JPS62201296A - Integrated circuit card and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an IC card incorporating an IC chip and a method for manufacturing the same.

Conventional technology Identification cards that identify individuals have traditionally used magnetic or optical reading methods, but these cards lack permanence and are easy to change, resulting in low identification security. Met. In view of this, various studies have recently been conducted to put into practical use systems that use IC cards with built-in IC chips as identification cards.

Compared to conventional magnetic strip cards, these IC cards have a larger storage capacity and have a built-in microcomputer chip that makes identification more secure. Andori l/
A variety of application systems are being considered, such as storing shopping transaction history in the digital world, and storing personal health data in the medical field.

There are many types of IC cards, but the thinnest ones are 0.
Standardization of an IC card with a thickness of 0.076 mm is being considered by the International Organization for Standardization (I5O).

Conventionally, this kind of IC card is manufactured by using an end mill or a press mold, etc., on a card base material 1 having a thickness of 550 μm in the form of a laminated or n-1 type, as shown in FIGS. 3 and 4.
A through hole 3 is provided with the size of the C module 2, an IC module 2 having approximately the same thickness as the card base material 1 is inserted, and an oversheet 4°5 of approximately 100 μm made of polyvinyl chloride is overlaid on the front and back sides. It was heated to 100 to 150°C and pressurized at 16 to 3 ts kg/ct, and laminated for several minutes.

In the IC modules 2 and 1~, normally, as shown in Fig. 3, the connection terminal portion 6 is formed on the first surface of the insulating substrate using metal foil or plating, etc., and the IC chip is die-bonded on the opposite side of the insulating substrate. 17. Connect the wiring pattern on the insulating substrate and the connection pad of the IC chip by bonding with gold wire, in-line bonding with a film carrier, etc., and wire some of the wiring patterns so that they are electrically connected to the connection terminal section 6. However, a spacer was pasted to surround the IC chip on the insulating substrate, and the IC chip was covered with a sealant such as epoxy resin.

Problems to be Solved by the Invention The IC card has a 0.0-.
Since a thickness of 76 mm is required, the thickness and structure of the IC module 2 to be buried or inserted are greatly restricted. For example, the front and back oversheets 4 and 6 are each 100/
If it is 7 m, the card base material 1 will be 560 μm, and I
The thickness of the C module 2 must be limited to 560 μm when buried, and the oversheet 45 on the connection terminal 6 side.

Even in the case where the through hole 7 is provided and the IC module 2 is inserted, it is necessary to limit the thickness to 660 μm.

In order to make the IC module 2 as thin as this, a typical IC chip with a thickness of 560 μm is polished to a thin layer of 30 μm.
Unless the thickness is adjusted to about 0 μm, it will be difficult to mount it in the IC module 2. Therefore, in order to protect the IC chip from external stress, it is necessary to
Many attempts have been made to reduce the influence of external stress on the IC chip by making the structure of the IC module 2 surrounding the C chip as hard as possible.

However, if the IC module 2 is made rigid, stress will often be concentrated on the corners of the IC module 2 embedded or inserted into the card base material 1 when the IC card is bent or twisted. As a result, cracks and discoloration occur on the surface oversheet 4°6.
61, -7 In extreme cases, the IC module 2 may easily fall off, causing the IC module 2 to float and become stuck when inserting the IC card into the reader/writer. This may also reduce the aesthetic and commercial value of the IC card.

In order to solve the problem with another means of solving the problem, the present invention provides a first card base material having holes smaller than the planar dimension of the IC module disposed on the first oversheet, Furthermore, a second hole is provided on top of the hole with approximately the same planar dimensions as the IC module.
Layer the card base material and the second oversheet,
A notch is provided in the corner of the surface of the IC module that contacts the first oversheet, and the end surface of the IC module is inserted into the hole in the first card base material. An IC card is provided in which a first card base material and an IC module are bonded together.

Effect: With this configuration, even if stress such as bending or twisting is applied to the IC card, the IC module has a notch in the corner, and the notch and card base material are fixed with adhesive. , external stress on the corners of the IC monoyl is dispersed at the notches, causing cracks and discoloration of the oversheet.

Examples Examples Examples of the present invention will be described below with reference to the accompanying drawings.

In FIG. 1, a connecting terminal portion 8 is formed on the first surface of an insulating substrate 9 with a thickness of 100 μm by etching copper foil and then applying nickel plating or gold plating. After die-bonding the IC chip 10 to the surface, a gold wire 12 is used to bond the bonding pad portion of the IC chip 10 to the insulating substrate 9I-.

Connect the wiring pattern 1-1 and electrically connect a part of the wiring/center turn to the connection terminal part 8 on the insulating base @9, and further surround the spacer 11 with the chip 10: Sea urchin insulating substrate 9-hi and cover the IC chip 10 with the sealant 13 whose main component is epoxy resin.
An IC module 14 with a thickness of 0 μm is created.

In that case, at least the outermost layer of the spacer 11 of the IC module 14 is 1.0 to 1.5 m1llzJ larger on one side than the planar dimension of the IC module 14.
Set the size to s. The thickness of the outermost layer spacer 11 may be about 0.1 to 0.3 mm, but in this example, the spacer thickness was 0.2 mm.

Next, the first card base material 16 made of a 200 μm polyvinyl chloride sheet is coated with a 1. A hole 16 that is 1.5 mm smaller is provided, and a hole 19 that is approximately the same as the planar dimension of the IC module 14 is provided in the second card base material 17 and second oversheet 18 made of a 360 μm polyvinyl chloride sheet, Overlap the first oversheet 20 so that the holes 15 and 19 are aligned, and apply an adhesive 22 mainly composed of epoxy resin and polybutadiene rubber to the notch 21 of the IC module 14, and then apply the adhesive 22 to the IC module 14. Insert 14.

After performing the net processing, an IC card is obtained by processing the outer shape to a size of 86 mm x 54 mm.

A bending test for the IC card thus prepared was conducted as follows.

An IC card was fixed between the jaws of a machine with one side movable, and was bent at a rate of 30 times per minute with a deflection of 2 mm in the long side direction (86 mm), and checked every 125 times. A similar test was conducted by reversing the front and back sides every 250 times. The deflection in the short side direction (54mm) of the IC card is still 1.
0 mm, and the same test as in the long side direction was conducted.

As a result, in the conventional IC module structure, the number of bends was 3.
After 75 bends, the oversheet 5 broke at the corner of the IC module. However, in the case of the IC card according to the present invention, no abnormality was observed in the first oversheet 2o even after the bending test was performed up to 1000 times. I couldn't.

For reference, the adhesive 22 is applied only to the notch 21 at the corner of the IC module 14 in step 10.

Case I, and case ■ where the adhesive 22 is also applied between the notch 21, the IC module 14, and the first oversheet 20;
A bending test was also carried out for the case (2) in which the adhesive 22 was applied only between the IC module 14 and the first oversheet 20, but only on the notch 21. The result 1. In the case of IT, there was no abnormality even after 1000 times, but ■
In the case of 376 times, cracks occurred in the first oversheet 20. This shows that it is effective to apply the adhesive 22 to the notch 21 at the corner of the IC module 14.

Effects of the Invention As described above, according to the present invention, a notch is provided at the corner of the IC monoyl and is fixed to the notch with the card base material and adhesive, thereby reducing stress caused by external stress. This eliminates concentration, prevents damage to the oversheet, and prevents problems such as the IC module popping out, making it possible to obtain an IC card that is strong, aesthetically pleasing, and of great commercial value.

[Brief explanation of drawings]

FIG. 1 is a partial sectional view of the IC card of the present invention, and FIG.
The figure is a perspective view showing the IC module structure of the IC card, FIG. 3 is an exploded perspective view of a conventional IC card, and FIG.
The figure is a partial sectional view of the conventional IC card. 14...ZC module, 15...hole, 16...first card base material, 17...
-Second card base material, 18...second oversheet, 19...hole, 20...first
Oversheet, 21... Notch, 22...
···glue.

Claims (2)

[Claims] (1) A first card base material with holes smaller than the planar dimensions of the IC module is placed on top of the first oversheet, and a second card base material with holes with approximately the same planar dimensions as the IC module is placed on top of the first oversheet. Layer the second card base material and the second oversheet, and make a notch in the corner of the surface of the IC module that contacts the first oversheet to the extent that the end surface of the IC module can fit into the hole in the first card base material. 1. An IC card characterized in that a first card base material and an IC module are bonded to each other via an adhesive at the cutout portion. (2) A first card base material having a hole smaller than the planar dimension of the IC module is placed on the first oversheet in alignment with the IC module insertion position, and then placed on top of the first card base material in a plane that is approximately the same as the IC module. A second card base material having a hole of the same size as the second oversheet is overlapped, and the end face of the IC module is inserted into the hole of the first card base material at the corner of the surface in contact with the first oversheet. The first card base material and the IC are bonded to each other via a thermosetting adhesive in the notch.
A method for manufacturing an IC card, which comprises bonding modules together and then heating and pressurizing them while sandwiching them between mirror-finished metal plates.