JPH06293194A - Semiconductor card and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a semiconductor card, hardly making warp and/or deformation, and the manufacturing method thereof. CONSTITUTION:A semiconductor card, constituted of an electronic component 1, provided on a print substrate 2, and a card substrate 3, made of resin and in which the print substrate 2 is embedded, is formed of a first molded part, constituting the outer peripheral part of the card substrate 3 and supporting the outer peripheral part of the print substrate 2 at the intermediate position in the direction of the thickness of the same, and a second molded part 3b, constituting the inner peripheral part of the card substrate 3 and integrally embedded in the inner peripheral part of the print substrate 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type semiconductor card in which all desired electronic components are embedded in a card base,
And its manufacturing method.

[0002]

2. Description of the Related Art In recent years, a printed circuit board on which a predetermined electronic component such as a memory IC, a CPU, an input / output coil, etc. is mounted is completely embedded in a card base made of resin and provided for a reader / writer. There has been proposed a non-contact type semiconductor card that performs data communication between an input / output coil and a coil mounted on the printed circuit board.

This semiconductor card has a structure in which external terminals are exposed on the surface of the card, and a connecting terminal provided in a reader / writer is connected to the external terminals to communicate data by comparing with a contact type semiconductor card. Since the external terminal is not contaminated or worn, it has a feature that it is possible to perform highly reliable and highly reliable data communication.

Conventionally, such a non-contact type semiconductor card is
For example, as described in Japanese Patent Application Laid-Open No. 61-222712, a printed board on which predetermined electronic components are mounted is set on the cavity surface of the lower mold, and the upper mold and the lower mold form the structure. The cavity is filled with resin, and the card substrate in which the printed circuit board is embedded is integrally molded.

According to this, as shown in FIG. 9, a semiconductor card is formed in which the back surface (surface on which electronic components are not mounted) of the printed circuit board 21 is exposed on one side of the card base 22. Note that reference numerals 23a and 23b in the figure denote laminated films attached to both front and back surfaces of the card base 22.

[0006]

In the conventional semiconductor card described above, as shown in the drawing, the printed circuit board 21 is embedded on one side of the card base 22 with a bias, so that the arrow A, There is a problem that it tends to bend in the direction of A '.

The present invention has been made in order to solve the above-mentioned deficiencies of the prior art, and is a semiconductor card in which deformation such as warpage is unlikely to occur, and a manufacturing method suitable for manufacturing such a semiconductor card. And to provide.

[0008]

In order to achieve the above object, the present invention provides a semiconductor card in which an electronic component mounted on a printed circuit board is embedded in a card base made of resin. A first molding portion that constitutes an outer peripheral portion and supports the outer peripheral portion of the printed board at an intermediate position in the thickness direction thereof, and an inner peripheral portion of the card base body, and integrates the inner peripheral portion of the printed board. The card base was constructed from the second molding part embedded in the.

As a method of manufacturing such a semiconductor card, a method of manufacturing a semiconductor card, which comprises a step of burying a printed circuit board and an electronic component mounted on the printed circuit board in a resin card base, When a component is embedded in a resin-made card substrate, first, the printed board on which the electronic component is mounted is attached to a first mold, and the card substrate is provided on either the inner peripheral portion or the outer peripheral portion of the printed substrate. Part of the
As described above, the printed board in which a part of the card base is integrally formed on either the inner peripheral portion or the outer peripheral portion is attached to the second mold, and the remaining portion of the card base is molded.

Further, in a method of manufacturing a semiconductor card including a step of burying a printed circuit board and an electronic component mounted on the printed circuit board in a resin card base, a recess into which the printed circuit board having the electronic component mounted can be inserted is formed. The first molding part having the first molding part is molded in advance, the printed circuit board on which the electronic component is mounted is inserted into the concave part of the first molding part, and the space in the concave part is filled with resin to form the second molding part. By forming, the electronic component and the printed board are embedded in the card board.

[0011]

In the semiconductor card, since the printed circuit board and the electronic components mounted on the printed circuit board are completely embedded in the card base made of resin, internal stress caused by curing shrinkage of the resin is applied to both front and back surfaces of the printed circuit board. It can act almost equally. Therefore, the deformation of the card body such as warpage can be significantly reduced.

Further, according to the above manufacturing method, the resin can be molded on both front and back surfaces of the printed circuit board without using a molding die having a special printed circuit board supporting structure, and the printed circuit board and the electronic component can be used as a card. It is possible to form a semiconductor card that is completely embedded in the substrate.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a sectional view of a semiconductor card according to the present invention, FIG. 2 is a plan view of the semiconductor card, and FIGS. 3 and 4 are sectional views showing a manufacturing process of the semiconductor card.

As shown in FIG. 1, in the semiconductor card of the present invention, a printed circuit board 2 on which an electronic component 1 such as a memory IC 1a, a CPU 1b, and an input / output coil IC is mounted is completely contained in a card base 3. And the laminate films 4 and 5 are attached to both the front and back surfaces of the card base 3.

As shown in FIGS. 1 and 2, the card base 3 constitutes an outer peripheral portion of the card base 3, and the outer peripheral portion of the printed circuit board 2 is integrally embedded at an intermediate position in the thickness direction thereof. It is composed of a frame-shaped first molding portion 3a and a second molding portion 3b which constitutes an inner peripheral portion of the card base 3 and in which the inner peripheral portion of the printed circuit board 2 is integrally embedded.

The first molding portion 3a and the second molding portion 3b are molded with the same or different resin material. The card substrate 3 (the first molding portion 3a and the second molding portion 3b) can be molded by using an arbitrary resin material. However, in order to protect electronic components, the melting temperature is as low as possible and the curing shrinkage rate is as low as possible. Low resin materials are preferred. An unsaturated polyester can be mentioned as such a preferable resin material.

The printed circuit board 2 is provided with one or a plurality of through holes 6, and the resin molded on the front and back surfaces of the printed circuit board 2 is connected through the through holes 6. .

The manufacturing apparatus and manufacturing method of the semiconductor card according to the above embodiment will be described below. In the semiconductor card of the above-mentioned embodiment, the first molding part 3a is a first card shown in FIG.
It is formed by molding with the mold 11 and the second molding portion 3b with the second mold 12 shown in FIG.

As shown in FIG. 3, the first die 11 is composed of an upper die 11a and a lower die 11b.
On the opposing surfaces of a and 11b, a frame-shaped cavity 13 having an outer circumference having the same shape as the outer shape of the card base 3, an inner circumference smaller than the outer shape of the printed circuit board 2, and a thickness equal to the thickness of the card base 3, Resin injection port 1 communicating with the cavity 13
4, a space portion 15 formed on the inner peripheral portion of the cavity 13, and a card holding portion 16 projecting between the cavity 13 and the space portion 15.

As shown in FIG. 4, the second die 12 is composed of an upper die 12a and a lower die 12b.
A cavity 17 having the same shape as the outer shape of the card base 3 is formed on the opposing surfaces of a and 12b, and the upper die 12a and the lower die 12 are formed.
A resin injection port 18 communicating with the cavity 17 is opened in b.

When molding the card base 3, the upper mold 11a and the lower mold 11b of the first mold 11 are opened, and the printed circuit board 2 on which the predetermined electronic component 1 is mounted is mounted on the lower mold 11b. Put. At this time, the outer peripheral portion of the printed circuit board 2 is projected into the cavity 13 and the position is adjusted so that all the electronic components 1 are accommodated in the space portion 15.

Next, as shown in FIG. 3, the upper mold 11a is formed.
And the resin is injected into the cavity 13 through the resin injection port 14 to mold the first molding portion 3a. Then, Figure 4
As shown in FIG. 2, the printed circuit board 2 on which the first molding portion 3 a is molded is housed in the cavity 17 of the second mold 12, and the resin is injected into the cavity 17 from the resin injection port 18 to perform the second molding. The part 3b is molded. Finally, the laminate films 4 and 5 are attached to both the front and back surfaces of the card substrate 3 manufactured as described above to obtain a desired semiconductor card.

In the semiconductor card of the above-mentioned embodiment, the printed circuit board 2 and the electronic component 1 mounted on the printed circuit board 2 are completely embedded in the card base 3 made of resin, and internal stress caused by curing shrinkage of the resin is eliminated. Since the front and back surfaces of the printed circuit board 2 are made to act substantially equally, it is possible to reduce deformation such as warpage occurring in the card base.

Since the through holes 6 are formed in the printed circuit board 2 and the resin molded on both front and back surfaces of the printed circuit board 2 is connected through the through holes 6,
The printed board 2 and the card base 3 can be firmly integrated.

In addition, according to the above-described manufacturing method, first, the inner peripheral portion of the printed board 2 is fixed to the first mold 11 and the outer peripheral portion of the printed board 2 is a part of the card substrate 3. Of the first molding portion 3a.
Since a can be fixed to the second mold 12 to mold the second molding part 3b which is the remaining part of the card base 3, use a molding mold having a special printed circuit board support structure. Instead, it is possible to form a semiconductor card in which the printed circuit board 2 and the electronic component 1 are completely embedded in the card base.

The shape of the first molding portion 3a is not limited to the shape described in the above embodiment, but may be formed in other shapes. Below, the other shape of the 1st shaping | molding part 3a is illustrated. As shown in FIG. 5, two printed circuit boards 2 facing each other are provided.
The first molding portion 3a is formed on the side portion. As shown in FIG. 6, two adjacent printed circuit boards 2 are provided.
The first molding portion 3a is formed on the side portion. As shown in FIG. 7, a first molding portion 3a having a recess in the center is formed in advance, the printed board 2 is inserted into the recess, and then a second molding portion 3b is formed. In addition, it goes without saying that the shape of the card is not limited to a rectangular shape, but may be a circular shape, an elliptical shape, an oval shape or the like.

[0027]

As described above, in the semiconductor card of the present invention, resin card bases are molded on both front and back surfaces of a printed circuit board, and the printed circuit board and electronic components mounted on the printed circuit board are placed in the card base. Since it is completely embedded, it is possible to reduce deformation such as warpage occurring in the card base.

Further, according to the manufacturing method of the present invention, the card substrate is molded through the two-step molding process. Therefore, the printed circuit board and the electronic board can be manufactured without using a molding die having a special printed circuit board supporting structure. It is possible to form a semiconductor card in which the components are completely embedded in the card substrate.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a semiconductor card according to an embodiment of the present invention.

FIG. 2 is a plan view of this semiconductor card.

FIG. 3 is a cross-sectional view showing a manufacturing process of this semiconductor card.

FIG. 4 is a cross-sectional view showing a manufacturing process of this semiconductor card.

FIG. 5 is a plan view of a semiconductor card according to another embodiment of the present invention.

FIG. 6 is a plan view of a semiconductor card according to another embodiment of the present invention.

FIG. 7 is a sectional view of a semiconductor card according to another embodiment of the present invention.

FIG. 8 is a cross-sectional view of a conventional non-contact type semiconductor card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Printed circuit board 3 Card base 3a 1st molding part 3b 2nd molding part 11 1st metal mold 12 2nd metal mold

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location G06K 19/07 H01L 21/56 T 8617-4M 23/28 Z 8617-4M H05K 1/02 D 8824 -4E

Claims (8)

[Claims] 1. A semiconductor card in which an electronic component mounted on a printed circuit board is embedded in a card base made of resin, wherein an outer peripheral portion of the card base is formed, and the printed circuit board is provided at an intermediate position in the thickness direction. The card base is composed of a first molding part supporting an outer peripheral part of the card and a second molding part constituting an inner peripheral part of the card base and integrally embedding an inner peripheral part of the printed board. A semiconductor card characterized by the above. 2. The semiconductor card according to claim 1, wherein the first molding portion is formed in a frame shape along four sides of the printed circuit board. 3. The semiconductor card according to claim 1, wherein the first molding portion is formed along two sides of the printed circuit board facing each other or two sides adjacent to each other. 4. The semiconductor card according to claim 1, wherein the first molding portion is formed on an outer peripheral portion of the printed board and one surface side of the printed board following the outer peripheral portion. 5. The semiconductor card according to claim 1, wherein at least a part of an outer peripheral portion of the printed circuit board is embedded in the first molded portion. 6. The semiconductor card according to claim 1, wherein the first molding portion and the second molding portion are molded from the same resin material. 7. A method of manufacturing a semiconductor card, comprising the step of burying a printed circuit board and an electronic component mounted on the printed circuit board in a resin card substrate, wherein the printed circuit board and the electronic component are housed in a resin card substrate. At the time of embedding, first, the printed circuit board on which the electronic component is mounted is attached to the first mold, and a part of the card base is integrally formed on either the inner peripheral portion or the outer peripheral portion of the printed circuit board, and then The printed circuit board having a part of the card base integrally formed on either the inner peripheral portion or the outer peripheral portion as described above is attached to the second mold, and the remaining portion of the card base is molded. A method for manufacturing a semiconductor card, comprising: 8. A method for manufacturing a semiconductor card, which includes a step of burying a printed circuit board and an electronic component mounted on the printed circuit board in a card base made of resin, wherein a concave portion into which the printed circuit board having the electronic component mounted can be inserted. The first molding part having the first molding part is molded in advance, the printed circuit board on which the electronic component is mounted is inserted into the concave part of the first molding part, and the space in the concave part is filled with resin to form the second molding part. A method for manufacturing a semiconductor card, characterized by embedding an electronic component and a printed circuit board in a card base by forming the same.