JP2011081693A - Non-contact type information medium, method of manufacturing the same and booklet to which non-contact type information medium is attached - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simplify the working process of a non-contact type information medium in a means for attaining the non-contact type information medium by holding an IC inlet comprising an IC chip and an antenna coil connected to it in between porous thermoplastic sheets and providing a booklet to which the non-contact type information medium is attached, and to which the non-contact type information medium is bonded on a front cover or a back cover further, and to provide the non-contact type information medium which is excellent in adhesion with a cover and a paper sheet and is also excellent in durability and anti-forgery property or the like, a method of manufacturing the contact type information medium and the booklet to which the non-contact type information medium is attached using the method. <P>SOLUTION: In the non-contact type information medium 20 composed by holding the IC inlet including the antenna coil 32 and the IC chip 31 connected to it between two porous thermoplastic resin sheets provided with a thermoplastic resin adhesive on surfaces on the inner side, being laminated and bonded, the surface of at least one of the porous thermoplastic resin sheets is matted. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a non-contact information medium having an IC chip and an antenna coil, a manufacturing method thereof, and a non-contact information medium-attached booklet to which the non-contact information medium is bonded.

  In recent years, while systems using non-contact IC cards and non-contact IC tags have become widespread, for example, an IC inlet composed of a non-contact IC module and an antenna connected to the booklet such as a passport or a savings passbook is sandwiched between exterior substrates. A non-contact type information medium attached booklet that can be filled in and printed with electronic data, in which this non-contact type information medium is attached to a cover sheet and loaded, has been developed and is publicly known.

  As an example of the booklet attached to the non-contact type information medium, a concave portion is formed by adhering a second base material sheet having an opening with a predetermined width on the upper surface side of the first base material sheet. A non-contact type data carrier provided with an IC chip and a coil antenna connected thereto, and an adhesive layer provided on the lower surface side of the first base sheet, and the non-contact type data carrier There is a booklet having a non-contact type data carrier attached to the inner surface of the paper (see Patent Document 1).

JP 2002-42068 A

  In the non-contact type information medium obtained by the above-described conventional technique, an opening for providing an IC chip and a coil antenna connected to the IC chip in the recess is provided in the second base sheet, and the first base is provided. There is an increase in processing steps such as bonding, and there are problems such as inferior flatness due to the bonding accuracy of the opening, the generation of voids after bonding, and unevenness due to the variation in the thickness of the opening sheet and the IC module. .

  As a method for solving such problems of unevenness and voids, for example, the following can be considered. That is, an IC chip and an antenna between a sheet of a thermoplastic base material such as PVC (polyvinyl chloride resin) or PET-G (modified polyethylene terephthalate resin), such as credit cards and IC cards that are generally distributed. Etc., and the substrate is made to flow and smooth by applying a strong heat pressure. A non-contact type information medium-attached booklet can be created by adhering the non-contact type information medium thus obtained between the front or back cover of the booklet and the inner sheet.

In addition, a porous sheet that is thermoplastic and has voids in the substrate can be used instead of a substrate that flows by hot pressure. Since such a sheet is obtained by foaming a resin, the material is generally soft and has low rigidity. In addition, since there is a gap in the base material, it is compatible with various adhesives, and for example, it is easy to adhere to a paper booklet. Furthermore, unevenness can be absorbed by applying an appropriate pressure. However, when laminating and adhering such porous base materials, if the high temperature and high pressure are applied and the fusion is attempted, the voids themselves will be crushed. Processing such as applying an adhesive is also performed. If the melting point of this adhesive is low, the heat pressure applied during processing can be low, and the collapse of the porous substrate can be suppressed.

  However, if the melting point of the thermoplastic adhesive is low, the thermal pressure required for processing can be low, but there is a problem that the substrates are likely to be blocked and peeled off in a high temperature environment. For this reason, it has been difficult to completely eliminate the collapse of the gap while maintaining sufficient adhesion performance and workability.

Problems caused by the collapse of voids in the porous thermoplastic substrate include the following. That is,
When applying an adhesive to a substrate and bonding it to another material such as a booklet or cover, the surface wettability deteriorates, and even if the adhesive is repelled or bonded, the anchor effect is insufficient, resulting in insufficient adhesive strength. It becomes lower. Further, when the voids are crushed, the gloss of the substrate surface may increase and affect the appearance of the product. This problem is particularly prominent in the portion where the antenna is sandwiched between the base materials, and a portion where the antenna is present is thick, so that pressure is easily applied, and more gaps are crushed and gloss is likely to increase. As a result, when the surface of the base material is observed, problems such as an appearance defect that only a certain portion of the antenna is glossy or an adhesive performance at the glossy portion is deteriorated occur.

  The present invention solves the problems of the prior art, and the problem is that an IC inlet composed of an IC chip and an antenna coil connected to the IC chip is sandwiched between porous thermoplastic sheets. In a means for providing a non-contact information medium attached booklet that is a contact-type information medium, and further this non-contact type information medium is bonded to the front cover or back cover, the processing process of the non-contact information medium is simplified. In addition, a non-contact type information medium having excellent adhesion to a cover and paper, and having excellent durability and anti-falsification properties, a manufacturing method thereof, and a non-contact type information medium using the non-contact type information medium The purpose is to provide an accompanying booklet.

  As means for solving the above-mentioned problems, in the invention according to claim 1, an IC inlet including an antenna coil and an IC chip connected to the antenna coil is provided with a thermoplastic resin adhesive on the inner surface. In a non-contact type information medium formed by being sandwiched and bonded between two porous thermoplastic resin sheets, at least one surface of the porous thermoplastic resin sheet is subjected to mat processing. It is a non-contact type information medium.

  In the invention according to claim 2, the roughness of the surface of the mat-processed porous thermoplastic resin sheet has an arithmetic average roughness of 0.2 μm or more and a maximum height of 1.5 μm or more. The non-contact type information medium according to claim 1.

  The invention described in claim 3 includes a lamination step of laminating an IC inlet between two porous thermoplastic resin sheets provided with a thermoplastic resin adhesive layer on an inner surface, and the laminated porous layer A matting step of matting at least one outer surface of the thermoplastic resin sheet to a predetermined roughness, and a forming step of applying hot pressure to the laminated inlet and the porous thermoplastic resin sheet; and The method of manufacturing a non-contact type information medium according to claim 1, wherein

  According to a fourth aspect of the present invention, there is provided a porous thermoplastic resin sheet in which an IC inlet is sandwiched and laminated using a press surface matted to a predetermined roughness in the mat processing step and the forming step. By heating and pressing, the outer surface of at least one porous thermoplastic resin sheet is matted to a predetermined roughness, and at the same time, a plurality of laminated porous thermoplastic resin sheets and an IC inlet are bonded together. The method of manufacturing a non-contact type information medium according to claim 1 or 2.

  In the invention according to claim 5, the porous thermoplastic resin sheet on the mat-processed side of the non-contact type information medium according to claim 1 or 2 is adhered to the lining paper of the booklet, and the opposite side is provided. 1 is a non-contact type information medium-attached booklet in which a porous thermoplastic resin sheet is bonded to either a front or back cover member.

Since this invention is the above structure, there exist the following effects.
That is, according to the first aspect of the present invention, the IC inlet provided with the IC chip and the antenna coil is sandwiched between the porous thermoplastic resin sheets coated with the thermoplastic resin adhesive and bonded, thereby simplifying the operation. A non-contact type information medium can be created by a stable method. By using a porous thermoplastic resin sheet and sandwiching the antenna sheet and applying heat pressure, the gap part shrinks and the base material itself deforms, making it a flexible non-contact type with excellent smoothness. An information medium can be created. In addition, by matting at least one surface, the wettability of the adhesive can be maintained even when the gaps in the porous thermoplastic resin sheet are crushed, and appearance defects such as antenna marks can be prevented. I can do it.

  In order to obtain the effect by the mat processing as described above, it is desirable that the arithmetic average roughness of the mat processed portion is 0.2 μm or more and the maximum height is 1.5 μm or more as shown in claim 2. If the roughness is larger than this value, the effect of applying the mat processing is more sufficiently exhibited in terms of improvement in appearance and improvement in adhesive strength.

  Since the porous sheet is thermoplastic, in order to perform matting on the porous sheet, it is desirable to apply hot pressure to the sheet using a matted press surface as shown in claim 4. In the first place, the production of the non-contact type information medium includes a step of laminating the base material and applying heat pressure as shown in claim 1, and thus, the base material is bonded and matted simultaneously in this step. It is efficient because things can be done.

  The non-contact type information medium obtained as described above can be used as a cover material of a booklet as shown in claim 5. In this case, the material of the booklet is often paper, and even when the porous sheet forming the non-contact type information medium is bonded to the paper, various adhesives can be obtained by matting the surface as described above. An agent can be used, and the adhesive strength is also improved.

It is a perspective view explaining one Embodiment of a non-contact type information medium attachment booklet using a non-contact type information medium concerning the present invention. It is a plane explanatory view showing an example of the non-contact IC inlet used for the non-contact type information medium concerning the present invention. It is the cross-sectional schematic diagram which showed the state which adhere | attached the non-contact-type information medium which concerns on this invention, the member for cover sheets, and an internal paper. It is a cross-sectional schematic diagram explaining an example of the conventional non-contact information medium. 1 is a schematic cross-sectional view illustrating an embodiment of a non-contact information medium according to the present invention. It is a perspective view which shows the process of producing a non-contact information medium. It is a perspective view which shows the problem of the conventional non-contact type information medium.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view for explaining an example of a non-contact type information medium attached booklet according to the present invention, FIG. 2 is a plan explanatory view showing an example of a non-contact IC inlet used in the present invention, and FIG. It is the cross-sectional schematic diagram which showed the state which adhere | attached the non-contact-type information medium which concerns on this invention, the member for cover sheets, and an internal paper.

  A non-contact type information medium attached booklet 10 using the non-contact type information medium 20 according to the present invention has a structure as shown in FIGS. 1 and 3, for example, and is attached to the cover member 11 and its inner surface. A non-contact type information medium 20 is sandwiched between the paper 12 and bonded, and a plurality of text papers 13 are added thereto. An IC inlet which is a part of the non-contact type information medium 20 is composed of an antenna sheet substrate 30, an IC chip 31, and an antenna coil 32 as shown in FIG. For example, as shown in FIG. 3, this IC inlet is sandwiched between two exterior base materials 21 and 22 to constitute a non-contact type information medium 20.

  In the IC inlet shown in FIG. 2, an antenna is formed on the antenna base 30 by an etching method, a wire bonding method, a printed antenna method, or the like. An IC chip is connected to this antenna by a welding method or the like. In some cases, such an IC inlet can be provided with an opening inside the antenna coil 32 in the antenna sheet base material 30 to improve the adhesion between the exterior base materials. In some cases, it is possible to provide an antenna directly on the exterior substrate 22 without providing a sheet substrate.

  The IC inlet composed of the IC chip 31, the antenna coil 32, and the antenna sheet substrate 30 is uneven depending on the thickness of the IC chip itself, the thickness of the antenna, the junction between the jumper wire and the antenna, the thickness of the antenna sheet substrate itself, and the like. It is a sheet with. When this IC inlet is processed into the non-contact type information medium 20 by sandwiching it between the exterior base materials 21 and 22, it is desirable to eliminate these irregularities in appearance. Here, a porous thermoplastic resin sheet is used as an exterior base material as in the present invention, and the exterior base materials 21 and 22 are softened and deformed by applying hot pressure during processing, and absorbs the irregularities of the IC inlet, The non-contact type information medium 20 that is smooth as a whole can be created. As such a processing method, a conventional method for producing a general IC card or the like can be used. For example, a hot press machine can be used.

  Examples of the porous thermoplastic resin sheet used here include various types of thermoplastic resins such as polyethylene resin, polypropylene resin, polyvinyl chloride resin, polyvinylidene chloride resin, polystyrene resin, polyvinyl acetate resin, and polyester resin. Alternatively, it can be used in combination by mixing porous particles such as silica, foaming by adding air during kneading, or perforating after stretching. Such a material is generally marketed as a resin sheet or synthetic paper imparted with printability for ink jet printing or offset printing.

  The porous thermoplastic resin sheet alone is difficult to be fused by hot pressure, and there is a problem that even if the porous thermoplastic resin sheet is fused, the characteristic voids are crushed. For this reason, it is preferable to apply a thermoplastic resin adhesive in advance and then stack the IC inlets between them and apply heat pressure to bond them. Examples of the thermoplastic resin adhesive that can be used here include EVA (ethylene / vinyl acetate copolymer), EAA (ethylene / acrylic acid copolymer), polyester, polyamide, polyurethane, and olefin. Various general thermoplastic resin adhesives can be used.

  A laminate obtained by laminating an IC inlet on a porous thermoplastic resin sheet provided with a thermoplastic resin adhesive is bonded by applying a hot pressure 44 as shown in FIG. For example, a process is used in which the sheet is sandwiched between two metal plates and bonded by applying hot pressure 44 with a press or the like. In the case of a conventional non-contact type information medium such as an IC card, a SUS (stainless steel) plate having a gloss surface is generally used as the metal plate. However, as described above, when the hot pressure 44 is applied to the porous thermoplastic resin sheet, there is a problem that the gap of the sheet is crushed. In order to solve this problem, porous thermoplasticity is obtained by sandwiching a laminated base material using, for example, a SUS plate processed into a mat surface instead of a conventional glossy plate, and applying hot pressure. The surface of the resin sheet can be processed into a mat. FIG. 4 is a schematic cross-sectional view of a non-contact type information medium that is heated and pressed using, for example, a glossy SUS board as in the prior art, and FIG. 5 is a SUS board that is matted as shown in FIG. The cross section of the non-contact type information medium which performed heating and pressurizing using etc. is shown. According to the manufacturing method as claimed in claims 4 and 5 of the present invention, as shown in FIG. 5, the surface 23 on which the surface of the non-contact type information medium is matted is obtained. If a porous thermoplastic base material sandwiched between an antenna and an IC chip or the like is heated and pressurized using a glossy SUS plate as in the prior art, a large pressure is applied to the antenna and IC chip portion. As shown in FIG. 5, the antenna 51 or IC chip portion 51 has a higher gloss than the portion 50 without the antenna or IC chip because the gap is crushed, and the adhesive strength of this portion may be reduced. .

  The method of matting the surface of the porous thermoplastic resin sheet is not limited to the above-described method, and for example, a mat film can be sandwiched between glossy SUS plates. Further, here, the method of performing the mat processing in the process simultaneously with the heat pressure has been described, but the mat processing may be performed as a separate process after bonding with the heat pressure. As a processing method in this case, a physical method such as sanding or sandblasting, chemical etching, an ultraviolet irradiation method, or the like can be used. Further, although it is desirable to perform mat processing on both surfaces of the non-contact type information medium, depending on circumstances, only one surface may be processed.

  In the non-contact type information medium similar to the present invention, the degree of unevenness that can be confirmed by the human eye is about 0.1 to 1 μm. That is, if there is a step of 1 μm or more on a part of the surface of the base material, that part may become an appearance defect, but conversely, if the surface of the base material has unevenness of 1 μm or more as a whole The problem is not noticeable. As shown in claim 2, when the arithmetic average roughness of the matted surface of the non-contact type information medium of the present invention is 0.2 μm or more and the maximum height is 1.5 μm or more, non-contact An effect of reducing defects in appearance such as a step on the type information medium can be obtained.

  The invention according to claim 5 is such that the non-contact type information medium 20 is sandwiched and bonded between the cover member 11 and the inner sheet 12 and processed into a booklet shape. The non-contact type information medium 20 is bonded to the inner sheet 12 by an adhesive 42. This adhesive 42 often uses a water-based emulsion adhesive from the viewpoint of workability and environment. Often uses equipment that has produced booklets so far, and adhesives have been chosen for bonding fabric and paper. If a non-contact type information medium used for a booklet attached to a non-contact type information medium is created using an exterior base material such as PVC or PET-G used for general IC cards, existing equipment and adhesion In addition, it is not possible to bond the inner sheet with an agent, and there is a problem that the rigidity is high. In order to solve such problems, in the present invention, a porous thermoplastic resin sheet is used as an exterior base material, and the surface of the porous thermoplastic resin sheet is matted to provide high flexibility and adhesion. In addition, an excellent non-contact type information medium can be produced.

When the non-contact type information medium 20 and the cover member 11 are bonded, for example, a two-component mixed epoxy adhesive, a moisture curable silicone adhesive, a one-component curable urethane adhesive, or the like can be used. Various hot melt adhesives such as EVA, EAA, polyester, polyamide, polyurethane, and olefin can also be used. Even in such an adhesive, since the surface property of the non-contact type information medium affects the adhesive strength, the adhesive strength can be increased by matting the surface of the non-contact type information medium.
Hereinafter, based on an Example, the non-contact information medium which concerns on this invention, its manufacturing method, and a non-contact information medium attached booklet are demonstrated more concretely.

(Creation of IC inlet)
As shown in FIG. 3, a 38 μm thick polyethylene terephthalate (PET) resin sheet is used as an antenna sheet base 30, aluminum vapor deposition and antenna-like mask layer are printed on both sides, and antenna coil 32 is formed on the surface by pattern etching. And a jumper wire was formed on the back. Further, the antenna coil and the jumper wire were joined by caulking, and the IC chip 31 was welded to the connection terminal portion of the antenna coil. The outer circumference of the antenna coil is 80 mm × 48 mm, and the inner circumference is 67 mm × 37 mm. Further, the inside of the antenna coil was removed by punching out with a size of 65 mm × 35 mm. Further, the outer periphery of the antenna coil and the outline 2 mm away from the IC were taken, and the outer antenna sheet substrate was punched and removed to obtain an IC inlet. The thickness of the antenna part is about 80 μm including the base material.

(Preparation of exterior base materials 1 and 2)
A 380 μm thick “TESLIN sheet” (registered trademark) (PPG Industry synthetic paper) was prepared as an exterior substrate, and heat sealant “AQUATEX” (registered trademark) (Chuo Rika Kogyo Co., Ltd.) on one side of this sheet. Polyolefin adhesive) was applied at a thickness of 5 g / m ² . After drying, two 150 mm × 200 mm sheets were cut to obtain an exterior substrate 1 (21) and an exterior substrate 2 (22).

(Creation of non-contact information media)
The IC inlet was placed on the exterior base material 2 (22) prepared above and fixed by spot heating. Furthermore, exterior base material 1 (21) was laminated and fixed by spot heating.
The laminated sheet was sandwiched between two mat-processed SUS plates and bonded by heating and pressing to obtain a non-contact type information medium 20. The surface roughness of the mat-processed SUS plate was 0.8 μm to 1.1 μm in arithmetic average roughness (Ra), and 6.0 μm to 8.0 μm in maximum height (Ry). .
The heating and pressing conditions were adjusted between a heating part temperature of 100 ° C. to 160 ° C., a pressure of 0.49 MPa to 2.94 MPa, and a processing time of 15 seconds to 120 seconds, and an optimum one was selected. The arithmetic average roughness (Ra) of the surface of the non-contact type information medium thus obtained was about 0.8 μm, and the maximum height (Ry) was about 4 μm. For comparison, the laminated sheets were sandwiched between two gloss SUS plates and processed under the same conditions to obtain a non-contact information medium for comparison. The surface of the base material of the comparative non-contact information medium thus obtained was generally glossy compared to that of the present invention, and the antenna portion was particularly noticeable and glossy. The arithmetic average roughness (Ra) of the glossy part was about 0.2 μm, and the maximum height (Ry) was about 1 μm.

(Bonding of non-contact type information medium and cover member)
A book cover cover cloth “Enviro-Mate” (registered trademark) (a cover cloth made by ICG Holliston) was cut into a non-contact information medium size to obtain a cover member 11. As the adhesive 41, “Sdyne” (registered trademark) (a moisture-curing hot melt adhesive manufactured by Sekisui Fuller) was melted with a heat roll coater and applied to the cover member 11 with a thickness of 20 g / m ² . The exterior base material 1 (21) side of the non-contact type information medium 20 was adhered to the cover member 11 to which the adhesive 41 was applied, pressed with a roller, and then aged. The same processing was performed for the non-contact information medium for comparison.

(Production of booklet attached to non-contact information media)
A plurality of body sheets 13 and one inner sheet 12 are collated, and the center part is sewn with a sewing machine to create a body part with the inner sheet 12 attached to the outermost part. 10 g / of “SP-2850” (water-based emulsion adhesive manufactured by Konishi Co., Ltd.) is used as the adhesive 42 on the exterior base material 2 (22) side of the non-contact type information medium 20 to which the cover member 11 obtained above is bonded. Coating was performed with a thickness of m ² , and the above-mentioned inner-attached paper 12 was adhered. The obtained booklet was expanded and cut into 125 mm × 180 mm to obtain a non-contact information medium-attached booklet 10. Similarly, a booklet using a non-contact information medium for comparison was also produced.

(Confirmation of effect)
The front and back covers of the non-contact information medium attached booklet according to the present invention prepared as described above were smooth and flexible. Also, good results were shown in various durability evaluation tests such as storage in a high temperature and high humidity environment and bending tests. However, in a booklet using a comparative non-contact type information medium heated and pressurized with a gloss SUS plate, the adhesive strength between the non-contact type information medium, the inner-pasted paper, and the book cover cloth is weak, and in particular, the antenna The adhesion of the sandwiched part was remarkably weak. When the peel strength between the cross and the non-contact type information medium was measured with respect to the portion where the antenna is sandwiched, the peel strength was 5 to 8 N / cm in the comparative non-contact type information medium. In the non-contact type information medium, the peel strength was increased to 12 to 18 N / cm, and it was confirmed that the adhesive strength was improved. As described above, the effect of matting the surface of the non-contact type information medium was confirmed.

DESCRIPTION OF SYMBOLS 10 ... Non-contact type information medium attached booklet 11 ... Cover member 12 ... Inner paper 13 ... Text paper 20 ... Non-contact type information medium 21 ... Exterior base material 1
22 ... exterior base material 2
23 ... Matted surface 30 ... Antenna sheet base 31 ... IC chip 32 ... Antenna coil 41 ... Adhesive (for cover)
42 ... Adhesive (for internal paper)
43 ... Adhesive (for exterior base material application)
44 ... Heat pressure 50 ... Antenna, part without IC chip 51 ... Antenna, IC chip part

Claims (5)

  An IC inlet including an antenna coil and an IC chip connected to the antenna coil is sandwiched and laminated between two porous thermoplastic resin sheets provided with a thermoplastic resin adhesive on the inner surface. In the non-contact type information medium, at least one surface of the porous thermoplastic resin sheet is subjected to mat processing.   The roughness of the surface of the mat-processed porous thermoplastic resin sheet has an arithmetic average roughness of 0.2 µm or more and a maximum height of 1.5 µm or more. Non-contact information medium.   A laminating step in which an IC inlet is sandwiched between two porous thermoplastic resin sheets provided with a thermoplastic resin adhesive layer on the inner surface; and an outer side of at least one of the laminated porous thermoplastic resin sheets 2. A mat processing step of matting the surface to a predetermined roughness, and a forming step of applying a hot pressure to the laminated inlet and the porous thermoplastic resin sheet to bond them to each other. 3. A method for producing a non-contact information medium according to 2.   In the mat processing step and the forming step, at least one sheet of the porous thermoplastic resin sheet sandwiched and laminated with the IC inlet is hot-pressed using a press surface matted to a predetermined roughness. The outer surface of the porous thermoplastic resin sheet is matted to a predetermined roughness, and at the same time, the plurality of laminated porous thermoplastic resin sheets and the IC inlet are bonded together. Of manufacturing a non-contact type information medium.   The porous thermoplastic resin sheet on the matte side of the non-contact type information medium according to claim 1 or 2 is bonded to the liner paper of the booklet, and the porous thermoplastic resin sheet on the opposite side is the front or back side. A booklet attached to a non-contact type information medium, wherein the booklet is adhered to any cover member.

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