JP2000182018A - Manufacture of heat resistant ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an IC card for forming a recessed part for loading an IC module on a heat resistant card base smoothly and with high accuracy. SOLUTION: A process for manufacturing the card base with a surface sheet on which a loading position of an IC module is indicated, a process for punching the outer contour shape of the IC module on the surface of the card base by pressing a cutting die 21 on the IC module loading part, a process for removing the surface sheet by cutting the inside of the punched outer counter shape by a cutting tool 31 and for cutting the IC module to depth in which the IC module is loaded, a process for applying or temporarily placing adhesive agent on the IC module loading part and a process for fixing the IC module on the card base by applying heat pressure after loading the IC module on the adhesive agent are included in the manufacturing method of the IC card for loading the IC module by cutting and forming the recessed part 18 for loading the IC module on the heat resistant card base, a process for manufacturing the card base with a surface sheet to indicate a position of an IC module loading part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card, and more particularly to a method for punching a card base material having high heat resistance, which is apt to cause material destruction at the time of cutting in a card manufacturing process. The present invention relates to a technology for manufacturing a heat-resistant IC card in which a recess for mounting an IC module is formed by using a cutting machine and an NC processing machine.

[0002]

2. Description of the Related Art A contact type IC card which performs data communication through a connection terminal, a function of a contact type IC card, and a non-contact type IC
In the production of a contact-type non-contact type shared IC card (hereinafter also referred to as a “combi card”) using an IC chip having the functions of a card in one IC chip (hereinafter also referred to as a “combi chip”), a coil and a coil are used. Method 1 (Fig. 6) for laminating an IC-mounted board with connection terminals integrated with a base material such as vinyl chloride to produce a card, or fabricating a card board with antenna coils and coil connection terminals embedded therein, The mounting part is cut with an NC machine or the like, and the coil connection terminals are exposed.
A method 2 (FIG. 7) for connecting the connection terminals provided in the OT, COB) and the coil connection terminals to form a card is used.

The above-mentioned conventional method will be described in further detail by taking a combination card as an example. FIG. 6 is a diagram illustrating a conventional IC card manufacturing method (method 1), and FIG. 7 is a diagram illustrating another conventional IC card manufacturing method (method 2). In the case of the method 1, as shown in FIG. 6A, first, the IC module 51, the antenna coil 53, and the antenna coil connection terminal 5
An IC module-mounted board 521 on which the IC module 4 is integrated is prepared, and the board is laminated with a core sheet 522 in which an opening 58 for mounting an IC is formed, and oversheets 523 and 524 for protecting the core sheet. Then, with or without the use of an adhesive, a press machine is used to form an integrated card base 52 by applying pressure and heating (FIG. 6B). in this case,
When the antenna coil 53 is provided, the substrate 52 is formed by photoetching or screen printing using conductive ink.
1 and is connected to the IC module 51 in advance. Further, the external device connection terminal 512 is exposed from an opening 59 formed in advance in the oversheet 523 so that data communication with the external device can be performed.
FIG. 6B is a sectional view of the completed card.
(C) is the same top view. The external connection device connection terminal 512 appears on the card surface, but the antenna coil 53 does not appear on the card surface.

In the case of method 2, as shown in FIG. 7A, first, an antenna coil 63 and an antenna coil connection terminal 64 are connected.
Is prepared, the oversheets 623 and 624 are laminated on the center core sheet 621, and are manufactured on an integrated card substrate with or without an adhesive (FIG. 7B). Thereafter, the concave portion 68 in which the IC module 61 is to be loaded is cut by counterbore processing, NC processing, or the like to expose the antenna coil connection terminal 64 in the card base (FIG. 7C). Next, the connection terminals 614 provided on the IC chip mounting board and the antenna coil connection terminals 64 on the base side are connected with a conductive adhesive such as solder, and an insulating adhesive is applied to the bonding area other than the connection terminal portions. And then IC
The module 61 is loaded, connected and bonded to produce a combination card (FIG. 7D). FIG. 7E is a plan view of the completed card. The external device connection terminals 612 appear on the card surface, but the antenna coil 63 does not appear on the card surface.

However, in the case of the above method 1, since the IC is mounted and then formed into a card by a hot press, the IC is likely to malfunction due to a physical load applied during card processing, and the reliability and yield are poor. There is a problem.
In addition, when a defect such as the appearance of a card other than the function of the IC occurs, the defect causes a waste including the IC, resulting in an extra cost corresponding to the cost. Further, in the case of the above method 2, since the IC module mounting concave portion is carved by NC cutting on the card base material, a base material having a certain elasticity and hardness such as vinyl chloride or PET-G is used. The material can be processed, but in the case of heat-resistant, hard and brittle resin such as biaxially stretched polyethylene terephthalate (PET) resin or glass epoxy resin sheet, good burrs and tears occur with the rotation of the drill. There is a problem that a complicated cutting process cannot be performed. On the other hand, in the case of vinyl chloride, the heat resistance is 60.
About 70 ° C., which is not suitable for applications where high heat resistance of 100 ° C. or more is required.

[0006]

Therefore, in the present invention,
The purpose of the present invention is to provide a manufacturing method for processing a concave portion for mounting an IC module with high precision and easily on a card base material having a heat resistance of about 100 ° C., and generally hard and easily broken and difficult to cut. is there.

[0007]

The first aspect of the present invention to solve the above-mentioned problems is to manufacture an IC card in which an IC module is mounted by cutting and forming an IC module mounting recess in a heat-resistant card base. In the method, a step of producing a card base having a surface sheet indicating the position of the IC module mounting section, a step of pressing a punching die against the IC module mounting section and punching the outer contour shape of the IC module on the surface of the card base, A step of cutting the inside of the contour shape with a cutting tool to remove a surface sheet and cutting to a depth at which an IC module can be mounted; a step of applying an adhesive to an IC module mounting portion or temporarily placing an adhesive sheet; After placing the IC module on the agent,
Fixing the IC module to the card base by applying heat and pressure. With this manufacturing method, the concave portion for mounting the IC module can be formed with high accuracy even on a heat-resistant base material that is difficult to cut.

A second aspect of the present invention is a method of manufacturing an IC card for mounting an IC module by cutting and forming an IC module mounting recess in a heat-resistant card base.
The process of producing a card base by press lamination using an adhesive or resin that can cut the surface sheet indicating the position of the module mounting part, and pressing the punching die against the IC module mounting part to outline the IC module on the surface of the card base A step of punching out the shape, a step of cutting the inside of the die-cut outer contour shape with a cutting tool to remove a surface sheet and cutting to a depth at which an IC module can be mounted;
A step of applying an adhesive or temporarily placing an adhesive sheet on the C module mounting portion, and a step of mounting the IC module on the adhesive and then applying heat and pressure to fix the IC module to the card base. A method for manufacturing a heat-resistant IC card. With this manufacturing method, the concave portion for mounting the IC module can be formed with high accuracy even on a heat-resistant base material that is difficult to cut.

A third aspect of the present invention is a method of manufacturing an IC card for mounting an IC module by cutting and forming an IC module mounting recess in a heat-resistant card base.
Press laminating three or more heat-resistant sheets including a surface sheet indicating the position of the module mounting part to produce a card base, at least two or more punching steps to form a contour shape on which an IC module can be mounted, and a die-cut outer shape A step of removing the top sheet by cutting the inside of the contour shape with a cutting tool, a step of applying an adhesive to the IC module mounting portion or temporarily placing the adhesive sheet, after placing the IC module on the adhesive, Fixing the IC module to the card base by applying heat and pressure. Because of this manufacturing method, even for a heat-resistant base material that is difficult to cut,
The concave portion for mounting the C module can be formed with high precision.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing an IC card according to the present invention will be described below with reference to the drawings. FIG.
FIG. 3 is a diagram showing an example of a card base used in the method for manufacturing an IC card of the present invention. FIG. 2 is a diagram showing another example of a card base used in the method of manufacturing an IC card according to the present invention. FIG. 1 shows a normal contact IC card, and FIG. 2 shows a card base mainly used in a method of manufacturing a combination card. The appearance of a chain line around the card indicates that the antenna coil 13 exists inside the card.

In the case of the ordinary contact type IC card base shown in FIG. 1, first, a printing pattern 125 and a register mark 126 indicating a mounting position of the IC module are printed on a card surface material 122 or a core sheet 121 serving as an oversheet. I do. Before punching into a card size, it also has a punching register mark (not shown). The registration mark is printed on the outside of the card pattern.
Similarly, the combination card of FIG. 2 is prepared by printing a print pattern 125 and a register mark 126 indicating an IC module mounting position on a card surface material 122 or a core sheet 121 to be an oversheet. Further, the antenna coil 13 and the antenna coil connection terminal 14 are previously formed on the center core sheet 121, and are often formed by photoetching or screen printing.

1 and 2, the three-layer base sheet 12
1, 122, 123 are laminated to form an integrated card base 12
, But is not limited to three layers.
There may be five or five layers. In addition, since a heat-resistant card base material generally does not have self-fusing property, an interlayer is often used for bonding between layers. Various heat-resistant materials can be used for the card base material. For example, polyethylene terephthalate (PET) resin, polycarbonate resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin,
Polyacetal resin, bismaleimide triazine (B
T) Resin, epoxy resin, polyimide resin, glass epoxy resin and the like. In the case of an epoxy resin, it may be in a B stage (semi-cured) state. These are not limited to sheet-like laminates, but may be thermosetting resins injected and cured to form card bases.

FIG. 3 is a diagram showing a manufacturing process of the IC card of the present invention. After the card base 12 is prepared as described above (FIG. 3A), the cutting die 21 having the outer contour shape of the module substrate 111 is pressed against the IC module mounting portion to perform a half cut of the base material surface (FIG. 3). (B)). The positioning of the mounting portion is performed based on a register mark printed on the oversheet 122 in advance. Next, the inside of the rectangular outline 211 formed by half-cutting is cut to remove the hatched card base portion in FIG. To form Since the depth of the first concave portion 181 on which the module substrate 111 of the card base is placed needs to be a predetermined thickness in consideration of the thickness of the module substrate and the adhesive,
It is necessary to perform high-precision cutting by the numerically controlled NC processing device 31. The second recess 182 is further cut and formed to a depth where the mold resin portion of the IC module can be embedded in the first recess. The adhesive 19 is attached to the step of the first concave portion 181.
Is applied or the adhesive sheet is temporarily placed, and then the IC module 11 is placed, and the IC module is mounted by applying heat and pressure (FIG. 3D).

FIG. 4 is a diagram showing another manufacturing process of the IC card of the present invention. FIG. 4 mainly shows a manufacturing process for a combination card. First, a base material 121 on which the layout of the antenna coil 13 and the antenna coil connection terminals 14 are formed is prepared. The antenna coil connection terminal 14 is formed so as to face the IC module mounting portion for connecting both ends of the antenna coil and the IC module terminal.
These can be provided by photo-etching the core substrate on which the copper foil is stretched, or by printing a conductive ink or the like on the substrate. The core sheet 121 uses a heat-resistant material such as polyethylene terephthalate (PET) or glass epoxy resin.

The card sheets 12 are prepared by laminating the oversheets 122 and 123 (FIG. 4A). Next, the IC module mounting portion is half-cut with the punch 22 to provide a generally rectangular outline 221 (FIG. 4).
(B)). Further, a half-cut 211 of the base material is performed by pressing the punching die 21 having the outer contour shape of the molded resin part of the IC module 11 of the IC module mounting part (FIG. 4C). This half cut is quite deep to accommodate the mold resin part of the module,
This is performed so as not to penetrate the card base material. In the above case, the inner half cut is performed first, but either may be performed first. Further, in the case of a multilayer, two or more half cuts may be performed. Positioning of the mounting portion is performed based on register marks printed on the oversheet 122 in advance. The inside of the contour line 221 is cut to remove the hatched card base portion in FIG. 4D to form the IC module mounting recess 18. In the case of this manufacturing method, high-precision processing can be performed on PET or a glass epoxy substrate that is not suitable for cutting.

Also in the case of a combination card, the module mounting recess 18 is formed at two levels of depth, the first recess 181 is at a depth where the antenna coil 13 is exposed, and the second recess 182 is an IC.
The module is formed to a depth at which the mold resin portion can be embedded. The depth of the first concave portion also depends on I
It is necessary that the thickness be substantially equal to the thickness of the C module mounting board 111 or the like or the thickness of the oversheet 123. The cutting of the portion of the card base material on which the module substrate 111 is placed and the module fitting portion are desirably performed by the numerically controlled NC processing device 31. A conductive adhesive 20 such as a solder paste or a silver paste is applied to a step portion of the first concave portion 181 for mounting an IC module on which a module substrate is mounted, or an adhesive sheet is temporarily placed. The application area is divided into at least two areas so as not to cause a short circuit. If the conductive adhesive application area is wide, an insulating adhesive sheet may be attached to a portion other than the area. After the conductive adhesive is applied or the adhesive sheet is temporarily placed, the IC chip mounting substrate is placed, and the substrate is subjected to heat pressure (for example, 200 ° C., 30 ° C.).
Second) to bond the IC chip mounting board to the card base and connect the antenna coil. This is because, even in the case of a solder paste or the like, if heating is performed under these conditions, the solder is melted and connected, and becomes conductive.

FIG. 5 is an enlarged sectional view showing an IC module mounting portion of the combination card. As shown in FIG. 5, the first concave portion 181 has the antenna coil connection terminal 1 on the surface.
4 so that it is exposed. Since the thin adhesive layer 124 is adhered on the connection terminal 14, this layer is also cut so that the connection terminal 14 is exposed. This cutting is performed by cutting the base material thickness calculated in advance by the NC processing or the like from the card surface as described above. The second concave portion 182
The C module 11 is cut to a depth at which the mold resin 115 can be embedded. Next, the conductive adhesive 20 is applied onto the antenna coil connection terminals 14, and then the IC module is mounted and heated and pressed. As a result, as shown in FIG. 5, the antenna coil connection terminals 114 on the chip side and the antenna coil connection terminals 14 on the card base are connected via the conductive adhesive 20 to achieve conduction, and the IC module is connected to the card base. Can be fixed. Note that this cross-sectional view is a diagram showing only the terminal connection surface.
Card base and IC with C module bonding sheet
The module is glued.

As shown in FIG. 5, the chip-side antenna coil connection terminal 114 is connected to a pad of the IC chip 112 by a bonding wire 113. If there are other terminals, they are similarly connected to the terminal plate on the substrate front side by wire bonding, through holes, etc., but the details are omitted in FIG. After bonding
The IC chip 112 and the bonding wire 113 are covered and protected by a mold resin 115.

(Embodiment relating to other materials) The terminal board of the IC module is formed by attaching a copper foil to both sides of an insulating board made of polyimide, glass epoxy, BT resin or the like, and etching the board with a process such as etching. After drawing external device contact terminals on the front surface and wiring such as coil connection terminals on the rear surface, plating with nickel, copper, gold, or the like is performed.
An IC chip is mounted on this substrate, and bonding between the IC chip and connection wiring provided in the substrate is performed using gold wires or the like. Further, the periphery of the IC chip is sealed using an epoxy resin or the like. It is preferable that the metal material of the terminal connected to the antenna coil of the IC module and the metal material of the connection terminal of the antenna coil be the same material. This is because if the same material is used, the range of selection of the conductive adhesive material is widened, and a material that can be strongly bonded can be used. In general, a material obtained by plating a copper material with nickel under plating and gold plating is preferably used.

For bonding the IC module, a thermosetting type is used.
Various types of thermoplastic (hot melt) adhesives can be used, and adhesives, moisture-curable adhesives, adhesive sheets, cold glues, and the like may be used. For conductive adhesives,
As described above, a solder paste and a silver paste can be used, and a conductive adhesive sheet, an anisotropic conductive adhesive sheet, a foil-like metal solder, and the like can be used. The application of the adhesive or the temporary placement of the sheet may be on the connection terminal on the card substrate side or on the connection terminal on the IC chip side.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the IC of the present invention will be described according to specific embodiments.
A method for manufacturing a card will be described. The reference numerals given in the embodiments correspond to the reference numerals given in FIGS. Example 1 A 150 μm thick milk-white polyethylene terephthalate (PET) sheet (manufactured by Toray Industries, Inc.) that had been biaxially stretched was used as a front side oversheet 122 and a predetermined pattern 1 was used.
25 and a register mark indicating the IC module mounting position and the card size punching position were printed and prepared. Similarly, a biaxially stretched 150 μm thick milky white PET sheet (manufactured by Toray Industries, Inc.) was prepared as an oversheet 123 on the side opposite to the terminal substrate by performing predetermined printing. The printed surfaces of the two layers of the oversheets 122 and 123 are placed on the inner side, and are kept in parallel planes at an interval of 500 μm, and a thermosetting epoxy resin is poured between the sheets and left at room temperature. And cured. As a result, a card substrate 12 having a thickness of 800 μm in which the epoxy resin layer becomes the center core 121 was formed.

After punching out the card base into a card size based on the register mark, punching was performed with a punching die 21 so as to half-cut the outer shape of the terminal board at the IC module mounting position. This is performed by using a punching die (150 μm depth) having a rectangular shape with a contour of 13 × 11.8 mm and four corners having a radius of curvature of 2.5 mm with reference to the register mark. The punching was performed by pushing the punching die from the PET sheet side. Subsequently, the first concave portion 181 forming the bonding surface of the concave portion for mounting the module with the IC module substrate was cut to a uniform depth of 200 μm using a cutting machine controlled by NC. This cutting was performed on a portion having the same shape as the half-cutting die. Further, the center portion of the first concave portion is cut into an 8 × 8 mm square shape having a corner portion having the same radius of curvature by using a cutting machine so that the mold resin portion of the IC module can be loaded. Was formed. This depth is 600 μm
It was made to become.

On the other hand, an IC module was prepared by mounting and molding an IC chip on a glass epoxy substrate (size: 13 mm × 11.8 mm) having a thickness of 150 μm. A hot-melt adhesive sheet having a thickness of 50 μm, which was cut out in a ring shape, was adhered to the periphery to prepare. After the IC module to which the adhesive sheet has been attached is placed in the IC module mounting concave portion 18 formed by cutting first, the both sides of the card base are sandwiched between press plates, and hot-pressed (200 ° C., 30 ° C.).
Seconds) and the IC module was mounted. There was no tearing, cracking, or burrs of the substrate in the steps of die-cutting and cutting of the concave portion for mounting the IC module, the IC module could be stably mounted, and the appearance of the front and back surfaces was good.

Example 2 Biaxially stretched thickness 200 μm
A milky-white polyethylene terephthalate (PET) sheet (manufactured by Toray Industries, Inc.) was used as the front side oversheet 122, and a predetermined pattern 125 and a registration mark indicating an IC module mounting position and a card size punching position were printed and prepared. Similarly, a biaxially stretched 200 μm thick milky white PET sheet (manufactured by Toray Industries, Inc.) was prepared as an oversheet 123 on the side opposite to the terminal substrate by performing predetermined printing. The antenna coil 13 and the antenna coil connection terminal 14 are provided by a photo-etching technique on a sheet in which a copper sheet is adhered to a 300 μm-thick PET sheet (manufactured by Toray Industries, Inc.) as a core sheet.
The printing surface of 123 is set to the inner surface side, an adhesive is applied to the surface of the oversheet that is in contact with the core sheet, and the oversheet is laminated.
Heat and pressure (120 ° C., 5 minutes) were applied to unite. Thus, a card base 1 having a thickness of 800 μm and made of a PET base
2 was formed. Therefore, the thickness of the adhesive layer after drying is 5
This is about 0 μm.

After punching out this card base to a card size with reference to the register mark, a punching die 21 is formed so that the center of the IC module mounting position is half-cut.
Punching was performed. For this purpose, punching was performed with the punching die 22 so as to half-cut the outer shape of the terminal board shape at the IC module mounting position with reference to the register mark 126. The half-cut is performed by using a punching die (200 μm depth) having a rectangular shape with a contour of 13 × 11.8 mm and four corners with a radius of curvature of 2.5 mm.
The test was performed by pushing the die from the ET sheet side. Subsequently, the center portion of the first concave portion was cut into a rectangular shape having an outline of 8 × 8 mm and four corners were formed using a punching die (depth: 550 μm) having a radius of curvature of 2.5 mm. It was carried out in the form of pushing a punching die.

The first concave portion 181 forming the bonding surface of the concave portion for mounting the module with the IC module substrate was cut to a uniform depth of 250 μm using the NC processing device (cutting machine) 31. This cutting was performed on a portion having the same shape as the half-cutting die. Further, the central portion of the first recess is
In order to load the mold resin part of the C module, NC
The second concave portion 182 was formed by cutting with the processing device 31. This depth was set to be 600 μm.

On the other hand, an IC module 11 is prepared by mounting a common IC chip (combination chip) for contact and non-contact on a glass epoxy substrate (size 13 mm × 11.8 mm) having a thickness of 200 μm and molding the card module. 50 μm thick conductive adhesive sheet 2 cut in a semicircular shape around the mold resin on the surface in contact with the first concave portion
It was prepared by sticking pieces. IC with this adhesive sheet attached
After the module was mounted on the IC module mounting recessed portion 18 formed by cutting the module in advance, both sides of the card base were sandwiched between press plates, and the IC module was mounted by applying heat and pressure (200 ° C., 30 seconds). . There is no tearing, cracking or burrs of the substrate in the process of die cutting and cutting of the IC module mounting recess, and the IC module can be mounted stably.
The appearance of the front and back surfaces was also good.

[0028]

According to the method for manufacturing a heat-resistant IC card of the present invention, the concave portion for mounting the IC module is formed in advance by half-cutting with a punching die and then cutting the inside, so that the material is generally hard and brittle. Even for a heat-resistant base material that easily breaks, the concave portion can be cut smoothly and accurately. In addition, an IC card having high heat resistance can be manufactured with good appearance on the front and back surfaces.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of a card base used in the IC card manufacturing method of the present invention.

FIG. 2 is a view showing another example of a card base used in the IC card manufacturing method of the present invention.

FIG. 3 is a diagram showing a manufacturing process of the IC card of the present invention.

FIG. 4 is a diagram showing another manufacturing process of the IC card of the present invention.

FIG. 5 is an enlarged sectional view showing an IC module mounting portion of the combination card.

FIG. 6 is a diagram illustrating a conventional method for manufacturing an IC card.

FIG. 7 is a diagram illustrating another method of manufacturing a conventional IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 IC module 12 Card base 13 Antenna coil 14 Antenna coil connection terminal 18 IC module mounting concave part 19 Adhesive 20 Conductive adhesive 21 and 22 Cutting die 31 NC processing device 52 and 62 Card base 53 and 63 Antenna coil 54 and 64 Antenna coil connection terminal 58 IC module mounting opening 68 IC module mounting recess 515,615 Mold resin

Claims (4)

[Claims] An IC for mounting an IC module by cutting and forming an IC module mounting recess in a heat-resistant card base.
In the method for manufacturing a card, a step of producing a card base having a surface sheet indicating the position of the IC module mounting section, a step of pressing a punching die against the IC module mounting section and punching the outer contour shape of the IC module on the surface of the card base, a mold A step of cutting the inside of the extracted outer contour shape with a cutting tool to remove a surface sheet and cutting to a depth where an IC module can be mounted, a step of applying an adhesive to an IC module mounting portion or temporarily placing an adhesive sheet Mounting the IC module on the adhesive and applying heat and pressure to fix the IC module to the card base.
Manufacturing method of C card. 2. The method according to claim 1, further comprising the step of performing at least two or more punching steps for forming a contour shape on which the IC module can be mounted, and removing the punched sheet portion by numerically controlled cutting. A method for manufacturing a heat-resistant IC card according to claim 1. 3. An IC for mounting an IC module by cutting and forming an IC module mounting recess in a heat-resistant card base.
In the method for manufacturing a card, a step of producing a card base by press lamination using an adhesive or a resin capable of cutting a surface sheet indicating a position of an IC module mounting portion, and pressing a die into the IC module mounting portion to press the card base The step of punching the outer shape of the IC module on the surface, the step of cutting the inside of the cut outer shape with a cutting tool to remove the surface sheet and cutting to the depth where the IC module can be mounted. A step of applying an adhesive or temporarily placing an adhesive sheet, and a step of mounting the IC module on the adhesive and then applying heat and pressure to fix the IC module to the card base. Sex I
Manufacturing method of C card. 4. An IC for mounting an IC module by cutting and forming an IC module mounting recess in a heat-resistant card substrate.
In a method for manufacturing a card, a step of press-laminating three or more heat-resistant sheets including a surface sheet indicating an IC module mounting portion position to produce a card base, at least two or more times forming a contour shape on which an IC module can be mounted A punching step, a step of cutting the inside of the external shape by cutting with a cutting tool and removing a top sheet, a step of applying an adhesive to an IC module mounting portion or temporarily placing an adhesive sheet, and a step of mounting an IC on the adhesive. A method for manufacturing a heat-resistant IC card, comprising a step of applying heat and pressure to fix an IC module to a card base after mounting the module.