JP3117682B2 - Contactless semiconductor card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type semiconductor card in which a substrate and an electronic component mounted on the substrate are embedded in a card base, and more particularly to a structure for sealing the substrate and the electronic component.

[0002]

2. Description of the Related Art In recent years, a substrate such as a printed circuit board on which predetermined electronic components such as a memory IC, a CPU, and a data input / output coil are mounted is completely embedded in a resin card base, and a reader / writer is provided. A non-contact type semiconductor card has been proposed in which data is exchanged between a data input / output coil provided in the device and the coil mounted on the substrate.

[0003] This semiconductor card is different from a contact type semiconductor card in which external terminals are exposed on the surface of the card and data is transferred by contacting a connection terminal provided in a reader / writer with the external terminal. The external terminals do not become dirty or worn, and are characterized by excellent durability and high-reliability data communication.

Conventionally, a manufacturing method of this kind of non-contact type semiconductor card has been proposed as described in Japanese Patent Application Laid-Open No. Hei 2-204096. According to this manufacturing method, a through hole is formed in a portion of the circuit board where no electronic component is mounted, and the circuit board is mounted in a first mold, and the electronic component is mounted in a portion of the circuit board where the electronic component is not mounted. And a protrusion is formed by projecting a part of the resin from the back surface of the circuit board through the through hole.

[0005] The circuit board with the frame is placed in another second mold, and the entire periphery is sealed with a sealing resin layer. At this time, since the projection is provided on the back side of the circuit board, a gap is formed between the bottom surface of the mold and the circuit board, so that the resin can also flow around the back side of the circuit board, and the circuit board is sealed with a sealing resin layer. It is designed to be completely buried inside.

[0006]

However, in this semiconductor card, the position of the circuit board is buried in the sealing resin layer so as to be deviated to the rear side, and therefore, the upper sealing resin layer formed on the circuit board has an upper side. There is a difference between the amount of resin and the amount of resin of the lower sealing resin layer formed on the lower side, which is quantitatively unbalanced.

[0007] When there is a difference in the amount of resin filled between the upper sealing resin layer and the lower sealing resin layer, the degree of curing shrinkage of the resin is different between the upper and lower sides of the substrate. Deformation such as warpage occurs in the layer, which mechanically adversely affects the internal substrate and the electronic components mounted thereon, resulting in a problem in operation reliability.

When the entire semiconductor card warps, not only does the commercial value decrease, but also the leader /
The opposing state (coupling state) between the input / output coil on the writer side and the input / output coil on the semiconductor card side is not uniform, so that communication characteristics vary. Further, when the entire semiconductor card is warped, there is a drawback that the semiconductor card cannot be smoothly taken in and out of the reader / writer, and the semiconductor card is partially worn as the card is taken in and out.

The present invention overcomes this disadvantage of the prior art,
It is an object of the present invention to provide a non-contact type semiconductor card which has high operation reliability, does not decrease the commercial value, has stable communication characteristics for each product, and has good handleability.

[0010]

In order to achieve the above object , the present invention provides an electronic component including a substrate, a data input / output coil mounted on the substrate and a semiconductor chip embedded in a resin card base. In the non-contact type semiconductor card, the substrate is embedded at a substantially central position in the thickness direction of the card base, and the card base is at least the first base.
It has a molding part and a second molding part, and the second molding part is semiconductive.
A molded part for defining the thickness of the body card.
The first molded part formed on the outer periphery of the molded part 2 is
Upper resin layer formed on the upper side of the board and formed on the lower side of the board
With a lower resin layer, and the amount of resin in the upper resin layer
The resin amount of the side resin layers is substantially equal .

[0011]

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, according to the present invention, a substrate is buried at a substantially central position in a thickness direction of a card base .
The card base has at least a first molded portion and a second molded portion.
Parts, of which the second molding part is the thickness of the semiconductor card.
Forming part for defining the second forming part
The first molded portion formed on the outer periphery of the
The formed upper resin layer and the lower formed below the substrate
It has a resin layer, the amount of resin in the upper resin layer and the lower resin layer.
Resin amount is almost equal. Therefore, the internal stress caused by the curing shrinkage of the resin of the upper resin layer and the lower resin layer becomes substantially equal on both the front and back surfaces of the substrate, and therefore, deformation such as warpage generated in the card base can be reduced. Further, the mechanical influence on the substrate and the electronic components due to the warpage of the card base can be minimized. As a result, mechanical adverse effects on the substrate and the electronic components mounted thereon are reduced, and the operation reliability can be improved.

[0013] Further, deformation such as warpage does not occur in the entire semiconductor card, so that a reduction in commercial value can be prevented, the communication characteristics of each product are stable, and the semiconductor card can be smoothly taken in and out of a reader / writer. Thus, the semiconductor card is not partially worn, and the handling is improved.

[0014]

[0015]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a semiconductor card according to the present invention, and FIG.
Is a plan view of the semiconductor card, and FIG. 3 is a cross-sectional view for explaining a manufacturing process of the semiconductor card.

As shown in FIG. 2, a semiconductor card includes a substrate 2 such as a printed circuit board on which electronic components 1 such as a memory IC 1a and a CPU 1b and a data input / output coil 1c are mounted. And laminated film 5 on both sides of the card base 3
Is affixed.

As shown in FIGS. 1 and 2, the card base 3 constitutes an outer peripheral portion thereof, and has a first molded portion 3a for holding the electronic component 1 and the substrate 2 at a substantially central position in the thickness direction.
And a case-shaped second molded portion 3b for enclosing the battery 4 of the substrate 2. As shown in FIG. 1, the surfaces (both front and back) of the first molded portion 3a and the second molded portion 3b are substantially flush with each other.
Laminated films 5 and 5 are stuck on both front and back sides. Further, the joining portion does not reach the outer peripheral portion of the card base 3 but exists in the inner portion of the card base 3.

The first forming part 3a and the second forming part 3b
Molded with the same or different resin materials. The card base 3 (the first molded part 3a and the second molded part 3b)
Although any resin material can be used for molding, a resin material having a low melting temperature and a small cure shrinkage is preferable for protecting electronic components. Such preferred resin materials include unsaturated polyesters.

One or more through-holes 6 for connecting resin layers are formed on the substrate 2 at positions where the electronic components 1 are not mounted. At the time of molding the first molded portion 3a, a part of the resin constituting the first molded portion 3a is filled in the through hole 6, and is formed on the upper side of the substrate 2 by the filled resin in the through hole 6. Upper resin layer 3
a-1 and a lower resin layer 3a- formed below the substrate 2.
2 are interconnected (see FIG. 3). A part of the resin forming the first molded portion 3a goes around the entire outer periphery of the substrate 2 as shown in FIGS.
3, the upper resin layer 3a-1 and the lower resin layer 3a-2 are also connected to each other.

Hereinafter, a method for manufacturing a semiconductor card according to this embodiment will be described. As shown in FIG.
Consists of an upper mold 11a and a lower mold 11b.
A cavity 13 having the same shape as the outer shape of the card base 3 and a resin injection portion 14 communicating with the cavity 13 are formed on the opposing surfaces of 1a and 11b.

Before being mounted on the mold 11, the second molding portion 3b is molded by another mold (not shown).
At the time of forming the first forming portion 3a, the upper mold 11a and the lower mold 11b are opened, and the battery mounting portion of the substrate 2 is covered with the second case-shaped second cover so as to cover the battery 4 mounted on the substrate 2. The substrate 2 and the second molding part 3b are placed in the lower mold 11b while being sandwiched between the molding parts 3b from above and below.
Is closed, and the upper and lower second molding portions 3b are sandwiched between the upper mold 11a and the lower mold 11b via the substrate 2.

At this time, the concave portion 15 of the second molded portion 3b engages with the convex portion 16 of the mold 11, and the substrate 2 in the cavity 13 in the in-plane direction (the plane direction orthogonal to the card thickness direction). Positioning is performed. Further, the electronic component 1 and the substrate 2 are fixed at a substantially central position in the vertical direction of the cavity 13 while being sandwiched between the upper and lower second molded portions 3b.

In this state, the resin is injected from the resin injection port 4, and the first molded portion 3a is formed as shown in FIG.
When the upper mold 11a and the lower mold 11b are in contact with the upper and lower second molding portions 3b, respectively, the mold 11 is closed to form the cavity 13, and the resin is injected into the cavity 13 to form the first molding portion. 3a are formed, so that the upper and lower second molded portions 3
The thickness of the first molded portion 3a, that is, the thickness of the card base 3 is defined by b.

The first formed part 3 thus formed
The upper and lower surfaces of “a” are substantially flush with the upper and lower surfaces of the second molded portion 3b as shown in FIG. Laminate films 5 and 5 are stuck on the upper and lower surfaces of the card base 3 composed of the first molded part 3a and the second molded part 3b, and the joint between the first molded part 3a and the second molded part 3b. Is covered with the laminate film 5.

In the figure, reference numeral 3c denotes a flange provided on the outer periphery of the second molding portion 3b, 12 denotes a portion between the upper mold 11a and the upper second molding portion 3b, and a portion between the lower mold 11b and the lower mold 11b. This space is provided between the second molding portion 3b and the second molding portion 3b in order to reduce the thermal effect of the mold temperature on the battery 4.

A through hole 6 is provided in the substrate 2, and resin is filled in the through hole 6, and the resin layers 3 a-1 and 3 a-2 formed on the front and back surfaces of the substrate 2 form the through hole 6.
Since they are connected to each other by a resin, the substrate 2 and the card base 3 can be firmly integrated.

[0028]

According to the present invention, the substrate is buried at a substantially central position in the thickness direction of the card base, and the card base is small.
At least a first molded part and a second molded part, of which
A second molding part for defining the thickness of the semiconductor card
A molded part, formed on the outer periphery of the second molded part
An upper resin formed on an upper side of the substrate;
And a lower resin layer formed on the lower side of the substrate.
The amount of resin in the upper resin layer is almost equal to the amount of resin in the lower resin layer.
No. Therefore, the internal stress caused by the curing shrinkage of the resin in the upper resin layer and the lower resin layer is substantially equal on both the front and back surfaces of the substrate, and therefore, deformation such as warpage of the card base can be reduced. Further, the mechanical influence on the substrate and the electronic components due to the warpage of the card base can be minimized. As a result, mechanical adverse effects on the substrate and the electronic components mounted thereon are reduced, and the operation reliability can be improved.

Further, deformation such as warpage does not occur in the entire semiconductor card, so that a reduction in commercial value can be prevented, communication characteristics of each product are stable, and the semiconductor card can be smoothly taken in and out of a reader / writer. Thus, the semiconductor card is not partially worn, and the handling is improved.

[0030]

[0031]

[0032]

[0033]

[0034]

[0035]

[Brief description of the drawings]

FIG. 1 is a sectional view of a semiconductor card according to an embodiment of the present invention.

FIG. 2 is a plan view of the semiconductor card.

FIG. 3 is a cross-sectional view for explaining a manufacturing process of the semiconductor card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 1a Memory IC 1b CPU 1c Data input / output coil 2 Substrate 3 Card base 3a First molded part 3a-1 Upper resin layer 3a-2 Lower resin layer 3a-3 Outer peripheral resin layer 3b Second Molding part 4 Battery 5 Laminate film 6 Through hole 11 Mold 11a Upper mold 11b Lower mold 13 Cavity 15 Concave part 16 Convex part

Claims (1)

(57) [Claims] 1. A non-contact type semiconductor card comprising a substrate, a data input / output coil mounted on the substrate, and an electronic component including a semiconductor chip embedded in a resin card substrate, wherein the substrate has a thickness of the card substrate. The card base is buried at a substantially central position in the vertical direction, and at least the first molded part and the second molded part
Part having a second molded part for defining the thickness of the semiconductor card
A of the forming section, the first molding portion formed on the outer circumference of the second molding part
The upper resin layer formed on the upper side of the substrate and the lower side of the substrate
Having a lower resin layer formed on the upper resin layer
A non-contact type semiconductor card, wherein the amount is substantially equal to the amount of resin in the lower resin layer .