JP2010094933A - Laminated card, and method of manufacturing laminated card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated card and a method of manufacturing the laminated card allowing the use of a usual heating and pressing press and causing no camber even if the kind and thickness of front and rear resin films are different. <P>SOLUTION: The laminated card has the printed front resin film and rear resin film laminated through an adhesive layer. Each of the front resin film and rear resin film has heat resistance higher than the temperature applied for lamination, and the front resin film and rear resin film are laminated in a state of at least one of thickness and material being different. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laminated card that does not warp even if the types and thicknesses of the front and back resin films are different, and a method for producing the laminated card.

In recent years, cards equipped with magnetic recording units and IC modules have been used as bank cards, credit cards, membership cards, employee ID cards, and the like.
Further, in the field centering on vehicles such as railways and buses in Japan, non-contact type IC cards that read and write data without contact are used.
For such a card, an “IC card manufacturing method” that can be manufactured at low cost is provided (for example, see Patent Document 1).

JP 2000-148959 A

The “IC card manufacturing method” described in Patent Document 1 is the “IC card manufacturing method in which an intermediate sheet on which an IC module is placed or embedded is interposed between a top sheet and a back sheet. The intermediate sheet and the front and back sheets are pressure-bonded using a reactive polyurethane hot melt resin under reduced pressure, and the press-bonding between the intermediate sheet and the front and back sheets is performed under reduced pressure (20 mmHg or less) at room temperature to 150 ° C., 0-30 kgf / It is performed under the conditions of cm ² ”.

The “IC card manufacturing method” described in Patent Document 1 has a drawback that the apparatus becomes extremely special because pressure is reduced in a heated state, and a great deal of cost is required for depreciation of the apparatus.
Therefore, the present invention has an object to provide a laminated card in which a normal heating and pressing press can be used and warpage does not occur even if the types and thicknesses of the front and back resin films are different, and a method for producing the laminated card. It is.

  In order to achieve the above object, a first aspect of the laminated card of the present invention is a laminated card in which a printed resin film for front and a resin film for back are laminated via an adhesive layer. The front resin film and the back resin film both have heat resistance higher than the temperature applied for lamination, and the front resin film and the back resin film At least one of them is laminated in a different state.

  The second aspect is characterized in that, in the first aspect, the adhesive layer includes an IC chip and an antenna electrically connected to the IC chip.

  The third aspect is characterized in that, in the first aspect, a magnetic recording portion is formed on either the front resin film or the back resin film.

  The fourth aspect is a method for producing a laminated card according to any one of the first aspect to the third aspect, wherein the card is laminated at 90 to 100 degrees Celsius with the front resin film and the back resin. A film and an adhesive layer are laminated.

  The fifth aspect is a method for producing a laminated card according to any one of the first to third aspects, wherein the front resin film and the back resin film are printed, and the magnetic recording portion is formed. Is performed in the manufacturing process before the stacking process.

  By using the laminated card and laminated card manufacturing method of the present invention, the front resin film and the back resin film are both resin films having heat resistance higher than the temperature applied for lamination. Material can be selected without any restrictions. In addition, by adjusting the amount of adhesive used in the adhesive layer, the IC chip and the antenna are contained, and a laminated card such as a non-contact IC card or magnetic recording card having a predetermined thickness and no warpage is finished. Can do.

Hereinafter, an example of a laminated card and a method for producing the laminated card will be described with reference to the drawings.
FIG. 1 is a sectional view of a card for explaining an IC card which is a laminated card of the present embodiment, and FIG. 2 is an enlarged view of a part A in FIG. 1, and a diagram for explaining an IC chip mounting part in detail. FIG. 3 is a cross-sectional view of a card for explaining another example of the laminated card of the present embodiment. FIG. 4 is a non-contact type in which an IC module part is embedded in the adhesive layer of the laminated card of the present embodiment. It is a figure for demonstrating an example of an IC card.

With reference to FIG. 1, an example of the laminated card of this embodiment will be described.
In the laminated card 100 of the present embodiment, the front resin film 1 and the back resin film 2 are laminated via an adhesive layer 3.
A surface printing portion 11 is formed on the exposed surface of the front resin film 1 or the surface on the adhesive layer side. Further, a back printed portion 21 is formed on the exposed surface of the back resin film 2 or the surface on the adhesive layer side.
If the front resin film 1 and the back resin film 2 are transparent films, the respective printing parts (the front surface printing part 11 and the back surface printing part 21) may be surfaces on the adhesive layer side. If the resin film 1 and the back resin film 2 are opaque films, the respective printing parts (the front surface printing part 11 and the back surface printing part 21) must be on the outermost surface side.
The printing unit may be any of those printed directly by a screen printing method, an offset printing method, or the like, or those obtained by thermal transfer of those printed by these methods.

Both the front resin film 1 and the back resin film 2 have higher heat resistance than the temperature applied for lamination. For example, if the temperature applied for lamination is 90 degrees Celsius, it has a heat resistance higher than 90 degrees, and if the temperature added for lamination is 100 degrees Celsius, it has a heat resistance higher than 100 degrees Celsius. is doing.
Under the conditions described above, the front resin film 1 and the back resin film 2 can be made of different materials, for example, when the thickness is the same. The front resin film 1 and the back resin film 2 may have different thicknesses when the materials are the same. Also, different materials and different thicknesses can be used.

That is, under the above-described conditions, in the laminated card according to the present embodiment, it is not necessary to dispose a material having the same material and thickness above and below (or front and back) the center of the card as in the prior art. . As a result, it has been usual to select the same material and the same thickness for the front and back of the card, and the front resin film and the back resin film are both laminated. By using a resin film having heat resistance higher than the temperature applied to the material, the material can be selected without being restricted by the material and thickness as described above.
Further, the above-mentioned laminated card can be applied to a non-contact type IC card, and the IC card and the antenna are contained by adjusting the amount of adhesive used, and the non-warped non-curved card is included. A contact IC card can be finished.

In FIG. 1, the front resin film 1 and the back resin film 2 are illustrated as a single film, but the front resin film 1 and the back resin film 2 may be a plurality of laminated films. For example, the front resin film 1 and the back resin film 2 can also be configured by laminating a film whose outermost surface is a transparent film and whose inside is opaque. In this case, printing may be performed on either side.
In the case of a credit card, the total thickness of the laminated card 100 is adjusted to the thickness specified in ISO 7810 to 7813 by adjusting the thickness of the film used and the thickness of the adhesive layer 3 described above.

In the example of the embodiment shown in FIG. 1, the adhesive layer 3 includes an IC module 4 for a non-contact type IC card.
The above-described IC module 4 has the antenna 6 formed on one side of the IC module base material 40 (can be used by being formed on both sides), and the IC chip 5 is mounted on any surface of the IC module base material 40. It is placed. Although not shown, the start and end of the antenna 6 are electrically connected to a terminal formed on the IC chip 5 by a metal wire or by solder or the like.
The IC chip 5 (along with a metal wire when connected by a metal wire) is protected by a sealing resin and embedded in the laminated card.
In a state where the above-described IC module 4 is embedded in the adhesive layer 3, the IC module base 40 of the IC module 4 included therein may be cut off with the same size as the laminated card.

Here, an example of a method for producing the laminated card 100 will be described with reference to FIG.
First, the front resin film 1 and the back resin film 2 in a multi-faceted state of the laminated card 100 on which the card design and characters are printed are prepared.
An adhesive layer 3 is formed with a predetermined thickness on one side of the back resin film 2.
The IC module 4 on which the antenna 6 and the IC chip 5 are formed is placed on the upper part, and bonded together while heating so as to cover the adhesive layer 3 containing the IC module 4 with the front resin film 1 prepared in advance. .
When covering the adhesive resin layer 3 containing the front resin film 1 and the IC module 4, gradually cool it in a pressurized state so that no air remains between the front resin film 1 and the adhesive layer 3. .
When a punching die is used and punched to the size of the card, a laminated card 100 including the IC module 4 as shown in FIG. 1 is completed.

The IC chip mounting portion will be described in detail with reference to FIG. 4 and FIG.
As described with reference to FIG. 1, the IC module 4 has the antenna 6 on one side or both sides of the IC module base material 40 (in the following description, the antenna is described as an example formed on one side of the IC module base material 40). The IC chip 5 is placed on the surface of the IC module base 40 on which the antenna 6 is formed. Although not shown, the start and end of the antenna are electrically connected to terminals formed on the IC chip 5 by metal wires, or by soldering or the like.
In many cases, the IC chip 5 is protected by the sealing resin 91 (along with the metal wire if connected by a metal wire) and embedded in the laminated card 100.

FIG. 2 shows an example in which the IC chip 5 is reinforced by sandwiching it from above and below with a thin metal reinforcing plate 8 so that the IC chip 5 is not broken when an impact is applied from the outside of the laminated card. .
The IC chip 5 may be embedded without being reinforced. In that case, the IC chip 5 is embedded between the adhesives 3 in a state of being sealed with the sealing resin 91.
The IC chip 5 is fixed by an adhesive 9 on an antenna base 60 (an isolated pedestal on the extension of the antenna) formed on the IC module base 40, and a metal such as aluminum or gold is not shown. A terminal formed on the upper part of the IC chip with a wire is electrically connected to the start and end of the antenna.
When connecting the terminal of the IC chip and the start and end of the antenna without using wires as described above, the IC chip is mounted so that the connection terminal of the IC chip is on the surface side of the IC module base 40, as shown in FIG. In addition, the antenna is directly bonded to the start and end extensions of the antenna by soldering or the like.

After the terminals of the IC chip 5 and the start and end of the antenna are electrically connected, the IC chip 5 is firmly fixed on the antenna base 60 (or the direct IC module base 40) by the sealing resin 91. Fixed.
A reinforcing plate 8 larger than the IC chip is directly attached to the upper portion of the sealing resin and the remaining one is directly attached to the back surface of the IC module base material 40 with an adhesive 9 so as to sandwich the IC chip 5.
The IC module 4 to which the reinforcing plate 8 is attached is embedded in the adhesive layer 3 and is sandwiched and laminated between the front resin film 1 and the back resin film 2.

With reference to FIG. 3, another example of the laminated card of the present embodiment will be described.
The example shown in FIG. 3 shows an example of a laminated card 1000 in which the magnetic recording portion 7 is formed on the exposed surface of the back resin film 2.
As described in FIG. 1, a surface printing portion (not shown) is formed on the exposed surface of the front resin film 1 or the surface on the adhesive layer side. Moreover, the back surface printing part (not shown) is formed in the surface of the resin film 2 for backs, or the surface at the side of an adhesive bond layer.
If the front resin film 1 and the back resin film 2 are transparent films, the respective printed portions may be surfaces on the adhesive layer side, but the front resin film 1 and the back resin film 2 are opaque. If it is a good film, each printed part must be on the exposed side.

As described with reference to FIG. 1, the front resin film 1 and the back resin film 2 both have a heat resistance higher than the temperature applied for lamination, 90 degrees Celsius or 100 degrees.
When the thickness is the same as the front resin film 1 and the back resin film 2 under the above-mentioned conditions, different materials can be used. When the back resin film 2 is made of the same material, different thicknesses can be used. Also, different materials and different thicknesses can be used.

The magnetic recording portion 7 is formed on the exposed surface of the printed back resin film 2 and heated and pressed by a flat pressure press so that the surface of the magnetic recording portion 7 and the exposed surface of the back resin film 2 are the same surface. To do.
As described with reference to FIG. 1, the adhesive layer 3 is formed with a predetermined thickness on one side of the back resin film 2.
The front resin film 1 is laminated so as to cover the adhesive layer 3 while heating.
When the front resin film 1 and the adhesive layer 3 are coated, the front resin film 1 and the adhesive layer 3 are gradually cooled in a pressurized state so that no air remains between them.
When a punching die is used and punched to the size of the card, a laminated card 1000 having a magnetic recording portion 7 as shown in FIG. 2 is completed.

With reference to FIG. 4, an example of a non-contact type IC card in which an IC module part is embedded in the adhesive layer of the laminated card of this embodiment will be described.
In the embodiment shown in FIG. 4, the upper part of the adhesive layer 3 and the front resin film 1 are removed from the IC module substrate 40 of the laminated card 100 shown in FIG. The antenna 6 and the IC chip 5 are exposed and developed in a planar shape.
The IC chip 5 is fixed on the IC module base material 40 with an adhesive 9, and although not shown, a terminal formed on the top of the IC chip with a metal wire such as aluminum or gold is electrically connected to the start and end of the antenna. It is connected to the. As described above, when connecting the IC chip terminal to the antenna start and end without using wires, the IC chip connection terminal is mounted on the surface of the IC module base 40, and the antenna start and end are connected. Connect the extension part directly with solder.
As described with reference to FIG. 2, the IC chip 5 may be protected with a sealing resin and further reinforced with a reinforcing plate.

Referring to FIG. 2, when the material used in the laminated card (non-contact type IC card) of the present embodiment is changed as in the following first to fifth examples, the card standard is used. It is verified whether or not the above is satisfied.
The IC chip 5 is verified as being formed on the antenna substrate 60 as described above.
Further, in each of the following examples, “820 μm”, which is slightly thinner than “upper limit value 840 μm of thickness defined by ISO”, is set as an upper limit value and verified.
(First embodiment) IC module substrate 40: 25 μm, antenna substrate 60: 25 μm including 10 μm adhesive, IC chip 5: 80 μm including 10 μm fixing adhesive, and the total thickness is 130 μm.
For example, if each of the front resin film 1 and the back resin film 2 is 100 μm, the adhesive layer 3 can be set to about 620 μm, so that the IC module 130 μm can be comfortably included in the adhesive layer.
(Second embodiment) IC module substrate 40: 50 μm, antenna substrate 60: 25 μm including adhesive, IC chip 5: 160 μm including 10 μm fixing adhesive, and the total thickness is 235 μm.
For example, if each of the front resin film 1 and the back resin film 2 is 100 μm, the adhesive layer 3 can be set to about 620 μm, so that the IC module 235 μm can be comfortably included in the adhesive layer.
(Third embodiment) In the first embodiment and the second embodiment, for example, if the front resin film 1 and the back resin film 2 are each 150 μm, the adhesive layer 3 can be set to about 520 μm. The IC module can be comfortably included in the adhesive layer.
(Fourth embodiment) In the first embodiment and the second embodiment, for example, 125 μm for the front resin film 1 and 188 μm for the back resin film 2 (or 188 μm for the front resin film 1 and back When a commercially available film of 125 μm) is used for the resin film 2, the adhesive layer 3 can be set to about 507 μm, so that an IC module having a thickness of 130 to 235 μm can be comfortably included in the adhesive layer.
(Fifth embodiment) In the second embodiment, when the sealing resin and the reinforcing plate are incorporated in the IC module, the IC module substrate 40: 50 μm, the antenna substrate 60: 25 μm including the adhesive, the sealing resin IC chip part sealed at 91: 300 μm (including fixing adhesive), reinforcing plate 110 μm (including two stainless steel reinforcing plates 50 μm, and fixing adhesive on the back side of the IC module substrate 40), the total thickness is 485 μm. If the material of the front resin film 1 is 125 μm, the back resin film 1 is 188 μm (or the front resin film 1 is 188 μm and the back resin film 2 is 125 μm), the adhesive layer 3 is about 507 μm. Since it can be set, an IC module having a thickness of 485 μm can be included in the adhesive layer.

Next, materials used for the laminated card will be described with reference to FIGS.
First, as a material used for the front resin film 1 and the back resin film 2, a resin having a heat resistance of 100 degrees Celsius or higher, including 90 degrees Celsius or higher, for example, high density polyethylene, polypropylene, polyethylene terephthalate (PET ), Polyvinylidene chloride, polycarbonate, polyamide, polyacetal, polybutylene terephthalate, AS resin, ABS resin, and the like.
The thickness is selected from commercially available 50 to 188 μm, and the total thickness with the adhesive layer 3 is designed to be a predetermined thickness (for example, a thickness defined in ISO 7810 to 7813).

Next, the material used for the adhesive layer 3 will be described.
A hot melt adhesive is used for the adhesive layer 3. For example, the hot melt adhesive is selected from those having a characteristic of being once melted and then remelted by reheating.
Examples of the above-mentioned hot melt adhesive include moisture curable and photo curable reactive hot melt adhesives. Preferably, a moisture curable hot melt is used. The moisture curing type reactive hot melt adhesive is selected from, for example, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., TE030 or TE100 manufactured by Sumitomo 3M, and the like.

The antenna 6 of the IC module 4 performs a bridge process by patterning an insulating plate on which a commercially available copper foil or aluminum foil is attached by etching.
A commercially available epoxy resin is used for the sealing resin 91. Commercially available adhesives or adhesives are used for the adhesive 9 for fixing the IC chip and the adhesive 9 for fixing the reinforcing plate.
Further, as the reinforcing plate 8, a commercially available stainless steel plate is punched into a predetermined size and used.

  In addition, as a printing ink for printing on the front and back resin films, a commercially available UV curable offset ink is used. The magnetic material used for the magnetic recording part is a commercially available magnetic ink or a transfer type tape.

  It can be used for cards specified in ISO 7810 to 7813 such as bank cards, credit cards, membership cards, employee ID cards, and non-contact type IC cards used in fields such as buses.

It is sectional drawing of the card | curd for demonstrating the IC card which is the lamination | stacking card | curd of this embodiment. It is an enlarged view of the A section of FIG. 1, and is a figure for demonstrating in detail about an IC chip mounting part. It is sectional drawing of the card | curd for demonstrating another example of the lamination | stacking card | curd of this embodiment. It is a figure for demonstrating an example of the non-contact-type IC card by which the IC module part was embedded in the adhesive bond layer of the lamination | stacking card | curd of this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Front resin film 2 Back resin film 3,9 Adhesive, adhesive layer 4 IC module 5 IC chip 6 Antenna 7 Magnetic recording part 8 Reinforcement plate 11 Front surface printing part 21 Back surface printing part 40 IC module base material 60 Antenna base Material 91 Sealing resin 100,1000 Laminated card

Claims (5)

A laminated card in which a front resin film and a back resin film subjected to printing are laminated via an adhesive layer,
Both the front resin film and the back resin film have heat resistance higher than the temperature applied for lamination,
The laminated card, wherein the front resin film and the back resin film are laminated in a state where at least one of thickness and material is different. The laminated card according to claim 1,
A laminated card comprising an adhesive layer containing an IC chip and an antenna electrically connected to the IC chip. The laminated card according to claim 1,
1. A laminated card, wherein a magnetic recording portion is formed on either the front resin film or the back resin film. A method for producing a laminated card according to any one of claims 1 to 3,
The method for producing a laminated card is characterized in that the card is laminated at 90 to 100 degrees Celsius by laminating a front resin film, a back resin film, and an adhesive layer. A method for producing a laminated card according to any one of claims 1 to 3,
A method for producing a laminated card, wherein the printing of the front resin film and the back resin film and the formation of the magnetic recording portion are performed in a production process prior to the lamination process.

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