JPH0213931B2 - - Google Patents
Info
- Publication number
- JPH0213931B2 JPH0213931B2 JP10821384A JP10821384A JPH0213931B2 JP H0213931 B2 JPH0213931 B2 JP H0213931B2 JP 10821384 A JP10821384 A JP 10821384A JP 10821384 A JP10821384 A JP 10821384A JP H0213931 B2 JPH0213931 B2 JP H0213931B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plunger
- pressurizing
- pot
- tablet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 84
- 229920005989 resin Polymers 0.000 claims description 84
- 239000012530 fluid Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 19
- 238000000465 moulding Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- 239000012809 cooling fluid Substances 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000001721 transfer moulding Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000010309 melting process Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、トランスフアーモールド成形方法
と、これに用いられる樹脂タブレツトの加圧用プ
ランジヤーの改良に関するものであり、主とし
て、半導体素子の樹脂モールド成形技術産業の分
野において利用されるものである。Detailed Description of the Invention (Field of Industrial Application) This invention relates to a transfer molding method and an improvement of a plunger for pressurizing a resin tablet used in the method, and mainly relates to a transfer molding method and a plunger for pressurizing a resin tablet. It is used in the field of technology industry.
（従来技術とその問題点）
半導体素子を樹脂封入成形する場合は、通常、
ポツト内に供給した樹脂材料を加熱すると共に、
これをプランジヤーにて加圧することにより溶融
化し、更に、上記プランジヤーの加圧力にて溶融
樹脂をランナ及びゲート等の移送経路を通して成
形用キヤビテイ内に注入するようにしている。(Prior art and its problems) When molding semiconductor elements with resin, usually
While heating the resin material supplied into the pot,
This is melted by applying pressure with a plunger, and the molten resin is injected into the molding cavity through transfer paths such as runners and gates under the pressure of the plunger.
ところで、上記樹脂材料はパウダーを固化させ
た所要形状のタブレツトを用いることにより、該
材料のポツト内への供給を容易化することが行な
われている。この樹脂タブレツトは、上述したよ
うに、ポツト内において加熱・加圧されて溶融状
態となるが、該ポツト内部及びタブレツト自体に
は空気と水分が存在すること、また、ポツトはタ
ブレツトの溶融化をスムーズに行なう目的で加熱
状態に維持されていること等から、投入供給され
たタブレツトはポツト内において加熱膨張される
ことになる。従つて、樹脂成形時においては、ポ
ツト内の空気及びタブレツト自体の空気・水分が
キヤビテイ内に混入して樹脂成形体にボイド（気
泡）を成形し易い欠点があると共に、タブレツト
の膨張を考慮して、所定の圧縮（密度）精度に成
形された樹脂タブレツトを使用しなければならな
いといつた成形上の制約を受けている。 Incidentally, the above-mentioned resin material can be easily supplied into a pot by using a tablet of a desired shape made of solidified powder. As mentioned above, this resin tablet is heated and pressurized in the pot to become a molten state, but it is important to note that air and moisture exist inside the pot and in the tablet itself, and the pot does not prevent the tablet from melting. Since the tablets are maintained in a heated state for the purpose of smooth operation, the tablets introduced into the pot will be heated and expanded within the pot. Therefore, when molding resin, there is a drawback that the air inside the pot and the air/moisture of the tablet itself can easily enter the cavity and form voids (bubbles) in the resin molded product. Therefore, there are molding restrictions such as the need to use resin tablets molded to a predetermined compression (density) accuracy.
（本発明の目的）
本発明は、ポツト内の樹脂タブレツトをプラン
ジヤーによつて加圧する際に、該タブレツト内に
含まれる空気・水分をポツト内から外部に排出さ
せることにより、溶融樹脂中に上記空気等が混入
するのを防止して、上述したような従来の問題点
を確実に解消することを目的とするものである。(Object of the present invention) The present invention aims at discharging the air and moisture contained in the tablet from the inside of the pot to the outside when pressurizing the resin tablet in the pot with a plunger. The purpose of this is to prevent air and the like from getting mixed in, thereby reliably solving the conventional problems described above.
（本発明の方法及び構成）
本発明方法は、樹脂材料供給用のポツト内に樹
脂タブレツトを供給する工程と、ポツト内の樹脂
タブレツトを所要温度に冷却したプランジヤーに
より加圧して、該樹脂タブレツトを順次溶融化さ
せながら、該溶融樹脂中の空気・水分をポツトと
プランジヤーとの間隙から外部に排出すると共
に、該空気・水分を含まない溶融樹脂を成形キヤ
ビテイ内に加圧注入させる工程と、プランジヤー
の樹脂加圧工程終了後に該プランジヤーを所要温
度に加熱する工程とから成るトランスフアーモー
ルド成形方法に係るものである。(Method and structure of the present invention) The method of the present invention includes a step of supplying a resin tablet into a pot for supplying resin material, and pressurizing the resin tablet in the pot with a plunger cooled to a required temperature to release the resin tablet. A step of sequentially melting the molten resin, discharging the air and moisture in the molten resin to the outside through the gap between the pot and the plunger, and injecting the molten resin that does not contain air and moisture into the molding cavity under pressure; The present invention relates to a transfer molding method comprising a step of heating the plunger to a required temperature after completing the resin pressurizing step.
また、本発明装置は、先端加圧部内に流体の通
路を形成した樹脂タブレツトの加圧用プランジヤ
ーと、上記流体通路の両端連通口間に接続させる
加熱流体の循環経路及び冷却流体の循環経路とか
ら成り、上記両循環経路と上記プランジヤーの流
体通路側とは切換バルブを介して夫々交互に連
通・遮閉可能に構成されていることを特徴とする
樹脂タブレツトの加圧装置に係るものである。 The device of the present invention also includes a plunger for pressurizing a resin tablet having a fluid passage formed in the tip pressurizing part, and a heating fluid circulation path and a cooling fluid circulation path connected between communication ports at both ends of the fluid passage. The present invention relates to a pressurizing device for a resin tablet, characterized in that both of the circulation paths and the fluid passage side of the plunger are configured to be able to communicate and close alternately through switching valves.
また、本発明装置は、先端加圧部内に断・続切
換可能な加熱体を備えた樹脂タブレツトの加圧用
プランジヤーと、該プランジヤーの上記先端加圧
部を冷却する送風冷却器とから構成されているこ
とを特徴とする樹脂タブレツトの加圧装置に係る
ものである。 Further, the device of the present invention is composed of a plunger for pressurizing a resin tablet, which is equipped with a heating element that can be switched on and off in the tip pressurizing section, and a blower cooler for cooling the tip pressurizing section of the plunger. The present invention relates to a pressurizing device for a resin tablet, characterized in that:
（実施例） 以下、本発明を実施例図に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on embodiment figures.
第１図は本発明方法に用いられる樹脂タブレツ
トの加圧装置Ａを備えた半導体素子の樹脂モール
ド成形用金型Ｂを示している。 FIG. 1 shows a mold B for resin molding a semiconductor element, which is equipped with a pressurizing device A for resin tablets used in the method of the present invention.
上記金型Ｂは固定上型１と該上型に対設した可
動下型２とから構成されると共に、上型１側には
樹脂タブレツトＣの供給用ポツト３と、樹脂成形
体の上半体を成形する上キヤビテイ４と、該上キ
ヤビテイ内の成形体を押出すためのエジエクター
ピン５等が設けられており、また、下型２側には
上記ポツト３及びキヤビテイ４との各対向位置に
カル部６及び下キヤビテイ７が夫々設けられると
共に、該カル部６と下キヤビテイ７とはゲート８
を介して連通形成されており、更に、下キヤビテ
イ７の上面となる両型１，２のパーテイングラフ
イン（Ｐ・Ｌ）面には半導体素子を取り付けたリ
ードフレーム９をセツトするための係合凹所１０
が設けられており（なお、上記したカル部６とゲ
ート８との間に所要長さの溶融樹脂移送用のラン
ナーを構成した通常の成形用金型を用いても差支
えない）、また、上記カル部６及び下キヤビテイ
７には樹脂成形体の押出用エジエクターピン１
１，１２が夫々設けられている。 The mold B is composed of a fixed upper mold 1 and a movable lower mold 2 placed opposite to the upper mold. On the upper mold 1 side, there is a pot 3 for supplying the resin tablet C and an upper half of the resin molded product. An upper cavity 4 for molding the molded body, and an ejector pin 5 for extruding the molded body in the upper cavity are provided, and on the lower mold 2 side, there are provided an upper cavity 4 for molding the molded body, and an ejector pin 5 for extruding the molded body in the upper cavity. A cull portion 6 and a lower cavity 7 are provided at the respective positions, and the cull portion 6 and the lower cavity 7 are connected to a gate 8.
Furthermore, on the parting graphic (P and L) surfaces of both molds 1 and 2, which are the upper surfaces of the lower cavity 7, there are engagements for setting the lead frame 9 on which the semiconductor element is attached. Matching place 10
(Note that it is also possible to use a normal molding die that has a runner of the required length for transferring molten resin between the cull part 6 and the gate 8 described above), and the above-mentioned An ejector pin 1 for extruding a resin molded body is installed in the cull part 6 and the lower cavity 7.
1 and 12 are provided, respectively.
また、上記加圧装置Ａは、先端加圧部１３1内
に流体の通路１４を形成した樹脂タブレツトＣの
加圧用プランジヤー１３と、上記流体通路１４の
両端連通口１４1，１４1間に接続させる加熱流体
Ｄの循環経路１５及び冷却流体Ｅの循環経路１６
とから成り、上記両循環経路１５，１６と上記プ
ランジヤーの流体通路１４側とは切換バルブ１
７，１８を介して夫々交互に連通・遮閉可能に構
成されている。なお、第１図において、符号P1，
P2で示すものは流体給送用のポンプ、同１９，
２０は加熱器及び冷却器、同２１はポツト３とプ
ランジヤーの先端加圧部１３1との間隙である。 Further, the pressurizing device A is connected between the pressurizing plunger 13 of the resin tablet C, which has a fluid passage 14 formed in the tip pressurizing part 13 1 , and communication ports 14 1 and 14 1 at both ends of the fluid passage 14. A circulation path 15 for heating fluid D and a circulation path 16 for cooling fluid E
The two circulation paths 15 and 16 and the fluid passage 14 side of the plunger are connected to a switching valve 1.
7 and 18 so that they can be alternately communicated and closed. In addition, in FIG. 1, the symbols P 1 ,
The one indicated by P 2 is a pump for fluid supply, 19,
20 is a heater and a cooler, and 21 is a gap between the pot 3 and the tip pressurizing part 131 of the plunger.
次に本発明の作用を説明する。 Next, the operation of the present invention will be explained.
まず、前記凹所１０内にリードフレーム９をセ
ツトして両型１，２の型締めを行ない、次に、ポ
ツト３内に樹脂タブレツトＣを供給して該タブレ
ツトを所要温度まで加熱すると共に、プランジヤ
ーの先端加圧部１３1により加圧して溶融化し、
これをカル部６、ゲート８を通して上下のキヤビ
テイ４，７内に加圧注入させるものである。しか
しながら、上記したプランジヤーの先端加圧部１
３1による樹脂タブレツトＣの加圧時においては、
該先端加圧部の流体通路１４側と冷却流体Ｅの循
環経録１６とをバルブ１７，１８を介して連通さ
せて、該経路中のポンプP2により冷却流体（例
えば、常温〜約80度の水）Ｅを流体通路１４に給
送させておく、従つて、このとき、上記先端加圧
部１３1は所要温度に冷却された状態で樹脂タブ
レツトＣを加圧することになるから、該タブレツ
トは、第２図のＡ及びＢを示すように、金型の加
熱部からの熱を最も多く受けるカル部６側から順
次溶融化されていくことになる。このことは、上
記樹脂タブレツトＣのプランジヤー１３側は時間
的に遅く溶融化されるいうことであり、また、こ
の加圧溶融化作用は、第２図Ｃに示すプランジヤ
ー１３の加圧作用終了後まで略均一に行なわれる
から、溶融化された樹脂がゲート８を通して上下
キヤビテイ４，７内に順次加圧注入されることと
も相俟つて、上記溶融樹脂C1がポツト３と先端
加圧部１３1との間隙２１を塞ぐことがなく、従
つて、該間隙は樹脂タブレツトＣの溶融化の際に
内部から流出した空気・水分を外部に排出する一
種のエアベントを構成するものである。 First, the lead frame 9 is set in the recess 10 and both molds 1 and 2 are clamped. Next, a resin tablet C is supplied into the pot 3 and the tablet is heated to a required temperature. Pressure is applied by the tip pressurizing part 13 1 of the plunger to melt it,
This is injected under pressure into the upper and lower cavities 4 and 7 through the cull portion 6 and the gate 8. However, the above-mentioned plunger tip pressurizing part 1
3 When pressurizing resin tablet C according to 1 ,
The fluid passage 14 side of the tip pressurizing part and the circulation path 16 of the cooling fluid E are communicated via valves 17 and 18 , and the cooling fluid (for example, from room temperature to about 80 degrees Water) E is supplied to the fluid passage 14. Therefore, at this time, the tip pressurizing section 131 pressurizes the resin tablet C while being cooled to the required temperature. As shown in A and B in FIG. 2, the melting process starts from the side of the cull part 6 that receives the most heat from the heating part of the mold. This means that the plunger 13 side of the resin tablet C is melted later in time, and this pressurized melting action is completed after the pressurizing action of the plunger 13 as shown in FIG. Since the melting is carried out almost uniformly, the melted resin is sequentially injected under pressure into the upper and lower cavities 4 and 7 through the gate 8, and the molten resin C1 is poured into the pot 3 and the tip pressurizing part 13. Therefore, the gap 21 between the resin tablet C and the resin tablet C is not blocked, and thus constitutes a kind of air vent for discharging air and moisture flowing out from the inside when the resin tablet C is melted.
なお、上記した溶融樹脂C1中の空気・水分は
上述した樹脂タブレツトＣの加熱加圧による溶融
化の過程において間隙２１から外部に排出される
ため、該溶融樹脂自体に空気・水分は含まれてい
ない。また、カル部６、ゲート８、上下キヤビテ
イ４，７内に存在する空気は、上述した溶融樹脂
C1を上下キヤビテイ４，７内へ加圧注入する際
に、両型１，２のパーテイングライン間（又は、
該部に設けたエアベント）を通して外部に排出さ
れるものであるから、結局、リードフレーム９上
の半導体素子を樹脂モールドする成形樹脂体C2
は、第２図Ｄに示すように、その内部或はその外
表面のいずれにもボイドを形成することがないの
である。 Note that since the air and moisture in the molten resin C 1 described above are discharged to the outside from the gap 21 during the melting process by heating and pressurizing the resin tablet C, the molten resin itself does not contain air and moisture. Not yet. In addition, the air existing in the cull part 6, gate 8, and upper and lower cavities 4 and 7 is removed from the molten resin described above.
When injecting C 1 into the upper and lower cavities 4 and 7 under pressure, between the parting lines of both molds 1 and 2 (or
Since it is discharged to the outside through the air vent provided in the part, the molded resin body C 2 in which the semiconductor element on the lead frame 9 is molded in resin is used.
does not form voids either inside or on its outer surface, as shown in FIG. 2D.
また、第２図Ｃに示すプランジヤー１３の加圧
作用終了後において、その先端加圧部の流体通路
１４側と加熱流体Ｄの循環経路１５とをバルブ１
７，１８を介して連通させ、且つ、該経路中のポ
ンプP1により加熱流体（少なくとも、溶融樹脂
C1と略同じ温度の流体）Ｄを流体通路１４に給
送させると、先端加圧部１３1は所要温度に加熱
されてカル部６に残溜して硬化する成形樹脂体
C3との附着を防止することができるのであり、
従つて、第２図Ｄに示す型開き時において、上記
成形樹脂体C2，C3及びゲート８部の成形樹脂体
C4を、上下のエジエクターピン５，１１，１２
を介して両型１，２間に容易に取り出すことがで
きるのである。 Further, after the pressurizing action of the plunger 13 as shown in FIG.
7, 18, and the heated fluid (at least the molten resin
When the fluid D having approximately the same temperature as C 1 is fed to the fluid passage 14, the tip pressurizing part 13 1 is heated to the required temperature and remains in the cull part 6 to form a molded resin body that hardens.
It is possible to prevent adhesion with C 3 ,
Therefore, when the mold is opened as shown in FIG. 2D, the molded resin bodies C 2 and C 3 and the molded resin body of the gate 8 part
C 4 , upper and lower ejector pins 5, 11, 12
It can be easily taken out between the molds 1 and 2 via the .
上記した本発明装置の実施例においては、プラ
ンジヤーの先端加圧部１３1を加熱流体Ｄ及び冷
却流体Ｅを用いて交互に加熱・冷却するように構
成したものを示したが、本発明装置におけるプラ
ンジヤー先端加圧部の加熱及び冷却手段として、
第３図に示すような、加熱体及び送風冷却器を採
用しても差支えないものである。 In the above-described embodiment of the device of the present invention, the tip pressurizing portion 131 of the plunger is alternately heated and cooled using the heating fluid D and the cooling fluid E. However, in the device of the present invention, As a heating and cooling means for the plunger tip pressurizing section,
There is no problem even if a heating element and a blower cooler as shown in FIG. 3 are used.
即ち、第３図に示す本発明装置の他の実施例
は、先端加圧部１３1′内に断・続切換可能な加熱
体２２を備えた樹脂タブレツトの加圧用プランジ
ヤー１３′と、該プランジヤーの上記先端加圧部
１３1′を冷却する送風冷却器２３とから構成され
ている。 That is, another embodiment of the apparatus of the present invention shown in FIG. 3 includes a plunger 13 ' for pressurizing a resin tablet, which is equipped with a heating element 22 that can be switched on and off in a tip pressurizing part 131', and a plunger 13' for pressurizing a resin tablet. and a blower cooler 23 for cooling the tip pressurizing section 13 1 '.
また、上記加熱体２２は、プランジヤー１３′
の上述した前実施例の作用における加圧作用終了
後に、手動的に、或は、成形サイクルと連動して
自動的に開閉されるスイツチ機構２２1によつて
所要温度に加熱されると共に、ポツト３′の外部
上方位置に移動したときは上記スイツチ機構２２
１によりその加熱状態を中止することができるよ
うに設けられており、また、上記送風冷却器２３
は、上方移動した先端加圧部１３1′の外方周囲
を、常温の空気、或は、所要の冷風２４を吹付け
て該先端加圧部を所要温度に冷却することができ
るように設けられている。従つて、この第二実施
例の構成に基づく作用は、プランジヤー先端加圧
部１３1′を加熱・冷却する作用の点において前実
施例のものと相違するが、樹脂タブレツトＣに対
する加圧作用については、第２図のＡ〜Ｄに説明
した前実施例の作用と略同一であると共に、その
効果についても同じく前実施例の効果と略同一で
ある。 Further, the heating body 22 is connected to the plunger 13'.
After the pressurizing action in the action of the previous embodiment described above is completed, the pot is heated to the required temperature by the switch mechanism 221 that is opened and closed manually or automatically in conjunction with the molding cycle. When moved to the external upper position of 3', the above switch mechanism 22
1 , the heating state can be stopped by the air cooler 23.
is provided so that room temperature air or the required cold air 24 can be blown around the outer circumference of the tip pressurizing section 13 1 ' that has moved upward to cool the tip pressurizing section to a required temperature. It is being Therefore, the action based on the configuration of this second embodiment is different from that of the previous embodiment in terms of the action of heating and cooling the plunger tip pressurizing part 13 1 ', but the action of pressurizing the resin tablet C is different. The operation is substantially the same as that of the previous embodiment described in FIGS. 2A to 2D, and the effect is also substantially the same as that of the previous embodiment.
なお、その他の具体的構成は前実施例のものと
略同一であるため、対応する構成部材には前実施
例のものと同じ符号を付している。 Note that other specific configurations are substantially the same as those of the previous embodiment, so corresponding constituent members are given the same reference numerals as those of the previous embodiment.
（本発明の作用・効果）
本発明方法によれば、樹脂タブレツトの加熱加
圧による溶融化の過程において、その溶融化の際
に内部から流出した空気・水分をポツトとプラン
ジヤーとの間隙から効率良く外部に排出するた
め、溶融樹脂中に空気・水分が混入することがな
く、従つて、この溶融樹脂をキヤビテイ内に加圧
注入することにより、その成形樹脂体内部或は外
表面にボイドが形成されるのを確実に防止するこ
とができて、この種の樹脂モールド成形品に要求
される高品質性及び高信頼性の向上を図ることが
できるといつた優れた効果を奏するものである。
特に、従来方法においては、樹脂モールド成形サ
イクルの短縮化を図るといつた観点から、ポツト
内の樹脂タブレツトの溶融化とそのキヤビテイ内
への加圧注入作用を可及的に迅速に行なうように
していることから、プランジヤーの先端加圧部内
に専用のヒータを備えてその加熱状態を維持して
おき、樹脂タブレツトを該先端加圧部とカル部と
の間においてその上下両端部から同時的に溶融化
させていたため、その溶融樹脂によつてポツトと
プランジヤーとの間隙が塞がれることになり、従
つて、その溶融化の際に内部から流出しようとす
る空気・水分は再び溶融樹脂中に混入した状態で
キヤビテイ内へ加圧注入されるといつた重大な問
題を有していたのである。このような問題は、具
体的には、発光ダイオードの樹脂モールド成形時
において、その発光レンズ部内にボイドが形成さ
れて該製品自体の使用不能といつた欠点として現
われたり、また、半導体素子の樹脂モールド成形
品の耐久性低下或は外観不良といつた種々の弊害
を生ずるもであるが、本発明方法によるときは、
上述したような従来の問題を確実に解消すること
ができるものである。(Operations and Effects of the Present Invention) According to the method of the present invention, in the process of melting a resin tablet by heating and pressurizing it, air and moisture flowing out from inside during the melting are efficiently removed from the gap between the pot and the plunger. Since the resin is well discharged to the outside, air and moisture do not get mixed into the molten resin. Therefore, by injecting the molten resin into the cavity under pressure, no voids are created inside or on the outer surface of the molded resin body. It has excellent effects such as being able to reliably prevent the formation of resin molded products and improving the high quality and high reliability required for this type of resin molded product. .
In particular, in the conventional method, from the viewpoint of shortening the resin molding cycle, the melting of the resin tablet in the pot and the pressurized injection into the cavity are performed as quickly as possible. Therefore, a dedicated heater is installed in the pressure section at the tip of the plunger to maintain its heated state, and the resin tablet is simultaneously placed between the pressure section at the tip and the cull section from both its upper and lower ends. Because the resin was melted, the gap between the pot and the plunger was closed by the molten resin. Therefore, the air and moisture that flowed out from inside the pot during the melting process were returned to the molten resin. This poses a serious problem if the mixture is injected into the cavity under pressure. Specifically, such problems appear as defects in the resin molding of light emitting diodes, in which voids are formed in the light emitting lens part, making the product itself unusable, and in resin molding of semiconductor elements. However, when the method of the present invention is used,
It is possible to reliably solve the conventional problems as described above.
また、本発明装置によれば、プランジヤーの先
端加圧部の冷却及び加熱を交互に行なうことがで
きるので、樹脂タブレツトの溶融化の際に内部か
ら流出する空気・水分をポツトとプランジヤーと
の間隙から効率良く外部へ排出して該空気等をキ
ヤビテイ内へ加圧注入するといつた従来の弊害を
確実に解消することができるといつた優れた効果
を奏するものである。 Furthermore, according to the device of the present invention, since the pressure part at the tip of the plunger can be alternately cooled and heated, the air and moisture flowing out from inside when melting the resin tablet can be absorbed into the gap between the pot and the plunger. This provides excellent effects such as being able to reliably eliminate the disadvantages of the conventional method, such as when the air is efficiently discharged to the outside and the air is injected under pressure into the cavity.
更に、本発明によれば、所定の圧縮精度に成形
された樹脂タブレツトを使用しなければならない
といつた成形上の制約を受けることがないといつ
た優れた実用的効果を奏するものである。 Further, according to the present invention, excellent practical effects are achieved in that there is no restriction on molding, such as the need to use a resin tablet molded to a predetermined compression accuracy.
図は本発明の実施例を示すものであり、第１図
は樹脂タブレツトの加圧装置と半導体素子の樹脂
モールド成形用金型との要部を示す一部切欠正面
図、第２図のＡ，Ｂ，Ｃ，Ｄはいずれも本発明方
法の作用説明図、第３図は本発明装置の他の実施
例を示す一部切欠正面図である。
Ａ……加圧装置、Ｂ……金型、Ｃ……樹脂タブ
レツト、C1……溶融樹脂、C2，C3，C4……成形
樹脂体、Ｄ……加熱流体、Ｅ……冷却流体、３，
３′……ポツト、４，７……キヤビテイ、１３，
１３′……プランジヤー、１３1，１３1′……先端
加圧部、１４……流体通路、１４1……両端連通
口、１７，１８……切換バルブ、２１……間隙、
２２……加熱体、２３……送風冷却器。
The figures show an embodiment of the present invention, and FIG. 1 is a partially cutaway front view showing the main parts of a pressurizing device for a resin tablet and a mold for resin molding a semiconductor element, and FIG. , B, C, and D are all explanatory views of the operation of the method of the present invention, and FIG. 3 is a partially cutaway front view showing another embodiment of the apparatus of the present invention. A...pressure device, B...mold, C...resin tablet, C1 ...molten resin, C2 , C3 , C4 ...molded resin body, D...heated fluid, E...cooling fluid, 3,
3'... Pot, 4, 7... Cavity, 13,
13'... Plunger, 13 1 , 13 1 '... Tip pressurizing section, 14... Fluid passage, 14 1 ... Both ends communication port, 17, 18... Switching valve, 21... Gap,
22...Heating body, 23...Blower cooler.
Claims (1)
を供給する工程と、ポツト内の樹脂タブレツトを
所要温度に冷却したプランジヤーにより加圧し
て、該樹脂タブレツトを順次溶融化させながら、
該溶融樹脂中の空気・水分をポツトとプランジヤ
ーとの間隙から外部に排出すると共に、該空気・
水分を含まない溶融樹脂を成形キヤビテイ内に加
圧注入させる工程と、プランジヤーの樹脂加圧工
程終了後に該プランジヤーを所要温度に加熱する
工程とから成るトランスフアーモールド成形方
法。 ２ 先端加圧部内に流体の通路を形成した樹脂タ
ブレツトの加圧用プランジヤーと、上記流体通路
の両端連通口間に接続させる加熱流体の循環経路
及び冷却流体の循環経路とから成り、前記両循環
経路と上記プランジヤーの流体通路側とは切換バ
ルブを介して夫々交互に連通・遮閉可能に構成さ
れていることを特徴とする樹脂タブレツトの加圧
装置。 ３ 先端加圧部内に断・続切換可能な加熱体を備
えた樹脂タブレツトの加圧用プランジヤーと、該
プランジヤーの上記先端加圧部を冷却する送風冷
却器とから構成されていることを特徴とする樹脂
タブレツトの加圧装置。[Scope of Claims] 1. A step of supplying a resin tablet into a pot for supplying resin material, and pressurizing the resin tablet in the pot with a plunger cooled to a required temperature to sequentially melt the resin tablet,
Air and moisture in the molten resin are discharged to the outside through the gap between the pot and the plunger, and the air and moisture are
A transfer molding method comprising the steps of injecting a water-free molten resin into a molding cavity under pressure, and heating the plunger to a required temperature after the resin pressurization step of the plunger is completed. 2. Consists of a plunger for pressurizing a resin tablet with a fluid passage formed in the tip pressurizing part, and a heating fluid circulation path and a cooling fluid circulation path connected between communication ports at both ends of the fluid passage, and both of the circulation paths and the fluid passage side of the plunger are configured to be able to communicate and close alternately through switching valves. 3. It is characterized by being composed of a plunger for pressurizing a resin tablet, which is equipped with a heating element that can be switched on and off in the tip pressurizing section, and a blower cooler that cools the tip pressurizing section of the plunger. Pressurizing device for resin tablets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10821384A JPS60251633A (en) | 1984-05-28 | 1984-05-28 | Transfer mold forming method and resin tablet pressurizing device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10821384A JPS60251633A (en) | 1984-05-28 | 1984-05-28 | Transfer mold forming method and resin tablet pressurizing device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60251633A JPS60251633A (en) | 1985-12-12 |
| JPH0213931B2 true JPH0213931B2 (en) | 1990-04-05 |
Family
ID=14478891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10821384A Granted JPS60251633A (en) | 1984-05-28 | 1984-05-28 | Transfer mold forming method and resin tablet pressurizing device thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60251633A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0186241U (en) * | 1987-11-30 | 1989-06-07 | ||
| US5200125A (en) * | 1988-12-24 | 1993-04-06 | T&K International Laboratory, Ltd. | Method for seal molding electronic components with resin |
| GB2252746B (en) * | 1991-01-17 | 1995-07-12 | Towa Corp | A method of molding resin to seal an electronic part on a lead frame and apparatus therefor |
| MY109641A (en) * | 1991-03-20 | 1997-03-31 | Nitto Denko Corp | Resin tablet for semiconductor sealing,process for producing the same, and process for producing semiconductor devices using the same |
| AU3904393A (en) * | 1992-04-13 | 1993-11-18 | Apic Yamada Corporation | Method of transfer mold and apparatus for transfer mold |
| JP2524955B2 (en) * | 1993-04-22 | 1996-08-14 | トーワ株式会社 | Method and apparatus for resin sealing molding of electronic parts |
| JP3566426B2 (en) * | 1995-10-30 | 2004-09-15 | Ｔｏｗａ株式会社 | Electronic component resin molding equipment |
| US7291304B2 (en) * | 2004-07-01 | 2007-11-06 | Husky Injection Molding Systems Ltd. | Coinjection molding cooled shooting pot cylinder |
-
1984
- 1984-05-28 JP JP10821384A patent/JPS60251633A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60251633A (en) | 1985-12-12 |
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