JP2009157666A - Contact/non-contact sharing type ic card, non-contact type ic card and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure the satisfactory connection of an antenna coil and an IC module in a card base in a contact/non-contact sharing type IC card or a non-contact single function IC card. <P>SOLUTION: A contact/non-contact sharing type IC card or a non-contact type IC card is configured by laminating an antenna sheet 101 and an at least a contact terminal board side core sheet 102 forming an antenna coil 20 through a hot-melt adhesive sheet 106, and connecting both end parts 20a and 20b of an antenna coil and a terminal for antenna connection through conductive adhesive. The antenna coil 20 of the antenna sheet is formed by etching a metallic foil laminated through a non-hot-melt adhesive on a base material for an antenna sheet, and a connection terminal is formed by cutting at least both ends of the antenna coil from the opposite side of the formation face, and putting a base material 101c for an antenna sheet through it. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a contact / non-contact type IC card, a non-contact type IC card, and a manufacturing method thereof. More specifically, the present invention relates to an IC card having an antenna coil in a card base and connected to the antenna coil and an antenna connection terminal of a contact / non-contact shared or non-contact IC module directly under the IC module, and a manufacturing method thereof. .

A contact / non-contact IC card having both a contact type and a non-contact type function is also referred to as a dual interface card or a combination card. Since this has a reliable settlement by contact and a simple and quick authentication function by non-contact, it is widely used. Originally, dual interface cards are used for contact IC functions (payment and withdrawal by ATM) in areas where advanced encryption technology is required and security is required. It is characterized in that there is a memory area that is used for functions and can share both data in the IC chip.
Therefore, in fields that require security and convenience at the same time by combining financial cards such as credit cards and bank cards, transportation cards such as commuter passes, ID cards such as employee cards and student cards, etc. It's being used.

On the other hand, since the non-contact type IC card does not perform contact communication with an external device, it is not necessary to have a contact terminal board on the card surface. Therefore, generally, an IC chip (which may be an IC module without a terminal plate) is embedded in the card base. However, in the form of embedding the IC chip, if any trouble (caused by causes other than the IC chip) occurs in the manufacturing process of the IC card, the IC chip cannot be reused and the damage increases.
Therefore, even if it is a non-contact IC card, the IC chip is used while being held on a terminal board (formal or decorative board having no function as a terminal), and the antenna connection terminal ( There may be a case where the non-contact interface) and both ends of the antenna coil in the card base are connected in a concave hole cut from the card surface. This form has an advantage that the IC chip can be taken out and reused even if a manufacturing defect occurs. The non-contact type IC card of the present invention means such a form.

By the way, conventionally, there are roughly three types (conventional methods 1 to 3) of the form of the contact / non-contact type IC card and the manufacturing method thereof. This will be described with reference to FIGS.
The conventional method 1 is the form shown in the cross-sectional view of FIG. In this device, an antenna substrate 101 made of an integrated IC module including an IC terminal plate 51 for contact and an antenna 20 is flattened with a resin or an adhesive (FIG. 9A), and cover sheets 104 and 105 are formed on the front and back surfaces. Is affixed with a hot press or an adhesive (FIG. 9B). In this form, it is difficult to increase the positional accuracy of the contact IC terminal plate 51 and there is a problem that the IC chip is broken during pressing, and it has not been widely used.

The conventional method 2 is the form shown in FIG. In the figure, (A) and (B) are sectional views, and (C) is a perspective plan view. This is a card base material 102, 103 in which both sides of an antenna sheet 101 having a large number of openings 10h (sheets obtained by etching the metal foil of a sheet laminated with metal foil to form the antenna 20) 101 are heat-fusible. (FIG. 10 (A)), and hot-pressing and fusing the upper and lower card bases 102 and 103 together through the opening 10h. This is a method in which a card is cut into individual pieces and then cut from the surface to expose the terminals, and the IC module 50 is embedded and simultaneously electrically connected to the antenna 20 (FIG. 10B).
This method has the advantage of not using an adhesive sheet, but the peripheral portion of the antenna sheet 101 needs to be inside the edge of the individual card (otherwise, the peripheral portion will not be fused and will peel off). In addition, it is necessary to use the antenna sheet 100 that has been singulated, and there are many problems in processing, such as difficulty in positioning with high accuracy and peeling between the base materials when cutting around the terminal board 51.

The both ends 20a and 20b of the antenna 20 of the antenna sheet 101 are connected to the antenna connection terminals of the IC module 50 when the IC module mounting recess is excavated from the card surface side. A method of performing electrical connection by filling molten metal (solder), conductive adhesive 9 or the like between the excavated and exposed metal surface of the antenna 20 and the antenna connection terminal is performed.
FIG. 10C is a plan view of the IC card base body (the state before the IC module is mounted), showing that the antenna sheet 101 provided with a large number of openings 10 h is embedded in the card base body 10. Yes.

  The conventional method 3 is shown in the cross-sectional view of FIG. This method is a method in which a base material that is not heat-fusible is used for the antenna sheet 101 and the card base materials 102 and 103 on both sides thereof are bonded together via adhesive sheets 106 and 107. Although there are similarities to 2 in the conventional method, it is not necessary to cut the antenna sheet 101 into individual pieces, and it can be handled in a multi-faceted state, and the adhesive sheets 106 and 107 can be used as a spacer sheet that also serves as a stress absorber. Thus, there is an advantage that the smoothness of the card surface can be improved, and at the same time, the suitability for character embossing can be improved. The connection between the antenna both ends 20a and 20b of the antenna sheet 101 and the antenna connection terminal of the IC module 50 is performed in the same manner as in the conventional method 2.

However, in the conventional method 3, since both ends 20a and 20b of the antenna connected to the antenna coil 20 surface of the antenna sheet 101 are directed to the front surface side (contact terminal plate 51 surface side) of the IC card 1, When cutting is performed from the surface side so that both ends 20a and 20b of the antenna coil are exposed, the edge of the end mill first contacts with the hot-melt adhesive sheet 106 before reaching the metal foil layer of the antenna coil 20. Will reach.
If it does so, the layer of considerable thickness of the hot-melt adhesive sheet | seat 106 of the property melt | dissolved at a comparatively low temperature will be heated by the high-speed rotation of an end mill blade, and the cutting waste will become the periphery part and end mill of the recessed part shape during cutting. There was a problem that the cutting shape with high accuracy of the concave portion 30 for mounting the IC module and the both ends 20a and 20b of the antenna coil could not be obtained due to the blade. In particular, the antenna coil end portions 20a and 20b are preferably cut so that a flat bottom surface is exposed within the thickness of the metal foil layer. If the metal foil layer is punched or the shape of the bottom surface is deformed, contact failure is caused. Or the durability tends to decrease.

FIG. 12 is a diagram showing a concave shape for mounting an IC module by end mill cutting.
FIG. 12A shows a normal cutting shape, and FIGS. 12B and 12C show examples in which the shape is deformed by cutting waste. FIG. 12B shows that the shape of the deeper part (second recess 32) inside the IC module mounting recess 30 is not a correct rectangular shape, but a distorted shape. It can be seen that the holes 33a, 33b are also deformed. This is probably because the sticky adhesive adheres to the edge of the end mill, resulting in a large diameter and distortion.
In FIG. 12C, adhesive residue or core substrate cutting residue adheres around the second recess 32, or the core substrate in the conductive recess holes 33a and 33b cannot be completely removed. The state is shown. This is considered to be due to incomplete cutting due to adherence of debris, debris, etc., of the hot-melt adhesive to the edge of the end mill.

Here, the end mill blade will be described for reference. FIG. 13 shows the shape of the end mill blade, FIG. 13 (A) shows two blades, and FIG. 13 (B) shows four blades. In either case, the upper part is a side view and the lower part is a front view of the cutting edge. In addition, there are various types of end mill blades such as a ball shape with a rounded tip, a flat shape (projection of the tip of the blade tip), a straight tube shape or a tapered shape with a taper. In addition, there are two-blade and four-blade blades with blade edges on both sides of the rotation center axis, and single-blade blades with blade edges only on one side.
FIG. 13 shows a substantially straight two-blade and four-blade. The diameter of the cutting edge of an IC card used for cutting an IC module mounting recess or a conductive recess is about 5.0 mm to 1.0 mm, and the tip is generally flat as described above. Used.
FIG. 14 shows a schematic diagram of the cutting edge (right side) with the adhesive attached to the cutting edge (left side) in a normal state. Normal cutting is impossible when the adhesive is attached.

  In the present application, it is considered to cut the IC module mounting recess and the conductive recess in a state where the cutting waste of the adhesive sheet does not adhere to the end mill blade. That is, when cutting the end of the antenna from the front side of the card, if both ends of the antenna coil of the antenna sheet are on the opposite side of the base for the antenna sheet as viewed from the card front side (terminal plate side), the end mill blade The metal foil layer is not cut in a state in which the tip of the wire is in contact with the heat-meltable adhesive sheet, and the conductive concave hole having the designed shape can be cut. The present invention is based on such a viewpoint.

Although prior patent documents directly related to the present application cannot be detected, there is Patent Document 1 relating to a contact-type non-contact type shared IC card and a manufacturing method thereof. However, in the same document, the card base material is not laminated via the adhesive sheet, so that the phenomenon that the present application has a problem does not occur.
Patent Document 2 also relates to a contact-type non-contact-type common IC card and a method for manufacturing the same, but does not use a heat-meltable adhesive sheet for stacking card base materials.

JP 2000-207518 A JP 2000-182017 A

As described above, when laminating the card base material via the adhesive sheet, if the concave part for connecting to the IC module mounting or the antenna terminal is excavated from the hot-melt adhesive sheet side, it is heated by the high speed rotation of the end mill. In addition, there is a problem that the resin or cutting waste that has become sticky on the adhesive sheet clings around the end mill or the concave hole, and the designed concave mounting hole and conductive concave hole cannot be excavated.
Therefore, in the present invention, the metal foil layers at both ends of the antenna coil where the conductive concave holes are cut are formed on the lower side of the antenna sheet base material when viewed from the cutting direction side, and the metal foil layers are cut. It has been completed through research to eliminate the influence of hot melt adhesive sheets.

  The first of the gist of the present invention is that an antenna sheet on which an antenna coil is formed and at least a core sheet on the side of a contact terminal plate of an IC card are laminated via a hot-melt adhesive sheet. In the contact / non-contact type IC card in which both ends of the antenna coil and the antenna connection terminals of the contact / non-contact common IC module are electrically connected with a conductive adhesive, the antenna coil of the antenna sheet is the antenna sheet. A metal foil laminated with a thermosetting adhesive on a base material for etching is formed by etching, and both ends of the antenna coil of the antenna sheet are cut from opposite sides of the forming surface, and the antenna sheet base material is formed. The contact / non-contact type IC card is characterized in that a connection terminal is formed by penetrating.

  The second aspect of the present invention is that an antenna sheet on which an antenna coil is formed and at least a core sheet on the terminal board side of an IC card are laminated via a heat-meltable adhesive sheet. In the non-contact type IC card in which both ends of the antenna coil and the antenna connection terminals of the non-contact IC module are electrically connected with a conductive adhesive, the antenna coil of the antenna sheet is thermosetting on the antenna sheet base material. It is formed by etching a metal foil laminated with an adhesive, and both ends of the antenna coil of the antenna sheet are cut from the opposite side of the forming surface, and the connection terminal is formed by penetrating the antenna sheet base material. A non-contact type IC card, which is characterized in that

  The third aspect of the present invention is that at least one core sheet is provided between the antenna sheet on which the antenna coil is formed and at least the core sheet on the contact terminal plate side of the IC card via a heat-meltable adhesive sheet. In the manufacturing method of a contact / non-contact type IC card that is laminated and electrically connected between both ends of the antenna coil of the antenna sheet and the antenna connection terminals of the contact / non-contact common IC module with a conductive adhesive, The following steps (1) to (6), (1) a step of laminating a metal foil on a substrate for an antenna sheet using a thermosetting adhesive, and preparing an antenna sheet, (2) of the antenna sheet Form a resist film in the shape of an antenna pattern on the metal foil surface and etch to form both ends of the antenna coil that connect the antenna coil and the antenna connection terminal (3) A core sheet is laminated on both sides of the antenna sheet on which the antenna coil is formed via a heat-meltable adhesive sheet, and a transparent oversheet is further laminated on both sides, and then hot pressing is performed to integrate the sheet. A step of making a card base, (4) a step of cutting a recess for mounting an IC module from the side opposite to the side where both ends of the antenna coil of the antenna sheet are provided, and (5) an end mill in the same manner. A step of forming a concave hole for conduction in which a part of both ends of the antenna coil is exposed using a blade; (6) a portion in which a conductive adhesive is filled in the concave hole for conduction and in contact with the IC card base of the IC module Apply thermal adhesive tape or liquid adhesive to the IC module and insert the IC module into the IC module mounting recess, and fix the IC module to the IC card substrate. A method of manufacturing a contact and non-contact sharing type IC card comprising a step, for electrical connection between Yuru an antenna coil, in.

  According to a fourth aspect of the present invention, there is at least one core sheet between the antenna sheet on which the antenna coil is formed and the core sheet on the IC module substrate side of at least the IC card via a hot-melt adhesive sheet. In the manufacturing method of a non-contact IC card, in which both ends of the antenna coil of the antenna sheet and the antenna connection terminals of the non-contact IC module are electrically connected with a conductive adhesive, the following (1) to ( 6) Step, (1) A step of preparing an antenna sheet by laminating a metal foil on a substrate for an antenna sheet using a thermosetting adhesive, and (2) an antenna pattern shape on the metal foil surface of the antenna sheet. Forming a resist film on the substrate and etching to form both ends of the antenna coil for connecting the antenna coil and the antenna connection terminal; (3 A step of laminating a core sheet on both sides of an antenna sheet on which an antenna coil is formed via a heat-meltable adhesive sheet, and further laminating a transparent oversheet on both sides, and then hot pressing to form an integrated card base, (4) A step of cutting the concave portion for mounting the IC module from the side opposite to the side where the both ends of the antenna coil of the antenna sheet are provided by using an end mill blade, (5) Similarly, the antenna coil using the end mill blade. (6) filling the conductive concave in the conductive concave hole, and thermally bonding tape or liquid at the portion of the IC module that contacts the IC card substrate. Apply the adhesive, load the IC module into the IC module mounting recess, fix the IC module to the IC card base, Non-contact IC card manufacturing method of which is characterized by having a step, for electrical connection with the Nakoiru, in.

The contact / non-contact type IC card according to the present invention has a configuration in which an antenna sheet is laminated with a core sheet via a heat-meltable adhesive sheet, and at least both end portions of the antenna coil have conductive concave holes for the antenna sheet. Since it cuts from the base material side, the said conduction | electrical_connection concave hole is not deform | transforming, and it has not been in the state which penetrated the metal layer. Therefore, the IC card is excellent in electrical characteristics and durability without causing contact failure.
The non-contact type IC card according to the present invention has the same effect.

In the method for manufacturing a contact / non-contact type IC card according to the present invention, the cutting of the conductive concave holes to both ends of the antenna coil is performed from the antenna sheet substrate side where no hot-melt adhesive sheet is interposed. The end mill blade does not cling to the cutting chips or the like of the heat-meltable adhesive sheet, can cut the conductive concave hole as designed, and can secure a good connection between the IC module and the antenna coil. For this reason, the durability of the IC card is also excellent.
Since the card substrate laminating step can be performed in the state of a multi-sided sheet of antennas, the productivity can be improved as compared with the case where the card substrate is cut into individual pieces as in the conventional method 2.
The non-contact type IC card manufacturing method according to the present invention has the same effect.

Hereinafter, the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view of a contact / contactless IC card (first form) according to the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a contactless IC card (second form) according to the present invention. FIG. 4 is a cross-sectional view, FIG. 4 is a diagram showing an example of a planar form of a non-contact IC card, FIG. 5 is a diagram showing an antenna sheet, and FIG. 6 is a IC module mounting recess and an antenna connection conducting recess. FIGS. 7A and 7B are diagrams showing a detailed structure of the conductive concave hole, and FIGS. 8A and 8B are diagrams showing a contact / non-contact IC module.

  As shown in FIG. 1, the contact / non-contact IC card (first form) 1 according to the present invention excavates an IC module mounting recess 30 in the card base 100, and the contact / non-contact IC module is inserted into the recess. 50 is attached. The contact / non-contact type IC card 1 is a first embodiment of the present invention. As will be described in detail later, the contact / non-contact common IC module 50 has a contact / non-contact common IC chip 3 on the opposite side of the contact terminal plate 51 on the front side, and the non-contact interface of the IC chip 3 is connected to the antenna. The terminals 52a and 52b are connected. The antenna connection terminals 52a and 52b are connected to both end portions 20a and 20b of the antenna coil 20 in the card base 100 via a conductive adhesive filled in the conduction concave holes 33a and 33b.

  Note that a tape-like COT (Chip On Tape) is frequently used for the IC module 50, but a COB (Chip On Board) or COF (Chip On Film) may be used.

  The planar form of the contact / non-contact type IC card 1 is as shown in FIG. The IC card base 100 has the antenna coil 20, and both ends 20 a and 20 b are filled in the conductive concave holes 33 a and 33 b on both sides of the IC module mounting concave portion 30 below the surface of the contact terminal plate 51. The antenna connection terminals 52a and 52b are connected with a conductive adhesive. Since the antenna coil 20 is embedded in the card base 100, it cannot be visually recognized from the outside.

The card base 100 has an antenna sheet 101 on which an antenna coil 20 is formed as a central layer, and core sheets 102 and 103 are laminated on both sides via hot-melt adhesive sheets 106 and 107, and further transparent on the outermost surface. The oversheets 104 and 105 are laminated. Conventional plastic cards, such as contact IC cards, generally use a self-bonding base material, heat press laminate, and a card base that is integrated, but in non-contact IC cards, an antenna sheet by etching is used. In many cases, such an antenna sheet base material is a material that does not have self-fusing properties (for example, polyimide, PET, etc.), and thus the adhesive sheets 106 and 107 are indispensable structures. Note that many core sheets and oversheets are mainly composed of a PET-G material, but the adhesive sheets are not required because they are heat-sealed.
The layer structure of the card base is not limited to the above, and various structures from about 5 layers to about 11 layers can be adopted. The above configuration is common to recent contact / non-contact IC cards 1.

  The contact / non-contact type IC card 1 of the present invention is characterized in that both end portions 20a and 20b of the antenna coil 20 of the antenna sheet 101 are formed on the side surface 101b opposite to the contact terminal plate 51 of the antenna sheet substrate 101c. There is in being. In FIG. 1, the entire antenna coil 20 is formed on the opposite surface 101b. However, at least both ends 20a and 20b may be on the opposite surface 101b, and the antenna coil 20 itself is on the contact terminal plate 51 side ( Hereinafter, it may be on the surface 101a. In recent years, it is often the case that a metal foil layer is provided on both surfaces of the antenna sheet substrate 101c to form a capacitor for the resonant circuit configuration with the metal on both surfaces, and other wiring can be formed on the front and back surfaces.

As described above, the opposite side surface 101b is formed when the both ends 20a and 20b are excavated from the surface side, and if there is a layer of the hot-melt adhesive sheet 106 immediately above, the cutting waste is generated. This is because there is a problem that obstructs cutting by the end mill, and it is avoided.
That is, if the metal foil layer is cut through the antenna sheet base material 101c by cutting from the surface side, and the cutting is stopped in the metal foil layer, the above-described problem does not occur.
There is also a thin adhesive layer (not shown in FIG. 1) between the antenna sheet substrate 101c and the metal foil layer, but this layer is made of a thermosetting material or a material having a high melting point. Since it is a very thin layer of about 2 to 10 μm, there is an advantage that there is almost no influence by sticky cutting waste. On the other hand, the heat-meltable adhesive sheets 106 and 107 are originally required to melt at a relatively low temperature, and the thickness thereof is several tens of μm, so that the adhesive sheet is entangled with the end mill by the heat generated by the end mill, The effect on cutting is increased.

FIG. 3 is a cross-sectional view of the non-contact type IC card (second embodiment) of the present invention. The non-contact type IC card 2 is a second form. In the second embodiment, the IC module mounting recess 30 is excavated in the card base 100 and the non-contact IC module 60 is mounted in the recess.
The non-contact IC module 60 has a non-contact IC chip 4 on the opposite side of the IC module substrate 61 on the front surface side, and the non-contact interface of the non-contact IC chip 4 is connected to the antenna connection terminals 62a and 62b. . The antenna connection terminals 62a and 62b are connected to both end portions 20a and 20b of the antenna coil 20 in the card base 100 through the conductive recess holes 33a and 33b. The IC module 60 does not have terminals other than the antenna connection terminal.

  The card base 100 is the same as the IC card of the first embodiment, and the core sheet 102, 103 is laminated on both sides of the antenna sheet 101 on which the antenna coil 20 is formed via adhesive sheets 106, 107. In addition, a transparent oversheet 104, 105 is laminated on the outermost surface. Although the expression “center layer” is used, the antenna sheet 101 does not necessarily have a symmetrical arrangement in the layer configuration. In the case of FIG. 3, the core sheet 103 is thicker than the core sheet 102. This is because by increasing the thickness of the core sheet 103, it is possible to obtain an advantage for multi-functionality such as pasting a rewritable label, a Braille label, or the like that has been used by being embedded in the base material portion. However, it is desirable to conform to the JISX6301: 2005 “identification card-physical characteristics” ID-1 card as a widely distributed card, and it is necessary to comprehensively consider the warpage and size of the card.

  According to JISX6301: 2005, the nominal value of the card size is 85.60 mm wide × 53.98 mm long, and the thickness is 0.76 mm. The allowable thickness dimension is 0.68 to 0.84 mm. Further, the warp (8.11) of the entire card is 1.5 mm or less including the card thickness in the card before embossing.

  Unless the self-bonding base material is used as the antenna sheet base material, the adhesive sheets 106 and 107 are also indispensable. As the layer configuration of the card base 100, various configurations can be adopted as in the first embodiment.

In this manufacturing method, the antenna card is manufactured in advance, and the modularized IC chip is connected to the antenna card with the terminal portion cut in the final process, so that damage to the IC chip due to a long-time laminating press can be suppressed. There is an advantage.
The antenna card refers to a state where the antenna sheet is pressed and then punched into a card shape (ID-1 size). It often refers to the card before counterbore cutting with an end mill.
On the other hand, the antenna sheet refers to a sheet in which an antenna is formed. In the meaning of a multi-sheet large format sheet or single-sided sheet, it means a state before pressing.

  When the IC module substrate 61 is placed at a position conforming to the ISO standard, the planar shape is the same as in FIG. Since the non-contact type IC card 2 does not need to be in electrical communication with an external device, a contact terminal pattern in the original sense is not necessary. The IC chip is mounted on the back side of the IC module substrate 61 and the antenna connection terminals 62a and 62b are provided in the same manner as the IC card of the first embodiment, and the same connection structure is employed. Since the contact terminal pattern is not required on the surface side of the IC module substrate 61 (the surface side when viewed from the card), a free design can be made, and a reinforcing plate for the purpose of surface protection and strength improvement is affixed. You can also. In addition, since there is no limitation on the position by the IC contact terminal, the size and the plane mounting position can be freely set.

FIG. 4 is a diagram showing an example of a planar form of the non-contact IC card of the present invention. This is a form in which a non-contact IC module 60 is integrated in a card base 100 that holds the SIM 5.
Before the SIM 5 is folded off from the bridge 16, the non-contact IC card 2 includes the contact terminal plate 51 and the contact IC chip, and thus functions as a contact IC card. In the remaining state after the SIM 5 is broken, the non-contact IC module 60 and the antenna coil 20 function only as the non-contact type IC card 2. However, not only this example but various embodiments can be adopted.

FIG. 5 is a diagram showing the antenna sheet 101 and shows a state of being separated. 5A is a surface view seen from the contact terminal plate surface, and FIG. 5B is a view turned upside down and seen from the back side.
The portion corresponding to the antenna coil 20 may be arranged on either the front or back side of the antenna sheet substrate 101c, but it is an essential condition in the present invention that both end portions 20a and 20b of the antenna coil are always on the back side. . Although not shown, if necessary on the resonant circuit configuration, a pattern to be a capacitor may be arranged. The conductive member 8 is a portion that connects the antenna coil 20 across the surface side.

The antenna sheet 101 is patterned according to such rules, and when the milling machine (NC processing machine) is carved, the metal foil layer on the first contact surface is removed by etching, and on the back side. Both end portions 20a and 20b serving as terminals are arranged.
After the antenna sheet 101 is integrated with the card base 100, the IC module mounting recess 30 for embedding the IC module and cutting for exposing both end portions 20a, 20b as terminals are performed. The concave holes formed by the cutting process are referred to as conductive concave holes 33a and 33b.

FIG. 6 is a view showing a concave portion for mounting an IC module and a concave hole for connecting an antenna, wherein the upper part of FIG. 6 is a plan view and the lower part is a cross-sectional view passing through the conductive concave holes 33a and 33b. .
There are different embodiments for excavating the IC module mounting recess 30 and the conduction recesses 33a and 33b, and as shown in FIG. 6A, the IC module mounting recess 30 and the antenna connection conduction recess 33a. , 33b are connected adjacently and cut in a staircase shape, and as shown in FIG. 6B, the conductive concave holes 33a, 33b are formed as independent holes at positions slightly apart from the mounting concave part 30. If there is, there is. The two steps of cutting the concave portion 30 for mounting the IC module and cutting the concave holes 33a and 33b for connecting the antenna use two types of end mill blades even when cutting continuously with one end mill blade. The two processes may be cut.

  The IC module mounting recess 30 is a portion where the first recess 31 (the portion above the broken line in the cross-sectional view of FIG. 6) for suspending the terminal substrate portion around the IC module 50 and the IC chip of the IC module 50 are molded. And a second recess 32 excavated deeper than the first recess. In FIG. 6, since the vertical dimension is enlarged, it looks quite deep, but the IC module terminal board has a horizontal dimension of about 10 mm to 15 mm, whereas the maximum thickness of the part where the IC chip 3 is molded is shown. Is about 400 μm to 600 μm, so it is actually a flat excavation shape.

<Manufacturing process of contact / non-contact IC card>
Next, a method for manufacturing a contact / non-contact IC card of the present invention will be described. It is assumed that the contact / non-contact IC module is prepared in advance with an adhesive sheet such as COT attached, and necessary printing on the card substrate has already been performed.
(1) First, a step of preparing an antenna sheet is performed.
This is done by laminating a metal foil on the antenna sheet substrate. A PET sheet is preferably used for the antenna sheet substrate, but various materials can be used as described later. A thickness of about 10 μm to 500 μm can be used. Copper or aluminum foil can be used as the metal foil, and the thickness is preferably about 15 μm to 50 μm.

As the adhesive for laminating the antenna sheet substrate 101c and the metal foil, various materials such as thermoplastic, thermosetting, or moisture-curing type can be used, but those having heat resistance that can withstand the etching process are appropriate. A thermosetting adhesive is generally used.
The present invention is premised on the use of a thermosetting adhesive that does not melt in an etching process or an IC card use environment. The metal foil may be laminated only on one side of the antenna sheet substrate 101c. However, when the wiring is formed on both sides or a capacitor is formed, a double-sided laminate is used.

(2) Next, a resist film is formed in an antenna pattern shape on the metal foil surface of the antenna sheet and etched to form antenna coil end portions 20a and 20b that connect the antenna coil 20 and the antenna connection terminals. Perform the process.
The resist film may be formed by either a resist printing method or a photoresist using a photomask. The antenna coil 20 is often formed so as to make several turns around the card, but various shapes are adopted depending on the use of the IC card in order to avoid a character embossed part and to consider antenna characteristics. .

(3) Subsequently, a core sheet is laminated on both sides of the antenna sheet 101 on which the antenna coil 20 is formed via a heat-meltable adhesive sheet, and a transparent oversheet is further laminated on both sides, followed by hot pressing. A process of forming an integrated card base is performed.
The core sheets 102 and 103 are laminated on both surfaces of the antenna sheet 101 via hot-melt adhesive sheets 106 and 107, and the transparent oversheets 104 and 105 are laminated on the outermost surfaces on both sides and temporarily fixed. Thereafter, the temporary fixing laminate is sandwiched between the mirror plates, and heat and pressure are applied and integrated. As the heat-meltable adhesive sheets 106 and 107, a thermoplastic material that adheres at a relatively low temperature can be used. For example, a polyester-based hot melt adhesive sheet or the like is used. A thickness of about 30 μm to 100 μm can be used. The laminated material is not limited to the above configuration, but is adjusted so that the thickness of the final card base 100 that has been hot-pressed falls within the standard range of 0.76 ± 0.08 mm.

(4) Subsequently, a step of cutting the concave portion for mounting the IC module using an end mill blade is performed from the side opposite to the side where both ends of the antenna coil of the antenna sheet are present.
In general, until the step (3), the sheet is often processed in the form of a multi-sided sheet. However, after the step (4), the sheet is often cut into a single card and processed. .
As described above, the IC module mounting recess 30 and the conductive recesses 33a and 33b are formed using the end mill blade from the side opposite to the side where the antenna coil both ends 20a and 20b of the antenna sheet base 101c are present. To cut. Cutting is performed by attaching an end mill blade to a milling machine and performing numerical control (NC control) by a program. The cutting edge of the end mill carves with the oversheet 104, the core sheet 102, the adhesive sheet 106, and the antenna sheet base material 101c, and stops at a set depth after reaching the metal foil layer (coil end portions 20a, 20b). To do. The IC module mounting recess 30 is cut to a depth where the resin mold portion 7 of the IC module 50 can be accommodated.

(5) Similarly, a step of forming a concave hole for conduction in which part of both ends of the antenna coil is exposed using an end mill blade is performed. Usually, the conductive concave holes 33a and 33b are excavated in the surface of the first concave portion 31. The size is a circle with a diameter of about 1 mm to 3 mm, a rectangle with a side of 1 mm to 3 mm, or the like. The depth is such that the metal foil layer is cut shallowly at a depth of 1 μm to several tens of μm. It is preferable to stop in the metal foil layer so that the bottom surfaces of the conductive concave holes 33a and 33b form a flat bottom surface. This is because stopping in the layer provides a wide contact area. The cutting depth is carved to a preset depth. Usually, it is set not to penetrate the metal foil layer.

  FIG. 7 is a diagram showing a detailed structure of the conductive concave hole. It is sectional drawing of the concave hole 33a for the right side of FIG. 6 (B). The antenna sheet 101 has an antenna sheet substrate 101c as a central layer, and an antenna coil, a capacitor, and both ends 20a and 20b of the antenna coil are formed on both sides thereof. In FIG. 7, only the antenna coil end portion 20a is shown. The metal foil layer is laminated with the adhesives 101s1 and 101s2 on both sides of the antenna sheet substrate 101c. However, the metal foil layer on the adhesive 101s1 side is already etched and removed. The antenna coil end portion 20a remains on the adhesive 101s2 side.

The conduction recess 33a is formed by cutting deeper from the surface of the first recess 31 of the IC module mounting recess 30. Since the cutting proceeds from the antenna sheet substrate 101c side, it is possible to reduce the influence of the cutting waste of the thick heat-meltable adhesive sheet remaining on the end mill blade.
It is preferable that the bottom surface of the conductive recess 33a is stopped so as to form a parallel bottom surface in the metal layer of the antenna coil end portion 20a. This is because the contact area between the conductive adhesive and the metal layer can be increased by the parallel bottom surface. The metal at both ends is preferably made of copper foil. This is because the film resistance due to oxidation can be reduced. The adhesives 101s1 and 101s2 are made of thermosetting adhesive as described above, and the thickness thereof is a thin layer of about 2 to 10 μm. Become.

  Naturally, the depth setting varies depending on the layer structure of the card, but the sensor works by the method of mechanically stopping by calculation and the contact between the terminals (metal at both ends of the coil) and the end mill blade edge. There is a method to stop by feeding back information. In the former method, the cutting speed is fast, and in the latter method, the speed of engraving in the Z-axis direction is somewhat slow. Use of these together contributes to accuracy improvement and time reduction.

(6) Finally, the conductive recesses 33a and 33b are filled with a conductive adhesive, and the IC module 50 is loaded into the IC module mounting recess, and the IC module is fixed to the IC card base, and the IC The electrical connection process between the module and the antenna coil is performed.
As described above, the contact / non-contact IC module is based on the premise that an adhesive sheet such as COT has already been attached. If not, the IC module 50 is placed in the recess 30 in the IC card substrate. A thermal adhesive tape or a liquid adhesive is applied to a portion in contact with 100.
In this process, the terminal (both ends 20a, 20b) exposed and the IC module mounting recess 30 cut card is set in a card feeder of an implanter (IC module pasting device), and terminal connection and module mounting are performed. After that, a simple inspection is performed.

  8A and 8B are diagrams showing a contact / non-contact shared IC module. FIG. 8A is a contact terminal plate surface view, FIG. 8B is a rear view, and FIG. 8C is a schematic cross-sectional view. The contact / non-contact common IC module 50 is continuously mounted on a reel substrate called COT (chip on tape). The contact / non-contact COT features the eight contact terminals (C1 to C8) on the front side and the IC chip 3 mounting portion and the front side contact terminals on the back side as shown in FIG. 8B. There are five openings (for five terminals currently used) 26 for connecting to the antenna, and antenna connection terminals 52a and 52b. A1 and A2 pads which are non-contact interfaces of the IC chip 3 and the antenna connection terminals 52a and 52b are connected by a wire 27. The IC chip 3 and the wire connection part are molded with a thermosetting epoxy resin or the like and protected as a resin mold part 7.

On the back side of the contact / non-contact COT, a non-conductive thermal adhesive tape for bonding to the IC module mounting recess 30 of the card base 100 is provided on the entire surface of the reel tape except for the antenna connection terminals 52a and 52b. Paste (apply). Alternatively, a liquid adhesive may be used instead of the thermal adhesive tape as described above.
The contact / non-contact COT with the adhesive sheet is set in the implanter, and the implant process is started. The cut IC card substrate 100 is subjected to terminal exposure inspection, resonance characteristic inspection, electrical characteristic inspection, and the like. In the next unit, the accepted product is injected with a thermosetting conductive resin into the conduction concave holes 33a and 33b by a dispenser mechanism. A method of melting and connecting solder paste or eutectic solder in place of the thermosetting conductive resin is also conceivable, but a connecting step with a heater head that has been heated to a high temperature is required in the latter half of the implanting step.

  Contact / non-contact common COT50 with adhesive sheet is punched out, then mounted and sealed (pressed with a high-heat head for terminal connection if necessary), and simple inspections regarding COT pop-out, position and connection are performed. This completes the manufacturing process. After this, there are processes such as issue processing, character embossing, and inspection, but details are omitted.

<Manufacturing process of non-contact type IC card>
The manufacturing method of the non-contact type IC card can also be manufactured in the same process as the contact / non-contact type IC card. As described above, the position, size, shape, and the like of the IC module substrate 61 can be freely set because they are not limited to ISO regulations. Since the mounting position of the IC module can be freely selected to some extent, a contact IC card that operates in a system of another system can coexist in one IC card, and a SIM card or a hybrid card can also be used. On the other hand, if the standard is the same as that of the contact / non-contact IC card, the manufacturing apparatus and the program can be shared.
Similarly, the non-contact IC module 60 can be formed into a reel tape shape, and an adhesive tape is applied to the back surface of the IC module.

  The layer structure of the card base 100 does not necessarily have to be a symmetrical structure (symmetry) with the antenna sheet 101 as a central layer, and may be biased to one side. By increasing the thickness of the base material, it becomes possible to embed a label with a rewrite display function later or to attach a braille label.

<Embodiments related to other materials>
(1) Substrate for antenna sheet In addition to polyethylene terephthalate (PET), PET-G, polyethylene naphthalate, polybutylene terephthalate, polycarbonate, polyamide, polyarylate, polyetheretherketone, polyimide, polyetherimide, cellulose diacetate Cellulose triacetate, polystyrene, acrylic, polypropylene, hard vinyl chloride, ABS, glass epoxy substrate, and the like can be used.

(2) About conductive adhesive Although the epoxy resin etc. based on silver particle are used for a thermosetting type conductive resin, a different type metal compound type with copper paste, carbon, etc. can be used. The curing type includes a two-component curing type and a thermosetting type. Instead of the thermosetting conductive resin, a solder paste or eutectic solder can be dissolved and used.

<Manufacture of IC card base>
A biaxially stretched white PET sheet having a thickness of 38 μm was used as the antenna sheet substrate 101 c, and a rolled copper foil having a thickness of 35 μm was laminated on both sides thereof via an epoxy thermosetting adhesive having a thickness of 2 to 3 μm. A photosensitive resin was applied to the copper foil surface, exposed through a photomask and developed to form a resist pattern. This is etched to leave the bridge pattern 8 on the contact terminal plate surface side, as shown in FIG. 5, and the antenna having the antenna coil 20, antenna coil end portions 20a and 20b, and bridge connection portions 8a and 8b on the back side. Sheet 101 was obtained. The wiring on the front and back of the antenna sheet 101 is obtained by ultrasonically connecting the two portions of the bridge connecting portions 8a and 8b.

  Core sheets 102 and 103 made of a white PET-G resin sheet having a thickness of 280 μm are provided on the front and back sides of the antenna sheet via polyester hot-melt adhesive sheets 106 and 107 having a thickness of 50 μm, and further on the outer side. Oversheets 104 and 105 made of a transparent PET-G resin having a thickness of 50 μm were laminated and temporarily attached. After these sheets were temporarily stacked, they were placed on a hot plate of a press machine and press laminated. The conditions for the pressing process were a hot plate temperature of 120 ° C., a pressure of 2.0 MPa, and a molding heating time of 20 minutes. The total thickness of the card substrate 100 was close to 800 μm. Then, it cut | judged to each card size and completed the lamination process.

<Manufacture of contact / non-contact IC modules>
A copper foil is pasted on both sides of a glass epoxy substrate having a thickness of 100 μm, a photo-etching process is performed to form a contact IC card terminal pattern on the surface, and two antenna connection terminals 52a and 52b are sized on the back surface. However, it formed so that it might become 2.0 mm x 3.0 mm. Nickel plating and then gold plating were applied to the front and back terminal portions.
A contact / non-contact IC chip 3 is die-bonded to the central portion on the back side of the contact terminal plate (about 13.0 mm × 11.0 mm), and the metal surface on the back side of the contact terminal through five wire bonding openings 26. Connected with gold wire. The IC chip 3 and the wire connection part were transferred and molded with an epoxy resin.

  In this COT, the contact terminal plate 51 surface is arranged in two rows and is continuously formed in a tape shape. A polyester-based hot melt adhesive sheet is temporarily attached to the surface of the resin-sealed IC chip 3 so as not to prevent the connection of the antenna connection terminals (size: 4.0 mm × 4.0 mm) 52a, 52b, Prepared for the implant process.

<Implant process>
The IC card base 100 cut into individual pieces is subjected to NC processing, and as shown in FIGS. 1 and 6A, the formation of the IC module mounting recess 30 and the cutting of the conductive recess holes 33a and 33b for antenna connection are performed. Was done. An end mill blade with a diameter of 1.0 mm was used for both cuttings.

  The conductive adhesive (silver paste) 9 is injected into the conductive concave holes 33a and 33b of the cut card, and the IC module 50 prepared above is mounted, and then heated and pressurized at 200 ° C. for 1 second. The contact / non-contact IC card 1 was completed through an aging process for fixing and urging the conductive adhesive to cure.

  A non-contact IC card 2 was manufactured in the same manner as in Example 1 except that the non-contact IC module was manufactured as follows. The layer structure of the card substrate 100 was also the same as that in Example 1.

<Manufacture of non-contact IC modules>
Copper foil is attached to both sides of the glass epoxy substrate, photoetching is performed to make the front surface unpatterned, and the size of the antenna connection terminals 62a and 62b on the back surface is 2.0 mm × 3.0 mm. It formed so that it might become. The terminal portion on the back was plated with nickel and then with gold. A non-contact IC chip 4 was die-bonded to the central portion on the back side of the IC module substrate (about 10.0 mm × 13.0 mm). After the antenna connection terminals 62a and 62b were wire-connected, transfer molding (injection molding) with an epoxy resin and resin sealing were performed, thereby completing the non-contact IC module 60.

<Implant process>
After performing the implant process in the same manner as in Example 1 and injecting the conductive adhesive (silver paste) 9 into the conductive concave holes 33a and 33b of the cut card and mounting the IC module 60 prepared above. The non-contact type IC card 2 was completed through an aging process that was fixed by heating and pressurizing at 200 ° C. for 1 second and promoting the curing of the conductive adhesive.

  In both Example 1 and Example 2, the yield rate was almost 100%. Conventionally, when the end portion of the antenna coil on the lower side of the heat-meltable adhesive sheet is cut, the yield is greatly improved compared to the case where defective products of several percent or more are generated. It was also observed that durability was improved. When the metal foil was aluminum, a separate test was carried out, but similarly good cutting shapes of the mounting recess and the conductive recess were obtained.

1 is a cross-sectional view of a contact / non-contact type IC card (first embodiment) according to the present invention. It is the same top view. It is sectional drawing of the non-contact-type IC card (2nd form) of this invention. It is a figure which shows an example of the planar form of a non-contact-type IC card. It is a figure which shows an antenna sheet. It is a figure which shows the recessed part for conduction | electrical_connection for an IC module mounting | wearing recessed part and an antenna connection. It is a figure which shows the detailed structure of the concave hole for conduction | electrical_connection. It is a figure which shows a contact / non-contact common IC module. It is a figure which shows 1 of the conventional system of a contact / non-contact shared type IC card. It is a figure which shows 2 of the conventional system of a contact / non-contact shared type IC card. It is a figure which shows 3 of the conventional system of a contact / non-contact shared type IC card. It is a figure which shows the recessed part shape for IC module mounting | wearing which deform | transformed. It is a figure which shows the shape of an end mill blade. It is a figure which shows the state which the cutting waste of the adhesive sheet adhered to the end mill blade.

Explanation of symbols

1 Contact / Non-contact IC card 2 Non-contact IC card 3 Contact / Non-contact IC chip 4 Non-contact IC chip 5 SIM
DESCRIPTION OF SYMBOLS 7 Resin mold part 8 Conductive member, Bridge pattern 9 Conductive adhesive 16 Bridge 20 Antenna coil 20a, 20b Antenna coil edge part 26 Wire bonding opening 27 Wire 30 IC module mounting recessed part 33a, 33b Conductive recessed hole 50 Contact・ Non-contact shared IC module, COT
51 Contact terminal plate 52a, 52b Antenna connection terminal 60 Non-contact IC module 61 IC module substrate 62a, 62b Antenna connection terminal 100 Card base 101 Antenna sheet 102, 103 Core sheet 104, 105 Oversheet 106, 107 Adhesive sheet

Claims (12)

The antenna sheet on which the antenna coil is formed and at least the core sheet on the contact terminal plate side of the IC card are laminated via a heat-meltable adhesive sheet, and contact with both ends of the antenna coil of the antenna sheet In the contact / non-contact shared IC card in which the antenna connection terminals of the non-contact shared IC module are electrically connected with a conductive adhesive, the antenna coil of the antenna sheet is a thermosetting adhesive on the antenna sheet substrate. The metal foil laminated by etching is formed by etching, and both ends of the antenna coil of the antenna sheet are cut from the opposite side of the forming surface, and the connection terminal is formed by penetrating the antenna sheet base material. A contact / non-contact IC card characterized by 2. The contact / non-contact IC card according to claim 1, wherein a part or most of a portion other than the both ends of the antenna coil is formed on the heat-meltable adhesive sheet side. 3. The contact / non-contact type IC card according to claim 1, wherein the metal foil at both ends of the antenna coil is a copper foil. The antenna sheet on which the antenna coil is formed and at least the core sheet on the terminal board side of the IC card are laminated via a heat-meltable adhesive sheet, and both ends of the antenna coil of the antenna sheet are contactless IC In a non-contact type IC card in which the antenna connection terminals of the module are electrically connected with a conductive adhesive, the antenna coil of the antenna sheet is etched with a metal foil laminated on the antenna sheet base material with a thermosetting adhesive. The connection terminal is formed by cutting both ends of the antenna coil of the antenna sheet from the opposite side of the forming surface and penetrating the antenna sheet base material. Contact IC card. The non-contact type IC card according to claim 4, wherein a part or most of a portion other than the both end portions of the antenna coil is formed on the heat-meltable adhesive sheet side. 6. The non-contact type IC card according to claim 4, wherein the metal foil at both ends of the antenna coil is a copper foil. At least one core sheet is laminated between the antenna sheet on which the antenna coil is formed and the core sheet on the side of the contact terminal plate of the IC card via a heat-meltable adhesive sheet, and the antenna coil of the antenna sheet In the manufacturing method of a contact / non-contact type IC card in which both ends of the antenna and the antenna connection terminals of the contact / non-contact common IC module are electrically connected with a conductive adhesive, the following (1) to (6) The process of
(1) A step of laminating a metal foil on a substrate for an antenna sheet using a thermosetting adhesive to prepare an antenna sheet;
(2) forming a resist film in the shape of an antenna pattern on the metal foil surface of the antenna sheet and etching to form both ends of the antenna coil for connecting the antenna coil and the antenna connection terminal;
(3) A core sheet is laminated on both sides of the antenna sheet on which the antenna coil is formed via a hot-melt adhesive sheet, a transparent oversheet is further laminated on both sides, and then hot-pressed to form an integrated card substrate. The process of
(4) cutting the IC module mounting recess from the side opposite to the side where the antenna coil ends of the antenna sheet are located using an end mill blade;
(5) Similarly, a step of forming a concave hole for conduction in which part of both ends of the antenna coil is exposed using an end mill blade,
(6) A conductive adhesive is filled in the conductive concave hole, and a thermal adhesive tape or liquid adhesive is applied to a portion of the IC module that contacts the IC card base, and the IC module is loaded into the IC module mounting concave portion. Fixing the IC module to the IC card base and electrically connecting the IC module and the antenna coil;
A method for producing a contact / non-contact type IC card characterized by comprising: 8. The method for producing a contact / non-contact type IC card according to claim 7, wherein the contact hole is stopped so that the bottom surface of the conductive concave hole is positioned in the metal foil layer. 9. The method for manufacturing a contact / non-contact IC card according to claim 7 or 8, wherein a copper foil is used for the metal foil on both ends of the antenna coil. At least one core sheet is laminated between the antenna sheet on which the antenna coil is formed and at least the core sheet on the IC module substrate side of the IC card via a heat-meltable adhesive sheet, and the antenna coil of the antenna sheet In the method of manufacturing a non-contact IC card in which both ends of the non-contact IC module and the antenna connection terminals of the non-contact IC module are electrically connected with a conductive adhesive, the following steps (1) to (6):
(1) A step of laminating a metal foil on a substrate for an antenna sheet using a thermosetting adhesive to prepare an antenna sheet;
(2) forming a resist film in the shape of an antenna pattern on the metal foil surface of the antenna sheet and etching to form both ends of the antenna coil that connects the antenna coil and the antenna connection terminal;
(3) A core sheet is laminated on both sides of the antenna sheet on which the antenna coil is formed via a hot-melt adhesive sheet, a transparent oversheet is further laminated on both sides, and then hot-pressed to form an integrated card substrate. The process of
(4) cutting the IC module mounting recess from the side opposite to the side where the antenna coil ends of the antenna sheet are located using an end mill blade;
(5) Similarly, a step of forming a concave hole for conduction in which part of both ends of the antenna coil is exposed using an end mill blade,
(6) A conductive adhesive is filled in the conductive concave hole, and a thermal adhesive tape or liquid adhesive is applied to a portion of the IC module that contacts the IC card base, and the IC module is loaded into the IC module mounting concave portion. Fixing the IC module to the IC card base and electrically connecting the IC module and the antenna coil;
A method for producing a non-contact IC card, comprising: 11. The method of manufacturing a non-contact IC card according to claim 10, wherein the contact hole is stopped so that the bottom surface of the concave hole for conduction is located in the metal foil layer. 12. The method for manufacturing a non-contact IC card according to claim 10, wherein the metal foil at the both ends of the antenna coil is a copper foil.

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