JPH0216234B2 - - Google Patents
Info
- Publication number
- JPH0216234B2 JPH0216234B2 JP57160220A JP16022082A JPH0216234B2 JP H0216234 B2 JPH0216234 B2 JP H0216234B2 JP 57160220 A JP57160220 A JP 57160220A JP 16022082 A JP16022082 A JP 16022082A JP H0216234 B2 JPH0216234 B2 JP H0216234B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- base material
- adhesive
- card base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000002313 adhesive film Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 239000004593 Epoxy Substances 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004382 potting Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Credit Cards Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
【発明の詳細な説明】
この発明は、ICモジユールを装着もしくは内
蔵したICカードの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an IC card with an IC module attached or built therein.
近年、マイクロコンピユータ、メモリ等のIC
モジユール（チツプ）を装着もしくは内蔵したチ
ツプカード、メモリカード、マイコンカード、電
子カードなどと称されるカード（以下、ここでは
単にICカードという）の研究開発がなされてい
る。このICカードは、従来の磁気ストライプカ
ードに比べてその記憶容量が大きいことから、金
融関係では預金通帳に替つて預貯金の履歴を記
録・記憶したり、クレジツト関係では買物等の取
引き履歴を記録・記憶させるようなことが考えら
れている。 In recent years, ICs for microcomputers, memory, etc.
Research and development is being carried out on cards (hereinafter simply referred to as IC cards) that are equipped with or have modules (chips) installed or are called chip cards, memory cards, microcomputer cards, electronic cards, etc. This IC card has a larger storage capacity than conventional magnetic stripe cards, so it can be used to record and store the history of deposits and savings in place of a bankbook in the financial field, and to record the history of transactions such as shopping in the credit field.・Things that will help you remember things are being considered.
そして、このようなICカードの製造方法とし
ては、積層プレスされたカード基材に、エンドミ
ルもしくは彫刻機などによりICモジユール大の
凹部を設けた後、接着剤などによりICモジユー
ルを上記凹部に接着固定する方法が従来より一般
的であつた。 The method for manufacturing such an IC card is to create a recess the size of an IC module in the laminated and pressed card base material using an end mill or engraving machine, and then use adhesive to fix the IC module in the recess. This method has been more common than before.
しかしながら、このような方法によつて製造さ
れたICカードは、ICモジユールの埋設孔寸法と
ICモジユールの外形寸法との間にエンドミル加
工、彫刻加工の上で防止不可能な誤差が生ずるた
め、ICモジユールとカード基材との間に微少な
空隙が発生し、カードの耐湿性、耐水性、耐久性
が弱くなる欠点を有し、また、ICモジユール製
造時のICモジユールの厚さと、ICモジユールの
埋設孔の深度とが精度的にバラツキを有すること
から、カード基材の表面とICモジユール表面の
高さがそろわず、カード使用時のトラブルの原因
となつていた。さらに、接着剤の塗布工程におい
て、接着剤の塗布量が多い場合には、ICモジユ
ールを埋設したときに接着剤がカード表面にはみ
出し、外観上の美感を損うばかりでなく、接着剤
が電極面に付着した場合には、動作不良を誘発す
る原因となる等の欠点がある。更にまた、接着剤
の塗布量が少ない場合は、ICモジユール接着面
の端部へ接着剤が行き渡らないため、折曲げなど
の外力によつてICモジユールがカード基材から
容易に脱落するなど、ICカードの改ざんを可能
としてしまうといつた欠点がある。 However, the IC card manufactured by this method has the same dimensions as the hole in the IC module.
As unavoidable errors occur between the external dimensions of the IC module and the end milling and engraving processes, a minute gap is created between the IC module and the card base material, resulting in poor moisture resistance and water resistance of the card. However, since the thickness of the IC module during manufacture of the IC module and the depth of the hole in which the IC module is buried vary in precision, the surface of the card base material and the IC module The surface heights were not aligned, causing problems when using cards. Furthermore, in the adhesive application process, if a large amount of adhesive is applied, the adhesive will protrude onto the card surface when the IC module is buried, not only detracting from the aesthetic appearance but also causing the adhesive to overflow into the electrodes. If it adheres to the surface, it has disadvantages such as causing malfunction. Furthermore, if the amount of adhesive applied is small, the adhesive will not reach the edges of the adhesive surface of the IC module, which may cause the IC module to easily fall off from the card base material due to external force such as bending. The drawback is that it allows cards to be tampered with.
よつて、この発明の目的は、上述のような種々
な欠点を有する従来のICカードの製造方法に改
良を加え、信頼性の高いICカードの製造方法を
提供することにある。 Therefore, an object of the present invention is to provide a highly reliable IC card manufacturing method by improving the conventional IC card manufacturing method which has the various drawbacks as described above.
以下にこの発明を、図面を参照してその実施例
を詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図はこの発明に用いるICモジユールの断
面を示すものであり、このICモジユールの製造
は次のように行なわれる。 FIG. 1 shows a cross section of an IC module used in the present invention, and this IC module is manufactured as follows.
先ず、厚さ0.1mm程度のガラスエポキシフイル
ム基板１に、35μｍ厚の銅箔をラミネートしたプ
リント配線用フイルムを用いて、所望のパターン
を得るためにエツチングした後、ニツケル及び金
メツキを行ない、外部との接続端子用電極パター
ン２及び回路パターン３を形成した後、所望の大
きさに打抜く。そして、接続端子用電極パターン
２と回路パターン３とを、必要個所においてスル
ーホール４によつて電気的に接続する。この回路
パターン３上の所定位置にICチツプ５をダイボ
ンデイングし、ICチツプ５上の電極６と回路パ
ターン３とを導体７によりワイヤーボンデイング
方式により接続する。なお、この部分はワイヤを
使用しないフエイス・ボンデイング方式で実施す
ることもでき、その場合にはより薄いICモジユ
ールを得ることができる。ICチツプ５と回路パ
ターン３との必要な接続を導体７で行なつた後、
エポキシ樹脂ポツテイング時の流れ止め用に、ガ
ラスエポキシ等の材質で成るポツテイング枠８を
エポキシ系の接着剤等でガラスエポキシフイルム
基板１に取付け、エポキシ樹脂９を流し込んでモ
ールドする。この時、比較的粘度の高いエポキシ
樹脂（105CPS程度）で先ずスルーホール４を隠
し、充分硬化したことを確認した後に、低粘度の
エポキシ樹脂（103CPS程度）を流し込む方法を
採れば、スルーホール４を通してポツテイング用
のエポキシ樹脂９が、カード表面となる接続端子
用電極パターン２側に出ることを防ぐことができ
る。 First, a printed wiring film made by laminating a 35 μm thick copper foil onto a glass epoxy film substrate 1 with a thickness of about 0.1 mm is etched to obtain a desired pattern, and then nickel and gold plating is applied to the external surface. After forming the electrode pattern 2 for connection terminals and the circuit pattern 3, punching is performed to a desired size. Then, the connection terminal electrode pattern 2 and the circuit pattern 3 are electrically connected through the through holes 4 at necessary locations. The IC chip 5 is die-bonded to a predetermined position on the circuit pattern 3, and the electrode 6 on the IC chip 5 and the circuit pattern 3 are connected by a conductor 7 using a wire bonding method. Note that this part can also be implemented using a face bonding method that does not use wires, in which case a thinner IC module can be obtained. After making the necessary connections between the IC chip 5 and the circuit pattern 3 using the conductor 7,
In order to prevent the flow of epoxy resin during potting, a potting frame 8 made of a material such as glass epoxy is attached to a glass epoxy film substrate 1 with an epoxy adhesive or the like, and an epoxy resin 9 is poured and molded. At this time, if you first cover the through hole 4 with a relatively high viscosity epoxy resin (about 10 5 CPS) and after confirming that it has sufficiently hardened, pour in the low viscosity epoxy resin (about 10 3 CPS). It is possible to prevent the epoxy resin 9 for potting from coming out through the through hole 4 to the side of the connecting terminal electrode pattern 2 which becomes the card surface.
以上に述べた方法により、ICカード用のICモ
ジユール１０を得ることができるが、回路パター
ン３及び接続端子用電極パターン２を形成する方
法やICチツプ５をボンデイングする方法を含め
て、ここで述べた方法はいずれも現在の関連業界
における技術で対応可能なものである。 Although the IC module 10 for an IC card can be obtained by the method described above, the method described here includes the method of forming the circuit pattern 3 and the electrode pattern 2 for connection terminals and the method of bonding the IC chip 5. All of the methods described above are applicable to current technology in the relevant industry.
このようにして得られたICモジユール１０を
使用し、この発明によつて目的のICカードを得
るには以下の方法による。以下、実施例としてカ
ード基材に硬質塩化ビニールを用いた場合につい
て述べる。 Using the thus obtained IC module 10, a desired IC card according to the present invention can be obtained by the following method. Hereinafter, as an example, a case will be described in which hard vinyl chloride is used as the card base material.
第２図はこの発明によつて得られたICカード
の平面図であり、第３図は第２図の−断面図
であり、第４図及び第５図はそれぞれこの発明の
製造方法における中間製品の構造を示すものであ
り、第４図はICモジユール埋設用の凹部１５を
設けたカード基材を、第５図は接着剤層１４を設
けたICモジユール１６を示している。 FIG. 2 is a plan view of an IC card obtained according to the present invention, FIG. 3 is a cross-sectional view of FIG. 2, and FIGS. 4 shows a card base material provided with a recess 15 for embedding an IC module, and FIG. 5 shows an IC module 16 provided with an adhesive layer 14.
ここにおいて、カード基材は、約0.56mm厚さの
乳白硬質塩化ビニールで成るセンタコア１１に、
オフセツト印刷又はシルクスクリーン印刷で表裏
に所望の絵柄１３を印刷した後、約0.1mm厚さの
透明硬質塩化ビニールで成るオーバーシート１２
を表裏に当てがい、ステンレス等の鏡面に仕上げ
られた２枚の金属板に挟持せしめる。そして、温
度150℃、圧力25Kg／cm2、時間10分というラミネ
ート条件で加熱加圧することにより、約0.76mm厚
さの硬質塩化ビニール積層体（カード基材）を得
る。そして、この積層体の所望個所に、ICモジ
ユール１０と平面寸法が同一もしくは0.5mm程度
大きく、かつICモジユール１０の厚さと同等も
しくは0.05mm程度深い凹部をエンドミルもしくは
彫刻機で切削し、ICモジユール１０を装着する
ための凹部１５を形成する（第４図）。 Here, the card base material is a center core 11 made of opalescent hard vinyl chloride with a thickness of about 0.56 mm.
After printing a desired pattern 13 on the front and back sides by offset printing or silk screen printing, an oversheet 12 made of transparent hard vinyl chloride with a thickness of about 0.1 mm is applied.
are placed on the front and back and sandwiched between two mirror-finished metal plates such as stainless steel. Then, a hard vinyl chloride laminate (card base material) with a thickness of about 0.76 mm is obtained by heating and pressurizing under lamination conditions of a temperature of 150° C., a pressure of 25 Kg/cm 2 , and a time of 10 minutes. Then, use an end mill or engraving machine to cut a recess in a desired location of this laminate, which has the same planar dimensions as the IC module 10 or is approximately 0.5 mm larger, and is equivalent to the thickness of the IC module 10 or is approximately 0.05 mm deeper. A recess 15 is formed for mounting the holder (FIG. 4).
一方、離けい紙上に粘着性を有する未硬化エポ
キシ樹脂接着剤フイルム（例えば3M社製ボンデ
イングテープ＃584など）をICモジユール１０の
底面の大きさ又は0.2〜１mmだけ大きめに打抜い
たものを、ICモジユール１０の底面に粘着貼付
して離けい紙を剥離し、接着剤１４を形成した
ICモジユール１６を得る（第５図）。 On the other hand, a piece of adhesive uncured epoxy resin adhesive film (for example, 3M bonding tape #584, etc.) on a release paper is punched out to the size of the bottom surface of the IC module 10 or 0.2 to 1 mm larger. Adhesive was pasted on the bottom of IC module 10 and the release paper was peeled off to form adhesive 14.
An IC module 16 is obtained (Figure 5).
次に、接続剤層１４を形成したICモジユール
１６をカード基材の凹部１５に装着した後、再び
鏡面に仕上げられた２枚の金属板に挟持せしめ、
温度100℃〜160℃（好ましくは140℃）、圧力は加
圧開始時から約５分（好ましくは２分）経過時ま
で毎分当り0.5Kg／cm2〜２Kg／cm2（好ましくは１
Kg／cm2）の加圧速度で加圧し、又は加熱加圧開始
時より２Kg／cm2〜５Kg／cm2（好ましくは３Kg／
cm2）の一定圧力で加圧し、30秒〜10分（好ましく
は２分）経過時に10Kg／cm2〜30Kg／cm2（好ましく
は25Kg／cm2）の圧力まで昇圧した上、10分〜30分
（好ましくは20分）加熱加圧し、その冷却後にIC
モジユール１０，１６の装着された積層シートを
得る。 Next, the IC module 16 with the connecting agent layer 14 formed thereon is mounted in the recess 15 of the card base material, and then sandwiched between two mirror-finished metal plates again.
The temperature is 100℃ to 160℃ (preferably 140℃), and the pressure is 0.5Kg/cm 2 to 2Kg /cm 2 (preferably 1Kg/cm 2 per minute from the start of pressurization until about 5 minutes (preferably 2 minutes) have elapsed).
Kg/cm 2 ), or at a pressure rate of 2 Kg/cm 2 to 5 Kg/cm 2 (preferably 3 Kg/cm 2 ) from the start of heating and pressing.
cm 2 ) at a constant pressure, and after 30 seconds to 10 minutes (preferably 2 minutes) have elapsed, increase the pressure to 10 Kg/cm 2 to 30 Kg/cm 2 (preferably 25 Kg/cm 2 ), and then pressurize for 10 minutes to Heat and pressurize for 30 minutes (preferably 20 minutes), and after cooling, IC
A laminated sheet with modules 10 and 16 attached is obtained.
このようにして得られた積層体をICモジユー
ル１０の電極部が正規の位置となるように、所望
する寸法の抜型を用いて打抜くことにより、第２
図及び第３図に示すようなICモジユール１０が
センターコア１１に密着したICカードを得るこ
とができる。なお、第２図の磁気ストライプ１７
は必要に応じて、例えば転写、コーテイング等で
設けても良い。 The thus obtained laminate is punched out using a cutting die of desired dimensions so that the electrode portion of the IC module 10 is in the correct position.
It is possible to obtain an IC card in which the IC module 10 is in close contact with the center core 11 as shown in FIGS. In addition, the magnetic stripe 17 in FIG.
may be provided by, for example, transfer, coating, etc., if necessary.
以上のようにこの発明の製造方法によれば、再
プレスを行なうことによりカード基材の熱的流動
性のためにICモジユールとカード基材の間に不
必要な空隙が生ぜず、カード基材表面とICモジ
ユール表面とが同一平面となるICカードを得る
ことができる。また、プレス時に前述したような
加圧加熱条件を採用することにより、ICモジユ
ールに不必要な負荷がかかることを防ぎ、ICモ
ジユールを破壊してしまうようなこともない。 As described above, according to the manufacturing method of the present invention, by performing re-pressing, unnecessary voids are not created between the IC module and the card base material due to the thermal fluidity of the card base material, and the card base material It is possible to obtain an IC card in which the front surface and the IC module surface are on the same plane. Furthermore, by employing the above-mentioned pressurizing and heating conditions during pressing, unnecessary loads are prevented from being applied to the IC module, and the IC module will not be destroyed.
さらに、加熱加圧接着方式の採用によつて接着
強度を強化し得ると共に、未硬化又は半硬化エポ
キシ感熱圧接着剤の使用を可能ならしめ、接着剤
の不必要な付着や接着剤の不足によるICモジユ
ールの脱落を防止できるといつた利点を有する。 Furthermore, by adopting a heat-pressure bonding method, the adhesive strength can be strengthened, and it is possible to use uncured or semi-cured epoxy heat-sensitive pressure adhesives, thereby eliminating unnecessary adhesion of adhesive or insufficient adhesive. It has the advantage of preventing the IC module from falling off.
なお、この発明においては、未硬化又は半硬化
エポキシ樹脂接着剤として、不織布等にエポキシ
系樹脂を含浸した後、未硬化又は半硬化状のフイ
ルムとした接着用フイルム（例えば3M社製ボン
デイングテープY582Aなど）を用いることによ
つて、加熱加圧プレスラミネート時の接着剤及び
カード基材の熱的流動を抑えることができ、カー
ド基材表面への接着剤の流出を防止することがで
きると共に、カード基材の歪みを抑えることも可
能となる。また、上述の実施例ではICモジユー
ルの形状を円板状としているが、任意の形状で良
い。 In this invention, as an uncured or semi-cured epoxy resin adhesive, an adhesive film (for example, bonding tape Y582A manufactured by 3M Company) is used as an uncured or semi-cured epoxy resin adhesive. etc.), it is possible to suppress the thermal flow of the adhesive and card base material during hot press lamination, and prevent the adhesive from flowing out onto the surface of the card base material. It is also possible to suppress distortion of the card base material. Further, in the above embodiment, the IC module has a disk shape, but it may have any shape.
第１図はこの発明に用いることができるICモ
ジユールの一例を示す断面構造図、第２図はこの
発明によるICカードの一例を示す外観図、第３
図はその−断面図、第４図はこの発明による
カード基材の凹部の形成の様子を示す断面構造
図、第５図はこの発明で用いるICモジユールの
一例を示す断面構造図である。
１……ガラスエポキシフイルム基板、２……電
極パターン、３……回路パターン、４……スルー
ホール、５……ICチツプ、６……電極、７……
導体、８……ポツテイング枠、９……エポキシ樹
脂、１０，１６……ICモジユール、１１……セ
ンターコア、１２……オーバーシート、１３……
絵柄、１４……接着剤。
FIG. 1 is a cross-sectional structural diagram showing an example of an IC module that can be used in the present invention, FIG. 2 is an external view showing an example of an IC card according to the present invention, and FIG.
4 is a cross-sectional structural diagram showing how the recesses are formed in a card base material according to the present invention, and FIG. 5 is a cross-sectional structural diagram showing an example of an IC module used in the present invention. 1... Glass epoxy film substrate, 2... Electrode pattern, 3... Circuit pattern, 4... Through hole, 5... IC chip, 6... Electrode, 7...
Conductor, 8... Potting frame, 9... Epoxy resin, 10, 16... IC module, 11... Center core, 12... Oversheet, 13...
Pattern, 14...Adhesive.
Claims (1)
ードの製造方法において、前記ICモジユールの
底面に感熱タイプ接着剤層を設けると共に、熱可
塑性カード基材の所望の位置に前記ICモジユー
ルに対応する大きさの凹部を形成し、この凹部に
前記ICモジユールを埋設した後、鏡面処理され
た金属板で挟持して加熱加圧を行ない、前記IC
モジユール及びカード基材を接着せしめると共
に、カード表面と前記ICモジユールの電極面と
がほぼ同一平面となるようにしたことを特徴とす
るICカードの製造方法。 ２ 前記ICモジユールの底面に設ける感熱タイ
プ接着剤層として、未硬化又は半硬化エポキシ樹
脂接着フイルムを使用した特許請求の範囲第１項
記載のICカードの製造方法。[Claims] 1. A method for manufacturing an IC card with a built-in or attached IC module, in which a heat-sensitive type adhesive layer is provided on the bottom surface of the IC module, and the IC module is attached to a desired position of a thermoplastic card base material. After forming a recess of a corresponding size and embedding the IC module in the recess, the IC module is sandwiched between mirror-treated metal plates and heated and pressurized.
1. A method for manufacturing an IC card, characterized in that a module and a card base material are bonded together, and the card surface and the electrode surface of the IC module are substantially on the same plane. 2. The method for manufacturing an IC card according to claim 1, wherein an uncured or semi-cured epoxy resin adhesive film is used as the heat-sensitive adhesive layer provided on the bottom surface of the IC module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57160220A JPS5948984A (en) | 1982-09-13 | 1982-09-13 | Method of producing ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57160220A JPS5948984A (en) | 1982-09-13 | 1982-09-13 | Method of producing ic card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948984A JPS5948984A (en) | 1984-03-21 |
| JPH0216234B2 true JPH0216234B2 (en) | 1990-04-16 |
Family
ID=15710316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57160220A Granted JPS5948984A (en) | 1982-09-13 | 1982-09-13 | Method of producing ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948984A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6913057B2 (en) | 2001-10-19 | 2005-07-05 | Nissei Plastic Industrial Co., Ltd. | IC-card manufacturing apparatus |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6175986A (en) * | 1984-09-21 | 1986-04-18 | Tokyo Jiki Insatsu Kk | Loading medium for integrated circuit element |
| JPS62201295A (en) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Integrated circuit card and manufacture thereof |
| JPS62201296A (en) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Integrated circuit card and manufacture thereof |
| JPH07123182B2 (en) * | 1986-05-20 | 1995-12-25 | 日立マクセル株式会社 | Semiconductor device |
| JP2562476B2 (en) * | 1987-06-11 | 1996-12-11 | 大日本印刷株式会社 | 1C card manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54145506A (en) * | 1978-05-08 | 1979-11-13 | Tokyo Jiki Insatsu Kk | Method of fabricating magnetic card |
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5580831A (en) * | 1978-12-11 | 1980-06-18 | Tokyo Jiki Insatsu Kk | Manufacture of magnetic card |
| JPS5752977A (en) * | 1980-08-07 | 1982-03-29 | Gao Ges Automation Org | Identifying card and method of producing same |
-
1982
- 1982-09-13 JP JP57160220A patent/JPS5948984A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54145506A (en) * | 1978-05-08 | 1979-11-13 | Tokyo Jiki Insatsu Kk | Method of fabricating magnetic card |
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5580831A (en) * | 1978-12-11 | 1980-06-18 | Tokyo Jiki Insatsu Kk | Manufacture of magnetic card |
| JPS5752977A (en) * | 1980-08-07 | 1982-03-29 | Gao Ges Automation Org | Identifying card and method of producing same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6913057B2 (en) | 2001-10-19 | 2005-07-05 | Nissei Plastic Industrial Co., Ltd. | IC-card manufacturing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948984A (en) | 1984-03-21 |
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