JP2002216094A - Method for manufacturing ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC card capable of highly precisely and easily working a recessed part for mounting an IC module even when using a card substrate which is made of generally hard and easily broken high heat-resistant raw materials, and therefore difficult to cut. SOLUTION: This method for manufacturing an IC card using a heat-resistant card substrate comprises a process for manufacturing a card substrate having a surface sheet expressing an IC module mounting part position, a process for half cutting the outline shape of an IC module on the surface of the card substrate at the IC module mounting part by a laser working machine 21, a process for removing the surface sheet by cutting the inside part of the removed outline shape by a cutting tool 31, and for cutting it deep enough for mounting the IC module, a process for applying or temporarily placing adhesive to the IC module mounting part, and a process for placing the IC module on the adhesive, and for fixing the IC module to the card substrate by applying a thermal pressure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC for forming a concave portion for mounting an IC module on a card base which is liable to be damaged during cutting in an IC card manufacturing process.
The present invention relates to a card manufacturing method.

[0002]

2. Description of the Related Art A contact type IC card which performs data communication through a connection terminal, a function of a contact type IC card, and a non-contact type IC card.
A contact type non-contact type shared IC card (hereinafter also referred to as a "combi card") using a contact type non-contact type shared IC chip (hereinafter also referred to as a "combi chip") having the functions of a C card in one IC chip. In the manufacture of the IC, a method of laminating an IC-mounted substrate on which a coil and a connection terminal are integrated with a base material such as vinyl chloride to form a card (hereinafter referred to as method 1) (FIG. 6), an antenna coil, A card substrate having coil connection terminals embedded therein is manufactured, and the IC mounting portion of the card substrate is cut with an NC machine or the like, and the coil connection terminals are exposed.
A method of connecting the connection terminals provided on the OT and COB) and the coil connection terminals to form a card (hereinafter referred to as method 2)
(FIG. 7) was used. Hereinafter, the above-mentioned conventional method will be described in more detail using a combination card as an example.

FIG. 6 is a diagram for explaining a conventional IC card manufacturing method (method 1). In the case of Method 1, FIG.
First, an IC in which the IC module 51, the antenna coil 53 and the antenna coil connection terminal 54 are integrated
A module-mounted board 521 is prepared, and the board is
Core sheet 522 having openings 58 for mounting ICs
And an oversheet 523 to further protect the core sheet
524 are laminated, and are pressed and heated by a press machine with or without an adhesive to form an integrated card base 52 (FIG. 6B).

Here, when the antenna coil 53 is provided, it is formed in a loop on the substrate 521 by photoetching or screen printing using conductive ink, and the connection to the IC module 51 is also made in advance. Further, the external device connection terminal 512 is exposed from an opening 59 formed in advance in the oversheet 523 so that data communication with the external device is possible. FIG. 6B is a sectional view of the completed card, and FIG. 6C is a plan view of the completed card. The external device connection terminal 512 appears on the card surface, but the antenna coil 53 does not appear on the card surface.

FIG. 7 is a diagram for explaining another method of manufacturing a conventional IC card (method 2). In the case of method 2, FIG.
(A) First, the center core sheet 6 on which the antenna coil 63 and the antenna coil connection terminal 64 are formed.
21 are prepared, and oversheets 623 and 624 are laminated thereon, and an integrated card substrate is manufactured with or without an adhesive (FIG. 7B). Thereafter, the concave portion 68 for mounting the IC module 61 into which the IC module 61 is to be mounted is cut using an NC machine or the like to perform spot facing, thereby exposing the antenna coil connection terminal 64 in the card base (FIG. 7).
(C)).

Next, the connection terminals 614 provided on the IC chip mounting board and the antenna coil connection terminals 64 on the base side are connected by solder or conductive adhesive, and an insulating adhesive is applied to the bonding area other than the connection terminal portions. After applying the agent, I
The C module 61 is loaded, connected, and bonded to produce a combination card (FIG. 7D). FIG. 7E is a plan view of the completed card, and shows external device connection terminals 612.
Appears on the card surface, but the antenna coil 63 does not appear on the card surface.

[0007]

However, in the case of the above-mentioned conventional method 1, since the IC is mounted and then formed into a card by a hot-press, a malfunction of the IC due to a physical load applied at the time of card processing occurs. There is a problem that the reliability and yield are easily generated. Further, even when a defect such as a card appearance other than the function of the IC occurs, the defect causes a waste including the IC, and there is a problem that extra cost is generated for the cost.

In the case of the conventional method 2, since the IC module mounting recess is formed in the card substrate by cutting, a material having a certain degree of elasticity and hardness, such as vinyl chloride or PET-G, is used. The processing of the card base using is easy. However, for example, 2
High heat resistance, such as an axially stretched polyethylene terephthalate (PET) resin or glass epoxy resin sheet, and hard and brittle resins cannot be cut well due to burrs and tears as the drill rotates. There was a problem. Further, in the case of vinyl chloride, which can be easily cut, the heat resistance temperature is about 60 to 70 ° C., and there is a problem that it is not suitable for applications requiring high heat resistance of 100 ° C. or more.

On the other hand, as a method for solving these problems, Japanese Patent Application Laid-Open No. 2000-182018 discloses a method in which a punch is used to provide a step of punching out the outer shape of an IC module on the surface of a card base in advance. A manufacturing method for manufacturing (method 3) has been proposed. However, this method 3
In the case of (1), there is a problem that it is necessary to manufacture a punching die according to the card. In addition, there is a problem that a plurality of punching dies need to be prepared and punching is performed a plurality of times.

Further, in any of the above-mentioned methods 1 to 3, when producing a combination card, a counterbore processing is performed by cutting with an NC processing machine or the like, and an antenna coil connection terminal in the card base is formed. 64 are exposed. In order to ensure that the antenna coil connection terminal 64 is exposed and that the cutting is not performed due to excessive cutting, it is necessary to control the cutting depth of the cutting with extremely high precision.
The dimensional accuracy of the card base must also be made high, and there is a problem that the unit price of the card becomes extremely high.

[0011] An object of the present invention is to easily and accurately process a concave portion for mounting an IC module even when using a card base which is generally hard and easily cracked and thus difficult to cut, such as a material having high heat resistance. To provide a method of manufacturing an IC card.

[0012]

The present invention solves the above-mentioned problems by the following means. In addition, in order to make it easy to understand, description is given with reference numerals corresponding to the embodiment of the present invention, but the present invention is not limited to this. That is, the invention of claim 1 is a method for manufacturing an IC card in which an IC module (11) is mounted by cutting and forming IC module mounting recesses (181, 182) in the card base (12). And a laser engraving step of engraving the outer shape of the IC module on the surface of the card substrate with a laser.
A cutting step of cutting the inside of the laser-engraved outer contour to form the IC module mounting recess in which the IC module can be mounted, and a mounting step of mounting the IC module in the IC module mounting recess. And a method of manufacturing an IC card having the following.

According to a second aspect of the present invention, there is provided an IC according to the first aspect.
In the method for manufacturing a card, the laser engraving step is performed at least to a depth penetrating an oversheet layer (122, 123) provided on the outermost surface of the card base (12). It is a manufacturing method.

[0014] The invention of claim 3 is claim 1 or claim 2.
3. The method for manufacturing an IC card according to claim 1, wherein the IC module (11) is a contact / contactless IC module capable of performing contact communication in which terminals make contact and communication and contactless communication in which contact is carried out without contact. The laser engraving step is a method of manufacturing an IC card, characterized by exposing a connection terminal (14) for connecting an antenna built in the card base to the IC module.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing an IC card according to the present invention will be described below with reference to the drawings. Figure 1
FIG. 3 is a diagram showing an example of a card base used in the method for manufacturing an IC card of the present invention. FIG. 2 is a diagram showing another example of a card base used in the method of manufacturing an IC card according to the present invention. FIG. 1 shows a normal contact IC card, and FIG. 2 shows a card base mainly used in a method of manufacturing a combination card. A broken line around the card indicates that the antenna coil 13 exists inside the card.

In the case of the ordinary contact type IC card base shown in FIG. 1, first, a print pattern 125 and a register mark 126 indicating a mounting position of the IC module are printed on a card surface material 122 or a core sheet 121 to be an oversheet. I do. Before punching into a card size, it also has a punching register mark (not shown). The registration mark is printed on the outside of the card pattern. Similarly, in the case of the combination card shown in FIG. 2, a print pattern 125 and a register mark 126 indicating an IC module mounting position are printed on the card surface material 122 or the core sheet 121 to be an oversheet, and are prepared. Further, the antenna coil 13 and the antenna coil connection terminal 14 are previously formed on the center core sheet 121, and are often formed by photoetching or screen printing.

In the case of FIGS. 1 and 2, the three-layer base material sheet 12 is used.
1, 122, 123 are laminated to form an integrated card base 12
, But is not limited to three layers.
There may be five or five layers. In general, since a heat-resistant base material does not have self-fusing properties, an interlayer is often used for bonding between layers. A variety of heat-resistant materials can be used for the base material used for the card. For example, polyethylene terephthalate (PET) resin, polycarbonate (PC) resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin, polyacetal resin, bismaleimide・
Examples include a triazine (BT) resin, an epoxy resin, a polyimide resin, and a glass epoxy resin. In the case of an epoxy resin, it may be in a B stage (semi-cured) state. These are not limited to sheet-like laminates, but may be thermosetting resins injected and cured to form card bases.

FIG. 3 is a diagram showing a manufacturing process of the IC card of the present invention. After the card base 12 is prepared as described above (FIG. 3A), the outer contour of the module substrate 111 is half-cut (engraved) on the IC module mounting portion by the laser processing machine 21 (laser). Engraving step) (FIG. 3 (B)). The alignment of the mounting part is, for example,
The registration is performed based on the register mark 126 printed and provided on the oversheet 122 in advance. The laser processing machine 21 is a PE
Several tens to several hundreds on plastic sheets such as T and PC
It is sufficient that a groove of about μm can be engraved, and a groove generally used for processing may be used. A small-sized carbon dioxide laser, YAG laser, or the like used for marking or cutting plastics is suitable.

Next, a cutting process is performed on an inner portion of the rectangular contour 211 formed by performing the half cut, and FIG.
The IC card mounting concave portion 18 is formed by removing the hatched card base portion shown in FIG. Since the depth of the first concave portion 181 on which the module substrate 111 of the card base is placed needs to be a predetermined thickness in consideration of the thickness of the module substrate and the adhesive, the numerically controlled NC processing device 31 It is necessary to perform high-precision cutting. The second concave portion 182 is further cut and formed to a depth at which the mold resin portion of the IC module can be embedded in the first concave portion 181. The adhesive 19 is applied to the step of the first concave portion 181 or the adhesive sheet is temporarily placed, and then the IC module 11 is placed.
Attach the IC module by applying heat and pressure (Fig. 3
(D)).

FIG. 4 is a diagram showing another manufacturing process of the IC card of the present invention. FIG. 4 mainly shows a manufacturing process for a combination card. First, a base material 121 on which the layout of the antenna coil 13 and the antenna coil connection terminals 14 are formed is prepared. The antenna coil connection terminal 14 is formed so as to face the IC module mounting portion for connecting both ends of the antenna coil and the IC module terminal.
These can be provided by photo-etching the core substrate on which the copper foil is stretched, or by printing a conductive ink or the like on the substrate. The core sheet 121 uses a heat-resistant material such as polyethylene terephthalate (PET) or glass epoxy resin.

The card sheets 12 are prepared by laminating the oversheets 122 and 123 (FIG. 4A). Next, the IC module mounting portion is half-cut by the laser processing machine 21 to provide a generally rectangular contour line 221 (laser engraving process-1) (FIG. 4B). here,
With respect to the portion where the antenna coil connection terminal 14 is provided, the laser processing machine 21
If the resin of No. 22 is completely removed, it is possible to prevent the overseat 122 from being left in a later cutting process or to cut off the antenna coil connection terminal 14, thereby improving the yield. In addition, the precision of the cutting process may be reduced, and the process can be performed efficiently.

Further, a half cut 211 is performed on the outer contour of the molded resin portion of the IC module 11 of the IC module mounting portion by the laser beam machine 21 (laser engraving step-2) (FIG. 4C). This half-cut is considerably deep to accommodate the mold resin portion of the module, but is performed so as not to penetrate the card base.

In the above case, the outer half cut is performed first, but either may be performed first. The positioning of the mounting portion is performed, for example, based on a register mark printed on the oversheet 122 in advance. This contour line 22
By cutting the inner portion of FIG. 1, the hatched card base portion in FIG. 4D is cut and removed to form the IC module mounting concave portion 18. In the case of this manufacturing method, PET, glass epoxy substrate, etc., which are not suitable for cutting,
High-precision processing is possible.

Also in the case of a combination card, the module mounting recess 18 is formed at two levels of depth, the first recess 181 is at a depth where the antenna coil 13 is exposed, and the second recess 182 is an IC.
The module is formed to a depth at which the mold resin portion can be embedded. The depth of the first concave portion also depends on I
It is necessary that the thickness be substantially equal to the thickness of the C module mounting board 111 or the like or the thickness of the oversheet 123. The cutting of the portion of the card base on which the module substrate 111 is placed and the module fitting portion is desirably performed by the NC processing device 31 which is similarly numerically controlled. The conductive adhesive 20 such as a solder paste or a silver paste is applied to the step portion of the first concave portion 181 for mounting an IC module on which the module substrate is mounted, or the adhesive sheet is temporarily placed. The application area is divided into at least two areas so as not to cause a short circuit. If the conductive adhesive application area is wide, an insulating adhesive sheet may be attached to a portion other than the area. After the conductive adhesive is applied or the adhesive sheet is temporarily placed, the IC chip mounting substrate is placed, and the substrate is subjected to heat pressure (for example, 200 ° C., 30
Second) to bond the IC chip mounting board to the card base and connect the antenna coil. This is because, even in the case of a solder paste or the like, if heating is performed under these conditions, the solder is melted and connected, and becomes conductive.

FIG. 5 is an enlarged sectional view showing an IC module mounting portion of the combination card. As shown in FIG. 5, the first concave portion 181 has the antenna coil connection terminal 1 on the surface.
4 or the oversheet 122 is completely removed by the laser beam machine 21. Since a thin adhesive layer 124 is adhered on the connection terminal 14, this layer is also removed by cutting or a laser processing machine 21 so that the connection terminal 14 is exposed. When this processing is performed by cutting, the base material thickness calculated in advance by the NC processing or the like is cut from the card surface as described above. On the other hand, in the case of using the laser processing machine 21, the processing may be performed with an output that can remove the resin and does not melt the antenna coil connection terminal 14.

The second concave portion 182 is cut to a depth where the mold resin 115 of the IC module 11 can be embedded. Next, a conductive adhesive 20 is placed on the antenna coil connection terminals 14.
Is applied, and an IC module is mounted and heated and pressed. As a result, as shown in FIG. 5, the antenna coil connection terminals 114 on the chip side and the antenna coil connection terminals 14 on the card base are connected via the conductive adhesive 20 to achieve conduction, and the IC module is connected to the card base. Can be fixed. Although this cross-sectional view shows only the terminal connection surface, the card base and the IC module are bonded by an IC module bonding sheet or the like except for the peripheral portions of the connection terminals.

As shown in FIG. 5, the chip-side antenna coil connection terminal 114 is connected to the pad of the IC chip 112 by a bonding wire 113. If there are other terminals, they are similarly connected to the terminal plate on the substrate front side by wire bonding, through holes, etc., but the details are omitted in FIG. After bonding
The IC chip 112 and the bonding wire 113 are covered and protected by a mold resin 115.

(Example relating to other materials) The terminal board of the IC module is made of polyimide, glass epoxy, B
After pasting copper foil on both surfaces of an insulating substrate such as T-resin, using a process such as etching on the substrate, drawing external device contact terminals on the front surface, and drawing wiring such as coil connection terminals on the back surface, Plating of nickel, copper, gold, etc. An IC chip is mounted on this substrate, and bonding between the IC chip and connection wiring provided in the substrate is performed using gold wires or the like. Further, the periphery of the IC chip is sealed using an epoxy resin or the like. It is preferable that the metal material of the terminal connected to the antenna coil of the IC module and the metal material of the connection terminal of the antenna coil be the same material. This is because if the same material is used, the range of selection of the conductive adhesive material is widened, and a material that can be strongly bonded can be used. In general, a material obtained by plating a copper material with nickel under plating and gold plating is preferably used.

Various adhesives of a thermosetting type or a thermoplastic (hot melt) type can be used for bonding the IC module. Examples of the adhesive include an adhesive, a moisture-curable adhesive, an adhesive sheet, and a cold glue. You may. As the conductive adhesive, a solder paste and a silver paste can be used as described above, and a conductive adhesive sheet, an anisotropic conductive adhesive sheet, a foil metal solder, and the like can be used. The application of the adhesive or the temporary placement of the sheet may be on the connection terminal on the card base side or on the connection terminal on the IC chip side.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the IC of the present invention will be described according to specific embodiments.
A method for manufacturing a card will be described. The reference numerals given in the embodiments correspond to the reference numerals given in FIGS. Example 1 A 150 μm thick milk-white polyethylene terephthalate (PET) sheet (manufactured by Toray Industries, Inc.) that had been biaxially stretched was used as a front side oversheet 122 and a predetermined pattern 1 was used.
25 and a register mark 126 indicating the IC module mounting position and the card size punching position were printed and prepared. Similarly, biaxially stretched milk white PET with a thickness of 150 μm
A sheet (manufactured by Toray Industries, Inc.) was prepared as an oversheet 123 on the side opposite to the terminal substrate by performing predetermined printing. The two layers of the oversheets 122 and 123 are placed in parallel planes at 500 μm intervals so that the printed surfaces are on the outside, and a thermosetting epoxy resin is poured between the sheets and left at room temperature. And cured. As a result, the thickness of the epoxy resin layer becomes 800 μm which becomes the center core 121.
m card bases 12 were formed.

After punching out the card base to a card size based on the register mark, engraving was performed by the laser processing machine 21 so as to half-cut the outer shape of the terminal board shape at the IC module mounting position. This includes
The outline is 13 × 11.8 based on the register mark 126.
4mm corner with a 2.5mm radius of curvature
, And laser engraving with a depth of 150 μm was performed from the surface PET sheet side. Subsequently, the first concave portion 181 forming the bonding surface of the concave portion for mounting the module with the IC module substrate was cut to a uniform depth of 200 μm using a cutting machine controlled by NC. This cutting was performed on a portion having the same shape as the half-cutting die.
Further, the center portion of the first concave portion is cut into an 8 × 8 mm square shape having a corner portion having the same radius of curvature by using a cutting machine so that the mold resin portion of the IC module can be loaded. Was formed. This depth is 600μ
m.

On the other hand, an IC module was prepared by mounting an IC chip on a glass epoxy substrate (size: 13 mm × 11.8 mm) having a thickness of 150 μm, and the mold resin of the surface of the IC module in contact with the first concave portion of the card base was prepared. A hot-melt adhesive sheet having a thickness of 50 μm, which was cut out in a ring shape, was adhered to the periphery to prepare. After the IC module to which the adhesive sheet has been attached is placed in the IC module mounting concave portion 18 formed by cutting first, the both sides of the card base are sandwiched between press plates, and hot-pressed (200 ° C., 30 ° C.).
Seconds) and the IC module was mounted. In the process of half-cutting and cutting the concave portion for mounting the IC module, the substrate did not tear, crack, or generate burrs, the IC module could be mounted stably, and the appearance of the front and back surfaces was good.

Example 2 Biaxially stretched thickness 200 μm
A milky white polyethylene terephthalate (PET) sheet (manufactured by Toray Industries, Inc.) was used as the front side oversheet 122, and a predetermined pattern 125 and a registration mark indicating an IC module mounting position and a card size punching position were printed and prepared. Similarly, a biaxially stretched 200 μm thick milky white PET sheet (manufactured by Toray Industries, Inc.) was prepared as an oversheet 123 on the side opposite to the terminal substrate by performing predetermined printing. An antenna coil 13 and an antenna coil connection terminal 14 are provided by a photo-etching technique on a sheet in which a 300 μm-thick PET sheet (manufactured by Toray Industries, Inc.) is pasted with a copper foil as a core sheet.
An adhesive was applied to the surface of the oversheet, which was in contact with the core sheet, and laminated. The sheet was integrated by applying heat and pressure (120 ° C., 5 minutes). As a result, the card base 12 having a thickness of 800 μm and made of a PET base
Was formed. Therefore, the thickness of the adhesive layer after drying is 50
This is about μm.

After punching out this card base to a card size with reference to the register mark, laser engraving was performed by a laser processing machine 21 so as to half-cut the center of the IC module mounting position. This was performed by half-cutting the outer shape of the terminal board at the IC module mounting position with reference to the register mark 126. The half cut is controlled so that the outline is a rectangular shape of 13 × 11.8 mm and the four corners have an outline with a radius of curvature of 2.5 mm.
I went from the ET sheet side. Subsequently, the central portion of the first concave portion is controlled so that the outline is a rectangular shape of 8 × 8 mm, and the four corners have an outline with a curvature radius of 2.5 mm.
Processing of 50 μm was performed from the surface PET sheet side.

The first concave portion 181 forming the bonding surface of the concave portion for mounting the module with the IC module substrate was cut to a uniform depth of 250 μm by using the NC processing device (cutting machine) 31. This cutting was performed on the same shape portion as the half cut. Further, the second concave portion 182 is formed by cutting the central portion of the first concave portion by the NC processing device 31 along the shape that has been previously cut half by using a cutting machine so that the mold resin portion of the IC module can be loaded. did. This depth was set to be 600 μm.

On the other hand, an IC chip (combination chip) mounted on a 200 μm thick glass epoxy substrate (size 13 mm × 11.8 mm) with a contactless and non-contact IC chip, and molded.
The module 11 was prepared, and two 50 μm-thick conductive adhesive sheets cut in a semicircular shape were adhered to the periphery of the mold resin on the surface of the IC module in contact with the first concave portion of the card base. After the IC module to which the adhesive sheet has been attached is placed in the IC module mounting recess 18 formed by cutting first, the both sides of the card base are sandwiched between press plates, and hot pressure (200 ° C., 30 seconds) is applied. The IC module was mounted. In the process of half-cutting and cutting the concave portion for mounting the IC module, the substrate did not tear, crack, or generate burrs, the IC module could be mounted stably, and the appearance of the front and back surfaces was good.

According to the present embodiment, before cutting the concave portion in which the IC module is to be embedded, half cutting is performed in advance by a laser processing machine. Also, the recess can be cut smoothly and accurately. In addition, an IC card having high heat resistance can be manufactured with good appearance on the front and back surfaces. Furthermore, when exposing the antenna coil connection terminal, processing can be performed simply and reliably by performing processing using a laser processing machine.

[0038]

As described in detail above, according to the first aspect of the present invention, since the laser engraving step of engraving the outer contour of the IC module on the surface of the card base by a laser is generally hard and brittle. It is possible to smoothly and accurately cut the concave portion even on a heat-resistant base material that easily causes cracks.

According to the second aspect of the present invention, since the laser engraving step is performed at least to a depth penetrating the oversheet layer provided on the outermost surface of the card base, the concave portion can be cut more smoothly and with higher precision. be able to.

According to the third aspect of the present invention, the IC module is a contact / non-contact type IC module. Since the laser engraving step exposes the connection terminals, the processing accuracy of the cutting step is not increased. In addition, the recess can be cut.

[Brief description of the drawings]

FIG. 1 is a view showing an example of a card base used in the IC card manufacturing method of the present invention.

FIG. 2 is a view showing another example of a card base used in the IC card manufacturing method of the present invention.

FIG. 3 is a diagram showing a manufacturing process of the IC card of the present invention.

FIG. 4 is a diagram showing another manufacturing process of the IC card of the present invention.

FIG. 5 is an enlarged sectional view showing an IC module mounting portion of the combination card.

FIG. 6 is a diagram illustrating a conventional method for manufacturing an IC card.

FIG. 7 is a diagram illustrating another method of manufacturing a conventional IC card.

[Explanation of symbols]

 Reference Signs List 11 IC module 12 Card base 13 Antenna coil 14 Antenna coil connection terminal 18 IC module mounting recess 19 Adhesive 20 Conductive adhesive 21 Laser processing machine 31 NC processing device 52, 62 Card base 53, 63 Antenna coil 54, 64 Antenna Coil connection terminal 58 IC module mounting opening 68 IC module mounting recess 515,615 Mold resin

Claims (3)

[Claims] 1. A method of manufacturing an IC card in which an IC module is mounted by cutting and forming an IC module mounting concave portion in a card base, wherein: a base manufacturing step of manufacturing the card base; A laser engraving step of engraving the surface of the card base with a laser, and a cutting step of cutting the inside of the laser-engraved outer contour to form the IC module mounting recess in which the IC module can be mounted. A mounting step of mounting the IC module in the recess for mounting the IC module. 2. The method for manufacturing an IC card according to claim 1, wherein the laser engraving step is performed at least to a depth penetrating an oversheet layer provided on the outermost surface of the card base. Of manufacturing an IC card. 3. The method for manufacturing an IC card according to claim 1, wherein the IC module performs contact communication in which terminals make contact and communication and non-contact communication in which contact does not contact. A method for producing an IC card, wherein the laser engraving step comprises exposing a connection terminal for connecting an antenna built in the card base to the IC module. .