JPS6282093A - Integrated circuit card with magnetic stripe - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an IC cart with a magnetic sleeve.

[Prior art and its problems]

Conventionally, as a credit card or a bank card, the owner code and the owned old machine are displayed in embossed letters, and the information such as the owner code and other specific code information are stored in a strip-like magnetic recording section. So-called magnetic cards, which record magnetically on magnetic cards, were widely used, but because the recorded information on these magnetic cards can be easily read, third parties other than the owner may read and misuse the recorded information on the magnetic cards. Therefore, recently, IC cards with a built-in RCC chip that operates according to external input signals and outputs pre-installed identification information have been used, and magnetic cards In the period of transition from conventional to IC cards, IC cards with magnetic stripes are in demand.

Conventionally, as shown in FIG. 4, the IC chip 90 was located near the end of the card body 91 in the plate direction, but was embedded approximately in the center in the width direction. Therefore, when the card body 91 is deflected in the width direction, the IC chip 90 is subject to large deformation and is likely to break or break the leads.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned conventional problems, and its purpose is to prevent the IC chip housed inside from being bent not only in the longitudinal direction but also in the width direction of the card body. To provide an IC card with a magnetic stripe which is not damaged and is less likely to have its leads cut.

[Summary of the invention]

In order to achieve the above object, the present invention has an IC chip housed inside a card body, a magnetic stripe formed on the outer surface near one long side of the card body, and an external terminal connected to an electrode of the IC chip. is provided on an insulating wiring board and arranged at one end edge of the card body near the magnetic stripe, and the extended part of the card body is formed by extending the insulating wiring base into the card body facing the magnetic stripe. By attaching an IC chip near the edge, the card body can withstand bending not only in the longitudinal direction but also in the width direction.
The IC card is constructed as a magnetic stripe-equipped IC card in which the IC chip is not damaged and leads are less likely to be cut.

[Embodiments of the invention]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 3 is an overall perspective view showing an RC card with a magnetic stripe according to the present invention.

The IC card 1 has a thickness that complies with ISO standards and is rectangular in shape. A striped magnetic stripe 2 is provided on the top surface of the IC card 1 near one long side of the IC card 1 . The IC card 1 has an IC module 3 housed therein at a position facing the magnetic stripe 2 and in the vicinity thereof. The IC module 3 is composed of a wiring board 4, a CPU chip 5 and a memory chip 6 mounted on the wiring board 4 while avoiding the center of the IC card 1, and a plurality of external terminals 7 provided on the wiring board 4. has been done. The memory chip 6 is, for example, a non-volatile EP-ROM.
Or it is formed by EEP-ROM. C
The PU chip 5 has a function of comparing the personal identification number input from the external terminal 7 side with the personal identification information stored in the memory chip 6, and outputting the result of the comparison.

At this time, it is desirable that the personal identification information stored in the memory chip 6 is not transmitted to the terminal side. In addition to personal identification information, the memory chip 6 also stores and maintains personal credit and transaction history.

1 is an enlarged sectional view taken along the line III-III in FIG. 3, and FIG. 2 is an exploded perspective view of the IC card 10.
indicates that it has a five-layer structure.

The wiring board 4 constituting the IC module 3 is made of flexible L-shaped hard vinyl chloride resin with a thickness of 200 μm, and is slightly shorter in length than the long side of the IC car 1-'1 and has a width similar to that of the CPU chip. 5 and memory chip 6. The wiring board 4 has an opening 43 for the CPU chip 5 in the extension part 41 at a position where the extension part 41 and the neck part 42 intersect.
An opening 44 for the memory chip 6 is provided near the edge of each.

Further, the wiring board 4 is arranged in two rows each along the upper surface edge of the neck part 42.
A total of eight external terminals 7 are provided. A predetermined adhesive tape 8 is formed between the CPU chip 5, external terminal 7, and memory chip 6. The lead pattern 8 and the external terminal 7 are formed by laminating copper foil on the wiring board 4 and etching it, and the external terminal 7 is further raised to a predetermined thickness with copper plating. and the joint part 81 with the memory chip knob 6
The back side is finished with tin plating. The CPU chip 5 and the memory chip 6 are fitted into the opening 43 for the CPtJ chip 5 and the opening 44 for the memory chip 6, respectively, and the bonding portion 81 of the electrode a11, which is a gold hump, and the lead pattern 8 are bonded. It is. This connection is made by welding gold and tin using pulse heating. In addition, the CPU chip 5 and the memory chip 6 are bonded to the upper electrode terminal 51 and the lead pattern 8 by solidifying the joint 81 with a sealing resin 52 formed by molding a partial molding I and forming the wiring board 4.
The lower part protrudes slightly from the lower surface of the wiring board 4.

The center sea 1-10 is made of hard vinyl chloride resin with a thickness of 200 μm, and has an L-shaped opening 10a into which the IC module 3 is inserted. The receiving portion 10b of this 15-shaped opening 10a is connected to the magnetic stripe 2 of the IC card 1.
, and the neck portion 10C is located at a position corresponding to the external terminal 7.

Upper surface sea 1-13 and lower surface sea) 14 are each IC
It is made of hard vinyl chloride resin with a thickness of 160 μm and is polymerized and bonded with adhesive to cover the upper and lower surfaces of the module and Senkushi-1, and both positions correspond to the CPU chip 5 and memory chip 6. A rectangular opening 1 having an area facing at least both of the chips and the chips.
3a and 14a are formed, and the opening 1 of the lower sheet
A rectangular CPU chip 5 and a rectangular memory chip 6 are respectively fitted into 3a.

Further, the upper sheet 13 has eight small holes 13b arranged in parallel at positions corresponding to the external terminals 7, through which the external terminals 7 pass.

The upper exterior film 15 and the lower exterior film 16 are polymerized to cover the upper surface of the upper sheet 13 and the lower surface of the lower sheet 14, respectively, and are bonded with an adhesive 19, and have a thickness of 1.
Made of 00μm hard vinyl chloride resin. The upper exterior film 15 has a plurality of small holes 15a arranged in parallel at positions corresponding to the external terminals 7, through which the external terminals 7 pass, and magnetic stripes 2 are arranged on the top surface along the long sides, avoiding the center in the width direction. It is formed by applying fine powder such as iron oxide.

Further, the space between the upper exterior film 15 and the lower exterior film 16 at the positions corresponding to the opening E143 for the CPU chip 5 and the opening 44 for the memory chip 6 of the wiring board 4 is made of a two-component mixed type, for example, an epoxy resin. A filler 9 is filled to fix the CPU chip 5 and the memory chip 6.

Next, a method for manufacturing the IC card 1 according to the above embodiment of the present invention will be described. A top sheet 13 and an upper exterior film 15 are arranged above the center sheet 10, and a lower sheet 14 and a lower exterior film 16 are stacked in this order below the center sheet 10. 13a, etc., small holes 11a, 13b, etc. are processed in advance and wound into a roll shape. In FIGS. 1 and 2, (1) the lower exterior film 16, the lower sheet 14 and the center sheet 10 are adhered with an adhesive 19 and polymerized. In parallel with this, the upper exterior film 15 and the upper sort 13 are adhered with an adhesive 19 and polymerized.

■ Fit the IC module 3 manufactured separately in advance into the L-shaped opening 10a of the center sort 10, and glue the bottom surface 7F1.
At step 19, it is adhered to the lower sheet 14 and polymerized.

(2) Fill the area around the CPU chip 5 and memory chip 6 of the IC module 3 with the filler 9.

(2) The upper exterior film 15 and the upper sheet 1-13, which were polymerized in (2) above, are adhered to the upper surfaces of the center sheet 10 and the IC module 3 with adhesive 19 to integrate the whole. At this time, the upper surface of the exterior terminal 7 and the upper exterior film J・1
The top surface of 5 is flush.

■ Cut the outer periphery to the specified size of the IC cart.

■ Magnetic stripe 2 on two sides of the upper exterior film 15
form.

The thickness of the adhesive layer between each sheet is about 20 μm, and thus an IC card 1 having an average thickness of about 800 μm is completed.

According to the above embodiment of the present invention, since the top sheet 13, the bottom sheet 14, the top exterior film 15, and the bottom exterior film 16 are arranged symmetrically in the vertical direction with respect to the center sheet 10, the IC card 1 is warped. Since the IC module 3 is stored avoiding the center of the IC card 1, even if a bending moment is applied to the IC card 11 due to an external force, the U chip 5 or memory chip 6 will not be damaged. Since the top surfaces of the external terminals 7 and the upper exterior film 15 are flush with each other, dust accumulates on the external terminals 7 and causes poor contact. can be prevented. Furthermore, since the IC module 3 is fitted into the L-shaped opening 10a provided in the center notebook 10, the positioning of the IC module 3 can be performed accurately and efficiently when manufacturing the IC cart 1. Since film is used, it is easy to serialize the process and mass-produce, and since it includes an IC chip and a magnetic stripe 2, it can also meet the demands during the transition period when switching from magnetic cards to IC carts.

Although the above embodiment shows the case where the CPU chip 5 and the memory chip 6 are separated, it is of course possible to integrate both chips and put them in one place. In this case, it is desirable that the IC chip be placed near the external terminal 7. Furthermore, since the IC card 1 is vertically symmetrical with respect to the center sheet 1O, the IC card 1 may be manufactured with the vertical order reversed with respect to the above embodiment.

〔Effect of the invention〕

According to the present invention, an external terminal connected to an electrode of an IC chip is disposed on one edge of the card body near a magnetic stripe formed on the outer surface near one long side of the card body, and the external terminal is not provided. Since the IC chip is attached to the inside of the extended portion of an insulating wiring board facing the magnetic stripe near the edge of the card body, the IC chip causes the card body to flex not only in the longitudinal direction but also in the width direction. Even in such cases, there is no damage and the lead is less likely to be cut.

[Brief explanation of drawings]

Fig. 1 shows an IC card, Fig. 3 is an enlarged vertical sectional view of In-I [1 line], Fig. 2 is an exploded perspective view, Fig. 3 is an overall perspective view, and Fig. 4 is a perspective view showing a conventional example. It is. ■ ・ ・ ・ tC card, 2... Magnetic stripe, 3... IC module, 4... Wiring board, 5... CPU chip, 6... Memory chip, 7... External terminal, 8 ... Lead pattern, 9... Filler, 10... Center sheet, 10a... Opening, 13... Top sheet, 13a... Opening, 14... Bottom sheet, 14a... Opening, 15... Upper exterior film, 16... Lower exterior film, 41... Extension part. Patent Applicant: Casio Computer Co., Ltd. Figure 3 (&-I Rice Research Institute) Figure 4

Claims (1)

[Claims] In an IC card with a magnetic stripe, which has an IC chip housed inside and a magnetic stripe formed on the outer surface near one long side, an external terminal connected to an electrode of the IC chip is connected near the magnetic stripe. At the same time as placing it on one edge of the card body,
The insulating wiring board provided with the external terminal is extended into the card body facing the magnetic stripe, and an IC chip is attached near the edge of the card body at the extension portion of the insulating wiring board facing the magnetic stripe. An IC card with a magnetic stripe.