JP2006178549A - Ic card manufacturing method, ic card manufacturing apparatus and ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To attain cost reduction, high cutting performance, punching burr prevention, print fading prevention, character blurring prevention and character fading prevention. <P>SOLUTION: At least one of the shape or physical properties of an adhered card base material is measured and recorded, and a punching machine is adjusted by using recording data, and the card base material is punched like a card by the adjusted punching machine. The card base materials are accumulated and stored by an accumulating part, and at least one of the shape or physical properties of the accumulated and stored card base material is measured and recorded, and the punching machine is adjusted by using the recording data, and the card base material is punched like a card by the adjusted punching machine. At least one of the shape or physical properties of the punched IC card is measured and recorded, and the card printing machine is adjusted by using the recording data, and the printing of the IC card is operated by the adjusted card printing machine. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC card manufacturing method, an IC card manufacturing apparatus, and an IC card that are suitable for application to an IC card that stores personal information and the like that require safety (security) such as forgery and alteration prevention.

  Conventionally, for an IC card, for example, an inlet having a circuit board on which an IC chip and an antenna are mounted is inserted between two sheets of material, and a moisture curable adhesive, a UV curable adhesive, a two-component mixed adhesive, or the like is bonded. The card base material bonded together using an agent is stamped into a card shape after curing. Or it is common to heat-press using the sheet | seat material in which thermocompression bonding is possible, and to produce by punching in the shape of a card | curd.

  The IC card thus produced is generally used after character information and image information are given to the card surface and a protective layer is provided. However, since the produced IC card has a film thickness distribution or waviness on the card base material bonded together, strictly speaking, each IC card has a different thickness state.

As a control means such as position detection at the time of punching and defect detection, for example, Patent Document 1 proposes an apparatus that deletes a position of a defect position from defect position information. Further, for example, in Patent Document 2, there is a technique that suppresses variation in the cutting position and suppresses variation in each IC card at a position where a common image is recorded. Furthermore, for example, Patent Document 3 proposes a white polyester film having a surface roughness (centerline average roughness, Ra) of 5 to 50 nm.
JP 2001-189013 A (page 1 to page 10, FIGS. 1 to 9) Japanese Patent Application Laid-Open No. 11-139050 (first page to page 14, FIGS. 1 to 10) JP 9-295390 A (pages 1 to 6)

  Thus, control means such as position detection at the time of punching, defect detection, etc. have been proposed, but there is no proposal that stipulates the adjustment of the punching means and the adjustment of the printing method from the shape of the card substrate, and it is particularly produced. If the IC card has a different thickness, there are problems that the cutting property is likely to be partially changed by punching, the adhesive sticks out, burrs are generated at the corners of the card, and the punching position is easily shifted.

  For example, since adjustment is performed by actually punching out a real card after adjustment is performed with an IC card for adjustment, loss of the IC card is inevitably generated. On the other hand, in the printing of the back and front surfaces of the IC card after forming the card, if the IC card is not flat, a conveyance failure occurs, and the pressing force on the thin part of the IC card is insufficient, so that printing is not performed and flatness does not appear. In addition, there are problems such as partially crushed characters, sticking of dust generated due to defective punching, and print shading. Even if an expensive IC card is laminated, stamping and printing 2 There has been a serious problem that the product has been removed as a defective product over time, leading to a further increase in production cost as a defective product, and an effective solution has been strongly desired. Therefore, there has been a need for a method for producing an IC card with a constant cutting property regardless of the shape of the produced card base.

  The present invention has been made in view of the above points, and is an IC card manufacturing method, an IC card manufacturing apparatus, and an IC card that are low cost, capable of cutting, preventing punching burrs, preventing printing blurring, preventing character crushing, and preventing character blurring. The purpose is to provide.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

According to the first aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In a multi-layer IC card manufacturing method in which a card base material is manufactured by pasting together, and an IC card is manufactured by punching the card base material into a card shape.
Measure and record at least one of the shape or physical property value of the bonded card substrate,
Adjust the punching machine using the recorded data,
An IC card manufacturing method, wherein a card substrate is punched into a card shape by the adjusted punching machine.

According to a second aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In a multi-layer IC card manufacturing method in which a card base material is manufactured by pasting together, and an IC card is manufactured by punching the card base material into a card shape.
The card substrate is accumulated and stored in the accumulation unit,
Measure and record at least one of the shape or physical property value of the card base material accumulated and stored,
Adjust the punching machine using the recorded data,
An IC card manufacturing method, wherein a card substrate is punched into a card shape by the adjusted punching machine.

According to a third aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In a multi-layer IC card manufacturing method in which a card base material is manufactured by pasting together, and an IC card is manufactured by punching the card base material into a card shape.
Measure and record at least one of the shape or physical property value of the punched IC card,
Adjust the card printer using the recorded data,
An IC card manufacturing method comprising printing on an IC card by the adjusted card printer.

  According to a fourth aspect of the present invention, in the IC according to any one of the first to third aspects, the recorded data includes at least one measurement value of thickness, warpage amount, and flatness. This is a card manufacturing method.

  According to a fifth aspect of the present invention, in the recording apparatus according to any one of the first to third aspects, the recording data includes at least one physical property value of elastic modulus, breaking elongation, and orientation angle. This is an IC card manufacturing method.

  The invention according to claim 6 is characterized in that, before the card base material is punched into a card shape, the bonded card base material is cut into a sheet-like sheet shape. 2. An IC card manufacturing method according to item 1.

  The invention according to claim 7 is characterized in that before the card base material is punched into a card shape, format printing is performed on the bonded card base material. It is an IC card manufacturing method of description.

In an eighth aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In a multi-layer IC card production apparatus that produces a card base by laminating the card base and punching the card base into a card shape,
Bonded card substrate measurement recording means for measuring and recording at least one of the shape or physical property value of the bonded card substrate,
An IC card manufacturing apparatus comprising: adjusting means for adjusting a punching machine for punching into a card shape using the recording data.

According to the ninth aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In a multi-layer IC card production apparatus that produces a card base by laminating the card base and punching the card base into a card shape,
An accumulating unit for accumulating and storing the card substrate;
An accumulated and stored card base material measurement recording means for measuring and recording at least one of the shape or physical property value of the card base material accumulated and stored in the accumulation unit,
An IC card manufacturing apparatus comprising: adjusting means for adjusting a punching machine for punching into a card shape using the recording data.

In the tenth aspect of the present invention, an adhesive layer is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In a multi-layered IC card manufacturing apparatus that manufactures an IC card by punching the card base into a card shape, at least one of the shape or physical property value of the punched IC card Punching IC card measurement recording means for measuring and recording one;
An IC card manufacturing apparatus comprising adjustment means for adjusting a card printer that prints on an IC card using the recording data.

  According to an eleventh aspect of the present invention, in the IC according to any one of the eighth to tenth aspects, the recorded data includes at least one measurement value of thickness, warpage amount, and flatness. This is a card manufacturing apparatus.

  The invention according to claim 12 is characterized in that the recorded data includes at least one physical property value of elastic modulus, breaking elongation, and orientation angle. IC card manufacturing apparatus.

  The invention according to claim 13 has a cutting machine for cutting the bonded card base material into a sheet-like sheet shape before punching out the card base material into a card shape. The IC card manufacturing apparatus according to any one of 12 above.

  The invention according to claim 14 has a card printing machine that performs format printing on the card base material bonded before punching out the card base material into a card shape. The IC card manufacturing apparatus according to any one of the above items.

The invention according to claim 15 is to produce an IC card using any one of claims 1 to 14,
Having an image receiving layer on at least one side of the IC card;
Provide personal identification information including name, face image by thermal transfer method or inkjet method,
The IC card is characterized in that a writing layer capable of writing is provided on at least a part of the IC card.

The invention according to claim 16 is provided with a transparent protective layer on an upper surface provided with personal identification information including the name and face image,
16. The IC card according to claim 15, wherein the transparent protective layer is made of an actinic ray curable resin.

  The invention according to claim 17 is the IC card according to claim 15 or 16, wherein the IC chip of the IC card is arranged at a position other than the position overlapping the face image portion.

  The invention according to claim 18 is the IC card according to any one of claims 15 to 17, wherein the IC card is a non-contact type.

  The invention according to claim 19 is the IC card according to any one of claims 15 to 18, characterized in that planar unevenness of a chip peripheral portion of the IC card is within ± 10 μm. .

  With the above configuration, the present invention has the following effects.

  According to the invention described in claim 1 and claim 8, at least one of the shape or physical property value of the bonded card base is measured and recorded, and the punching machine is adjusted using the recorded data. By punching the card base material into a card shape with the punching machine, it is possible to reduce the cutting property partially changing and the adhesive that has hardened from the cutting surface to protrude into the beard shape. In addition, it prevents the card base presser from being lowered and prevents the occurrence of burrs at the corners of the IC card. Also, the card base is pressed flat so that the punching position does not shift and the punching defect is eliminated. It can prevent adhesion of dust and printing blur.

  According to invention of Claim 2 and Claim 9, a card base material is accumulated and stored in the accumulation part, and at least one of the shape or physical property value of the card base material accumulated and stored is measured and recorded. Then, the punching machine is adjusted using the recorded data, and the card base material is punched into a card shape with the adjusted punching machine, so that the cutting property is partially changed, and the adhesive cured from the cutting surface becomes a bearded shape. It is possible to reduce the protrusion. In addition, it prevents the card base presser from being lowered and prevents the occurrence of burrs at the corners of the IC card. Also, the card base is pressed flat so that the punching position does not shift and the punching defect is eliminated. It can prevent adhesion of dust and printing blur.

  According to the invention described in claim 3 and claim 10, at least one of the shape or physical property value of the punched IC card is measured and recorded, and the card printer is adjusted using the recorded data. By printing on an IC card with a card printer, for example, if the IC card is not flat, it is pressed and transported so that it is flat, and the thin part of the IC card is printed with a large pressing pressure. This eliminates punching defects that cause thick characters to be crushed, and prevents the occurrence of dust adhering and printing blurring.

  According to the fourth and eleventh aspects of the present invention, the recorded data includes at least one measurement value of the thickness, the warpage amount, and the flatness, and the first, second, eighth, and ninth aspects. In this case, it is possible to reduce the cost, the cutting property, and the punching burrs. According to the third and tenth aspects, it is possible to prevent printing blur, character collapse, and character blur.

  According to the fifth and twelfth aspects of the present invention, the recorded data includes at least one physical property value of an elastic modulus, a breaking elongation, and an orientation angle, and includes the first, second, eighth and eighth aspects. Item 9 can reduce the cost, cutability, and prevent punching burrs. Claims 3 and 10 can prevent printing blurring, character collapse, and character blurring.

  According to the invention described in claim 6 and claim 13, before the card base material is punched into a card shape, it is easy to handle by cutting the bonded card base material into a single sheet. The punching accuracy is improved.

  According to the invention of claim 7 and claim 14, before the card base material is punched into a card shape, it is easy to handle and the accuracy of the format printing by applying the format print to the card base material bonded together. Will improve.

  According to the invention of claim 15, an IC card is manufactured using any one of claims 1 to 14, and the image receiving layer is provided on at least one surface of the IC card, and the thermal transfer system or the ink jet system is used. By providing personal identification information including name and face image, and providing a writing layer that can be written on at least part of the IC card, licenses, identification card, passport, alien registration card, library card, cash card , Credit cards, employee ID cards, employee ID cards, membership ID cards, medical cards and student ID cards.

  According to the sixteenth aspect of the present invention, personal identification information including name and face image is protected by the transparent protective layer, and durability is improved.

  According to the seventeenth aspect of the present invention, the IC chip is disposed at a position other than the position overlapping the face image portion, and the IC chip does not exist at the position overlapping the face image portion, thereby improving the surface smoothness and printing. Improves.

  According to the invention described in claim 18, since the IC card is a non-contact type and excellent in safety, it can be used for applications requiring high confidentiality of data and prevention of forgery and alteration.

  According to the nineteenth aspect of the present invention, since the surface irregularity of the IC card chip peripheral portion is within ± 10 μm, the surface smoothness is improved and the printability is improved.

  Hereinafter, an IC card manufacturing method, an IC card manufacturing apparatus, and an IC card according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

  FIG. 1 is a schematic configuration diagram of an IC card manufacturing process. In this IC card manufacturing process, a long sheet-shaped first sheet material (back sheet) 1 is arranged in the first sheet material supply section A, and a sheet-like second sheet material (front sheet) 2 is formed. The second sheet material supply unit B is provided. An adhesive is supplied to the second sheet material 2 from the adhesive supply unit C <b> 1 and applied to the second sheet material 2. The sheet is conveyed to the inlet supply unit E by the second sheet material conveyance unit D. The second sheet material conveying portion D is composed of a conveying roller d1 and a conveying belt d2, and the conveying belt d2 is supported by the platen roller c1 in the adhesive supply portion C1.

  In the inlet supply portion E, an inlet 3 of components including an IC chip and an IC module having an antenna is supplied and placed at a predetermined position of the second sheet material 2, and the second sheet material 2 is moved to the back roller portion F. Send to. The first sheet material 1 is supplied with an adhesive from the adhesive supply unit C <b> 2, coated, and sent to the back roller unit F.

  The back roller part F has a temperature-adjustable laminating roller f, and the first sheet material 1 and the second sheet material 2 are bonded together using the laminating roller f. The temperature difference between the laminating roller f and the rollers f1, f2 is 0 ° C. or higher and 100 ° C. or lower. In this embodiment, the second sheet material 2 has an image receiving layer, the first sheet material 1 has a writing layer, and the rollers f1 and f2 have a roller temperature on the image receiving layer side of the writing layer side. The temperature is lower than the temperature of the roller.

  A card base material transport unit G is disposed at the rear stage of the back roller unit F, and the card base material transport unit G includes transport belts g1 and g2 facing each other and transport rollers g3 and g4. A sheet substrate on which the first sheet material 1 and the second sheet material 2 are bonded is sandwiched between the conveying belts g1 and g2 facing each other in the card substrate conveying section G. Send to cutting section H.

  In the cutting part H, the sheet base material of the bonded product is cut into a single sheet by a cutting machine h1. Thereafter, the sheet base material in sheet form is sent to the collection unit K.

  In the collection unit K, the flat plate k1 is disposed between the sheet-like sheet base materials and is sent to the storage unit L. As the flat plate k1, for example, a SUS plate is used.

  In the storage part L, it is stored at a predetermined temperature for a predetermined time and sent to the punching part N.

  In the punching portion N, punching is performed in a card shape by a punching machine n1. The punched IC card is printed by the printing unit O using the back surface format printing or the ink jet printing card printing machine o1 and sent to the loading unit P.

  In the loading section P, the cartridge is loaded in the magazine p1 and sealed with the cover p2.

  In this embodiment, before punching into a card shape, the sheet base material of the bonded product is cut into a sheet-like sheet shape at the cutting portion H, so that handling is easy and punching accuracy is improved. Further, by performing format printing before punching into a card shape, handling is easy and the accuracy of format printing is improved.

  Further, an adhesive is interposed between the first sheet material 1 and the second sheet material 2, and an inlet 3 having an IC chip on the inlet base material is enclosed in the adhesive layer, thereby providing a card base material. An IC card is created by punching the card base material into a card shape. The card base material creation process is performed in the clean room 501, the card base material storage process is performed in the clean room 502, the format printing, the card base material punching process and the punched IC card cartridge loading process are performed in the clean room 503. Are created in an environment of class 100,000 or less. In this way, by creating an IC card in an environment of class 100,000 or less, it is possible to prevent dust and other dust from entering during the manufacture of the IC card, and scratches during punching, printing, card transportation, etc. And the occurrence of dirt can be suppressed, and the yield of non-defective cards is improved.

  The creation of this IC card includes the creation of a card base, storage of the card base, punching out of the card base, and loading of the punched IC card into a cartridge. However, at least one of these may be created in an environment of class 100,000 or less, and dust such as dust can be prevented from being mixed during the manufacture of the IC card. In particular, in order to prevent the attached dust from moving and scratching the card surface when handling IC cards such as punching and loading, the process from storage of the card base material to cartridge loading is class. It is preferable that it is 10,000 or less.

  An IC card manufactured using the IC card manufacturing method or IC card manufacturing apparatus of the present invention is shown in FIG. FIG. 2 is a cross-sectional view of an image forming body of an IC card bonded product.

  A card base material, which is an image forming body of an IC card bonded product, includes an electronic component 3 a having a predetermined thickness between a first sheet material 1 and a second sheet material 2. The electronic component 3a includes an antenna 3a1, an IC chip 3a2, and the like, and an IC module of the electronic component 3a is provided in the inlet 3. This is a laminated structure in which the inlet 3 is disposed between the first sheet material 1 and the second sheet material 2 and laminated with the adhesive layers 6 and 7 interposed therebetween. The IC chip 3a2 is covered with a reinforcing plate 3b, and the reinforcing plate 3b has a larger shape than the IC chip 3a2 and protects the IC chip 3a2.

  The first sheet material 1 or the second sheet material 2 has an image receiving layer 8a on at least one surface, in this embodiment, on one surface of the second sheet material 2, and the name and face by the thermal transfer method or the ink jet method. Personal identification information 8b including an image is provided. Further, a transparent protective layer 8c is provided on the upper surface on which personal identification information 8b including a name and a face image is provided by transfer of a transfer foil, and the transparent protective layer 8c is made of an actinic ray curable resin. By providing the transparent protective layer 8c on the upper surface on which the personal identification information 8b is provided, the personal identification information 8b is protected and durability is improved.

  In this embodiment, a writable writing layer 9 a is provided on one side of the first sheet material 1. Further, the IC chip 3a2 is disposed at a position other than the position overlapping the face image portion, and the IC chip 3a2 does not exist at the position overlapping the face image portion, thereby improving the surface smoothness and improving the printability. An IC card can be obtained.

  As described above, the IC card has an IC module, is a non-contact card, and is excellent in safety. Therefore, the IC card can be used for applications that require high confidentiality of data and anti-counterfeiting.

  The IC card manufactured in this way can suppress the occurrence of scratches and dirt on the IC card. In this embodiment, the number of dust mixed or adhering inside or outside of one card is 100. It is as follows, and it is possible to suppress the occurrence of scratches and dirt on the IC card, and the good card yield is improved.

  Also, by providing personal identification information including name and face image by thermal transfer method or ink jet method on at least one image receiving layer of IC card, and providing a writable writing layer at least in part, licenses and identification It can be preferably used for certificate, passport, alien registration card, library card, cash card, credit card, employee card, employee card, membership card, medical card and student card.

  Next, the configuration of the present invention will be described in detail.

[Feedback of recorded data]
In this invention, as shown in FIG. 1, the cutting part H is provided with a bonded card substrate measurement recording means S1 for measuring and recording at least one of the shape or physical property value of the bonded card substrate. . The recorded data includes at least one measured value of the thickness, warpage, and flatness of the card base material, and includes at least one physical property value of elastic modulus, elongation at break, and orientation angle. In S1, the recording data is transferred to the punching machine n1 and the card printing machine o1. As shown in FIG. 3, the orientation angle can be obtained from an orientation pattern obtained by measuring the card material sheet material with a polymer orientation meter.

  In addition, the storage unit L includes an accumulation unit 11 that accumulates and stores card base materials. The accumulating unit 11 includes an accumulatively stored card base material measurement recording unit S2 that measures and records at least one of the shape and physical property values of the card base material accumulated and stored. The recorded data includes at least one measured value of the thickness, warpage, and flatness of the card base material, and includes at least one physical property value of elastic modulus, elongation at break, and orientation angle. In S2, the recording data is transferred to the punching machine n1 and the card printing machine o1.

  Further, the punching portion N includes punching IC card measurement recording means S3 for measuring and recording at least one of the shape or physical property value of the punched IC card. The recorded data includes at least one measurement value of the thickness, warpage, and flatness of the IC card, and includes at least one physical property value of elastic modulus, elongation at break, and orientation angle. The recorded data is transferred to the card printer o1.

  The punching machine n1 has adjusting means n2. The adjusting means n2 adjusts the punching machine n1 that punches into a card shape using the recorded data. Measuring and recording at least one of the shape or physical property value of the bonded card base, adjusting the punching machine n1 using the recorded data, and punching the card base into a card shape by the adjusted punching machine n1 Thus, it can be reduced that the cutting property is partially changed and the adhesive cured from the cutting surface protrudes into a beard shape. In addition, it prevents the card base presser from being lowered and prevents the occurrence of burrs at the corners of the IC card. Also, the card base is pressed flat so that the punching position does not shift and the punching defect is eliminated. It can prevent adhesion of dust and printing blur.

  Further, the card base material is accumulated and stored in the accumulator l1, and at least one of the shape or physical property value of the card base material accumulated and stored is measured and recorded, and the punching machine n1 is adjusted using the recorded data. , And the card base material is punched into a card shape by the adjusted punching machine n1, so that the cutting property is partially changed, and the adhesive that has hardened from the cutting surface can be reduced from protruding into a beard shape. In addition, it prevents the card base presser from being lowered and prevents the occurrence of burrs at the corners of the IC card. Also, the card base is pressed flat so that the punching position does not shift and the punching defect is eliminated. It can prevent adhesion of dust and printing blur.

  The card printing machine o1 has an adjusting means o2. The adjusting means o2 adjusts the card printer o1 that prints on the IC card using the recording data. By measuring and recording at least one of the shape or physical property value of the punched IC card, adjusting the card printing machine o1 using the recorded data, and printing on the IC card by the adjusted card printing machine o1, For example, when an IC card is not flat, it is conveyed by pressing it flat, and the thin part of the IC card is printed with a large pressing pressure, eliminating the defective punching that partially collapses thick characters. It can prevent adhesion of dust and printing blur.

  This invention uses a sensor for the bonded card base, measures the thickness, undulation, and warp of the card base in advance, and optimizes the punching and printing methods based on these information during punching and printing. The purpose is to do.

  The deflection of the card base material at the time when the bonding is completed is measured, thereby adjusting the material and pressing force of the pressing plate (stripper) n3 of the punching machine n1, as shown in FIG. If it is previously determined that the card substrate is a concave card base, the presser plate (stripper) n3 is a flexible one having a small thickness, and when punching out the central part of the card base, the presser plate (stripper) It is possible to cope with the punching by increasing the force of n3 only at the central portion and eliminating the occurrence of burrs by eliminating the floating of the card base material.

  Further, by cutting out a part of the card base material that has been pasted and measuring the physical properties, a punching speed that matches the physical properties (for example, elastic modulus and elongation at break) can be employed.

  When printing the punched IC card, if the punched IC card thickness data is sent to the card printing machine o1 in advance, the printing pressure is optimum for the thickness of the IC card, or blanket for offset printing. Pressure, etc. can be adjusted, and loss cards can be eliminated. If it is known in advance that there is a large difference in thickness between the front, rear, left and right, it is possible to remove the IC card in advance or to change the inclination of the conveying portion in accordance with the IC card.

  Together, it is one of the objects of the present invention to eliminate loss in card production and increase production efficiency.

[Punching method]
In the present invention, a punching machine shown in FIG. 5 is used. FIG. 5 is a side view of the main part of the punching die apparatus.

  The punching die apparatus includes a punching die having an upper blade 110 and a lower blade 120, the upper blade 110 includes a punching punch 111, and the lower blade 120 has a punching die 121. An IC card having the same size as the die hole 122 is punched by lowering the punch 111 for punching into a die hole 122 provided at the center of the punching die 121. For this reason, the size of the punch 111 for punching is slightly smaller than the size of the die hole 122. A blade whose upper cutting blade has an angle close to a right angle is generally called a punch die, and a blade having an acute angle is called a hollow blade. The punch die method is usually a drop-off method, but a hollow blade is often provided with an underlay without being removed. In the present invention, in consideration of productivity and maintainability, a punched die system having a blade angle of around 90 degrees was used to punch a bonded sheet base material into a card shape.

  In this way, the punching blade uses a mold in which the punch side blade to be punched and the die side blade to be punched are paired up and down, and the card base is cut at a blade angle of about 90 °. . Since the punch die method has a simple blade structure, the punch die method is suitable for production in which a large amount of card base material is punched. Since it is difficult to punch a card base material having a high breaking elongation, it is preferable to use an adhesive having a breaking elongation of 500% or less.

  When punching a plurality of format-printed card bases with a plurality of punches as in this invention, if punching is performed simultaneously, compressive stress and tensile stress are simultaneously applied to the card base material from multiple directions. In addition, the “cut residue” of the base material occurs on the cut surface, which often causes “burrs”. As a countermeasure, in the present invention, as a means for dispersing stress, even if a plurality of punches are operated simultaneously so that the plurality of punches do not punch the card substrate at the same time, the difference in the punch height as in the embodiment is provided. By attaching it, it is devised to avoid simultaneous punching. As a means for making a difference in how to cut a plurality of punches, a means for avoiding punching at the same time by using a plurality of punches by using a plurality of motors and changing each punching speed is also preferable.

[Presser plate (stripper)]
When cutting is performed using a pair of upper and lower molds, the occurrence of burrs can be reduced by sufficiently holding the card substrate punched in advance with a pressing plate (stripper). However, when punching multiple parts at the same time, it is sufficient if the card base material to be punched is flat. However, like an IC card, a plurality of card base materials are bonded using an adhesive or the like, and an electronic component is placed inside. When mixed, it is difficult to produce a bonded card substrate completely flat. If a card base that is not completely flat is punched almost at the same time, using an integrated presser plate (stripper) as in the past, even if pressed with a strong force, if there is an uneven part, the recessed part will be pressed. Cutting is not possible and burrs occur. Therefore, when punching a plurality of parts at the same time, it is preferable that each punched part is pressed individually. Furthermore, in order to make the punching position and the pressing position accurate, the base material that has been pre-formatted is used, and the card base material is pressed by a pressing plate (stripper) that is individually divided based on them, and punching is performed. This is a more preferable form in the present invention.

[Card base thickness]
In this invention, the cutting property when carded is defined by the standard deviation of the thickness of the card substrate, but the thickness range of the card substrate before cutting is ± 10 from the average value of the card substrate thickness. % Is preferable, and more preferably within ± 6%. Usually, many cards on the market are about 760 μm to 800 μm. In the case of 800 μm, the card is within ± 80 μm, preferably ± 48 μm or less. In addition, when the thickness range is widened, when printing or image formation is performed with a printer or the like, the card surface cannot be pressed with the printer head, and density unevenness and print blurring are generated, which is not preferable.

[Inclination in the card surface]
Since the IC card to be manufactured includes an IC chip, an antenna, or a member for protecting the chip, unevenness is likely to occur.

  In the present invention, the inclination in the card surface means that when a tangent line is drawn at any point between the top of the raised portion of the card and the bottom of the raised portion with respect to the neutral surface in the card surface, The inclination angle (inclination) between the tangent and the neutral plane inside the card surface is defined as the in-card inclination. When the in-card inclination is larger than 0.004, a blur occurs when printing with a printer.

[Inlet base material]
As the base material used, PET (polyethylene terephthalate), PET-G, PEN (polyethylene naphthalate), vinyl chloride, PC (polycarbonate), TAC (triacetyl cellulose), acrylic, paper, YUPO, etc. are all used. However, in the present invention, PET, PET-G, and PEN are preferable from the viewpoint of mechanical strength, dimensional stability, and solvent resistance, and PET or PET-G is more preferable from the viewpoint of transparency, processability, and cost. .

[Break elongation of adhesive]
The breaking elongation of the adhesive means that when the adhesive is continuously pulled at a constant speed, the adhesive is torn at a certain point and breaks. It is the elongation rate of the adhesive stretched up to that time. Generally, when the breaking elongation is small, it is easy to cut when cutting with a scissors-like blade, and when the breaking elongation is large, the elongation until the adhesive is cut is large, so it is difficult to cut when cutting with a scissors-like blade. . On the other hand, when an adhesive is used as a part of the card substrate, it is preferable that the value of the elongation at break is larger when the card is bent or folded, because it is flexible.

  When card cutting is performed by the punch die method, it is ideal that the breaking elongation is small and the breaking elongation at the completion of curing of the adhesive is large. The preferable range of the breaking elongation at the time of cutting is 5% or more and 500% or less, and more preferably 50% or more and 400% or less. The breaking elongation at the completion of complete curing is preferably 50% or more and 500% or less, more preferably 100% or more and 400% or less.

[Elastic modulus of adhesive]
When the adhesive is deformed by applying an external force, the stress generated by the external force and the strain generated by the deformation are proportional to each other in a range where the deformation is not so large (Hooke's law). The elastic modulus of the adhesive is obtained by using the proportional constant at this time as the elastic modulus. That is, the elastic modulus C is expressed by C = (stress) / (strain). If the elastic modulus is high, cutting with a blade such as scissors is easy to cut, but on the other hand, the adhesive becomes hard and the card durability is lowered. On the other hand, when the elastic modulus is low, the adhesive protrudes from the cross section during cutting, and when the card is formed, the cross sectional shape deteriorates and the appearance deteriorates. A preferred range of the elastic modulus of the adhesive is at 30 kgf / mm ² or more 100 kgf / mm ² or less, more preferably 40 kgf / mm ² or more 80 kgf / mm ² or less.

[Measurement method of elongation at break and 2% elastic modulus]
In this invention, the elongation at break (%) and the 2% elastic modulus were set at 23 ° C. and 55% RH, and after leaving the adhesive for 300 hours or longer, Orientec Tensilon Universal Testing Machine RTA- 100, the data processing is Tensilon multi-function data processing TYPE MP-100 / 200S Ver. Measurement was performed using No. 44. The resin fixing means was fixed by an air chuck method. The crosshead speed can be selected from 5 to 100 mm / min, RANGE from 5 to 100%, and the load from 0.1 to 500 kg. However, in the evaluation of the present invention, the crosshead speed is 30 mm / min and RANGE is Evaluation was performed under the conditions of 20% and a load of 100 kg.

  When measuring the elongation at break and the 2% elastic modulus of the adhesive, it is particularly difficult to form a single film. Therefore, a 500 μm resin layer was formed on a PP release sheet, and a desired sample was prepared and measured. For the measurement, a sample having a width of 1 cm was fixed to an air chuck and a tensile test was performed. The elongation at break was determined from the elongation at break when the actinic ray curable resin was broken or cracked during pulling.

[Paste environment]
Normally, when bonding, the adhesive can be applied without adjusting the environmental humidity and temperature, and the curing of the adhesive proceeds, but when using a moisture curable adhesive, the temperature and humidity from the time of creation are used. When the work is performed in an environment that gives the adhesive, the adhesive cure speed becomes faster and the adhesive is fully cured faster. As an environment at the time of preparation, the temperature is preferably 20 ° C. or more and 50 ° C. or less, and the humidity is preferably 70% or more and 100% or less.

[Sheet storage environment after bonding]
The card substrate coated with the adhesive and bonded together is stored until the adhesive is cured. The storage environment for the card substrate is preferably a temperature of 20 ° C. or more and 50 ° C. or less and a humidity of 40% or more and 100% or less. If the temperature and humidity are below these values, the adhesive will not cure, and if the temperature is above this range, the adhesive will ignite and cause the sheet to swell.

  After about 3 days, the card substrate has a peel strength between the card substrates of 1500 g / 2.5 cm or more, and even if the card substrate is carried or cut, the card substrate is not distorted or bent. Thereafter, the adhesive is completely cured over 1 to 4 weeks.

[Load applied to card substrate]
Since the card base immediately after bonding is not completely cured, it is necessary to apply a certain amount of load during storage in order to increase the adhesion between the two card bases bonded together. It is. If the applied load is too large, the card base material may be distorted or the IC chip or the like inside the bonded card base material may be damaged. It is preferred load applied to the card substrate is 2 kg / m ² or more 1500 kg / m ² or less.

[Coating viscosity of adhesive]
When the adhesive coating viscosity at the time of making the bonded card base is less than 5000 mPs, many bubbles are generated at the time of bonding, the planar unevenness is deteriorated, and when it is larger than 40000 mPs, the adhesive applicability is high. Since it deteriorates, planar unevenness will deteriorate. In addition to the planar unevenness, a problem that the card surface strength after curing is reduced occurs. Therefore, it is preferably 5000 mPs or more and 30000 mPs or less, more preferably 7000 mPs or more and 20000 mPs or less. The coating temperature is preferably 140 ° C. or lower, more preferably 130 ° C. or lower.

[IC card base material adhesive]
As the bonding material of the present invention, it is preferable to use a hot melt adhesive, a thermoplastic resin, or the like. For example, as the hot melt adhesive, a commonly used one can be used. Examples of the main component of the hot melt adhesive include ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, and polyolefin. However, in the present invention, a moisture curable adhesive is specifically preferable among the low temperature adhesives.

  Moisture curable materials as reactive hot melt adhesives are disclosed in JP-A Nos. 2000-036026, 2000-212278, and 2000-219855. Any of these adhesives may be used, and materials that are not particularly limited can be used as long as low-temperature bonding can be performed.

  The film thickness of the adhesive is preferably 100 to 600 μm, more preferably 150 to 500 μm, and still more preferably 150 μ to 450 μm in terms of the thickness including the electronic component.

[Electronic parts]
An electronic component refers to an information recording member, specifically, an IC chip that electrically stores information of a user of the electronic card and a coiled antenna body connected to the IC chip. The IC chip is a memory alone or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member.

  The IC module has an antenna coil, but when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). There are known methods using industrial anisol, etc.) or soldering methods, but any method may be used.

  In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the shearing force due to the flow of the resin causes the joint to come off or the surface smoothness due to the flow or cooling of the resin. In order to eliminate the damage and lack of stability, a resin layer is previously formed on the substrate sheet, and the electronic component is sealed with a porous resin film or porous foam to enclose the component in the resin layer. It is preferably used in the form of a conductive resin film, a flexible resin sheet, a porous resin sheet or a non-woven sheet. For example, a method described in Japanese Patent Application No. 11-105476 can be used.

  Further, since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.

[Sheet material for IC card substrate]
Examples of the substrate include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, and poly-4-fluoride. Polyfluorinated ethylene resins such as ethylene fluoride, ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer Polymers, ethylene / vinyl alcohol copolymers, vinyl polymers such as polyvinyl alcohol and vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol, biodegradable cell Biodegradable resins such as loose acetate, biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, polymethyl methacrylate, polyethyl methacrylate, ethyl polyacrylate, polybutyl acrylate, etc. Examples include synthetic resin sheets such as acrylic resin, polystyrene, polycarbonate, polyarylate, and polyimide, or high-quality paper, thin paper, glassine paper, paper such as sulfuric paper, single layer such as metal foil, or laminates of these two or more layers. It is done. The thickness of the support of the present invention is 30 to 300 μm, preferably 50 to 200 μm. In this invention, from the viewpoint of card base material transportability due to heat shrinkage and warping of the support, the thermal shrinkage rate at 150 ° C./30 min as a sheet member in addition to the low temperature adhesive is 1.2% or less in the longitudinal (MD) The width (TD) is preferably 0.5% or less. Further, an easy contact treatment may be performed on the support for post-processing to improve adhesion, and an antistatic treatment may be performed for chip protection. Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

  The second sheet material may be provided with a cushion layer in addition to the image receiving layer in order to form a face image of the card user. An image element is provided on the surface of the personal authentication card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided. It may be a card.

[Image receiving layer]
The image receiving layer in the second sheet member can be formed with a binder and various additives. The image-receiving layer in the present invention forms a gradation information-containing image by a sublimation type thermal transfer method, and forms a character information-containing image by a sublimation type thermal transfer method or a melt type thermal transfer method. The adhesion of the hot-melt ink must be good as well as the dyeability of the sublimable dye. In order to impart such special properties to the image-receiving layer, it is necessary to appropriately adjust the types of binders and various additives and their blending amounts as described later.

  An information carrier comprising a format print represents an information carrier provided with at least one selected from a plurality of identification information and book information. Specifically, a ruled line, a company name, a card name, and notes Indicates the issuer's phone number.

  For the formation of an information carrier consisting of format printing, use the “lithographic printing technology”, “new printing technology overview”, “offset printing technology”, “plate making / printing slightly understandable picture book” published by Japan Printing Technology Association, etc. It can be formed using the general inks described, and is formed of ink such as carbon in photocurable ink, oil-soluble ink, solvent-type ink, and the like.

  In some cases, watermark printing, holograms, fine patterns, etc. may be employed to prevent visual counterfeiting, and the printed material, hologram, barcode, matte pattern, fine pattern, background pattern, uneven pattern may be used as the forgery / alteration prevention layer. Select timely, visible light absorbing color material, ultraviolet absorber, infrared absorber, fluorescent whitening material, metal deposition layer, glass deposition layer, bead layer, optical change element layer, pearl ink layer, neighboring pigment layer, It is also possible to provide the front sheet by printing or the like from an antistatic layer or the like.

[Writing layer]
The writing layer is a layer that allows writing on the back surface of the IC card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155. The writing layer is formed on a first sheet material in which a plurality of layers are not laminated. Addition of a material that improves slipperiness, such as wax, to the writing layer is effective in preventing damage and wear when rubbed. As the additive, polyethylene wax is preferably used.

[IC card creation method]
Here, an example of a method for producing an IC card using a hot melt adhesive will be given. In producing the IC card, first, a hot melt adhesive is applied to a predetermined thickness on the front and back sheets with an applicator. As a coating method, a normal method such as a roller method, a T-die method, or a die method is used. In the case of coating in the form of stripes in the present invention, there is a method of intermittently opening the T-die slit, but it is not limited thereto.

  Further, the first sheet material and the second sheet material may be subjected to format printing or information recording either before or after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, It can be formed by any method such as an ink jet method, a sublimation transfer method, an electrophotographic method, and a heat melting method.

  The manufacturing method of the IC-mounted card base material of the present invention is as follows: JP-A-2000-036026, JP-A-2000-21855, JP-A-2000-21278, JP-A-10-316959, JP-A-11-5964, etc. An installation method is disclosed. Any bonding method, coating method, and the like can be used, and the present invention is not particularly limited.

  Moreover, as a method of arranging an adhesive member at a specific position, it can be manufactured by applying an adhesive at a predetermined position by a screen printing method, a gravure printing method or the like. In addition, when a hot melt adhesive is used, it can be applied to each arrangement by applying the adhesive from the nozzle in a bead shape with a hand gun type hot melt applicator. Alternatively, the adhesive processed into a film shape can be cut to be placed in a predetermined arrangement, and after being placed in each arrangement, it can be bonded by heating and pressing.

At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the base material and the adhesion of a predetermined electronic component between the first sheet material and the second sheet material. It is preferable to manufacture by a bonding method or the like. The heating is preferably 10 to 180 ° C, more preferably 30 to 150. The pressurization is preferably 1.0 to 300 kgf / cm ² , more preferably 1.0 to 200 kgf / cm ² . If the pressure is higher than this, the IC chip is damaged. The heating and pressurizing time is preferably 0.001 to 90 seconds, more preferably 0.001 to 60 seconds. If the time is longer than this, the production efficiency is lowered.

  The sheet for an IC card having an IC module having an IC chip and an antenna in the adhesive layer is stored under a predetermined condition. The first sheet material and the second sheet material are bonded together via an adhesive. Thereafter, the IC card sheet is supplied to the punching die, and the IC card is manufactured by punching the IC card from the IC card sheet with the punching die. In this case, an authentication identification image or a bibliographic item may be recorded before punching. Another effective means is a method of making a hole for supplying moisture necessary for reaction around the card size of the card base material bonded to accelerate the curing.

[Method of applying transfer foil onto IC card]
Transfer of the transfer foil to the transfer material is usually performed using a means capable of applying pressure while heating, such as a thermal head, a heat roller, or a hot stamp machine.

[Example 1]
EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, the aspect of this invention is not limited to this. In the following, “part” means “part by weight”.

[Selection of adhesive]
The adhesive used was Sdyne 2013MK manufactured by Sekisui Chemical Co., Ltd. <Creation of first sheet material (back sheet)>
U2L98W low heat yield grade 188 μm manufactured by Teijin DuPont Films Ltd. was used as the back sheet.
(Create writing layer)
A coating liquid for forming a first writing layer, a coating liquid for forming a second writing layer, and a coating liquid for forming a third writing layer having the following composition are applied and dried in this order on the support backing sheet 188 μm, and the respective thicknesses are obtained. The writing layer was formed by laminating so as to be 5 μm, 15 μm, and 0.2 μm.
<First writing layer forming coating solution>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black Trace amount Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second writing layer forming coating solution>
4 parts of polyester resin [Toyobo Co., Ltd .: Bironal MD1200]
Silica 5 parts Titanium dioxide particles [manufactured by Ishihara Sangyo Co., Ltd .: CR80] 1 part 90 parts of water <third writing layer forming coating solution>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sanmide 55] 5 parts Methanol 95 parts The center line average roughness of the obtained writing layer was 1.34 μm.

(Form format printing layer on the writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
<Creation of second sheet material (front sheet)>
U2L98W low heat yield grade manufactured by Teijin DuPont Films Ltd. was used as a front sheet. The thickness of the PET sheet is 188 μm on both sides.
(Create a table sheet)
A second sheet material (front sheet 1) was formed by sequentially coating and drying a cushion layer and an image receiving layer comprising the following composition on the support surface sheet 188 μm.
(Photo-curing cushion layer) Film thickness 10μm
Urethane acrylate oligomer (made by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512)
55 parts polyester acrylate (Toagosei Co., Ltd .: Aronix M6200)
15 parts urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000)
25 parts hydroxycyclohexyl phenyl ketone (Ciba Specialty Chemicals: Irgacure 184) 5 parts methyl ethyl ketone 100 parts The actinic ray curable compound after application is dried at 90 ° C./30 sec, then with a mercury lamp (300 mJ / cm ² ). Photocuring was performed.

(Image receiving layer)
The first image-receiving layer forming coating solution, the second image-receiving layer forming coating solution and the third image-receiving layer forming coating solution having the following composition are applied and dried in this order on the cushion layer, and each thickness is 0. The image receiving layer was formed by laminating to 2 μm, 2.5 μm, and 0.5 μm.
<First image-receiving layer forming coating solution>
9 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BL-1]
Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second image-receiving layer forming coating solution>
6 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming third image-receiving layer>
Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitech E1000]
Urethane-modified ethylene acrylic acid copolymer 8 parts [manufactured by Toho Chemical Co., Ltd .: Hitec S6254]
Methyl cellulose [manufactured by Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part Water 90 parts (formation of information carrier consisting of format printing layer)
Format printing (employee ID, name) was performed on the image receiving layer by an offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
(Transparent resin layer formation) The printing ink which consists of the following composition was mixed with the roll mill, and printing ink was created. Printing was performed on the image receiving layer by an offset printing method. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
(Transparent resin layer composition 1)
Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dirocure 1173 (manufactured by Ciba Specialty Chemicals) 5 parts trimethylolpropane acrylate 10 parts (preparation of IC concealment layer)
By the resin convex printing method, watermark printing was performed on the outermost surface of the support opposite to the image receiving layer surface. The printing pattern was performed in either FIG. 6 or FIG. Printing ink was printed with UV black ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp. The film thickness was 1.0 μm.

(Used inlet)
An aluminum foil having a thickness of 10 μm was vapor-deposited on an S series tetron film manufactured by Teijin DuPont Films Co., Ltd., and then etched as in the form of an antenna wire. An IC chip, a reinforcing plate, and the like were placed on the base sheet thus obtained to obtain an IC card inlet.

<Creation of IC card image recording material>
Using the first sheet material (back sheet) shown in FIG. 8 and the second sheet material (front sheet) shown in FIG. 9, the IC-mounted card substrate and card base with an image receiving layer shown in FIG. A card substrate was prepared using a material preparation device.

  The card base creation as an embodiment will be described. The first sheet material (back sheet) is installed in the first sheet supply unit, and the second sheet material (front sheet) is installed in the second sheet supply unit. An adhesive was charged into the hot melt agent supply section.

  In this way, the first sheet material (back sheet) in the form of a long sheet and the second sheet material (front sheet) of a single sheet are provided, and the second sheet material is under nitrogen at a specific temperature. An adhesive was supplied from a moisture curing type adhesive supply unit by a T-die coating method, and an electronic component composed of FIGS. 10 to 12 having a thickness of 270 μm was arranged. In order to prevent the temperature of the adhesive from decreasing, the heating member was heated and heated.

  FIG. 10 is a schematic diagram of an IC module made of an IC card material, which is an IC module of an electronic component 3a in which an IC chip 3a2 is joined to an antenna 3a1 of an antenna coil wound with a copper wire.

  The inlet structure of FIG. 11 is a nonwoven fabric type, and the nonwoven fabric 3a4 on which the printed pattern is formed and the IC chip 3a2 are joined by bonding or the like, and the reinforcing plate 3b covers the IC chip 3a2 by 50% or more on the IC chip 3a2. It is the schematic diagram which interposes. An IC card sheet “FT series” manufactured by Hitachi Maxell Co., Ltd. can also be used.

  FIG. 12 shows a printed circuit board type in which a printed circuit board 3a5 on which a printed pattern is formed and an IC chip 3a2 are joined by bonding or the like, and a reinforcing plate 3b is interposed on the IC chip 3a2 so as to cover 50% or more of the IC chip 3a2. FIG.

  The inlet used was a heat treatment of various S series Tetron films manufactured by Teijin DuPont Films, Ltd., and the heat shrinkage rate was adjusted. Thereafter, both surfaces of the support were coated with various resins with a thickness of 1 μm. Further, an aluminum foil having a thickness of 10 μm was vapor-deposited thereon, and then subjected to an etching process like an antenna wire. On the base sheet support thus obtained, an IC chip, a reinforcing plate and the like were installed to form an IC card inlet.

An adhesive is supplied to the first sheet material by a T-die coating method from a moisture curable adhesive supply section under nitrogen at a specific temperature, and the moisture curable adhesive is applied to the first sheet material and the second sheet material. And a card base whose thickness is controlled to 740 μm by a heat and pressure roll (pressure 3 kg / cm ² , roll surface temperature 70 ° C.) and a film thickness control roll. A material master was created. This card base plate is shown in FIG. 13 and FIG. FIG. 13 shows an embodiment using the inlet of FIG. 11, and FIG. 14 shows an embodiment using the inlet of FIG.

  The target thicknesses of the adhesive applied to the first and second sheet materials were 30 to 40 μm and 330 to 350 μm, respectively. In this invention, by controlling the thickness distribution of each coating, the card thickness standard deviation, thickness variation range, and in-plane inclination values were adjusted, and an IC card having the values shown in the examples after punching was obtained.

  The cutting step is preferably performed after the initial curing of the adhesive and the adhesion to the support are sufficiently performed. In consideration of cutting properties, the adhesive does not necessarily need to be completely cured. The prepared master was able to obtain an image recording body for an IC card having a size of 55 mm × 85 mm by a punching method shown later. When there was no format printing part on the front and back surfaces of the finished card substrate, the logo and OP varnish were printed sequentially by a resin letterpress printing method with a card printer.

[Storage of IC card]
The IC cards obtained as described above were loaded in the card magazine having the shape shown in FIG. The card magazine was configured to be mountable in the loading section of the card printer shown in FIG. After the card magazines were sealed, these magazines were stored for 10 days in a 23 ° C. and 55% environment.

[IC card creation method]
[Method of describing authentication identification image and attribute information image on IC card]
(Creation of ink sheet for sublimation thermal transfer recording)
A 6 μm-thick polyethylene terephthalate sheet with anti-fusion processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta and cyan were obtained.
<Coating liquid for yellow ink layer formation>
Yellow dye (MSY Yellow manufactured by Mitsui Toatsu Dye Co., Ltd.) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Coating liquid for forming a magenta ink layer>
Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate modified polystyrene 2 parts [Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
70 parts of methyl ethyl ketone

20 parts of toluene <Cyan ink layer forming coating solution>
Cyan dye (Nippon Kayaku Co., Ltd. Kayaset Blue 136) 3 parts Polyvinyl acetal 5.6 parts [Electrochemical Industry Co., Ltd .: Denkabutyral KY-24]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
20 parts of methyl ethyl ketone (preparation of ink sheet for melt type thermal transfer recording)
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.
<Ink layer forming coating solution>
Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemicals: EV40Y]
Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries, Ltd .: Tamanol 521] 5 parts Methyl ethyl ketone 90 parts (Face image formation)
The image receiving layer or transparent resin portion, the information printing portion and the ink side of the ink sheet for sublimation type thermal transfer recording are overlapped, and the output is 0.23 W / dot and the pulse width is 0.3-4. A human image having gradation in the image was formed on the image receiving layer by heating under conditions of 5 ms and a dot density of 16 dots / mm. In this image, the dye and the nickel of the image receiving layer form a complex.

(Formation of character information)
The transparent resin part and the ink side of the melt type thermal transfer recording ink sheet are overlapped, and the condition of output 0.5 W / dot, pulse width 1.0 ms, dot density 16 dots / mm using the thermal head from the ink sheet side The character information was formed on the IC card image recording body by heating with.

  The face image and attribute information are provided as described above.

[Synthesis of IC card surface protective layer-added resin]
[Create IC card surface protection foil]
(Preparation of transfer foil 1)
A transfer foil 1 was prepared by laminating the following composition on a release layer of a polyethylene terephthalate film-2 having a thickness of 25 μm provided with a release layer of a 0.1 μm fluororesin layer.
(Actinic ray curable compound)
Shin-Nakamura Chemical Co., Ltd. A 9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink Surfactant F-179 0.25 part <Intermediate layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts after coating Curing of the curing agent was performed at 50 ° C. for 24 hours.
<Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts ( Creation of transfer foil 2)
The following composition was laminated | stacked on the mold release layer of the 25-micrometer-thick polyethylene terephthalate film-2 which provided the mold release layer of the 0.1 micrometer fluororesin layer, and the actinic-light curable transfer foil 2 was produced.
(Actinic ray curable compound)
Shin-Nakamura Chemical Co., Ltd. A 9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink Surfactant F 179 0.25 part <Intermediate layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M 1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts Post-application curing The agent was cured at 50 ° C. for 24 hours.
<Barrier layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 1 part Toughtex M-1913 (Asahi Kasei) 8 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1 part Methyl ethyl ketone 90 parts <Adhesive layer forming coating Liquid> Film thickness 0.5μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemical Co., Ltd .: Jurimer AT510]
2 parts Water 45 parts Ethanol 45 parts Heat of 5 cm diameter rubber hardness 85 heated to a surface temperature of 200 ° C. using the transfer foil 1 and the transfer foil 2 having the above-mentioned configuration on the image receptor on which images and characters are recorded. Transfer was performed in the order of transfer foil 1 and transfer foil 2 by applying heat for 1.2 seconds at a pressure of 150 kg / cm ² using a roller. The transfer was performed using the IC card making apparatus shown in FIG.

  FIG. 15 shows a card printer as an IC card creation apparatus. In the card printer, a card base material supply unit 10 and an information recording unit 20 are arranged at an upper position, and a transparent protective layer and / or an optical change are arranged at a lower position. An element transfer layer application part / or resin layer application part 70 is arranged, and then a transparent protective layer and / or an optical change element transfer layer application part / or resin layer application part 70 are arranged to create a card as an image recording body. To do.

  In the card base material supply unit 10, for example, a plurality of card base materials 50 that have been cut into pieces in advance to write the personal information of the card user created in FIG. Stocked up. In this example, the card substrate 50 includes a support and an image receiving layer, and the card substrate 50 is automatically supplied one by one from the card substrate supply unit 10 at a predetermined timing.

  In the information recording unit 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged correspondingly. While the card substrate 50 is moved by thermal transfer using a thermal transfer sheet such as a yellow ribbon, a magenta ribbon, or a cyan ribbon, an image area having gradation such as a card user's face photograph is present in a predetermined area of the image receiving layer. To be recorded.

Further, a character ribbon cassette 31 and a recording head 32 are arranged, and authentication identification information such as a name and a card issuance date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon, and an image recording layer is formed. In this information recording unit 20, a gradation information image is formed on the image receiving layer by heating imagewise, and the recording head condition when forming the image is pressurized in the range of 0.01 to 0.3 kg / cm ² , The head is formed at a temperature of 50 to 500 ° C.

  In the transparent protective layer and / or the optical change element transfer layer applying unit / or the resin layer applying unit 70, a transfer foil cassette 71 is arranged, and a thermal transfer head 72 is arranged corresponding to the transfer foil cassette 71. The optical change element transfer foil 43 and / or the transparent protective transfer foil 64 and the curable transfer foil 66 are transferred, and an optical change element transfer layer and / or a transparent protective transfer layer and a curable protective layer-containing transfer layer are provided.

  Evaluation of the physical properties of this example is shown below.

(Card cutting)
A punch die or a hollow blade was placed on the card punching machine shown in FIG. 5 and punched into a card form, and then the card cross section was observed and evaluated in five stages. A result of 4 or more is a preferable result.
5: There is no protrusion of the base material or adhesive on the card cross section, and the card is slippery when touched by hand. 4: No burrs or adhesive sticking out of the base material on the card cross section.
3: There is no burr of the base material on the card cross section, but the adhesive protrudes and the cross section is rough.
2: The burr | flash of a base material generate | occur | produces in the card | curd cross section, the adhesive has protruded, and a cross section becomes rough.
1: The base material burr | flash generate | occur | produced in the card | curd cross section, and the adhesive has protruded greatly.

(Card productivity)
A punch die or a hollow blade was placed on the card punching machine shown in FIG. 5, and the created card base was punched into a card form. 1500 IC cards were punched out per day, and the number of cards until the blades needed to be replaced after the remaining cuts in the IC card cross section were recorded. It was set as a condition that it was possible to use in production to punch over 300,000 sheets. Below this, the number of process stops and blade maintainability deteriorate, making them unsuitable for production. Further, if the cutting property is poor, the blade is likely to be worn.

(Card back side trimability)
The created IC card was subjected to format printing on the back side of the IC card using the card printer of FIG. The printed surface was observed and evaluated in five stages. A result of 4 or more is a preferable result.
5: Card printing has no blurring or unevenness, and all are performed at a uniform density.
4: Card printing has no blur or unevenness, and all are printed with a density within a specified range.
3: There is no blur in card printing, but density unevenness occurs in 10 to 50% of the whole.
2: Print blur and density unevenness occur in 10 to 50% of the entire card printing.
1: Printing blur and density unevenness occur in 50 to 90% of the entire card printing.

(Printer transportability)
The 10000 cards produced in the example were continuously printed by the printer shown in FIG. 16, and the ratio of the number of transport cards generated at that time was calculated as the transport failure rate. The conveyance failure rate is preferably 1% or less.

(Dust mixing rate)
The 10000 cards produced in the example were continuously printed by the printer shown in the figure, and the ratio of the number of cards in which dust was mixed between the card and the protective foil at that time was calculated as the dust mixing rate. The dust mixing rate is preferably 0.5% or less.

The results are shown in Table 1.
Table 1

  According to the results of Table 1, in the present invention, the results of the present invention are excellent with respect to the comparative example, and the effects of the invention are recognized.

  The present invention measures and records at least one of the shape or physical property value of the bonded card base material, adjusts the punching machine using the recorded data, and uses the adjusted punching machine to turn the card base material into a card shape. Punch out. In addition, the card base material is accumulated and stored in the accumulation part, and at least one of the shape or physical property value of the card base material accumulated and stored is measured and recorded, and the punching machine is adjusted using the recorded data. The card base material is punched into a card shape by the adjusted punching machine. In addition, at least one of the shape or physical property value of the punched IC card is measured and recorded, the card printer is adjusted using the recorded data, and printing is performed on the IC card by the adjusted card printer, thus reducing the cost. It is possible to prevent cutting, burr prevention, printing blurring, character crushing, and character blurring.

It is a schematic block diagram of the manufacturing process of an IC card. It is sectional drawing of the image forming body of the bonded product of an IC card. It is a figure which shows the orientation pattern which measured the sheet | seat material of the card | curd base material with the polymer orientation meter. It is the figure which looked at the punching blade from the upper part. It is a side view of the principal part of a punching die apparatus. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows a 1st sheet material (back sheet). It is a figure which shows a 2nd sheet | seat material (front sheet | seat). It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is sectional drawing of a card base original plate. It is sectional drawing of a card base original plate. It is a figure which shows the card printer as an IC card production apparatus.

Explanation of symbols

1 First sheet material (back sheet)
2 Second sheet material (front sheet)
DESCRIPTION OF SYMBOLS 3 Inlet 3a Electronic component 3a1 Antenna 3a2 IC chip 3b Reinforcement board 6,7 Adhesive layer 8a Image receiving layer 8b Personal identification information 8c Transparent protective layer 9a Writing layer 50 Card base material 501,502,503 Clean room A 1st sheet material supply Part B Second sheet material supply part C1, C2 Adhesive supply part D Second sheet conveyance part E Inlet supply part F Back roller part G Card base material conveyance part H Cutting part K Collection part L Storage part l1 Accumulation part N Punching part n1 Punching machine N2 Adjustment means O Printing part o1 Card printing machine o2 Adjustment means P Loading part S1 Card base material measurement recording means S2 Card base material measurement recording means

Claims (19)

An adhesive layer is interposed between the first sheet material and the second sheet material, and the card base material is bonded to the adhesive layer so as to enclose an inlet having an IC chip on the inlet base material. In a method for producing an IC card having a multilayer structure in which an IC card is produced by punching the card substrate into a card shape,
Measure and record at least one of the shape or physical property value of the bonded card substrate,
Adjust the punching machine using the recorded data,
An IC card manufacturing method, wherein a card base material is punched into a card shape by the adjusted punching machine. An adhesive layer is interposed between the first sheet material and the second sheet material, and the card base material is bonded to the adhesive layer so as to enclose an inlet having an IC chip on the inlet base material. In a method for producing an IC card having a multilayer structure in which an IC card is produced by punching the card substrate into a card shape,
The card substrate is accumulated and stored in the accumulation unit,
Measure and record at least one of the shape or physical property value of the card base material accumulated and stored,
Adjust the punching machine using the recorded data,
An IC card manufacturing method, wherein a card base material is punched into a card shape by the adjusted punching machine. An adhesive layer is interposed between the first sheet material and the second sheet material, and the card base material is bonded to the adhesive layer so as to enclose an inlet having an IC chip on the inlet base material. In a method for producing an IC card having a multilayer structure in which an IC card is produced by punching the card substrate into a card shape,
Measure and record at least one of the shape or physical property value of the punched IC card,
Adjust the card printer using the recorded data,
An IC card manufacturing method, wherein printing is performed on an IC card by the adjusted card printer.   4. The IC card manufacturing method according to claim 1, wherein the recording data includes at least one measurement value of thickness, warpage, and flatness.   The IC card manufacturing method according to any one of claims 1 to 3, wherein the recording data includes at least one physical property value of an elastic modulus, a breaking elongation, and an orientation angle.   The IC card manufacturing method according to any one of claims 1 to 5, wherein the card base material bonded together is cut into a single sheet before punching the card base material into a card shape. .   6. The IC card manufacturing method according to claim 1, wherein format printing is performed on the bonded card base material before punching the card base material into a card shape. An adhesive layer is interposed between the first sheet material and the second sheet material, and the card base material is bonded to the adhesive layer so as to enclose an inlet having an IC chip on the inlet base material. In a multi-layer IC card manufacturing apparatus that manufactures and creates an IC card by punching the card substrate into a card shape,
Bonded card substrate measurement recording means for measuring and recording at least one of the shape or physical property value of the bonded card substrate,
An IC card manufacturing apparatus comprising adjusting means for adjusting a punching machine for punching into a card shape using the recording data. An adhesive layer is interposed between the first sheet material and the second sheet material, and the card base material is bonded to the adhesive layer so as to enclose an inlet having an IC chip on the inlet base material. In a multi-layer IC card manufacturing apparatus that manufactures and creates an IC card by punching the card substrate into a card shape,
An accumulating unit for accumulating and storing the card substrate;
An accumulated and stored card base material measurement recording means for measuring and recording at least one of the shape or physical property value of the card base material accumulated and stored in the accumulation unit,
An IC card manufacturing apparatus comprising adjusting means for adjusting a punching machine for punching into a card shape using the recording data. An adhesive layer is interposed between the first sheet material and the second sheet material, and the card base material is bonded to the adhesive layer so as to enclose an inlet having an IC chip on the inlet base material. In a multi-layer IC card manufacturing apparatus that manufactures and creates an IC card by punching the card substrate into a card shape,
A punched IC card measurement recording means for measuring and recording at least one of the shape or physical property value of the punched IC card;
An IC card manufacturing apparatus, comprising: an adjustment unit that adjusts a card printer that prints on an IC card using the recording data.   11. The IC card manufacturing apparatus according to claim 8, wherein the recording data includes at least one measurement value of thickness, warpage amount, and flatness.   11. The IC card manufacturing apparatus according to claim 8, wherein the recording data includes at least one physical property value of an elastic modulus, a breaking elongation, and an orientation angle.   13. The cutting apparatus according to claim 9, further comprising a cutting machine that cuts the bonded card base material into a single sheet before punching out the card base material into a card shape. IC card production equipment.   The IC card according to any one of claims 9 to 12, further comprising a card printing machine that performs format printing on the bonded card base material before punching the card base material into a card shape. Production device. An IC card is produced using any one of claims 1 to 14,
Having an image receiving layer on at least one side of the IC card;
Provide personal identification information including name, face image by thermal transfer method or inkjet method,
An IC card, wherein a writing layer capable of writing is provided on at least a part of the IC card. Provide a transparent protective layer on the top surface provided with personal identification information including the name and face image,
The IC card according to claim 15, wherein the transparent protective layer is made of an actinic ray curable resin.   The IC card according to claim 15 or 16, wherein the IC chip of the IC card is disposed at a position other than a position overlapping the face image portion.   The IC card according to any one of claims 15 to 17, wherein the IC card is a non-contact type.   The IC card according to any one of claims 15 to 18, wherein a planar unevenness of a chip peripheral portion of the IC card is within ± 10 µm.

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