JP2002279386A - Portable electronic medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a portable electronic medium which is formed thinner and reduces generation of short circuit of the wiring. SOLUTION: No electronic components are mounted on a first surface 2a of a circuit card 2, but only a contact pad 8 and a first wiring pattern 5 are formed thereon in a substantially flat shape. This first wiring pattern 5 is roughly wired with wide pattern space. Electronic parts are mounted on a second surface 2b of the circuit card 2, and a second wiring pattern 17 for electrically connecting the mounted electronic components 14, 15 and 16 is provided thereon. In this second wiring pattern 17, the pattern space is narrowed, and is wired finely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a portable electronic medium comprising a thin memory card such as an SD card.

[0002]

2. Description of the Related Art Conventionally, a portable semiconductor device (for example, an IC card or the like) in which electronic components are embedded in a card body so as to have no space in the body has been disclosed in Japanese Patent Laid-Open No. 1-2414.
No. 96 discloses a non-contact IC card.

In this IC card, a module on which an IC, a battery, and the like are mounted is housed in a case on a circuit board, and then a thermosetting resin is injected into the case through a hole provided in an upper case to form a gap in the case. And then heat-cured, and the case and the module are integrally solidified to be manufactured.

[0004]

In the prior art as described above, since the structure is formed by covering the outer periphery with the upper case and the lower case, the IC card becomes thick, and the thickness is reduced. It was difficult.

If a thinner case is used to reduce the thickness, the resin injected into the case shrinks as it cures, and the case shrinks due to the shrinkage of the resin. , The surface of the case becomes uneven, and there is a high possibility that the external appearance becomes unsightly.

The present invention has been made in view of the above points, and an object of the present invention is to provide a portable electronic medium which can be formed to have a smaller thickness and reduce the occurrence of short-circuits in the applied wiring. .

[0007]

In order to achieve the above object, a portable electronic medium according to the present invention comprises a plurality of terminal portions arranged in substantially a single line for transmitting and receiving data by connecting to an external device. Are disposed, the first surface on which the first wiring pattern is applied and exposed to the outside, and the second surface on which the electronic component is mounted and the second wiring pattern is applied.
A circuit board having a surface and a size substantially equal to the size of the first surface and the second surface of the circuit board;
And a case member that is placed on the second surface and accommodates the electronic component by covering the electronic component.

In order to achieve the above object, a portable electronic medium according to the present invention comprises a circuit board having one surface exposed to the outside and an electronic component mounted on the other surface; A plurality of terminal portions arranged on one surface and arranged in a substantially aligned state for transmitting and receiving data by connecting to an external device; and the first surface and the second surface of the circuit board A formable electronic device having a size substantially the same as the size of the electronic component, and covering the second surface, the electronic component and a case member covering the entire other surface of the circuit board on which the electronic component is mounted. In the medium, a first wiring pattern is provided on the first surface, and a second wiring pattern finer than the first wiring pattern is provided on the second surface. And

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) An embodiment of the present invention will be described below with reference to the drawings. FIGS. 2 and 3 are views for explaining the appearance of the portable electronic medium 1 according to the first embodiment of the present invention. FIG. 2 is a top view and FIG. 3 is a bottom view.

An electronic medium 1 includes a circuit board 2 shown in FIG.
And a box-shaped case 3 made of resin shown in FIG. The circuit board 2 is mounted on a box-shaped case 3 having substantially the same size as the circuit board 2 so that the circuit board 2 is exposed to the outside on its upper surface.

As will be described later, the circuit board 2 has an upper surface (first surface) 2a exposed to the outside and a back surface (second surface) 2b housed in the case 3, and has first and second surfaces. The circuit board is a double-sided board having a wiring pattern on both sides.

FIG. 1 is a view showing a circuit board 2 mounted on a case 3. FIG. 1 (a) shows the first exposed outside.
FIG. 4 is a plan view showing a surface 2a of FIG. FIG. 1B is a plan view showing a second surface 2 b protected by the case 3.

The first surface 2 of the circuit board 2 shown in FIG.
In FIG. 1A, a plurality (9) of contact pads 8 as contact terminals are formed on one end of the upper surface so as to be exposed to the outside.

The contact pads 8 have nine contact terminals arranged substantially in a line at a predetermined interval, and perform power supply and data transfer with the external device by being connected to an external device. It is provided for.

The electronic components are formed on a second substrate 2 to be described later.
The electronic component is not mounted on the first surface 2a of the circuit board 2 but is formed substantially flat.

The contact pad 8 on the first surface 2a exposed to the outside and the second surface 2 accommodated in the case 3
A first wiring pattern 5 is provided on the first surface 2a of the circuit board 2 for connecting to the electronic component b.

Since the first wiring pattern 5 is in a state of being exposed to the outside, a large pattern interval is required.
The wiring is coarser than a wiring pattern 17 provided on a second surface 2b described later.

In order to protect the first wiring pattern 5 exposed to the outside from the first surface 2a,
Various processing is given. For example, it is possible to print a resin as a protective layer on the first surface 2a of the circuit board 2 so that the first wiring pattern is visually hidden (not visible) from the outside.

As shown in FIG. 4, the first surface 2a of the circuit board 2 is preliminarily subjected to a resist process, and after the electronic medium 1 is completed, the product name and the lot number are displayed by laser marking. It is also possible to apply.

The second surface 2 of the circuit board 2 shown in FIG.
In b, for example, a control IC 14 for controlling the entire electronic medium 1, a memory 15 for storing various data, a capacitor 16 such as a chip component, and the like are mounted at predetermined intervals as electronic components. .

The plurality of electronic components 14, 15, and 16 mounted on the circuit board 2 have different heights, and are mounted on the circuit board 2 at different intervals.

On the second surface 2b of the circuit board 2, a second wiring pattern 17 for electrically connecting the mounted electronic components 14, 15, 16 is provided. The second wiring pattern 17 is housed in the case 3 and is protected from the outside.

For this reason, the second wiring patterns 17 are finely wired with a small space between the patterns. That is, in this embodiment, the second wiring pattern 17 is a wiring pattern of the space 100 [mu] m between lines of thickness 100 [mu] m, line.

On the other hand, the first surface 2a of the circuit board 2
In the first wiring pattern 5 provided on the second surface 2b, the pattern interval is formed larger than the wiring pattern 17 provided on the second surface 2b.

In particular, in the vicinity of the contact pads 8 where the wiring patterns 5 are concentrated, as shown in FIG. 1A, the pattern interval (between A and A) is the end of the contact pads 8 arranged in a line. From the center position of the first connection terminal 8a located at the center position to the center position of the ninth connection terminal 8b located at the opposite end.
B) must be smaller than the size obtained by dividing the number of connection terminals by 1 minus the number of connection terminals.

That is, in the present embodiment, the distance from the center position of the first connection terminal 8a to the center position of the ninth connection terminal 8b located at the opposite end is 19 mm.
In this case, the pattern interval (between A and A) of the first wiring pattern 5 is formed to be larger than 100 μm described later and smaller than 2.375 mm (a size obtained by dividing 19 mm by 8). Then it is effective.

FIG. 5 is a view showing a box-shaped case 3 for forming the electronic medium 1 together with the circuit board 2. The case 3 shown in FIG. 5 is formed by changing the thickness (wall thickness) of the case 3 in accordance with the height of the facing electronic component. Case 3
A rib 19 is formed at a position corresponding to a gap provided between the IC 14 and the memory 15 on the circuit board 2.

By providing the ribs 19 at portions corresponding to the gaps between the electronic components in the case 3, it is possible to prevent the case 3 from generating dents (irregularities) and to keep the strength of the case higher.

FIGS. 6 and 7 are views for explaining the structure of the electronic medium 1, and are sectional views taken along the line CC shown in FIG. 6 and 7, the circuit board 2 of FIG.
Next, the assembly of the case 3 of FIG. 5 will be described.

As shown in FIG. 6, the second surface 2b of the circuit board 2 shown in FIG. 1 is arranged inside the case 3 shown in FIG. By using and bonding, the electronic medium 1 shown in FIG. 7 is completed.

When the filling resin material 21 is injected into the space inside the case 3 in which the circuit board 2 is housed, the strength of the case 3 can be further increased. This filling resin material 2
For 1, a variety of filling resin materials such as a thermosetting resin, an ultraviolet curable resin, and a foamed resin can be applied.

Next, referring to FIG. 8 and FIG.
An electronic medium 21 will be described as a modification of the first embodiment. FIG.
FIG. 9 is a top view showing the appearance of the electronic medium 21, and FIG.
(A) is a first surface 22 a exposed to the outside of the circuit board 22.
FIG. 9B is a plan view showing a second surface 22 b of the circuit board 22 protected by the case 3.

In this modification, the first surface 2 of the circuit board 22
Since the first wiring pattern 25 formed in 2a is exposed to the outside, the pattern spacing is widened and the wiring is coarser than the wiring pattern 27 formed on the second surface 22b. It differs from FIG. 2 in that the wiring is thicker than the wiring of the wiring pattern 27 above.

Therefore, even if the surface is peeled off and the wiring pattern is directly exposed to the outside, it is hard to fray and the possibility of disconnection can be reduced.

In this embodiment, since the circuit board has a structure exposed to the outside, the circuit board is protected by a case member or the like from the second wiring pattern provided on the surface (second surface) of the circuit board. The first wiring patterns formed on the surface (first surface) of the circuit board exposed to the outside are coarsely wired (at wide intervals).

Therefore, since the first wiring pattern provided on the surface exposed to the outside has a large pattern interval,
Even if a conductive substance or the like is attached, it is possible to prevent a short circuit between the patterns.

Further, since the first wiring pattern is also provided on the surface exposed to the outside, the portions other than the contact pads are subjected to a processing such as resin printing or the like.
The first wiring pattern on the circuit board exposed to the outside can be protected.

As the electronic device is used, even if the processing (the resin layer on the surface) applied to the surface exposed to the outside is peeled off and the first wiring pattern is exposed, the processing is performed. Since the intervals between the patterns are large, it is possible to prevent occurrence of a short circuit between the patterns.

[0039]

As described above, according to the present invention,
It is possible to make the wiring thinner and to reduce the occurrence of short-circuits in the applied wiring.

[Brief description of the drawings]

FIG. 1 is a portable electronic medium 1 according to an embodiment of the present invention.
The figure which shows the board | substrate 7 used for.

FIG. 2 is a top view for explaining the appearance of the electronic medium 1.

FIG. 3 is a bottom view for explaining the appearance of the electronic medium 1;

FIG. 4 is a top view for explaining another embodiment of the appearance of the electronic medium 1;

FIG. 5 is a view showing a case in which the electronic medium 1 is formed together with the substrate 7;

FIG. 6 is a schematic sectional view for explaining the structure of the electronic medium 1.

FIG. 7 is a schematic sectional view for explaining the structure of the electronic medium 1.

FIG. 8 is a top view for explaining the appearance of the electronic medium 21.

FIG. 9 is a view showing a substrate 22 used for an electronic medium 21;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 21 Electronic medium 2, 22 Circuit board 2a, 22a First surface of circuit board 2b, 22b Second surface of circuit board 3 Case 5, 25 First wiring pattern 8 Contact pad 14 Control IC 15 Memory 16 Capacitor 17, 27 Second wiring pattern 19 Rib 20 Adhesive sheet

Claims (8)

[Claims] 1. A plurality of terminals in a state of being aligned in substantially a row for transmitting and receiving data by connecting an external device is arranged, a first exposed to the outside together with the first wiring pattern is applied A circuit board having a surface and a second surface on which an electronic component is mounted and on which a second wiring pattern is provided; and a circuit board having substantially the same size as the first surface and the second surface of the circuit board. A portable electronic medium, comprising: a case member formed to have a size and covered by the second surface to house the electronic component by covering the electronic component. 2. The portable electronic medium according to claim 1, wherein said first wiring pattern is formed at a wider interval than said second wiring pattern. 3. A circuit board having a first surface exposed to the outside and an electronic component mounted on a second surface, and a circuit board disposed on the first surface of the circuit board and connected to an external device. A plurality of terminal portions arranged in a state of being substantially aligned in order to exchange data, the first surface and the second surface of the circuit board;
The electronic component and a case member that covers the entire second surface of the circuit board on which the electronic component is mounted, is formed to have a size substantially the same as the size of the surface of the electronic component, and is covered by the second surface. In a portable electronic medium, a first wiring pattern is provided on the first surface,
A portable electronic medium, wherein a second wiring pattern finer than the first wiring pattern is provided on the second surface. 4. The portable device according to claim 1, wherein a protection layer for protecting the first wiring pattern is provided on a first surface of the circuit board. Possible electronic medium. 5. The portable electronic device according to claim 1, wherein a resin layer is provided on the first wiring pattern on the first surface of the circuit board. Medium. 6. The printed circuit board according to claim 1, wherein a printed layer printed on the first wiring pattern is provided on the first surface of the circuit board. A portable electronic medium as described. 7. The distance between the first wiring patterns is determined by the distance between the center positions of the terminal parts located at the end of the plurality of terminal parts arranged in substantially one row, and the number of terminal parts. 4. The portable electronic medium according to claim 2, wherein the distance is smaller than a distance obtained by subtracting one from the distance. 8. The first wiring pattern includes a wiring pattern around a terminal formed around the plurality of terminal portions,
A wiring pattern formed at a position distant from the plurality of terminal portions, and an interval between the wiring patterns around the terminal is the terminal located at the end of the plurality of terminal portions arranged in substantially one row. 4. The portable electronic medium according to claim 2, wherein a distance between the center positions of the portions is smaller than a distance obtained by subtracting one from the number of the terminal portions.