JPH0994834A - Resin molding apparatus and semiconductor integrated circuit apparatus made with the use of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce stress applied to the inside of a resin recessed part which is formed in the resin main body part of a resin product and the generation of the flash of the molded resin. SOLUTION: This apparatus has an upper mold and a lower mold which are installed to oppose each other and mold a resin which is injected after mold matching and an ejector pin 10 which ejects a semiconductor integrated circuit apparatus from the upper mold or the lower mold in demolding after resin molding, and the ejection surface 10b in the end part 10a of the ejector pin 10 is made in a projected spherical shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus for resin molding in semiconductor manufacturing technology, and more particularly to an ejector pin for releasing a resin product and a semiconductor integrated circuit device manufactured by the resin molding apparatus. is there.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
The present invention was studied by the present inventors upon completion, and its outline is as follows.

In a manufacturing process for assembling a resin-encapsulated semiconductor integrated circuit device, a resin molding device for resin sealing, that is, a molding device is disclosed in, for example, Japanese Patent Laid-Open No. 52-957.
A transfer mold apparatus as described in Japanese Patent Publication No. 65 is used. With this device, the semiconductor chip, which is a semiconductor element fixed or bonded to the lead frame, and the inner lead portion of the lead frame are sealed with resin.

The transfer molding apparatus is provided with a resin molding apparatus main body portion having an upper mold and a lower mold, and the shape of the resin main body of the resin product under the condition that the molds are matched with each other. A cavity corresponding to is formed. By injecting a molten resin into the cavity, a resin main body having a shape corresponding to the shape of the cavity is molded.

Further, the resin molding device or the main body of the resin molding device is provided with an ejector pin for thrusting a resin product such as a semiconductor integrated circuit device after the resin molding to separate the resin product from the upper mold or the lower mold. Has been done.

Since the tip of the ejector pin is formed by a flat surface, the outer peripheral portion of the tip has an edge shape.

[0007]

However, in the resin molding apparatus in the above-mentioned technique, since the outer peripheral portion of the tip of the ejector pin has an edge shape, it is formed by the ejector pin of the resin main body of the resin product. The stress concentrates on the corners inside the resin recess, and cracks occur at the corners.

This causes a problem that the reliability of the resin product is reduced.

Further, since the outer peripheral portion of the tip portion of the ejector pin has an edge shape, a mold resin burr is generated from the resin concave portion, and the mold resin burr is attached to the tip portion of the ejector pin.

As a result, when a mark such as the number of a mold for which molding is performed using the protruding surface of the tip of the ejector pin is formed on the resin main body, the mark adheres to the tip of the ejector pin. There is a problem that the mold resin rubs against and disappears.

An object of the present invention is to reduce the stress applied to the inside of the resin recess formed in the resin main body of the resin product, and further to reduce the occurrence of mold resin burrs, and a semiconductor manufactured using the same. An object is to provide an integrated circuit device.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0013]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the resin molding apparatus of the present invention is installed so as to face each other, and the first mold and the second mold for performing resin molding by injecting resin after mold matching, and the first mold after resin molding. When the first mold is separated from the second mold, the first mold
An ejector pin for releasing a resin product from a mold or the second mold, and a projecting surface of the ejector pin is formed in a convex spherical shape.

As a result, the inside of the resin concave portion formed by the ejector pin of the resin main body of the resin product is formed into a spherical shape without forming a corner.

As a result, the concentration of stress inside the resin recess can be reduced, and the occurrence of cracks in the resin recess can be reduced.

Further, since the inside of the resin recess is formed into a spherical shape, it is possible to reduce the occurrence of mold resin burr from the resin recess.

The resin molding apparatus according to the present invention is provided with a first mold and a second mold which are installed so as to face each other and are injected with resin after mold matching to perform resin molding, and the first mold after resin molding. 1 mold and an ejector pin that separates the resin product from the second mold when the mold is separated from each other, and a spherical projection near the center of the ejecting surface of the ejector pin. A portion is provided, and the outer peripheral skirt of the convex portion is formed of a curved surface.

Further, the resin molding apparatus of the present invention comprises first and second molds which are installed so as to face each other and are injected with resin after mold matching to perform resin molding, and the first mold after resin molding. 1 ejector pin which separates a resin product from the 1st metallic mold or the 2nd metallic mold at the time of separation of the 1st metallic mold and the 2nd metallic mold, A tip part of the ejector pin has a projection direction of the ejector pin. Is formed in a pyramid shape having a protruding surface at a right angle with the head.

Further, the semiconductor integrated circuit device of the present invention has a resin main body formed by resin-sealing a semiconductor element and its peripheral portion by the resin molding device, and the resin main body is provided with the resin main body. The resin recess has a spherical surface or a pyramidal inclined surface formed by an ejector pin.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a partial sectional view showing an example of the embodiment of the structure of the resin molding apparatus according to the present invention, and FIG. 2 shows an example of the embodiment of the structure of the first mold in the resin molding apparatus of the present invention. 3 is a plan view, FIG. 3 is a partial sectional view showing an example of an embodiment of a structure of an ejector pin in a resin molding apparatus of the present invention, and FIG. 4 is a structure of a semiconductor integrated circuit device manufactured by the resin molding apparatus of the present invention. FIG. 3 is a partial plan view showing an example of the form of FIG.

The resin molding apparatus described in this embodiment is a case where the resin product to be molded is the semiconductor integrated circuit device 17. That is, in the semiconductor integrated circuit device 17, the semiconductor chip 1 which is a semiconductor element and its peripheral portion are resin-sealed.

Therefore, the resin molding device is used to form the semiconductor integrated circuit device 17 as a resin product for resin-sealing the semiconductor chip 1 on the lead frame 2 to which the semiconductor chip 1 is fixed in advance. It is a thing.

The basic structure of the resin molding apparatus according to the present embodiment will be described. The lower mold 7 and the first mold, which are first molds installed opposite each other and injected with resin after mold matching to perform resin molding, 2 When the upper mold 8 which is a mold and the lower mold 7 and the upper mold 8 after resin molding are separated from each other, the semiconductor integrated circuit device 17 which is a resin product is separated from the lower mold 7 or the upper mold 8. The ejector pin 10 and the ejector pin 10 are provided. As shown in FIG. 3, the protruding surface 10b at the tip end portion 10a of the ejector pin 10 is formed in a convex spherical shape.

Further, the resin molding apparatus has an upper die base member 4 attached to a fixed platen (not shown) by the support columns 3 and a lower die base member 6 attached to the movable platen 5, and the movable platen 5 is It is movable up and down by a cylinder (not shown) operated by hydraulic pressure.

Further, a lower die 7 which is a first die is fixed to the lower die base member 6, and an upper die 8 which is a second die is fixed to the upper die base member 4. The mold 7 moves toward and away from the upper mold 8 by moving the movable platen 5 up and down. Mold cavities 9a and 9b are formed in the lower mold 7 and the upper mold 8, respectively. When the lower mold 7 and the upper mold 8 are matched with each other, the mold is also called a parting surface or a molding division plane. A cavity 9 is formed on the mating surface for molding the resin recess 16a of the semiconductor integrated circuit device 17, which is a resin product, by the mold recesses 9a and 9b.

Each of the upper mold base member 4 and the lower mold base member 6 has a heater (not shown) built therein, and the heater heats the upper mold 8 and the lower mold 7, respectively. .

A cylindrical pot 11 is attached to the upper die 8 through the upper die base member 4, and a plunger 12 is mounted in the pot 11 so as to be slidable in the axial direction. A resin tablet 13 is placed in the pot 11.
The tablet 13 is brought into a molten state by heating the lower mold 7 and the upper mold 8 by the heater. FIG. 1 shows a state where the tablet 13 after being melted is filled in the cavity 9.

In order to guide the molten resin into the cavity 9, a runner 14 that connects the pot 11 and the cavity 9 is formed on the mold matching surface, and the entrance of the runner 14 to the cavity 9 is a gate. It is 15.

Here, in the lower die 7 shown in FIG.
In the illustrated case, a total of 12 lead frames 2 each having five semiconductor chips 1 (see FIG. 1) are loaded, and in the illustrated case, a total of 60 cavities 9 (see FIG. 1) are installed. The constituting mold recess 9a is formed in the lower mold 7, and all the semiconductor chips 1 and their peripheral parts can be resin-sealed by a single molding step.

Needless to say, the number of semiconductor chips 1 fixed in advance to one lead frame 2 and the number of semiconductor integrated circuit devices 17 molded in one molding step can be set to any number. Yes.

The semiconductor integrated circuit device 17 of this embodiment
Has a semiconductor chip 1 and a resin main body 16 formed by sealing the periphery thereof with a resin, and a resin concave portion 1 made of a spherical surface formed by the ejector pin 10 on the resin main body 16.
6a.

Furthermore, when molding the resin main body 16 of the semiconductor integrated circuit device 17, the protrusion 16b of the ejector pin 10 for ejecting the semiconductor integrated circuit device 17 is used to mark the mark 16c such as the number of the lower die 7 on the resin main body. It may be formed on the portion 16. Therefore, the resin body 16 has
The ejector pin 10 forms a resin recess 16a. The resin recess 16a has a depth of about 0.5 mm, for example.

After resin molding, the lower mold 7 and the upper mold 8 are opened. At this time, the ejector pin 10 projects the semiconductor integrated circuit device 17 connected to the tablet 13 in conjunction with the mold opening operation of the lower mold 7 and the upper mold 8.
That is, the ejector pin 10 is the semiconductor integrated circuit device 1
The semiconductor integrated circuit device 17 is detached from the lower die 7 by pushing 7.

Thus, the resin molding of the semiconductor integrated circuit device 17 is completed.

According to the resin molding apparatus of this embodiment and the semiconductor integrated circuit device manufactured using the same, the following operational effects can be obtained.

That is, the tip portion 1 of the ejector pin 10
Since the protruding surface 10b at 0a is formed in a convex spherical shape, a corner portion is formed inside the resin concave portion 16a formed by the ejector pin 10 in the resin main body portion 16 of the semiconductor integrated circuit device 17 which is a resin product. Is not formed, and the inside 16b is formed only by the spherical surface.

As a result, the inside 16b of the resin recess 16a is
It is possible to reduce the concentration of stress on the resin, and as a result, it is possible to reduce the occurrence of cracks in the resin recess 16a.

Therefore, the reliability of the semiconductor integrated circuit device 17, which is a resin product, can be improved.

Further, since the inner portion 16b is formed into a spherical shape, it is difficult to form a gap between the ejector pin 10 and the inner portion 16b, so that it is possible to reduce the occurrence of mold resin burr from the resin recessed portion 16a.

As a result, it is possible to reduce the adhesion of the mold resin burr to the tip portion 10a of the ejector pin 10, so that the mark 16c such as the number of the lower die 7 formed on the resin main body 16 is the same as the mold resin burr. It is possible to reduce the occurrence of secondary defects such as rubbing and disappearing.

Although the invention made by the present inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the embodiments of the present invention, and does not depart from the scope of the invention. It goes without saying that various changes can be made with.

For example, in the above-described embodiment, the ejecting surface of the ejector pin of the resin molding device is formed in a convex spherical shape. However, the shape of the ejecting surface is the resin main body of the resin product. An ejector pin provided in the resin molding apparatus of another embodiment shown in FIG. 5 or 6 may be used as long as it does not form a corner in the resin concave portion.

Here, the ejector pin 20 shown in FIG.
Is provided with a spherical convex portion 20d in the vicinity of the center 20c of the protruding surface 20b at the tip portion 20a.
The outer peripheral skirt 20e of d has a curved surface.

Further, the ejector pin 30 shown in FIG.
Is a protruding surface 3 whose tip portion 30a is substantially perpendicular to the protruding direction 18 (see FIG. 3) of the ejector pin 30.
It is formed in a pyramid shape having 0b in the head portion 30c.

In this case, an obtuse resin corner 16e is formed in the resin recess 16a formed by the ejector pin 30, that is, in the interior 16b of the resin recess 16a of the resin main body 16 in the other embodiment shown in FIG. To be done.

That is, the semiconductor integrated circuit device 17 manufactured by the resin molding device having the ejector pin 30.
As shown in FIG. 7, the pyramid inclined surface 16 formed by the ejector pin 30 on the resin body 16 is shown in FIG.
It has a resin recess 16a made of d.

Here, the resin corner portion 16e of the resin concave portion 16a
Is an obtuse angle, the stress applied to the resin corner portion 16e is reduced.

Therefore, by providing the ejector pins 20 and 30 shown in FIGS. 5 and 6 in the resin molding apparatus described in the above-mentioned embodiment, respectively, the same operation and effect as those of the resin molding apparatus in the above-described embodiment can be obtained. Obtainable.

Further, in the resin molding apparatus according to the above-described embodiment, the case where the first mold is the lower mold and the second mold is the upper mold has been described. On the contrary, the first mold is the upper mold. Needless to say, the second mold may be a lower mold.

Further, in the above-described embodiment, the case where the resin product is the semiconductor integrated circuit device has been described. However, the resin product is not limited to the semiconductor integrated circuit device as long as it is manufactured by resin molding. Good.

[0053]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.
It is as follows.

(1). The ejecting surface of the ejector pin is formed in a convex spherical shape, or a spherical convex portion is provided near the center of the protruding surface and the outer peripheral hem of the convex portion is a curved surface, or the ejector pin is formed. Is formed into a pyramid shape having a protruding surface on the head which is substantially perpendicular to the ejecting direction of the ejector pin, the inside of the resin body of the resin product is formed into a spherical shape. A resin recess or a resin recess having an obtuse resin corner is formed. As a result, it is possible to reduce the concentration of stress inside the resin recess or the resin corner of the resin recess, and as a result, it is possible to reduce the occurrence of cracks in the resin recess.

(2). Since the occurrence of cracks in the resin recess of the resin body of the resin product can be reduced, the reliability of the resin product can be improved.

(3). Since a resin recess having a spherical interior or a resin recess having an obtuse resin corner is formed, it is possible to reduce the occurrence of mold resin burr from the resin recess. As a result, it is possible to reduce the adhesion of the mold resin burr to the tip of the ejector pin,
It is possible to reduce the occurrence of secondary defects such as the disappearance of marks such as die numbers formed on the resin main body.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing an example of an embodiment of the structure of a resin molding apparatus according to the present invention.

FIG. 2 is a plan view showing an example of an embodiment of the structure of a first mold in the resin molding apparatus of the present invention.

FIG. 3 is a partial cross-sectional view showing an example of an embodiment of the structure of an ejector pin in the resin molding device of the present invention.

FIG. 4 is a partial plan view showing an example of an embodiment of a structure of a semiconductor integrated circuit device manufactured by a resin molding device of the present invention.

FIG. 5 is a partial cross-sectional view showing an example of the structure of an ejector pin of a resin molding device according to another embodiment of the present invention.

FIG. 6 is a partial perspective view showing an example of the structure of an ejector pin of a resin molding apparatus according to another embodiment of the present invention.

FIG. 7 is a partial cross-sectional view showing an example of the structure of a semiconductor integrated circuit device manufactured by a resin molding device according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip (semiconductor element) 2 Lead frame 3 Support 4 Upper mold base member 5 Movable platen 6 Lower mold base member 7 Lower mold (1st mold) 8 Upper mold (2nd mold) 9 Cavity 9a Mold Recessed portion 9b Mold recessed portion 10 Ejector pin 10a Tip portion 10b Projected surface 11 Pot 12 Plunger 13 Tablet 14 Runner 15 Gate 16 Resin body portion 16a Resin recessed portion 16b Internal 16c mark 16d Pyramidal inclined surface 16e Resin corner portion 17 Semiconductor integrated circuit device (resin) 18) Ejection direction 20 Ejector pin 20a Tip part 20b Ejection surface 20c Near the center 20d Convex part 20e Outer peripheral hem part 30 Ejector pin 30a Tip part 30b Ejection surface 30c Head part

Claims (5)

[Claims] 1. A resin molding device for molding a resin product, comprising: a first mold and a second mold, which are installed to face each other, and are injected with resin after mold matching to perform resin molding. An ejector pin that separates the resin product from the first mold or the second mold when the first mold and the second mold are separated from each other after resin molding, and the ejecting surface of the ejector pin Is formed in a convex spherical shape. 2. A resin molding device for molding a resin product, the first mold and the second mold being installed so as to face each other, and the resin is injected after mold matching to perform resin molding. An ejector pin that separates the resin product from the first mold or the second mold when the first mold and the second mold are separated from each other after resin molding, and a protruding surface of the ejector pin 2. A resin molding apparatus, wherein a spherical convex portion is provided near the center of, and an outer peripheral skirt portion of the convex portion is a curved surface. 3. A resin molding device for molding a resin product, the first mold and the second mold being installed so as to face each other, and resin is injected after mold matching to perform resin molding. An ejector pin that separates the resin product from the first mold or the second mold when the first mold and the second mold are separated from each other after resin molding, and a tip end portion of the ejector pin Is formed into a pyramid shape having a protruding surface on the head which is substantially perpendicular to the protruding direction of the ejector pin. 4. The resin molding apparatus according to claim 1, 2 or 3, wherein the resin product is a semiconductor integrated circuit device in which a semiconductor element and a peripheral portion thereof are resin-sealed. apparatus. 5. A semiconductor integrated circuit device manufactured by using the resin molding apparatus according to claim 1, 2, 3 or 4.
A resin having a resin main body formed by resin-sealing a semiconductor element and its peripheral portion by the resin molding device, and a resin having a spherical surface or a pyramid inclined surface formed by an ejector pin of the resin molding device in the resin main body. A semiconductor integrated circuit device having a recess.