JP2668727B2 - Mold for molding box-shaped resin molded article and method of manufacturing semiconductor device using this mold - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for molding a box-shaped resin molded product and a method of manufacturing a semiconductor device using the mold, and more particularly, to a method for manufacturing a semiconductor device using a lead frame. In addition, a mold for molding a box-shaped resin molded product with a lead frame capable of preventing the occurrence of flash burrs of the resin constituting the box-shaped resin molded product, and by using this mold, a lead frame and a semiconductor element can be formed. The present invention relates to a method for manufacturing a hermetically sealed semiconductor device, which makes good electrical connection of the device.

Technical background of the invention and its problems In a method of manufacturing a hermetically sealed semiconductor device comprising a box-shaped hollow resin molded product, a lead frame, a semiconductor chip, a bonding wire and a lid member, a conventional method is to use a box-shaped hollow resin molded product. When molding, after embedding the lead frame in the mold, by injection molding or transfer molding the resin in this mold, the lead frame and the box-shaped hollow resin molded body are integrated, so-called Generally, insert molding is performed.

However, in such insert molding, since flash burrs of the resin occur on the surface of the lead frame, there has been a problem that electrical connection between the lead frame and the semiconductor element cannot be easily performed.

In order to solve this problem, a method in which a semiconductor element is electrically connected on a lead frame in advance and then molded with resin has been generally adopted.

However, this method has a problem that the function of the semiconductor element is easily deteriorated because the semiconductor element receives high heat and impact during molding.

Further, a method has been attempted in which the flash burrs are removed to facilitate electrical connection between the lead frame and the semiconductor element. For example, there are a blast method for removing flash burrs using abrasive grains, a method for dissolving and removing flash burrs using chemicals, and a method for removing flash burrs by injecting a high-pressure liquid (Japanese Patent Application Laid-Open No. 60-1502033). .

However, in the above blast method, since the surface of the resin mold portion is damaged, the surface of the resin mold portion must be masked, and there is a problem that the manufacturing process becomes complicated. Also, in the method using chemicals, even though flash burrs can be removed, the flash burrs cannot be completely removed, and furthermore, brushing or the like must be performed. However, there is a problem similar to the blast method.
Further, in the method of injecting a liquid at a high pressure, it is necessary to remove flash burrs adhering to the front and back surfaces of the lead frame. Therefore, a high-pressure liquid ejecting apparatus having a complicated structure including two ejection nozzles is required. There was a problem.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and to prevent the generation of flash burrs of a resin constituting a box-shaped resin molded product on a lead frame constituting a semiconductor device. Provided is a mold for molding a box-shaped resin molded body with a lead frame, and a method for manufacturing a hermetically sealed semiconductor device that improves electrical connection between a lead frame and a semiconductor element by using the mold. The purpose is to do.

SUMMARY OF THE INVENTION A mold for molding a box-shaped resin molded product according to the present invention is a molding die used when manufacturing a box-shaped resin molded product with a lead frame constituting a semiconductor device. The projection for forming a hollow portion of the box-shaped resin molded product in the mold projects from the parting face, and the surface to be contacted with the island of the lead frame in the projection for forming the hollow portion is a plane parallel to the parting face,
Further, the surface of the hollow portion forming projection that is to be in contact with the internal lead of the lead frame is provided in a tapered shape.

A method of manufacturing a semiconductor device according to the present invention, a semiconductor element,
A box-shaped resin molded body having a lead frame, a bonding wire for electrically connecting the electrode of the semiconductor element and the lead frame, and having a recess for accommodating the semiconductor element, and the box-shaped resin molded body When manufacturing a semiconductor device including a lid member for sealing the entire concave portion, the hollow portion forming protrusion of the box-shaped resin molding in the molding die protrudes from the parting face, and the hollow portion forming protrusion is formed. A die in which the surface of the lead frame to be contacted with the island is a plane parallel to the parting face, and the surface of the hollow portion forming projection that is to be contacted with the inner lead of the lead frame is tapered. A step of injecting resin under pressure with a lead frame installed therein to obtain a box-shaped resin molded body integrated with the lead frame; A step of wire-bonding a semiconductor device to the island of the frame and then wire-bonding the electrodes of the semiconductor element and the lead frame; It is characterized in that it comprises a step of sealing the whole.

DETAILED DESCRIPTION OF THE INVENTION Hereinafter, a box-shaped resin molded body molding die according to the present invention and a semiconductor device manufacturing method using the die will be specifically described with reference to the drawings.

FIG. 1 is a schematic view of one step in a method of manufacturing a semiconductor device using a mold for molding a box-shaped resin molded product according to the present invention, and FIG. FIG. 3 is an explanatory cross-sectional view of a mold having a protrusion for forming a hollow portion of a box-shaped resin molded body, of which FIG. 3 is a schematic view showing a configuration of a semiconductor device obtained by a manufacturing method according to the present invention. Is.

First, in the first step of the method for manufacturing a semiconductor device according to the present invention, the box-shaped resin molded body 1 integrated with the lead frame 2 is obtained by the insert molding method. At this time, in the present invention, the molding dies 3a and 3b as shown in FIGS. 1 and 2, that is, the projections 4 for forming the hollow portion of the box-shaped resin molded article 1 project from the parting face 5, and The surface of the hollow portion forming protrusion 4 that is to be in contact with the island 2a of the lead frame is a plane parallel to the parting face 5, and the hollow portion forming protrusion 4 is to be in contact with the lead 2b of the lead frame. A die whose surface is tapered is used. The optimum size of the hollow portion forming projection 4 in the molding die 3a used in the present invention varies depending on the material, shape, etc. of the lead frame 2, but is generally in the following range. That is, the protrusion difference A from the parting face 5 of the surface to be in contact with the island 2a of the lead frame in the hollow portion forming protrusion 4 is 10 to 100 μm, and the side surface corner portion of the hollow portion forming protrusion 4 is The protrusion difference B from the parting face is 5 to 50 μm.

In the present invention, a resin is injected and injection-molded in a state where the lead frame 2 is installed in the molds 3a and 3b as described above.

In the present invention, the use of the mold 3a having the projecting portion 4 for forming the hollow portion of the box-shaped resin molded body as described above allows the lead frame island 2a and the internal lead 2b to be utilized by utilizing the elasticity of the lead frame 2. Is closely adhered to the mold 3a, and then resin is injected into the mold for molding, so that the lead frame 2 in the recess of the obtained box-shaped resin molded body 1,
That is, flash burrs of the resin do not occur on the island 2a and the internal leads 2b. Further, in the semiconductor device manufacturing method according to the present invention, it is not necessary to pretreat the lead frame 2.

The resin forming the box-shaped resin molded body 1 in the present invention is
It is a heat-resistant resin, specifically, an epoxy resin, a polyimide resin, a phenol resin, an unsaturated polyester resin,
Thermosetting resin such as silicone resin, polyphenylene sulfide (PPS), polybutylene terephthalate (PB
T), polyether sulfone (PES), polyether ether ketone (PEEK), liquid crystal polymer, polyamide imide, and other thermoplastic resins are used, and curing agents, curing accelerators,
Also includes fillers and the like.

In the present invention, the conditions for the insert molding are different depending on the resin used, but usually, the pressure is 10 to 500 kg / cm.
^2. Pressurized and heated at a temperature of 100 to 250 ° C.

Next, in the second step of the manufacturing method according to the present invention, after the semiconductor element 6 is die-bonded to the island 2a of the lead frame, the electrode of the semiconductor element 6 and the lead frame 2 are
And wire bonding.

Specific examples of the semiconductor element 6 include DRAM and SRA.
Memory elements such as M and ROM, CCD image sensor, MOS
An image sensor element such as an image sensor can be used.

The island 2a of the lead frame is electrically connected to the semiconductor element 6 by the die bonding, and the electrode of the semiconductor element 6 and the lead frame 2 are connected by the wire bonding via the bonding wire 7 made of a gold wire, an aluminum wire, or the like. Are electrically connected.

In the present invention, since the electrical connection is performed after the box-shaped resin molded body 1 is formed, the semiconductor element 6 is not subject to high heat and impact when the box-shaped resin molded body 1 is formed as in the related art. Therefore, the semiconductor element 6 can retain its original function.

Finally, in the third step of the manufacturing method according to the present invention, the lid member 8 is adhered to the concave portion of the box-shaped resin molded body 1 to seal the entire concave portion of the box-shaped resin molded body 1.

The lid 8 used in the present invention is not particularly limited, and a conventionally known lid can be used. Specifically, a transparent lid such as a quartz glass plate, a sapphire plate, a transparent alumina plate, or a transparent plastic plate can be used. And opaque lids such as colored glass plates, ceramic plates such as alumina, and colored plastic plates.

In the present invention, examples of the adhesive used for bonding the lid member 8 to the box-shaped resin molded body 1 include an epoxy-based adhesive, an imide-based adhesive, and an acrylic-based adhesive.

Effect of the Invention According to the manufacturing method of the present invention, the protrusion for forming the hollow portion of the box-shaped resin molded product in the molding die projects from the parting face, and the island of the lead frame in the protrusion for forming the hollow portion is The lead frame is placed in a mold in which the surface to be contacted with the parting face is a plane parallel to the parting face, and the surface to be contacted with the internal lead of the lead frame in the projection for forming the hollow portion is tapered. The resin is pressure-injected in the installed state, and through a step of obtaining a box-shaped resin molded body integrated with the lead frame, the gap between the semiconductor element and the island of the lead frame and between the electrode of the semiconductor element and the lead frame. Since the semiconductor device is manufactured by electrically connecting the two,
There is an effect that it is possible to easily prevent the flash flash of the resin on the lead frame without damaging the resin mold portion, and to improve the electrical connection between the lead frame and the semiconductor element.

Further, in the method of manufacturing a semiconductor device according to the present invention, since the mold as described above is used, the manufacturing process is simplified without requiring the step of pretreating the lead frame.

[Brief description of the drawings]

FIG. 1 is a schematic view of one step in a method of manufacturing a semiconductor device using a mold for molding a box-shaped resin molded product according to the present invention, and FIG. FIG. 3 is a cross-sectional explanatory view of a die having a hollow portion forming protrusion of the die, and FIG. 3 is a schematic diagram showing a configuration of a semiconductor device obtained by a manufacturing method according to the present invention. 1 ... box-shaped resin molded body 2 ... lead frame 2a ... contact planned portion (lead frame island) 2b ... contact planned portion (internal lead frame lead) 2c ... contact planned portion (lead frame external lead) 3a, 3b: Mold for injection molding 4: Protrusion for forming hollow part 5: Parting face 6: Semiconductor element 7: Bonding wire 8: Lid material

Claims (4)

(57) [Claims] 1. A molding die used for manufacturing a box-shaped resin molded product with a lead frame which constitutes a semiconductor device, wherein a projection for forming a hollow portion of the box-shaped resin molded product in the molding die is provided. The part protrudes from the parting face, the surface of the hollow part forming projection that is to come into contact with the island of the lead frame is a plane parallel to the parting face, and the internal lead of the lead frame at the hollow part forming projection is A surface-contacting surface is provided in a tapered shape. 2. The protrusion difference between the parting face of the surface of the lead frame to be contacted with the island in the protrusion for forming the hollow portion from the parting face is 10 to 100 μm, and the side surface corner of the protrusion for forming the hollow portion is formed. The box-shaped resin molded body molding die according to claim 1, wherein a protrusion difference from the parting face is 5 to 50 μm. 3. A box-shaped resin molded article comprising a semiconductor element, a lead frame, and a bonding wire for electrically connecting an electrode of the semiconductor element and the lead frame, and having a recess for accommodating the semiconductor element. When manufacturing a semiconductor device comprising: and a lid member for sealing the entire concave portion of the box-shaped resin molded product, the hollow-portion-forming projection of the box-shaped resin molded product in the molding die protrudes from the parting face. The surface of the hollow portion forming projection that is to contact the island of the lead frame is a plane parallel to the parting face, and the surface of the hollow portion forming projection that is to contact the internal lead of the lead frame is tapered. The resin is pressurized and injected into the mold provided in the shape of the lead frame with the lead frame installed. A step of obtaining a shape, a step of die-bonding a semiconductor element to an island of a lead frame, a step of wire-bonding an electrode of the semiconductor element and a lead frame, Sealing the entire recess of the box-shaped resin molded product. 4. A difference in projection between a parting face of the surface of the lead frame and the surface of the lead frame which is to come into contact with the island in the projection for forming a hollow portion is 10 to 100 μm, and a corner of a side surface of the projection for forming the hollow portion is formed. The method of manufacturing a semiconductor device according to claim 3, wherein an injection molding die having a protrusion difference from the parting face of 5 to 50 μm is used.