JP4525159B2 - Non-contact IC booklet, its manufacturing method, and non-contact IC inlet - Google Patents

Description

  The present invention relates to a booklet having a non-contact IC module, a manufacturing method thereof, and a non-contact IC inlet, and more particularly, to a configuration of the non-contact IC inlet and a manufacturing method thereof.

  In recent years, while systems using non-contact IC cards and non-contact IC tags have become widespread, for example, a non-contact IC module (such as an IC chip storing unique identification information is transmitted to and received from a booklet such as a passport or a savings passbook) A non-contact IC booklet that allows electronic data to be entered and printed has been developed, in which an IC inlet is sandwiched between exterior substrates and the IC inlet is attached to the cover, etc. It is publicly known.

  As an example of the booklet with non-contact IC, for example, as shown in a side sectional view of FIG. 6, a first base sheet (3) having an opening (4) having a predetermined width on the upper surface side. The base material sheet (5) of 2 is bonded to form a recess, and an IC chip (8) and a coil antenna (7) connected thereto are provided in the recess, and the first base material sheet (3 ) And a non-contact type data carrier (2) provided with an adhesive layer (10) on the lower surface side, and this non-contact type data carrier (2) is attached to the inner surface of the back cover (13) of the booklet. There is a booklet having a non-contact type data carrier (see, for example, Patent Document 1).

The above prior art documents are shown below.
Japanese Patent Laid-Open No. 2002-4068

  However, in the above prior art, the opening (4) for providing the IC chip (8) and the coil antenna (7) connected thereto in the recess is provided in the second base sheet (5), There is an increase in processing steps such as bonding the base material (3) of 1 and the unevenness due to the bonding accuracy of the opening (4), the generation of voids after bonding, and the variation in the thickness of the opening sheet and the IC module. There were problems such as poor flatness. For example, as shown in the perspective view of FIG. 7, the non-contact type data carrier (2) is stuck to the inner surface of the back cover (13) of the booklet. Furthermore, since it protrudes from the inner surface of the back cover (13) and is not smooth, a notch (15) must be provided at the corner of the body of the paper (14). There was something.

  In order to solve the above-described delamination and design problems on the adhesive surface, for example, as shown in the side sectional view of FIG. 8, a plurality of perforated paper sheets (16) are laminated to form an opening (4). In this, a non-contact IC chip (8) and a coil antenna (7) connected thereto are provided, and an exterior base material (17) is provided from both sides to form a non-contact IC inlet (20). There is a non-contact IC booklet (1) in which an IC inlet (20) is sandwiched between a back cover (13) and a back cover paper (18) for decorating and sticking the inner surface thereof.

  However, in the technique of the non-contact IC-attached booklet (1), since a plurality of perforated paper sheets (16) are stacked to form the opening (4), the number of materials and the number of processing steps are increased. There was a problem in the lamination accuracy of the sheet (16) and the generation of voids after lamination. Furthermore, since the plurality of perforated paper sheets (16) and the exterior substrate (18) are hard, the back cover (13) is not flexible and is not suitable for an IC chip (8) that is weak against external pressure. There was also.

  The present invention solves such problems of the prior art, and the problem is that a non-contact made up of an IC chip that stores unique identification information and a coil antenna that transmits and receives this unique identification information. In the booklet with non-contact IC, in which the IC module is loaded into the exterior base material to form a non-contact IC inlet, and the non-contact IC inlet is sandwiched between the front cover and the back cover, the number of materials and processing steps of the exterior base material are reduced. A non-contact IC booklet that can be applied to an IC chip that does not require high accuracy in lamination, can ensure stable quality, and has flexibility on the cover, and is also susceptible to external pressure. It is to provide.

In order to achieve the above object in the present invention, first, in the invention of claim 1, a non-contact IC module including an antenna and a non-contact IC chip that performs non-contact communication with an external device using the antenna is provided. The non-contact IC module includes a step of loading on the exterior base material, and a step of cutting the sheet loaded on the exterior base material into a predetermined size and providing it on either the front cover, the back cover, or the page. A method for producing a booklet with a contact IC, wherein the exterior base material is at least two exterior base material sheets having flexibility, and the exterior base material sheet applies a foamed resin to the inner surface of the base material sheet, It is obtained by heating and foaming, the non-contact IC module is disposed between the inner surfaces of the exterior substrate sheet, and the inner surfaces of the exterior substrate sheet are thermally fused or bonded with an adhesive. Characteristic booklet with non-contact IC It is obtained by the production method.

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Further, in the invention of claim 2, the inner surface of at least one of the exterior base sheet is provided with a concave portion that is a little larger according to the shape of the non-contact IC module in advance. This is a method for manufacturing a booklet with a non-contact IC .

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  Since this invention is the above structure, there exist the following effects.

  That is, according to the first aspect of the invention, the non-contact IC module including the antenna and the non-contact IC chip that performs non-contact communication with the external device using the antenna is sandwiched between the exterior base materials. Furthermore, it is a booklet with a non-contact IC provided on either the front cover, the back cover, or the page, and the exterior base material is composed of at least two base material sheets having flexibility, The non-contact IC module is loaded between the inner surfaces of the base sheet, and the inner surfaces of the exterior base sheet are bonded to each other with heat fusion or an adhesive so that the loaded non-contact IC module has flexibility. When encased in the inner surface of the sheet, the inner surface of the base sheet is recessed, so that the non-contact IC inlet composed of the base sheet and the non-contact IC module becomes smooth, and thus the front cover, the back cover, or the page Back of Sandwiched cover or page even if smooth, and also can be a dominant non-contact booklet with IC-designed, can escape stress, such as impact against a non-contact IC module is further loaded.

  In addition, even if a non-contact IC inlet made of a flexible material is sandwiched between the front cover, back cover, or page of a booklet, the front cover, the back cover, or the page itself Any of them can have flexibility, and can fulfill functions (such as turning ability) as a cover or page of a booklet.

Moreover, the said base material sheet can make the inner surface in which a non-contact IC module is inserted | pinched rich by making it the sheet | seat by which the foaming resin is apply | coated to the inner surface of a base material, and a foaming resin is applied. Since the inner surface of the base material sheet is heat-sealable, it does not require an adhesive (although it may be used) when sealing the inner surfaces to form a non-contact IC inlet (energy) ) Can be used as a booklet with non-contact IC that is superior.

According to the invention of claim 2 , the non-contact IC module that is particularly vulnerable to external pressure is provided on the inner surface of at least one of the base sheet according to the shape of the non-contact IC module in advance. It is also possible to make a booklet with a non-contact IC disposed in the recess, and by making the recess slightly larger than the shape of the non-contact IC module, the non-contact IC module is attached to the base sheet in a non-adhered state. When the non-contact IC inlet is folded, the non-contact IC module in the base sheet moves and the stress is released by moving the non-contact IC module. can do.

  Furthermore, a plurality of conventional perforated paper sheets are laminated and opened by providing a recess slightly larger than the shape of the non-contact IC module in advance on the inner surface of at least one of the base sheet. Compared with a part (concave part) formed, the number of materials and processing steps are drastically reduced, and a booklet with a non-contact IC that contributes to improvement in accuracy of stacking and energy reduction can be obtained.

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According to the third aspect of the invention, the step of loading the exterior substrate with a non-contact IC module including an antenna and a non-contact IC chip that performs non-contact communication with an external device using the antenna; A method for producing a booklet with a non-contact IC comprising the step of cutting the sheet loaded on the exterior base material into a predetermined size and providing it on either the front cover, the back cover, or the page. The exterior base material is composed of at least two base material sheets having flexibility, the non-contact IC module is disposed between the inner surfaces of the base material sheet, and the inner surfaces of the base material sheets are heated with each other. Compared to a conventional method in which a plurality of perforated paper sheets are laminated to form an opening (concave portion), a processing process including the number of materials and lamination is achieved by adopting a manufacturing method in which fusion or adhesion is performed with an adhesive. Decrease in accuracy, such as lamination When a non-contact IC module booklet manufacturing method that contributes to the reduction of energy and energy consumption is encased in the inner surface of a flexible base sheet, Since the inner surface is recessed, a manufacturing method in which it is not necessary to dare to form an opening (concave) can be obtained.

Moreover, the inner surface of the base sheet that wraps the non-contact IC module is rich in flexibility by making the base sheet a manufacturing method obtained by applying foamed resin to the inner surface of the base and heating and foaming it. Manufacturing process and materials that do not require an adhesive (although it may be used) when sealing the inner surfaces to form a non-contact IC inlet because the inner surface of the base sheet has heat sealability It is possible to produce a booklet with a non-contact IC that is advantageous in saving energy.

Further, according to the invention according to claim 4 , a non-contact that is particularly vulnerable to external pressure is obtained by providing a manufacturing method in which a recess corresponding to the shape of the non-contact IC module is provided in advance on at least one inner surface of the base sheet. It is also possible to manufacture a booklet with a non-contact IC in which the IC module is disposed in the recess, and the recess is slightly larger than the shape of the non-contact IC module. As a result, even when the non-contact IC inlet is bent, the non-contact IC module in the base sheet moves and releases stress, so that the non-contact IC module is not easily damaged. It can be set as the manufacturing method of a booklet with a contact IC.

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Furthermore, according to the invention of claim 5 , a non-contact IC module comprising an antenna and a non-contact IC chip that performs non-contact communication with an external device using the antenna is sandwiched between exterior substrates. The non-contact IC inlet is formed of at least two base sheets having flexibility, and the non-contact IC module is disposed between the inner surfaces of the base sheets. By using a non-contact IC inlet in which the inner surfaces of the material sheets are heat-sealed or bonded with an adhesive, the number of materials and processing steps (total energy) of the exterior base material are drastically reduced, and high accuracy is not required for lamination, etc. In addition, it is possible to provide a non-contact IC inlet that can ensure a stable quality and give the cover a flexibility, and can also be applied to an IC chip that is weak against external pressure.
Moreover, the said base material sheet can make the inner surface in which a non-contact IC module is inserted | pinched rich by making it the sheet | seat by which the foaming resin is apply | coated to the inner surface of a base material, and a foaming resin is applied. Since the inner surface of the base sheet is heat-sealable, it does not require an adhesive (although it may be used) when sealing the inner surfaces to form a non-contact IC inlet (energy) ), An advantageous IC inlet can be provided.

  Therefore, the present invention exhibits excellent practical effects in applications such as electronic passports loaded with non-contact IC inlets and booklets with non-contact ICs such as savings and bankbooks.

  The best mode for carrying out the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a perspective view illustrating an example of a booklet with a non-contact IC according to the present invention, and FIG. 2 is a side sectional view showing a part of the booklet with a non-contact IC according to an embodiment of the present invention. It is. FIG. 3 is a side sectional view showing a non-contact IC inlet constituting the non-contact IC booklet according to another embodiment of the present invention, and FIG. 4 shows the other non-contact IC inlet. FIG. 5 is an explanatory view showing an example of an IC module substrate constituting the non-contact IC inlet.

  As shown in FIG. 1, for example, the booklet with a non-contact IC of the present invention comprises a front cover (12), a back cover (13), and a plurality of text sheets (14). The back cover (13) and the inner surface thereof. A non-contact IC module substrate composed of an IC chip (8) and a coil antenna (7) is provided between the backing paper (18) to be attached to the substrate, and an exterior base material is provided from both sides to provide a non-contact IC inlet ( 20), and the non-contact IC inlet (20) is sandwiched between the back cover (13) and the back cover paper (18) for decorating and sticking the inner surface thereof, and the periphery thereof is attached. Booklet (1).

Therefore, in the present invention, as shown in FIG. 2, for example, the non-contact IC inlet (20) is sandwiched between the back cover (13) and the back cover paper (18) on the inner surface thereof, and the periphery thereof is stuck. In the booklet (1) with non-contact IC, the exterior base material is composed of the upper exterior base material sheet (17a) and the lower exterior base material sheet (17b), and at least the inner surfaces thereof are flexible and are not in contact with the inner surface. An IC module substrate (30) in which an IC chip (8) and a coil antenna (7) formed on a PET film (32) are joined is mounted, and an upper exterior base sheet (17a) and a lower exterior base sheet It is a non-contact IC booklet (1) characterized in that the inner surfaces of (17b) are sealed to form a non-contact IC inlet (20).

In the present invention, for example, as shown in FIG. 4, the upper exterior base sheet (17a) is made of paper as the base sheet (72), and the foamed resin layer (74) is provided on the inner surface thereof. The exterior base sheet (17b) is made of paper as a base sheet (72), and a foam resin layer (74) is provided on the inner surface thereof. The IC inlet (20) is used. Thus, the inner surfaces of the upper and lower exterior base sheet (17a, 17b) have flexibility and embossability, and the inner surfaces have a sealing property, particularly a heat sealing property.

In addition, as shown in FIG. 4, for example, the present invention uses a paper as a base sheet (72) and has a non-coated surface on the inner surface of a lower exterior base sheet (17b) provided with a foamed resin layer (74) on the inner surface. A concave portion (40) slightly larger than the shape of the contact IC module substrate (30) is provided, and the non-contact IC module substrate (30) is mounted in the concave portion (40). A non-contact IC booklet (1) characterized in that 17a) is sealed by a lower exterior base sheet (17b) to form a non-contact IC inlet (20).

  The shape of the recess (40) can be substantially the same as the shape of the non-contact IC module substrate (30), and the recess (40) can be formed on the inner surface of the upper exterior base sheet (17a). Alternatively, it may be provided about half on the inner surface of the upper and lower exterior base sheet (17a, 17b).

Further, in the present invention, for example, as shown in FIG. 3, the upper and lower exterior base sheet (17a, 17b) is a pulp mold mainly composed of pulp fibers and mixed with a heat-fusible resin as a binder. The sheet is formed from a molding material, and has flexibility and embossability to form a recess (40) in advance, and the inner surfaces have a sealing property, particularly a heat sealing property.

  In addition, as shown in FIG. 3, for example, the present invention provides a lower exterior substrate sheet (17b) formed by molding a molding material for pulp mold, which is mainly composed of pulp fibers and mixed with a heat-fusible resin as a binder. ) Is provided in advance with a recess (40) slightly larger than the shape of the non-contact IC module substrate (30), and the non-contact IC module substrate (30) is mounted on the recess (40). With non-contact IC, characterized in that the upper exterior base sheet (17a) formed by molding a molding material for pulp mold is sealed by the lower exterior base sheet (17b) to form a non-contact IC inlet (20) Booklet (1).

  Each material, manufacturing method, etc. which comprise the non-contact IC booklet of this invention are demonstrated concretely below.

First, in the case of the upper and lower exterior base sheet (17a, 17b) constituting the non-contact IC inlet (20) of the present invention shown in FIG. 4, the foamed resin layer (74) is formed on the inner surface of the base sheet (72). The base sheet (72) provided is, for example, high-quality paper having a basis weight of about 70 g / m 2, coated paper, a nonwoven fabric having a thickness of about 0.05 mm, a cover cloth, and the like. It is used according to etc.

  In addition, as the foamed resin layer (74), for example, a polyvinyl chloride resin, an aqueous emulsion resin layer, and a polyolefin resin are used as main components. For each of these resins, a foaming agent, a concealing agent, a filler, and a polyvinyl chloride resin are used. Is used in combination with a plasticizer.

  For example, in the case of the foamed polyvinyl chloride resin, the foamed resin layer (74) is a coating method when using a paste resin, and a calendar method or an extrusion method when using a straight resin. Formed on sheet (72).

  Further, the aqueous emulsion resin is not particularly limited, but for example, at least one or two of acrylic ester, aromatic vinyl compound, SBR type, vinyl acetate type, ethylene-vinyl acetate copolymer, silicone, polyurethane, polybutene and the like. Although it consists of the above and is not specifically limited on a structure, a normal copolymer or a core / shell two-layer structure, a blend, etc. can be used. In addition, a coating method is applied as the molding method.

  Furthermore, examples of the polyolefin resin include polyethylene, polypropylene, polybudene, polyisoprene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer, propylene-α-olefin copolymer. A polymer, an ethylene-ethyl acrylate copolymer, an ionomer, or the like can be selected as appropriate, and a single type or a mixture of a plurality of types may be used. As the molding method, a calendar method or an extrusion method is applied.

  As described above, after forming a foamed resin layer on a base material sheet such as paper by coating or the like, it is heated and foamed at about 150 to 190 ° C., and a recess (40) corresponding to the shape of the non-contact IC module substrate (30) in advance. For those requiring the formation of, the depression (40) can be formed by the embossing plate pressing method simultaneously with the foaming.

Further, in the case of the upper and lower exterior base sheet (17a, 17b) constituting the non-contact IC inlet (20) of the present invention shown in FIG. 3, pulp fiber is mainly used, and a heat-fusible resin is mixed as the binder. It can be obtained by molding a molding material for a pulp mold.

  Examples of pulp fibers that are the main body of the upper and lower exterior base sheet (17a, 17b) include, for example, pulp fibers having a fiber length of 500 μm or less obtained by pulverizing various papers (including waste paper) with a pulverizer, or general papermaking processes. Mechanical pulp that mechanically crushed wood as a pulp in the inside, chemical pulp in which chemicals are added to wood chips to dissolve lignin and disaggregated into fibers, or a combination of chemical lignin removal and mechanical defibration And a pulp fiber having a fiber length of 500 μm or less, and the like.

  Additives can also be mixed with the above pulp fibers. Examples of the additives include a sizing agent (such as pine resin-based resin acid maleate) that prevents bleeding of ink and the like, and a filler that imparts opacity. (Calcium carbonate, white carbon, etc.), powders such as polyacrylamide as a dry paper strength enhancer and melamine formaldehyde resin that improves wet strength, and the like can be appropriately selected depending on the use of the pulp molded product.

  Moreover, as a heat-fusible resin mixed with the pulp fiber as a binder (binder), most of the thermoplastic resin can be used as long as it is a thermoplastic resin. A resin having meltability and adhesiveness is suitable, for example, a polyethylene-based resin such as polyethylene, polypropylene or polybuden-1 resin, an ethylene copolymer such as ethylene / vinyl acetate copolymer, or a poly-resin such as polymethyl acrylate. Examples thereof include acrylic acid resins.

  In addition, the heat-fusible resin as the binder may be a biodegradable resin in consideration of environmental conservation related to disposal. Examples of the biodegradable resin include polylactic acid, polyethylene succinate, Aliphatic polyesters such as hydroxybutyrate, or aliphatic aromatic polyesters such as polybutylene adipate / terephthalate copolymer and modified polyethylene terephthalate are included, and the biodegradability of the paper itself is not impaired even when mixed with pulp fibers. It can also be a pulp molded product.

  The mixing ratio of the heat-meltable resin with respect to the pulp fiber is preferably smaller after use, for example, considering recycling to paper products, etc., but considering the binding property, it is about 10 to 50% by weight with respect to the pulp fiber. And appropriately determined from the type of resin and the use of the pulp molded product.

  A material for the upper and lower exterior base sheet (17a, 17b) obtained by laminating a molding material in which a heat-fusible resin as a binder is mixed with pulp fibers as described above, and laminating them with a fiber stacker to form a sheet or web. And for those requiring the formation of the recess (40) according to the shape of the non-contact IC module substrate (30) in advance, the material for this sheet or web-like upper and lower exterior base sheet (17a, 17b), It can be set as a recessed part (40) by the heating pressure system by an embossing plate.

  The non-contact IC module substrate (30) used for the non-contact IC booklet (1) of the present invention is not particularly limited, but is preferably as thin as possible, for example, as shown in FIG. As shown in the plan view and the cross-sectional view of FIG. 5 (b) showing the BB plane, the periphery on a PET film (32) having a width (W) of 75 mm, a length (H) of 45 mm, and a thickness (D) of 15 μm. Further, a copper foil loop-shaped coil antenna (7) is provided by etching, and an IC chip (8) having a thickness (DC) of about 0.4 mm is electrically connected to the loop-shaped coil antenna (7). A thin non-contact IC module substrate (30) is preferably used. Moreover, it can replace with this PET film (32), and tough films, such as a polyethylene naphthalate (PEN) and a polyimide film, can be used.

It is a perspective view explaining one embodiment of a booklet with a non-contact IC of the present invention. It is explanatory drawing which represented one Embodiment of the booklet with a non-contact IC of this invention in the side cross section. It is explanatory drawing which represented one Embodiment of the non-contact IC inlet which comprises the booklet with a non-contact IC of this invention with the sectional side view. It is explanatory drawing which represented other one Embodiment of the non-contact IC inlet which comprises the booklet with a non-contact IC of this invention with the sectional side view. The example of the IC module substrate of the non-contact IC inlet which constitutes the booklet with non-contact IC of the present invention is shown, (a) is its front view, and (b) is its BB surface. It is sectional drawing. It is explanatory drawing which represented the example of the conventional booklet with non-contact IC by the side cross section. It is a perspective view explaining an example of the conventional booklet with non-contact IC shown in FIG. It is explanatory drawing which represented another example of the conventional booklet with non-contact IC by the side cross section.

DESCRIPTION OF SYMBOLS 1 ... Non-contact IC booklet 2 ... Non-contact data carrier 3 ... 1st base material 4 ... Opening 5 ... 2nd base material sheet 7 ... Coil antenna 8 ... IC chip 12 ... · · · Front cover 13 · · · Back cover 14 · · · Body paper 15 · · · Notched portion 16 · · · Paper sheet 17 · · · Exterior base material 17a · · · Upper exterior base sheet 17b · · · Lower exterior base sheet 18 · · · Back Paste 20 ... Non-contact IC inlet 30 ... Non-contact IC module substrate 32 ... PET film 40 ... Recess 72 ... Base sheet 74 ... Foamed resin layer D ... PET film thickness DC ... IC chip Thickness H ... PET film width W ... PET film width

Claims (2)

  Loading a non-contact IC module including an antenna and a non-contact IC chip that performs non-contact communication with an external device using the antenna on the exterior base material, and the non-contact IC module is loaded on the exterior base material A method for producing a non-contact IC-attached booklet comprising a step of cutting a sheet into a predetermined size and providing it on a front cover, a back cover, or a page, wherein the exterior substrate has at least flexibility Two exterior base sheet, and the exterior base sheet is obtained by applying a foamed resin to the inner surface of the base sheet and heating and foaming the same, and the non-contact between the inner surfaces of the exterior base sheet A method for producing a booklet with a non-contact IC, wherein an IC module is disposed and the inner surfaces of the exterior substrate sheet are heat-sealed or bonded with an adhesive.   The method for producing a booklet with a non-contact IC according to claim 1, wherein a recess having a slightly larger size corresponding to the shape of the non-contact IC module is provided in advance on at least one inner surface of the exterior substrate sheet.

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