JP2010092120A - Non-contact information medium and booklet with non-contact information medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact information medium for reducing undulation, waviness, or curl on a substrate of a section where an antenna exists by forming one of outer base materials using foaming resin which is excellent in adhesiveness, and forming the other one using non-foaming resin. <P>SOLUTION: The non-contact information medium includes: an antenna sheet 3 on which an antenna 4 is formed; an IC chip 5 connected to the antenna 4; and outer base materials laminated on both faces of the antenna sheet 3. One of the outer base materials is a first base material 6 formed of a porous foaming resin member, and the other one is a second base material 7 formed of a non-foaming resin member. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a non-contact information medium that performs non-contact data communication with an external device and a booklet with a non-contact information medium including the non-contact information medium.

In recent years, systems using non-contact IC cards and non-contact IC tags have become widespread, and non-contact information media provided with IC inlets that allow electronic data to be entered and printed on booklets such as passports and savings passbooks are used. Has been. A non-contact information medium has a base material that has a tear strength higher than that of fine paper or coated paper on both sides of an antenna sheet including an IC module and an antenna connected to the IC module, and has excellent flexibility. Installed and configured.
As such a non-contact information medium, one in which an exterior base material sandwiching an antenna sheet from both sides is formed of a porous foamed resin is known (for example, see Patent Document 1).
6A is an exploded cross-sectional view schematically showing the non-contact information medium 21 described in Patent Document 1, and FIG. 6B is a view of joining the non-contact information medium 21 described in Patent Document 1. It is sectional drawing which shows the state made to do.
The non-contact information medium 21 is formed by sandwiching an IC inlet 22 from above and below by two sheet-like foamed resin sheets 26 having a porous structure. The IC inlet 22 and the sheets 26 attached to the upper and lower surfaces thereof are integrally joined by an adhesive (not shown).
The IC inlet 22 includes an antenna sheet 23, antenna coils 24 formed on both surfaces of the antenna sheet 23, and an IC chip 25 attached to the antenna sheet 23.
The sheet 26 having a porous structure is water-absorbing and can use water or alcohol-based glue. For this reason, it is suitable for joining with cover members, such as paper, and it is supposed that the lamination process excellent in joining strength can be performed using a porous structure. On the other hand, if a foamed resin is used for the antenna sheet 23, the hygroscopic property hinders the etching process for installing the antenna 24, and therefore, a non-foamed resin is often used.
US Pat. No. 7,059,535

By the way, although the sheet 26 made of foamed resin in the non-contact information medium 21 of Patent Document 1 has high heat shrinkability, the antenna sheet 23 employs non-foamed resin and has heat shrinkability different from that of the sheet 26. For this reason, when the antenna layer 24 provided on the antenna sheet 23 is sandwiched and laminated and bonded, the thermal contraction rate between the foamed resin sheet 26 and the antenna sheet 23 is largely different from that of the antenna on the surface of the sheet 26. There is a problem that local deformation, that is, undulation, undulation, and curling are likely to occur. As a result, as shown in FIGS. 6B and 6C, the presence of the antenna layer 24 is visually recognized on the surface of the sheet 26 and the cover material 27, and there is a problem that the quality of appearance deteriorates.
Further, when the sheet 26 made of foamed resin is attached to the antenna sheet 23 including the thick antenna 24 with a high degree of expansion of the base material, the sheet 26 expands according to the thickness, and the thickness of the antenna sheet 24 is increased. Since it is easy to be raised, there is a problem in that the presence of the surface antenna 24 of the sheet 26 and the cover material 27 is easy to visually recognize and the appearance quality is lowered as described above.
Furthermore, the foamed resin has a lower tear resistance than the non-foamed resin, and there is a problem that if the sheet 26 is intentionally torn, the antenna sheet 23 is easily torn, and the antenna sheet 23 is easily damaged. Since it is easy to take out only the IC inlet for the purpose, there is a problem that it is not desirable from the viewpoint of security.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a non-contact information medium having a good appearance and high tear strength and security.

In order to achieve the above object, the present invention provides the following means.
The non-contact information medium according to the first aspect of the present invention is formed by covering both sides of an inlet having an antenna sheet having antennas formed on both sides and an IC chip connected to the antenna with an exterior base material. A non-contact type information medium, wherein one of the exterior substrates is a first substrate made of a porous foamed resin, and the other of the exterior substrates is a second substrate made of a non-foamed resin. It is characterized by that.
The non-contact information medium with a cover according to the second aspect of the present invention is characterized by comprising a cover member bonded to one surface of the non-contact information medium.
A booklet with a non-contact information medium according to a third aspect of the present invention is characterized by including the non-contact information medium of the present invention.

  According to the non-contact information medium of the present invention, by using a foamed resin on one side of the antenna sheet and having an adhesive property with a booklet paper surface, etc. Generation of undulation, undulation and curling of the substrate can be suppressed, and a non-contact information medium with high tear strength and security can be provided while improving the quality on appearance.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a view showing an IC inlet 2 constituting a part of a non-contact IC inlay (non-contact type information medium) according to an embodiment of the present invention. 2A is an exploded cross-sectional view in which a non-contact IC inlay 1 is manufactured using the IC inlet 2, and FIG. 2B is a cross-sectional view showing a state in which an exterior base material is bonded to the IC inlet 2. It is.

  The non-contact IC inlay 1 is formed by sandwiching an IC inlet 2 from above and below by two sheet-like exterior base materials, a first base material 6 and a second base material 7. The IC inlet 2 and the first base material 6 and the second base material 7 attached to both upper and lower surfaces thereof are integrally joined by an adhesive 8.

  The IC inlet 2 includes an antenna sheet 3, antenna coils 4 formed on both surfaces of the antenna sheet 3, and an IC chip 5 attached to the antenna sheet 3.

    As a material for the antenna sheet 3, various resins such as polyethylene terephthalate (PET) can be suitably employed.

  The antenna coil 4 is formed by a method such as etching, wire bonding, or printing using a conductor such as aluminum or silver. Among these, aluminum is inexpensive and is preferable from the viewpoint of manufacturing cost. The antenna coil 4 has an antenna loop 4A provided on one surface and a jumper wire 4B formed on the other surface. The end of the jumper wire 4B is electrically connected to the antenna loop 4A by using a through hole (not shown) opened in the sheet or by caulking.

    The IC chip 5 is attached to the antenna sheet 3 by being electrically connected to the antenna coil 5 by welding or the like. As a result, the IC inlet 2 can transmit and receive data without contact with an external data reader or the like.

The first substrate 6 is made of polyethylene, polypropylene, polybutene, polyisoprene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer, propylene-α-olefin copolymer, ethylene. -It consists of polyolefin resin, such as an ethyl acrylate copolymer and an ionomer. The 1st base material 6 consists of a base material which can be obtained by the method of mixing porous particles, such as a silica, and adding air at the time of kneading | mixing resin, making it foam, and carrying out perforation processing after extending | stretching.
As the 1st base material 6, what is marketed as a resin sheet or synthetic paper which gave printing suitability to ink jet, offset, etc. can also be used. Moreover, the 1st base material 6 has what has thermoplasticity. For example, a polyolefin-based foamed resin used for the first base material 6 has high flexibility, and is an effective base material for maintaining flexibility by using it in a product such as a booklet as a final product.
The first base 6 is desirably about 0.15 mm to 0.50 mm in thickness.

The second base material 7 made of non-foamed resin is made of the same material as the antenna sheet, such as PET, PEN, PEN-G, PET-G, PVC, polyimide, or the expansion and contraction due to heat and other processing becomes equal to the antenna sheet. It consists of the base material of such a material.
Therefore, the second base material is preferably a base material made of a material having a thermal shrinkage of 0.1% to 2% (150 ° C. for 30 minutes). In addition, it is preferable that the second base material 7 has a degree of elongation of 100 to 200% (MD) and 75% to 150% (CD).
Further, the second substrate 7 is made of a non-foamed resin so that the hardness of the entire booklet is not increased when it is incorporated into a booklet or the like, that is, the flexibility of the booklet is not impaired. The hardness (flexibility) of the second substrate can be adjusted by the thickness of the second substrate. When the thickness of the second base material is 0.03 mm to 0.15 mm and the hardness is 0.05 to 0.50 mN · m, the second base material can be suitably used. More preferably, the thickness is 0.075 mm. The hardness is measured in accordance with, for example, (J) TAPPI UM409, the sheet flexibility (deflection amount) y, w is the weight per square meter of the test piece, and L is the portion of the test piece where the deflection is measured. It may be installed after examination based on the hardness El calculated with the following calculation formula.
El = wL ¹ / 8y

Adhesive 8 includes ethylene vinyl acetate copolymer (EVA), ethylene acrylic acid copolymer (EAA), ethylene methacrylic acid copolymer (EMAA), polyester, polyamide, polyurethane, and olefin. What consists of various thermoplastic resins, such as, can be employ | adopted suitably. In addition, the adhesive 8 preferably has a heat melting property.
The thickness of the first base material 6 and the second base material 7 to be bonded to the antenna sheet 3 with the adhesive 8 is desirably 0.001 mm to 0.03 mm. As a result, it is possible to maintain the adhesive strength between the first base material 6 and the second base material 7 and the antenna sheet 3 and to maintain the barrier effect against the antenna corrosion due to the infiltration of a solution such as alcohol or salt water.

As described above, according to the present invention, the second resin can be obtained by adopting the foamed resin on one surface of the antenna sheet and adopting the non-foamed resin on the other surface while having adhesiveness with the booklet paper surface. By making the heat shrinkage rate of the base material and the antenna sheet equal, as shown in FIG. 2B, the heat shrinkage rate of the antenna sheet and the second base material is different in the heat laminating process. It is possible to suppress the occurrence of waviness, undulation, and curling of the surface, and the effect that the quality of appearance can be improved is obtained. As a result, the entire non-contact information medium can be suitable for a booklet. An effect is obtained.
Moreover, according to the 2nd base material of this invention, the thermal contraction rate of a base material is suppressed to 0.1%-2% (150 degreeC 30 minutes), and the thermal contraction rate of a 2nd base material and an antenna sheet is equivalent. Therefore, it is possible to effectively suppress the occurrence of surface undulation, undulation, and curling due to thermal shrinkage during the lamination process, and the effect of improving the appearance quality can be obtained.
In addition, according to the present invention, by adopting the second base material having an extension degree of 100 to 200% (MD) and 75% to 150% (CD), the thickness of the antenna on the antenna sheet can be used to adjust the exterior base material. It is possible to effectively prevent the appearance of irregularities that can appear on the surface, make it impossible to see the built-in antenna and antenna sheet from the surface of the exterior base material, and improve the appearance quality as described above. Is obtained.
Further, according to the present invention, the unevenness of the portion where the antenna is arranged in the antenna sheet is greatly reduced, so that the exterior base material or the cover member in the portion can be prevented from being worn.
Furthermore, according to the present invention, the thickness of the second base material is 0.03 mm to 0.15 mm, and the hardness of the second base material is 0.05 to 0.50 mN · m. The non-contact information medium using only the first base material can maintain the tear resistance even when it is thin.

3A is an exploded cross-sectional view showing the configuration of the non-contact IC inlay 10 with a cover member of the present invention, and FIG. 3B is a cross-sectional view showing a state where the cover member 11 is attached to the non-contact inlay 1. It is.
The non-contact IC inlay 1 according to the present invention is an intermediate product before it is applied to a booklet, with a cover member 11 made of cloth or PVC or the like made of a cloth material or PVC bonded to the outer surface of the second substrate 7.
The cover member 11 can employ cloth cloth, paper cloth, or PVC cloth having a thickness of 0.25 mm to 0.5 mm, and a polyurethane, vinyl chloride, or vinyl acetate adhesive having a thickness of 0.005 mm to 0.05 m. It can distribute | arrange on the outer surface of the 2nd base material 7 via. Furthermore, the non-contact IC inlay 10 with a cover having a thickness of 0.5 mm to 1.4 mm can be formed by heat laminating.

  When the configuration of the present invention is adopted, as shown in FIG. 3B, even if the second base material 7 and the cover member 11 are bonded together, the thickness of the antenna 4 is the surface of the second base material, and thus the surface of the cover member. The surface of the second substrate 7 or the cover member 11 is not uneven.

FIG. 4 is a diagram showing a state in which the non-contact IC inlay 1 is applied to the booklet 15.
On the non-contact IC inlay 1, a booklet surface (sheet paper) 12 such as coated paper or high-quality paper is bonded or bound to the first substrate 6, while a cover made of cloth, cloth, PVC or the like is used. The member 11 is attached to the second substrate 7 with an adhesive and can be a part of the booklet 15 with the non-contact information medium.

As shown in FIG. 5A or 5B, the antenna sheet 3 is provided with a through hole 13 that penetrates in the thickness direction, and penetrates the first base material and the second base material described later. The holes 13 can be joined without the antenna sheet 3 interposed therebetween.
By providing the through-hole 13, the surface of the first base material, which will be described later, is subjected to a process such as heat laminating and directly joined firmly to the second base material, while the second base material is used. Thereby, the visualization of the unevenness | corrugation by the through-hole 13 can be prevented. Further, the entire non-contact IC inlay 1 is more stably joined, and it becomes difficult to take out only the IC inlet for the purpose of forgery and the like, so that the security can be improved.

    As mentioned above, although embodiment of this invention and the effect by this invention have been demonstrated, the technical scope of this invention is not limited to the said embodiment, A various change is added in the range which does not deviate from the meaning of this invention. It is possible.

Hereinafter, the non-contact IC inlay 1 and the booklet 15 of the present embodiment will be further described using examples.
(Example)
1. Preparation of IC inlet The antenna sheet 3 is a base material made of PET having a thickness of 0.038 mm, a hardness of 0.05 mN · m, and a heat shrinkage rate of 160% (MD). An antecoil 4A and an IC chip 5 formed by processing were provided. On the other surface of the antenna sheet 3, the IC chip 5 and the antenna coil 4 </ b> A are disposed with a jumper wire 4 </ b> B and joined by a welding method.

2. The first base material disposed on one surface of the antenna sheet 3 has a thickness of 0.18 mm and a hardness of
A base material made of a porous foamed resin with 0.15 mN · m and a heat shrinkage rate of 4% (150 ° C. for 30 minutes), specifically, a polyolefin-based resin, trade name “TESLIN sheet” ( PPG Industry).

3. Second base material The second base material 7 disposed on the other surface of the antenna sheet 3 has a thickness of 0.75 mm and a hardness of
A base material made of non-foamed resin PET having 0.10 mN · m and a heat shrinkage rate of 167% (MD) was used.

4). Bonding of the first substrate and the second substrate 7 The sheets of the first substrate and the second substrate 7 were bonded to the antenna sheet 3 using an olefin-based adhesive having a thickness of 0.01 mm.
Then, one porous first base material 6 is subjected to drilling processing equivalent to the lead frame size of the IC chip 5, and the other non-foamable resin second base material 7 is molded with the IC chip 5 mold. Drilling was performed to the size equivalent.

3. Production of Information Medium The IC inlet 2 and the first base material 6 were arranged so that the lead frame and the mold of the IC chip 5 were accommodated in the holes formed in the first base material 6. And the IC inlet 2 was inserted | pinched from the upper and lower surfaces by the 1st base material 6 and the 2nd base material 7, and was temporarily fixed by spot heating.
The first base material 6, the second base material 7, and the IC inlet 2 that were temporarily fixed by spot heating were sandwiched between two stainless steel plates and heated and pressed to be completely joined to obtain a non-contact IC inlay 1. The heating and pressing conditions were a heating section temperature of 140 ° C., a pressure of 40 kg F / cm ² , and a treatment time of 120 seconds.

4). Attachment to booklet The cover member 11 serving as a cover member was a cloth cloth having a thickness of 0.4 mm. The cover member 11 was arranged on the outer surface of the second base material 7 via a polyurethane adhesive having a thickness of 0.05 mm, and was subjected to a heat laminating process to obtain an information medium with a cover having a thickness of 0.6 mm.
Next, a plurality of text sheets and a single inner sheet were collated, and the center was sewn with a sewing machine to produce a booklet paper surface 12 portion with the inner sheet attached to the outermost part. Then, an aqueous emulsion adhesive (trade name: SP-2850, manufactured by Konishi Co., Ltd.) is applied to the first base material 6 on the side opposite to the cover member of the non-contact IC inlay 1 bonded to the cover member at 20 g / m 2. Coating was performed, and the first base material 6 and the internally attached paper were bonded. The obtained booklet was expanded and cut into 125 mm × 180 mm to obtain a booklet 15.
In the non-contact IC inlay 1 manufactured as described above, undulation and curling by the antenna coil 4 formed on the antenna sheet 3 do not occur, and the surface of the second base material 7 of the non-contact IC inlay 1 The presence of the antenna coil 4 could not be visually confirmed, and the appearance was good. Further, in the booklet 15 with the non-contact information medium provided with the non-contact IC inlay 1 produced as described above, the presence of the antenna coil 4 cannot be visually recognized on the surface of the cover member 11, and the appearance is good. It became.

It is a front view which shows an example of the IC inlet which comprises the non-contact IC inlay of this invention. (A) It is the decomposition | disassembly sectional drawing which produced the non-contact IC inlay 1 using IC inlet 2. FIG. (B) It is sectional drawing which shows the state by which the exterior base material was joined to IC inlet 2. FIG. (A) It is an exploded sectional view showing composition of non-contact IC inlay 10 with a cover member. FIG. 2B is a cross-sectional view illustrating a state where the cover member 11 is attached to the non-contact inlay 1. It is a figure which shows the state in which the non-contact IC inlay 1 was applied to the booklet. (a) (b) It is a front view which shows the other example of the IC inlet which comprises the non-contact IC inlay of this invention. (A) It is an exploded sectional view explaining the composition of the conventional non-contact IC inlay. (B) It is sectional drawing which shows the state with which the conventional non-contact IC inlay was joined. (C) It is sectional drawing which shows the conventional non-contact IC inlay with a cover member.

Explanation of symbols

1 Non-contact IC inlay (Non-contact information medium)
2 IC inlet 3 Antenna sheet 4 Antenna coil 5 IC chip 6 First base material 7 Second base material 11 Cover member 15 Booklet

Claims (3)

A non-contact information medium in which both sides of an inlet having an antenna sheet having antennas formed on both sides and an IC chip connected to the antenna are covered with an exterior base material and sandwiched,
One of the exterior substrates is a first substrate made of a porous foam resin,
The other of the exterior base materials is a second base material made of non-foamed resin. A non-contact information medium according to claim 1;
A non-contact information medium with a cover, comprising: a cover member bonded to one surface of the non-contact information medium.   A non-contact information medium-attached booklet comprising the non-contact information medium according to claim 1.

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