JPH0418464B2 - - Google Patents
Info
- Publication number
- JPH0418464B2 JPH0418464B2 JP59208843A JP20884384A JPH0418464B2 JP H0418464 B2 JPH0418464 B2 JP H0418464B2 JP 59208843 A JP59208843 A JP 59208843A JP 20884384 A JP20884384 A JP 20884384A JP H0418464 B2 JPH0418464 B2 JP H0418464B2
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- mold
- transfer
- cavity
- molten resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 63
- 229920005989 resin Polymers 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 51
- 238000012546 transfer Methods 0.000 claims description 40
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 238000000465 moulding Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 10
- 238000004891 communication Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、リードフレーム上に取付けた半導
体素子の樹脂モールド成形方法の改良に関するも
のであり、特に、半導体素子をトランスフアモー
ルド金型を用いて樹脂モールドする成形技術産業
の分野において利用されるものである。Detailed Description of the Invention (Field of Industrial Application) This invention relates to an improvement in a resin molding method for a semiconductor element mounted on a lead frame, and particularly relates to a method for molding a semiconductor element using a transfer mold. It is used in the field of molding technology industry where resin molding is performed.
（従来の技術）
半導体素子のトランスフアモールド金型の基本
的な構成例としては、例えば、固定上型と、これ
に対向配設した可動下型と、樹脂材料の供給ポツ
トと、該ポツト内の樹脂材料を溶解化させるヒー
タ及びプランジヤーと、上記両型間に対設した成
形用キヤビテイ部と、該キヤビテイ内と上記ポツ
トとを連通させるカル部・ランナ部及びゲート部
から成る溶融樹脂材料の移送経路等を配設したも
のが知られている。このような従来金型を用いて
半導体素子の樹脂モールド成形を行なう場合は、
リードフレーム上の半導体素子をキヤビテイ部の
所定位置にセツトして両型の型締めを行ない、次
に、ポツト内に樹脂材料を供給すると共にこれを
加熱加圧して溶解化し、次に、この溶融樹脂材料
を移送経路を通してキヤビテイ内に加圧注入し、
これにより半導体素子を樹脂モールド成形するも
のである。(Prior Art) A basic configuration example of a transfer mold mold for a semiconductor device includes, for example, a fixed upper mold, a movable lower mold disposed opposite to the fixed upper mold, a resin material supply pot, and a mold inside the pot. A heater and a plunger for melting the resin material, a molding cavity portion disposed oppositely between the two molds, and a cull portion, a runner portion, and a gate portion that communicate the inside of the cavity with the pot. There are known devices in which a transfer route and the like are provided. When performing resin molding of semiconductor elements using such conventional molds,
The semiconductor element on the lead frame is set in a predetermined position in the cavity, and both molds are clamped.Next, a resin material is supplied into the pot and melted by heating and pressurizing it. The resin material is injected under pressure into the cavity through the transfer path,
In this way, the semiconductor element is resin molded.
ところで、上記型締後の金型におけるポツト・
移送経路及びキヤビテイ部には空気が残溜してお
り、この残溜空気がキヤビテイ内において溶融樹
脂材料中に混入した場合は、その成形樹脂体の内
部或は外表面にボイド（気泡）或はピンホール若
しくは欠損部を形成して、これが半導体成形品の
耐水（湿）性及び信頼性を低下させると共にその
外観を損う等の弊害を生ずるものである。ところ
が、従来の上記残溜空気の排出作用は、キヤビテ
イ側へ加圧移送する溶融樹脂材料の流れを利用す
るものであるため、プランジヤーによる樹脂材料
の加圧力を必要以上に高めたり、樹脂材料の使用
量を所要量以上に用いなければならないといつた
問題があると共に、溶融樹脂材料の加圧移送時に
移送経路内の残溜空気が該樹脂材料中に巻き込ま
れてこれがキヤビテイ内に注入されるのを確実に
防止することができないといつた問題があり、従
つて、金型の全体的な耐久性を低下させると共
に、樹脂材料の有効利用率を低下させ、更には、
高品質の半導体成形品を確実に成形することがで
きない等の欠点を有するものであつた。 By the way, the pots and
Air remains in the transfer path and the cavity, and if this residual air mixes into the molten resin material within the cavity, voids (bubbles) or Pinholes or missing parts are formed, which causes problems such as lowering the water resistance (humidity) and reliability of the semiconductor molded product and impairing its appearance. However, the conventional method of discharging the residual air utilizes the flow of molten resin material that is transferred under pressure to the cavity side, so it may cause the pressing force of the resin material by the plunger to be increased more than necessary, or the resin material may be damaged. There is a problem that the amount used must be more than the required amount, and when the molten resin material is transferred under pressure, residual air in the transfer path is drawn into the resin material and is injected into the cavity. There is a problem that it is not possible to reliably prevent this, and as a result, it reduces the overall durability of the mold, reduces the effective utilization rate of the resin material, and furthermore,
This method has drawbacks such as the inability to reliably mold high-quality semiconductor molded products.
（発明が解決しようとする問題点）
本発明は、トランスフアモールド金型における
溶融樹脂材料の移送経路とキヤビテイ内に残溜す
る空気を効率良く外部に排出して、該残溜空気が
溶融樹脂材料中に混入するのを確実に防止するこ
とによつて、上記残溜空気の混入に起因する上述
したような従来の問題点を解消することを目的と
するものである。(Problems to be Solved by the Invention) The present invention efficiently exhausts the air remaining in the transfer path of the molten resin material and the cavity in the transfer mold mold to the outside, so that the remaining air can be removed from the molten resin. The object of this invention is to eliminate the above-mentioned conventional problems caused by the incorporation of residual air by reliably preventing the incorporation of residual air into the material.
また、本発明は、使用する樹脂材料の有効利用
率の向上と、使用する金型の全体的な耐久性の向
上をも図ることを目的とするものである。 The present invention also aims to improve the effective utilization rate of the resin material used and the overall durability of the mold used.
（問題点を解決するための手段）
本発明に係る半導体素子のトランスフア樹脂モ
ールド成形方法は、対向配設した両型のキヤビテ
イ部に半導体素子を取付けたリードフレームをセ
ツトして該両型の型合せをするトランスフアモー
ルド金型の型締工程を行ない、次に、金型ポツト
内への樹脂材料供給工程を行ない、次に、該ポツ
ト内の樹脂材料を加熱・加圧して溶融化する樹脂
材料の溶融化工程を行ない、次に、ポツト内の溶
融樹脂材料を金型のカル部・ランナ部・ゲート部
から成る移送経路を通して成形キヤビテイ内に加
圧注入する溶融樹脂材料の加圧移送工程を行なう
と共に、この加圧移送工程を同時に、上記移送経
路におけるランナ部から該経路中の残溜空気を外
部に吸引排除する移送経路内のバキユーム工程及
び上記キヤビテイに連通させたエアベントから該
キヤビテイ内の残溜空気を外部に吸引排除するキ
ヤビテイ内のバキユーム工程を行ない、次に、上
記移送経路の経路終端部側を閉じて溶融樹脂材料
の外部流出を防止する移送経路の遮閉工程を行な
い、更に、所要の樹脂モールド成形時間経路後
に、上記移送経路を開放すると共に両型を型開き
して半導体樹脂モールド成形品を外部へ取出す型
閉工程を行なうことを特徴とするものである。(Means for Solving the Problems) The transfer resin molding method for a semiconductor element according to the present invention involves setting a lead frame on which a semiconductor element is mounted in the cavity portions of both types disposed facing each other. A mold clamping process is carried out for the transfer mold molds for mold matching, then a process is carried out to supply resin material into the mold pot, and then the resin material in the pot is heated and pressurized to melt it. The process of melting the resin material is carried out, and then the molten resin material in the pot is pressurized and injected into the molding cavity through the transfer path consisting of the cull part, runner part, and gate part of the mold. At the same time, this pressurized transfer process is simultaneously carried out through a vacuum process in the transfer route that suctions and removes residual air in the route from the runner section in the transfer route to the outside, and from an air vent communicating with the cavity to the cavity. A vacuuming process is performed inside the cavity to suck out the residual air inside the cavity to the outside, and then a closing process of the transfer path is performed to close the end of the transfer path to prevent the molten resin material from flowing out. Furthermore, after a required resin molding time has elapsed, a mold closing step is performed in which the transfer path is opened and both molds are opened to take out the semiconductor resin molded product to the outside.
（作用）
従つて、本発明方法においては、移送経路とキ
ヤビテイ内に残溜する空気の排除が効率良く、且
つ、確実に行なわれるので、キヤビテイ側に加圧
移送される溶融樹脂材料中に上記残溜空気が混入
することがないのである。(Function) Therefore, in the method of the present invention, the air remaining in the transfer route and the cavity is efficiently and reliably removed, so that the above-mentioned air is removed from the molten resin material transferred under pressure to the cavity side. This prevents residual air from getting mixed in.
また、上記移送経路の経路終端部側の遮閉工程
により、溶融樹脂材料の外部流出作用が防止され
ることから、該経路のゲート部を通してキヤビテ
イ内に加圧注入される溶融樹脂材料の加圧注入作
用が、夫々均等な条件下で行なわれることになる
ものである。 In addition, since the closing process at the end of the transfer route prevents the molten resin material from flowing out, the molten resin material that is pressurized and injected into the cavity through the gate of the route is pressurized. The injection action is to be carried out under equal conditions.
（実施例）
次に、本発明方法を実施例図に基づいて説明す
る。(Example) Next, the method of the present invention will be explained based on example diagrams.
第１図及び第２図は、本発明方法を使用する場
合に用いられるトランスフアモールド金型の要部
を示しており、該金型は、固定上型１と、該上型
１に対向配設した可動下型２と、上型１側に配設
した樹脂材料３の供給用ポツト４と、該ポツト４
に嵌合させた樹脂材料加圧用プランジヤー５と上
下両型１，２間に対設した成形用キヤビテイ６…
６と、上記下型２のパーテイングラインＰ・Ｌ面
に配設した上記キヤビテイ６…６とポツト４とを
連通させるカル部７1・ランナ部７2及びゲート部
７3から成る溶融樹脂材料の移送経路７と、ポツ
ト４内の樹脂材料加熱用のヒータ及びキヤビテイ
６…６と移送経路７内にて成形される樹脂成形体
のエジエクター機構（図示なし）等から構成され
ている。 FIGS. 1 and 2 show the main parts of a transfer mold mold used when using the method of the present invention, and the mold includes a fixed upper mold 1 and A movable lower mold 2 provided, a supply pot 4 for resin material 3 provided on the upper mold 1 side, and the pot 4
A plunger 5 for pressurizing a resin material fitted into a molding cavity 6 disposed oppositely between the upper and lower molds 1 and 2...
6, a molten resin material consisting of a cull part 71 , a runner part 72, and a gate part 73 , which communicate the cavities 6...6 arranged on the parting line P and L surfaces of the lower die 2 and the pot 4. , a transfer path 7, heaters and cavities 6 for heating the resin material in the pots 4, and an ejector mechanism (not shown) for the resin molded body molded in the transfer path 7.
また、上記移送経路７の経路終端部７4には、
真空源（図示なし）側と連結させた吸気（バキユ
ーム用）経路８が連通開口されると共に、該吸気
経路の連通開口８1よりもポツト４側となる経路
終端部７4（ランナ部７）には、該ポツト４側と吸
気経路の連通開口部８1とを連通又は遮閉するス
トツパー機構９が配設されており、該ストツパー
機構は、溶融樹脂材料のストツパー９1と、該ス
トツパーを経路終端部７4に対して進退させる油
（空）圧装置９2とから構成されている。 Further, at the route end portion 74 of the transfer route 7,
An intake (vacuum) path 8 connected to a vacuum source (not shown) side is opened for communication, and a path terminal portion 7 4 (runner section 7) is located closer to the pot 4 than the communication opening 8 1 of the intake path. is provided with a stopper mechanism 9 that communicates or closes the pot 4 side and the communication opening 81 of the intake path, and the stopper mechanism includes a stopper 91 made of molten resin material and a stopper mechanism 9 that connects the stopper It is comprised of a hydraulic (pneumatic) device 9 2 that moves forward and backward with respect to the path end portion 7 4 .
更に、キヤビテイ６…６部には、第２図に示す
ように、該キヤビテイ６と真空源（図示なし）側
とを連結させたエアベント（吸気経路）１０が連
通開口されると共に、該エアベント１０の連通開
口部１０1よりも上記真空源側となる位置には、
該キヤビテイ６と該真空源側とを連通又は遮閉さ
せるストツパー機構１１が配設されており、該ス
トツパー機構は、溶融樹脂材料のストツパー１１
１と、該ストツパーをエアベント１０に対して進
退させる油（空）圧装置（図示なし）とから構成
されている。 Furthermore, as shown in FIG. 2, an air vent (intake path) 10 connecting the cavity 6 and a vacuum source (not shown) is opened in the cavities 6...6, and the air vent 10 At a position closer to the vacuum source than the communication opening 101 ,
A stopper mechanism 11 for communicating or closing the cavity 6 and the vacuum source side is provided, and the stopper mechanism 11 is made of a molten resin material.
1 , and a hydraulic (pneumatic) device (not shown) that moves the stopper forward and backward relative to the air vent 10.
なお、図中符号１２は、両型１・２のパーテイ
ングラインＰ・Ｌに配設されたシール部材を示す
ものである。 Note that the reference numeral 12 in the figure indicates a sealing member disposed at the parting lines P and L of both molds 1 and 2.
上記した金型を用いて半導体素子の樹脂モール
ド成形を行なう場合は、まず、キヤビテイ６…６
部の所定位置に半導体素子を取付けたリードフレ
ームをセツトして型締めを行ない、次に、ポツト
４内に樹脂材料３を供給し、次に、該材料３をヒ
ータにて所要温度にまで加熱すると共に、第３図
に示すように、プランジヤー５により加圧して溶
融化し、次に、プランジヤー５を更に下降させて
溶融樹脂材料３1をキヤビテイ６…６側へ加圧移
送する。また、上記材料３1の加圧移送と同時に、
真空源を作動させて、移送経路７とキヤビテイ６
…６内の残溜空気を、吸気経路８とエアベント１
０を通して夫々外部へ強制的に吸引排除して該移
送経路７とキヤビテイ６…６内を真空状態とす
る。 When performing resin molding of a semiconductor element using the above-mentioned mold, first, the cavities 6...6
A lead frame with a semiconductor element attached thereto is set at a predetermined position in the mold and the mold is clamped.Next, a resin material 3 is supplied into the pot 4, and then the material 3 is heated to a required temperature with a heater. At the same time, as shown in FIG. 3, the molten resin material 31 is pressurized and melted by the plunger 5, and then the plunger 5 is further lowered to transfer the molten resin material 31 to the cavities 6...6 side under pressure. In addition, at the same time as the pressurized transfer of the material 3 1 ,
Activate the vacuum source to remove the transfer path 7 and cavity 6.
…The residual air in 6 is transferred to the intake path 8 and air vent 1.
0 to the outside to create a vacuum in the transfer path 7 and the cavities 6...6.
次に、ストツパー機構の油（空）圧装置９2を
作動して、そのストツパー９1・１１1により上記
吸気経路８及びエアベント１０の連通開口部８
１・１０1とポツト４側及びキヤビテイ６側とを遮
閉し、この状態で、第４図に示すように、プラン
ジヤー５の加圧力により溶融樹脂材料３1を移送
経路７を通してキヤビテイ６…６内に加圧注入
し、更に、所要時間経過後に、ストツパー９1・
１１1を元の位置に復動させると共に型開きをし
てエジエクター機構により半導体樹脂モールド成
形品及び移送経路７内等に成形されるコールドス
ラグを両型１・２間に取出せばよいのである。 Next, the hydraulic (pneumatic) device 9 2 of the stopper mechanism is activated, and the stoppers 9 1 and 11 1 open the communication opening 8 between the intake passage 8 and the air vent 10 .
1.10 1 and the pot 4 side and the cavity 6 side are closed off, and in this state, as shown in FIG. After the required time has elapsed, the stopper 9 1 .
11 1 is returned to its original position, the mold is opened, and the semiconductor resin molded product and the cold slag molded in the transfer path 7 are taken out between the molds 1 and 2 by the ejector mechanism.
なお、上記したプランジヤー５の下降は、溶融
樹脂材料３1がカル部７1に充填されたとき（第３
図に示す状態）に一時的にその下動を中止させ
て、移動経路７とキヤビテイ６…６内の上記した
バキユーム工程をより確実に行なうようにしても
よい。また、上記バキユーム工程は、プランジヤ
ー５が完全に下降されるまで（第４図）継続して
行なうことが好ましい。 Note that the above-described descent of the plunger 5 occurs when the molten resin material 3 1 is filled into the cull portion 7 1 (the third
In the state shown in the figure), the downward movement may be temporarily stopped to more reliably perform the above-described vacuuming process in the moving path 7 and the cavities 6...6. Further, it is preferable that the vacuum step is continued until the plunger 5 is completely lowered (FIG. 4).
上記した実施例においては、移送経路７とキヤ
ビテイ６…６内を真空状態に維持することができ
るので、溶融樹脂材料中に残溜空気が混入するの
を効率良く、且つ、確実に防止し得て、キヤビテ
イ６…６内で成形される半導体樹脂モールド成形
体の内部或は外表面に、上記残溜空気に起因する
ボイド或はピンボール若しくは欠損部が形成され
るのを確実に防止することができるものである。 In the above-described embodiment, since the transfer path 7 and the cavities 6...6 can be maintained in a vacuum state, it is possible to efficiently and reliably prevent residual air from entering the molten resin material. To reliably prevent the formation of voids, pinballs, or missing parts caused by the residual air on the inside or outside surface of the semiconductor resin molded body molded in the cavities 6...6. It is something that can be done.
更に、上記した作用・効果に加えて、溶融樹脂
材料３1の外部流出防止により、ゲート７3を通し
てキヤビテイ６…６内に注入される該材料３1の
加圧注入条件の均等化による樹脂モールド成形体
の均一及び高品質化を図ることができると共に、
樹脂材料の使用量減少及び有効利用率の向上を図
ることができ、更には、樹脂材料３（３1）に対
するプランジヤー５の加圧力を一定に維持し得
て、成形金型の耐久性向上を図ることができる等
の効果を奏するものである。 Furthermore, in addition to the above-mentioned functions and effects, by preventing the molten resin material 3 1 from flowing out, the resin mold is improved by equalizing the pressurized injection conditions for the material 3 1 injected into the cavities 6...6 through the gate 7 3 . It is possible to achieve uniformity and high quality of the molded product, and
It is possible to reduce the amount of resin material used and improve the effective utilization rate, and furthermore, it is possible to maintain a constant pressure force of the plunger 5 on the resin material 3 (3 1 ), thereby improving the durability of the molding die. This has effects such as being able to achieve the desired results.
（発明の効果）
本発明方法によれば、加圧移送する溶融樹脂材
料中に金型内の残溜空気が混入しないので、半導
体樹脂モールド成形体の内部或は外表面にボイド
或はピンボール若しくは欠損部が形成されること
がなく、従つて、半導体成形品の耐水（湿）性及
び信頼性を著しく向上することができると共に、
外観に優れた半導体成形品を成形することができ
る大きな効果を奏するものである。また、キヤビ
テイ内への溶融樹脂材料の加圧注入条件の均等
化、及び、該材料の加圧力一定化による半導体成
形品の高品質化と樹脂材料の有効利用率の向上、
及び、成形金型の耐久性向上を図ることができる
ので、前述した従来方法における問題点を確実に
解消できる優れた効果を奏するものである。(Effects of the Invention) According to the method of the present invention, residual air in the mold is not mixed into the molten resin material transferred under pressure, so there are no voids or pinballs inside or on the outer surface of the semiconductor resin molded product. Or, no defects are formed, and therefore, the water resistance (moisture) and reliability of the semiconductor molded product can be significantly improved, and
This has the great effect of making it possible to mold semiconductor molded products with excellent appearance. In addition, by equalizing the pressurized injection conditions of the molten resin material into the cavity and by making the pressing force of the material constant, the quality of semiconductor molded products is improved and the effective utilization rate of the resin material is improved.
In addition, since the durability of the molding die can be improved, the above-mentioned problems of the conventional method can be reliably solved.
図は本発明方法の実施例を示すものであり、第
１図は半導体素子のトランスフアモールド金型の
要部を示す一部切欠縦断面図、第２図はそのキヤ
ビテイ部の一部切欠平面図、第３図及び第４図は
いずれも本発明方法の作用説明図である。
１……上型、２……下型、３……樹脂材料、３
１……溶融樹脂材料、４……ポツト、５……プラ
ンジヤー、６……キヤビテイ、７……移送経路、
７1……カル部、７2……ランナ部、７3……ゲー
ト部、７4……経路終端部、８……吸気経路、９
……ストツパー機構、１０……エアベント、１１
……ストツパー機構。
The figures show an embodiment of the method of the present invention, in which Fig. 1 is a partially cutaway vertical sectional view showing the main parts of a transfer mold mold for a semiconductor element, and Fig. 2 is a partially cutaway plan view of the cavity part thereof. FIG. 3, and FIG. 4 are all explanatory diagrams of the operation of the method of the present invention. 1... Upper mold, 2... Lower mold, 3... Resin material, 3
1 ... Molten resin material, 4... Pot, 5... Plunger, 6... Cavity, 7... Transfer route,
7 1 ...Cull part, 7 2 ...Runner part, 7 3 ...Gate part, 7 4 ...Route end part, 8...Intake route, 9
...Stopper mechanism, 10...Air vent, 11
...stopper mechanism.
Claims (1)
子を取付けたリードフレームをセツトして該両型
の型合せをするトランスフアモールド金型の型締
工程を行ない、次に、金型ポツト内への樹脂材料
供給工程を行ない、次に、該ポツト内の樹脂材料
を加熱・加圧して溶融化する樹脂材料の溶融化工
程を行ない、次に、ポツト内の溶融樹脂材料を金
型のカル部・ランナ部・ゲート部から成る移送経
路を通して成形キヤビテイ内に加圧注入する溶融
樹脂材料の加圧移送工程を行なうと共に、この加
圧移送工程と同時に、上記移送経路におけるラン
ナ部から該経路中の残溜空気を外部に吸引排除す
る移送経路内のバキユーム工程及び上記キヤビテ
イに連通させたエアベントから該キヤビテイ内の
残溜空気を外部に吸引排除するキヤビテイ内のバ
キユーム工程を行ない、次に、上記移送経路の経
路終端部側を閉じて溶融樹脂材料の外部流出を防
止する移送経路の遮閉工程を行ない、更に、所要
の樹脂モールド成形時間経過後に上記移送経路を
開放すると共に両型を型開きして半導体樹脂モー
ルド成形品を外部へ取出す型開工程を行なうこと
を特徴とする半導体素子のトランスフア樹脂モー
ルド成形方法。1. A lead frame with a semiconductor element attached to it is set in the cavities of both molds arranged facing each other, and a clamping process of the transfer mold mold is performed to match the two molds. Next, the lead frame is placed into the mold pot. Next, a resin material supplying step is carried out in which the resin material in the pot is heated and pressurized to melt it, and then the molten resin material in the pot is poured into the cull part of the mold.・A pressurized transfer step is carried out to inject the molten resin material into the molding cavity through a transfer path consisting of a runner section and a gate section, and at the same time, the molten resin material is injected into the molding cavity through a transfer path consisting of a runner section and a gate section. A vacuum step in the transfer path for sucking and discharging residual air to the outside and a vacuum step in the cavity for sucking and discharging the residual air in the cavity to the outside from an air vent communicated with the cavity are performed, and then the transfer A step of closing the transfer path is performed by closing the end of the path to prevent the molten resin material from flowing out.Furthermore, after the required resin molding time has elapsed, the transfer path is opened and both molds are opened. 1. A transfer resin molding method for a semiconductor element, characterized in that a mold opening step is performed to take out a semiconductor resin molded product to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20884384A JPS6185829A (en) | 1984-10-03 | 1984-10-03 | Transfer resin molding process of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20884384A JPS6185829A (en) | 1984-10-03 | 1984-10-03 | Transfer resin molding process of semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6185829A JPS6185829A (en) | 1986-05-01 |
| JPH0418464B2 true JPH0418464B2 (en) | 1992-03-27 |
Family
ID=16563019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20884384A Granted JPS6185829A (en) | 1984-10-03 | 1984-10-03 | Transfer resin molding process of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185829A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0644581B2 (en) * | 1986-06-27 | 1994-06-08 | 三菱電機株式会社 | Method for manufacturing resin-sealed semiconductor |
| FR2615037B1 (en) * | 1987-05-06 | 1990-04-27 | Radiotechnique Compelec | PROCESS AND MOLD FOR THE ENCAPSULATION OF A SEMICONDUCTOR DEVICE BY RESIN INJECTION |
| JPWO2008093511A1 (en) * | 2007-01-30 | 2010-05-20 | コニカミノルタオプト株式会社 | Optical element molding apparatus and optical element molding method |
| JP5824765B2 (en) * | 2011-01-11 | 2015-12-02 | アピックヤマダ株式会社 | Resin molding method, resin molding apparatus, and supply handler |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5868940A (en) * | 1981-10-20 | 1983-04-25 | Oki Electric Ind Co Ltd | Transfer molding press for plastic molded type semiconductor |
| JPS58155727A (en) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | Mold for resin sealing of semiconductor device |
| JPS5911232A (en) * | 1982-07-12 | 1984-01-20 | Hitachi Ltd | Resin sealing method |
-
1984
- 1984-10-03 JP JP20884384A patent/JPS6185829A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5868940A (en) * | 1981-10-20 | 1983-04-25 | Oki Electric Ind Co Ltd | Transfer molding press for plastic molded type semiconductor |
| JPS58155727A (en) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | Mold for resin sealing of semiconductor device |
| JPS5911232A (en) * | 1982-07-12 | 1984-01-20 | Hitachi Ltd | Resin sealing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6185829A (en) | 1986-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2524955B2 (en) | Method and apparatus for resin sealing molding of electronic parts | |
| EP0477967B1 (en) | Method for press molding thermoplastic resin | |
| JP3423766B2 (en) | Resin encapsulation molding method and mold device for electronic components | |
| JPH0418464B2 (en) | ||
| KR20010021240A (en) | Resin-sealing apparatus | |
| JPS6152780B2 (en) | ||
| JP2002018912A (en) | Mold for injection molding and method for injection molding | |
| JPH0682698B2 (en) | Automatic continuous transfer resin molding method for semiconductor devices | |
| JP2893085B2 (en) | Method and apparatus for resin sealing molding of electronic parts | |
| JPH0229010B2 (en) | ||
| JPH0213931B2 (en) | ||
| JPH06155529A (en) | Injection molding method of plastic | |
| JPH0482236A (en) | Method and apparatus for resin sealing and molding of electronic component | |
| JPH09207174A (en) | Semiconductor mold apparatus | |
| JPH04201220A (en) | Molding die | |
| JPS6035245B2 (en) | Injection molding method | |
| JPH0554412B2 (en) | ||
| JPS646266Y2 (en) | ||
| JPS5889334A (en) | Injection molding metal die | |
| JP2736554B2 (en) | Resin sealing molding method and method of forming resin injection gate | |
| JPH06132331A (en) | Semiconductor sealing mold | |
| JPH08108455A (en) | Mold for sealing semiconductor resin | |
| JPH04179242A (en) | Sealing method for semiconductor element | |
| JPH05166866A (en) | Method and apparatus for resin-sealing of electronic component, and lead frame | |
| JP2002187175A (en) | Method for taking out semiconductor resin sealed molded article |