JP2661101B2 - IC card - Google Patents
IC cardInfo
- Publication number
- JP2661101B2 JP2661101B2 JP63033297A JP3329788A JP2661101B2 JP 2661101 B2 JP2661101 B2 JP 2661101B2 JP 63033297 A JP63033297 A JP 63033297A JP 3329788 A JP3329788 A JP 3329788A JP 2661101 B2 JP2661101 B2 JP 2661101B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- chip
- metal
- substrate
- card base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ICチップを内蔵したカードの構造に関す
る。Description: TECHNICAL FIELD The present invention relates to a structure of a card incorporating an IC chip.
従来のICチップを内蔵したカードの構造は、ガラスエ
ポキシフィルム基板又はポリイミドフィルム基板、ポリ
エステルフィルム基板等に外部接続端子となる電極パタ
ーン及びICチップの電極と接続する回路パターンを形成
し、外部接続端子面と回路パターン面とはスルーホール
加工により導通せしめ、核基板に１個もしくは複数のIC
チップをダイボンディング及びワイヤーボンディング方
式、またはフェイスボンディング方式等によりマウント
し樹脂により封止したICモジュールを硬質塩化ビニル、
耐熱ポリエステルの積層体を使用したカード基材の凹部
内に埋没設置して、表裏を透明塩化ビニル等からなるオ
ーバーシートでラミネートした構造が一般的である。The structure of a conventional card with a built-in IC chip consists of a glass epoxy film substrate, a polyimide film substrate, a polyester film substrate, etc., in which an electrode pattern to be an external connection terminal and a circuit pattern to be connected to the electrode of the IC chip are formed. The surface and the circuit pattern surface are made conductive by through-hole processing, and one or more ICs are placed on the core substrate.
An IC module in which the chip is mounted by die bonding and wire bonding or face bonding and sealed with resin is made of hard vinyl chloride,
In general, a card base using a heat-resistant polyester laminate is buried in a concave portion of a card base material, and the front and back sides are laminated with an oversheet made of transparent vinyl chloride or the like.
又、カード基材が樹脂であり、カード厚みも薄いため
特に曲げに対する特性において故障が発生する危険が非
常に大きい。そのためICチップのカード上での配置位置
（カードの角に配置し応力がかかりにくくする）やICチ
ップの向き（カードの長手方向に対してICチップの長手
方向を直角にする）等の配慮をした構造となっていた。Further, since the card base material is a resin and the card thickness is thin, there is a great risk that a failure will occur particularly in the bending property. Therefore, consideration must be given to the location of the IC chip on the card (located at the corner of the card to reduce stress) and the direction of the IC chip (the longitudinal direction of the IC chip is perpendicular to the longitudinal direction of the card). It was a structure that did.
しかし、前述の従来技術では、磁気記録体、外部接続
端子、エンボス加工等との併用、又、ICチップの数も複
数個になる等の理由により、カード曲げに対する応力の
かん和のための配慮ができない場合が通常でありICモジ
ュールにかかる応力による故障の発生を防止することが
できないという問題点を有する。そこで本発明はこの様
な問題点を解決するもので、その目的とするところは、
カードの曲がりに対して強いICカードを提供するところ
にある。However, in the above-mentioned prior art, due to the combined use with the magnetic recording medium, the external connection terminal, the embossing, etc., and the number of IC chips also becomes plural, consideration is given to the relaxation of the stress to the card bending. However, there is a problem that it is not possible to prevent the failure due to the stress applied to the IC module. Therefore, the present invention solves such a problem, and the purpose is to
It provides IC cards that are strong against card bending.
本発明のICカードは、ICチップを内部に有するICカー
ドにおいて、第１カード基材と、前記ICチップを一方の
面にマウントし、かつ前記第１のカード基材を覆い、高
剛性の金属基板から構成されている第２のカード基材
と、を有することを特徴とする。この場合において、前
記カード基材に実装された磁気記録体を有するICカード
において、前記金属基板は帯磁性の弱い金属により構成
すればよい。An IC card according to the present invention is an IC card having an IC chip therein, wherein a first card base, the IC chip is mounted on one surface, and the first card base is covered, and a high rigid metal And a second card base made of a substrate. In this case, in the IC card having the magnetic recording medium mounted on the card base, the metal substrate may be made of a metal having weak magnetic properties.
また、前記第１カード基材を金属板から構成し、前記
第２カード基材との積層体とすることができる。さら
に、前記カード基材に実装された磁気記録体を有するIC
カードにおいて、前記第１カード基材は帯磁性の弱い金
属とすることができる。Further, the first card base may be made of a metal plate, and may be a laminate with the second card base. Further, an IC having a magnetic recording body mounted on the card base material
In the card, the first card base material may be made of a metal having weak magnetic properties.
第１図は本発明の実施例における主要断面図であっ
て、ICモジュール１は磁気記録体への影響を与えない帯
磁性の弱い金属をコアとしたメタル基板５にICチップ２
を接続し、封止樹脂３にて接続部及びICチップ２の封止
及び保護を行ったものであり、このメタル基板５のICチ
ップ２を実装した反対側の面にはスルーホールにより導
通せしめた外部入出力端子が形成されている。又このメ
タル基板５はカード形状とほぼ同一の形状とし、やはり
帯磁性の弱い金属を使用したカード基材４と接着剤10に
よりラミネートされ剛性の高い積層体とし、ICチップ２
の配置部分への曲げ応力の集中を防ぎ、曲げに対して曲
がりにくい構造としている。尚、ここでの接着剤には硬
化タイプの接着剤を使用しさらに剛性を高めている。FIG. 1 is a main cross-sectional view of an embodiment of the present invention. An IC module 1 has an IC chip 2 on a metal substrate 5 having a core of a weak magnetic material which does not affect a magnetic recording medium.
And the connection portion and the IC chip 2 are sealed and protected by the sealing resin 3. The metal substrate 5 is electrically connected to the surface on the opposite side of the IC chip 2 through a through hole. External input / output terminals are formed. The metal substrate 5 has substantially the same shape as the card, and is laminated with a card base material 4 made of a metal having weak magnetic properties and an adhesive 10 to form a highly rigid laminate.
The structure prevents bending stress from concentrating on the portion where is arranged, and has a structure that is difficult to bend against bending. Here, a hardening type adhesive is used for the adhesive to further increase the rigidity.
第４図は本発明の実施例２の主要断面図であり、第１
図のカード基材４をICチップ２の封止樹脂３の厚さで分
割し、２体の金属板として、接着剤10を２層に狭んだ３
枚の金属板の積層体として、さらに剛性を高めた構造と
している。FIG. 4 is a main sectional view of Embodiment 2 of the present invention, and FIG.
The card substrate 4 shown in the figure is divided by the thickness of the sealing resin 3 of the IC chip 2, and the adhesive 10 is reduced to two layers as two metal plates.
As a laminate of two metal plates, it has a structure with even higher rigidity.
以上述べたように本発明によれば、メタル基板を使用
し、基板サイズをカードサイズとすることにより、ICチ
ップ配置部とその他の部分の剛性の差が少なく、曲げ応
力の集中しにくいカードが得られ、又、カード基材にも
金属板を用いてラミネートによる積層体とし、メタル基
板自体がカード基材をかねるための金属板の厚さを厚く
することができ、より剛性の高い、曲げに対して曲がり
にくいカードを得ることができ、金属板には帯磁性の弱
い金属を使用しているため磁気記録体との併用も可能で
あるという効果を有する。As described above, according to the present invention, by using a metal substrate and setting the substrate size to the card size, there is little difference in rigidity between the IC chip disposition portion and other portions, and a card in which bending stress is less likely to concentrate. It is also possible to obtain a laminated body by lamination using a metal plate also for the card base material, and to increase the thickness of the metal plate for the metal substrate itself to also serve as the card base material, to provide a more rigid, It is possible to obtain a card that is hard to bend, and has an effect that it can be used in combination with a magnetic recording body since a metal having weak magnetic properties is used for the metal plate.
第１図は本発明のICカード構造の一実施例を示す主要断
面図。 第２図は従来のICカード構造を示す主要断面図。 第３図はICカードの平面図。 第４図は本発明の実施例２の主要断面図。 １……ICモジュール ２……ICチップ ３……封止樹脂 ４……カード基材 ５……メタル基板 ６……磁気記録体 ７……絵柄 ８……オーバーコート ９……オーバーシート 10……接着剤FIG. 1 is a main sectional view showing one embodiment of the IC card structure of the present invention. FIG. 2 is a main sectional view showing a conventional IC card structure. FIG. 3 is a plan view of an IC card. FIG. 4 is a main sectional view of Embodiment 2 of the present invention. DESCRIPTION OF SYMBOLS 1 ... IC module 2 ... IC chip 3 ... Encapsulation resin 4 ... Card base material 5 ... Metal substrate 6 ... Magnetic recording body 7 ... Picture 8 ... Overcoat 9 ... Oversheet 10 ... adhesive
Claims (4)
て、 第１カード基材と、 前記ICチップを一方の面にマウントし、かつ前記第１の
カード基材を覆い、 高剛性の金属基板から構成されている第２のカード基材
と、 を有することを特徴とするICカード。1. An IC card having an IC chip therein, comprising: a first card base; and a high-rigidity metal substrate, wherein the IC chip is mounted on one surface and covers the first card base. An IC card comprising: a second card base material that is configured.
有するICカードにおいて、 前記金属基板は帯磁性の弱い金属であることを特徴とす
る請求項１記載のICカード。2. The IC card according to claim 1, wherein in the IC card having a magnetic recording medium mounted on the card base material, the metal substrate is made of a metal having weak magnetic properties.
前記第２カード基材との積層体としたことを特徴とする
請求項１記載のICカード。3. The method according to claim 2, wherein the first card base is made of a metal plate.
2. The IC card according to claim 1, wherein the IC card is a laminate with the second card base material.
有するICカードにおいて、 前記第１カード基材は帯磁性の弱い金属であることを特
徴とする請求項３記載のICカード。4. The IC card according to claim 3, wherein said first card substrate is made of a metal having weak magnetic properties, wherein said IC card has a magnetic recording medium mounted on said card substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63033297A JP2661101B2 (en) | 1988-02-16 | 1988-02-16 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63033297A JP2661101B2 (en) | 1988-02-16 | 1988-02-16 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01208195A JPH01208195A (en) | 1989-08-22 |
| JP2661101B2 true JP2661101B2 (en) | 1997-10-08 |
Family
ID=12382613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63033297A Expired - Lifetime JP2661101B2 (en) | 1988-02-16 | 1988-02-16 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2661101B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100209259B1 (en) * | 1996-04-25 | 1999-07-15 | 이해규 | Ic card and method for manufacture of the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61155976U (en) * | 1985-03-20 | 1986-09-27 |
-
1988
- 1988-02-16 JP JP63033297A patent/JP2661101B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01208195A (en) | 1989-08-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080613 Year of fee payment: 11 |