JP2012137807A - Booklet with ic and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a booklet with an IC without having damage to an IC chip in an IC module during a bookbinding process and the like or contact failure of the IC module and an antenna.SOLUTION: A booklet with an IC has a cover material, inside paper of the cover and pieces of book paper. The booklet is divided into two areas by a center line of the cover material and the inside paper of the cover, and on one side of the two areas, the cover material and the inside paper of the cover are stuck together with a non-contact communication member between them. The non-contact communication member comprises: an antenna substrate which has at least an open hole and is provided with an antenna; and an IC module which is received in the open hole of the antenna substrate and is connected with the antenna. The IC module has a connection plate, an IC chip connected with one side of the connection plate and a resin sealing part sealing the IC chip, and the IC module is arranged to place the resin sealing part on the cover material side.

Description

  The present invention relates to an IC booklet capable of non-contact communication and a method for manufacturing the same.

2. Description of the Related Art Conventionally, as a booklet capable of non-contact communication, there is known an IC booklet in which a non-contact communication member (inlay) including an IC chip and an antenna is attached to a book cover (see Patent Document 1).
In such a non-contact communication member, an IC chip may be used in the form of a bare chip, but in many cases, a connection plate (lead frame) for connecting to an antenna and an IC connected to the connection plate on one side of the connection plate It is often used in the form of an IC module having a resin mold for sealing the chip and the IC chip. The thickness of these IC modules is generally about 300 to 400 μm.

As an inlay configuration using such an IC module, a base material for forming an antenna is used, an opening (through hole) is provided in the base material, the IC module is placed in the opening (through hole), and the antenna is connected. The configuration is known. By doing in this way, since the thickness of an IC module is absorbed in a base material, thickness reduction can be achieved. In this configuration, the resin sealing portion and the connection plate of the IC module are exposed.
In addition, when using a thin base material of about 50 to 150 μm as the base material for forming the antenna, openings corresponding to the sizes of the resin sealing portion of the IC module and the connection plate are provided above and below the antenna base material on which the IC module is mounted, respectively. There is known a configuration in which a base material provided with (through-holes) is bonded, and the IC module does not stick out as a whole and is housed in the base material. Even in this configuration, both the resin sealing portion and the connection plate of the IC module are exposed.

As shown in FIG. 6, such a booklet usually includes an intermediate substrate 5 on the upper and lower sides of an antenna substrate 1 in which an IC module connected to an antenna is mounted in an opening (through hole) of the substrate. 6 is bonded to the cover material 9, and then bonded to the separately-stitched main paper 10 and the facing paper 8, and a crease is formed into a booklet.
As shown in FIG. 7, the cover material is bonded to the cover material and the main paper, and the adhesive is roll-coated on the cover material while the cover material is wound around the roller 23, and is conveyed by a sheet. It is pasted together with the facing paper and the main paper. In addition, since the facing paper and the main paper are in a state where a plurality of main papers are thread-bound along the center line and are not fixed, it is difficult to apply the adhesive while being wound around and transported to a roll. Usually, an adhesive is provided on the cover material side.
Moreover, the laminated body bonded together is creased by using a roller 24 and a folding knife 25 as shown in FIG. 8 and sandwiching the laminated body with the roller 24 while pressing the center of the laminated body with the crease material 25.

  Therefore, when the adhesive is provided on the cover material bonded with the non-contact communication member by the roll coating method, the cover material is wound around the roll and transported, so that the chip may be damaged due to bending load. There is.

In the conventional method, in the crease forming process, the booklet is sandwiched between a pair of rollers, and pressure is applied from both sides.
Generally, a cover material made of a material such as cotton or paper and having a thickness of about one hundred to several hundred μm is often used. Depending on the purpose of use, the saddle-stitched booklet usually has about 150 pages or less (for example, about 50 pages for a passport), and this paper should be made of paper material with a thickness of about several hundreds of μm. Many.

For example, when a booklet containing 20 pages of main paper is created by the method shown in FIG. 6 using a paper cloth material having a thickness of 300 μm for the cover material and a paper having a thickness of 110 μm for the facing paper and the main paper, The structure is such as contact communication member / flip sheet / five sheets / folding knife / five knife / five sheets / flip sheet / intermediate member / back cover. The creases are formed by being sandwiched by a pair of rollers from the front cover and back cover sides and pressurized. It is turned on.
At this time, in the IC module of the non-contact communication member, pressure is applied to the connecting plate side through a paper cloth material having a thickness of 300 μm, and a sheet of paper having a thickness of 110 μm and five sheets of 110 μm of thickness paper are applied to the resin sealing side. Pressure is applied through a total of 660 μm paper material and a folding knife, five 110 μm-thick paper sheets, 110 μm-thick turnover paper, an intermediate member, and a 300 μm-thick paper cloth material.
That is, a pressure is applied to the connecting plate side of the IC module by using a paper cloth material having a thickness of 300 μm as an interference material, and pressure is applied to the resin sealing side through a paper material having a thickness meter of 660 μm, a folding knife, and a thickness of 660 μm. Will be added. In addition, since each main paper is not fixed, force can be relieved by deviation.

The IC module is relatively resistant to external pressure because the resin-sealed side is protected by the resin being sealed, but the connection plate side has relatively low resistance to external pressure. If this occurs, problems such as not only damage to the IC chip body but also disconnection of the antenna connection may occur.
When the above-described conventional method is used, a strong external pressure is applied to the connection plate side of the IC module having a relatively low resistance to external pressure, which may cause damage to the IC chip in the IC module or poor contact between the antenna and the IC module. There is a fear.

US Pat. No. 7,059,535

  In view of the above problems, an object of the present invention is to provide a booklet with an IC that is free from breakage of an IC chip in an IC module or a poor contact between the IC module and an antenna during a bookbinding process. In particular, it is an object of the present invention to provide a booklet with an IC that is free from breakage of an IC chip in the IC module at the time of folding and a contact failure between the IC module and an antenna.

  The present invention has a cover material, a facing sheet bonded to the covering material, and one or more main paper sheets attached to the facing paper, and can be folded along the center line of the cover material, the facing paper, and the main paper sheet. A non-contact communication member is bonded between the cover material and the facing paper in one of the two regions sandwiching the center line of the cover material and the facing paper, The communication member includes an antenna base having at least a through-hole and an antenna formed thereon, and an IC module that is adopted in the through-hole of the antenna base and connected to the antenna, and the IC module is connected An IC chip connected to the connection plate and a resin sealing portion for sealing the IC chip are provided on one side of the plate and the connection plate, and the IC module is disposed so that the resin sealing portion is located on the cover material side The IC with a booklet that characterized in that it comprises.

  Further, the facing paper and the non-contact communication member are bonded together with an adhesive mainly composed of a reactive hot melt resin.

  Further, the facing paper and the non-contact communication member are bonded together with a chloride ion-resistant adhesive.

  In addition, an intermediate member is provided in a region where the non-contact communication member is not bonded, out of two regions sandwiching the center line of the cover material and the facing paper.

  Further, the present paper sheet and the facing paper are saddle-stitched along a center line.

  Further, the center line has no non-contact communication member and no intermediate member.

  Also, it has a cover material, a facing paper bonded to the cover material, and one or more paper sheets attached to the facing paper, and can be folded along the center line of the cover material, the facing paper and the paper sheet. A method for manufacturing a booklet, the step of bonding a facing sheet and a non-contact communication member in one of the two regions across the center line of the facing sheet, and the step of attaching one or more sheets of the sheet to the facing sheet A non-contact communication member having a non-contact communication member bonded to the non-contact communication member side and a cover material, and a cover material, a reverse paper, and a folding step along the center line of the paper sheet. Comprises an antenna substrate having at least a through hole and an antenna formed thereon, and an IC module that is used in the through hole of the antenna substrate and connected to the antenna. The IC module has a connection plate and an IC chip connected to the connection plate on one side of the connection plate and a resin sealing portion for sealing the IC chip, and the IC module is resin-sealed on the cover material side. It is set as the manufacturing method of the booklet with IC characterized by arrange | positioning so that a part may be located.

  Also, the folding step is characterized in that the folding knife is pushed in between a pair of rollers while inserting a folding knife along the center line from one side of the paper, and pressurized from the cover material side.

  Further, the step of attaching one or more pieces of paper to the facing paper is attached by a saddle stitching method.

  According to the present invention, it is possible to obtain a booklet with an IC that is free from breakage of an IC chip in the IC module or a poor contact between the IC module and the antenna during the bookbinding process. In particular, it is possible to obtain a booklet with an IC without breakage of an IC chip in the IC module at the time of folding or contact failure between the IC module and the antenna.

It is a section schematic diagram showing an example of a booklet with an IC of the present invention. It is the schematic which shows an example of the booklet with IC of this invention. It is a section schematic diagram showing an example of an IC module of the present invention. It is a section schematic diagram showing an example of the non-contact communication member of the present invention. It is the schematic which shows an example of the manufacturing method of the booklet with IC of this invention. It is the schematic which shows the manufacturing method of the conventional booklet with IC. It is the schematic which shows an example of the bonding method of a cover material and this paper. It is the schematic which shows an example of a folding process.

Hereinafter, it will be described in detail with reference to the drawings.
FIG. 1 is a schematic cross-sectional view showing an example of a booklet with an IC according to the present invention.
In FIG. 1, a booklet with an IC has a cover material 9, a facing paper 8, and a plurality of paper sheets 10 and can be bent along a center line (hinge line). Of the two areas divided by the center line, the non-contact communication member 7 is bonded between the cover material and the facing sheet in one area, and the intermediate member 12 is bonded between the cover material and the facing sheet in the other area. Yes.
The paper sheet and the facing paper are bound by a saddle stitching method along the center line. The non-contact communication member includes an antenna substrate 1 having a through hole and an antenna 3 formed thereon, and an IC module 2 that is used in the through hole of the antenna substrate and connected to the antenna. The intermediate base material 5 and the back side intermediate base material 6 are bonded together. The IC module has the connecting plate 2b and the IC chip 2a connected to the connecting plate on one side of the connecting plate and a resin sealing portion for sealing the IC chip, and the resin sealing portion is positioned on the cover material side. Has been placed. Further, the front side intermediate base material 5 and the back side intermediate base material 6 are each provided with a through-hole, and the connecting plate and the resin sealing portion of the IC module protruding from the antenna base material are taken away.

FIG. 5 is a schematic view showing an example of a method for producing a booklet with an IC of the present invention.
Hereinafter, a description will be given with reference to FIG.
First, the non-contact communication member 7 and the intermediate member 12 and the facing paper 8 are bonded together.
As the non-contact communication member and the intermediate member, for example, an antenna base material on which an IC module is mounted and sandwiched between the front side intermediate base material 5 and the back side intermediate base material 6 can be used. At this time, a non-contact communication member is provided in one area along the center line. The intermediate member may be omitted.

Although it does not specifically limit as an antenna base material used for a non-contact communication member, Polyester-type base materials, such as a polyethylene terephthalate (PET), a polyimide-type base material, a polyethylene naphthalate (PEN) -type base material, Polycarbonate (PC ) -Based substrates can be used. A paper base material may be used. An antenna substrate having a thickness of about 50 to 500 μm can be used.
The antenna substrate is formed with an antenna coil. The antenna coil can be formed by a known method such as an etching method using a metal thin film, a winding method using a coil, or a printing method using a conductive ink.
A through hole is provided in the antenna substrate by punching or the like, and an IC module is taken into the through hole and connected to the antenna coil.

The IC module has an IC chip on one side of the connection plate and the connection plate, the IC chip and the connection plate are electrically connected by a bonding wire, and the IC chip is sealed with a resin. The thickness of the IC module is generally about 300 to 400 μm.
The connection between the IC module and the antenna coil is performed using a connection plate of the IC module. Specifically, the connection plate and the antenna coil are connected using a conductive material such as anisotropic conductive adhesive or solder, or when a wound antenna is used as the antenna coil, the connection plate is connected by thermal pressure or ultrasonic waves. can do.

When an antenna substrate thinner than an IC module having a thickness of about 10 to 60 μm is used, an intermediate substrate may be bonded to both sides of the antenna substrate as necessary.
As the intermediate substrate, a thermoplastic porous sheet substrate or paper substrate can be used. Specifically, as the porous sheet base material, a resin such as polyethylene, polypropylene, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyvinyl acetate, polyester, ABS (acrylonitrile butadiene styrene copolymer) is used alone or in combination. It can be obtained by a method of mixing porous particles such as silica using a material, adding air during resin kneading, foaming, or perforating after stretching. Moreover, you may use paper sheets, such as a commercially available resin sheet or synthetic paper which provided printing suitability with respect to an inkjet, offset, etc. Specific examples include polyolefin synthetic paper “Teslin (registered trademark)” manufactured by PPG, polypropylene synthetic paper “YUPO (registered trademark)” manufactured by YUPO Corporation, and the like. The thickness of the intermediate substrate is about 100 to 200 μm.
When using an intermediate substrate, a through hole corresponding to the size of the IC module connection plate and resin sealing portion is provided, and bonded together with the position of the IC module connection plate and resin sealing portion protruding from the antenna substrate. be able to.
The antenna substrate and the intermediate substrate can be bonded together using a known adhesive such as a water-soluble adhesive. For example, EVA (ethylene vinyl acetate) adhesive, EAA (ethylene acrylic acid copolymer resin) adhesive, polyester adhesive, polyurethane adhesive, acrylic adhesive, polyolefin adhesive, nylon adhesive, etc. The water-soluble adhesive can be used.

  The IC module is arranged such that a resin sealing portion is positioned on the cover material side described later and a connection plate is positioned on the facing paper side. As will be described later, the cover material is made of cotton material, paper material, PVC material or the like of about 100 to 500 μm. The facing paper and the main paper piece are paper materials of thickness 110 to 180 μm and thickness 110 to 130 μm, depending on the number of pages. A plurality of sheets are provided. Although depending on the number of paper sheets, the facing paper and the paper sheet side are thicker and more shock-resistant than the cover material side when viewed from the IC module provided on the non-contact communication member. Further, since the paper sheet piece is not fixed, an impact can be released due to a shift between pages. Therefore, by adopting the above-described configuration, the connecting plate side having a relatively low resistance to external pressure is used as a side-by-side paper and a paper sheet side having excellent impact resistance, so that the IC of the IC module due to the external pressure applied during the bookbinding process or the like. Chip breakage and poor connection between the IC module connection plate and the antenna can be reduced.

The intermediate member may be a single layer or a multilayer laminated material using the same material as the above-described intermediate base material.
When using an intermediate base material for the non-contact communication member, the antenna base material is placed in one of the areas divided across the center line of the intermediate base material, and the intermediate base material is further bonded to make contactless communication. The member and the intermediate member can be provided at a time.

  It is preferable that the non-contact communication member and the intermediate member are not provided on the center line when the booklet is formed. For example, when the non-contact communication member and the intermediate member are provided at a time as described above, the vicinity of the center line of the intermediate base material may be punched out or thinned by pressing. This makes it easier to fold the booklet.

  The facing paper is a paper to be bonded to the facing surface of the cover material and is not particularly limited, but a paper material having a thickness of about 110 to 180 μm can be used. Moreover, what is printed suitably can be used.

The non-contact communication member, the intermediate member, and the facing paper can be bonded using an adhesive. Among these, it is preferable to bond using a reactive hot melt resin.
Examples of the reactive hot melt resin include those containing, for example, an ethylene / vinyl acetate copolymer (EVA) system or a polyurethane system as a main component.
The reactive hot melt resin is applied in a state where these resins are heated and melted, and after being bonded and cooled and solidified, it undergoes a crosslinking reaction with moisture (humidity) contained in the air or the bonded material, It becomes a flexible sheet-like layer, and has superior heat resistance, durability, water resistance, and moisture resistance compared to conventional water-based adhesives and hot-melt adhesives. For this reason, it is difficult to separate the facing paper to which the inlay and the book paper are attached so that no trace remains.
In addition, when the inlay and facing paper are bonded with an aqueous adhesive, etc., the facing paper and the aqueous adhesive do not have a barrier property against chlorine ions, etc., so the inlay antenna and the connection between the antenna and the IC chip are corroded. There is a case. Reactive hot-melt adhesives have a certain barrier property against moisture and chlorine ions, so it is possible to prevent moisture and chlorine ions (chloride ions) from entering the facing paper side. It is possible to prevent rust and corrosion at the joints of the IC module (IC chip) and the like. In particular, in the present invention, since the connecting plate of the IC module is arranged on the facing paper side, the effect of the reactive hot melt resin is exhibited. The reactive hot melt resin is preferably moisture curable. If it is a moisture effect type, the barrier properties such as moisture described above are high and preferable.

Next, the paper sheet piece is attached to the facing paper on which the non-contact communication member is bonded.
The paper sheet piece can be attached by, for example, a so-called saddle stitching method in which thread binding is performed along the center line of the facing paper or the paper sheet piece.
Although it does not specifically limit as this paper paper piece, The paper material of about 110-130 micrometers in thickness can be used. A plurality of paper pieces can be provided. For example, in the case of a passport, about 32 to 100 pages are usually used, so about 8 to 25 sheets can be used.

Next, the non-contact communication member and intermediate member side of the facing paper are bonded to the cover material.
A known material can be used as the cover material. For example, a cotton material, a paper material, or a PVC material can be used. The thickness of the cover material is generally about 100 to 500 μm.
Examples of the adhesive used for attaching the cover material include reactive hot-melt adhesives such as EVA (ethylene vinyl acetate) adhesives and polyurethane adhesives, EAA (ethylene acrylic acid copolymer resin) adhesives, A polyester adhesive can be used.
As a method for applying the adhesive, a known coating method can be used. For example, as shown in FIG. 7, an adhesive can be applied to the cover material side using a roll coater.

After this paper sheet piece is attached to the facing paper to which the non-contact communication member is bonded, and the cover material is bonded, folding processing is performed to crease along the center line (hinge line).
As shown in FIG. 8, the folding process can be performed by pushing the cover side of the booklet outward between a pair of rollers while inserting a folding knife from one side of the paper.

In the present invention, it is desirable to satisfy the following relationship.
“Thickness of cover material <thickness of facing paper + thickness of paper piece / 2”
At the time of folding, the pressure applied to the IC module from the pair of rollers is reduced by the cover on the cover side, and the impact is reduced on the side of the facing paper by the facing paper, a sheet of paper, and the cover. Here, a folding knife is inserted in the center of the booklet, and the folding knife is made of a hard material. Therefore, the thickness of the facing paper positioned between the folding knife and the IC module + the thickness of the paper piece / 2 is By making it thicker than the cover material, the IC module is less likely to be damaged even when a certain pressure is applied between the rollers.

DESCRIPTION OF SYMBOLS 1 ... Antenna base material 2 ... IC module 2a ... IC chip 2b ... Connection board 2c ... Bonding wire 2d ... Sealing resin 3 ... Antenna 4 ... Inlet 5... Front side intermediate base material 6... Back side intermediate base material 7... Non-contact communication member 8. ... Yarn binding part 12 ... Intermediate member 21 ... Liquid tank 22 ... Roller 23 ... Roller 24 ... Roller 25 ... Folding knife

Claims (9)

A booklet having a cover material, a facing sheet bonded to the cover material, and one or more main paper pieces attached to the facing paper, and being foldable along a center line of the cover material, the facing paper and the main paper piece Because
In one of the two areas sandwiching the center line of the cover material and the facing paper, a non-contact communication member is bonded between the cover material and the facing paper,
The non-contact communication member includes an antenna base having at least a through-hole and an antenna formed thereon, and an IC module that is adopted in the through-hole of the antenna base and connected to the antenna.
The IC module has a connection plate and an IC chip connected to the connection plate on one side of the connection plate and a resin sealing portion for sealing the IC chip,
The IC module is a booklet with an IC, wherein the IC module is arranged such that a resin sealing portion is positioned on the cover material side.   The booklet with IC according to claim 1, wherein the paper sheet and the facing paper are saddle-stitched along a center line.   The booklet with an IC according to claim 1 or 2, wherein the facing paper and the non-contact communication member are bonded together with an adhesive mainly composed of a reactive hot melt resin.   The booklet with an IC according to any one of claims 1 to 3, wherein the facing paper and the non-contact communication member are bonded together by a chloride ion-resistant adhesive.   5. The IC according to claim 1, further comprising an intermediate member in an area where the non-contact communication member is not bonded, out of two areas sandwiching the center line of the cover material and the facing paper. Accompanying booklet.   The booklet with an IC according to any one of claims 1 to 5, wherein a non-contact communication member and an intermediate member are not provided on the center line. A booklet having a cover material, a facing sheet bonded to the cover material, and one or more main paper pieces attached to the facing paper, and being foldable along a center line of the cover material, the facing paper and the main paper piece A manufacturing method of
Bonding the facing paper and the non-contact communication member in one of the two areas across the center line of the facing paper;
Attaching one or more pieces of paper to facing paper,
Bonding the non-contact communication member side of the facing paper with the non-contact communication member and the cover material together;
Folding along the center line of the cover material, the facing paper, and the main paper piece,
The non-contact communication member includes an antenna base having at least a through-hole and an antenna formed thereon, and an IC module that is adopted in the through-hole of the antenna base and connected to the antenna.
The IC module has a connection plate and an IC chip connected to the connection plate on one side of the connection plate and a resin sealing portion for sealing the IC chip,
The IC module is arranged such that a resin sealing portion is positioned on the cover material side, and a method for producing a booklet with an IC, characterized in that:   8. The method for producing a booklet with an IC according to claim 7, wherein in the folding step, a folding knife is inserted along a center line from one side of the paper and pushed between a pair of rollers, and pressure is applied from the cover material side. .   The method for manufacturing a booklet with an IC according to claim 8 or 9, wherein the step of attaching one or more pieces of paper to the facing paper is attached by a saddle stitching method.