JPH11353439A - Noncontact type ic card and its manufacture, and base body for noncontact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a noncontact type IC card which has an IC module and an antenna connection terminal securely connected and also has good card surface precision and its manufacturing method, and a base body for the IC card. SOLUTION: This noncontact type IC card which has an antenna 24 embedded in the card base body and also has the connection terminal 25 of the antenna 24 and an IC module terminal, mounted engaging a recessed part 22 formed in the card base body from outside the base body, connected together through a conductive material is characterized by that a resin layer 6 formed of a sheet constituting the card base body except the part between the terminals is interposed between the antenna connection terminal 25 and IC module 10. This IC card can be manufactured by spot facing the card base body so that part of the card base body is left as a thin layer on the antenna connection terminal after the card base body is formed by forming the antenna and antenna connection terminal on the core sheet of the card base body, and this IC card base body is characterized by that the thin-layer part is left.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC capable of transmitting and receiving data to and from an external device in a non-contact manner.
The present invention relates to a card, a method for manufacturing the card, and the IC card base. Especially, the antenna is sealed inside the IC card,
The present invention relates to a non-contact type IC card capable of securely joining an antenna terminal and a module contact in a plastic IC card designed to mount an IC module from the outside of the card, a method of manufacturing the same, and the like.

[0002]

2. Description of the Related Art In recent years, an IC using a semiconductor device has been developed from the viewpoint of improving data processing efficiency and security.
IC cards on which circuits are mounted have become widespread. Such IC cards include a contact type in which an external terminal is connected to a terminal of an external device to transmit and receive data, and a non-contact type in which an antenna is provided and which transmits and receives data to and from the external device by electromagnetic waves. Recently, the driving power of an IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card without a built-in battery is increasing. Furthermore, in the era of possessing a large number of cards, it has been required that a non-contact type IC card be provided with a contact type terminal board so that both functions can be used. And an IC chip functioning as a non-contact type IC card.

The IC module has a structure in which an IC chip having a microprocessor or memory function is mounted on a printed board, and the IC chip is covered with an epoxy resin or the like. The IC chip is formed thinly for embedding in a card, and its thickness is 150 to 300 μm.
It is about. Since it is thin in this way, it is likely to be damaged by external stress. On the other hand, non-contact IC cards are
There is a standard of 10536, the card thickness is 0.76mm
(± 10% is acceptable). Therefore, there is a manufacturing problem in that a fragile IC module is securely loaded in such a thin card base layer to ensure high reliability.

A conventional non-contact type IC card has, for example, a configuration in which an IC module including an IC chip and an antenna is incorporated between a front resin sheet and a back resin sheet. In the non-contact type IC card, in the manufacturing process, for example, the above-mentioned front and back resin sheets are heat-pressed with a transparent oversheet and a pre-printed milky white intermediate sheet by a hot press to form an integrated unit. A concave portion corresponding to the shape of a component such as a contact IC module, a coil, a capacitor, and a battery is cut to manufacture a front resin sheet and a back resin sheet. Next, for example, after applying a thermosetting adhesive to the back resin sheet, components such as an IC chip and an antenna are mounted in accordance with the positions of the recesses, and the front resin sheet is cured until the adhesive is cured. It is bonded by pressing with a press machine.

[0005] However, in the above-described method of manufacturing a non-contact type IC card (thermal lamination method), there is a problem that printing performed on the front resin sheet and the back resin sheet may be defective. This is because, when components such as an IC chip are mounted, irregularities corresponding to these components are formed on the surface of the front resin sheet and the surface of the back resin sheet, and distortion occurs due to the irregularities, thereby deteriorating printing quality. That's why. Also, since the IC chip and the coil or antenna are connected in advance and then buried in the card base for lamination,
There was also a problem that the electrical connection was cut off in the hot-pressing process and the restoration was impossible.

Therefore, a method of forming a card base in which only an antenna is embedded in advance and forming a recess for fitting the IC module in the card base and mounting the IC module has been used. FIG. 10 is a diagram showing a conventional method of manufacturing a non-contact type IC card. First, FIG.
The antenna 24 and the antenna connection terminal 25 as shown in FIG.
Is formed on a core sheet by screen printing or the like, and the upper and lower oversheets are laminated on the core sheet by thermal bonding or the like, and integrated to form a card base. Then, FIG.
As shown in (B), a recess 22 is formed in the base by counterboring so that only the connection terminal 25 of the antenna is exposed to the outside, and the IC chip is provided in the recess. Is mounted, and the IC module 10 having the connection terminal 26 with the antenna terminal is fitted and fitted using an adhesive, and the IC module and the antenna terminal are connected to form an IC card (Japanese Patent Application Laid-Open No. HEI 9-1997). -1
23654, JP-A-9-286187, etc.).

[Problems to be solved by the invention]

However, in the manufacturing method in which the IC module is fitted into the recess, the antenna connection terminal and the module terminal are joined using a conductive adhesive or the like, but reliable joining may not be achieved. , There was a lack of reliability. Accordingly, an object of the present invention is to provide a non-contact type IC card capable of performing reliable bonding even in such a manufacturing method, a manufacturing method thereof, and a non-contact type IC card base. In addition, there are various shapes of antennas for capturing signals of a non-contact type IC card, but when using the same type of antenna, the card base is manufactured in advance because the specifications are common to each card. There is a request from the manufacturer to keep it.
The present invention can meet such a demand.

[0008]

The gist of the non-contact type IC card of the present invention for solving the above-mentioned problems is to have an antenna buried inside the card base, and to connect a connection terminal of the antenna to the card base. In a non-contact type IC card in which an IC module terminal fitted from the outside of the base and fitted to the formed recess is electrically connected by a conductive material, a portion between the antenna connection terminal and the IC module, A non-contact type IC card characterized in that a resin layer of a sheet constituting a card base is interposed except for the above. Since such a non-contact type IC card is used, an IC card having no malfunction and a high surface accuracy can be obtained.

The gist of the method for manufacturing a non-contact type IC card according to the present invention for solving the above-mentioned problem is to provide an antenna embedded in a card base, a connection terminal of the antenna,
In a method of manufacturing a non-contact type IC card in which an IC module terminal fitted from the outside of the base and fitted in a recess formed in the card base is electrically connected to a conductive material, the center layer of the card base is formed. Forming a connection terminal for connecting the antenna to the surface of the core sheet where the IC module is mounted, and connecting the antenna connection terminal to the antenna provided on the core sheet or between the core sheet and the intermediate sheet; Step, the core sheet and the intermediate sheet having an antenna and a connection terminal and the over sheet as necessary are laminated and heated and pressed to integrate them,
The step of forming the card base and the countersinking of the card base to a depth large enough to embed the IC module substrate in a portion of the card base where the IC module is to be mounted and in which a part of the intermediate sheet layer remains. Forming the upper portion of the concave portion, and setting only the central portion of the concave portion to a depth large enough to embed the IC chip sealing resin portion of the IC module.
A step of forming the lower part of the concave portion by further counterboring and cutting a central portion of the antenna connection terminal so as not to cause a short circuit; and a portion where the card base side terminal of the IC module is joined to the antenna connection terminal. A step of forming a small hole in two places and filling a conductive material, and loading an IC module in the recess formed by counterboring, fixing the module by heating and pressurizing, and simultaneously forming an IC module terminal and an antenna connection terminal. And a method of manufacturing a non-contact type IC card. With this method of manufacturing a non-contact type IC card, it is possible to easily manufacture an IC card having no surface malfunction and good surface accuracy.

A first feature of a non-contact IC card base according to the present invention for solving the above-mentioned problems is to have an antenna embedded inside the card base, and a connection terminal of the antenna is
An IC fitted and mounted in a recess formed in a card base
A non-contact type IC card base formed by connecting to a module terminal, wherein a coil-shaped antenna is formed on a surface of a core sheet constituting a central layer of the base, and both connection terminals of the antenna are formed in the concave portion. The non-contact type IC card base according to the above aspect, wherein the two terminals are in contact with each other and both terminals are connected by a conductive material. Since such an IC card base is used, an IC card having no surface malfunction and good surface accuracy can be obtained.

A second aspect of the non-contact IC card base of the present invention for solving the above problems has an antenna embedded inside the card base, and both connection terminals of the antenna are formed on the card base. -Contact type IC formed by connecting to an IC module terminal fitted and mounted in the recess formed
A coil-shaped antenna is formed on the surface of a core sheet constituting a central layer of the substrate, and both connection terminals of the antenna are located in a contact portion of the recess and both terminals are conductive. A non-contact type IC card base body, wherein a thin sheet base material remains in a portion to which the IC substrate is adhered in the recessed portion which is connected to the material and which is counterbored. It is in. Since it is such an IC card base, an IC with no malfunction and good surface accuracy
Become a card.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of the IC card of the present invention. FIG. 1A shows the non-contact type IC.
FIG. 1B is a plan view of the card 20, and FIG.
It is sectional drawing which follows the A line. As shown in FIG. 1, a coil 24 is formed in the IC card base 21 and is connected to the IC module 10 via the antenna connection terminal 25 via the conducting portion 5p. As will be described in detail later, the conductive portion 5p is formed using a conductive material or the like. The antenna is provided as a winding coil in which a conductor is wound in a coil shape, a spiral pattern is formed on a printed board serving as a core sheet by a method such as photo etching, or by silk screen printing using conductive ink. Can be formed. In general, as shown in FIG.
Often formed on the surface of the core sheet 213.

[0013] At both ends of the antenna 24 and at the portions to be joined to the IC module, connection terminals 25 for assuring the joining are formed of metal pieces or conductive ink is printed by silk screen printing or the like. Form. In the case of conductive ink, the connection terminal 25 can be formed integrally with the antenna portion by screen printing or the like. However, when the antenna and the connection terminal are made of different materials, both need to be connected by a conductive adhesive or the like. is there.

As shown in FIG. 1B, the card base is often composed of a core sheet 213, upper and lower milky white sheets (intermediate sheets) 212 and 214 covering the core sheet, and transparent oversheets 211 and 215. . Of course, the card base is not limited to the illustrated configuration, and the card base may not use the oversheets 211 and 215 or may not use the lower sheets 214 and 215.

[0015] The first characteristic of the non-contact type IC card of the present invention.
The reason is that a portion 212t in which the intermediate sheet 212 is thinned is left and interposed in a portion where the wiring pattern layer of the IC module 10 is connected to the connection terminal of the antenna. The intermediate sheet 211,
Even if there is some variation in the thickness of the oversheet 212, this makes it possible to absorb processing errors such as the thickness of the sheet, and the IC module surface and the card substrate surface can always be made the same surface. Has an effect. Further, there is also an effect of improving the durability of the cutting blade by the fact that the cutting blade for counterboring does not grind the connection terminal. Further, the second characteristic of the non-contact type IC card of the present invention is as follows.
Is the connection terminal 2 between the terminal of the IC module 10 and the antenna.
5 is that the conductive portion 5p is formed by joining with a conductive material penetrating the antenna connection terminal. Such a structure has a remarkable effect that conduction between the IC module terminal and the antenna connection terminal is not cut even by a slight bending stress.

Next, a method of manufacturing a non-contact type IC card according to the present invention will be described with reference to FIGS. FIG.
FIG. 4 is a diagram illustrating a process of forming an antenna and connection terminals on a core sheet. First, the antenna 24 is formed by various means on one of the plastic sheets constituting the card base, usually on the surface of the core sheet 213. This can be achieved by a method of printing a conductive ink by a screen printing method, a method of forming the same by a photoetching process as in the case of a printed wiring board, a method of embedding a winding in a sheet, or the like. FIG. 2 (A) shows the core sheet 2 in such a method.
13 shows a state in which the antenna 24 is provided in a multi-faceted manner. Further, the antenna connection terminal 25 is formed of a thin metal piece or the like as described above, or is formed by a silk screen printing method. In the case of a metal piece, a metal such as lead, copper, aluminum or the like can be used by punching out a metal having a narrow central portion which is easily cut by a counterbore as shown in the figure. In this case, in a state where the metal piece is stuck on the release paper with the double-sided adhesive, the die is cut, and the die-cut metal piece is peeled off from the release paper together with the double-sided adhesive, and the IC module of the core sheet is mounted. It can be easily formed by sticking it to the part to be formed.

FIG. 2B is an enlarged view of the connection terminal 25, and FIG. 2C shows a cross section taken along the line BB. As shown in the figure, the connection terminal 25 is adhered to the core sheet 213 with a double-sided adhesive 28, and the antenna 24 and the connection terminal 25 are bonded to each other at the bonding portion 27 with solder or conductive adhesive.
Connected by Next, the core sheet 213, the intermediate sheets 212 and 214, and the oversheets 211 and 215
Are integrated by hot pressing or lamination.
Appropriate printing can be performed in advance on the front surfaces of the intermediate sheets 211 and 214 or the back surfaces (inner surfaces) of the oversheets 211 and 215. After the hot pressing, the card base is punched into individual cards. The mark 29 in FIG. 2A is a register mark for such punching.

FIG. 3 is a view showing a step of counterboring the card base. A plan view and a cross-sectional view of each step are shown. 3A, the surface of the card base 21 is in a smooth state, and the antenna 24 and the connection terminal 25 cannot be normally seen through. Next, only the upper step 22u of the recess 22 is ground to a depth corresponding to the thickness of the module substrate of the IC module (FIG. 3B). Counterbore is performed by cutting with an end mill, a drill, an engraving machine, or the like. The feature of the manufacturing method of the present invention is that a part of the intermediate sheet 212 is left above the connection terminal 25 as a thinned portion 212t during this grinding. By doing so, the overseat 21
Even if the thickness of the intermediate sheet 212 is slightly different from that of the intermediate sheet 212, the card surface and the IC module surface can be accurately planarized by grinding the surface from the card surface exactly to a depth corresponding to the thickness of the module substrate. There are advantages that can be achieved and that wear of the drill blade due to grinding of the metal surface of the connection terminal 25 by the drill can be reduced.

Finally, grinding is performed to the depth of the lower step 22d of the counterbore recess 22 to a depth that allows the IC chip sealing resin portion of the IC module 10 to be embedded (FIG. 3C). At the time of this grinding, the narrowed portion of the connection terminal 25 is cut, so that the connection terminal is divided into right and left. Further, in order to achieve conduction between the IC module and the connection terminal, two small holes 17 are provided below the connection terminal of the IC module, and the conductive material is filled sufficiently to swell into the small hole.

FIG. 4 is an enlarged sectional view showing a process of mounting the IC module, and FIG. 5 is an enlarged sectional view showing a state where the IC module is mounted. An adhesive is applied to a portion of the IC module 10 which is in contact with the thinned portion 212t of the intermediate sheet (except for a portion where the wiring pattern layer 14 is in contact with the conductive material in the small holes 17) to make the module into the concave portion 2.
2, the IC module can be mounted and the IC module terminal and the antenna connection terminal can be joined by applying heat and pressure. In FIG. 5, the wiring pattern layer 14 of the IC module 10 is connected to the antenna 24 via the conductive material in the small hole 17 and the connection terminal 25.

FIG. 6 is a diagram showing another process of mounting the IC module. In the case of FIG. 6, the joining means 15 having a sharply projecting shape is provided on the wiring pattern layer of the IC module 10, and the IC 22 is provided in the concave portion 22 cut to a predetermined depth.
When the module is fitted and the IC module is fixed, the joining means 15 of the IC module pierces the conductive material in the small hole 17. FIG. 7 is a diagram showing another state in which the IC module is mounted. In the figure, the wiring pattern layer 14 of the IC module 10 includes a bonding means 15, a conductive material in a small hole 17, and a connection terminal 2.
5 is securely connected to the antenna 24.

FIGS. 8 and 9 show an IC module used in the non-contact type IC card of the present invention. FIG. 8 shows an IC module terminal used for both a contact type and a non-contact type. FIG. 8 (A) is a contact terminal side surface view, FIG. 8 (B) is an IC chip side rear view, and FIG. (C) shows a cross section along a bonding wire connected to newly provided terminals C9 and C10. The IC module 10 shown in FIG.
(C) As shown in FIG.
1 mounted on the IC chip 12. An external contact terminal 13 is provided on one surface of the printed board 11, and a wiring pattern layer 14 is provided on the other surface of the printed board 11. The external contact terminal portion 13 and the wiring pattern layer 14 are electrically connected via a through hole 19. On the wiring pattern layer side of the printed circuit board 11,
The IC chip 12 is mounted, and the die pad of the IC chip and the wiring pattern layer 14 are electrically connected by bonding wires 18 (FIG. 8B). IC chip 12
Is the molding resin 16 including the bonding wires 18.
Coated with

As shown in FIG. 8A, eight terminals C1 to C8 are formed on the contact terminal side surface according to the ISO standard. Of these, the terminals C4 and C8 are for future use and are not actually used at present. Each terminal is separated by a separation groove 13g. The module-side terminals connected to the antenna are usually formed at terminals C9 and C10 provided separately from C1 to C8.

FIG. 9 shows an IC module of a non-contact only type. FIG. 9 (A) is a front view of the module, FIG. 9 (B) is a back view of the IC chip side, and FIG. 9 (C) is an antenna terminal. 2 shows a cross section taken along a bonding wire connected to. In the case of FIG. 9, since it is a non-contact only type IC module, there is no external contact terminal portion as in FIG. 1C, and only two wiring pattern layers 14 connected to the antenna terminals are provided on the back side. Is provided. 8 and 9 IC
In the case of a module, all of the modules are shown to have a joining means 15 having a shape protruding sharply on the wiring pattern layer 14, but the joining means may be joined without providing as described above. Further, when the joining means is provided, the connection terminal can be pierced, so that the small hole 17 can be omitted.

Next, the base for a non-contact type IC card of the present invention will be described. The IC card base is a so-called intermediate medium in an intermediate stage up to a completed card of a card base on which an antenna and connection terminals are formed.
(A), (B) and (C) are shown.
However, it is not necessary that each card be stamped. First of Non-Contact Type IC Card Substrates of the Present Invention
Means the state shown in FIG. 3A, and has a connection terminal 25 connecting the antenna 24 embedded in the card base and both terminals of the antenna. In this IC card base, since the antenna connection terminal 25 is formed on the intermediate sheet so as to connect the two antenna terminals with a conductive metal piece or conductive ink, the distance between the two terminals of the antenna is kept constant. And the irregularities on the card surface can be reduced. Second embodiment of the non-contact type IC card base of the present invention
Means the state shown in FIG. 3B or 3C, and has an antenna 24 embedded in the card base and connection terminals 25 connected to both terminals of the antenna, and an intermediate sheet is provided on the connection terminals. The thinned portion 212t remains. This I
As described above, the C card base can absorb errors in the thickness of the intermediate sheet and the oversheet.

<Example of Material> As the card base material 21, a known material such as a vinyl chloride resin, an ABS resin, a polyethylene terephthalate resin, and a polycarbonate resin, which has been conventionally used as a substrate of an IC card, can be used. As a material used for the joining means 15, a conductive material having a certain degree of hardness is preferable, and copper, aluminum, gold, silver,
Metals such as chromium and nickel, alloys thereof, and resin materials that are made conductive by dispersing metal powders such as copper, gold, silver, and aluminum can be used. As the conductive adhesive, a thermosetting resin material or the like that is made conductive by dispersing a metal powder such as copper, gold, silver, and aluminum can be used. An adhesive obtained by dispersing a metal powder as described above in a thermoplastic resin, which does not soften under normal use conditions of an IC card, but can be softened under heating conditions when an IC module is mounted may be used. it can.

[0027]

EXAMPLES (Example 1) <Preparation of IC module> IC module for contactless IC card (“SLE-44R2” manufactured by Siemens Corporation)
S "; a joint formed by cutting metal copper on both connection terminal portions on the back surface of the substrate having a thickness of 0.2 mm so as to have a conical shape with a height of 0.3 mm (diameter at the bottom 0.2 mm). Means 1
5 was fixed on the wiring pattern layer of the IC module using a conductive adhesive ("Able Bond 8350T" manufactured by Able Stick).

<Preparation of IC Card Base> As a transparent oversheet 211 (FIG. 5), a resin sheet (copolymer of polyvinyl chloride and vinyl acetate) having a thickness of 0.05 mm was used, and a milky white sheet (polyvinyl chloride) was used. ) 212 was used having a thickness of 0.28 mm. Milky white sheet 212
Was provided with a white concealing layer, and then a pattern formed by offset printing. On the other hand, for the core sheet 213, a milky white polyvinyl chloride sheet having a thickness of 0.15 mm is used.
Milky white polyvinyl chloride sheet 212 of core sheet 213
An antenna pattern (line width: 0.05 mm) was provided by silk screen printing using a conductive ink made of an aluminum paste on the surface to be fused.

At both ends of this antenna pattern, the IC
0.05 thickness at the part to be joined with the joining means of the module
A connection terminal was provided by a lead foil of mm. The lead foil is affixed to the release paper with a double-sided adhesive, and is punched out (one H-shaped member shown in FIG. 2B). Affixed to the position corresponding to the IC module terminal in a portion where the IC module of the core sheet is detached from the release paper, and is bonded to the antenna 24 with a conductive adhesive ("Able Bond 8350T" manufactured by Able Stick Co., Ltd.). 2) using the bonding portion 27 shown in FIG.
Connected like.

The transparent oversheet 215 was of the same quality and thickness as the oversheet 211, and the milky white polyvinyl chloride sheet 214 was of the same quality and thickness as the sheet 212. With the core sheet 213 on which the antenna 24 and the connection terminal 25 are formed as the center, two sheets 212 and 211 are stacked on the antenna surface side, and two sheets 214 and 215 are stacked on the back side, and are hot-pressed and integrated into a card base. Was formed. Thereafter, punching was performed for each card size. The total thickness of the card base after hot pressing was 0.81 mm.

A counterbore machine was first used to counterbore to a depth of 0.20 mm on a portion of the card base on which the IC module 10 was mounted. At this depth, it does not reach the total thickness of the oversheet having a thickness of 0.05 mm and the intermediate sheet having a thickness of 0.28 mm.
A portion 212t obtained by thinning the 13 mm-thick intermediate sheet remained. Next, add 0.25 to the center where the module enters.
The recess 22 was formed to a depth of 0.2 mm (total 0.45 mm from the surface of the card substrate). Further, a small hole having a diameter of 0.8 mm and a depth of 0.4 mm was provided in a portion where the joining means 15 of the IC module enters, and was filled with a heat-reactive conductive adhesive ("Able Bond 8350T" manufactured by Able Stick).

After applying a heat-reactive adhesive (“Afan UH-203” manufactured by Nippon Matai Co., Ltd.) to portions other than the connection terminals, the IC module is fitted into the concave portion 22 and heated under pressure (at a temperature of 100 to 170 °). C, 5-15kg / c
m ² , 5 seconds) and fixed in the recess. At this time, the joining means 15 is inserted into the conductive adhesive in the small hole 17 and
The continuity between the module 10 and the antenna 24 was completely achieved.

(Embodiment 2) <Preparation of IC module> The same non-contact type I as in Embodiment 1
An IC module for a C card (“SLE-44R2S” manufactured by Siemens KK; substrate thickness: 0.2 mm) was prepared, and a planar pattern having no bonding means 15 was used in the wiring pattern layer portion.

<Preparation of IC Card Substrate> An IC card substrate under the same conditions as in Example 1 was prepared, and Example 1 was similarly placed in the small hole.
The same heat-reactive conductive adhesive as in Example 1 was filled so as to rise from the small holes and solidified. After applying an adhesive (“Afan UH-203” manufactured by Nippon Matai Co., Ltd.) to the IC module, the IC module is fitted into the concave portion 22 and heated under pressure (temperature of 10).
(0 to 170 ° C., 5 to 15 kg / cm ² , 5 seconds) and fixed in the recess. Also in this case, the continuity between the IC module 10 and the antenna 24 was completely achieved.

The completed non-contact type IC card showed good operation in both the first and second embodiments, and no malfunction occurred even when the bending test was repeated. In addition, since the card surfaces were all formed smoothly, the design provided on the oversheet layer was not distorted.

[0036]

According to the non-contact type IC card of the present invention, the IC
Since the module terminal and the antenna connection terminal are joined by a conductive material via a thin resin layer, a processing error in sheet thickness can be absorbed and the card surface can be smoothed, and the IC module terminal and the antenna connection can be connected. The terminal and the terminal can be securely joined. ADVANTAGE OF THE INVENTION According to the manufacturing method of the non-contact type IC card of this invention, the plastic IC card of the design which encloses an antenna inside a card and mounts a module from the surface of a card can be manufactured easily and with high precision. Further, the base for a non-contact type IC card of the present invention can be usefully used as an intermediate medium for manufacturing such an IC card, and can contribute to an improvement in the manufacturing yield of the IC card.

[Brief description of the drawings]

FIG. 1 shows an embodiment of an IC card of the present invention.

FIG. 2 is a view showing a process of forming an antenna and a connection terminal on a core sheet.

FIG. 3 is a view showing a step of counterboring a card base.

FIG. 4 is an enlarged sectional view showing a step of mounting an IC module.

FIG. 5 is an enlarged sectional view showing a state where an IC module is mounted.

FIG. 6 is a diagram showing another process of mounting the IC module.

FIG. 7 is a diagram showing another state in which the IC module is mounted.

FIG. 8 shows an I used in the non-contact type IC card of the present invention.
It is a figure showing C module.

FIG. 9 shows the I used in the non-contact type IC card of the present invention.
It is a figure showing C module.

FIG. 10 is a diagram showing a conventional method of manufacturing a non-contact type IC card.

[Explanation of symbols]

 5p Conducting part 10 IC module 11 Printed circuit board (IC module substrate) 12 IC chip 13 External contact terminal part 13g Separation groove 14 Wiring pattern layer 15 Joining means 16 Mold resin (sealing resin) 17 Small hole 18 Bonding wire 19 Through hole 20 IC card 21 IC card base 22 Concave part 22u Upper part of concave part 22d Lower part of concave part 24 Antenna 25 Connection terminal 26 Module terminal 27 Adhesive part 28 Double-sided adhesive 211, 215 Transparent over sheet 212, 214 Milky white sheet (intermediate sheet) 212t Middle Thin part of sheet 213 Core sheet

Claims (12)

[Claims] 1. An antenna having an antenna embedded inside a card base, and a connection terminal of the antenna and an IC module terminal fitted and mounted in a recess formed in the card base from outside of the base. In a non-contact type IC card which is electrically conductive by a material, a resin layer of a sheet constituting a card base is interposed between the antenna connection terminal and the IC module except for a portion between the terminals. Contact type IC card. 2. The non-contact IC card according to claim 1, wherein the connection terminal of the antenna is formed of a thin metal piece. 3. The non-contact type IC card according to claim 1, wherein the connection terminals of the antenna are formed of conductive ink. 4. The non-contact type IC card according to claim 1, wherein the conductive material is filled in a small hole penetrating the antenna connection terminal. 5. The non-contact type IC card according to claim 1, wherein the antenna connecting terminal portion of the IC module is provided with a joining means having a sharply projecting shape. 6. The non-contact type IC card according to claim 1, wherein the conductive material is a heat-reactive adhesive. 7. An antenna having an antenna embedded inside a card base, and a connection terminal of the antenna and an IC module terminal fitted and mounted in a recess formed in the card base from outside of the base. Forming a connection terminal for connecting an antenna to a surface of a core sheet constituting a central layer of a card base and to which an IC module is mounted, in a method of manufacturing a non-contact type IC card which is conductive by a material; Connecting the antenna provided on the core sheet or between the core sheet and the intermediate sheet to the antenna connection terminal, and laminating the core sheet and the intermediate sheet having the antenna and the connection terminal, and the over sheet if necessary, and heating. A step of forming a card base by pressing and integrating the IC module, and an IC module in a portion where the IC module is mounted on the card base. The card substrate to a depth large enough to embed the substrate, and forming the upper step of the recess by counterboring the card base to a depth where the intermediate sheet layer partially remains; In order to form a lower step portion of the concave portion by forming a lower portion of the concave portion so that the IC chip sealing resin portion of the IC module can be buried, the central portion of the antenna connection terminal is cut so that a short circuit does not occur. Forming a small hole at two locations where the card base side terminal of the IC module and the antenna connection terminal are joined to the antenna connection terminal, and filling the conductive material; And bonding the IC module terminal and the antenna connection terminal at the same time as heating and pressurizing to fix the non-contact type IC card. 8. A sharply projecting joining means is provided at a contact portion of the IC module which is electrically connected to the antenna connection terminal,
8. The method for manufacturing a non-contact type IC card according to claim 7, wherein said joining means is inserted into a conductive material when the IC module is mounted. 9. The method for manufacturing a non-contact type IC card according to claim 7, wherein the antenna connection terminal is made of a conductive metal piece. 10. The method according to claim 7, wherein the conductive material is a heat-reactive adhesive. 11. An antenna having an antenna embedded inside a card base, wherein a connection terminal of the antenna is formed by connecting an IC module terminal fitted and mounted in a recess formed in the card base. A contact type IC card base, wherein a coil-shaped antenna is formed on the surface of a core sheet constituting a central layer of the base, and both connection terminals of the antenna are located in a contact portion of the concave portion and between the two terminals. Are connected by a conductive material.
Substrates for cards. 12. An antenna buried inside a card base, wherein both connection terminals of the antenna are formed by connecting IC module terminals fitted and mounted in recesses formed in the card base. A base for a non-contact type IC card, wherein a coil-shaped antenna is formed on a surface of a core sheet constituting a central layer of the base, and both connection terminals of the antenna are located in a contact portion of the concave portion and both terminals are provided. Wherein the non-contact type IC card is connected to a conductive material, and a thin sheet base material remains in a portion where the IC substrate is adhered in the recessed portion of the recess. Substrate.