JP2772489B2 - Resin encapsulation molding device for electronic parts and jig for pushing ejector pin - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a device mounted on a lead frame, for example,
In connection with the improvement of encapsulation molding equipment for encapsulating and molding electronic components such as ICs, diodes and capacitors with resin materials,
In particular, by preventing the deformation of the component parts of the mold caused by the mold clamping pressure of the molding die in the apparatus, an improvement has been made so that flash (resin burr) or the like is not formed on the surface of the outer lead in the molded product. About things.

[Conventional technology]

2. Description of the Related Art A transfer molding apparatus has conventionally been used as an apparatus for resin-molding an electronic component on a lead frame.

This apparatus (see FIGS. 8 and 9) includes a fixed mold plate 3 fixed to a fixed plate 1 via a spacer block 2 and a movable plate 4 opposed to the fixed plate 1 with a spacer block. The movable-side mold plate 6 fixed via the
And both mold plates (3.6)
Mold 7 and movable mold 8 for resin-molding electronic components into the mold
Are arranged facing each other.

Further, in the above two spacer block space composed of (S _1, S ₂₎ in the projecting ejector plate of the resin molded product 9 (10, 11) are arranged respectively fitted.

In order to perform resin molding using such a conventional apparatus, first, the lead frame 12 to which the electronic components are attached is set at a predetermined position on the PL (parting line) surface of both molds, and the mold is clamped. Then, a resin material is supplied into the pot, and the resin material is heated and pressurized by a heater and a plunger to be melted, and the molten resin material is passed through a resin passage 13 formed of a cal runner gate or the like. It suffices to inject pressure into the molding cavities (14 and 15) facing the PL surface.

At this time, the electronic components on the lead frame are sealed by the resin injected into the cavities (14, 15). In addition, the lead frame 12 and the molded article 9 after the resin sealing molding are protruded by the ejector pins (16, 17) provided on the ejector plates (10, 11) at the same time as the molds are opened. It is taken out between both molds.

[Problems to be solved by the invention]

By the way, in the above-mentioned resin sealing molding, both types of P.
When a part of the molten resin material enters the L surface, resin burrs adhere and harden on the PL surface and the surface of the lead frame, for example,
At the time of the next mold clamping, there is a serious adverse effect such that the mold clamping of both molds becomes defective, resulting in defective molding, and the molds themselves are damaged.

Therefore, conventionally, the both said type for the purpose of increasing the adhesion of both types PL surfaces thereby clamping strongly by the required pressure, both mold plates This clamping pressure (3.6) a space (S _1, S ₂ ) Supports (18, 19) are fitted in the space so as not to bend inward.

As described above, the supports (18, 19) have the purpose of preventing the two mold plates (3, 6) from being curved and deformed by the clamping pressure, but the ejector plates (10, 11) described above. Has many ejector pins (16
17) It is necessary to install a plurality of support pins in the above space to ensure the reciprocating sliding of the ejector plates (10 and 11) and return pins for both ejector plates. Because there are many restrictions on the shape, number and location of the supports (18 and 19), it is not possible to place the supports at appropriate receiving positions. For example, there has been a problem that it is not possible to prevent the occurrence of a lead flash in advance by applying a uniform mold clamping pressure to the outer lead portion of the lead frame.

SUMMARY OF THE INVENTION It is a main object of the present invention to provide a resin sealing device for an electronic component that can surely prevent distortion and bending deformation of a mold component due to a mold clamping pressure as described above.

It is another object of the present invention to provide a resin sealing device capable of molding resin sealing of an electronic component having high quality and high reliability.

[Means for solving the problem]

The resin sealing and molding apparatus for an electronic component according to the present invention is configured such that a fixed mold is mounted on a fixed board via an ejector mechanism mounting member, and a movable mold is mounted on a movable board via an ejector mechanism mounting member. A resin sealing molding device for an electronic component mounted on the electronic component, wherein the fixed die and the ejector mechanism mounting member, and the movable die and the ejector mechanism mounting member, except for a through hole portion of each ejector pin. It is characterized in that it is configured to be joined and supported substantially on the entire surface.

In addition, the resin sealing molding device for electronic components according to the present invention,
The above-mentioned fixed type and movable type are configured so as to be able to freely move toward and away from the ejector mechanism mounting member.

In addition, the resin sealing molding device for electronic components according to the present invention,
A resin-sealing molding device for an electronic component in which the fixed-side mold is mounted on a fixed board via an ejector-pin-fitting member and the movable-side mold is mounted on a movable board via an ejector-pin-fitting member. An ejector mechanism for vertically moving the upper and lower ejector pins is provided on the upper surface of the fixed platen and the lower surface of the movable plate, respectively, and the fixed type and the ejector pin insertion member, and the movable type and the ejector pin insertion member The members are joined and supported on substantially the entire surface of each ejector pin except for the through-hole portion.

Further, the jig for pushing the ejector pin according to the present invention includes a cavity opposed to both mold PL surfaces and a step portion to be inserted into the resin passage, and the step portion has a depth larger than the depth of the cavity and the resin passage. It is characterized by being formed high.

Also, the ejector pin pushing jig according to the present invention is configured by disposing an elastic pushing member for pushing the ejector pin at a position corresponding to the position of the cavity and the resin passage opposed to the PL surfaces of both molds. It is characterized by having done.

(Operation)

According to the configuration of the device of the present invention, since the back surface of the mold and the ejector mechanism mounting member are joined substantially over the entire surface except for the through hole of each ejector pin, distortion or bending deformation of the mold is caused by the clamping pressure. Is efficiently prevented, and it is possible to reliably prevent the generation of a gap between both PL surfaces.

Further, by separating the mold from the ejector mechanism mounting member, the position of the ejector pin in the ejector mechanism mounted on the ejector mechanism mounting member can be surely adjusted.

When a jig for pushing the ejector pin is used, the step portion of the jig is inserted into the cavity and the resin passage, or the intermediate mold is provided with an elastic pushing member for pushing the ejector pin. By performing the tightening, the position of the ejector pin can be surely adjusted.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

1 to 3 show an apparatus for sealing and molding an electronic component with a thermosetting resin material such as an epoxy resin.

This device comprises a fixing plate 31 fixed to the upper ends of several tie bars 30 erected on a base, a mounting member 33 of an upper ejector mechanism 32 fixed to a lower portion of the fixing plate, and a mounting member 33 for the ejector mechanism. An upper die 35 mounted vertically below and below the installation member 33 by an appropriate vertical movement mechanism 34, and an oil / pneumatic or electric motor or the like provided on the base side while being fitted to each of the tie bars. A movable plate 36 fitted to be movable up and down by a mold opening and closing mechanism (not shown), a mounting member 38 of a lower ejector mechanism 37 fixed to an upper portion of the movable plate, and an ejector mechanism mounting member 38 Appropriate vertical movement mechanism on top of
A lower mold 40 is provided so as to be movable up and down by 39.

A pot for supplying a resin material and a plunger for pressing the resin material in the pot are provided on the lower mold 40 side (not shown).
40) are provided with required heaters (not shown).

A plurality of resin molding cavities (41, 42) are provided opposite to the PL surface of both dies, and a cull portion corresponding to the lower die pot position is provided on the upper die surface as shown in FIG. 43 ₁ and a passage 43 provided between the cull portion and the cavity
_A resin passage 43 made of _two is formed. Therefore, the first
At the time of mold clamping shown in the figure, the lower mold pot and the upper and lower cavities (41, 42) are configured to communicate with each other via the resin passage 43.

The aforementioned PL surface, air vent 35 ₁ for providing communication between the upper die cavity 41 outside are respectively formed. Also,
At a predetermined position of the lower mold cavity 42, a setting recess 46 for fitting a lead frame 45 to which an electronic component 44 is attached is formed. The two ejector mechanism mounting members (33, 38) are interposed between the fixed platen 31 and the upper die 35 and between the movable plate 36 and the lower die 40, respectively. When the upper and lower molds 40 and 40 are joined to the ejector mechanism mounting members by the vertical movement mechanisms (34 and 39), the upper surface of the upper mold 35 and the lower surface of the lower mold 40 in FIG. They are joined in a uniform state over substantially the entire surface, and are therefore provided so as to be able to receive the mold clamping pressure over substantially the entire surface.

The figure shows a case where the surface pressure at the peripheral edges of the cavities (41, 42) is increased to effectively prevent flashing of the outer lead portion.

In addition, the upper and lower ejector mechanism mounting members (33
As described above, the ejector mechanisms (32, 37) for projecting the lead frame and the molded product (see FIG. 2) after resin molding between the upper and lower molds (35, 40) are provided respectively on the 38). Have been.

The upper ejector mechanism 32 provided on the fixed board 31 side,
As shown in Figure 1 and Figure 4, the molded article projecting ejector pin 32 ₁ in the upper mold cavity 41, the solidified resin projecting ejector pin 32 ₂ in the resin passage 43, the required for these pins Elastic agent 32 for applying the push-up elastic force of
_3, the ejector frame 32 ₄ joined disposed on the upper surface of the respective pin, pressing elastic member 32 ₅ of the ejector frame
When the mold is clamped, the ejector frame 32 cooperates with a return pin of the lower ejector mechanism 37 described later.
Is composed of ₄ from the return pin 32 ₆ which for pushing up.

Also, the ejector pin 32 ₁ upper mold 35 and the vertical direction of the through holes 32 ₇ provided in the ejector mechanism instrumentation portion member 33
Has been fitted in its lower end portion is engaged tightly fitted against the hole portion of the through hole 32 ₇ and the upper die cavity 41. Furthermore, the required pushing the elastic force of the elastic member 32 ₃ against the pin 32 _1, as described above, and that the arranged number the pin 32 ₁ the pin 32 ₁ is tightly fitted to the upper mold 35 side because it is, it is set to a relatively weak resilient enough to assist the fitted state, which is the same for the other ejector pin 32 _2.

Also, pressing the elasticity of the entire elastic material 32 ₅ applied to each ejector pin through the ejector frame 32 ₄ (32 _1, 32 ₂₎ is stronger than the push-up elastic of all elastic members 32 ₃ acting on the respective pin Therefore, when the mold is opened as shown in FIG. 2, the ejector frame is pressed against the push-up elasticity applied to each pin (32 ₁・ 32 ₂ ).
To become depressing the 32 _4, respective pins would eject the molded product and the solidified resin within the resin passage 43 in the upper die cavity 41 to respective downward.

As described above, when the push-up elasticity for each pin is set to be weak, there is an advantage that the press-down elasticity can be similarly set to be correspondingly weak. Also,
Ejector frame 32 ₄ ejector mechanism instrumentation portion member 3
While being fitted in the vertical direction of the groove portion 32 ₈ that is formed on the 3, the ejector frames each ejector pin (32 ₁ - 3
Since 2 ₂₎ is joined on the upper surface of, and is provided so as respective pin also pushed down at the same time by pushing down the frame. Accordingly, the ejector mechanism instrumentation portion member 33, ejector pins (32 _1, 32 ₂₎ and the narrow through-hole section 32 which is fitted the ejector frame 32 _{4 7} and the groove 32
₈ is provided, but for the rear surface of the upper die 35 (upper surface), in which can be joined to the substantially entire surface except for the portion of the through hole 32 _7.

In addition, a lower ejector mechanism provided on the movable platen 36 side
37 differs in that it aims at projecting a molded product in the lower mold cavity 42, but other basic configurations are almost the same as those of the upper ejector mechanism 32, so that they will be briefly described.

That is, in FIG., Reference numeral 37 ₁ ejector pin for moldings projecting (It is also possible features and solidified resin projecting ejector pins within the pin and the resin passage 43), the same reference numerals 37
₃ the elastic member for pushing down the ejector pins 37 _1, same reference numerals 37 ₄ ejector frame, the same reference numerals 37 ₅ is an ejector bar, the same reference numerals 37 ₆ to push up the frame in cooperation with the upper return pins 32 ₆ It pushes the upper ejector frame 32 ₄ upwardly and lower ejector frame 3
7 Lower return pin for pushing ₄ downward, same sign
37 ₇ through hole of the ejector pin 37 _1, the same reference numerals 37 ₈ groove, the reference numeral 37 ₉ denotes respectively the elastic member for pushing down the lower ejector frame 37 _4, each ejector pin pressing elastic member 37 elasticity of _3, as the elastic member 32 ₃ in the upper ejector mechanism, is set to a relatively weak resilient enough to assist a close fit state between the tip portion and the lower mold 40 side of the respective pins. In addition, the above-described ejector pins are moved down by the lower mold 40 to eject the ejector frame 37.
_{By 4} and the above ejector bar 37 ₅ fixed to the bottom is Setto, because those respective ejector pin protrudes relative and forcibly moved upward to molded articles upward, the elastic member 37 _3, no problem also be used as normal or strong elasticity.

The case where resin sealing molding is performed using the apparatus having the configuration of the above embodiment will be described.

First, in the mold opening state shown in FIG. 2, the upper and lower molds (35 and 40) are moved down and up by the up and down movement mechanism (34 and 39), and as shown in FIG. The tip surface of the pin (32 ₁・ 32 ₂・ 37 ₁ ) and the upper and lower cavities (41.4
2) and the bottom of the resin passage 43 are matched.

Next, when moved upward the movable platen 36 by mold opening and closing mechanism, with the push-up engagement force against the lower ejector frame 37 ₄ ejector bar 37 ₅ is relatively drop is released, a lower ejector mechanism instrumentation portion member 38 since the vertical movement mechanism 39 and the movable platen 36 of ejector pins 37 ₁ and the lower mold 40 is in the free loosely in, and are joined back side of the lower ejector mechanism instrumentation portion member 38 and the lower die 40 (lower surface) . At this time, results in a lower ejector frame 37 ₄ pushed down reliably by the elasticity of the elastic material 37 _9.

Next, the lead frame 45 to which the electronic component 44 is attached is set in the recess 46 on the lower mold PL surface, and a resin material is supplied into the lower mold pot.

Next, the movable plate 36 is further moved upward by the mold opening / closing mechanism, and the upper and lower molds for joining the lower mold 40 to the upper mold 35 are clamped. In the state of complete clamping shown in FIG. 1, for example, even if for any reason the upper and lower ejector frame (32 ₄ · 37 ₄₎ is such not moved upward and downward to a predetermined position, the as shown, it is possible to the upper and lower return pins (32 ₆ · 37 ₆₎ is moved upward and downward to the respective predetermined positions upper and lower both ejector frame by bonding. At the time of complete mold clamping shown in FIG. 1, mold clamping pressure is applied to both molds (35, 40) by the mold opening / closing mechanism, but the back surfaces of both molds are equipped with both ejector mechanisms. Substantially the entire surfaces are joined and supported by the members (33, 38) in a uniform state. Therefore, distortion, bending deformation, and the like of the two dies (35, 40) caused by the mold clamping pressure are efficiently prevented. Is what you can do.

Next, the resin material heated and melted by both types of heaters is pressurized by a plunger, and this molten resin material is pressurized and injected into both cavities (41, 42) through the resin passage 43, thereby obtaining a lead frame. The upper electronic component 44 is formed by sealing with the injected resin material.

Next, when lowered lower die 40 moves downward the movable platen 36 by mold opening and closing mechanism, firstly, the upper and lower return pins (32 ₆ · 37 ₆₎ engagement is released of the upper ejector frame 32 _fourth elastic member 32 _Five
As a result, the ejector frame moves down the upper ejector pins (32 ₁ , 32 ₂ ) to project the molded product in the upper mold cavity 41 and the solidified resin in the resin passage 43 downward. Further, when the lower et du compactors frame 37 ₄ lower die 40 is further lowered to engage the ejector bar 37 _5, relatively upward with respect to the lower die 40 descends in the ejector frame 37 ₄ is stopped since that would, thus protruding a molded product in the lower die cavity 42 upwards the ejector frame is moved upward the lower ejector pin 37 ₁ in the same manner (see Figure 2).

According to the configuration of the above-described embodiment, it is possible to efficiently prevent distortion / curve deformation of the two molds (35, 40), and to effectively and properly use the mold clamping pressure as the adhesion acting force of the two molds. Therefore, it is possible to reliably prevent the molten resin material from entering the PL surfaces of both molds and forming flash on the surfaces of the both mold PL surfaces and the outer leads of the molded product.

In the configuration of the above embodiment, the elastic material (32 ₃ · 37 ₁ ) that pushes the ejector pin (32 ₁ · 32 ₂ · 37 ₁ ) is used.
₃ ) Since the elasticity is set to be weak, it is necessary to ensure that the tip surfaces of the ejector pins match the bottom surfaces of the cavities (41 and 42) and the resin passage 43 before starting the sealing molding operation. Therefore, in the above-mentioned embodiment, for this purpose, a configuration is adopted in which the two types (35, 40) are pushed by the vertical movement mechanism (34, 39).

FIGS. 5 and 6 show the ejector pins (32 ₁
· The pressing jigs 47 and 48 for each pin that can surely match the tip surface of 32 ₂ · 37 ₁ ) with the bottom surfaces of both cavities (41 · 42) and the resin passage (43) are shown. By using the jig, the vertical movement mechanisms (34 and 39) of both types can be omitted.

That is, (see FIG. 5) the pushing jig 47 has a stepped portion 47 ₁ is inserted vertically into two cavities (41, 42) and the resin passage (43), the stepped portion under the upper both It is formed to be higher than the depth of the cavity and the resin passage.
Accordingly, interposed between previously dies when clamping a jig (35, 40), and, when the intermediate clamping or soft clamped in this state, the stepped portion 47 ₁ of the jig each pin (32 ₁・ 32 ₂・ 37 ₁ ) By pushing, it is possible to make the front end surfaces coincide with the bottom surfaces of both cavities (41 ・ 42) and resin passage (43). Therefore, prior to the supply process of the lead frame 45 and the resin material, the position adjustment of each pin (32 ₁・ 32 ₂・ 37 ₁ ) is surely performed by using the mold clamping process of both molds (35 ・ 40). Can be. The jig 48 (see FIG. 6)
Pushes each pin (32 ₁・ 32 ₂・ 37 ₁ ) to the stepped portion 48 ₁ to make the front end surface of the cavity (41 ・ 42) and the resin passage (4
Shows a case with an elastic pressing member 48 ₂ for pushing up the bottom surface of 3), but otherwise employs the same configuration as that of the jig 47. The elastic pushing member 48 ₂
The location to dispose the, need not be limited to the stepped portion 48 ₁ as described above, for example, no problem be adopted fair to So設to a thick plate-shaped jig (not shown).

FIG. 7 shows that both return pins (32 ₇ and 37 ₆ ) are provided by providing a dedicated drive mechanism (49 and 50) for forcibly moving the ejector frames (32 ₄ and 37 ₄ ) up and down. It indicates a material obtained by employing the simple configuration may omit the elastic member 32 ₅ and the ejector bar 37 ₅ of the upper. The above-described drive mechanisms (49, 50) may use an appropriate drive force such as oil / pneumatic or electric. In addition, the upper and lower elastic materials (32 ₃・ 37 ₃ ) are each ejector pin (32 ₁・ 32 ₂・ 37 ₁ )
To the ejector frame (32 ₄・ 37 ₄ ). The above drive mechanism (49/50)
And as a vertical drive mechanism for each pin (32 ₁・ 32 ₂・ 37 ₁ )
For example, a rack and pinion mechanism may be employed. The other configuration is substantially the same as the configuration of the embodiment shown in FIG. 1, and the same components are denoted by the same reference numerals.

In the structure of the embodiment shown in FIG. 7, the ejector pins (32 ₁ , 32 ₂ , 37 ₁ ) can be more reliably moved up and down. There are advantages that the vertical movement mechanism (34, 39) of the mold can be omitted, and the jigs (47, 48) for pushing the ejector pins shown in FIGS. 5 and 6 become unnecessary.
Further, since the upper and lower drive mechanisms (49, 50) can be operated simultaneously or separately, there is a practical advantage that various setting of the projecting time for the molded article or the like is possible.

The present invention is not limited to the above-described embodiment, but can be appropriately and arbitrarily changed and selected as needed without departing from the spirit of the present invention.

For example, in the embodiment, the case where the upper and lower ejector mechanisms are mounted via the mounting members is shown, but the upper and lower ejector frames and the driving mechanism are disposed on the upper surface of the fixed platen and the lower surface of the movable plate, respectively. In addition, a configuration may be adopted in which only the through holes for inserting the ejector pins are formed in the fixed platen, the movable platen, and the upper and lower ejector mechanism mounting members.

That is, the fixed mold is set on the fixed board via an ejector pin fitting member (not shown), and the movable mold is mounted on the movable board via an ejector pin fitting member (not shown). Further, an ejector mechanism for vertically moving the upper and lower ejector pins is provided on the upper surface of the fixed platen and the lower surface of the movable plate, respectively, and the above-mentioned fixed type and ejector pin insertion member, and the above-mentioned movable type and ejector pin insertion member May be joined and supported on substantially the entire surface of each ejector pin except for the through-hole portion, without any problem.
In this case, there is an advantage that the configuration of not only the ejector pin insertion member but also the entire apparatus is simplified, and the assembling work and maintenance and inspection work of each constituent member are simplified.

〔The invention's effect〕

ADVANTAGE OF THE INVENTION According to this invention, at the time of mold clamping of both molds, distortion / curve deformation etc. of the mold component parts of both molds etc. due to the mold clamping pressure are prevented, so that resin burrs and There is an effect that the formation of the lead flash can be efficiently and reliably prevented.

Accordingly, it is possible to provide a resin sealing device for an electronic component, which can reliably prevent a distortion, a curved deformation, and the like of a mold component caused by a mold clamping pressure.
The present invention has an excellent practical effect of being able to provide a resin sealing device capable of molding a resin-sealed molded product of an electronic component having high quality and high reliability.

Further, according to the present invention, since resin burrs can be prevented from adhering to the PL surfaces of both molds by reliable and proper mold clamping, the cleaning work for both mold surfaces can be simplified and the overall work efficiency can be improved. And an excellent practical effect such as simplification of the overall configuration of the device and improvement of the overall durability.

[Brief description of the drawings]

FIGS. 1 to 4 are partially cutaway longitudinal sectional views showing a main part of a resin sealing device for an electronic component according to the present invention. FIG. FIG. 3 shows a state in which the molds are opened, and FIG. 4 shows a relation between the upper mold PL surface and the upper ejector mechanism. FIG. 5 is a front view showing a main part of a jig for pushing an ejector pin. FIG. 6 is a partially cutaway longitudinal sectional view showing a configuration example of another pushing jig. FIG. 7 is a partially cutaway longitudinal sectional view showing a main part of another resin sealing device according to the present invention, showing a state at the time of mold clamping. 8 and 9 are partially cutaway longitudinal cross-sectional views showing a main part of the conventional apparatus at the time of mold clamping and mold opening. [Explanation of Reference Codes] 31 Fixed board 32 Ejector mechanism 32 ₁・ 32 ₂ Ejector pin 32 ₃ Elastic material 32 ₄ Ejector frame 32 ₅ Elastic material 32 ₆ Return pin 32 ₇ … Through-hole 32 ₈ … Groove 33… Ejector mechanism mounting member 34… Vertical movement mechanism 35… Upper die 36… Movable plate 37… Ejector mechanism 37 ₁ … Ejector pin 37 ₃ … Elastic material 37 ₄ Ejector frame 37 ₅ Ejector bar 37 ₆ Return pin 37 ₇ Through hole 37 ₈ Groove 37 ₉ Elastic material 38 Ejector mechanism mounting member 39 Vertical movement mechanism 40 Lower mold 41 · 42 Cavity 43 · Resin passage 44 ·· Electronic component 45 ··· Lead frame 46 ··· Recess 47 · 48 ··· Pushing jig 47 ₁ · 48 ₁ ··· Step 48 ₂ …… Elastic pushing member 49 ・ 50 …… Driving mechanism

Claims (5)

(57) [Claims] 1. A resin for an electronic component, wherein a fixed mold is mounted on a fixed plate via an ejector mechanism mounting member and a movable mold is mounted on a movable plate via an ejector mechanism mounting member. A sealing molding device, wherein the fixed mold and the ejector mechanism mounting member, and the movable mold and the ejector mechanism mounting member are respectively joined and supported on substantially the entire surface of each ejector pin except through holes. A resin sealing and molding apparatus for electronic components, characterized in that the apparatus is formed as follows. 2. The resin sealing and molding apparatus for electronic parts according to claim 1, wherein the fixed mold and the movable mold are configured to be able to freely contact and separate from the ejector mechanism mounting member. 3. A resin for an electronic component, wherein a fixed mold is mounted on a fixed board via an ejector pin fitting member and a movable mold is mounted on a movable board via an ejector pin fitting member. A seal molding device, wherein an ejector mechanism for vertically moving an upper and lower ejector pin is disposed on an upper surface of a fixed plate and a lower surface of a movable plate, respectively, and the fixed type and the ejector pin fitting member, and the movable type And an ejector pin fitting member which is joined to and supported on substantially the entire surface of each ejector pin except for the through-hole portion of each ejector pin. 4. A method according to claim 1, further comprising: a cavity opposed to the PL surface of both dies and a step inserted into the resin passage, wherein the step is formed higher than the depth of the cavity and the resin passage. Jig for pushing ejector pins. 5. An ejector pin push-in mechanism, wherein an elastic pushing member for pushing an ejector pin is provided at a position corresponding to a position of a cavity and a resin passage opposed to a PL surface of both molds. Jig.