JP2005332259A - Ic card manufacturing method, ic card manufacturing equipment and ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent print blurring or image omission, and to improve card yield. <P>SOLUTION: A card base material 50 is prepared by interposing adhesive between a first sheet material 1 and a second sheet material 2, and encapsulating an inlet 3 having an IC chip 3a2 on an inlet base material in adhesive layers 6 and 7, and a multi-layered IC card is prepared under an environment which is class 100,000 or less by punching the card base material 50 like cards. The preparation of the IC card is carried out in an environment chamber having a device for making air pass through a filter for purifying it. Also, at least a portion of processes for preparing the IC card is provided with a member 70 for holding magnetism for removing dust. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC card manufacturing method and an IC card suitable for application to an IC card that stores personal information or the like that requires safety (security) such as forgery and alteration prevention.

  Conventional IC cards use an IC chip, an inlet having a circuit board mounted with an antenna, inserted between two sheets of material, using a moisture-curing adhesive, a UV-curing adhesive, a two-component mixed adhesive, or the like. It is generally produced by sticking and curing, or by carding a card base material of two sheets with a hot press machine and then punching out into a card shape.

  The produced IC card is generally used after character information and image information are given to the card surface by a printer and a protective layer is provided. However, if dust such as dust adheres to the IC card before the character information and image information are recorded by the printer, printing blur and image omission occur, which is not suitable for use as a personal authentication card, and is preferable in terms of appearance. Absent.

Although it is necessary to prevent dust from adhering before printing, semiconductor wafer related products that have defined cleanliness have been proposed (for example, Patent Documents 1 and 2), but the cleanliness of IC cards has been defined. There is no example.
Japanese Patent Laid-Open No. 6-183522 (first page to ninth page, FIGS. 1 to 5) Japanese Patent Laid-Open No. 9-8086 (pages 1 to 6, FIGS. 1 to 7)

  In particular, in the manufacture of IC cards, heat and pressure are applied in the IC card bonding manufacturing process as described above. Therefore, once dust such as dust cannot be removed, it cannot be removed. There was a problem that the rate dropped.

  Furthermore, there are cases where a punching process or a printing process on the front or back side is required after card formation. If dust such as dust is generated in these processes, scratches or dirt are generated during card transportation such as punching or printing. Therefore, a serious problem such as a significant decrease in card yield has occurred, and a solution has been strongly desired.

  The present invention has been made in view of the above points, and provides an IC card manufacturing method, an IC card manufacturing apparatus, and an IC card capable of preventing print blur and image loss and improving the card yield. It is aimed.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

In the first aspect of the present invention, an adhesive is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In a method for producing an IC card having a multilayer structure in which a card substrate is created and an IC card is created by punching the card substrate into a card shape,
The IC card manufacturing method is characterized in that the IC card is created in an environment of class 100,000 or less.

  According to a second aspect of the present invention, the creation of the IC card includes at least one of creation of a card base material, storage of the card base material, punching of the card base material, and loading of a punched IC card cartridge. The IC card manufacturing method according to claim 1.

  The invention according to claim 3 is the IC card manufacturing method according to claim 1 or 2, characterized in that the card base material is cut into a single sheet before punching into the card. .

  4. The IC card manufacturing method according to claim 1, wherein the card substrate is subjected to format printing before being punched into the card shape. It is.

  According to a fifth aspect of the present invention, the process from storage of the card base material to punching of the card base material and loading of the cartridge of the punched IC card is created in an environment of the class 10,000 or less. It is an IC card manufacturing method of any one of Claims 1 thru | or 4.

  According to a sixth aspect of the present invention, the creation of the IC card is performed in an environmental chamber having a device for purifying air through a filter. IC card manufacturing method.

  The invention according to claim 7 is the IC card manufacturing method according to any one of claims 1 to 6, wherein the inlet stored in a class of 10,000 or less is used.

  The invention according to claim 8 is characterized in that the card base material is stored in a stacked form sandwiched between flat plates before punching. IC card manufacturing method.

  The invention according to claim 9 is the IC card manufacturing method according to claim 8, wherein the flat plate is a metal plate.

In the invention according to claim 10, an adhesive is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on an inlet base material is enclosed in the adhesive layer. In a multi-layer IC card manufacturing apparatus that creates a card base material and punches the card base material into a card shape to create an IC card.
It is an IC card manufacturing apparatus characterized by having a member for holding magnetism for removing dust in at least a part of the process of making the IC card.

  The invention according to claim 11 is the IC card manufacturing apparatus according to claim 10, wherein the member having magnetism is an electromagnet.

  According to a twelfth aspect of the present invention, in the IC card manufacturing apparatus according to the tenth or eleventh aspect, the magnetic force of the magnetic member is 0.001 Tesla or more and 2 Tesla or less.

  The invention according to claim 13 is manufactured using the IC card manufacturing method according to any one of claims 1 to 9 or the IC card manufacturing apparatus according to any one of claims 10 to 12. IC card.

  The invention according to claim 14 is the IC card according to claim 13, characterized in that the number of dust mixed or adhering inside or outside of one card is 100 or less.

The invention according to claim 15 has an image receiving layer on at least one side of the first sheet material or the second sheet material,
Provide personal identification information including name, face image by thermal transfer method or inkjet method,
15. The IC card according to claim 13, wherein a writable writing layer is provided on at least a part of the first sheet material or the second sheet material.

In the invention according to claim 16, a transparent protective layer is provided on the upper surface provided with personal identification information including the name and face image,
The IC card according to claim 15, wherein the transparent protective layer is made of an actinic ray curable resin.

  The invention according to claim 17 is the IC card according to claim 15 or 16, characterized in that the IC chip is arranged at a position other than the position overlapping the face image portion.

  The invention according to claim 18 is the IC card according to any one of claims 13 to 17, wherein the IC card is a non-contact type.

  With the above configuration, the present invention has the following effects.

  According to the first aspect of the present invention, by creating an IC card in an environment of class 100,000 or less, dust such as dust can be prevented from being mixed during the manufacture of the IC card. Further, it is possible to suppress the occurrence of scratches and dirt during card transportation, and the yield of non-defective cards is improved.

  According to the invention of claim 2, the creation of an IC card includes at least one of creation of a card base, storage of the card base, punching of the card base, and loading of a punched IC card cartridge, It is possible to prevent dust and other dust from being mixed during card manufacture.

  According to the third aspect of the present invention, the card base material is cut into a sheet-like sheet shape before being punched into a card shape, whereby the handling is easy and the punching accuracy is improved.

  According to the fourth aspect of the present invention, the card substrate is subjected to format printing before being punched into a card shape, whereby the handling is easy and the accuracy of the format printing is improved.

  According to the fifth aspect of the present invention, it is possible to prevent dust and other dust from entering from storage of the card base material to punching of the card base material and loading of the punched IC card, and scratches and dirt are generated. That can be suppressed.

  According to the sixth aspect of the present invention, the IC card is created in an environmental chamber having a device for purifying air through a filter, and dust and other dust can be prevented from being mixed during the manufacture of the IC card.

  According to the seventh aspect of the present invention, it is possible to use an inlet stored in a class of 10,000 or less, to prevent dust such as dust from entering from the inlet, and to further improve the dustproof property.

  According to the invention described in claim 8, the card base material is stored in a stacked form until it is sandwiched between flat plates before punching, and dust such as dust is mixed by applying a load during the production of the card base material. That can be reduced.

  According to the ninth aspect of the present invention, the flat plate is a metal plate, and a mixture of dust such as dust can be further reduced by placing a stainless steel plate between the card bases and applying a load.

  According to the tenth aspect of the present invention, at least a part of the process of creating the IC card has a member for holding magnetism for removing dust, and removes dust such as dust generated by friction of a machine or the like. be able to.

  According to the eleventh aspect of the present invention, the magnetic member is an electromagnet. For example, by making the electricity of the electromagnet intermittent, dust such as dust adhering to a roller, a conveyor belt, and the like can be dropped.

  According to invention of Claim 12, the magnetic force of the member which has magnetism is 0.001 Tesla or more and 2 Tesla or less, and dusts, such as dust, can be dropped.

  According to the invention described in claim 13, the IC card manufacturing method according to any one of claims 1 to 9, or the IC manufactured using the IC card manufacturing apparatus according to any one of claims 10 to 12. This is a card, and it is possible to suppress the occurrence of scratches and dirt on the IC card, thereby improving the yield of non-defective cards.

  According to the fourteenth aspect of the present invention, the number of dust mixed or adhering inside or outside of one card is 100 or less, and it is possible to suppress the occurrence of scratches and dirt on the C card. Card yield is improved.

  According to the invention described in claim 15, personal identification information including a name and a face image by a thermal transfer method or an ink jet method is provided on at least one side of the image receiving layer, a writing layer capable of writing is provided at least in part, and a license It can be preferably used for classes, identification cards, passports, alien registration cards, library cards, cash cards, credit cards, employee cards, employee cards, membership cards, medical cards and student cards.

  According to the sixteenth aspect of the present invention, personal identification information including name and face image is protected by the transparent protective layer, and durability is improved.

  According to the seventeenth aspect of the present invention, the IC chip is disposed at a position other than the position overlapping the face image portion, and the IC chip does not exist at the position overlapping the face image portion, thereby improving the surface smoothness and printing. Improves.

  According to the invention described in claim 18, since the IC card is a non-contact type and excellent in safety, it can be used for applications requiring high confidentiality of data and prevention of forgery and alteration.

  Hereinafter, an IC card manufacturing method, an IC card manufacturing apparatus, and an IC card according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

  FIG. 1 is a schematic configuration diagram of an IC card manufacturing process. In this IC card manufacturing process, a long sheet-shaped first sheet material (back sheet) 1 is arranged in the first sheet material supply section A, and a sheet-like second sheet material (front sheet) 2 is formed. The second sheet material supply unit B is provided. An adhesive is supplied to the second sheet material 2 from the adhesive supply unit C <b> 1 and applied to the second sheet material 2. The sheet is sent to the inlet supply unit E by the second sheet conveying member D. The second sheet conveying member D includes a conveying roller d1 and a conveying belt d2, and the conveying belt d2 is supported by the platen roller c1 in the adhesive supply unit C1.

  In the inlet supply portion E, an inlet 3 of components including an IC chip and an IC module having an antenna is supplied and placed at a predetermined position of the second sheet material 2, and the second sheet material 2 is moved to the back roller portion F. Send to. The first sheet material 1 is supplied with an adhesive from the adhesive supply unit C <b> 2, coated, and sent to the back roller unit F.

  The back roller part F has a temperature-adjustable laminating roller f, and the first sheet material 1 and the second sheet material 2 are bonded together using the laminating roller f. The temperature difference between the laminating roller f and the rollers f1, f2 is 0 ° C. or higher and 100 ° C. or lower. In this embodiment, the second sheet material 2 has an image receiving layer, the first sheet material 1 has a writing layer, and the rollers f1 and f2 have a roller temperature on the image receiving layer side of the writing layer side. The temperature is lower than the temperature of the roller.

  A card base material transport member G is disposed downstream of the back roller portion F, and the card base material transport member G includes transport belts g1 and g2 and transport rollers g3 and g4 that face each other. A sheet base material on which the first sheet material 1 and the second sheet material 2 are bonded is conveyed between the conveying belts g1 and g2 facing the card base material conveying member G. Send to cutting section H. In the cutting part H, the sheet base material of the bonded product is cut into a single sheet.

  Thereafter, the sheet is sent to the collection unit K, and the collection unit K places the flat plate k1 between the sheet-like sheet base materials and sends it to the storage unit L. In this storage part L, it is stored for a predetermined time at a predetermined temperature, sent to the punching part M, and punched into a card shape. The punched IC card is stored in the magazine n1 in the loading unit N, and is loaded with a cartridge that is sealed with the cover n2.

  Before punching into a card shape at the punching portion M, format printing is performed on one of the first sheet material 1 and the second sheet material 2. By cutting the sheet base material of the bonded product into a single sheet before punching into a card shape, handling is easy and punching accuracy is improved. Further, by performing format printing before punching into a card shape, handling is easy and the accuracy of format printing is improved.

  In this embodiment, an adhesive is interposed between the first sheet material 1 and the second sheet material 2, and an inlet 3 having an IC chip on an inlet base material is enclosed in the adhesive layer. A card substrate is created, and the card substrate is punched into a card shape to create an IC card. The card base material creation process is performed in the clean room 501, the card base material storage process is performed in the clean room 502, the card base material punching process and the punched IC card cartridge loading process are performed in the clean room 503, and the IC card is classified into class 100. Created in an environment of 1,000 or less. In this way, by creating an IC card in an environment of class 100,000 or less, it is possible to prevent dust and other dust from entering during the manufacture of the IC card, and scratches during punching, printing, card transportation, etc. And the occurrence of dirt can be suppressed, and the yield of non-defective cards is improved.

  The creation of this IC card includes the creation of a card base, storage of the card base, punching out of the card base, and loading of the punched IC card into a cartridge. However, at least one of these may be created in an environment of class 100,000 or less, and dust such as dust can be prevented from being mixed during the manufacture of the IC card. In particular, in order to prevent the attached dust from moving and scratching the card surface when handling IC cards such as punching and loading, the process from storage of the card base material to cartridge loading is class. It is preferable that it is 10,000 or less.

  The clean rooms 501 to 503 are configured as shown in FIGS. The clean room 501 to the clean room 503 can be classified into three types, that is, a turbulent flow method, a horizontal laminar flow method, and a vertical laminar flow method, depending on the air flow form.

  In the turbulent flow type shown in FIG. 2, clean air blows downward from a filter 510 attached to the ceiling and exhausts from the floor side. Since it is a method of diluting indoor air, the cleanliness is inevitably limited and is usually in the range of 10,000 to 100,000, but is characterized by ease of construction and low construction costs.

  The horizontal laminar flow type shown in FIG. 3 is a method in which a filter 511 is installed on one wall surface, a laminar flow is formed in a single horizontal direction, and it is carried to the suction port 511a on the opposite side before dust sinks. The downstream is inevitably contaminated, but the upstream provides class 100 cleanliness. Construction costs are slightly higher.

  The vertical laminar flow type shown in FIG. 4 is a system in which a filter 512 is installed on the entire ceiling, and the entire floor surface is used as a suction port 512a to flow the airflow vertically. It is a clean room of the highest degree that can obtain class 100 or less over the entire work surface. Since the facilities and space are large, the construction cost is high.

  In this way, humans become sources of dust and germs in the clean rooms 501 to 503 that are maintained. Depending on the movement, clothes, etc., the amount of dust and germs varies and usually has about 80,000 dust. In order to prevent the generation of such dust, it is preferable that an operator usually wears a white coat called a bembell and covers the whole body with a hat, a mask, gloves, glasses, and special shoes.

  As shown in FIG. 5, the clean room 501 through the clean room 503 can create an IC card using an air flow method (horizontal direction) that does not use a filter. However, as shown in FIG. 2 through FIG. When it is carried out in an environmental chamber having a device for purifying through the IC card, it is possible to prevent dust and other dust from being mixed when the IC card is manufactured.

  In the card base material production process shown in FIG. 1, an inlet 3 stored in a class of 10,000 or less is used, and the inlet 3 is stored in a clean room as shown in FIGS. In this way, using the inlet 3 stored in a class of 10,000 or less, dust such as dust can be prevented from entering from the inlet 3, and the dust resistance can be further improved.

  In the card base material storage process shown in FIG. 1, the card base material is stored in a stacked state between the flat plates k1 before being punched, and dust and other dust are mixed while applying a load while the card base material is manufactured. Can be reduced. The flat plate k1 is a metal plate such as stainless steel, and by putting a load between the card base material and applying a load, it is possible to further reduce the contamination of dust and the like.

  Further, in the IC card manufacturing apparatus of this embodiment, as shown in FIG. 1, at least a part of the process of making an IC card has a member 700 for holding magnetism for removing dust, Dust such as dust generated by friction can be removed. The member 700 for holding magnetism is opposite to the conveying roller b1 of the second sheet material supply unit B, the conveying belt d2 of the second sheet conveying member D, the counter roller f2 of the laminating roller f, and the card substrate conveying member G. The three conveyor belts g1 and g2 are arranged respectively.

  The member 700 having magnetism is an electromagnet, and dust such as dust adhering to a roller, a conveyor belt, etc. can be dropped by, for example, intermittently energizing the electromagnet. Moreover, the magnetic force of the member having magnetism is not less than 0.001 Tesla and not more than 2 Tesla, and dust such as dust can be dropped.

  FIG. 6 shows an IC card manufactured using the IC card manufacturing method or IC card manufacturing apparatus of the present invention. FIG. 6 is a cross-sectional view of an image forming body of an IC card bonded product.

  A card base material, which is an image forming body of an IC card bonded product, includes an electronic component 3 a having a predetermined thickness between a first sheet material 1 and a second sheet material 2. The electronic component 3a includes an antenna 3a1, an IC chip 3a2, and the like, and an IC module of the electronic component 3a is provided in the inlet 3. This is a laminated structure in which the inlet 3 is disposed between the first sheet material 1 and the second sheet material 2 and laminated with the adhesive layers 6 and 7 interposed therebetween. The IC chip 3a2 is covered with a reinforcing plate 3b, and the reinforcing plate 3b has a larger shape than the IC chip 3a2 and protects the IC chip 3a2.

  The first sheet material 1 or the second sheet material 2 has an image receiving layer 8a on at least one surface, in this embodiment, on one surface of the second sheet material 2, and the name and face by the thermal transfer method or the ink jet method. Personal identification information 8b including an image is provided. Further, a transparent protective layer 8c is provided on the upper surface on which personal identification information 8b including a name and a face image is provided by transfer of a transfer foil, and the transparent protective layer 8c is made of an actinic ray curable resin. By providing the transparent protective layer 8c on the upper surface on which the personal identification information 8b is provided, the personal identification information 8b is protected and durability is improved.

  In this embodiment, a writable writing layer 9 a is provided on one side of the first sheet material 1. Further, the IC chip 3a is disposed at a position other than the position overlapping the face image portion, and the IC chip 3a does not exist at the position overlapping the face image portion, thereby improving the surface smoothness and improving the printability. An IC card can be obtained.

  As described above, the IC card has an IC module, is a non-contact card, and is excellent in safety. Therefore, the IC card can be used for applications that require high confidentiality of data and anti-counterfeiting.

  The IC card manufactured in this way can suppress the occurrence of scratches and dirt on the IC card. In this embodiment, the number of dust mixed or adhering inside or outside of one card is 100. It is as follows, and it is possible to suppress the occurrence of scratches and dirt on the IC card, and the good card yield is improved.

  Also, by providing personal identification information including name and face image by thermal transfer method or ink jet method on at least one image receiving layer of IC card, and providing a writable writing layer at least in part, licenses and identification It can be preferably used for certificate, passport, alien registration card, library card, cash card, credit card, employee card, employee card, membership card, medical card and student card.

  Next, the configuration of the present invention will be described in detail.

[Clean room]
In the present invention, generally used clean rooms can be classified into three types according to the air flow mode: a turbulent flow method, a horizontal laminar flow method, and a vertical laminar flow method, and those using filters are shown in FIGS.

[Specific display of cleanliness]
The degree of cleanliness required depends on the required machining accuracy and operating conditions. Therefore, a standard is created based on the need to classify according to the required level of cleanliness.

  The cleanliness standards frequently used at production sites are the US Federal Standards 209B and D. “Class 1” when the number of particles of 0.5 μm or more floating in a cubic foot space is 1 or less, 10 or less In this case, “Class 100,000” is specified for each digit, such as “Class 100,000”. Recently, the existence of 0.1 μm level ultra-particles has become a problem, and a standard in which one 0.5 μm particle corresponds to 35 0.1 μm particles is also used. That is, “Class 1” refers to a cleanness level of “35 particles of 0.1 μm or more floating in 1 cubic foot of space”. Similarly, 7.5 particles are associated with 0.2 μm particles, and 3 particles are associated with 0.3 μm particles.

  In the present invention, the cleanliness class at the time of card production is preferably 100,000 or less, more preferably 10,000 or less, and still more preferably 1,000 or less. Since the storage of the inlet used is an electronic component, further dust resistance is required, and it is preferably stored at class 10,000 or less, more preferably at class 1,000 or less.

[Mechanism for holding magnetism]
Since the machine in the IC card manufacturing apparatus operates, dust is generated due to the friction of the machine. No matter how clean the environment in which this IC card manufacturing apparatus is located, it is necessary to take out the generated dust. Generally, a filter is used to remove dust and dirt with a filter inside the clean room. However, in precision products such as IC cards, dust may be mixed before being removed with a filter. A means for removing the dust immediately after the dust is generated is necessary. Since dust caused by mechanical friction is generally metal dust, it is preferable to use a member having magnetic force as a device for removing dust. Any type of magnet is effective, but if a large amount of metal dust adheres to the magnet, the power to attract newly generated dust will decrease, so using an electromagnet, turn off electricity at a certain interval, It is preferable to drop all metal litter once and use it again. When the magnetic force of the magnet is weak, the effect is small, and when it is too strong, the peripheral device is affected and causes malfunction, so 0.001 Tesla or more and 2 Tesla or less are a preferable range.

[Inclination in the card surface]
Since the IC card to be manufactured includes an IC chip, an antenna, or a member for protecting the IC chip, the IC card is likely to be uneven.

  In the present invention, the inclination in the card surface means that when a tangent line is drawn at any point between the top of the raised portion of the card and the bottom of the raised portion with respect to the neutral surface in the card surface, The inclination angle (inclination) between the tangent and the neutral plane inside the card surface is defined as the in-card inclination. When the in-card inclination is larger than 0.004, a blur occurs when printing with a printer.

[Inlet base material]
Examples of the inlet base material used include PET (polyethylene terephthalate), PET-G, PEN (polyethylene naphthalate), vinyl chloride, PC (polycarbonate), TAC (triacetyl cellulose), acrylic, paper, and YUPO. In this invention, PET, PET-G and PEN are preferable from the viewpoint of mechanical strength, dimensional stability and solvent resistance, and more preferably PET or PET-G from the viewpoint of transparency, processability and cost. is there.

[Heat shrinkage]
If the heat shrinkage rate is large, if the heat is applied at the time of bonding, the inlet base material shrinks and wrinkles or bubbles are formed, so the adhesion of the sheet base material is lowered and the durability of the IC card is lowered. To do. In this invention, when the inlet base material is held at 150 ° C. for 30 minutes and the heat shrinkage rate is within ± 2.5%, the amount of heat shrinkage applied at the time of bonding is small, so that peeling between the sheet materials hardly occurs. Are preferably used. A more preferable range is within ± 2.0%.

[Inlet size smaller than card size]
If the inlet size is larger than the IC card, an inlet appears on the cross section of the card. Therefore, assuming that the card is generally used as a card, a liquid or the like infiltrates from the gap and deteriorates adhesion and durability. As for the size of the inlet base material, the outer peripheral portion of the inlet base material is preferably 0.1 mm or more inside from the card cross section, and more preferably 1.0 mm or more inside.

[Adhesion]
A transfer foil can be used for protection with a light or thermosetting resin layer, but the adhesion between the transfer foil and the image recording material for preventing falsification is preferably in the range of 70 to 100%, more preferably. Is 75 to 100%.

  As for the degree of adhesion, the surface was photographed with a high magnification lens at a magnification of 2000 using a digital HF microscope VH-604 manufactured by Keyence Corporation, the area of the adhesion part was obtained, and the degree of adhesion was calculated from the following formula.

  The part which was not closely_contact | adhering was able to observe the state which floated because of the space | gap.

Area of intimate contact / total area * 100 ... Equation 1
As a method for improving the degree of adhesion, the image recording material for forgery prevention according to the present invention can be used and a protective layer can be used. Further, the surface of the image recording material for forgery prevention can be smoothed by using a method such as a calendar process or a printing pressure UP.

When the protective layer is provided, a heat and pressure treatment is performed. Usually, pressure can be applied while heating a thermal head, a heat roller, a hot stamp machine, or the like. The heating temperature is preferably 170 to 210 ° C., more preferably 180 to 210 ° C., and if the heating temperature is 170 ° C. or less, the adhesiveness is deteriorated. The heating time is 0.01 sec to 30 sec, preferably 0.01 to 20 sec. As a pressure, 3-100 kg / cm < ² > is preferable, More preferably, 3-50 kg / cm < ² > is preferable. If this pressure is lower than this, the adhesion deteriorates.

[Elastic modulus of adhesive]
When the adhesive is deformed by applying an external force, the stress generated by the external force and the strain generated by the deformation are proportional to each other as long as the deformation is not so large. The elastic modulus of the adhesive is obtained by using the proportional constant at this time as the elastic modulus. That is, the elastic modulus C is expressed by C = (stress) / (strain). If the elastic modulus is high, cutting with a blade such as scissors is easy to cut, but on the other hand, the adhesive becomes hard and the card durability is lowered. On the other hand, when the elastic modulus is low, the adhesive protrudes from the cross section during cutting, and when the card is formed, the cross sectional shape deteriorates and the appearance deteriorates. A preferred range of the elastic modulus of the adhesive is at 30 kgf / mm ² or more 100 kgf / mm ² or less, more preferably 40 kgf / mm ² or more 80 kgf / mm ² or less.

[Paste environment]
Normally, when bonding, the adhesive can be applied without adjusting the environmental humidity and temperature, and the curing of the adhesive proceeds, but when using a moisture curable adhesive from the time of creation When the work is performed in an environment that gives temperature and humidity, the adhesive cure speed becomes faster and the adhesive is fully cured faster. As an environment at the time of preparation, the temperature is preferably 20 ° C. or more and 50 ° C. or less, and the humidity is preferably 70% or more and 100% or less.

[Sheet storage environment after bonding]
The adhesive is applied and the laminated sheet base material is stored until the adhesive is cured. The storage environment of the sheet base material is preferably a temperature of 20 ° C. or more and 50 ° C. or less and a humidity of 40% or more and 100% or less. If the temperature and humidity are below these values, curing of the adhesive will not proceed, and if the temperature is above this range, the adhesive will ignite and cause the sheet substrate to swell.

  After about 3 days, the peel strength between the sheet materials becomes 1500 g / 2.5 cm or more, and even if the sheet base material is carried or cut, the sheet base material is not distorted or bent. Thereafter, the adhesive is completely cured over 1 to 4 weeks.

[Flat plate sandwiched between sheet base materials]
The laminated sheet base material will be uneven when a circuit, IC chip, or the like enters inside, and it will be difficult to stack vertically, so if you put a metal plate that is a strong flat plate every several sheets, The distance between the metal plates is preferably 1 or more and 400 or less, and more preferably 5 or more and 200 or less so that the unevenness on the surface can be canceled and the sheets can be stacked vertically without bending.

[Punching method (punch die method and hollow blade method)]
In this invention, the kind of blade used the punch die type blade and the hollow blade. The punch die method referred to here is a method in which a die having a pair of upper and lower sides is used and the sheet is cut with an angle of the upper and lower blades of around 90 degrees. The angle of the punch die type cutting blade is preferably from 80 ° to 100 °, more preferably from 85 ° to 95 °.

  The hollow blade method is a blade that punches out a sheet with a blade from above, and the angle of the blade when punching is around 30 degrees. The angle of the cutting blade of the hollow blade preventing group is preferably 20 ° or more and 40 ° or less, and more preferably 25 ° or more and 35 ° or less. The punch die method has a simple blade structure and is suitable for punching a large amount of sheets, but it is difficult to punch a sheet having a high elongation at break.

  On the other hand, the hollow blade has an acute blade angle, so it is possible to punch out any breaking elongation sheet, but it is inferior to the punch die method in terms of durability and the like, and the blade enters diagonally. Since there exists a possibility that the image receiving layer and the drawing layer which are coated on the material may break, the preferable blade angle is about 30 °.

[Judgment of complete curing]
After curing of the sheet using the moisture curable adhesive of the example is when the isocyanate group contained in the moisture curable adhesive has reacted 95% or more, the cured sheet is card-like for confirmation of curing. Whether or not the reaction is completed can be determined based on whether or not blistering due to the generation of carbon dioxide gas occurs when heat treatment at 90 ° C. or higher is performed. In order to know the progress of the reaction, it can be examined by measuring an infrared absorption spectrum and quantifying the amount of isocyanate group (NCO group) from the spectrum intensity.

[Coating viscosity of adhesive]
When the adhesive coating viscosity is less than 5000 mPs when creating a sheet base material by bonding, a large number of bubbles are generated at the time of bonding, the planar unevenness deteriorates, and when it is larger than 40000 mPs, the adhesive Since the applicability is deteriorated, the planar unevenness is deteriorated. In addition to the planar unevenness, a problem that the card surface strength after curing is reduced occurs. Therefore, it is preferably 5000 mPs or more and 30000 mPs or less, more preferably 7000 mPs or more and 20000 mPs or less. The coating temperature is preferably 140 ° C. or lower, more preferably 130 ° C. or lower.

[MDI (diphenylmethane diisocyanate)]
The amount of MDI is preferably less than 1%. MDI is the official name diphenylmethane diisocyanate. The shape is usually solid and has a boiling point of 190 ° C., a pseudo-solid point of 39 ° C., a flash point of 220 ° C., a vapor pressure of 160 ° C., and is less corrosive at room temperature. [Adhesive for making card base]
As the bonding material of the present invention, it is preferable to use a hot melt adhesive, a thermoplastic resin, or the like. For example, as the hot melt adhesive, a commonly used one can be used. Examples of the main component of the hot melt adhesive include ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, and polyolefin. However, in the present invention, a moisture curable adhesive is specifically preferable among the low temperature adhesives.

  It is a moisture curable material as a reactive hot melt adhesive, and is disclosed in JP-A 2000-036026, JP-A 2000-2111278, and JP-A 2000-211985. Any of these adhesives may be used, and materials that are not particularly limited can be used as long as low-temperature bonding can be performed.

  The thickness of the adhesive is preferably 100 to 600 μm, more preferably 150 to 500 μm, and still more preferably 150 μ to 450 μm in terms of the thickness including the electronic component. In addition, when the viscosity at 120 ° C. is less than 5000 mPs, many bubbles are generated when the cards are bonded to each other, and the planar unevenness deteriorates. When the viscosity is greater than 20000 mPs, the adhesive applicability deteriorates. Sex worsens. Since the problem that the card | curd surface intensity | strength after hardening falls, and problems, such as a burr | flash and a beard generate | occur | produce, Preferably it is 7000 mPs or more and 20000 mPs or less.

[Electronic parts]
The electronic component constituting the inlet indicates an information recording member, specifically, an IC chip that electrically stores information of the user of the IC card and a coiled antenna body connected to the IC chip. is there. The IC chip is a memory alone or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component.

  The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member. The IC module has an IC chip and an antenna coil. When the IC module has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). There are known methods using industrial anisol, etc.) or soldering methods, but any method may be used.

  In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the shearing force due to the flow of the resin causes the joint to come off or the surface smoothness due to the flow or cooling of the resin. In order to eliminate the damage and lack of stability, a resin layer is previously formed on the substrate sheet, and the electronic component is sealed with a porous resin film or porous foam to enclose the component in the resin layer. It is preferably used in the form of a conductive resin film, a flexible resin sheet, a porous resin sheet or a non-woven sheet. For example, a method described in Japanese Patent Application No. 11-105476 can be used.

  Further, since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.

[Method of providing an electronic component between the first sheet material and the second sheet material]
In this invention, in order to provide a predetermined electronic component between the first sheet material and the second sheet material, a heat bonding method, an adhesive bonding method, and an injection molding method are known as manufacturing methods. , Either method may be used. Further, the first sheet material and the second sheet material may be subjected to format printing or information recording either before or after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing. It can be formed by any method such as an inkjet method, a sublimation transfer method, an electrophotographic method, or a heat melting method.

  The manufacturing method of the IC-mounted card base material of the present invention is as follows: JP-A-2000-036026, JP-A-2000-21855, JP-A-2000-21278, JP-A-10-316959, JP-A-11-5964, etc. An installation method is disclosed. Any bonding method, coating method, and the like can be used, and the present invention is not particularly limited.

  Moreover, as a method of arranging an adhesive member at a specific position, it can be manufactured by applying an adhesive at a predetermined position by a screen printing method, a gravure printing method or the like. In addition, when a hot melt adhesive is used, it can be applied to each arrangement by applying the adhesive from the nozzle in a bead shape with a hand gun type hot melt applicator. Alternatively, the adhesive processed into a film shape can be cut to be placed in a predetermined arrangement, and after being placed in each arrangement, it can be bonded by heating and pressing.

[Card Material Sheet Material]
Examples of card base sheet materials include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, and polyvinylidene fluoride. , Polyfluorinated ethylene resins such as polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, polyamide such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / Vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymers such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol , Biodegradable resins such as biodegradable cellulose acetate and biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, ethyl polymethacrylate, polyethyl acrylate, polyacryl Acrylic resin such as butyl acid, synthetic resin sheet such as polystyrene, polycarbonate, polyarylate, polyimide, or paper such as fine paper, thin paper, glassine paper, sulfuric acid paper, single layer of metal foil, or more than two layers The laminated body of this is mentioned. The support of the present invention has a thickness of 30 to 300 μm, desirably 50 to 200 μm.

  In this invention, from the viewpoint of card base material transportability due to heat shrinkage and warping of the support, the thermal contraction rate at 150 ° C./30 min as a sheet member in addition to the low temperature adhesive is 1.2% in the longitudinal (MD) direction. Hereinafter, 0.5% or less is preferable in the lateral (TD). Further, an easy contact treatment may be performed on the support for post-processing to improve adhesion, and an antistatic treatment may be performed for chip protection. Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

  The second sheet material may be provided with a cushion layer in addition to the image receiving layer in order to form a face image of the card user. An image element is provided on the surface of the personal authentication card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided. It may be a card.

[Lamination]
At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the card base and the adhesion of a predetermined electronic component between the first sheet material and the second sheet material. It is preferable to manufacture by a method, a lamination method, etc. The heating is preferably 10 to 180 ° C, more preferably 30 to 150 ° C. The pressurization is preferably 1.0 to 300 kgf / cm ² , more preferably 1.0 to 200 kgf / cm ² . If the pressure is higher than this, the IC chip will be damaged. The heating and pressurizing time is preferably 0.001 to 90 seconds, more preferably 0.001 to 60 seconds. If the time is longer than this, the production efficiency is lowered.

  For an IC card in which an IC module having an IC chip and an antenna is disposed in an adhesive layer, and an inlet having the IC module is interposed between the first sheet material and the second sheet material bonded via an adhesive. After the card base material is stored under predetermined conditions, the card base material for IC card is supplied to the punching die, and the IC card is punched from the card base material for IC card by the punching die. IC cards are manufactured. In this case, an authentication identification image or a bibliographic item may be recorded before punching.

[Method of applying transfer foil onto IC card]
Transfer of the transfer foil to the transfer material is usually performed using a means capable of applying pressure while heating, such as a thermal head, a heat roller, or a hot stamp machine.

[Image receiving layer]
The image receiving layer included in the second sheet material can be formed of a binder and various additives. The image receiving layer in the present invention forms a gradation information-containing image by a sublimation type thermal transfer method and forms a character information-containing image by a sublimation type thermal transfer method or a melt type thermal transfer method. The adhesion of the hot-melt ink must be good as well as the dyeability of the sublimable dye. In order to impart such special properties to the image receiving layer, it is necessary to appropriately adjust the types of binders and various additives and their blending amounts as described later.

  As the binder for the image receiving layer in the present invention, a conventionally known binder for a sublimation type thermal transfer recording image receiving layer can be appropriately used. As the main binder, various binders such as vinyl chloride resin, polyester resin, polycarbonate resin, acrylic resin, polystyrene resin, polyvinyl acetal resin, and polyvinyl butyral resin can be used.

[Writing layer]
The writing layer is a layer that allows writing on the back surface of the IC card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155. A writing layer is formed in the 1st sheet | seat member in which the several layer is not laminated | stacked in a support body. Addition of a material that improves slipperiness, such as wax, to the writing layer is effective in preventing damage and wear when rubbed. As the additive, polyethylene wax is preferably used.

[IC card creation method]
Here, an example of a method for producing an IC card using a hot melt adhesive will be described. In producing the IC card, first, a hot melt adhesive is applied to a predetermined thickness on the front and back sheets with an applicator. As a coating method, a normal method such as a roller method, a T-die method, or a die method is used. In the case of coating in the form of stripes in the present invention, there is a method of intermittently opening the T-die slit, but it is not limited thereto. After bonding with a press or the like, it is punched into a predetermined shape and cut into a card shape to form a card. When a reactive adhesive is used as the adhesive, it is cut into a card shape after curing for a predetermined time. Another effective means is a method of opening holes for supplying moisture necessary for reaction around the card size of the sheets bonded together to accelerate curing.

  In this invention, when producing a card-sized card base, as a manufacturing method, for example, a first sheet material and a second sheet material are bonded together via an adhesive, and bonded cards laminated after bonding A method of shaping the substrate into card size is selected. As a method for shaping the card size, a punching method or a cutting method is mainly selected.

[Example 1]
EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, the aspect of this invention is not limited to this. In the following, “part” means “part by weight”.

[Create adhesive]
As an adhesive used, Sdyne 2013MK manufactured by Sekisui Chemical Co., Ltd. was used as an existing product and prototype.

<Creation of first sheet material (back sheet)>
U2L98W low heat yield grade 188 μm manufactured by Teijin DuPont Films Ltd. was used as the back sheet.

(Create writing layer)
A coating liquid for forming a first writing layer, a coating liquid for forming a second writing layer, and a coating liquid for forming a third writing layer having the following composition are applied and dried in this order on the back sheet 188 μm, and each thickness is 5 μm. , 15 μm and 0.2 μm were laminated to form a writing layer.
<First writing layer forming coating solution>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black Trace amount Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second writing layer forming coating solution>
4 parts of polyester resin [Toyobo Co., Ltd .: Bironal MD1200]
Silica 5 parts Titanium dioxide particles [manufactured by Ishihara Sangyo Co., Ltd .: CR80] 1 part 90 parts of water <third writing layer forming coating solution>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sanmide 55] 5 parts Methanol 95 parts The center line average roughness of the obtained writing layer was 1.34 μm.
(Form format printing layer on the writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

<Creation of second sheet material (front sheet)>
U2L98W low heat yield grade manufactured by Teijin DuPont Films Ltd. was used as a front sheet. The thickness of the PET sheet is 188 μm on both sides.

(Create a table sheet)
A second sheet material (surface sheet 1) was formed by sequentially coating and drying a cushion layer and an image receiving layer comprising the following composition on the front sheet 188 μm.
(Photo-curing cushion layer) Film thickness 10μm
Urethane acrylate oligomer (Shin Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (Shin Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone ( Ciba Specialty Chemicals: Irgacure 184) 5 parts 100 parts of methyl ethyl ketone The actinic ray curable compound after application was dried at 90 ° C./30 sec and then photocured with a mercury lamp (300 mJ / cm ² ).

(Image receiving layer)
The first image-receiving layer forming coating solution, the second image-receiving layer forming coating solution and the third image-receiving layer forming coating solution having the following composition are applied and dried in this order on the cushion layer, and each thickness is 0. The image-receiving layer was formed by laminating so as to be 2 μm, 2.5 μm, and 0.5 μm.
<First image-receiving layer forming coating solution>
9 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BL-1]
Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second image-receiving layer forming coating solution>
6 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming third image-receiving layer>
Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitech E1000]
Urethane-modified ethylene acrylic acid copolymer 8 parts [manufactured by Toho Chemical Co., Ltd .: Hitec S6254]
Methyl cellulose [manufactured by Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part Water 90 parts (formation of information carrier consisting of format printing layer)
Format printing (employee ID, name) was performed on the image receiving layer by the offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Transparent resin layer formation)
The printing ink which consists of the following composition was mixed with the roll mill, and printing ink was created. Printing was performed on the image receiving layer by the offset printing method. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Transparent resin layer composition 1)
Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dirocure 1173 (manufactured by Ciba Specialty Chemicals) 5 parts Trimethylolpropane acrylate 10 parts (Creation of IC concealment layer)
By the resin convex printing method, watermark printing was performed on the outermost surface of the support opposite to the image receiving layer surface. The printing pattern was performed in either FIG. 7 or FIG. Printing ink was printed with UV black ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp. The film thickness was 1.0 μm.

[Used inlet]
An aluminum foil having a thickness of 10 μm was vapor-deposited on an S series tetron film manufactured by Teijin DuPont Films Co., Ltd., and then etched as in the form of an antenna wire. An IC chip, a reinforcing plate, and the like were placed on the base sheet thus obtained to obtain an IC card inlet.

<Creation of IC card image recording material>
Using the first sheet material (back sheet) shown in FIG. 9 and the second sheet material (front sheet) shown in FIG. 10, the IC-mounted card substrate and card base with an image receiving layer shown in FIG. A card substrate was prepared using a material preparation device.

  The card base creation as an embodiment will be described. The first sheet material (back sheet) is installed in the first sheet supply unit, and the second sheet material (front sheet) is installed in the second sheet supply unit. An adhesive was charged into the hot melt agent supply section.

  In this way, the first sheet material (back sheet) in the form of a long sheet and the second sheet material (front sheet) of a single sheet are provided, and the second sheet material is under nitrogen at a specific temperature. An adhesive was supplied from a moisture curing type adhesive supply unit by a T-die coating method, and an electronic component composed of FIGS. 11 to 13 having a thickness of 270 μm was arranged. In order to prevent the temperature of the adhesive from decreasing, the heating member was heated and heated.

  FIG. 11 is a schematic diagram of an IC module made of an IC card material, which is an IC module of an electronic component 3a in which an IC chip 3a2 is joined to an antenna 3a1 of an antenna coil wound with a copper wire.

  The inlet structure of FIG. 12 is a nonwoven fabric type, and the nonwoven fabric 3a4 on which the printed pattern is formed and the IC chip 3a2 are joined by bonding or the like, and the reinforcing plate 3b covers the IC chip 3a2 by 50% or more on the IC chip 3a2. It is the schematic diagram which interposes. An IC card sheet “FT series” manufactured by Hitachi Maxell Co., Ltd. can also be used.

  FIG. 13 shows a printed circuit board type, in which a printed circuit board 3a5 on which a printed pattern is formed and an IC chip 3a2 are joined by bonding or the like, and a reinforcing plate 3b is interposed in the IC chip 3a2 so as to cover 50% or more of the IC chip 3a2. FIG.

  The inlet used was heat-treated for various T series Tetron films manufactured by Teijin DuPont Films Co., Ltd. to adjust the heat shrinkage rate. Thereafter, both surfaces of the support were coated with various resins with a thickness of 1 μm. Further, an aluminum foil having a thickness of 10 μm was vapor-deposited thereon, and then subjected to an etching process like an antenna wire. On the base sheet support thus obtained, an IC chip, a reinforcing plate and the like were installed to form an IC card inlet.

An adhesive is supplied to the first sheet material by a T-die coating method from a moisture curable adhesive supply section under nitrogen at a specific temperature, and the moisture curable adhesive is applied to the first sheet material and the second sheet material. And a IC / fixing member of an IC module, and a card controlled by a heating and pressing roll and a film thickness control roll (pressure 3 kg / cm ² , roll surface temperature 70 ° C.) and controlled to 740 μm A substrate master was created. This card base plate is shown in FIGS. 14 shows an embodiment using the inlet shown in FIG. 12, and FIG. 15 shows an embodiment using the inlet shown in FIG.

  The target thicknesses of the adhesive applied to the first and second sheet materials were 30 to 40 μm and 330 to 350 μm, respectively. In this invention, by controlling the thickness distribution of each coating, the card thickness standard deviation, thickness variation range, and in-plane inclination values were adjusted, and an IC card having the values shown in the examples after punching was obtained.

  The cutting step is preferably performed after the initial curing of the adhesive and the adhesion to the support have been sufficiently performed. In consideration of cutting properties, the adhesive does not necessarily need to be completely cured. The prepared original plate was able to obtain a 55 mm × 85 mm size IC card image recording body by a punching method shown later. When there was no format printing part on the front and back surfaces of the finished card substrate, the logo and OP varnish were printed sequentially by a resin letterpress printing method with a card printer.

[Card punching]
In this cutting process, a card punching machine shown in FIGS. 16 and 17 is used. In this embodiment, the card punching machine is constituted by a punching die device, FIG. 16 is an overall schematic perspective view of the punching die device, and FIG. 17 is a front end view of the main part of the punching die device. It is.

  This punching die apparatus includes a punching die having an upper blade 110 and a lower blade 120. The upper blade 110 includes a punching punch 111 provided with a relief 141 inside an outer edge. Has a punching die 121. An IC card having the same size as the die hole 122 is punched by lowering the punch 111 for punching into a die hole 122 provided at the center of the punching die 121. For this reason, the size of the punch 111 for punching is slightly smaller than the size of the die hole 122. A blade whose upper cutting blade has an angle close to a right angle is generally called a punch die, and a blade having an acute angle is called a hollow blade. The punch die method is usually a drop-off method, but a hollow blade is often provided with an underlay without being removed.

  In the present invention, in consideration of productivity and maintainability, a punched die system having a blade angle of around 90 degrees was used to punch a bonded sheet base material into a card shape.

[Storage of IC card]
The IC cards obtained as described above were loaded in the card magazine having the shape shown in FIG. The card magazine was configured to be mountable in the card printer loading unit shown in FIG. After sealing the magazines, these magazines were stored for 10 days in a 23 ° C. 55% environment.

[IC card creation method]
[Method of describing authentication identification image and attribute information image on IC card]
(Creation of ink sheet for sublimation thermal transfer recording)
A 6 μm-thick polyethylene terephthalate sheet with anti-fusion processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta, and cyan were obtained.
<Coating liquid for yellow ink layer formation>
Yellow dye (MSY Yellow manufactured by Mitsui Toatsu Dye Co., Ltd.) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Coating liquid for forming a magenta ink layer>
Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate modified polystyrene 2 parts [Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution>
Cyan dye (Nippon Kayaku Co., Ltd. Kayaset Blue 136) 3 parts Polyvinyl acetal 5.6 parts [Electrochemical Industry Co., Ltd .: Denkabutyral KY-24]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
20 parts of methyl ethyl ketone (preparation of ink sheet for melt type thermal transfer recording)
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.
<Ink layer forming coating solution>
Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemicals: EV40Y]
Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries, Ltd .: Tamanol 521] 5 parts Methyl ethyl ketone 90 parts (Face image formation)
The image receiving layer or transparent resin portion, the information printing portion and the ink side of the ink sheet for sublimation type thermal transfer recording are overlapped, and the output is 0.23 W / dot and the pulse width is 0.3-4. A human image having gradation in the image was formed on the image receiving layer by heating under conditions of 5 ms and a dot density of 16 dots / mm. In this image, the dye and the nickel of the image receiving layer form a complex.

(Formation of character information)
The transparent resin part and the ink side of the melt type thermal transfer recording ink sheet are overlapped, and the condition of output 0.5 W / dot, pulse width 1.0 ms, dot density 16 dots / mm using the thermal head from the ink sheet side The character information was formed on the IC card image recording body by heating with.

  The face image and attribute information are provided as described above.

[Synthesis of IC card surface protective layer added resin]
[Create IC card surface protection foil]
(Preparation of transfer foil 1)
A transfer foil 1 was prepared by laminating the following composition on a release layer of a polyethylene terephthalate film 2 having a thickness of 25 μm provided with a release layer of a 0.1 μm fluororesin layer.
(Actinic ray curable compound)
Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink surfactant F-179 0.25 part <intermediate layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Curing of the curing agent was performed at 50 ° C. for 24 hours.
<Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts ( Creation of transfer foil 2)
The following composition was laminated | stacked on the mold release layer of the 25-micrometer-thick polyethylene terephthalate film 2 which provided the mold release layer of the 0.1 micrometer fluororesin layer, and the actinic-light curable transfer foil 2 was produced.
(Actinic ray curable compound)
Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink surfactant F-179 0.25 part <intermediate layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Curing of the curing agent was performed at 50 ° C. for 24 hours.
<Barrier layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 1 part Toughtex M-1913 (Asahi Kasei) 8 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1 part Methyl ethyl ketone 90 parts <Adhesive layer forming coating Liquid> Film thickness 0.5μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Co., Ltd .: Hitec S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemical Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts Image The pressure is 150 kg / cm ² using a heat roller having a diameter of 5 cm and a rubber hardness of 85, heated to a surface temperature of 200 ° C. using the transfer foil 1 and the transfer foil 2 having the above-described configuration on the image receptor on which characters are recorded. Then, transfer was performed in the order of transfer foil 1 and transfer foil 2 by heating for 1.2 seconds. The transfer was performed using an IC card making apparatus shown in FIG.

  FIG. 19 shows a card printer as an IC card creation device. In the card printer, a card base material supply unit 10 and an information recording unit 20 are arranged at an upper position, and a transparent protective layer and / or an optical device are arranged at a lower position. A change element transfer layer application part / or resin layer application part 70 is arranged, and thereafter a transparent protective layer and / or an optical change element transfer layer application part / or resin layer application part 70 are arranged, and a card is used as an image recording body. create.

  In the card base material supply unit 10, for example, a plurality of card base materials 50 that have been cut into pieces in advance to write the personal information of the card user created in FIG. Stocked up. In this example, the card substrate 50 includes a support and an image receiving layer, and the card substrate 50 is automatically supplied one by one from the card substrate supply unit 10 at a predetermined timing.

  In the information recording unit 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged correspondingly. While the card substrate 50 is moved by thermal transfer using a thermal transfer sheet such as a yellow ribbon, magenta ribbon, or cyan ribbon, an image area having a gradation such as a photograph of the card user's face is recorded in a predetermined area of the image receiving layer. Is done.

Further, a character ribbon cassette 31 and a recording head 32 are arranged, and authentication identification information such as a name and a card issuance date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon, and an image recording layer is formed. In this information recording unit 20, a gradation information image is formed on the image receiving layer by heating imagewise, and the recording head condition when forming the image is pressurized in the range of 0.01 to 0.3 kg / cm ² , The head is formed at a temperature of 50 to 500 ° C.

  In the transparent protective layer and / or the optical change element transfer layer applying unit / or the resin layer applying unit 70, a transfer foil cassette 71 is arranged, and a thermal transfer head 72 is arranged corresponding to the transfer foil cassette 71. The optical change element transfer foil 43 and / or the transparent protective transfer foil 64 and the curable transfer foil 66 are transferred, and an optical change element transfer layer and / or a transparent protective transfer layer and a curable protective layer-containing transfer layer are provided.

  The evaluation of this example is shown below.

[Card waste]
The number of dusts having a diameter of 0.1 μm or more per IC card generated by peeling off the outer surface and the inside of 100,000 IC cards before printing produced in the examples was measured. 100 or less is a preferable value.

[Card yield]
The amount of adhering dust generated on the card face of 100,000 IC cards before printing produced in the example was confirmed. A card with dust attached cannot be considered as usable and becomes a defective card. The percentage of good cards without trash is shown as a percentage. 99% or more is a preferable range.

[Dust mixing rate after printing]
The 10000 non-defective IC cards produced in the example are continuously printed by the printer shown in the figure, and the ratio of the number of cards in which dust is mixed between the IC card and the protective foil at that time is mixed with dust. Calculated as a rate. The mixing ratio of dust is preferably 2% or less. Dust is caused by dust that appears from the side of the card when the printer is transported. Cards with dust in them cannot be considered usable, resulting in defective cards [Occurrence rate of printing unevenness and density unevenness]
The 10000 IC cards manufactured in the embodiment are continuously printed by the printer shown in FIG. 18, and the ratio of the number of cards in which density unevenness occurs in the printed and image forming portions is defined as the density unevenness occurrence rate. Calculated. The rate of occurrence of printing unevenness and image unevenness is preferably 1.5% or less.

  The results are shown in Table 1.

Table 1

  According to the results of Table 1, in the present invention, in comparison with the comparative example, the card mixed dust, the card yield, the dust mixed rate after printing, the printing unevenness, and the density unevenness generation rate are excellent results. The effect is recognized.

  This invention interposes an adhesive between the first sheet material and the second sheet material, and encloses an inlet having an IC chip on the inlet base material in the adhesive layer to create a card base material However, this card base material can be applied to the manufacture of an IC card having a multilayer structure in which the card base is punched into a card shape, thereby preventing printing blur and image loss and improving the card yield.

It is a schematic block diagram of the manufacturing process of an IC card. It is a figure which shows embodiment of a clean room. It is a figure which shows embodiment of a clean room. It is a figure which shows embodiment of a clean room. It is a figure which shows embodiment of a clean room. It is sectional drawing of the image forming body of the bonded product of an IC card. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows a 1st sheet material (back sheet). It is a figure which shows a 2nd sheet | seat material (front sheet | seat). It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is sectional drawing of a card base original plate. It is sectional drawing of a card base original plate. 1 is an overall schematic perspective view of a punching die device. It is a front end view of the principal part of a punching die apparatus. It is a figure which shows the card printer as an IC card production apparatus.

Explanation of symbols

1 First sheet material (back sheet)
2 Second sheet material (front sheet)
DESCRIPTION OF SYMBOLS 3 Inlet 3a Electronic component 3a1 Antenna 3a2 IC chip 3b Reinforcement board 6,7 Adhesive layer 8a Image receiving layer 8b Personal identification information 8c Transparent protective layer 9a Writing layer 50 Card base material A 1st sheet material supply part B 2nd sheet Material supply unit C1, C2 Adhesive supply unit D Second sheet conveyance member E Inlet supply unit F Back roller unit G Card base material conveyance member H Cutting unit K Collection unit L Storage unit M Punching unit N Loading unit 501, 502, 503 Clean room 700 Magnetic holding member

Claims (18)

An adhesive is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on the inlet base material is enclosed in the adhesive layer to create a card base material. In an IC card manufacturing method having a multilayer structure in which an IC card is produced by punching a base material into a card shape,
An IC card manufacturing method, wherein the IC card is created in an environment of class 100,000 or less. 2. The IC according to claim 1, wherein the creation of the IC card includes at least one of creation of a card base material, storage of the card base material, punching of the card base material, and cartridge loading of the punched IC card. Card manufacturing method. 3. The IC card manufacturing method according to claim 1, wherein the card base material is cut into a single sheet before punching into the card. The IC card manufacturing method according to any one of claims 1 to 3, wherein format printing is performed on the card base material before punching into the card shape. 5. The process from storage of the card base to punching of the card base and loading of the punched IC card in an environment of the class 10,000 or less. 2. The IC card manufacturing method according to claim 1. The IC card manufacturing method according to any one of claims 1 to 5, wherein the IC card is created in an environmental chamber having an apparatus for purifying air through a filter. The IC card manufacturing method according to any one of claims 1 to 6, wherein the inlet stored in a class of 10,000 or less is used. The IC card manufacturing method according to any one of claims 1 to 7, wherein the card base material is stored in a stacked state sandwiched between flat plates until punching. 9. The IC card manufacturing method according to claim 8, wherein the flat plate is a metal plate. An adhesive is interposed between the first sheet material and the second sheet material, and an inlet having an IC chip on the inlet base material is enclosed in the adhesive layer to create a card base material. In a multi-layer IC card manufacturing apparatus that creates an IC card by punching a base material into a card shape,
An IC card manufacturing apparatus comprising a member for holding magnetism for removing dust in at least a part of the step of creating the IC card. The IC card manufacturing apparatus according to claim 10, wherein the member having magnetism is an electromagnet. The IC card manufacturing apparatus according to claim 10 or 11, wherein a magnetic force of the magnetic member is 0.001 Tesla or more and 2 Tesla or less. An IC card manufactured using the IC card manufacturing method according to any one of claims 1 to 9 or the IC card manufacturing apparatus according to any one of claims 10 to 12. 14. The IC card according to claim 13, wherein the number of dust mixed or adhering inside or outside of one card is 100 or less. Having an image receiving layer on at least one side of the first sheet material or the second sheet material;
Provide personal identification information including name, face image by thermal transfer method or inkjet method,
The IC card according to claim 13 or 14, wherein a writable layer is provided on at least a part of the first sheet material or the second sheet material. A transparent protective layer is provided on the top surface provided with personal identification information including the name and face image,
The IC card according to claim 15, wherein the transparent protective layer is made of an actinic ray curable resin. The IC card according to claim 15 or 16, wherein an IC chip is arranged at a position other than a position overlapping the face image portion. The IC card according to any one of claims 13 to 17, wherein the IC card is a non-contact type.

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