JP2003223627A - Ic card and method of manufacturing ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase the strength of an IC card with a structure by reinforcement plates, protect an IC chip, smooth a surface also for a thin IC card, eliminate the nonuniformity of recording by suppressing the occurrence of irregularities, and provide excellent resistances against bending and point-pressure load. <P>SOLUTION: In this IC card, an image receiving layer 6 is installed on at least one face, and parts having an IC module 3 formed of an IC chip 3a and an antenna 3b are installed through adhesive agents 4 and 5 at a specified position between two support bodies 1 and 2 opposed to each other. The first reinforcement plate 20 and the second reinforcement plate 21 are installed, adjacent to each other, on the IC chip 3a at least through close-fitted layers 10 and 11 in this order. A close-fitting strength between the IC chip 3a and the first reinforcement plate 20 is larger than that between the first reinforcement plate 20 and the second reinforcement plate 21. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card incorporating a non-contact type IC module for storing personal information or the like which requires security such as forgery and alteration prevention, and a method of manufacturing the IC card. It is a thing.

[0002]

2. Description of the Related Art Conventionally, a magnetic card for recording data by a magnetic recording system has been widely used as an identification card (ID card), a credit card and the like. However, since data can be rewritten relatively easily with a magnetic card, tampering of the data is not sufficient, it is susceptible to external influences due to magnetism, data protection is not sufficient, and the recording capacity is small. There were problems such as.

Some ID cards have, for example, a face image and written information on the front surface, and a writing layer on the back surface which can be written with a writing implement or the like. Due to recent advances in sublimation printing technology, such ID cards have become easy and inexpensive to make, and have been rapidly spreading for the past several years, but have not yet reached full-scale spread.

An IC chip is built in the inside of the ID card, and the high cost is cited as the biggest impediment factor that has not yet spread in earnest. In addition, it is in a vicious cycle that it cannot be mass-produced because it does not spread, and it becomes expensive.

On the other hand, the quantitative problem is partly due to the fact that a technique for making a card inexpensively and stably has not been established yet. As a conventional method of creating an IC card, for example,
A sheet or sheet that is relatively thick and is made by accommodating IC components and wireless antennas in the upper and lower resin mold covers and then melting and bonding the joint surfaces of the upper and lower covers with heat. There is one that is created by shaving a groove in a material, housing an IC component and a wireless antenna in this groove, sealing this with a resin, and adhering a sheet material for holding an image receiving layer thereon. is there.

[0006]

By the way, the IC card created by the former method is relatively inexpensive when printing only a fixed symbol without a face image or written information as a wireless tag, When printing different facial images and written information on each sheet, it takes time to print the information on a sheet material with another machine, cut it, and attach it to a resin mold cover. It is handmade and very expensive.

The latter method is suitable for making a thin card. However, in this method, since a groove is formed in the sheet material, a thick sheet material is required. The thickness of the sheet material for holding the image receiving layer must be reduced. If it is made thinner, the resin-sealed part will be different in material from the other parts and will heat-shrink when it is cured.Therefore, the surface of the sheet material corresponding to the resin-sealed part will be different from the surface of other parts. I will dent a little. Therefore, when the image receiving layer is attached on the sheet material, a recess is formed at a portion corresponding to the recess of the sheet material. Therefore, when printing is attempted on the portion above the antenna or the IC, the diffusion of the ink to the image receiving layer due to heating of the thermal head becomes poor, and the color becomes light or white is removed. Therefore, it is necessary to exclude the recessed portion of the image receiving layer from the printing area to lay out the card surface, which has a drawback that free expression is restricted. Further, even if the surface is smooth, it is difficult to obtain good printing characteristics because the thermal conductivity is partially different. In particular, when the information is image information having gradation characteristics such as a facial photograph and is formed by the thermal transfer method, there is a great problem in image reproduction.

Then, when a gradation image or a fused image is transferred thermally by a thermal head, the stress of bending along the platen, which is an adhesion mechanism, and the pressure by the head cause disconnection of the connection between the IC built in the IC card and the wiring. The above problem frequently occurs, and the obtained IC card cannot be used as a product at the image forming stage, resulting in a decrease in production efficiency.

Further, when a writing layer capable of writing is provided, the durability against the load on the IC chip due to the writing pressure for writing becomes a problem, and particularly in the case of a thin card, it becomes a serious problem.

In order to deal with these problems, Japanese Unexamined Patent Application Publication No.
No. 131987, a surface support having an image receiving layer on one surface and a thermosetting resin layer on the other surface, and a back surface having a writing layer on one surface and a thermosetting resin layer on the other surface. A method is disclosed in which an IC module is inserted between the thermosetting resin layers of both the support and the support, the substrates are stacked, heated and pressed, and then punched into a predetermined shape to form a card. By this, it is possible to reduce the depression of the surface support corresponding to the IC module, to make the surface smooth and to improve the printing characteristics, and to obtain an inexpensive, mass-produced IC card. Further, regarding the durability due to the destruction of the IC chip due to pressure, bending, etc., and the disconnection of the antenna, Japanese Patent Laid-Open No.
It is disclosed in 199083 and JP-A-8-324166.

However, the IC obtained by this method
The card does not have sufficient flatness, and sublimation heat transfer and / or
Alternatively, when an image is formed by a thermal fusion transfer method or an ink jet method thermal transfer, the image receiving layer is deteriorated depending on the heating temperature, which causes a problem that the image receiving sensitivity is lowered or the image is blurred, and the flatness of the transfer head at the time of image receiving is generated. When a cushion layer is provided between the image receiving layer and the thermosetting resin layer in order to improve the image receiving property,
There is also a problem that the cushion layer is softened and a slight waviness is generated on the IC card, conversely the flatness is deteriorated, and recording unevenness occurs. Further, there remain problems in flatness and resistance to point pressure load against heat and pressure applied to the transfer head at the time of image reception, and against writing pressure applied to the writing layer.

The present invention has been made in view of the above circumstances. An object of the present invention is to improve the strength of an IC card and protect an IC chip by a reinforcing plate structure, and the surface of a thin IC card can be smoothed. An object of the present invention is to provide an IC card which suppresses uneven unevenness, has no recording unevenness, and is excellent in resistance to bending and point pressure strength load, and a method of manufacturing the IC card.

[0013]

In order to solve the above-mentioned problems and to achieve the object, the present invention has the following constitution.

According to a first aspect of the present invention, an image receiving layer is provided on at least one surface, and a component including an IC module including an IC chip and an antenna interposes an adhesive agent at a predetermined position between two opposing supports. In the IC card provided as described above, a first reinforcing plate and a second reinforcing plate are adjacently provided in this order to the IC chip at least with an adhesive layer interposed between the IC chip and the first reinforcing plate. The adhesion strength of is larger than the adhesion strength between the first reinforcing plate and the second reinforcing plate.

According to the invention described in claim 1, the IC
By providing a first reinforcing plate and a second reinforcing plate adjacent to the chip in this order with an adhesion layer interposed therebetween, the strength of the IC card is improved and the IC chip is protected by the structure of the reinforcing plate, and a thin IC card is provided. However, the surface can be smoothed and uneven unevenness is suppressed to prevent recording unevenness, and stress due to bending or point pressure strength load is efficiently dispersed by the second reinforcing plate being destroyed first. , Protects the IC chip and improves durability.

According to a second aspect of the present invention, the bonding point between the first reinforcing plate and the second reinforcing plate is a part of the reinforcing plate area. It's a card.

According to the invention of claim 2, the first
The reinforcing plate and the second reinforcing plate can efficiently disperse stress with a simple structure, and can improve the resistance against bending and point pressure load.

According to a third aspect of the present invention, the area of the first reinforcing plate and the area of the second reinforcing plate are both I.
3. The IC card according to claim 1, wherein the area of the first reinforcing plate is smaller than the area of the C chip and the area of the first reinforcing plate is smaller than the area of the second reinforcing plate.

According to the invention of claim 3, the first
With the reinforcing plate and the second reinforcing plate, the IC chip is protected and has excellent resistance to bending and point pressure strength load, and the area of the first reinforcing plate is smaller than the area of the second reinforcing plate. The unevenness disappears, the surface can be smoothed even with a thin IC card, and uneven unevenness is suppressed to eliminate uneven recording.

According to a fourth aspect of the present invention, an image receiving layer is provided on at least one surface, and a component including an IC module consisting of an IC chip and an antenna interposes an adhesive at a predetermined position between two opposing supports. In the IC card provided as described above, the IC chip has a first reinforcing plate at least with an adhesive layer interposed, and further includes a stress relaxation layer and a second reinforcing plate. is there.

According to the invention described in claim 4, the stress relaxation layer can disperse stress due to bending and point pressure strength to improve resistance, and smooth the surface of a thin IC card. As a result, uneven unevenness is suppressed and recording unevenness is eliminated.

The invention according to claim 5 is the IC card according to claim 4, wherein the stress relaxation layer is a fibrous sheet.

According to the fifth aspect of the present invention, the stress can be relaxed by the simple structure of the fibrous sheet, so that the surface of the thin IC card having the IC chip can be smoothed and unevenness is generated. Is suppressed and recording unevenness is eliminated.

According to a sixth aspect of the present invention, an image receiving layer is provided on at least one surface, and a component including an IC module including an IC chip and an antenna interposes an adhesive at a predetermined position between two opposing supports. In the IC card provided as described above, a reinforcing plate made of a shape memory alloy is provided adjacent to the IC chip, and the reinforcing plate is formed by flattening a shape memory alloy that stores a shape having a curvature in advance. The IC
The IC card is characterized in that it is deformed into a concave shape on the IC chip side by heating at the time of contact with the chip or after contact.

According to the sixth aspect of the present invention, the shape memory alloy is flattened, and is deformed into a concave shape toward the IC chip by heating during or after the close contact with the IC chip, thereby forming a reinforcing plate. By improving the strength of the IC card and protecting the IC chip, the surface can be smoothed even with a thin IC card, and uneven unevenness is suppressed to eliminate uneven recording.

The invention according to claim 7 is characterized in that the shape memory alloy is a Ni-Ti alloy.
The IC card described in 1.

According to the invention of claim 7, Ni
-By deforming the Ti alloy into a concave shape on the IC chip side,
The surface can be smoothed even with a thin IC card, and uneven unevenness is suppressed to eliminate uneven recording.

The invention according to claim 8 is the IC card according to claim 6, wherein the heating temperature for heating after the adhesion is 100 ° C. or higher.

According to the invention described in claim 8, it is possible to more reliably deform the IC chip side into the concave shape.

According to a ninth aspect of the present invention, an image receiving layer is provided on at least one surface, and a component including an IC module consisting of an IC chip and an antenna interposes an adhesive at a predetermined position between two opposing supports. In the IC card provided as described above, a first reinforcing plate is provided on the circuit side of the IC chip with at least an adhesive layer interposed therebetween, and a second reinforcing plate is provided on the opposite side of the IC chip with at least an adhesive layer interposed therebetween. The IC card is characterized in that the distance d1 between the first reinforcing plate and the IC chip and the distance d2 between the second reinforcing plate and the IC chip are d2 <d1.

According to the invention of claim 9, the first
The distance d1 between the reinforcing plate and the IC chip is
By making it larger than the distance d2 of the C chip, the deformation of the circuit surface due to bending and point pressure strength load is reduced, the strength of the IC card is improved and the circuit side of the IC chip is protected more reliably, and the surface of the thin IC card can be protected. The smoothing process can be performed, and the unevenness of recording can be suppressed by suppressing the unevenness of unevenness.

According to a tenth aspect of the present invention, an image receiving layer is provided on at least one surface, and a component including an IC module consisting of an IC chip and an antenna interposes an adhesive at a predetermined position between two opposing supports. In the IC card provided as described above, an adhesive having a thickness D1 and an IC module are provided in this order on the first support side, and an adhesive having a thickness D2 is laminated on the second support side so that D1 <D2, An IC card is characterized in that the IC module is attached so as to be partially embedded in the adhesive of the second support.

According to the tenth aspect of the present invention, the strength of the IC card is improved and the IC chip is protected by the layer structure, and the surface of the thin IC card can be smoothed to prevent unevenness from occurring. It has no recording unevenness and has excellent resistance to bending and point pressure strength loads.

The invention described in claim 11 has an image receiving layer on the side of the first support, and the image receiving layer on the side of the second support.
11. The IC card according to claim 10, wherein the IC module is mounted and integrated so as to be the circuit surface of the C chip.

According to the invention of claim 11, I
By mounting and integrating the C module, the circuit surface of the IC chip can be protected more reliably and with a simple structure.

The invention according to claim 12 is characterized in that the image receiving layer has personal identification information including at least a name and a face image, and the IC according to any one of claims 1 to 11. It's a card.

According to the twelfth aspect of the present invention, the personal identification information including the name and face image is included, and the personal identification information is used as an identification card (ID card) or a credit card.

The invention according to claim 13 is the IC card according to any one of claims 1 to 12, characterized in that a writing layer capable of writing is provided in part.

According to the thirteenth aspect of the present invention, it has a writing layer capable of writing and is used for an identification card (ID card), a credit card and the like.

The invention according to claim 14 is the IC card according to any one of claims 1 to 13, wherein the adhesive is a reactive hot melt adhesive.

According to the fourteenth aspect of the present invention, the adhesive is a reactive hot melt adhesive, which has excellent durability and is suitable for processing at low temperatures.

According to a fifteenth aspect of the present invention, an image receiving layer is provided on at least one surface, and personal identification information is provided on the image receiving layer.
At a predetermined position between two opposing supports, an IC chip,
In a method of manufacturing an IC card in which a component including an IC module including an antenna is provided with an adhesive interposed, an adhesive having a thickness D1 is provided on a first support, and the IC module is placed on the adhesive. , Thickness D2 on the second support
The method of manufacturing an IC card is characterized in that the adhesive of (1) is laminated and bonded so that D1 <D2.

According to the fifteenth aspect of the present invention, the strength of the IC card is improved and the IC chip is protected by the layer structure, the surface of the thin IC card can be smoothed, and uneven unevenness can be suppressed. It has no recording unevenness and has excellent resistance to bending and point pressure strength loads.

According to a sixteenth aspect of the present invention, the first support has the image receiving layer, and at least a part of the second support is provided with a writable writing layer. Item 15. The method for manufacturing an IC card according to Item 15.

According to the sixteenth aspect of the present invention, the personal identification information including the name and face image can be recorded, and moreover, it can be written on the writing layer, and the identification card (ID card).
And used for credit cards.

The invention according to claim 17 is the method for manufacturing an IC card according to any one of claims 15 to 16, characterized in that the adhesive is a reactive hot melt adhesive. is there.

According to the seventeenth aspect of the present invention, the adhesive is a reactive hot melt adhesive, which has excellent durability and is suitable for processing at a low temperature.

[0048]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an IC card and a method for manufacturing an IC card of the present invention will be described with reference to the drawings, but the present invention is not limited thereto as long as it is in the spirit.

1 and 2 show the IC card of the first embodiment, and FIG. 1 is a diagram showing the layer structure of the IC card, FIG.
[Fig. 3] is a diagram showing a configuration of a reinforcing plate.

The IC card of this embodiment has an IC chip 3a and an antenna 3b at a predetermined position between the opposing first support 1 on one side and the remaining second support 2 on one side. Parts including the module 3 are placed and filled with an adhesive to provide the adhesive layers 4 and 5.

The first support 1 on one side has an image-receiving layer 6 on one surface, and the image-receiving layer 6 has a name by a sublimation heat transfer and / or melt heat transfer system or an inkjet system,
Personal identification information including a face image is provided. The remaining second support 2 is provided with a writable writing layer 7.

The IC chip 3a is provided with a first reinforcing plate 20 and a second reinforcing plate 21 adjacent to each other with at least the adhesive layers 10 and 11 in this order. The adhesion strength between the IC chip 3a and the first reinforcing plate 20 is set to be larger than the adhesion strength between the first reinforcing plate 20 and the second reinforcing plate 20.

Parts including this IC module 3 and the first
The reinforcing plate 20 and the second reinforcing plate 20 are supported by mesh sheets 30 and 31 as a mesh structure member having a two-dimensional mesh structure.

Thus, the adhesion layer 1 is attached to the IC chip 3a.
The first reinforcing plate 20 and the second reinforcing plate 21 via the 0 and 11
With the reinforcing plate structure that is provided adjacent to and in this order,
The strength of the card can be improved and the IC chip 3a can be protected, the surface can be smoothed even with a thin IC card, uneven unevenness can be suppressed to prevent uneven recording, and resistance to bending and point pressure strength load Excellent, and the first reinforcing plate 20
The second reinforcing plate 21 has an adhesion strength.

Further, the entire surface of the side surface 3a2 opposite to the circuit surface 3a1 of the IC chip 3a is adhered to the first reinforcing plate 20 through the adhesion layer 10, but the first reinforcing plate 20 and the second reinforcing plate 20 are also attached. The adhesion point of the adhesion layer 11 of 21 is a part of the reinforcing plate area, and the first reinforcing plate 20 and the second reinforcing plate 21 can improve the adhesion strength with a simple structure.

The area of the first reinforcing plate 20 and the area of the second reinforcing plate 21 are both larger than the area of the IC chip 3a, and the area of the first reinforcing plate 20 is the second reinforcing plate 2.
Since it is smaller than the area of 1, the IC chip 3a can be more reliably
Is protected and has excellent resistance to bending and point pressure strength load, and since the area of the first reinforcing plate 20 is smaller than the area of the second reinforcing plate 21, unevenness is eliminated and the surface is smoothed even with a thin IC card. Processing can be performed, and unevenness in recording is suppressed by suppressing the occurrence of unevenness in unevenness.

FIGS. 3 and 4 show an IC card according to the second embodiment, and FIG. 3 is a diagram showing the layer structure of the IC card.
[Fig. 3] is a diagram showing a configuration of a reinforcing plate.

The IC card of this embodiment has the same configuration as that of the embodiment of FIGS. 1 and 2, and the same reference numerals are given to omit the description. First through the adhesion layer 10 to the IC chip 3a
Of the present invention, and further comprises a mesh sheet 30 and a second reinforcing plate 21 which form a stress relaxation layer.

The mesh sheet 30 is composed of a fibrous sheet, and has a simple structure and can relax stress. This mesh sheet 30 is adhered to the first reinforcing plate 20 via the adhesive layer 12 and to the second reinforcing plate 21 via the adhesive layer 13, and is thin due to the mesh sheet 30 constituting the stress relaxation layer. Even with an IC card, the surface can be smoothed and uneven unevenness can be suppressed to eliminate uneven recording.

5 and 6 show an IC card according to the third embodiment, and FIG. 5 is a diagram showing the layer structure of the IC card.
[Fig. 3] is a diagram showing a configuration of a reinforcing plate.

The IC card of this embodiment has the same configuration as that of the embodiment of FIGS. 1 and 2 and is given the same reference numeral and its description is omitted. A reinforcing plate 22 made of a shape memory alloy is provided adjacent to the IC chip 3a, and the reinforcing plate 22 is a flat plate made of a shape memory alloy that stores a shape having a curvature in advance. After the close contact, the IC chip is deformed into a concave shape by heating.

That is, as shown in FIG. 6A, an adhesive is supplied to the reinforcing plate 22 made of a shape memory alloy by the adhesive supply section 40, and the adhesive layer 10 is bottled on the reinforcing plate 22. The IC chip 3a is placed and adhered on the adhesive layer 10 (FIG. 6B), and when the IC chip 3a is brought into close contact with or after the close contact, the IC chip 3a is heated by a residual stress so that the IC has a curvature R
It can be deformed into a concave shape on the tip side (Fig. 6).
(C)).

In this manner, the reinforcing plate 22 made of the shape memory alloy leaves a residual compressive stress on the chip, which causes the IC chip 3 to be bent from the side opposite to the circuit surface.
The circuit surface of a is protected, the surface can be smoothed even with a thin IC card, unevenness is prevented from occurring, recording is not uneven, and resistance to bending and point pressure strength load is excellent.

The shape memory alloy is a Ni--Ti alloy,
By deforming the IC chip side into a concave shape, the surface can be smoothed even with a thin IC card, and uneven recording is suppressed and uneven recording is eliminated. Further, when the heating temperature for heating after the adhesion is 100 ° C. or higher, the IC chip side can be more surely deformed into a concave shape.

7 and 8 show an IC card according to the fourth embodiment, and FIG. 7 is a diagram showing the layer structure of the IC card.
[Fig. 3] is a diagram showing a configuration of a reinforcing plate.

The IC card of this embodiment has the same configuration as that of the embodiment of FIGS. 1 and 2, and the same reference numerals are given to omit the description. The first reinforcing plate 20 is provided on the circuit 3a1 side and the antenna 3b side of the IC chip 3a via the adhesion layer 18, and the IC
It has a second reinforcing plate 21 on the opposite side surface 3b2 with the chip 3a interposed therebetween, with an adhesive layer 19 interposed therebetween. First reinforcing plate 20
And the distance d1 between the IC chip 3a and the second reinforcing plate 21 and the IC
The distance d2 of the chip 3a is d2 <d1.

Area of first reinforcing plate 20 and second reinforcing plate 2
The area of 1 is larger than the area of the IC chip 3a and the area of the first reinforcing plate 20 is larger than the area of the second reinforcing plate 21, so that the strength of the IC card is improved and the circuit 3a1 of the IC chip 3a. Side is protected more surely, thin IC
Even with a card, the surface can be smoothed and uneven unevenness is suppressed to eliminate uneven recording.

9 and 10 show the IC of the fifth embodiment.
FIG. 9 shows a card, FIG. 9 shows a layer structure of an IC card, and FIG. 10 shows a structure of a reinforcing plate.

The IC card of this embodiment has the same configuration as that of the embodiment of FIGS. 1 and 2 and is given the same reference numeral and its description is omitted. In this embodiment, the module support 35
The antenna 3b is provided by etching. The IC chip 3a is provided on the module support 35 on the side of the circuit 3a1 via the adhesion layer 14, and the IC chip 3a and the antenna 3b are connected. The module support body 35 is provided with the first reinforcing plate 20 via the adhesion layer 15.

Side 3 of IC chip 3a opposite to circuit 3a1
The second reinforcing plate 21 is provided on the a2 via the adhesion layer 17.

Area of first reinforcing plate 20 and second reinforcing plate 2
The area of 1 is larger than the area of the IC chip 3a and the area of the first reinforcing plate 20 is larger than the area of the second reinforcing plate 21, so that the circuit 3a1 side of the IC chip 3a is more reliably protected. It

In addition, the first reinforcing plate 20 and the IC chip 3a
And the distance d2 between the second reinforcing plate 21 and the IC chip 3a are d2 <d1. In this way, by making the distance d1 between the first reinforcing plate and the IC chip larger than the distance d2 between the second reinforcing plate and the IC chip, the strength of the IC card is improved and the circuit side of the IC chip is more reliably protected. And thin IC
Even with a card, the surface can be smoothed and uneven unevenness is suppressed to eliminate uneven recording.

Further, in the embodiment shown in FIGS. 1 to 10, the adhesive layer 4 of the adhesive having the thickness D1 is provided on the first support 1 side.
The IC module 3 is provided in this order, and the adhesive layer 5 of the adhesive having a thickness D2 is laminated on the second support 2 side so that D1 <D2, and the IC module 3 is the adhesive of the first support 1. It is pasted so that it is partially embedded in. With such a layer structure, the strength of the IC card is improved and the IC chip 3a is protected, and the surface of the thin IC card can be smoothed.
It suppresses uneven unevenness to prevent recording unevenness and has excellent resistance to bending and point pressure strength load.

On the side of the first support 1, the IC chip 3
The IC module 3 is placed and integrated so as to become the circuit surface 3a1 of "a", and the IC chip 3 has a more reliable and simple structure.
The circuit surface 3a1 of a can be protected.

Further, the IC card has an image receiving layer 6 on one surface of the first support 1, the image receiving layer 6 is provided with personal identification information, and a predetermined position between the opposing second supports 2 is provided. To the IC
A component including the IC module 3 including the chip 3a and the antenna 3b is provided with the adhesives 4 and 5 interposed therebetween. The adhesive layer 4 of the adhesive having the thickness D1 is provided on the first support 1 and the adhesive 4 is provided. After mounting the IC module 3 via the mesh sheets 30 and 31, an adhesive layer 5 made of an adhesive having a thickness D2 is provided on the second support 2 and laminated so that D1 <D2. to paste together.

Before being heated, the surface support, which is the first support 1 on one side, has an image receiving layer for ink jet or an image receiving layer for sublimation heat transfer on one side of the film support and the other side thereof. It is preferable to have an adhesive layer, but the present invention is not limited to this.

The image receiving layer is a layer capable of receiving an image and is made of a material that traps and fixes the dye when the sublimation dye or the diffusion dye is heated by the thermal head and thermally diffuses. Preferably, for example, polyvinyl chloride resin, polyester resin, polyvinyl acetal resin,
Polymer materials such as polyvinyl butyral resin, epoxy resin, acrylic resin, etc. are known as materials for a good image receiving layer. Generally, it is preferable that these materials for the image receiving layer 6 are formed into powder, dissolved in a solvent such as methyl ethyl ketone, coated with a gravure coater or the like, dried, and then volatilized to form a solvent. The invention is not limited to this.

In order to form an image on the image receiving layer, a thermal head is brought into contact with the surface of the IC card to thermally diffuse the sublimation dye or the diffusion dye, so that the image becomes clear and is diffused per unit time. This is preferable because the amount of dye increases, but the present invention is not limited to this. In this case, in order to form an image on the image receiving layer, the applied pulse width of the thermal head is changed so that the thermal head gives gradation to each dot, and the thermal diffusion amount of the sublimation dye or the diffusion dye is controlled. Preferably.

The film support is formed by mixing white pigments and folding bubbles into a honeycomb structure, for example, polyethylene terephthalate (PET) or polypropylene (PP), or PET in order to enhance the formed image.
-G (manufactured by Eastman Kodak Company) or the like is preferable, and in particular, biaxially stretched resin, specifically 2
An axially stretched polyester film is preferable because it has strength even if it is thin, but the present invention is not limited to this. The thickness of the biaxially stretched polyester film is preferably 12 μm or more (more preferably 25 μm or more), and 3
It is preferably 00 μm or less (more preferably 250 μm or less).

To form an image on the image receiving layer, the applied pulse width of the thermal head is changed so that the thermal head gives gradation to each dot, and the thermal diffusion amount of the sublimation dye ink is controlled. At this time, when the film support has a honeycomb structure with bubbles, the contact with the thermal head is uniform and the heat insulation is good, so that the dots are well cut and a good image can be obtained.

These layers preferably contain a white pigment, and as the pigment, known pigments such as titanium oxide, barium sulfate and calcium carbonate can be used. A polyester film (specific gravity 1.38 or less) that contains a white pigment and is biaxially stretched to form voids to increase whiteness is preferable in terms of heat insulation and cushioning.

In the adhesive layer, the adhesive forming the adhesive layer is preferably a hot melt adhesive, and more preferably the hot melt adhesive is a reactive type.

As the hot melt adhesive used in the IC card of the present invention, a commonly used one can be used. Examples of the main component of the hot melt adhesive include ethylene / vinyl acetate copolymer (EVA) type, polyester type, polyamide type, thermoplastic elastomer type,
Examples include polyolefin type. As the polyamide hot melt adhesive, there is Macromelt series manufactured by Henkel, and as the thermoplastic elastomer hot melt adhesive, Shell Chemical Co., Ltd. Califlex TR.
And Clayton series, Asahi Kasei's tough plane, Fi
restore Synthetic Rubber a
nd Latex Tuffden, Phillips P
Examples include Sopren 400 series manufactured by Etroleum. Sumitomo Chemical's Sumitic, Chisso Petrochemical's Vistac, Mitsubishi Yuka's Yutakac, Henkel's Macromelt series, Mitsui Petrochemical's Tuffmer, Ube Lexen's APAO, Eastman Chemical Made East Bond,
There is A-FAX manufactured by Hercules. When the resins having different elastic moduli are used in the present invention, it can be selected from the above.

In the present invention, the hot melt adhesive is preferably a reactive type. Reactive hot melt adhesive (hereinafter,
A reactive adhesive is a type of adhesive in which a resin is melted and adhered, and then moisture is absorbed to cure the resin. Its characteristic is that it has a curing reaction compared to ordinary hot melt, and that it has a long bondable time and a high softening temperature after bonding, so it is highly durable and suitable for low-temperature processing. Is mentioned. As one example of the reactive adhesive, there is one in which an isocyanate group-containing urethane polymer is the main component at the molecular end, and this isocyanate group reacts with water to form a crosslinked structure.

Examples of reactive adhesives that can be used in the present invention include TE030 and TE100 manufactured by Sumitomo 3M Limited, Hibon 4820 manufactured by Hitachi Chemical Polymer Co., Ltd., Bondmaster 170 series manufactured by Kanebo UNSC, and Macroplast QR 3460 manufactured by Henkel. . In this invention, it is preferable to use resins having different elastic moduli. It is preferable to use a resin having a different elastic modulus because a resin having a high elastic modulus exhibits a skeleton function, and a resin having a low elastic modulus can be filled with fluidity and smoothed when a support is bonded. Further, the shape is changed to a so-called beam even if it is deformed, and the resistance is improved.

Here, an example of a method for manufacturing the IC card of the present invention using a hot melt adhesive will be described. In producing an IC card, first, a hot melt adhesive is applied to the front and back sheets with an applicator to a predetermined thickness. As a coating method, a usual method such as a roller method, a T-die method, or a die method is used.

An IC is provided between the upper and lower sheets coated with the adhesive.
Attach the member. The adhesive applied may be preheated with a heater or the like before mounting. After that, the IC member mounted between the upper and lower sheets is pressed with a press heated to the bonding temperature of the adhesive for a predetermined time, or instead of rolling by the press, the sheet is conveyed in a constant temperature layer while being rolled. May be rolled in. Further, vacuum pressing may be performed in order to prevent bubbles from entering during bonding. After pasting with a press or the like, it is punched into a predetermined shape and cut into a card shape to form a card. When a reactive adhesive is used as the adhesive, it is cured for a predetermined time and then cut into a card. It is effective to make a hole around the card size of the laminated sheets to accelerate the curing, in order to supply water necessary for the reaction.

Regarding the electronic parts in the present invention, a coil type one in which a winding coil and an IC chip are joined, or a print support on which an antenna pattern is formed
A print support type in which a C chip is joined is used. Further, a reinforcing plate is provided adjacent to the IC chip.

An IC module comprising an IC chip and an antenna according to the present invention has an inlet shape provided adjacent to a mesh sheet having a mesh. A coil type in which a winding coil and an IC chip are joined is provided on a mesh sheet having a mesh with a two-dimensional mesh structure, or a sandwiched shape is used. Further, it is preferable to adopt a print support type shape in which an IC chip is bonded to a print support on which an antenna pattern is formed.

The reinforcing plate of the present invention has a composite reinforcing structure having excellent mechanical strength to efficiently disperse the stress applied to the chip. Since the card becomes thicker, the reinforcing plate having the composite reinforcing structure is preferably made of high-strength material. Young's modulus of 10
A material of 0 GPa or more is preferably used for the main structure. A reinforcing plate having a composite reinforcing structure has an H structure, a corrugated structure, a laminated panel structure, a honeycomb structure, a concave structure, a blade stringer structure, a Z stringer structure, an I stringer structure, a hat stringer structure, a tube stringer structure, It is preferably selected from a grid type panel structure and a mesh structure.

The back side support, which is the other side of the support before heating, preferably has a writing layer on one side of the support and an adhesive layer on the other side, but the present invention is not limited to this. Absent. For example, a part of the writing layer may be used, or a fiber support may be used instead of the film support. The film support may have any original required function, but when the card is heated under pressure, the warp is smaller when the upper and lower material configurations are symmetrical, and a flat surface is obtained, so the film support It is preferable that it has the same structure as the above.

Further, it is preferable that the film support has a bubble-containing structure or has a cushion layer, but the present invention is not limited to this. Further, it is preferable to provide an adhesive layer provided on the front surface support and an adhesive layer having an elastic modulus different from that of the adhesive layer provided on the back surface support. The present invention is not limited to this as long as it does not deviate from the gist of the present invention.

The writing layer is preferably, for example, a polyester emulsion in which calcium carbonate, silica fine particles and the like are diffused. Like the image receiving layer of the surface support, the writing layer is dissolved in a solvent, coated with a gravure coater or the like, and then dried. It is preferable to vaporize the solvent to form the film, but the present invention is not limited to this. The thickness of the writing layer is preferably about the same as that of the image receiving layer, but the present invention is not limited to this.

This writing layer preferably has a fine uneven surface on the surface of the writing layer in order to improve writing performance in order to improve the writing performance, but the present invention is not limited to this.

As a method of recording a gradation image on an IC card, it is preferable to thermally diffuse a sublimation dye or a diffusion dye by heat transfer and trap the sublimation dye or the diffusion dye in the image-receiving layer to fix it.

Examples of thermal transfer include a method of writing a thermal transfer image with a thermal head and a method of transferring a recorded image from an image sheet on which an image has already been recorded, but the present invention is not limited to these. Further, as the thermal transfer, sublimation transfer recording is preferable, and the sublimation dye or the diffusion dye is preferably a post-chelate type dye capable of forming a chelate in the image receiving layer. The image-receiving layer preferably contains a metal compound capable of chelating the post-chelate dye. As such a metal compound, an inorganic or organic salt of a metal ion or a metal complex is preferable.

Image recording is performed by forming a protective layer using a thermal transfer sheet on an image on the information carrying layer provided with at least one selected from an authentication and identification image such as a face image, an attribute information image and format printing, or a printing surface side. It was formed.

As a method of forming an authentication identification image represented by a face image, a sublimation-type thermal transfer recording method, which is advantageous for forming a gradation image, is mentioned, and in recent years, it is generally represented by a driver's license. Has become.

Personal identification information includes name, address, date of birth,
It is a qualification and the personal identification information is usually recorded as character information, and a fusion type thermal transfer recording method is generally used. The format printing is performed by a printing method such as resin letterpress printing, lithographic printing, silk printing or the like on the substrate or on the image receiving layer used in the sublimation type thermal recording system.

It is preferable to provide a protective layer on the surface on which the image is recorded. The protective layer is not particularly limited as long as it is transparent and has a protective effect, but an actinic ray curable resin is particularly preferable. It can be provided on the upper surface of the recorded image by a transfer foil made of an actinic ray curable resin. The transfer of the transfer foil to the material to be transferred is usually performed using a means such as a thermal head, a heat roller, a hot stamping machine or the like that can apply pressure while heating.

As described above, in this embodiment, the IC chip is
A thin IC is provided by providing a reinforcing plate adjacent to the top 3a.
The surface of the card can be smoothed to prevent unevenness from occurring.
There is no recording unevenness, and bending or point pressure strength load
It has excellent resistance. [Examples] Hereinafter, the present invention will be described in detail with reference to Examples.
Obviously, the embodiment of the present invention is not limited to this. still,
In the following, "part" means "part by weight". (Preparation of adhesive) Adhesive 1 Henkel's Macroplast QR346
0 (moisture-curable adhesive) was used. (Fabrication of IC module) IC module 1; forming a winding type antenna,
SU with a thickness of 50 μm and 3 × 3 mm square IC chips joined together
4 × 4 mm square plate made of S301 with a thickness of 120 μm
Bond the first reinforcing plate to the side opposite to the circuit surface with epoxy resin
12mm on one side of the first reinforcing plate ²To be the area of
Thickness 50 made of SUS301 with epoxy resin
IC module having a second reinforcing plate in the form of a 5 × 5 mm square plate of μm
Got Jules.

Next, the IC module is sandwiched from both sides by a non-woven fabric made of polyethylene terephthalate fiber and at least part of the weave of the fiber is adhered, and the IC module 1
Was produced. When comparing the strength of holding the first reinforcing plate of the IC module 1 and peeling the IC chip with the strength of holding the first reinforcing plate and peeling the second reinforcing plate, the second reinforcing plate was The peeling strength was low. This example
This is shown in FIGS. 1 and 2.

IC module 2; A winding type antenna is formed, IC chips of 50 μm in thickness and 3 × 3 mm square are joined, and 4 × 4 of 120 μm in thickness made of SUS301.
A mm-square plate-shaped first reinforcing plate was bonded to the side opposite to the circuit surface with an epoxy resin. Next, the IC module was sandwiched from both sides with a non-woven fabric made of polyethylene terephthalate fiber and at least part of the weave of the fiber was adhered to produce an IC module sheet.

Then, a 5 × 5 mm square plate-shaped second reinforcing plate made of SUS301 and having a thickness of 50 μm was adhered to the first reinforcing plate side with an epoxy resin to obtain an IC module 2. This embodiment is shown in FIGS.

IC module 3; Ni-Ti in which a winding type antenna is formed, IC chips having a thickness of 50 μm and 3 × 3 mm square are bonded, and a shape having a curvature is stored in advance.
A reinforcing plate formed by flattening the shape memory alloy of the alloy was adhered with a thermosetting resin.

The reinforcing plate made of a shape memory alloy has a thickness of 120.
After using a material that expresses the shape memorized at 110 ° C in a 4 × 4 mm square plate of μm, adhere the reinforcing plate with the thermosetting resin 12
It was heat-cured at 0 ° C. and deformed so that the reinforcing plate had a concave shape of R = 100 mm stored in advance on the IC chip side.

Then, the IC module is sandwiched from both sides by a non-woven fabric made of polyethylene terephthalate fiber and at least a part of the weave of the fiber is adhered to the IC module 3
Was produced. This embodiment is shown in FIGS.

IC module 4; A wound type antenna is formed, IC chips of 50 μm in thickness and 3 × 3 mm square are joined, and 4 × 4 of 120 μm in thickness made of SUS301.
A thickness of 10 mm square plate-shaped first reinforcing plate on the side opposite to the circuit surface.
It was bonded with an epoxy resin of μ. Then SU on the circuit side
A 120 mm thick 4 × 4 mm square plate-shaped second reinforcing plate made of S301 was bonded with an epoxy resin having a thickness of 80 μm.

Then, the IC module is sandwiched from both sides by a non-woven fabric made of polyethylene terephthalate fiber and at least a part of the weave of the fiber is bonded.
Was produced. The distance from the chip is chip / first reinforcing plate (d1) = 10 μ, chip / second reinforcing plate (d2) = 8
0 μ. This embodiment is shown in FIGS. 7 and 8.

IC module 5: An IC chip having a thickness of 60 μm and a size of 3 × 3 mm is bonded with a conductive adhesive having a thickness of 20 μ to a print support having a thickness of 38 μ on which an antenna pattern is formed by etching, and a thickness of 1 made of SUS301 is used.
A first reinforcing plate in the form of a square plate of 4 × 4 mm having a size of 20 μm was bonded to a side opposite to the circuit surface with an epoxy resin with a thickness of 10 μm.

Then, on the surface of the print support opposite to the IC chip, 4 × 4 mm of SUS301 having a thickness of 120 μm was formed.
The second reinforcing plate having a rectangular plate shape was adhered to the epoxy resin in a thickness of 10 μm to obtain an IC module 5. The distance from the chip was set to be chip / first reinforcing plate (d1) = 10 μm and chip / second reinforcing plate (d2) = 68 μm. This example
This is shown in FIGS. 9 and 10.

IC module 6; a wound type antenna is formed, IC chips of 50 μm in thickness and 3 × 3 mm square are bonded, and 4 × 4 of 170 μm in thickness made of SUS301.
mm square plate-shaped first reinforcing plate is bonded to the side opposite to the circuit surface with epoxy resin, and the IC module is sandwiched from both sides by a non-woven fabric made of polyethylene terephthalate fiber and at least part of the fiber texture is bonded. 6 was produced.

Next, an example of making an IC card will be described.

<Embodiment 1> FIG. 11 is an embodiment showing an example of a laminated structure of an IC card and an individual authentication card.

In the IC card of this embodiment, a part including an IC module consisting of an IC chip and an antenna is placed at a predetermined position between a front support on one side and a back support on the other side which face each other. A front adhesive layer and a back adhesive layer are provided by being filled with an adhesive.

The front support has an image-receiving layer on one side, and this image-receiving layer uses a sublimation heat transfer and / or melt heat transfer method, or an inkjet method as a personal identification information including a name and a face image as a recognition image and attribute information. Is provided, and is further protected by providing a protective layer. The remaining back support on one side is provided with a writable writing layer.

A first reinforcing plate is provided on the side opposite to the circuit surface of the IC chip via a first adhesion layer.
The second reinforcing plate 21 is provided adjacent to the second reinforcing plate via the second adhesion layer.

Both sides of the component including the IC module, the first reinforcing plate and the second reinforcing plate are supported by a nonwoven fabric sheet as a mesh structure member having a two-dimensional mesh structure.

JIS as a front surface support and a back surface support
Moisture permeability by K7128 Z0208 is 22 (g
A 125 μm thick white polyester sheet having a thickness of 25 μ / m ² , 24 hr) was used. (Preparation of front image support) A first image receiving layer forming coating liquid, a second image receiving layer forming coating liquid and a third image receiving layer forming coating liquid having the following composition on the surface of the front substrate 125 μm subjected to corona discharge treatment. Are applied in this order and dried to obtain thicknesses of 0.2 μm and 2.5
An image receiving layer was formed by laminating so that the thickness was 0.5 μm and 0.5 μm. <Coating liquid for forming first image-receiving layer> Polyvinyl butyral resin 9 parts [Sekisui Chemical Co., Ltd .: S-REC BL 1] Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX] Methyl ethyl ketone 80 parts Butyl acetate 10 Part <Coating liquid for forming second image-receiving layer> Polyvinyl butyral resin 6 parts [Sekisui Chemical Co., Ltd .: S-REC BX 1] Metal ion-containing compound (compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Third part Coating liquid for forming image-receiving layer> Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitec E1000] Urethane-modified ethylene acrylic acid copolymer 8 parts [Toho Chemical Industry Co., Ltd .: Hitec S6254] Methylcellulose [Shin-Etsu Chemical] Industry Co., Ltd .: SM15] 0.1 part water 90 parts (format printing) Logo and O by resin letterpress printing method
P varnish was printed sequentially. (Preparation of Back Support) (Preparation of Writing Layer) On the surface of the back support 125 μm subjected to corona discharge treatment, a coating liquid for forming a first writing layer, a coating liquid for forming a second writing layer, and a third composition having the following composition Coating solutions for writing layer formation were applied and dried in this order to give respective thicknesses of 5 μm, 15 μm,
A writing layer was formed by laminating so as to have a thickness of 0.2 μm. <Coating liquid for forming the first writing layer> Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Japan Polyurethane Industry Co., Ltd .: Coronate HX] Carbon black Trace amount of titanium dioxide particles [Ishihara Sangyo] Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer> Polyester resin 4 parts [Toyobo Co., Ltd .: Vylonal MD1200] Silica 5 parts Titanium dioxide particles [Ishihara] Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Third writing layer forming coating liquid> Polyamide resin [Sanwa Chemical Industry Co., Ltd .: Sunmide 55] 5 parts Methanol 95 parts Obtained writing layer The center line average roughness was 1.34 μm. (Creation of IC Card Sheet) FIG. 12 shows an example of an IC card manufacturing apparatus. The IC card manufacturing apparatus 109 is provided with a delivery shaft 110 for delivering the second sheet material 101, and the second sheet material 101 delivered from the delivery shaft 110 is stretched over a guide roller 111 and a drive roller 112. Supplied. A precoater coater 113 is provided between the delivery shaft 110 and the guide roller 111.
Are arranged. The applicator coater 113 coats the adhesive layer 102a on the sheet with a predetermined thickness.

Further, in the IC card manufacturing apparatus 109,
A delivery shaft 114 for delivering the first sheet material 104 is provided, and the first sheet material 104 delivered from the delivery shaft 114 is supplied while being stretched over a guide roller 115 and a drive roller 116. Delivery shaft 114 and guide roller 11
An applicator coater 117 is arranged between the five. The applicator coater 117 has an adhesive layer 102.
b is applied to a sheet with a predetermined thickness.

Second sheet material 101 coated with an adhesive
Then, the first sheet material 104 comes into contact with the first sheet material 104 while being separated from the first sheet material 104, and is conveyed along the conveyance path 118. An IC module 103 is inserted at a position where the second sheet material 101 and the first sheet material 104 face each other with a space therebetween.

The IC module 103 is supplied as a single body or as a plurality of sheets or rolls. The second sheet material 101 is provided in the conveyance path 118 of the IC card manufacturing apparatus 109.
Then, the heating laminating unit 119 and the cutting unit 120 are arranged along the conveyance direction of the first sheet material 104. The heating laminate is preferably a vacuum heating laminate.
In addition, a protective film supply unit may be provided in front of the heating laminating unit 119, and it is preferable that the protective film supply units are arranged so as to face each other above and below the transport path 118. The heating laminating unit 119 includes a flat heating laminating upper die 121 and a heating laminating lower die 122 which are arranged to face each other above and below the transport path 118. The heat-laminating upper mold 121 and the lower mold 122 are provided so as to be movable in the directions in which they approach and separate from each other. After passing through the heating laminating section 119, the sheet material is cut into a predetermined size at the cutting section. (Preparation of IC Card Sheet 1) Using the card manufacturing apparatus shown in FIG. 12, a front support and a back support having an image receiving layer were used as the first support and the second support.

Adhesive 1 was applied to a front support having an image receiving layer using a T-die to a thickness of 80 μm, and adhesive 1 was applied to the back support using a T-die to a thickness of 380 μm. Then, the IC module 1 having the structure shown in FIG. 2 is placed on the front support with the adhesive so that the circuit surface is on the back support side as shown in FIG. 11 and sandwiched between the upper and lower sheets. It was produced by laminating at 70 ° C. for 1 minute. The thickness of the IC card sheet thus produced was 760 μm. After the production, it was stored for 7 days in an environment of 25 ° C and 50% RH. (Punching) The IC card sheet thus prepared was punched by the following IC card punching die device.

FIG. 13 is an overall schematic perspective view of the punching die device, and FIG. 14 is a front end view of the main part of the punching die device. This punching die device has a punching die having an upper blade 210 and a lower blade 220. Then, the upper blade 210 includes a punching punch 211 in which a clearance 241 is provided inside the outer extension, and the lower blade 220 has a punching die 221. By lowering the punching punch 211 into a die hole 222 provided in the center of the punching die 221, an IC card of the same size as the die hole 222 is punched out. For this reason, the size of the punch 211 for punching is slightly smaller than the size of the die hole 222. (Method of Writing Personal Information on Personal Authentication Card and Surface Protecting Method) A personal authentication card having a face image, attribute information, and format printing was prepared on the punched IC card as follows. (Preparation of sublimation-type thermal transfer recording ink sheet) A 6 μm-thick polyethylene terephthalate sheet having a back surface processed to prevent fusion is coated with a yellow ink layer-forming coating solution, a magenta ink layer-forming coating solution, and cyan. The ink layer forming coating liquid was provided so that each thickness was 1 μm, and three color ink sheets of yellow, magenta and cyan were obtained. <Coating liquid for forming yellow ink layer> Yellow dye (Compound Y 1) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY 24] manufactured by Denki Kagaku Kogyo Co., Ltd. Polymethyl methacrylate modified polystyrene 1 part [Toagosei] Chemical Industry Co., Ltd .: Rededa GP 200] Urethane modified silicone oil 0.5 parts [Dainichi Seika Chemicals Co., Ltd .: Dialomer SP 2105] Methyl ethyl ketone 70 parts Toluene 20 parts <Magenta ink layer forming coating liquid> Magenta Dye (Compound M 1) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY 24] manufactured by Denki Kagaku Kogyo KK Polymethyl methacrylate modified polystyrene 2 parts [Toagosei Kagaku Kogyo: Rededa GP 200] 0.5 parts of urethane modified silicone oil [manufactured by Dainichiseika Kogyo KK: Ialomer SP 2105] Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution> Cyan dye (compound C 1) 1.5 parts Cyan dye (compound C 2) 1.5 parts Polyvinyl acetal 5.6 parts [Electricity Chemical Industry Co., Ltd .: Denka Butyral KY 24] Polymethylmethacrylate-modified polystyrene 1 part [Toagosei Chemical Industry Co., Ltd .: Rededa GP 200] Urethane-modified silicone oil 0.5 part [Dainichi Seika Kogyo Co., Ltd.] Manufactured by: Dialomer SP 2105] Methyl ethyl ketone 70 parts Toluene 20 parts (preparation of ink sheet for melt-type thermal transfer recording) Polyethylene terephthalate sheet having a thickness of 6 μm and processed to prevent fusion on the back side, and a coating liquid for forming an ink layer having the following composition Was applied and dried to a thickness of 2 μm to obtain an ink sheet. <Ink layer forming coating solution> Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemical Co., Ltd .: EV40Y] Carbon black 3 parts Phenolic resin [Arakawa Chemical Industry Co., Ltd .: Tamanor 521] 5 parts 90 parts of methyl ethyl ketone (formation of face image) The image receiving layer and the ink side of a sublimation type thermal transfer recording ink sheet are superposed on each other and output from the ink sheet side using a thermal head 0.23 W / dot, pulse width 0.3 to 4 By heating under a condition of a dot density of 16 dots / mm for 0.5 msec, a human image having gradation is formed on the image receiving layer. In this image, the dye and nickel in the image receiving layer form a complex. (Formation of character information) The OP varnish portion and the ink side of the ink sheet for melt-type thermal transfer recording are superposed and output from the ink sheet side using a thermal head 0.5 W / dot, pulse width 1.0 msec, dot density Character information was formed on the OP varnish by heating under the condition of 16 dots / mm.

Next, the formation of the surface protective layer will be described. (Preparation of actinic ray curable transfer foil) Preparation of actinic ray curable transfer foil by laminating the following composition on the release layer of a polyethylene terephthalate film having a thickness of 25 μm provided with a release layer of 0.1 μm fluororesin layer I went. (Actinic ray curable compound) Shin Nakamura Chemical Co., Ltd. A 9300 / Shin Nakamura Chemical Co., Ltd. EA 1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Others Additive of Dainippon Ink Surfactant F179 0.25 part <Intermediate layer forming coating liquid> Film thickness 1.0 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX 1] 3.5 parts Tuftex M 1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts Curing of the curing agent after coating was carried out at 50 ° C. for 24 hours. <Adhesive layer forming coating solution> Film thickness 0.5 μm Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitech S6254B] 8 parts Polyacrylic ester copolymer [Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Further, using the actinic radiation curable transfer foil 1 having the above-mentioned structure on the image receptor on which images and characters are recorded, a surface temperature of 20
Transfer was performed by applying heat for 1.2 seconds at a pressure of 150 kg / cm ² using a heat roller heated to 0 ° C. and having a rubber hardness of 85 and a diameter of 5 cm.

The produced IC card was applied with a steel ball having a tip diameter R of 1 mm for a load of 1 kg on the steel plate 500 times for each of the circuit surface and the non-circuit surface of the IC chip, and the IC card was not destroyed, and the face image was not blurred. It was The writing layer was strongly printed with a ballpoint pen, but did not break. R = 30m in the long side direction
After bending 1000 times at m, the IC worked without peeling. Example 2 The same as Example 1 except that the IC module was changed to IC module 2. With a steel ball having a tip diameter R of 1 mm, a load of 1 kg was applied 500 times on each of the circuit surface and the non-circuit surface of the IC chip on the steel plate, the steel plate was not destroyed, and the face image was not printed. The writing layer was strongly printed with a ballpoint pen, but did not break. After bending 1000 times in the long side direction at R = 30 mm, the IC operated without peeling. <Example 3> The same procedure as in Example 1 was carried out except that the IC module was replaced with the IC module 3. With a steel ball having a tip diameter R of 1 mm, a load of 1 kg was applied 500 times on each of the circuit surface and the non-circuit surface of the IC chip on the steel plate, the steel plate was not destroyed, and the face image was not printed. The writing layer was strongly printed with a ballpoint pen, but did not break. After bending 1000 times in the long side direction at R = 30 mm, the IC operated without peeling. <Example 4> The same procedure as in Example 1 was carried out except that the IC module was changed to IC module 4. With a steel ball having a tip diameter R of 1 mm, a load of 1 kg was applied 500 times on each of the circuit surface and the non-circuit surface of the IC chip on the steel plate, the steel plate was not destroyed, and the face image was not printed. The writing layer was strongly printed with a ballpoint pen, but did not break. After bending 1000 times in the long side direction at R = 30 mm, the IC operated without peeling. <Example 5> Adhesive 1 is applied to each of the front and back supports using a T-die so that the thickness is 80 μm and 360 μ, and the IC module is made into the IC module 5, and the circuit surface side The same procedure as in Example 1 was carried out except that the above was placed on the front support side. With a steel ball having a tip diameter R of 1 mm, a load of 1 kg was applied 500 times on each of the circuit surface and the non-circuit surface of the IC chip on the steel plate, the steel plate was not destroyed, and the face image was not printed.
The writing layer was strongly printed with a ballpoint pen, but did not break. After bending 1000 times in the long side direction with R = 30 mm,
The IC worked without peeling. <Comparative Example> Adhesive 1 was applied to each of the front support and the back support using a T-die to a thickness of 230 μm, and the space between the upper and lower sheets with the adhesive is shown in FIG. I
The same procedure as in Example 1 was carried out except that the C module was put in and bonded at 70 ° C. and pressure-laminated. Tip diameter R =
1mm load with 1mm steel ball is applied 500 times to the circuit surface and non-circuit surface of the IC chip, and the number of pushes from the non-circuit surface is 3
It didn't work at 00 times. The facial image print also had blurring around the chip. The writing layer was strongly printed with a ball-point pen and stopped working. After bending 1000 times so that R = 30 mm in the long side direction, wrinkles were generated from the peeling end portion and peeling occurred.

[0127]

As described above, according to the first aspect of the present invention, the first reinforcing plate and the second reinforcing plate are provided on the IC chip with the adhesive layer interposed therebetween.
By providing the reinforcing plate adjacent to this in this order, the strength of the IC card can be improved and the IC chip can be protected by the structure of the reinforcing plate, and the surface of the thin IC card can be smoothed and uneven unevenness can be suppressed. As a result, there is no recording unevenness, and the stress due to bending and point pressure strength load is destroyed by the second reinforcing plate first, so that the stress is efficiently dispersed, the IC chip is protected, and the durability is improved.

According to the second aspect of the invention, the first reinforcing plate and the second reinforcing plate can efficiently disperse stress with a simple structure, and can improve the resistance against bending and point pressure load.

According to the third aspect of the present invention, the first reinforcing plate and the second reinforcing plate protect the IC chip and have excellent resistance to bending and point pressure strength load. Since the area is smaller than the area of the second reinforcing plate, unevenness is eliminated, the surface can be smoothed even with a thin IC card, and unevenness is suppressed and uneven recording is eliminated.

According to the invention described in claim 4, the stress relaxation layer can disperse stress due to bending and point pressure strength to improve resistance, and the surface of a thin IC card can be smoothed, resulting in unevenness. The occurrence of unevenness is suppressed and recording unevenness is eliminated.

According to the fifth aspect of the present invention, the stress is relaxed by the simple structure of the fibrous sheet, so that the surface of a thin IC card having an IC chip can be smoothed and uneven unevenness can be suppressed. Recording unevenness disappears.

According to the sixth aspect of the present invention, the shape memory alloy is flattened, and is deformed into a concave shape toward the IC chip by heating at the time of contact with the IC chip or after the contact, so that the IC card has a reinforcing plate structure. In order to improve the strength of the IC card and protect the IC chip, the surface of the IC card can be smoothed even with a thin IC card, and uneven unevenness can be suppressed to eliminate uneven recording.

According to the seventh aspect of the present invention, the thin IC is formed by deforming the Ni—Ti alloy into a concave shape on the IC chip side.
Even with a card, the surface can be smoothed and uneven unevenness is suppressed to eliminate uneven recording.

According to the invention described in claim 8, I
It can be deformed into a concave shape on the C-chip side.

According to the ninth aspect of the present invention, the distance d1 between the first reinforcing plate and the IC chip is made larger than the distance d2 between the second reinforcing plate and the IC chip, so that the circuit due to bending or point pressure strength load is applied. The deformation of the surface is reduced, the strength of the IC card is improved, the circuit side of the IC chip is more reliably protected, the surface can be smoothed even with a thin IC card, uneven unevenness is suppressed, and recording unevenness is eliminated.

In the tenth aspect of the present invention, the strength of the IC card is improved and the IC chip is protected by the layer structure, and the surface can be smoothed even with a thin IC card, and uneven unevenness is suppressed to prevent uneven recording. It also has excellent resistance to bending and point pressure strength loads.

According to the eleventh aspect of the present invention, by mounting and integrating the IC module, the circuit surface of the IC chip can be protected more reliably and with a simple structure.

According to the twelfth aspect of the invention, the personal identification information including the name and face image is stored, and the identification card (ID
Used for credit cards and credit cards.

According to the thirteenth aspect of the invention, the invention has a writing layer capable of writing and is used for an identification card (ID card), a credit card and the like.

In the fourteenth aspect of the present invention, the adhesive is a reactive hot melt adhesive, has excellent durability and is suitable for processing at low temperatures.

In the fifteenth aspect of the present invention, the strength of the IC card is improved and the IC chip is protected by the layer structure, and the surface can be smoothed even with a thin IC card, and uneven unevenness is suppressed to prevent uneven recording. It also has excellent resistance to bending and point pressure strength loads.

According to the sixteenth aspect of the present invention, personal identification information including a name and a face image can be recorded, and moreover, it can be written on the writing layer, and is used for an identification card (ID card) or a credit card.

According to the seventeenth aspect of the present invention, the adhesive is a reactive hot melt adhesive, has excellent durability, and is suitable for processing at low temperatures.

[Brief description of drawings]

FIG. 1 is a diagram showing a layer structure of an IC card according to a first embodiment.

FIG. 2 is a diagram showing a configuration of a reinforcing plate.

FIG. 3 is a diagram showing a layer structure of an IC card according to a second embodiment.

FIG. 4 is a diagram showing a configuration of a reinforcing plate.

FIG. 5 is a diagram showing a layer structure of an IC card according to a fifth embodiment.

FIG. 6 is a diagram showing a configuration of a reinforcing plate.

FIG. 7 is a diagram showing a layer structure of an IC card according to a sixth embodiment.

FIG. 8 is a diagram showing a configuration of a reinforcing plate.

FIG. 9 is a diagram showing a layer structure of an IC card according to a seventh embodiment.

FIG. 10 is a diagram showing a configuration of a reinforcing plate.

FIG. 11 is an embodiment showing an example of a laminated structure of an IC card and an individual authentication card.

FIG. 12 is a diagram showing an example showing an example of an IC card manufacturing apparatus.

FIG. 13 is an overall schematic perspective view of a punching die device.

FIG. 14 is a front end view of the main part of the punching die device.

FIG. 15 is a diagram showing a configuration of a conventional reinforcing plate.

[Explanation of symbols]

1 first support 2 Second support 3 IC module 3a IC chip 3b antenna 4,5 adhesive 6 Image receiving layer 10,11 Adhesion layer 20 First reinforcement plate 21 Second reinforcing plate

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2C005 MA10 MA14 MA19 MB01 MB08                       PA03 PA18 PA21 PA22 PA25                       RA04 RA09 RA10 RA16 RA18                 5B035 AA08 BA03 BA05 BB09 CA01                       CA03 CA06 CA23

Claims (17)

[Claims] 1. An IC card having an image receiving layer on at least one surface, and a component including an IC module consisting of an IC chip and an antenna is provided at a predetermined position between two opposing supports with an adhesive interposed. The IC chip is provided with a first reinforcing plate and a second reinforcing plate adjacent to each other in this order at least via an adhesive layer, and the adhesive strength between the IC chip and the first reinforcing plate is:
An IC card, which is larger in adhesion strength between the first reinforcing plate and the second reinforcing plate. 2. The IC card according to claim 1, wherein a bonding point between the first reinforcing plate and the second reinforcing plate is a part of a reinforcing plate area. 3. The area of the first reinforcing plate and the area of the second reinforcing plate are both larger than the area of the IC chip, and the area of the first reinforcing plate is the second reinforcing plate. 3. The IC card according to claim 1, wherein the IC card has a smaller area. 4. An IC card having an image receiving layer on at least one surface, and a component including an IC module consisting of an IC chip and an antenna is provided at a predetermined position between two opposing supports with an adhesive interposed. An IC card having the first reinforcing plate on the IC chip with at least an adhesive layer interposed therebetween, and further comprising a stress relaxation layer and a second reinforcing plate. 5. The IC card according to claim 4, wherein the stress relaxation layer is a fibrous sheet. 6. An IC card having an image receiving layer on at least one surface, and a component including an IC module consisting of an IC chip and an antenna is provided at a predetermined position between two opposing supports with an adhesive interposed. A reinforcing plate made of a shape memory alloy is provided adjacent to the IC chip, and the reinforcing plate is formed by flattening a shape memory alloy that stores a shape having a curvature in advance. An IC card characterized by being deformed into a concave shape on the IC chip side by heating after adhesion. 7. The IC card according to claim 6, wherein the shape memory alloy is a Ni—Ti alloy. 8. The heating temperature for heating after the adhesion is 100.
7. The IC card according to claim 6, wherein the temperature is not lower than ° C. 9. An IC card having an image receiving layer on at least one surface, and a component including an IC module consisting of an IC chip and an antenna is provided at a predetermined position between two opposing supports with an adhesive interposed. A first reinforcing plate on the circuit side of the IC chip with at least an adhesive layer interposed therebetween, and a second reinforcing plate on the opposite side of the IC chip with at least an adhesive layer interposed therebetween, The distance d1 between the reinforcing plate and the IC chip and the distance d2 between the second reinforcing plate and the IC chip are d2 <d1.
An IC card characterized by: 10. An IC card having an image receiving layer on at least one surface, and a component including an IC module consisting of an IC chip and an antenna is provided at a predetermined position between two opposing supports with an adhesive interposed. , An adhesive having a thickness D1 and an IC module are provided in this order on the first support side, and an adhesive having a thickness D2 is provided on the second support side.
An IC card, which is laminated so that D1 <D2, and is bonded so that the IC module is partially embedded in the adhesive of the second support. 11. An image receiving layer is provided on the side of the first support, and an IC module is placed and integrated on the side of the second support so as to be the circuit surface of the IC chip. Item 10 is an IC card. 12. The image receiving layer has personal identification information including at least a name and a face image.
The IC card according to claim 11. 13. The IC card according to any one of claims 1 to 12, which has a writing layer capable of writing on a part thereof. 14. The IC card according to claim 1, wherein the adhesive is a reactive hot melt adhesive. 15. An image receiving layer is provided on at least one side, personal identification information is provided on the image receiving layer, and a component including an IC module consisting of an IC chip and an antenna is bonded at a predetermined position between two opposing supports. In a method of manufacturing an IC card in which an agent is provided, a first support is provided with an adhesive having a thickness D1, the IC module is placed on the adhesive, and then a second support is provided with a thickness D2. A method for manufacturing an IC card, comprising laminating and bonding an adhesive so that D1 <D2. 16. The image-receiving layer is provided on the first support,
The method of manufacturing an IC card according to claim 15, wherein a writable writing layer is provided on at least a part of the second support. 17. The method of manufacturing an IC card according to claim 15, wherein the adhesive is a reactive hot melt adhesive.