JPS62134295A - Integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an IC card with a built-in IC.

Conventional technology Identification cards used to identify individuals have traditionally used magnetic or scientific reading methods, but they lacked permanence and could be changed, making identification difficult. Therefore, recently, IC cards with built-in IC chips have been attracting attention as identification cards.

These IC cards have a larger storage capacity than conventional magnetic stripe cards, so they can be used to store savings and savings history in place of a bank book in the banking field, transaction history such as shopping in the credit card field, and can be used to store health and personal information in the medical field. Various application systems such as data storage are being considered.

Conventionally, this type of card is as shown in Figures 4 to 7.
An IC having almost the same thickness as the card base material 1 is inserted into a hole 3 that is the size of the IC module 2 by using an end mill, a press mold, etc., through a 550 μm thick card base material 1 that is laminated or pressed in sheet form. Insert the module 2, overlay the oversheets 4 and 6 made of polyvinyl chloride with a thickness of about 100μm on the front and back sides, and
It was heated to 50'C, pressurized at 16 to 36 kg/c-, and laminated for several minutes (e.g.,
Refer to Publication No. 0-86860 2゜As for the IC module 2, the connecting terminal portion 7 is usually formed on the first surface of the insulating substrate 6 using metal foil or plating, and the IC chip 8 is formed on the opposite surface of the insulating substrate 60.
is die-bonded and connected to the wiring pattern on the insulating substrate 6 by bonding with a gold wire 9, inner lead bonding with a film carrier, etc., a part of the wiring pattern is electrically connected to the connection terminal part 7, and then a spacer is connected to the wiring pattern on the insulating substrate 6. The O IC card is made by pasting it on an insulating substrate 6 so as to surround the IC'' fXo chip 8, and coating the IC chip 8 with a sealant 11 such as epoxy resin. Various designs are displayed as well as cards or plastic cards.

Problems that the invention aims to solveHowever, the XC card is 15O (International Organization for Standardization)
As is being considered for standardization, a thickness of 0.76n, which is the same as that of conventional magnetic stripe cards, is required, so there are significant restrictions on the thickness of the IC module 2 and the thickness of the IC chip 8 to be buried. .

For example, the oversheets 4 and 6 on the front and back sides each have IC゜μm.
In this case, the card base material 1 has a thickness of 560 μm, and the IC module 2 also needs to have a thickness of 660 μm or less. If the IC chip 8 is to be bonded with the gold wire 9, a hard plate with a thickness of at least 100 μm is required as the insulating substrate 6, and the thickness of the IC chip 8 is conventionally 660 μm.
Generally, the thickness is about 200 to 300 μm, but it needs to be polished to a thickness of 200 to 300 μm. Furthermore, when bonding is performed between the bonding pad portion of the IC chip 8 and the wiring pattern on the insulating substrate 6, the height becomes 100 to 200 μm. Therefore, the thickness of the sealant 11 made of epoxy resin or the like is also extremely thin. It becomes 250 μm.

A polyvinyl chloride oversheet 4 is formed on the buried IC module 2, and this oversheet also has a thickness of about 0 μm for the IC. Therefore, when strong ultraviolet rays are irradiated, they pass through the polyvinyl chloride oversheet 4 and the Xa chip encapsulant 11 of the IC module 2, and in the worst case, the XC chip 8 is destroyed. .

Recently, devices 9 that use electromagnetic waves such as ultraviolet rays and X-rays have been used in various fields, and humans have many opportunities to be exposed to ultraviolet rays and X-rays. There was a possibility that ICC Chikubu 8 could be destroyed due to exposure to the air, making it inferior in reliability and safety.

Means for Solving the Problem In order to solve this problem, the present invention embeds an IO module with a built-in IC chip in the card base material, and the design of the IC card is at least larger than the chip size. Trademarks that are part of.

To provide an IC card in which a character 1 figure is displayed using electromagnetic wave shielding ink so as to be positioned on an IC module.

With this configuration, even if an IC card is exposed to excessive electromagnetic waves such as ultraviolet rays or Therefore, an IC card with high quality can be obtained.

Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.

In FIG. 1, the IC module 19 is formed by etching a copper foil and plating the connecting terminal portion 13 on the first surface of the insulating substrate 12 with a thickness of 0 μm, followed by nickel plating, gold plating, etc.
The IC chip 15 is fixed to the opposite second surface of the insulating substrate 120 with silver paint, and the bonding pad part of the IC chip 16 is connected to the wiring pattern on the insulating substrate 12 using a gold wire 16. A part of the IC chip 16 is electrically connected to the connection terminal portion 13 on the insulating substrate 12, and a spacer 171i1G chip 16'ft is attached on the insulating substrate 12 so as to surround it, and the IC chip 16 is sealed with epoxy resin or the like. It is made by coating with agent 18.

The above IC module 1 Sl: is inserted into a hole 21 provided in a card base material 20 made of a 560 μm polyvinyl chloride sheet, and the connecting terminal portion 13 is exposed on the surface of the connecting terminal portion 13 of the IC module 19. An oversheet 22 provided with terminal holes 14 is laminated as shown in FIG.
Electromagnetic shielding ink 2 made of polyvinyl chloride resin as a paste and lead dioxide as a pigment is applied to the surface opposite to the connection terminal portion 13.
3 Oversheet 24 that is fully printed and displays trademarks, etc.
The IC card of the present invention can be obtained by laminating them.

The IC card according to the embodiment described above can protect the IC chip 15 by shielding it from ultraviolet rays and X-rays.

In addition to lead dioxide, organic pigments and inorganic pigments having an electromagnetic wave shielding effect can be used as the pigment.

In addition, one character of the trademark is made of electromagnetic wave shielding ink.

Even if the graphic is displayed only on one side of the IC card, the IC chip 16 has the protective effect, but the electromagnetic shielding ink 2 is also applied to the connection terminal section 13 surface of the IC module 19.
It is clear that if 3 were provided, the effect would be even stronger.

Effects of the Invention As described above, according to the present invention, one character and one figure of the trademark larger than the IO chip size are displayed using electromagnetic wave shielding ink at a position corresponding to the IC module, so that ultraviolet rays, X@, etc. It is possible to obtain an IC card whose IC chip is not destroyed even when exposed to electromagnetic waves, which is of great practical value.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an IC card according to an embodiment of the present invention;
Fig. 2 is a plan view showing the trademark displayed on the IC card, Fig. 3 is a plan view of the opposite side of the IC card, Fig. 4 is an exploded perspective view showing the structure of a conventional IC card, and Fig. 6 is a plan view of the trademark displayed on the IC card. The sectional view of the conventional IC card, FIGS. 6 and 7, are plan views of the front and back sides of the IC card. 12... Insulating board, 18... Connection terminal section, 16... 1... IC chip, 19 Old... IC module, 20... Card paste material, 21 ...
... Hole, 22.24 ... Oversheet, 2
3... Electromagnetic wave shielding ink. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 3
Figure 4 Figure 5 Figure 6 Figure 7rl! J

Claims (1)

[Claims] An IC module containing an IC chip is embedded in the card base material, and trademarks, characters, and figures that are at least larger than the IC chip size and are part of the IC card design are placed on the IC module using electromagnetic shielding ink. An IC card characterized by displaying the following.