樹脂自体
に空気・水分は含まれていない。 また、力μ部６−ゲ
ート８・上下キャビティ４・７内に存在する空気は、上
述した溶融樹脂Ｃ１を上下キャビティ４・７内へ加圧注
入する際に、両型１・２のパーティングライン間（又は
、核部に設けたエアベント）を通して外部に排出される
ものであるから、結局、リードフレーム９上の半導体素
子を樹脂モールドする成形樹脂体Ｃ３は、第２図（Ｄ）
に示すように、その内部或はその外表面のいずれにもボ
イドを形成することがないのである。Note that air and moisture in the above-mentioned molten resin C1 are discharged to the outside from the gap 21 during the process of melting the above-mentioned resin tapelet C by heating and pressurizing, so air and moisture are not contained in the molten resin itself. Not yet. In addition, the air existing in the force μ section 6-gate 8 and the upper and lower cavities 4 and 7 is removed from the parts of both molds 1 and 2 when the above-mentioned molten resin C1 is injected under pressure into the upper and lower cavities 4 and 7. Since it is discharged to the outside through between the lines (or through an air vent provided in the core part), the molded resin body C3 for resin-molding the semiconductor element on the lead frame 9 is as shown in FIG. 2(D).
As shown in Figure 2, no voids are formed either inside or on the outside surface.
また、第２図（Ｃ）に示すプランジャー１３の加圧作用
終了後において、その先端加圧部の流体通路１４側と加
熱流体りの循環経路１５とをバルブ１７・１８を介して
連通させ、且つ、該経路中のポンプＰ□によシ加熱流体
（少なくとも、溶融樹脂Ｃ１と略同じ温度の流体）Ｄを
流体通路１４に給送させると、先端加圧部１Ｂ□は所要
温度に加熱されてカル部６に残溜して硬化する成形樹脂
体Ｃ３との耐着を防止することができるのであシ、従っ
て、第２図（Ｄ）に示す型開き時において、上記成形樹
脂体Ｃ２・Ｃ３及びゲート８部の成形樹脂体Ｃ４を、上
下のニジエフクーピン５・１１・１２を介して両型１・
２間に容易に取シ呂すことができるのである。Further, after the pressurizing action of the plunger 13 as shown in FIG. , and when the pump P□ in the path supplies the heating fluid (at least a fluid with approximately the same temperature as the molten resin C1) D to the fluid passage 14, the tip pressurizing part 1B□ is heated to the required temperature. Therefore, when the mold is opened as shown in FIG. 2(D), the molded resin body C2 is・C3 and the molded resin body C4 of the gate 8 part are molded into both molds 1 and 2 through the upper and lower Nizhiev Coupins 5, 11, and 12.
It can be easily transferred between the two.
上記した本発明装置の実施例においては、プランジャー
の先端加圧部１８１を加熱流体り及び冷却流体Ｅを用い
て交互に加熱・冷却するように構成したものを示したが
、本発明装置におけるプランジャ、−先端加圧部の加熱
及び冷却手段として、第３図に示すような、加熱体及び
送風冷却器を採用しても差支えないものである。In the above-described embodiment of the device of the present invention, the tip pressurizing portion 181 of the plunger is alternately heated and cooled using the heating fluid stream and the cooling fluid E, but in the device of the present invention, As a means for heating and cooling the plunger and the tip pressurizing section, a heating body and a blower cooler as shown in FIG. 3 may be employed.
即ち、第３図に示す本発明装置の他の実施例は、先端加
圧部１３ぐ内に断・続切換可能な加熱体２２を備えた樹
脂タブレットの加圧用プランジャー１３′と、該プラン
ジャーの上記先端加圧部１３１を冷却する送風冷却器２
３とから構成される装置また、上記加熱体２２は、グラ
ンジャー１３′へ必した前実施例の作用における加圧作
用終了後に、手動的に、或は、成形サイクルと連動して
自動的に開閉されるスイッチ機構２２□によって所要温
度に加熱されると共に、ポット３Ｉ′の外部上方位置に
移動したときは上記スイッチ機構２２１’によシその加
熱状態を中止することができるように設けられておシ、
また、上記送風冷却器２３は、上方移動した先端加圧部
１３′Ｘの外方周囲を、常温の空気、或は、所要の冷風
２４を吹付けて該先端加圧部を所要温度に冷却すること
ができるように設けられている。従って、この第二実施
例の構成に基づく作用は、プランジャー先端加圧部１３
．′を加熱・冷却する作用の点において前実施例のもの
と相違するが、樹脂タブレッ）Ｃに対する加圧作用につ
いては、第２図の（Ａ）〜（Ｄ）に説明した前実施例の
作用と略同−であると共に、その効果についても同じく
前実施例の効果と略同−である。That is, another embodiment of the device of the present invention shown in FIG. Air blower cooler 2 that cools the tip pressurizing part 131 of the jar
Further, the heating body 22 is heated manually or automatically in conjunction with the molding cycle after the pressurizing action in the previous embodiment is completed, which is necessary for the granger 13'. It is heated to a required temperature by the switch mechanism 22□ which is opened and closed, and is provided so that the heating state can be stopped by the switch mechanism 221' when the pot 3I' is moved to a position above the outside of the pot 3I'. Oshi,
Further, the air cooler 23 blows room temperature air or a required amount of cold air 24 around the outer circumference of the tip pressurizing section 13'X that has moved upward to cool the tip pressurizing section to a required temperature. It is set up so that you can Therefore, the action based on the configuration of this second embodiment is as follows:
．． Although it is different from the previous embodiment in terms of the heating and cooling action of C, the pressurizing action on the resin tablet C is the same as that of the previous embodiment as explained in (A) to (D) of FIG. The effect is also substantially the same as that of the previous embodiment.
なお、その他の具体的構成は前実施例のものと略同−で
あるため、対応する構成部材には前実施例のものと同じ
符号を付している。Note that the other specific configurations are substantially the same as those of the previous embodiment, so corresponding constituent members are given the same reference numerals as those of the previous embodiment.
（本発明の作用・効果）
本発明方法によれば、樹脂タブレノトの加熱加圧による
溶融化の過程において、その溶融化の際に内部から流出
した空気・水分をポットとプランジャーとの間隙から効
率良く外部に排出するため、溶融樹脂中に空気・水分が
混入することがなく、従って、この溶融樹脂をキャビテ
ィ内に加圧注入することによシ、その成形樹脂体内部或
は外表面にボイドが形成されるのを確実に防止すること
ができて、この種の樹脂モールド成形品に要求される高
品質性及び高信頼性の向上を図ることができるといった
優れた効果を奏するものである。 特に、従来方法にお
いては、樹脂モールド成形サイクルの短縮化を図るとい
った観点から、ポット内の樹脂タブレットの溶融化とそ
のギャビテづ内への加圧注入作用を可及的に迅速に行な
うようにしていることから、プランジャーの先端加圧部
内に専用のヒータを備えてその加熱状態を維持しておき
、樹脂タブレフトを該先端加圧部とカル部との間におい
てその上下両端部から同時的に溶融化させていたため、
その溶融樹脂によってポットと１ランジヤーとの間隙が
塞がれることになシ、従って、その溶融化の際に内部か
ら流出しようとする空気・水分は再び溶融樹脂中に混入
した状態でキャビティ内へ加圧注入されるといった重大
な問題を有していたのである。このような問題は、具体
的には、発光ダイオードの初詣モールド成形時において
、その発光レンズ部内にボイドが形成されて該製品自体
の使用不能といった欠点として現われたり、また、半導
体素子の樹脂モールド成形品の耐久性低下或は外観不良
といった種々の弊害を生ずるものであるが、本発明方法
によるときは、上述したような従来の問題を確実に解消
することができるものである。(Operations and Effects of the Present Invention) According to the method of the present invention, in the process of melting the resin tablet by heating and pressurizing, air and moisture flowing out from inside during the melting are removed from the gap between the pot and the plunger. Because it is efficiently discharged to the outside, air and moisture do not get mixed into the molten resin. Therefore, by injecting the molten resin under pressure into the cavity, it is possible to remove the inside or outside surface of the molded resin body. It has excellent effects such as being able to reliably prevent the formation of voids and improving the high quality and high reliability required for this type of resin molded product. . In particular, in the conventional method, from the viewpoint of shortening the resin molding cycle, melting of the resin tablet in the pot and pressurized injection into the gap are performed as quickly as possible. Therefore, a dedicated heater is installed in the tip pressurizing part of the plunger to maintain its heated state, and the resin tab left is simultaneously heated from both upper and lower ends between the tip pressurizing part and the cull part. Because it was melted,
The molten resin will not close the gap between the pot and the first runger, and therefore, the air and moisture that try to flow out from inside during melting will be mixed into the molten resin again and flow into the cavity. This had the serious problem of being injected under pressure. Specifically, such problems appear as defects such as the formation of voids in the light emitting lens part during the first molding of light emitting diodes, making the product itself unusable, and also in resin molding of semiconductor elements. However, when using the method of the present invention, the above-mentioned conventional problems can be reliably solved, although various disadvantages such as decreased durability and poor appearance of the product occur.
寸だ、本発明装置によれば、１ランジヤーの先端加圧部
の冷却及び加熱を交互に行なうことができるので、樹脂
タブレットの溶融化の際に内部から流出する空気・水分
をポットとプランジャーとの間隙から効率良く列部へ排
出して該空気等をキゼテイ内へ加圧注入するといった従
来の弊害を確実に解消することができるといった優れた
効果を奏するものである。According to the device of the present invention, it is possible to alternately cool and heat the pressurizing part at the tip of one plunger, so that the air and moisture flowing out from inside when melting the resin tablet can be removed from the pot and plunger. This has an excellent effect in that it can reliably eliminate the conventional disadvantages of efficiently discharging air into the row section from the gap between the two and injecting the air under pressure into the interior of the container.
更に、本発明によれば、所定の圧縮精度に成形された樹
脂タブレットを使用しなければならないといった成形上
の制約を受けることがないといった優れた実用的効果を
奏するものである。Further, according to the present invention, excellent practical effects are achieved in that there is no restriction on molding such that resin tablets molded to a predetermined compression accuracy must be used.
図は本発明の実施例を示すものであシ、第１図は樹脂タ
ブレットの加圧装置と半導体素子の樹脂モールド成形用
金型との要部を示す一部切欠正面Ａ−・加圧装置、 Ｂ
−・・金型、 Ｃ−・樹脂タブレフト、 Ｃ１−・・溶
融樹脂、 Ｃ２・Ｃ３・Ｃ４−・成形樹脂体、 Ｄ・・
・加熱流体、 Ｅ−冷却流体、 ３・３′−・ポット、
４・７−・キャビティ、 １３・１３′−・１フンジ
ヤー、１３よ ・１３へ〜先端加圧部、 １４・−・流
体通路、１４Ｌ−・・両端連通口、 １７・１８・・・
切換バルブ、 ２１・−・間隙、 ２２・・・加熱体、
２３・・・送風冷却器。
特許出願人 長 １）道 男The figure shows an embodiment of the present invention, and FIG. 1 is a partially cutaway front view A showing the main parts of a pressurizing device for a resin tablet and a mold for resin molding a semiconductor element.Pressing device , B
- Mold, C- Resin table left, C1- Molten resin, C2, C3, C4- Molded resin body, D...
・Heating fluid, E-cooling fluid, 3・3′-・pot,
4.7-.Cavity, 13.13'-.1 funnel, 13.To 13~Tip pressurizing part, 14.-.Fluid passage, 14L-.Both ends communication port, 17.18..
switching valve, 21... gap, 22... heating element,
23... Air cooler. Patent applicant: 1) Michio
Claims (2)
給する工程と、ポット内の樹脂タブレットを所要温度に
冷却したプランジャ〜によシ加圧して、該樹脂タブレッ
トを順次溶融化させながら、該溶融樹脂中の空気・水分
をポットとプランジャーとの間隙から外部に排出すると
共に、該空気・水分を含まない溶融樹脂を成形キャビテ
ィ内に加圧注入させる工程と、プランジャーの樹脂加圧
工程終了後に該プランジャーを所要温度に加熱する工程
とから成るトランスファーモールド成形方法。(1) A step of supplying a resin tablet into a pot for supplying resin material, and pressurizing the resin tablet in the pot by a plunger cooled to a required temperature to sequentially melt the resin tablet. A step in which the air and moisture in the molten resin is discharged to the outside through the gap between the pot and the plunger, and the molten resin that does not contain air and moisture is injected into the molding cavity under pressure, and a step in which the resin is pressurized by the plunger. A transfer molding method comprising the step of heating the plunger to a required temperature after completion of the transfer molding process.
フトの加圧用プランジャーと、上記流体通路の両端連通
日間に接続させる加熱流体の循環経路及び冷却流体の循
環経路とから成シ、上記両循環ブを介して夫々交互に連
通・遮閉可能に構成されていることを特徴とする樹脂タ
ブレットの加圧装置。 Ｇ）先端加圧部内に断・続切換可能な加熱体を備えた樹
脂タブレットの加圧用プランジャーと、該プランジャー
の上記先端加圧部を冷却する送風冷却器とから構成され
ていることを特徴とする樹脂タブレットの加圧装置。(2) Consisting of a pressurizing plunger made of a resin tag left with a fluid passage formed in the tip pressurizing part, and a heating fluid circulation path and a cooling fluid circulation path connected to both ends of the fluid passage; A pressurizing device for a resin tablet, characterized in that it is configured to be able to communicate and close alternately through both circulation valves. G) It is composed of a plunger for pressurizing a resin tablet, which is equipped with a heating element that can be switched on and off in the tip pressurizing section, and a blower cooler that cools the tip pressurizing section of the plunger. Features a pressurizing device for resin tablets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10821384A JPS60251633A (en) | 1984-05-28 | 1984-05-28 | Transfer mold forming method and resin tablet pressurizing device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10821384A JPS60251633A (en) | 1984-05-28 | 1984-05-28 | Transfer mold forming method and resin tablet pressurizing device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60251633A true JPS60251633A (en) | 1985-12-12 |
| JPH0213931B2 JPH0213931B2 (en) | 1990-04-05 |
Family
ID=14478891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10821384A Granted JPS60251633A (en) | 1984-05-28 | 1984-05-28 | Transfer mold forming method and resin tablet pressurizing device thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60251633A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0186241U (en) * | 1987-11-30 | 1989-06-07 | ||
| EP0530377A1 (en) * | 1991-03-20 | 1993-03-10 | Nitto Denko Corporation | Semiconductor sealing resin tablet and its manufacture |
| US5200125A (en) * | 1988-12-24 | 1993-04-06 | T&K International Laboratory, Ltd. | Method for seal molding electronic components with resin |
| US5435953A (en) * | 1991-01-17 | 1995-07-25 | Towa Corporation | Method of molding resin for sealing an electronic device |
| US5603879A (en) * | 1993-04-22 | 1997-02-18 | Towa Corporation | Method of molding resin to seal electronic parts using two evacuation steps |
| US5770128A (en) * | 1992-04-13 | 1998-06-23 | Apic Yamada Corporation | Method of transfer molding and a transfer molding machine |
| EP0771636A3 (en) * | 1995-10-30 | 1999-08-18 | Towa Corporation | Resin sealing/molding apparatus for electronic parts |
| EP1765563A1 (en) * | 2004-07-01 | 2007-03-28 | Husky Injection Molding Systems Ltd. | Coinjection molding cooled shooting pot cylinder |
-
1984
- 1984-05-28 JP JP10821384A patent/JPS60251633A/en active Granted
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0186241U (en) * | 1987-11-30 | 1989-06-07 | ||
| US5200125A (en) * | 1988-12-24 | 1993-04-06 | T&K International Laboratory, Ltd. | Method for seal molding electronic components with resin |
| US5507633A (en) * | 1991-01-17 | 1996-04-16 | Towa Corporation | Resin molding apparatus for sealing an electronic device |
| US5435953A (en) * | 1991-01-17 | 1995-07-25 | Towa Corporation | Method of molding resin for sealing an electronic device |
| US5645787A (en) * | 1991-03-20 | 1997-07-08 | Nitto Denko Corporation | Process for producing semiconductor devices using resin tablets |
| EP0530377A1 (en) * | 1991-03-20 | 1993-03-10 | Nitto Denko Corporation | Semiconductor sealing resin tablet and its manufacture |
| US5770128A (en) * | 1992-04-13 | 1998-06-23 | Apic Yamada Corporation | Method of transfer molding and a transfer molding machine |
| US5834035A (en) * | 1993-04-19 | 1998-11-10 | Towa Corporation | Method of and apparatus for molding resin to seal electronic parts |
| US5603879A (en) * | 1993-04-22 | 1997-02-18 | Towa Corporation | Method of molding resin to seal electronic parts using two evacuation steps |
| EP0771636A3 (en) * | 1995-10-30 | 1999-08-18 | Towa Corporation | Resin sealing/molding apparatus for electronic parts |
| EP1134064A2 (en) * | 1995-10-30 | 2001-09-19 | Towa Corporation | Resin sealing/molding apparatus for electronic parts |
| SG90015A1 (en) * | 1995-10-30 | 2002-07-23 | Towa Corp | Resin sealing/molding apparatus for electronic parts |
| EP1134064A3 (en) * | 1995-10-30 | 2004-03-03 | Towa Corporation | Resin sealing/molding apparatus for electronic parts |
| EP1765563A1 (en) * | 2004-07-01 | 2007-03-28 | Husky Injection Molding Systems Ltd. | Coinjection molding cooled shooting pot cylinder |
| EP1765563A4 (en) * | 2004-07-01 | 2007-08-29 | Husky Injection Molding | Coinjection molding cooled shooting pot cylinder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0213931B2 (en) | 1990-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2612795B2 (en) | Runnerless injection molding equipment | |
| US6068809A (en) | Method of injection molding elements such as semiconductor elements | |
| GB2252746A (en) | Resin sealing of electronic parts | |
| CN104070634B (en) | Products formed process units, products formed production method and products formed | |
| US5204122A (en) | Mold for use in resin encapsulation molding | |
| JPS60251633A (en) | Transfer mold forming method and resin tablet pressurizing device thereof | |
| JPH0820040A (en) | Injection molding method | |
| JPH0416940B2 (en) | ||
| JPH09141688A (en) | Method and apparatus for injection molding electronic part | |
| JPS6315892B2 (en) | ||
| JPH0537474Y2 (en) | ||
| JPH0374892B2 (en) | ||
| JPH0356341Y2 (en) | ||
| JP3581743B2 (en) | Method and apparatus for resin sealing molding of electronic parts | |
| JPS6031930A (en) | Compression molding method of thermoplastic resin | |
| JP2666630B2 (en) | Method for manufacturing semiconductor device | |
| JP2518661B2 (en) | Method and apparatus for resin encapsulation molding of semiconductor element | |
| JPS5889334A (en) | Injection molding metal die | |
| JPH11168114A (en) | Resin encapsulating apparatus for semiconductor chip | |
| KR101973630B1 (en) | Resin molding manufacturing method using the resin backflow gas injection | |
| KR100340979B1 (en) | Resin bag molding method of electronic parts | |
| CN210362287U (en) | Cold runner system for thermosetting plastic development | |
| JPH0418464B2 (en) | ||
| JP2000000850A (en) | Metal mold for injection molding | |
| JPS61125821A (en) | Resin molding device |