JPH072225Y2 - IC card - Google Patents

Description

[Detailed Description of the Invention] (Industrial field of application) The present invention relates to an IC card equipped with an IC chip, in particular, an IC that reduces the number of manufacturing steps and can reliably protect the IC chip from external force. Regarding cards.

(Prior Art) Conventionally, a magnetic recording medium such as a floppy disk or a cassette tape has been widely used as an external storage device of a computer and an electronic device using the computer, but in recent years, it is easy to handle and downsized. RAM,
A card-shaped or package-shaped recording medium including a semiconductor memory such as a ROM has been used. On the other hand, in the field of credit cards, ID cards, bank cards, etc., as a card replacing a magnetic card, a so-called IC chip, which is a semiconductor integrated circuit such as a microprocessor, RAM, ROM, etc. IC cards have been developed because of their extremely large information storage capacity and high security.

By the way, as this type of IC card, one manufactured conventionally by a sandwich type or a fitting type is used. That is, in the sandwich type, as shown in the vertical sectional view in FIG. 4, the module 2 composed of the printed wiring board, the IC chip, and the external connection terminal row is fitted into the hole of the center core sheet 1 and held for one end. It is configured by laminating the over sheets 31 and 32 while heating. On the other hand, the fitting type is the fifth
As shown in the longitudinal sectional view in the figure, the card frame 4 is preliminarily formed with a recess for fitting a module, and the module 5 is fitted into the recess.

(Problems to be solved by the invention) However, such a conventional IC card has the following problems. That is, in the former sandwich method, not only the number of manufacturing steps is large, but also the positioning when the module 2 is fitted into the hole of the center core sheet 1 is very difficult. In addition, since heating is performed when laminating, the IC chip may be thermally destroyed by the heat pressure at that time. On the other hand, in the latter fitting method, only the module 5 needs to be fitted in the card frame 4, so that the problems of the number of manufacturing steps and thermal destruction of the IC chip as described above do not occur. However, a part of the module 5 is exposed to the outside as shown in the drawing, and the IC card is often carried by the user in a card case or pocket at all times. Therefore, an external impact force or bending force, that is, an external force is directly applied to the module 5 (in particular, the IC chip), and as a result, the module 5 may be bent or broken. Furthermore, since the module 5 is simply fitted in the recess of the card frame 4, the module 5 may fall off the card frame 4.

The present invention has been made to solve the above-mentioned problems, and reduces the number of manufacturing steps, and when the device is carried, the module (especially IC chip) is protected from external stress such as impact force and bending stress from the outside. The purpose of the present invention is to provide a highly reliable IC card capable of preventing the damage of (1) and protecting it more reliably and preventing the module from falling off.

(Means for Solving the Problems) In order to achieve the above object, the IC card of the present invention is provided with a recess for mounting a card plate and a recess for mounting a module on the bottom surface of the recess. In addition, the card frame has a through hole for fitting the external connection terminal row part formed in the bottom surface of the recess for mounting the module, and the IC chip is mounted on one side of the printed wiring board and externally on the other side. A connection terminal row is formed, and the external connection terminal row forming surface side is fitted into a module mounting recess of the card frame, and the external connection terminal row portion is fitted into a through hole for fitting the external connection terminal row portion to be integrated. Mounted module and the IC chip mounting surface side of the module, and fit into the recess for mounting the card plate of the card frame so as to cover the entire surface. And a card plate that is fixed by being inserted, and the surface of the card frame and the surface of the card plate are substantially flush with each other.

(Operation) Therefore, by adopting the above-described means in the present invention, the module can be entirely covered by the card frame and the card plate except the external connection terminal row portion, so that the module can be prevented from falling off. By separating the card base material into the card frame and card plate, the IC card absorbs external stress such as impact force and bending stress from the outside to prevent damage to the module, especially the IC chip. Is possible. Further, since the card frame, the card plate, and the module are all fitted together, the manufacturing is easy and the number of manufacturing steps can be reduced. Furthermore, since the surfaces of both the card frame and the card plate are substantially flush with each other, the card has a substantially flat surface over the entire surface, so when inserting the card into the reader, the card plate It doesn't get caught.

(Embodiment) The IC card of the present invention comprises three elements of a card frame, a module, and a card plate, and the module is fitted into a recess having a through hole for fitting a terminal portion provided in the card frame, and the recess is closed. By arranging the card plate on the above, the advantages of each of the sandwich type and the fitting type described above are taken in, and problems (former: many manufacturing processes, IC chip is thermally destroyed, latter: module (especially IC Chip), the module is removed).

Hereinafter, an embodiment of the present invention based on the above concept will be described in detail with reference to the drawings.

1 (a) to 1 (c) show an embodiment of the present invention, and FIG. 1 (a) is a front view of an IC card, and FIG. 1 (b).
Is a side view, and FIG. 1 (c) is a bottom view.

That is, as shown in FIG. 1, the IC card 6 of this embodiment
Is formed with a recess 7c for mounting a card plate, and a recess 7a for mounting a module is formed on the bottom surface of the recess 7c.
And the card frame 7 in which the through hole 7b for fitting the external connection terminal row portion is formed in the bottom surface of the concave portion 7a for mounting the module, and the IC on one side of the printed wiring board.
The chip is mounted, the external connection terminal row is formed on the other surface side, the external connection terminal formation surface side is fitted into the module mounting recess 7a of the guard frame 7, and the external connection terminal row portion 8a is the external connection terminal row. A module 8 fitted and integrated in a through hole 7b for fitting a part;
On the IC chip mounting surface side of the module 8, there is formed a card plate 9 which is fitted and fixed in a card plate mounting recess 7c of the card frame 7 so as to cover the entire surface.

Here, the card frame 7 surface and the card plate surface 9
And are almost flush with each other. In addition, the height position of the card frame 7 and the height position of the external connection terminal row portion 8a are made substantially equal to each other, or the height position of the external connection terminal row portion 8a is slightly smaller than the height position of the card frame 7. It is low.

On the other hand, FIG. 2 is a sectional view taken along the line AA of the IC card 6 in FIG. 1, and FIG. 3 is a sectional view taken along the line BB of FIG. The same parts as those in (c) are designated by the same reference numerals. The lower side in the figure is the front side of the IC card 6, and the upper side in the figure is the back side of the IC card 6.

In the figure, a card frame 7 is formed by injection molding (injection molding) of a specific resin. One surface of the card frame 7 is a flat surface, and the other surface is attached with a card plate 9 as shown in the drawing. A recess 7c for use is formed. A recess 7a for mounting the module 8 is formed on the bottom surface of the recess 7c for mounting the card plate 9. Further, the bottom surface of the concave portion 7a for mounting the module 8 has a through hole 7b for fitting the external connection terminal row portion 8a.
Are formed. Here, the card frame 7 is, for example,
A thermoplastic synthetic resin such as ABS resin or vinyl chloride is used as a material, and a desired pattern is printed in black, brown, green or the like on the entire flat surface for the purpose of decoration. Further, as a method for printing a pattern on the card frame 7, for example, "JP-A-57-25929 (injection molding simultaneous painting method)" and "JP-A-56-151542 (manufacturing method of a molded article with a paint) ", Etc. are adopted.

On the other hand, on one surface side of the printed wiring board 10 made of epoxy resin or the like, an external connection terminal row 12 for electrically connecting the IC chip 11 and an external device is formed, and in this embodiment, many are provided. In order to efficiently arrange the terminals, the terminals are arranged in a row along the short side of the wiring board. An IC chip 11 is mounted on the other surface side of the printed wiring board 10 and is connected to a printed wiring pattern (made of copper or the like) 13 by a bonding wire 14. Further, the printed wiring pattern 13 and the external connection terminal row 12 are connected by a through hole 15. Reference numeral 16 is a die pattern (made of copper or the like), and 17 is a die bonding paste.
Furthermore, the IC chip 11 mounting surface side of the printed wiring board 10 is provided with a predetermined gap as shown in the drawing.
A rectangular sealing resin frame 18 made of epoxy resin or the like is fixed so as to cover the outer peripheral side of the. An epoxy resin 19 is sealed between the sealing resin frame 18 and the IC chip 11 so as to cover the entire IC chip 11. The module 8 is configured by the above elements.

On the other hand, the module 8 having the above-described structure is provided with the printed wiring board 10 and the sealing resin frame 18 in the card frame 7.
The external connection terminal row portion 8a into the through hole of the concave portion 7a.
It is fitted in each 7b. Then, the bottom surface of the recess 7a of the card frame 7 and the printed wiring board 10 are bonded and integrated with each other via the first adhesive 20. The card plate 9 is adhered to the surface of the encapsulated epoxy resin 19 with a second adhesive 21 so as to cover the surface of the epoxy resin 19 and the entire encapsulating resin frame 18. The height position of the card frame 7 and the height position of the card plate 9 are made substantially equal to each other as shown in the drawing, and the height position of the external connection terminal row portion 8a is higher than that of the card frame 7. Is slightly lowered (t ') so that there is almost no gap at the boundary between the card frame 7, the external connection terminal row portion 8a, and the card plate 9. Here, as the first and second adhesives 20 and 21, hard adhesives such as epoxy resin-based adhesives, phenolic resin-based adhesives and polyurethane-based adhesives may be used, or adhesives other than these may be used. Good. Like the card frame 7, the card plate 9 is made of a thermoplastic synthetic resin such as ABS resin or vinyl chloride as a material, and the information stored in the IC chip 11 and the decoration are printed. ing.

In the IC card 6 configured as described above, since the module 8 is covered by the card frame 7 and the card plate 9 except the external connection terminal row portion 8a,
Even if the user handles the IC card 6 roughly, the module can be prevented from falling off, and the card frame 7 and the card plate 9 absorb impact force, bending force, etc. from the outside, and the printed wiring board 10 is bent. The IC chip 11 is not damaged by being cracked or cracked. Further, since the card frame 7, the card plate 9 and the module 8 are all fitted into each other, the manufacturing is extremely easy as compared with the conventional one, and the number of manufacturing steps can be reduced. Further, both the surface of the card frame 7 and the card plate 9 are substantially flush with each other, so that the IC card 6 is substantially flat over the entire surface, so that the IC card 6 is inserted into the reader. In this case, the card plate 9 will not be caught and peeled off. On the other hand, IC
Since the card 6 has a substantially flat surface over the entire surface, there is no apparent discomfort, and the design is extremely excellent. Further, since the injection molding method is applied to the molding of the card frame 7 which constitutes a part of the IC card 6, it is possible to paint on the entire surface of the card frame 7 up to the corners thereof. Become.

As described above, in the IC card 6 of this embodiment, the card frame 7, the card plate 9, and the module 8 are all fitted together by a fitting method, and the entire module 8 is covered except for the external connection terminal row portion 8a. By this, the handling characteristics of the card are improved, the durability is extremely excellent, the number of manufacturing steps is small, the manufacturing is easy, and the design is excellent. That is, by exposing the external connection terminal row portion 8a and embedding the module 8 main body in the concave portion 7a, the sandwich type laminating described above is not necessary, so that heat is not applied and thermal destruction of the IC chip is prevented. At the same time, the above-mentioned fitting-type module does not fall off, and the surface opposite to the terminal part fitting through-hole is covered with a card plate to prevent the module 8 from falling off from the back surface and also to fix the heat. Adhesion can be made to the card frame without hanging.

As described above, according to the present invention, the recess for mounting the card plate is formed, the recess for mounting the module is formed on the bottom surface of the recess, and the recess for mounting the module is formed. The card frame having through holes for fitting the external connection terminal row portion formed on the bottom surface of the IC chip, the IC chip mounted on one surface side of the printed wiring board and the external connection terminal row formed on the other surface side, and The IC chip of the module and the module in which the external connection terminal row forming surface side is fitted into the module mounting recess of the card frame and the external connection terminal row section is fitted into the through hole for fitting the external connection terminal row section On the mounting surface side,
Since the card plate is fitted and fixed in the recess for mounting the card plate of the card frame so as to cover the entire surface, the surface of the card frame and the surface of the card plate are made substantially flush with each other. In addition to reducing the number of manufacturing processes and preventing damage to the module (particularly IC chip) from external stress such as impact force and bending stress from the outside when carrying it, etc.
Highly reliable to prevent the module from falling off
IC card can be provided.

[Brief description of drawings]

1 (a) to 1 (c) show an embodiment of the present invention, and FIG. 1 (a) is a front view of an IC card, and FIG. 1 (b).
Is a side view, FIG. 1 (c) is a bottom view, FIG. 2 is a sectional view taken along the line AA in FIG. 1, and FIG. 3 is a sectional view taken along the line BB in FIG. Figures and 5 are conventional
It is a longitudinal cross-sectional view showing an example of the configuration of each IC card. 6 ... IC card, 7 ... Card frame, 7a ... Module mounting recess, 7b ... Through hole, 7c ... Card plate mounting recess, 8 ... Module, 8a ... External connection terminal row part, 9
… Card plate, 10… Printed wiring board, 11… IC chip, 12… External connection terminal row, 13… Printed wiring pattern,
14 ... Bonding wire, 15 ... Through hole, 16 ... Die pattern, 17 ... Die bonding paste, 18 ... Encapsulating resin frame, 19 ... Epoxy resin, 20 ... First adhesive, 21 ...
Second adhesive.

Claims (1)

[Scope of utility model registration request] 1. A recess for mounting a card plate is formed, a recess for mounting a module is formed on the bottom of the recess, and an external connection terminal row portion is fitted on the bottom of the recess for mounting the module. And a card frame with through holes formed in it, an IC chip is mounted on one side of the printed wiring board and an external connection terminal row is formed on the other side, and the external connection terminal row formation side is the card frame A module, which is fitted into a recess for mounting a module, and in which the external connection terminal row portion is fitted into a through hole for fitting the external connection terminal row portion, and is integrated, and on the IC chip mounting surface side of the module, the entire surface. And a card plate fitted and fixed in a recess for mounting the card plate of the card frame so as to cover An IC card characterized in that the surface of the card frame and the surface of the card plate are substantially flush with each other.