JP6917832B2 - card - Google Patents

Description

The present invention relates to a card, particularly a card having a rigid embedded component.

With the development of card technology in recent years, various cards applicable to a wide range of applications have been provided. As a means to bring about this wide range of applications, the front and back of the inlet on which the antenna coil for transmitting and receiving electromagnetic waves is mounted is sandwiched between the core base material which is the card body, and the IC module, the sensor, and the display are placed on the surface of the core base material. Buried parts such as are buried. According to such a buried component, data communication processing with an external device can be performed using electromagnetic waves or the like.

An example of the above card is an IC card in which an IC chip is incorporated in the card. This IC card includes a contact type IC card that can write and read information by inserting it into a dedicated device, and a non-contact type that can write and read information just by bringing it close to the dedicated device. There is an IC card.

For example, a non-contact type IC card is configured by sandwiching the front and back of an inlet on which an IC chip having functions such as a control unit for controlling communication processing and a memory is mounted together with the above antenna coil between core base materials. There is.

In addition, an IC card in which a contact type IC card and a non-contact type IC card are combined is also widespread, and a hybrid type IC card in which a contact type IC chip and a non-contact type IC chip are mounted respectively. (Hybrid card) and a combination type IC card (combination card or dual interface card) on which one IC chip for both contact type and non-contact type is mounted.

The contact type IC card has an IC module exposed on the surface as an embedded component, and in order to mount the IC module, a recess for embedding the IC module is generally formed in the core base material. .. However, in an IC card having a core base material in which such a recess is formed, there is a problem that the inlet sheet and the core base material sandwiching the inlet sheet are delaminated. Various means have been proposed to solve this problem.

In Patent Document 1, it is an IC card in which an inlet having a circuit pattern including an antenna coil is sandwiched between two core base materials, and has an IC module exposed on the surface of the IC card. At least one through hole is formed in the inlet so as to straddle the area overlapping the module and the area not overlapping the IC module, and the two core base materials sandwiching the inlet are formed through the through hole. The combined IC card is disclosed. The through hole is said to have a horizontally long shape having a length equal to or longer than one side of the IC module corresponding to the longitudinal direction of the inlet sheet.

Japanese Patent No. 4825522

In an IC card in which a recess is formed for mounting an IC module exposed on the surface of the IC card, there is an increasing need to improve the durability of the card. In particular, the dynamic bending force of a card conforming to JIS X6305-1 is required to satisfy the number of times (1000 times) or more specified in this standard.

When the above-mentioned dynamic bending force is evaluated for the IC card of Patent Document 1, no defect occurs at the above-mentioned 1000 times, but when the evaluation is performed beyond this number of times, the IC module of the IC card becomes Cracks may occur on the surface opposite to the mounted surface. In addition, the expansion of this crack may cause the antenna to rupture. Further, the IC module may be lifted and the IC module may fall off.

Further, as the embedded parts other than the IC module embedded in the core base material, those having higher rigidity than the resin constituting the core base material are mainly used. Even when the dynamic bending force is evaluated for the card provided with the buried parts in the same manner, it is assumed that the same problem as described above will occur if the evaluation is performed more than 1000 times.

Therefore, even when the dynamic bending force of the card is evaluated more than the number of times specified in JIS X6305-1, the card is less likely to crack and the buried parts are less likely to malfunction. There is a need to provide a card.

As a result of diligent studies, the present inventors have found that the above problems can be solved by the following means, and have completed the present invention. That is, the present invention is as follows:
<1> An inlet, which comprises an antenna base material and an antenna circuit on the antenna base material.
Rigid embedded parts existing on the front and back of the inlet, which are embedded in the front and back core base materials, and at least the front side core base material, and a part of which is exposed on the surface of the front side core base material. Is a card that has
The front core base material, the inlet, and the back core base material are laminated in this order.
At the periphery of the inlet, the front and back core substrates are bonded to each other, and in a region of the card corresponding to at least a part of the rigid embedded component, the front and back core substrates are bonded to each other. The relationship between the adhesive force A1 between the front core base material and the antenna base material and the adhesive force A2 between the back side core base material and the antenna base material is as follows. A) Satisfying card:
A2 / A1 <1.0 (A).
<2> The card according to the above item <1>, which satisfies the above formula (A) in the entire region of the antenna base material.
<3> The card according to item <1> or <2> above, wherein the front side and back side core base materials are not bonded to each other in a region other than the peripheral edge of the inlet.
<4> The above <4> which has an adhesive layer between the front core base material and the antenna base material and does not have an adhesive layer between the back side core base material and the antenna base material. The card according to any one of items 1> to <3>.
<5> Any of the above items <1> to <4>, wherein the front side and back side core base materials are made of amorphous polyester, and the antenna base material is made of crystalline polyester. The card described in item 1.
<6> The rigid embedded component is an IC module having a substrate portion and a sealing portion that seals an IC chip.
The substrate portion is exposed on the surface of the front core substrate, and at least in the region corresponding to the substrate portion, the front and back core substrates are not bonded to each other, and the adhesive force A1 and the adhesive force A1. The relationship with the adhesive force A2 satisfies the above formula (A).
The card according to any one of the above items <1> to <5>.
<7> To provide an antenna base material and an inlet having an antenna circuit on the antenna base material.
The adhesive layer and the front core base material are arranged so that the adhesive layer exists between the front core base material and the surface of the antenna base material, and the back side core base material is placed on the back surface of the antenna base material. Arrangement, the inlet is sandwiched between the front and back core substrates, and the front and back core substrates are bonded at the peripheral edges of the front and back core substrates, respectively.
A method for manufacturing a card, which comprises forming a recess for installing a rigid embedded component from the surface of the front core base material and embedding the rigid embedded component in the recess.
In the region of the card corresponding to at least a part of the rigid embedded component, the front side and the back side core base materials are not bonded to each other, and the adhesive force between the front side core base material and the antenna base material. A method for manufacturing a card, wherein the relationship between A1 and the adhesive force A2 between the back core base material and the antenna base material satisfies the following formula (A):
A2 / A1 <1.0 (A).
<8> The rigid embedded component is an IC module having a substrate portion and a sealing portion that seals an IC chip, and at least in a region corresponding to the substrate portion, the front side and back side core base materials are The relationship between the adhesive force A1 and the adhesive force A2, which are not bonded to each other, satisfies the above formula (A).
The method according to item <7> above.

According to the present invention, even when the dynamic bending force of the card is evaluated more than the number of times specified in JIS X6305-1, the card is less likely to crack and the buried parts are less likely to malfunction. It is possible to provide a card that is compatible with each other.

FIG. 1A is a side sectional view of one aspect of the card of the present invention. FIG. 1B is a front view of the inlet of one aspect of the card of the present invention. FIG. 2 is a diagram showing an example of a laminated region of an adhesive layer in the card of the present invention. FIG. 3A is a side sectional view of one aspect of the card of the present invention in which the rigid embedded component is an IC module. FIG. 3B is a view of the inlet of the card of FIG. 3A as viewed from the front side. FIG. 4 is a diagram showing a method for manufacturing a card of the present invention. 4 (a) is a diagram showing a coating process, FIG. 4 (b) is a diagram showing a sandwiching process, and FIG. 4 (c) is a diagram showing a recess forming process, FIG. 4 (d). ) Is a diagram showing an embedding process. FIG. 5 is a diagram showing a method of manufacturing a card of the present invention in which the rigid embedded component is an IC module. 5 (a) is a diagram showing a coating process, FIG. 5 (b) is a diagram showing a sandwiching process, and FIG. 5 (c) is a diagram showing a recess forming process, FIG. 5 (d). ) Is a diagram showing an embedding process. FIG. 6 is a diagram showing the position of the adhesive layer on the card of the comparative example. FIG. 7 is a diagram showing the positions of fusion holes in the cards of the comparative example.

"card"
As shown in FIG. 1, the card (100) of the present invention comprises an antenna substrate (8) and an antenna circuit (2) on the antenna substrate (8), the inlet (10).
Front and back core substrates (30a, 30b) present on both sides of the inlet (10),
Rigid embedded component (20) that is embedded in at least the front core base material (30a) and the surface of the substrate portion (22) is exposed on the surface of the front core base material (30a).
Is a card (100) equipped with
The front core base material (30a), the inlet (10), and the back side core base material (30b) are laminated in this order.
At the periphery of the inlet (10), the front and back core substrates (30a, 30b) are bonded to each other and the front and back cores of the card (100) correspond to at least a portion of the rigid embedded component. The base materials (30a, 30b) are not bonded to each other, and the adhesive force A1 between the front side core base material (30a) and the antenna base material (8) (8a) and the back side core base material (30b) The relationship of the adhesive force A2 between the antenna base material (8) and (8b) satisfies the following formula (A):
A2 / A1 <1.0 (A).

In addition, the card of the present invention may have optional spacers (40a, 40b) surrounding the side surface of the inlet (10).

With the above configuration, the present inventors are less likely to malfunction the rigid embedded parts and crack the card even when the dynamic bending force of the card is evaluated more than the number of times specified in JIS X6305-1. It was found that it is possible to achieve both the difficulty of occurrence of. Although not bound by theory, this is because the front and back core substrates are not bonded to each other and the back core substrate and antenna substrate are in the region corresponding to a portion of the rigidly embedded component. Due to the weak adhesive force between them, the stress applied to a part of the rigidly embedded parts and the front side core base material and the back side core base material to each other during the bending test is relaxed, especially for the rigidly embedded parts. It is considered that the stress received from the back core base material is relaxed for a part and the front core base material.

The above-mentioned adhesive strengths A1 and A2 can be the adhesive strengths evaluated by the delamination test according to JIS X 6305-1.

The ratio of A2 / A1 is preferably less than 1.0, 0.8 or less, 0.5 or less, 0.3 or less, 0.1 or less, or 0 from the viewpoint of obtaining the above-mentioned relaxation effect.

In particular, when the above bending test is performed, a part of the rigidly embedded part is made to follow only the front core base material, and the stress received from the back side core base material is eliminated, thereby further suppressing the malfunction of the rigidly embedded part. From this point of view, it is preferable that the card of the present invention has an adhesive layer between the front core base material and the inlet, and does not have an adhesive layer between the back core base material and the inlet.

In order to satisfy the above formula (A) at least in the region corresponding to a part of the rigid buried part, as shown in FIG. 1 (a), in the region (6) where a part of the rigid buried part is planned to be installed. , An adhesive layer (50) may be present between the front core substrate and the inlet.

As shown in FIG. 2 (b), the adhesive layer (50) may exist so as to surround the area (6) where a part of the rigid embedded parts is planned to be installed, or FIG. 2 ( As shown in b), it may be present on the entire antenna substrate (8), thereby satisfying the formula (A) in the region of the entire antenna substrate (8). Further, as shown in FIG. 2C, this adhesive layer may be present in all or a part of the region (30) between the front side core base material and the back side core base material.

In the region other than the peripheral edge of the inlet, the front side and the back side core base materials are not bonded to each other, that is, the fusion holes such as the fusion holes described in Patent Document 1 are not formed in the inlet. When the dynamic bending force of the card is evaluated more than the number of times specified in JIS X6305-1, it may be preferable from the viewpoint of making it difficult for the card to crack.

Further, from the viewpoint of controlling the above A1 and A2 only by the adhesive layer, it is preferable that the front side and back side core base materials and the antenna base material are made of a substance that does not fuse with each other. For example, it is preferable that the front side and back side core base materials are made of amorphous polyester, and the antenna base material is made of crystalline polyester.

Hereinafter, each component of the present invention will be described.

<Inlet>
The inlet includes an antenna base material and an antenna circuit on the antenna base material.

{Antenna base material}
Examples of the antenna base material include polyolefin resins such as polyethylene and polypropylene, polystyrene resins, polyvinyl chloride resins, poly (meth) acrylate resins, acrylic resins, polyacetal resins, crystalline polyethylene terephthalates (PET), and poly. Crystalline polyester resins such as butylene terephthalate and polyethylene naphthalate (PEN), polyamide resins, polycarbonate resins, polyphenylene sulfide resins, and thermoplastic resins such as polyimide resins can be used.

The thickness of the antenna base material can be, for example, 1 μm or more, 5 μm or more, or 10 μm or more, and 100 μm or less, 60 μm or less, or 30 μm or less.

{Antenna circuit}
The antenna circuit may be an aluminum foil, a copper foil, or the like. The antenna circuit can be formed by etching, vapor deposition, or winding.

The antenna circuit may further include an antenna terminal in an area where a part of the rigid embedded component is planned to be installed.

(Antenna terminal)
The antenna terminal is a connection terminal for electrically connecting to a part of the rigid embedded component.

{Other configurations}
The inlet in the card of the present invention may further have an IC chip connected to the antenna circuit. The IC chip is a chip component equipped with semiconductor integrated circuits such as a CPU, RAM, ROM, and EEPROM.

<Front and back core base materials>
The front side and back side core base materials are core base materials existing on both sides of the inlet. In particular, within the scope of the context of the present invention, one core base material in which a part of the surface of the rigid embedded component is exposed on the surface is referred to as a "front side core base material", and the other core base material is referred to. The material is referred to as the "backside core substrate".

The front and back core substrates are bonded to each other outside the periphery of the inlet. This bond may be made directly or via a spacer and / or an adhesive layer. As the spacer, the following thermoplastic resin that can be used as the front side and back side core base materials can be used, and as the adhesive layer, the adhesives mentioned below can be used.

Examples of the front and back core base materials include polyolefin resins such as polyethylene and polypropylene, polystyrene resins, polyvinyl chloride resins, poly (meth) acrylate resins, acrylic resins, polyacetal resins, and crystalline polyethylene terephthalate (PET). , PET-G), polybutylene terephthalate, crystalline polyester resin such as polyethylene naphthalate (PEN), amorphous polyester resin such as amorphous polyethylene terephthalate (PET-G), polyamide resin, polycarbonate (PC) resin, A thermoplastic resin such as a polyphenylene sulfide resin or a polyimide resin can be used. The core base material may be one in which these resins are used in a single layer, or may be a laminate thereof.

The thickness of the front and back core base materials is such that the total thickness of the card is 650 μm or more, 680 μm or more, 700 μm or more, or 720 μm or more when the front and back surfaces of the inlet are sandwiched between the front and back core base materials and thermocompression bonded. Yes, and can be adjusted to be 840 μm or less, 820 μm or less, or 800 μm or less.

Further, the front side and back side core base materials may be provided with other optional layers. Examples of other layers include a protective layer, a thermal recording layer, a printing layer and the like. These layers may be contained in only one of the front and back core substrates, or both.

<Rigid buried parts>
The rigid embedded parts are at least embedded in the front core base material, and a part of them is exposed on the surface of the front core base material.

The rigid embedded part can be a part having a higher flexural modulus than the resin constituting the front core base material. The flexural modulus can be evaluated using a predetermined test piece in accordance with, for example, JIS K 7171. The flexural modulus of a rigidly embedded part smaller than a test piece conforming to JIS K 7171 can be evaluated using a test piece having the same material, layer structure, and the like as the rigidly embedded part to be evaluated.

As such a rigid embedded component, for example, an IC module, a sensor, a display, or the like can be used.

Hereinafter, an IC module, which is an example of a rigid embedded component, will be specifically described.

<Rigid embedded parts: IC module>
The IC module may have a substrate portion and a sealing portion that seals the IC chip. When the rigid embedded component is an IC module, a part of the rigid embedded component exposed on the surface of the front core base material may be a substrate portion. That is, as shown in FIG. 3, the IC module (20') is embedded in at least the front core base material (30a), and the substrate portion (22) is exposed on the surface (30a) of the front core base material. You may be. In this case, the sealing portion (24) may penetrate the antenna base material and exist in the back side core base material (30b).

The substrate portion may have, for example, a module substrate and external contact terminals existing on a surface exposed to the outside of the module substrate. When the card of the present invention is used as a combination card, this board portion further has an optional internal connection terminal for connecting to the antenna terminal of the inlet on the side opposite to the side where the external contact terminal exists. May be good.

The module substrate may be made of, for example, glass-epoxy, polyimide, or the like. The size of the surface exposed to the outside of the module substrate may be about 11.8 × about 13 mm.

The external contact terminal may be, for example, an external contact terminal in which a plating layer made of nickel, gold, silver or the like is laminated on a pattern made of copper.

The sealing portion has a contact type IC chip connected to an external contact terminal for performing communication processing in a contact state, and a sealing resin for sealing the contact type IC chip. It's okay.

The connection between the IC chip and the external contact terminal can be performed by a connecting member such as wire bonding.

<Adhesive layer>
As the adhesive layer, for example, polyester resin-based, epoxy resin-based, urethane resin-based, silicone resin-based, vinyl acetate resin-based, and acrylic resin-based thermosetting adhesives, and mixtures and derivatives thereof can be used. Moreover, a thermoplastic adhesive (hot melt adhesive) can be used. The form of these adhesives may be one-component type, sheet-like, or two-component type.

The thickness of the adhesive layer can be 1 μm or more, 3 μm or more, or 5 μm or more, and can be 20 μm or less, 15 μm or less, or 10 μm or less.

<spacer>
The spacer is an optional spacer that surrounds the side surface of the inlet.

As the spacer, the materials mentioned for the core base material can be used.

The thickness of the spacer can be selected according to the thickness of the antenna base material, and can be, for example, 1 μm or more, 5 μm or more, or 10 μm or more, and 100 μm or less, 60 μm or less, or 30 μm or less.

《Card manufacturing method》
The method of the present invention for producing a card includes an inlet providing step, an adhesive layer laminating step, a sandwiching step, a recess forming (cutting) step, and an embedding step. Here, in the region of the card corresponding to at least a part of the rigid embedded component, the front side core base material and the back side core base material are not bonded to each other, and the adhesive force A1 between the front side core base material and the antenna base material , The relationship of the adhesive force A2 between the back core base material and the antenna base material satisfies the following formula (A):
A2 / A1 <1.0 (A).

Hereinafter, the details of each step will be described with reference to FIG.

<Inlet provision process>
The inlet providing step means providing an antenna substrate and an inlet comprising an antenna circuit on the antenna substrate.

In the inlet providing step, for example, an aluminum foil, a copper foil, or the like is attached to the antenna base material mentioned for the inlet and a loop shape is formed by etching, or a silver paste is printed by screen printing to form a loop shape. , The method of forming a loop shape by routing a wire, the method of transferring a transfer foil for an antenna pattern to form a loop shape, and the like can be performed by forming an antenna circuit on an antenna base material.

<Pinching process>
In the sandwiching step, the adhesive layer and the front core base material are arranged so that the adhesive layer exists between the front side core base material and the front side surface of the antenna base material, and the back side is placed on the back side surface of the antenna base material. It means that the core base material is arranged, the inlet is sandwiched between the front side and the back side core base material, and the front side and the back side core base material are bonded at each peripheral portion of the front side and the back side core base material.

More specifically, in the sandwiching step, as shown in FIG. 4A, first, an adhesive layer (8a) between the front core base material (30a) and the front surface (8a) of the antenna base material (8) is used. The adhesive layer (50) and the front core base material (30a) are arranged so that the 50) is present, and the back side core base material (30b) is arranged on the back surface (8b) of the antenna base material (8). do.

As shown in FIG. 4A, the adhesive layer can be arranged, for example, by laminating it on the front core base material (30a). The region where the adhesive layer is arranged may be a region corresponding to at least a part of the rigid embedded component of the antenna base material, a region corresponding to the shape of the antenna base material, or the entire front core base material. It may be the area of.

Further, after the card is manufactured, an adhesive layer is laminated on the back surface (8a) of the antenna base material (8) as long as the above formula (A) is satisfied, at least in the region corresponding to a part of the rigid embedded parts. You may let me.

Next, as shown in FIG. 4B, the inlet (10) is sandwiched between the front side and back side core base materials (30a, 30b), and at the peripheral edges of the front side and back side core base materials (30a, 30b), respectively. The front side and back side core base materials (30a, 30b) are bonded.

Bonding may be performed via an adhesive layer or by thermocompression bonding. Further, at the time of bonding, optional spacers (40a, 40b) may be arranged so as to surround the side surface of the inlet (10). As the spacer, the materials mentioned for the core base material can be used. That is, the front side and back side core base materials may be directly bonded or may be bonded via a spacer and / or an adhesive layer.

<Recess formation process>
In the recess forming step, as shown in FIG. 4C, a recess (20a) for installing the rigid embedded component is formed from the surface of the core base material (30a) to a region where the rigid embedded component is planned to be installed. Means that. The recess can be formed, for example, by cutting.

<Embedding process>
The embedding step means embedding the rigid embedded part (20) in the recess as shown in FIG. 4 (d).

When embedding the rigid embedded component (20), the antenna terminal (2a) and the rigid embedded component (20) may be adhered to each other via, for example, silver paste.

<< Card manufacturing method: When the rigid embedded part is an IC module >>
Even when the rigid embedded component is an IC module having a substrate portion and a sealing portion that seals the IC chip, the method of the present invention for manufacturing a card is an inlet providing step, an adhesive layer laminating step, and a sandwiching step. Includes recess forming (cutting) steps, and embedding steps. Here, in the region corresponding to at least the substrate portion of the IC module of the card, the front side and the back side core base materials are not bonded to each other, and the relationship between the adhesive force A1 and the adhesive force A2 is based on the above formula (A). Meet.

The inlet providing step, the adhesive layer laminating step, the sandwiching step, and the embedding step can be performed in the same manner as described above. Further, the recess forming (cutting) step may be performed in the same manner as described above, or as shown in FIG. 4 (c), the sealing portion (24) of the IC module (20') is embedded in the antenna. The recess (20a) may be formed so as to penetrate the base material (8).

The present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

《Making a card》
<Example 1>
As the inlet, an inlet having an antenna circuit (thickness 30 μm) having an antenna terminal on one side on PET (thickness 38 μm) as an antenna base material was used.

Then, PET-G (thickness 50 μm) as a spacer was placed so as to surround the side surface of the inlet, and then PET-G (thickness 225 μm), PET-G (thickness 100 μm), and PET- Laminates as a core base material having G (thickness 50 μm) in this order are arranged on both sides of the inlet so that PET-G (thickness 225 μm) is on the inlet side, and these are thermocompression bonded from both sides. rice field. At the time of arrangement, as shown in FIG. 5A, a polyester-based two-component curable adhesive (thickness 7 μm) was applied only to the surface of the front core base material (30a) in contact with the antenna circuit (2). The adhesive layer was laminated by coating so as to correspond to the shape of the antenna base material (8).

Next, a recess for embedding the IC module as a rigid embedded component is formed from the side where the adhesive layer of the inlet exists, the IC module is embedded, and the antenna terminal and the IC module are joined via silver paste. The card of Example 1 was prepared.

<Comparative example 1>
As shown in FIG. 6A, the adhesive layer (on the surface of the front core base material (30a) in contact with the antenna circuit (2) and the surface of the back side core base material (30b) in contact with the antenna base material (8)) A card of Comparative Example 1 was produced in the same manner as in Example 1 except that 50) were laminated.

<Comparative example 2>
As shown in FIG. 6B, Comparative Example 1 except that the adhesive layer (50) was laminated only on the surface of the back core base material (30b) in contact with the antenna base material (8). In the same manner as above, the card of Comparative Example 2 was produced.

<Comparative example 3>
The card of Comparative Example 3 was produced in the same manner as in Example 1 except that the adhesive layer was not laminated on the front side and back side core base materials. However, the bending test shown below could not be performed because the IC module could not be embedded due to peeling between the core base material on the side where the IC module was embedded and the inlet.

<Comparative Examples 4 to 7>
As shown in FIG. 7, cards of Comparative Examples 4 to 7 were produced in the same manner as in Examples and Comparative Examples 1 to 3, except that fusion holes (4a and 4b) were engraved in the inlet.

《Bending test》
Bending tests were performed on the cards of Examples and Comparative Examples 1, 2, and 4 to 7 in accordance with JIS X6305-1 5.8. Specifically, the front and back surfaces in the long side direction and the front and back surfaces in the short side direction were performed at a pitch of 250 times, and every 1000 times, the IC module was observed to malfunction and the card was cracked. In Table 1 below, the number of bending tests when dysfunction or cracks did not occur is described, and defects that did not occur even after 5000 times are described as "more than 5000".

The results are shown in Table 1.

From Table 1, the recording medium of the examples did not cause any malfunction of the IC module or cracks of the card even when the bending test was performed 4000 times, so that the malfunction of the IC module is unlikely to occur. It can be understood that it is a combination of the difficulty of cracking the card. On the other hand, it was understood that the cards of Comparative Examples 1, 2 and 4 to 7 had either a malfunction of the IC module or a crack of the card before the number of bending tests reached 4000. Let's do it.

2 Antenna circuit 2a Antenna terminal 4a, 4b Fusion hole of comparative example 6 Area where rigid embedded parts are planned to be installed 8 Antenna base material 8a Between front side core base material and antenna base material (front side surface of antenna base material)
8b Between the back core base material and the antenna base material (the back surface of the antenna base material)
10 Inlet 20 Rigid embedded parts 20'IC module 20a Recessed 22 Substrate part 24 Sealing part 30 Area between front side core base material and back side core base material 30a Front side core base material 30b Back side core base material 40a, 40b Spacer 100 Card

Claims (7)

An inlet, comprising an antenna substrate and an antenna circuit on the antenna substrate.
Front and back core substrates present on both sides of the inlet, and
An IC module having a substrate portion and a sealing portion that seals an IC chip, which is embedded in at least the front core base material, and the substrate portion is exposed on the surface of the front core base material. It is a card equipped with an IC module.
The front core base material, the inlet, and the back side core base material are laminated in this order.
On the outside of the periphery of the inlet, the front and back core substrates are bonded to each other, and the front and back core substrates are connected to each other in at least a region of the card corresponding to the substrate portion of the IC module. The relationship between the adhesive force A1 between the front core base material and the antenna base material and the adhesive force A2 between the back side core base material and the antenna base material, which are not bonded, is as follows. A card that satisfies formula (A):
A2 / A1 <1.0 (A). The card according to claim 1, which satisfies the formula (A) in the entire region of the antenna base material. The card according to claim 1 or 2, wherein the front side and back side core base materials are not bonded to each other in a region other than the peripheral edge of the inlet. Claims 1 to 3 have an adhesive layer between the front core base material and the antenna base material, and do not have an adhesive layer between the back side core base material and the antenna base material. The card described in any one of the items. The card according to any one of claims 1 to 4, wherein the front side and back side core base materials are made of amorphous polyester, and the antenna base material is made of crystalline polyester. To provide an antenna substrate and an inlet comprising an antenna circuit on the antenna substrate.
The adhesive layer and the front core base material are arranged so that an adhesive layer exists between the front core base material and the surface of the antenna base material, and the back side core base material is placed on the back surface of the antenna base material. Arrangement, the inlet is sandwiched between the front and back core substrates, and the front and back core substrates are bonded at the peripheral edges of the front and back core substrates, respectively.
A method for manufacturing a card, which comprises forming a recess for installing a rigid embedded component from the surface of the front core base material, and embedding the rigid embedded component in the recess.
In the region of the card corresponding to at least a part of the rigid embedded component, the front side and the back side core base materials are not bonded to each other, and the adhesive force between the front side core base material and the antenna base material. A method for manufacturing a card, wherein the relationship between A1 and the adhesive force A2 between the back side core base material and the antenna base material satisfies the following formula (A):
A2 / A1 <1.0 (A). The rigid embedded component is an IC module having a substrate portion and a sealing portion that seals an IC chip, and the front side and back side core base materials are bonded to each other at least in a region corresponding to the substrate portion. The relationship between the adhesive force A1 and the adhesive force A2 satisfies the formula (A).
The method according to claim 6.

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