JP2003141490A - Ic card and method of manufacturing ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To smooth the surface of an IC card even if the IC card is thin, eliminate irregularity of recording by suppressing the occurrence of recessed and projected irregular parts, and provide a resistance against bending and a point pressure strength load. SOLUTION: In this IC card, a part including an IC module formed of an IC chip and an antenna is installed at a specified position between two opposed support bodies having an image receiving layer at least on one surfaces thereof, having a personal identification information including names and face images by a sublimation heat transfer and/or a melting heat transfer system or an ink jet system, and having a writable writing layer at least at a part thereof. The IC card comprises a reinforcement plate of a combined reinforcement structure adjacent to the IC chip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card incorporating a non-contact type IC module for storing personal information or the like which requires security such as forgery and alteration prevention, and a method of manufacturing the IC card. It is a thing.

[0002]

2. Description of the Related Art Conventionally, a magnetic card for recording data by a magnetic recording system has been widely used as an identification card (ID card), a credit card and the like. However, since data can be rewritten relatively easily with a magnetic card, tampering of the data is not sufficient, it is susceptible to external influences due to magnetism, data protection is not sufficient, and the recording capacity is small. There were problems such as.

Some ID cards have, for example, a face image and written information on the front surface, and a writing layer on the back surface which can be written with a writing implement or the like. Due to recent advances in sublimation printing technology, such ID cards have become easy and inexpensive to make, and have been rapidly spreading for the past several years, but have not yet reached full-scale spread.

An IC chip is built in the inside of the ID card, and the high cost is cited as the biggest impediment factor that has not yet spread in earnest. In addition, it is in a vicious cycle that it cannot be mass-produced because it does not spread, and it becomes expensive.

On the other hand, the quantitative problem is partly due to the fact that a technique for making a card inexpensively and stably has not been established yet. As a conventional method of creating an IC card, for example,
A sheet or sheet that is relatively thick and is made by accommodating IC components and wireless antennas in the upper and lower resin mold covers and then melting and bonding the joint surfaces of the upper and lower covers with heat. There is one that is created by shaving a groove in a material, housing an IC component and a wireless antenna in this groove, sealing this with a resin, and adhering a sheet material for holding an image receiving layer thereon. is there.

[0006]

By the way, the IC card created by the former method is relatively inexpensive when printing only a fixed symbol without a face image or written information as a wireless tag, When printing different facial images and written information on each sheet, it takes time to print the information on a sheet material with another machine, cut it, and attach it to a resin mold cover. It is handmade and very expensive.

The latter method is suitable for making a thin card. However, in this method, since a groove is formed in the sheet material, a thick sheet material is required. The thickness of the sheet material for holding the image receiving layer must be reduced. If it is made thinner, the resin-sealed part will be different in material from the other parts and will heat-shrink when it is cured.Therefore, the surface of the sheet material corresponding to the resin-sealed part will be different from the surface of other parts. I will dent a little. Therefore, when the image receiving layer is attached on the sheet material, a recess is formed at a portion corresponding to the recess of the sheet material. Therefore, when printing is attempted on the portion above the antenna or the IC, the diffusion of the ink to the image receiving layer due to heating of the thermal head becomes poor, and the color becomes light or white is removed. Therefore, it is necessary to exclude the recessed portion of the image receiving layer from the printing area to lay out the card surface, which has a drawback that free expression is restricted. Further, even if the surface is smooth, it is difficult to obtain good printing characteristics because the thermal conductivity is partially different. In particular, when the information is image information having gradation characteristics such as a facial photograph and is formed by the thermal transfer method, there is a great problem in image reproduction.

Then, when a gradation image or a fused image is transferred thermally by a thermal head, the stress of bending along the platen, which is an adhesion mechanism, and the pressure by the head cause disconnection of the connection between the IC built in the IC card and the wiring. The above problem frequently occurs, and the obtained IC card cannot be used as a product at the image forming stage, resulting in a decrease in production efficiency.

Further, when a writing layer capable of writing is provided, the durability against the load on the IC chip due to the writing pressure for writing becomes a problem, and particularly in the case of a thin card, it becomes a serious problem.

In order to deal with these problems, Japanese Unexamined Patent Application Publication No.
No. 131987, a surface support having an image receiving layer on one surface and a thermosetting resin layer on the other surface, and a back surface having a writing layer on one surface and a thermosetting resin layer on the other surface. A method is disclosed in which an IC module is inserted between the thermosetting resin layers of both the support and the support, the substrates are stacked, heated and pressed, and then punched into a predetermined shape to form a card. By this, it is possible to reduce the depression of the surface support corresponding to the IC module, to make the surface smooth and to improve the printing characteristics, and to obtain an inexpensive, mass-produced IC card. Further, regarding the durability due to the destruction of the IC chip due to pressure, bending, etc., and the disconnection of the antenna, Japanese Patent Laid-Open No.
It is disclosed in 199083 and JP-A-8-324166.

However, the IC obtained by this method
The card does not have sufficient flatness, and sublimation heat transfer and / or
Alternatively, when an image is formed by a thermal fusion transfer method or an ink jet method thermal transfer, the image receiving layer is deteriorated depending on the heating temperature, which causes a problem that the image receiving sensitivity is lowered or the image is blurred, and the flatness of the transfer head at the time of image receiving is generated. When a cushion layer is provided between the image receiving layer and the thermosetting resin layer in order to improve the image receiving property,
There is also a problem that the cushion layer is softened and a slight waviness is generated on the IC card, conversely the flatness is deteriorated, and recording unevenness occurs. Further, there remain problems in flatness and resistance to point pressure load against heat and pressure applied to the transfer head at the time of image reception, and against writing pressure applied to the writing layer.

The present invention has been made in view of the above circumstances, and an object thereof is to make it possible to smooth the surface of a thin IC card, suppress uneven unevenness, and prevent uneven recording and bending. IC with excellent resistance to point pressure strength load
A method of manufacturing a card and an IC card.

[0013]

In order to solve the above-mentioned problems and to achieve the object, the present invention has the following constitution.

According to a first aspect of the present invention, "a personal identification information including a name and a face image is provided on at least one side by an image receiving layer on at least one side and a sublimation heat transfer and / or melt heat transfer method or an inkjet method is provided. In an IC card in which a component including an IC module consisting of an IC chip and an antenna is placed at a predetermined position between two opposing supports provided with a writable writing layer, and an adhesive is filled, An IC card comprising a reinforcing plate having a composite reinforcing structure adjacent to an IC chip. ]
Is.

According to the invention described in claim 1, the IC
By providing a reinforcing plate having a composite reinforcing structure adjacent to the chip, the surface of the thin IC card can be smoothed,
It suppresses uneven unevenness to prevent recording unevenness and has excellent resistance to bending and point pressure strength load.

The invention according to claim 2 is that "a reinforcing plate having a composite reinforcing structure is an H structure, a corrugated structure, a laminated panel structure, a honeycomb structure, a concave structure, a blade stringer structure, a Z stringer structure, and an I type. The composite reinforcing structure selected from a stringer structure, a hat type stringer structure, a tube type stringer structure, a grid type panel structure, and a mesh structure.
C card. ].

According to the invention described in claim 2, the reinforcing plate having the composite reinforcing structure is excellent in mechanical strength.

According to a third aspect of the present invention, "an IC chip is installed in a recess of the H structure or the recessed structure, and an antenna is installed so as to extend from an opening of the H structure or the recessed structure, and The IC card according to claim 1 or 2, wherein a ratio of the minimum thickness and the maximum thickness of the H structure or the concave structure is 0.5 or more and less than 1.0. ].

According to the third aspect of the present invention, the reinforcing plate having the H structure or the concave structure is used, and the concave portion of the H structure or the concave structure is used, so that the IC chip and the antenna can be compact. Can be placed, IC
The bending of the chip and the antenna can be suppressed.

According to a fourth aspect of the present invention, "the corrugated structure has a bellows shape having short sides and long sides, and the unevenness of the bellows is provided in the short side direction and I in the long side direction.
3. The I according to claim 1 or 2, wherein the antenna connected to the C chip is present so as to extend.
C card. ].

According to the fourth aspect of the present invention, since the reinforcing plate having the corrugated structure is used and the bellows shape of the corrugated structure is used, the IC chip and the antenna can be arranged compactly, and the IC chip can be compactly arranged. And the bending of the antenna can be suppressed.

According to a fifth aspect of the present invention, "the laminated panel structure is made of a metal plate, a plurality of metal plates are arranged in a tile shape in the same layer, and the metal plates are provided so as to cover the joint portion. The IC card according to claim 1, wherein the IC cards are stacked. ].

According to the invention described in claim 5, strength is provided by using the laminated panel structure made of metal plates,
Moreover, the IC chip and the antenna are arranged compactly,
Moreover, the bending of the IC chip and the antenna can be suppressed.

The invention according to claim 6 is that "the honeycomb structure is made of metal, and the hollow portion is filled with a resin.
card. ].

According to the invention of claim 6, the honeycomb structure is made of metal, and the hollow portion is filled with resin,
It is lightweight and strong, the IC chip and the antenna are compactly arranged, and the bending of the IC chip and the antenna can be suppressed.

The invention according to claim 7 is that "the size of the reinforcing plate having the composite reinforcing structure is larger than the shape of the IC chip and is made of a metal plate. The IC card described in the item. ].

According to the seventh aspect of the present invention, since the size of the reinforcing plate having the composite reinforcing structure is larger than the IC chip shape and is made of a metal plate, the bending of the IC chip can be suppressed.

The invention according to claim 8 is the IC card according to any one of claims 1 to 7, wherein the composite reinforcing structure contains one material having a Young's modulus of 100 GPa or more. ].

According to the invention described in claim 8, the strength can be improved by the composite reinforcing structure containing one kind of material having Young's modulus of 100 GPa or more.

According to a ninth aspect of the present invention, "an IC card in which a component including an IC module including an IC chip and an antenna is placed at a predetermined position between two opposing supports and is filled with an adhesive. 2. An IC card having a reinforcing plate adjacent to the IC chip, and at least one layer of a mesh structure member having a two-dimensional mesh structure having openings in a mesh shape. ].

According to the invention of claim 9, the IC
By having a reinforcing plate adjacent to the chip and having a mesh structure member having a two-dimensional mesh structure having openings in a mesh shape, the surface of a thin IC card can be smoothed and uneven unevenness can be suppressed. There is no recording unevenness, and it has excellent resistance to bending and point pressure strength loads.

According to a tenth aspect of the present invention, "The IC card according to the ninth aspect is characterized in that the mesh has a regular polygonal opening. ].

According to the tenth aspect of the present invention, the mesh sheet as the mesh structure member has openings having a regular polygonal mesh shape, so that a thin IC card can be evenly bent and pressed. Excellent resistance to heavy loads.

The invention described in claim 11 is directed to "opposing 2
In a method of manufacturing an IC card, in which a component including an IC module including an IC chip and an antenna is placed at a predetermined position between two supports, and an adhesive is filled in the IC card manufacturing method, a reinforcing plate and a card are provided adjacent to the IC chip. A method for manufacturing an IC card, comprising a mesh structure member having a two-dimensional structure having a mesh parallel to and perpendicular to the short side, and bonding the mesh structure member along the mesh direction of the mesh structure member. ].

According to the invention of claim 11, I
A two-dimensional mesh structure member having a mesh parallel to and perpendicular to the short side of the reinforcing plate and the card adjacent to the C chip is provided, and the mesh structure member is bonded along the mesh direction to make it thin. The surface can be smoothed even with an IC card, uneven unevenness is suppressed, and there is no recording unevenness.
Excellent resistance to bending and point pressure strength loads.

The invention according to claim 12 is the "opposing 2
In an IC card in which parts including an IC module including an IC chip and an antenna are placed at a predetermined position between two supports and filled with an adhesive, the IC module has a two-dimensional mesh structure having an opening. An IC card, which is formed on a support, has no antenna or IC chip in the opening, and has a reinforcing plate adjacent to the IC chip. ].

According to the invention of claim 12, I
The C module is formed on a support having a two-dimensional mesh structure having an opening, and there is no antenna or IC chip in the opening, and a reinforcing plate is provided adjacent to the IC chip, so that even a thin IC card can be used. The surface can be smoothed, unevenness is prevented from occurring, recording is not uneven, and resistance to bending and point pressure strength load is excellent.

The invention as set forth in claim 13 is directed to "opposing 2
An adhesive is provided on one side of the two supports, an adhesive is provided on the remaining one side, and the two-dimensional mesh structure has an opening at a predetermined position between two opposing supports. An IC module composed of an IC chip and an antenna formed on a support, wherein the antenna and the IC chip do not exist in the opening portion, and a reinforcing plate is provided adjacent to the IC chip, near the IC chip. A method for manufacturing an IC card, characterized in that the openings are provided so as to be unevenly distributed and then bonded together. ].

According to the thirteenth aspect of the present invention, the antenna and the IC chip do not exist in the opening portion, the reinforcing plate is provided adjacent to the IC chip, and the opening portion is unevenly distributed in the vicinity of the IC chip. By providing and sticking the thin IC card, the surface can be smoothed, unevenness can be prevented from occurring, recording unevenness can be prevented, and resistance to bending and point pressure strength load can be excellent.

According to a fourteenth aspect of the present invention, "the antenna is of an etching type.
The IC card described in 1. ].

According to the fourteenth aspect of the present invention, the antenna is formed by the etching method, and the surface of the thin IC card can be smoothed.

The invention as set forth in claim 15 is directed to "two facing each other"
In an IC card in which parts including an IC module composed of an IC chip and an antenna are placed at a predetermined position between two supports and filled with an adhesive, a reinforcing plate is provided adjacent to the IC chip, and An IC card in which adhesives having different elastic moduli in the in-plane direction of the card are provided in a stripe shape. ].

According to the invention of claim 15, I
By having a reinforcing plate adjacent to the C chip and providing adhesives with different elastic moduli in the in-plane direction of the card in a stripe shape, the surface can be smoothed even with a thin IC card, and unevenness is generated. To prevent uneven recording, and
Excellent resistance to bending and point pressure strength loads.

According to the sixteenth aspect of the invention, there are two "opposing two".
An adhesive is provided in a stripe shape on one of the two supports, an adhesive is provided on the remaining one of the supports, and an IC including an IC chip and an antenna is provided at a predetermined position between two opposing supports. A method of manufacturing an IC card, characterized in that a component including a module is provided, and the components are attached along the stripe direction. ].

According to the sixteenth aspect of the present invention, a component including an IC module including an IC chip and an antenna is provided at a predetermined position between two opposing supports, and the component is attached along the stripe direction of the adhesive. By combining, thin I
The surface can be smoothed even with a C card.

According to a seventeenth aspect of the present invention, "Adhesives having different elastic moduli are used, an adhesive having a high elastic modulus is used for the support on one side, and an adhesive having a low elastic modulus is used for the support on the other side. 17. The method of manufacturing an IC card according to claim 16, wherein: ].

According to the seventeenth aspect of the invention, by using the adhesives having different elastic moduli, the surface of the thin IC card can be further smoothed.

The invention described in claim 18 is the "opposing 2
In an IC card in which parts including an IC module composed of an IC chip and an antenna are placed at a predetermined position between two supports and filled with an adhesive, a reinforcing plate is provided adjacent to the IC chip, and The adhesive to be filled is composed of at least two kinds of adhesives having different elastic moduli, and the adhesive having a high elastic modulus is provided on one of the supports with an uneven shape,
An IC card characterized in that an adhesive having a low elastic modulus is provided in a recess. ].

According to the eighteenth aspect of the present invention, the adhesive having a high elastic modulus is provided on one of the supports in an uneven shape, and the adhesive having a low elastic modulus is provided in the recess. As a result, the surface of the thin IC card can be smoothed, unevenness is prevented from occurring, recording is not uneven, and resistance to bending and point pressure strength load is excellent.

The invention as set forth in claim 19 is the "opposing 2
An adhesive with a high elastic modulus is provided on one of the two supports, and unevenness is applied by embossing rolls, and an adhesive with a low elastic modulus is provided on the other one of the supports, so that a gap between two opposing supports is provided. A method of manufacturing an IC card, characterized in that a component including an IC module composed of an IC chip and an antenna is provided at a predetermined position of and bonded to each other. ].

According to the nineteenth aspect of the present invention, one of the two opposing supports is provided with an adhesive having a high elastic modulus, the embossing roll is used to make the surface uneven, and the remaining one side is supported. By providing an adhesive with a low elastic modulus on the body and sticking it together, the surface can be smoothed even with a thin IC card, uneven unevenness is suppressed and recording unevenness does not occur, and
Excellent resistance to bending and point pressure strength loads.

According to a twentieth aspect of the present invention, the IC card according to the nineteenth aspect is characterized in that "the adhesive having a low elastic modulus is present at the edge of the reinforcing plate. ].

According to the twentieth aspect of the present invention, since the adhesive having a low elastic modulus is present at the edge portion of the reinforcing plate, the adhesive adheres to the reinforcing plate to surely protect the IC chip. Is.

The invention described in claim 21 is characterized in that "the adhesive to be filled is a reactive hot melt adhesive, claim 1 to claim 12, claim 14, claim 14 and claim The IC card according to claim 15, claim 18, or claim 20. ].

According to the twenty-first aspect of the present invention, the filled adhesive is a reactive hot melt adhesive,
It has excellent durability and is suitable for low temperature processing.

The invention described in claim 22 is characterized in that "the adhesive to be filled is a reactive hot melt adhesive," claim 13, claim 16, claim 17, claim 17, Item 20. A method of manufacturing an IC card according to any one of Items 19. ].

According to the twenty-second aspect of the present invention, the filled adhesive is a reactive hot melt adhesive,
It has excellent durability and is suitable for low temperature processing.

According to a twenty-third aspect of the present invention, "Individual identification information including a name and a face image is provided on at least a part of an image receiving layer having at least one surface by a sublimation heat transfer and / or melt heat transfer method or an ink jet method. A writing layer capable of writing is provided, wherein the writing layer is provided in claim 9, claim 10, claim 12, claim 14, claim 15, and claim 1.
The IC card according to claim 8 or claim 20. ]
Is.

According to the twenty-third aspect of the invention, it can be used as an identification card (ID card), a credit card, or the like.

The invention described in claim 24 is characterized in that "a transparent protective layer is provided on an upper surface on which personal identification information including a name and a face image is provided, and the transparent protective layer is made of an actinic ray curable resin. The IC card according to any one of claims 1 to 10, claim 12, claim 14, claim 15, claim 18, and claim 20. ].

According to the twenty-fourth aspect of the present invention, the transparent protective layer is provided on the upper surface on which the personal identification information including the name and the face image is provided, which is durable.

[0062]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an IC card and a method for manufacturing an IC card of the present invention will be described with reference to the drawings, but the present invention is not limited thereto as long as it is in the spirit.

FIG. 1 is a diagram showing the layer structure of an IC card. The IC card of this embodiment has an I card at a predetermined position between the opposing one-side support 1 and the remaining one-side support 2.
A component 3 including an IC module composed of a C chip 3a and an antenna 3b is placed and filled with an adhesive to form an adhesive layer 4,
5 are provided.

The support 1 on one side has an image receiving layer 6 on one side, and this image receiving layer 6 is provided with personal identification information 7 including a name and a face image by a sublimation heat transfer and / or melt heat transfer method or an ink jet method. It is provided. The image receiving layer 6 provided with this personal identification information 7 is protected by a protective layer 8. The remaining support 2 on one side is provided with a writable writing layer 9.

A reinforcing plate 10 having a composite reinforcing structure is provided adjacent to the IC chip 3a. The component 3 including the IC module and the reinforcing plate 10 are supported by mesh sheets 11 and 12 as a mesh structure member having a two-dimensional mesh structure.

Before being heated, the surface support, which is the support 1 on one side, has an image receiving layer for ink jet or a sublimation heat transfer receiving layer on one side of the film support and an adhesive layer on the other side. However, the present invention is not limited to this.

The image receiving layer 6 is a layer capable of receiving an image, and is made of a material that traps and fixes the dye when the sublimation dye or the diffusion dye is heated by the thermal head and thermally diffuses. However, a polymer material such as polyvinyl chloride resin, polyester resin, polyvinyl acetal resin, polyvinyl butyral resin, epoxy resin, acrylic resin, etc. is known as a good material for the image receiving layer. Generally, these materials for the image receiving layer 6 are made into powder and dissolved in a solvent such as methyl ethyl ketone,
It is preferable that the film is formed by applying it with a gravure coater or the like, then drying it and evaporating the solvent, but the present invention is not limited to this.

In order to form an image on the image receiving layer 6, a thermal head is brought into contact with the surface of the IC card to thermally diffuse the sublimation dye or the diffusion dye, so that the image becomes clear and is diffused per unit time. This is preferable because the amount of dye to be added increases, but the present invention is not limited to this. In this case, in order to form an image on the image receiving layer, the applied pulse width of the thermal head is changed so that the thermal head gives gradation to each dot, and the thermal diffusion amount of the sublimation dye or the diffusion dye is controlled. Preferably.

The film support is made of, for example, polyethylene terephthalate (PET) or polypropylene (PP), or PET in which a white pigment is mixed and air bubbles are folded in a honeycomb structure in order to enhance the image formed.
-G (manufactured by Eastman Kodak Company) or the like is preferable, and in particular, biaxially stretched resin, specifically 2
An axially stretched polyester film is preferable because it is strong even if it is thin, but the present invention is not limited to this.
The thickness of the biaxially stretched polyester film is preferably 12 μm or more (more preferably 25 μm or more), and 30
It is preferably 0 μm or less (more preferably 250 μm or less).

To form an image on the image receiving layer 6, the applied pulse width of the thermal head is changed to control the thermal diffusion amount of the sublimation dye ink so that the thermal head gives gradation to each dot. At this time, if the film support has a honeycomb structure with air bubbles, the contact with the thermal head is uniform and the heat insulation is good, so that the dots are well cut and a good image can be obtained.

These layers preferably contain a white pigment, and known pigments such as titanium oxide, barium sulfate and calcium carbonate can be used. A polyester film (specific gravity 1.38 or less) that contains a white pigment and is biaxially stretched to form voids to increase whiteness is preferable in terms of heat insulation and cushioning.

The adhesives constituting the adhesive layers 4 and 5 are preferably hot-melt adhesives, and more preferably hot-melt adhesives.

As the hot melt adhesive used in the IC card of the present invention, a commonly used one can be used. Examples of the main component of the hot melt adhesive include ethylene / vinyl acetate copolymer (EVA) type, polyester type, polyamide type, thermoplastic elastomer type,
Examples include polyolefin type. As the polyamide hot melt adhesive, there is Macromelt series manufactured by Henkel, and as the thermoplastic elastomer hot melt adhesive, Shell Chemical Co., Ltd. Califlex TR.
And Clayton series, Asahi Kasei's tough plane, Fi
restore Synthetic Rubber a
nd Latex Tuffden, Phillips P
Examples include Sopren 400 series manufactured by Etroleum. Sumitomo Chemical's Sumitic, Chisso Petrochemical's Vistac, Mitsubishi Yuka's Yutakac, Henkel's Macromelt series, Mitsui Petrochemical's Tuffmer, Ube Lexen's APAO, Eastman Chemical Made East Bond,
There is A-FAX manufactured by Hercules. When the resins having different elastic moduli are used in the present invention, it can be selected from the above.

In the present invention, the hot melt adhesive is preferably reactive. Reactive hot melt adhesive (hereinafter,
A reactive adhesive is a type of adhesive in which a resin is melted and adhered, and then moisture is absorbed to cure the resin. Its characteristic is that it has a curing reaction compared to ordinary hot melt, and that it has a long bondable time and a high softening temperature after bonding, so it is highly durable and suitable for low-temperature processing. Is mentioned. As one example of the reactive adhesive, there is one in which an isocyanate group-containing urethane polymer is the main component at the molecular end, and this isocyanate group reacts with water to form a crosslinked structure.

Examples of reactive adhesives that can be used in the present invention include TE030 and TE100 manufactured by Sumitomo 3M, Hibon 4820 manufactured by Hitachi Chemical Polymer Co., Ltd., Bondmaster 170 series manufactured by Kanebo UNC, and Macroplast QR 3460 manufactured by Henkel. . In this invention, it is preferable to use resins having different elastic moduli. It is preferable to use a resin having a different elastic modulus because a resin having a high elastic modulus exhibits a skeleton function, and a resin having a low elastic modulus can be filled with fluidity and smoothed when a support is bonded. Further, the shape is changed to a so-called beam even if it is deformed, and the resistance is improved.

An example of the method of manufacturing the IC card of the present invention using a hot melt adhesive will be described below. In producing an IC card, first, a hot melt adhesive is applied to the front and back sheets with an applicator to a predetermined thickness. As a coating method, a usual method such as a roller method, a T-die method, or a die method is used. In the case of coating in a stripe shape in the present invention, there is a method of intermittently providing an opening portion for the T die slit, but the method is not limited to this. Further, as a method of making the adhesive surface of the present invention uneven, there is a method of subjecting the adhesive surface coated by the above method to pressure treatment with an embossing roll. An IC member is mounted between the upper and lower sheets coated with the adhesive. The adhesive applied may be preheated with a heater or the like before mounting. After that, the IC member mounted between the upper and lower sheets is pressed with a press heated to the bonding temperature of the adhesive for a predetermined time, or instead of rolling by the press, the sheet is conveyed in a constant temperature layer while being rolled. May be rolled in. Further, vacuum pressing may be performed in order to prevent bubbles from entering during bonding. After pasting with a press or the like, it is punched into a predetermined shape and cut into a card shape to form a card. When a reactive adhesive is used as the adhesive, it is cured for a predetermined time and then cut into a card. It is effective to make a hole around the card size of the laminated sheets to accelerate the curing, in order to supply water necessary for the reaction.

As for the electronic parts in the present invention, a coil type one in which a winding coil and an IC chip are joined, or a print support having an antenna pattern formed thereon is used.
A print support type in which a C chip is joined is used. A reinforcing plate 10 is provided adjacent to the IC chip.

The IC module composed of the IC chip and the antenna according to the present invention has an inlet shape provided adjacent to the mesh sheets 11 and 12 having the mesh of the two-dimensional mesh structure. A coil type in which a winding coil and an IC chip are joined is provided on the mesh sheets 11 and 12 having a mesh with a two-dimensional mesh structure, or a sandwiched shape is used. Also,
It is preferable that a support of the print support type in which an IC chip is joined to the print support on which an antenna pattern is formed has a shape obtained by punching.

The reinforcing plate 10 of the present invention has a composite reinforcing structure excellent in mechanical strength. Since the card becomes thicker, the reinforcing plate having the composite reinforcing structure is preferably made of high-strength material. In particular, it is preferable that a material having a Young's modulus of 100 GPa or more is used for the main structure. A reinforcing plate having a composite reinforcing structure has an H structure, a corrugated structure, a laminated panel structure, a honeycomb structure, a concave structure, a blade stringer structure, a Z stringer structure, an I stringer structure, a hat stringer structure, a tube stringer structure, It is particularly preferable to have a composite reinforcing structure selected from a grid type panel structure and a mesh structure.

The back side support which is the remaining one side support 2 before heating preferably has a writing layer on one side of the support and an adhesive layer on the other side, but the present invention is not limited to this. I can't. For example, a part of the writing layer may be used, or a fiber support may be used instead of the film support. The film support may have any original required function, but when the card is heated under pressure, the warp is smaller when the upper and lower material configurations are symmetrical, and a flat surface is obtained, so the film support It is preferable that it has the same structure as the above.

The film support preferably has a bubble-containing structure or has a cushion layer, but the present invention is not limited to this. Further, it is preferable to provide an adhesive layer provided on the front surface support and an adhesive layer having an elastic modulus different from that of the adhesive layer provided on the back surface support. The present invention is not limited to this as long as it does not deviate from the gist of the present invention.

The writing layer 9 is preferably, for example, a polyester emulsion in which calcium carbonate, silica fine particles and the like are diffused. Like the image receiving layer of the surface support, the writing layer 9 is dissolved in a solvent and coated with a gravure coater or the like, and then dried. However, the present invention is not limited to this. The thickness of the writing layer is preferably about the same as that of the image receiving layer, but the present invention is not limited to this.

This writing layer preferably has a fine uneven surface on the surface of the writing layer in order to improve writing performance in order to improve writing performance, but the present invention is not limited to this.

A surface support having an image receiving layer on one surface side and an adhesive layer on the other surface side as shown in FIG. 1, and a back surface support having a writing layer on one surface side and an adhesive layer on the other surface side. The body, for example, so that the adhesive layers thereof are spaced apart and face each other, the component 3 is inserted between the adhesive layers of the front surface support and the back surface support, and then the front surface support and the back surface support are superposed. By heating together, an adhesive layer having the component 3 is formed between the front surface support and the back surface support to manufacture an IC card.

As a method of recording a gradation image on an IC card, it is preferable to thermally diffuse a sublimation dye or a diffusion dye by thermal transfer and trap the sublimation dye or the diffusion dye in the image-receiving layer to fix it.

Examples of the thermal transfer include a method of writing a thermal transfer image with a thermal head and a method of transferring a recorded image from an image sheet on which an image has already been recorded, but the present invention is not limited to these. Further, as the thermal transfer, sublimation transfer recording is preferable, and the sublimation dye or the diffusion dye is preferably a post-chelate type dye capable of forming a chelate in the image receiving layer. The image-receiving layer preferably contains a metal compound capable of chelating the post-chelate dye. As such a metal compound, an inorganic or organic salt of a metal ion or a metal complex is preferable.

Image recording is performed by forming a protective layer using a thermal transfer sheet on an image on the information carrying layer provided with at least one selected from an authentication identification image such as a face image, an attribute information image and format printing, or a printing surface side. It was formed.

As a method of forming an authentication identification image represented by a face image, there is a sublimation type thermal transfer recording method which is advantageous for forming a gradation image, and in recent years, it is generally represented by a driver's license. Has become.

The personal identification information includes name, address, date of birth,
It is a qualification and the personal identification information is usually recorded as character information, and a fusion type thermal transfer recording method is generally used. The format printing is performed by a printing method such as resin letterpress printing, lithographic printing, silk printing or the like on the substrate or on the image receiving layer used in the sublimation type thermal recording system.

It is preferable to provide a protective layer on the surface on which the image is recorded. The protective layer is not particularly limited as long as it is transparent and has a protective effect, but an actinic ray curable resin is particularly preferable. It can be provided on the upper surface of the recorded image by a transfer foil made of an actinic ray curable resin. The transfer of the transfer foil to the material to be transferred is usually performed using a means such as a thermal head, a heat roller, a hot stamping machine or the like that can apply pressure while heating.

As described above, in this embodiment, by providing the reinforcing plate 10 having the composite reinforcing structure adjacent to the IC chip 3a, the surface of the thin IC card can be smoothed and unevenness is not generated. It suppresses and has no recording unevenness, and has excellent resistance to bending and point pressure strength load.

An example of the reinforcing plate 10 having a composite reinforcing structure is shown in FIGS. The reinforcing plate 10 of FIG. 2 has an H structure, the reinforcing plate 10 of FIG. 3 has a concave structure, the IC chip 3a is installed in these recesses 10a, and the antenna 3b is opened from the opening 10a1 of the H structure or the concave structure. Is installed so as to extend, and the minimum thickness of the H structure or the concave structure,
The ratio of the maximum thickness is 0.5 or more and less than 1.0. As described above, the use of the concave portion 10a having the H structure or the concave structure has strength, and the IC chip 3a and the antenna 3b are compactly arranged. Nonwoven fabric is used as the mesh sheets 11 and 12 having a two-dimensional mesh structure.

The reinforcing plate 10 of FIG. 4 has a corrugated structure, and the corrugated structure has a bellows shape having a short side D1 and a long side D2, and the unevenness of the bellows 10b is provided in the short side direction and the long side is formed. The antenna 3b connected to the IC chip 3a extends in the direction. In this way, by utilizing the bellows shape of the corrugated structure, the IC chip 3a and the antenna 3 have strength against bending of the long side D2.
b is compactly arranged, and bending of the IC chip 3a and the antenna 3b can be suppressed.

The reinforcing plate 10 of FIG. 5 has a laminated panel structure made of a metal plate 10c, and a plurality of metal plates 10c are arranged in a tile shape in the same layer, and the metal plates 10c are laminated so as to cover the joint portion. Has been done. In this way, the metal plate 10c
It has strength due to the laminated panel structure consisting of
The chip 3a and the antenna 3b are compactly arranged, and the bending of the IC chip 3a and the antenna 3b can be suppressed.

In the reinforcing plate 10 of FIG. 6, the honeycomb structure is made of metal, and the hollow portion 10d is filled with the resin 13.
As described above, the honeycomb structure is made of metal, and the hollow portion 10d is filled with the resin 13. Therefore, the honeycomb structure is lightweight and strong,
Moreover, the IC chip 3a and the antenna 3b are compactly arranged, and the bending of the IC chip 3a and the antenna 3b can be suppressed.

Further, the reinforcing plate 10 has a blade type stringer structure, a Z
A type stringer structure, an I type stringer structure, a hat type stringer structure, a tube type stringer structure, a grid type panel structure, a mesh structure and the like can be used.

Reinforcement plate 1 having such a composite reinforcement structure
0 is preferable because the size is larger than the shape of the IC chip and is made of a metal plate because bending of the IC chip can be suppressed, and it is preferable that the composite reinforcing structure contains one material having a Young's modulus of 100 GPa or more because strength can be improved.

Next, another embodiment of the IC card and the method of manufacturing the IC card of the present invention will be described.

As shown in FIG. 1, the IC card of this embodiment has an IC chip 3a and an antenna 3b at a predetermined position between two opposing one-side supports 1 and the remaining one-side supports 2. The component 3 including the IC module consisting of is placed, the adhesive layers are filled with the adhesive, and the adhesive layers 4 and 5 are provided.
The reinforcing sheet 10 is provided adjacent to the chip 3a, and mesh sheets 11 and 12 are provided as a mesh structure member having a two-dimensional mesh structure having openings in a mesh shape. The mesh sheets 11 and 12 have at least one layer. All you have to do is do it.

As described above, in this embodiment, the mesh sheets 11 and 12 are provided as the mesh structure member of the two-dimensional mesh structure having the reinforcing plate 10 adjacent to the IC chip 3a and having the mesh-like openings. By having such a thin IC card, the surface can be smoothed, unevenness can be prevented from occurring, recording unevenness can be prevented, and resistance to bending and point pressure strength load can be excellent.

Further, as shown in FIG. 7, the mesh sheets 11 and 12 serving as the mesh structure members have openings having a regular mesh shape in a polygonal shape, so that a thin IC card can be evenly bent and pressed. Excellent resistance to heavy loads.

Further, as shown in FIGS. 8 and 9, the IC card of this embodiment has a two-dimensional structure having a mesh adjacent to the IC chip 3a and parallel to the reinforcing plate 10 and the short side of the card. Mesh sheet 1 as a structural mesh structural member
1 and 12 are produced by laminating the mesh sheets 11 and 12 along the mesh direction.

In the IC card of this embodiment, as shown in FIG. 10, the IC module is formed on a support 15 having a two-dimensional mesh structure having an opening, and an antenna 3b and an antenna 3b are provided in the opening 15a. IC chip 3a does not exist,
A reinforcing plate 10 is provided adjacent to the IC chip 3a. In this IC card, the antenna 3b and the IC chip 3a are not present in the opening 15a of the support 15 having a two-dimensional mesh structure having an opening, and the reinforcing plate 10 is provided adjacent to the IC chip 3a. The IC card is manufactured by providing the openings in the vicinity of the chip 3a so that the openings are unevenly distributed and bonding them together. Also,
Since the antenna 3b is formed by an etching method, the surface of the thin IC card can be smoothed, unevenness is prevented from being generated, recording is not uneven, and resistance to bending and point pressure strength load is excellent.

The mesh structure member used in the present invention has a two-dimensional mesh structure. The two-dimensional mesh structure has an opening in the depth direction, and parts other than the opening are connected or integrated to form a sheet structure in the plane direction. For example, the following materials can be used as long as they meet the purpose of the present invention.
There are mesh fabrics such as non-woven fabrics, plain weaves, twill weaves, and satin weaves. Also, moquette, plush velour,
A woven fabric having a pile called a seal, a velvet, or a suede can be used.

In the present invention, it is preferable that the openings have a regular polygonal shape. The polygonal shape can be created by embossing a plastic sheet and stretching it. Further, a member obtained by punching a plastic sheet can be used. Materials include polyamides such as nylon 6, nylon 66 and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohols, polyvinylidene chloride,
Synthetic resins such as polyvinyl chloride, polyacrylonitrile, acrylamide, methacrylamide, and other acrylics, polyvinylidene cyanide, polyfluoroethylene, polyurethane, and other synthetic resins; silk, cotton, wool, cellulose, cellulose ester, and other natural fibers , 1 or 2 selected from regenerated fibers (rayon, acetate) and aramid fibers
Fibers that combine more than one kind can be raised. Among these fiber materials, rayon which is preferably polyamide type such as nylon 6 or nylon 66, acrylic type such as polyacrylonitrile, acrylamide or methacrylic acid, polyester type such as polyethylene terephthalate, cellulose type as regenerated fiber or cellulose ester type is preferable. And acetate and aramid fiber.

As shown in FIGS. 11 and 12, the IC card of this embodiment has an IC chip 3a and an antenna 3 at a predetermined position between two opposing supports 1 and 2.
The component 3 including the IC module composed of b is placed, the mesh sheet 20 is provided as a mesh structure member having a two-dimensional mesh structure having openings in a mesh shape, and the adhesives 21 and 22 are filled therein. This IC card has a reinforcing plate 10 adjacent to the IC chip 3a, and adhesives 21 and 22 having different elastic moduli in the in-plane direction of the card are provided in a stripe shape, and the adhesive 21 has a low elastic modulus. And the adhesive 22 has a high elastic modulus.

In this IC card, adhesives 21 and 22 are provided in stripes on two opposing supports 1 and 2, and the IC chip is provided at a predetermined position between the two opposing supports 1 and 2. A component 3 including an IC module composed of 3a and an antenna 3b is provided and bonded together along the stripe direction to manufacture. In this embodiment, the adhesives 21 and 22 having different elastic moduli are used, the adhesive 22 having a high elastic modulus is used for the support 2, and the adhesive 21 having a low elastic modulus is used for the support 1.

Further, as shown in FIGS. 13 and 14, the IC card of this embodiment has the reinforcing plate 10 adjacent to the IC chip 3a and is filled with the adhesive 21, 22.
Are made of at least two kinds of adhesives having different elastic moduli, an adhesive 22 having a high elastic modulus is provided on one of the supports 2 in an uneven shape, and an adhesive 21 having a low elastic modulus is a concave portion 22a.
It is provided in.

In the IC card of this embodiment, one of two facing supports is provided with adhesive 22 having a high elastic modulus on one support 2 and is embossed by an embossing roll to provide support 1 on one side. An adhesive 21 having a low elastic modulus is provided. Then, the IC is placed at a predetermined position between the two opposing supports 1 and 2.
By providing and bonding the component 3 including the IC module including the chip 3a and the antenna 3b, the surface can be smoothed even with a thin IC card, and uneven unevenness can be suppressed to prevent uneven recording, and to prevent bending and dots. Excellent resistance to compressive load.

Since the adhesive 21 having a low elastic modulus is present at the edge portion of the reinforcing plate 10, the adhesive adheres to the reinforcing plate 10 and the IC chip is surely protected.

Here, I using the hot melt adhesive
An example of a C card manufacturing method will be given.

In manufacturing an IC card, first, a hot melt adhesive is applied to the front and back sheets with an applicator to a predetermined thickness. Roller method, T
Normal methods such as die method and die method are used.
The IC unit is mounted between the upper and lower sheets coated with the adhesive. The adhesive applied before mounting may be preheated with a heater or the like. Then IC between the upper and lower sheets
Press the unit mounted with a press heated to the bonding temperature of the adhesive for a predetermined time, or press a roll while transporting the sheet in a constant temperature layer of a predetermined temperature instead of pressing the press. Good. Further, vacuum pressing is effective in order to prevent bubbles from entering during bonding. After they are stuck together by a press or the like, they are punched out into a predetermined shape and cut into a card to make a card.
When a reactive adhesive is used as the adhesive, it is cured for a predetermined time and then cut into a card. It is effective to form a hole around the card size of the laminated sheets to accelerate the curing and to supply water necessary for the reaction.

FIG. 15 is a diagram showing an IC card manufacturing apparatus. The IC card manufacturing apparatus is provided with a delivery shaft 210 for delivering the roll-shaped surface support 201, and the surface support 201 delivered from the delivery shaft 210 is a roller 2.
23 and 224 are supplied and supplied.

An extrusion die 240 facing the surface support 201 is arranged. The extrusion die 240 emits thermosetting resin and passes through the surface support 201 to form an adhesive layer.

Further, the IC card manufacturing apparatus is provided with a delivery shaft 250 for delivering the roll-shaped back surface support 204, and the back surface support 20 delivered from this delivery shaft 250.
4 is supplied by being stretched over rollers 251 and 252.

An extrusion die 242 is arranged to face the back surface support 204. The extrusion die 242 emits a thermosetting resin and passes through the back surface support 204 to form an adhesive layer.

The surface support 20 thus formed
1 and the back surface support member 204 are in contact with each other while being separated from each other and are conveyed along the conveyance path 270. At positions where the front surface support 201 and the back surface support 204 are spaced apart and face each other, the components 206 each including an IC module including an IC chip and an antenna are taken out and inserted one by one.

In the conveyance path 270 of the IC card manufacturing apparatus, the pressure heating section 272, the coating section 290, and the cutting section 2 are arranged along the conveyance direction of the front surface support 201 and the back surface support 204.
84 and a punching unit 273 are arranged along the transport direction.

The pressurizing and heating unit 272 has a flat hot press upper die 272a and a hot press lower die 272b, which are arranged to face each other above and below the transport path 270. The hot press upper die 272a and the heat press lower die are provided. The 272b are provided so as to be movable in a direction in which they approach and separate from each other.

Heat Press Upper Die 272a and Lower Die 272b
Although it is possible to use a heat roller instead of a flat type, a flat press type is used to avoid a roller which is close to line contact and to which an excessive bending force is applied even if it is slightly displaced.

In the coating section 290, an image receiving layer coating liquid container 290a is provided above the conveying path 270, and the image receiving layer coating liquid is coated on one surface side of the surface support 201 by the image receiving layer coating liquid container 290a to reverse coater. The image receiving layer is formed on the surface by the method.

In the coating section 290, a writing layer coating liquid container 290b is provided below the transport path 270, and the writing layer coating liquid container 290 applies the writing layer coating liquid to one surface side of the back support 204. A writing layer is formed on the surface by the reverscota method.

The cutting section 284 is composed of a cutter upper mold 284a and a cutter lower mold 28, which are arranged to face each other above and below the transport path 270.
The front surface support 201 and the back surface support 204, which have 4b and are bonded to each other, are cut to form a sheet.

The sheet is supplied to the punching unit 273. The punching unit 273 includes a card punching upper die 273a and a card punching lower die 273b which are arranged so as to face each other above and below the transport path 270.
Consists of. After the sheet materials of the individual sheets are completely heat-welded, they are integrated and then punched into the size of an IC card. [Examples] Hereinafter, the present invention will be described in detail with reference to Examples, but the embodiments of the present invention are not limited thereto. In addition,
In the following, "part" means "part by weight". (Preparation of adhesive) Adhesive 1 Macroplast QR3460 manufactured by Henkel
(Moisture-curable adhesive) was used. <Tensile elastic modulus; 180 MPa> Adhesive 2 • Sekisui Chemical Co., Ltd. Esdyne 9631S 95 parts • Porous high silica aluminosilicate (AMT-SILICA # 200B; Mizusawa Chemical Co., Ltd.) 5 parts The above components at a temperature of 150 ° C. for 60 minutes Then, the mixture was stirred with a homogenizer to prepare an adhesive 2. <Tensile Elastic Modulus; 306 MPa> (Measurement of Physical Properties of Adhesive) [Measurement of Tensile Elastic Modulus] Adhesives 1 and 2 are bonded together with a spacer having a thickness of 300 μm by using a hot press machine.
Sandwiched between release PET films with a thickness of 0 μm, 100 ℃
And 5 kg / cm ² for 3 minutes and then left for 7 days under the conditions of temperature 25 ° C. and humidity 50% RH to remove the release PET film to obtain a thickness of 300
An adhesive after curing of μm was obtained.

The adhesive sheet obtained in this manner was used as a universal testing machine for Orientec Tensilon RTA-
Tensile modulus and tensile elongation at break were measured using 100 according to ASTM D638. (Fabrication of IC module) IC module 1; forming a winding type antenna,
IC chips with a thickness of 70 μm and 4 × 4 mm square are joined together to make SU
Maximum thickness 1 consisting of S304 (Young's modulus 197 MPa)
50μm Minimum thickness 100μm 6x6mm square reinforcing plate with H-shaped composite reinforcing structure on the side opposite to the circuit surface
An IC module was obtained by adhering the IC module so that the IC module entered the concave portion of the shape.
Next, the IC module was sandwiched from both sides with a non-woven fabric made of polyethylene terephthalate fiber and at least a part of the weave of the fiber was adhered to produce an IC module 1.
As shown in FIG.

IC module 2; reinforcing plate having a maximum thickness of 15
The IC module 1 was manufactured in the same manner as the IC module 1 except that the corrugated shape was 0 μm. As shown in FIG.

IC module 3; reinforcing plate having a maximum thickness of 50
It was produced in the same manner as the IC module 1 except that three flat plates each having a thickness of μm were alternately stacked. As shown in FIG.

IC module 4; reinforcement plate having a maximum thickness of 12
It was produced in the same manner as the IC module 1 except that the concave shape having a minimum thickness of 0 μm and the thickness of 100 μm was adopted and the chip was adhered so as to enter the concave portion. As shown in FIG.

IC module 5; reinforcing plate has a maximum thickness of 15
The IC module 1 was manufactured in the same manner as the IC module 1 except that the honeycomb shape was 0 μm. As shown in FIG.

IC module 6; a sheet obtained by embossing polyethylene from the IC module and extending it, and the opening is quadrangular and the long side and the short side are substantially at right angles (Delnet; manufactured by Sanki)
It was produced in the same manner as the IC module 1 except that it was sandwiched from both sides by a mesh sheet consisting of. It shows in FIG.

IC module 7: A thickness of 70 is added to a print support on which an antenna pattern is formed by etching.
SUS304 by joining IC chips of μm, 4 × 4mm square
(Young's modulus 197 MPa) maximum thickness 110 μm
A reinforcing plate having a 6 × 6 mm square H-shaped composite reinforcing structure having a minimum thickness of 100 μm was adhered to the side opposite to the circuit surface so that the IC chip could enter the H-shaped concave portion to obtain an IC module. Then, the print support is perforated to form an IC module 7
Was produced. As shown in FIG.

IC module 8: The IC module was the same as the IC module 1 except that the IC module was made of polyethylene terephthalate fiber and was bonded at least on one side with a non-woven fabric in which the weave of the fiber was at least partially adhered.

IC module 9; thickness 15 on a printed support on which an antenna pattern is formed by etching.
0 μm, 4 × 4 mm square IC chip bonded together and made of aluminum (Young's modulus 69 MPa) with a thickness of 100 μm 6
A 6 mm square reinforcing plate was adhered to obtain an IC module. <Example 1> [Creation of IC card] The IC card and the personal authentication card of the present invention are laminated as shown in FIG.

As the support, a white polyester sheet having a thickness of 100 μm and a thickness of 75 μm having a moisture permeability of 22 (g · 25 μm / m ² , 24 hr) according to JIS K7128-Z0208 was used as the front surface support and the back surface support. . (Preparation of surface support) A first coating liquid for forming an image receiving layer, a coating liquid for forming a second image receiving layer, and a coating liquid for forming a third image receiving layer having the following composition were formed on a surface of a support 100 μm subjected to corona discharge treatment. Coating and drying in this order, each thickness 0.2μm, 2.5
An image receiving layer was formed by laminating the layers so as to have a thickness of 0.5 μm and 0.5 μm. <Coating liquid for forming first image-receiving layer> Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BL-1] 9 parts Isocyanate [Nippon Polyurethane Industry Co., Ltd .: Coronate HX] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second image receiving layer> Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 6 parts Metal ion-containing compound (compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts < Third image-receiving layer-forming coating liquid> Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitec E1000] Urethane-modified ethylene acrylic acid copolymer 8 parts [Toho Chemical Industry Co., Ltd .: Hitec S6254] Methylcellulose [ Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part water 90 parts (format printing The resin relief printing method, logo and O
P varnish was printed sequentially. (Preparation of back surface support) (Preparation of writing layer) On the surface of the support backing sheet having a thickness of 75 μm subjected to corona discharge treatment, Oji Yuka Co., Ltd .: YUPO DFG-65
The sheets are stuck together, and a first writing layer forming coating liquid, a second writing layer forming coating liquid and a third writing layer forming coating liquid having the following compositions are applied and dried in this order to have a thickness of 5 μm. , 15μ
A writing layer was formed by laminating so as to have a thickness of 0.2 μm. <Coating liquid for forming the first writing layer> Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Japan Polyurethane Industry Co., Ltd .: Coronate HX] Carbon black Trace amount of titanium dioxide particles [Ishihara Sangyo] Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer> Polyester resin 4 parts [Toyobo Co., Ltd .: Vylonal MD1200] Silica 5 parts Titanium dioxide particles [Ishihara] Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Third writing layer forming coating liquid> Polyamide resin [Sanwa Chemical Industry Co., Ltd .: Sunmide 55] 5 parts Methanol 95 parts Obtained writing layer The center line average roughness was 1.34 μm. (Creation of IC Card Sheet) The IC card manufacturing apparatus of the present invention is based on the example of FIG. (Preparation of IC Card Sheet 1) The IC card manufacturing apparatus shown in FIG. 15 was used, and a back support and a front support were used as the first support and the second support.

Adhesive 1 was applied to each sheet using a T-die to a thickness of 280 μm, and the IC module 1 having the structure shown in FIG.
It was produced by vacuum laminating at 70 ° C. for 1 minute. The thickness of the IC card sheet thus created is 760
was μm. After production, the environment is set to 25 ° C and 50% RH.
Stored for days. [Punching] The IC card sheet thus created is punched out from the following IC card by a die device.
Stamped.

FIG. 16 is an overall schematic perspective view of the punching die device, and FIG. 17 is a front end view of the main part of the punching die device. This punching die device has a punching die having an upper blade 110 and a lower blade 120. Then, the upper blade 110 includes a punching punch 111 in which a clearance 141 is provided inside the outer extension, and the lower blade 120 has a punching die 121. By lowering the punching punch 111 into a die hole 122 provided in the center of the punching die 121, an IC card having the same size as the die hole 122 is punched. Further, for this reason, the size of the punching punch 111 is slightly smaller than the size of the die hole 122. (Method of Writing Personal Information on Personal Authentication Card and Surface Protecting Method) A personal authentication card having a face image, attribute information, and format printing was prepared on the punched IC card as follows. (Preparation of sublimation-type thermal transfer recording ink sheet) A 6 μm-thick polyethylene terephthalate sheet having a back surface processed to prevent fusion is coated with a yellow ink layer-forming coating solution, a magenta ink layer-forming coating solution, and cyan. The ink layer forming coating liquid was provided so that each thickness was 1 μm, and three color ink sheets of yellow, magenta and cyan were obtained. <Coating liquid for forming yellow ink layer> Yellow dye (Compound Y-1) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24] manufactured by Denki Kagaku Kogyo Co., Ltd. Polymethyl methacrylate modified polystyrene 1 part [ Toagosei Chemical Industry Co., Ltd .: Rededa GP-200] 0.5 parts urethane modified silicone oil [Dainichi Seika Kogyo Co., Ltd .: Dialomer SP-2105] methyl ethyl ketone 70 parts Toluene 20 parts <Coating for forming magenta ink layer Working solution> Magenta dye (Compound M-1) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24] manufactured by Denki Butyral Co., Ltd. Polymethylmethacrylate modified polystyrene 2 parts [Toagosei Chemical Industry Co., Ltd.] Made by: Rededa GP-200] 0.5 parts of urethane modified silicone oil [Dainichi Seika Kogyo Co., Ltd. Made: Dialomer SP-2105] Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating liquid> Cyan dye (compound C-1) 1.5 parts Cyan dye (compound C-2) 1.5 parts Polyvinyl acetal 5 6 parts [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.] Polymethylmethacrylate modified polystyrene 1 part [Reeda GP-200 manufactured by Toagosei Chemical Industry Co., Ltd.] 0.5 parts urethane modified silicone oil [ Dainichi Seika Kogyo Co., Ltd .: Dialomer SP-2105] Methyl ethyl ketone 70 parts Toluene 20 parts (preparation of ink sheet for melt-type thermal transfer recording) A polyethylene terephthalate sheet having a thickness of 6 μm and processed to prevent fusion on the back surface has the following composition. The ink layer-forming coating solution is applied to a thickness of 2 μm and dried to dry the ink. It was obtained. <Ink layer forming coating liquid> Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemical Co., Ltd .: EV40Y] Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries Co., Ltd .: Tamanor 521] 5 parts 90 parts of methyl ethyl ketone (formation of face image) The image receiving layer and the ink side of a sublimation type thermal transfer recording ink sheet are superposed on each other and output from the ink sheet side using a thermal head 0.23 W / dot, pulse width 0.3 to 4 By heating under a condition of a dot density of 16 dots / mm for 0.5 msec, a human image having gradation is formed on the image receiving layer. In this image, the dye and nickel in the image receiving layer form a complex. (Formation of character information) The OP varnish portion and the ink side of the ink sheet for melt-type thermal transfer recording are superposed and output from the ink sheet side using a thermal head 0.5 W / dot, pulse width 1.0 msec, dot density Character information was formed on the OP varnish by heating under the condition of 16 dots / mm. [Surface protection method] (Surface protection layer forming method) <Preparation of actinic ray-curable transfer foil 1> On a release layer of a polyethylene terephthalate film 2 having a thickness of 25 μm provided with a release layer of a fluororesin layer of 0.1 μm. The following composition was laminated on to prepare an actinic ray curable transfer foil 1. (Actinic ray curable compound) Shin Nakamura Chemical Co., Ltd. A-9300 / Shin Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 Parts Other Additives Dainippon Ink Surfactant F-179 0.25 parts <Intermediate layer forming coating liquid> Film thickness 1.0 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 3.5 Part Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts Curing of the curing agent after coating was carried out at 50 ° C. for 24 hours. <Adhesive layer forming coating solution> Film thickness 0.5 μm Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic ester copolymer [Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol Further, using the actinic ray curable transfer foil 1 having the above-mentioned structure on the image receptor on which images and characters are recorded, a surface temperature of 20.
Transfer was performed by applying heat for 1.2 seconds at a pressure of 150 kg / cm ² using a heat roller heated to 0 ° C. and having a rubber hardness of 85 and a diameter of 5 cm.

The produced IC card was not destroyed by using a steel ball having a tip diameter R = 1 mm under a load of 1 kg for 500 times, and the face image was not printed. The writing layer was strongly printed with a ballpoint pen, but did not break. R = in the long side direction
After bending 1000 times at 30 mm, the IC worked without peeling. Example 2 The same as Example 1 except that the IC module was changed to IC module 2. A steel ball having a tip diameter R of 1 mm was not destroyed by applying a load of 1 kg for 500 times, and the face image was not scratched. The writing layer was strongly printed with a ballpoint pen, but did not break. R = 30 along the long side
After bending 1000 times in mm, the IC worked without peeling. <Example 3> The same procedure as in Example 1 was carried out except that the IC module was replaced with the IC module 3. A steel ball having a tip diameter R of 1 mm was not destroyed by applying a load of 1 kg for 500 times, and the face image was not scratched. The writing layer was strongly printed with a ballpoint pen, but did not break. R = 30 along the long side
After bending 1000 times in mm, the IC worked without peeling. <Example 4> The same procedure as in Example 1 was carried out except that the IC module was changed to IC module 4. A steel ball having a tip diameter R of 1 mm was not destroyed by applying a load of 1 kg for 500 times, and the face image was not scratched. The writing layer was strongly printed with a ballpoint pen, but did not break. R = 30 along the long side
After bending 1000 times in mm, the IC worked without peeling. <Example 5> The same procedure as in Example 1 was carried out except that the IC module was changed to IC module 5. A steel ball having a tip diameter R of 1 mm was not destroyed by applying a load of 1 kg for 500 times, and the face image was not scratched. The writing layer was strongly printed with a ballpoint pen, but did not break. R = 30 along the long side
After bending 1000 times in mm, the IC worked without peeling. Example 6 Adhesive 1 was applied to each of the front and back supports using a T-die to a thickness of 280 μm, and the space between the upper and lower adhesive-attached sheets is shown in FIG. Example except that the IC module 6 having the constitution was put in such a manner that the longitudinal direction of coating and laminating and the direction of the grids of the openings of the mesh sheet were in the same direction and were laminated at 70 ° C. and pressure-laminated. Same as 1. A steel ball having a tip diameter R of 1 mm was not destroyed by applying a load of 1 kg for 500 times, and the face image was not scratched. The writing layer was strongly printed with a ballpoint pen, but did not break. R = 3 in the long side direction
After bending 1000 times at 0 mm, the IC worked without peeling. (FIG. 8) <Embodiment 7> The same operation as in Embodiment 1 except that the IC module is replaced by the IC module 7. A steel ball having a tip diameter R of 1 mm was not destroyed by applying a load of 1 kg for 500 times, and the face image was not scratched. The writing layer was strongly printed with a ballpoint pen, but did not break. R = 30 along the long side
After bending 1000 times in mm, the IC worked without peeling. Example 8 Adhesive 1 was coated on the front support using a T-die to a thickness of 350 μm, and adhesive 2 was placed on the back support every 2 mm and a slit having a length of 2 mm was used. Use a die to coat to a maximum thickness of 320 μm,
Insert the IC module 8 between the upper and lower sheets with the adhesive so that the stripe direction and the laminating direction are parallel to each other at 70 ° C.
The same procedure as in Example 1 was carried out except that the layers were bonded together and laminated under pressure. A steel ball having a tip diameter R of 1 mm was not destroyed by applying a load of 1 kg for 500 times, and the face image was not scratched. The writing layer was strongly printed with a ballpoint pen, but did not break. After bending 1000 times so that R = 30 mm in the long side direction, the IC operated without peeling. (FIGS. 11 and 12) <Example 9> Adhesive 1 was coated on the front support using a T-die to a thickness of 280 μm, and adhesive 2 was used on the back support using a T-die. And the embossing roll is applied while heating the surface of the adhesive 2 to 70 ° C., and the IC module 8 is put between the upper and lower sheets with the adhesive at 70 ° C. The procedure of Example 1 was repeated, except that the layers were laminated and pressure-laminated. A steel ball with a tip diameter R = 1 mm is capable of applying a 1 kg load to 50
It was not destroyed over 0 times, and the print of the face image did not suffer from blurring. The writing layer was strongly printed with a ballpoint pen, but did not break. 10 so that R = 30 mm in the long side direction
After bending 00 times, the IC worked without peeling. (Fig. 13,
14) <Comparative Example> The adhesive 1 is applied to each of the front support and the back support using a T-die to a thickness of 280 μm, and the IC module is provided between the upper and lower adhesive-attached sheets. Example 9 was carried out in the same manner as in Example 1 except that 9 was put in and bonded at 70 ° C. and pressure laminated. With a steel ball having a tip diameter R = 1 mm, a 1 kg load was applied 500 times, and the operation was not performed 350 times. The facial image print also had blurring around the chip. The writing layer was strongly printed with a ball-point pen and stopped working. After bending 1000 times so that R = 30 mm in the long side direction, wrinkles were generated from the peeling end portion and peeling occurred.

[0138]

As described above, according to the first aspect of the present invention, by providing the reinforcing plate having the composite reinforcing structure adjacent to the IC chip, the surface of the thin IC card can be smoothed and the unevenness can be obtained. The occurrence of unevenness is suppressed and there is no recording unevenness,
Moreover, it has excellent resistance to bending and point pressure strength loads.

According to the invention described in claim 2, the reinforcing plate having the composite reinforcing structure is excellent in mechanical strength.

According to the third aspect of the present invention, the reinforcing plate having the H structure or the concave structure is used, and the concave portion having the H structure or the concave structure is used to have strength, and the IC chip and the antenna can be compactly arranged. Therefore, the bending of the IC chip and the antenna can be suppressed.

According to the invention described in claim 4, since the reinforcing plate having the corrugated structure is used and the bellows shape of the corrugated structure is used, the strength is high, the IC chip and the antenna can be arranged compactly, and the IC chip and the antenna are Bending can be suppressed.

According to the invention described in claim 5, since the laminated panel structure made of the metal plate is used, the laminated panel structure has strength and I
C chip and antenna are compactly arranged and IC
The bending of the chip and the antenna can be suppressed.

In the invention described in claim 6, since the honeycomb structure is made of metal and the hollow portion is filled with resin, it is lightweight and has strength, and the IC chip and the antenna are compactly arranged, and The bending of the antenna can be suppressed.

According to the invention described in claim 7, the size of the reinforcing plate having the composite reinforcing structure is larger than the IC chip shape and is made of a metal plate, so that the bending of the IC chip can be suppressed.

In the invention according to claim 8, the strength can be improved by the composite reinforcing structure containing one material having a Young's modulus of 100 GPa or more.

According to the ninth aspect of the invention, the thin I-shaped structure is provided by having the reinforcing plate adjacent to the IC chip and having the two-dimensional mesh structure mesh member having the mesh-like openings.
The surface of the C card can be smoothed, unevenness is prevented from occurring, recording is not uneven, and resistance to bending and point pressure strength load is excellent.

According to the tenth aspect of the invention, the mesh sheet as the mesh structure member has openings having a regular polygonal mesh shape, so that a thin IC card can be uniformly bent or subjected to point pressure strength load. It has excellent resistance.

In the eleventh aspect of the present invention, there is provided a reinforcing plate and a two-dimensional mesh structure member having a mesh parallel to and perpendicular to the short side of the card adjacent to the IC chip. By sticking along the direction of the mesh, the surface can be smoothed even with a thin IC card, uneven unevenness can be suppressed, recording unevenness can be prevented, and resistance to bending and point pressure strength load is excellent.

According to the twelfth aspect of the invention, the IC module is formed on a support having a two-dimensional mesh structure having an opening, and there is no antenna or IC chip in the opening, and the IC module is adjacent to the IC chip. By including the reinforcing plate, the surface of the thin IC card can be smoothed, unevenness can be prevented from occurring, recording unevenness can be prevented, and resistance to bending and point pressure strength load can be excellent.

In the thirteenth aspect of the invention, the antenna and the IC chip are not present in the opening portion, the reinforcing plate is provided adjacent to the IC chip, and the opening portion is provided in the vicinity of the IC chip so as to be unevenly distributed. By combining them, the surface can be smoothed even with a thin IC card, unevenness can be prevented from occurring, recording unevenness can be prevented, and resistance to bending and point pressure strength load can be excellent.

In the fourteenth aspect of the present invention, the antenna is formed by the etching method, and the surface of the thin IC card can be smoothed.

In a fifteenth aspect of the invention, a thin IC card is provided by providing a reinforcing plate adjacent to the IC chip and providing adhesives having different elastic moduli in the in-plane direction of the card in a stripe shape. However, the surface can be smoothed, unevenness is prevented from occurring, recording is not uneven, and resistance to bending and point pressure strength load is excellent.

According to the sixteenth aspect of the invention, the two facing
By providing a part including an IC module composed of an IC chip and an antenna at a predetermined position between two supports and bonding the parts along the stripe direction of the adhesive, the surface of a thin IC card can be smoothed.

According to the seventeenth aspect of the present invention, by using the adhesives having different elastic moduli, the surface of the thin IC card can be further smoothed.

In the eighteenth aspect of the present invention, the adhesive having a high elastic modulus is provided on one of the supports in a concavo-convex shape, and the adhesive having a low elastic modulus is provided in the recess. The surface of a thin IC card can be smoothed, unevenness is prevented from occurring, recording is not uneven, and resistance to bending and point pressure strength load is excellent.

In the nineteenth aspect of the invention, the two opposing
One of the two supports is provided with an adhesive having a high elastic modulus, embossing rolls are used to make the surface uneven, and the other one of the supports is provided with an adhesive having a low elastic modulus to bond the thin ICs. The surface of a card can be smoothed, unevenness is prevented from occurring, recording is not uneven, and resistance to bending and point pressure strength load is excellent.

According to the twentieth aspect of the invention, since the adhesive having a low elastic modulus is present at the edge portion of the reinforcing plate, the adhesive adheres to the reinforcing plate and the IC chip is surely protected.

In the twenty-first aspect of the present invention, the filled adhesive is a reactive hot melt adhesive, which has excellent durability and is suitable for processing at low temperatures.

According to the twenty-second aspect of the present invention, the filled adhesive is a reactive hot melt adhesive, which has excellent durability and is suitable for processing at a low temperature.

In the twenty-third aspect of the invention, it is used for an identification card (ID card), a credit card and the like.

According to the twenty-fourth aspect of the invention, the transparent protective layer is provided on the upper surface on which the personal identification information including the name and the face image is provided, which is durable.

[Brief description of drawings]

FIG. 1 is a diagram showing a layer structure of an IC card.

FIG. 2 is a diagram showing an example of a reinforcing plate having a composite reinforcing structure.

FIG. 3 is a diagram showing an example of a reinforcing plate having a composite reinforcing structure.

FIG. 4 is a diagram showing an example of a reinforcing plate having a composite reinforcing structure.

FIG. 5 is a diagram showing an example of a reinforcing plate having a composite reinforcing structure.

FIG. 6 is a diagram showing an example of a reinforcing plate having a composite reinforcing structure.

FIG. 7 is a plan view showing a mesh sheet as a mesh structure member.

FIG. 8 is a diagram showing manufacturing of an IC card.

FIG. 9 is a diagram showing a state in which a mesh sheet is attached and manufactured along the mesh direction.

FIG. 10 is a plan view showing a state where a reinforcing plate is arranged adjacent to an IC chip on a mesh structure member.

FIG. 11 is a diagram showing a layer structure of an IC card.

FIG. 12 is a plan view showing the configuration of an adhesive.

FIG. 13 is a diagram showing a layer structure of an IC card.

FIG. 14 is a plan view showing the configuration of an adhesive.

FIG. 15 is a diagram showing a configuration of an IC card manufacturing apparatus.

FIG. 16 is an overall schematic perspective view of a punching die device.

FIG. 17 is a front end view of the main part of the punching die device.

[Explanation of symbols]

1,2 support 3 Parts including IC module 3a IC chip 3b antenna 4,5 Adhesive layer 6 Image receiving layer 7 personal identification information 8 protective layer 9 writing layers 10 Reinforcing plate 11,12 mesh sheet

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2C005 MA11 MA13 MA14 MA15 MA32                       NA06 NB01 PA14 PA25 RA04                 5B035 AA07 BA05 BB09 BB12 CA01                       CA23

Claims (24)

[Claims] 1. A personal identification information including a name and a face image by a sublimation heat transfer and / or melt heat transfer method or an ink jet method having an image receiving layer on at least one side, and a writable writing layer provided on at least a part thereof. Facing 2
In an IC card in which parts including an IC module consisting of an IC chip and an antenna are placed at predetermined positions between two supports and filled with an adhesive, a reinforcement having a composite reinforcing structure adjacent to the IC chip. An IC card having a plate. 2. A reinforcing plate having a composite reinforcing structure has an H structure,
Corrugated structure, laminated panel structure, honeycomb structure, concave structure,
A composite reinforcing structure selected from a blade type stringer structure, a Z type stringer structure, an I type stringer structure, a hat type stringer structure, a tube type stringer structure, a grid type panel structure, and a mesh structure. The IC card according to item 1. 3. An IC chip is installed in a recess of the H structure or the concave structure, and an antenna is installed so as to extend from an opening of the H structure or the concave structure, and the H structure or the concave structure is formed. The IC card according to claim 1 or 2, wherein a ratio of the minimum thickness and the maximum thickness is 0.5 or more and less than 1.0. 4. The corrugated structure has a bellows shape having short sides and long sides, and the unevenness of the bellows is provided in the short side direction, and the antenna connected to the IC chip extends in the long side direction. It exists, The IC card of Claim 1 or Claim 2 characterized by the above-mentioned. 5. The laminated panel structure is made of a metal plate, a plurality of metal plates are arranged side by side in a tile shape in the same layer, and the metal plates are laminated so as to cover a joint portion. The IC card according to claim 1 or 2. 6. The IC card according to claim 1, wherein the honeycomb structure is made of metal and a hollow portion is filled with resin. 7. The I according to claim 1, wherein a size of the reinforcing plate having the composite reinforcing structure is larger than an IC chip shape and is made of a metal plate.
C card. 8. The composite reinforcing structure has a Young's modulus of 100 GPa.
The IC card according to claim 1, wherein the IC card contains one of the above materials. 9. An I-position at a predetermined position between two opposing supports.
An IC card in which components including an IC module including a C chip and an antenna are placed and filled with an adhesive, and a two-dimensional structure having a reinforcing plate adjacent to the IC chip and having a mesh-like opening An IC card having at least one layer of a mesh structure member having a mesh structure. 10. The IC card according to claim 9, wherein the mesh has a regular polygonal opening. 11. A method of manufacturing an IC card in which a component including an IC module consisting of an IC chip and an antenna is placed at a predetermined position between two opposing supports, and an adhesive is filled in the IC card. An IC card characterized in that it has a reinforcing plate and a mesh structure member of a two-dimensional structure having a mesh parallel and perpendicular to the short side of the card, and is bonded along the mesh direction of this mesh structure member. Manufacturing method. 12. An IC card in which a component including an IC module consisting of an IC chip and an antenna is placed at a predetermined position between two opposing supports and is filled with an adhesive, wherein the IC module has an opening. The antenna and the IC chip are not present in the opening, and a reinforcing plate is provided adjacent to the IC chip. IC card. 13. An adhesive is provided on one of the two opposing supports, and an adhesive is provided on the remaining one of the supports, and an opening is provided at a predetermined position between the two opposing supports. Having 2
An IC module including an IC chip and an antenna formed on a support having a three-dimensional mesh structure, wherein the antenna and the IC chip do not exist in the opening, and the I
A method of manufacturing an IC card, comprising a reinforcing plate adjacent to the C chip, the opening being provided in the vicinity of the IC chip so as to be unevenly distributed, and the bonding being performed. 14. The IC card according to claim 11, wherein the antenna is an etching type. 15. An IC card in which a component including an IC module consisting of an IC chip and an antenna is placed at a predetermined position between two opposing supports and is filled with an adhesive, the IC card being adjacent to the IC chip. And a reinforcing plate, and an adhesive having different elastic moduli in the in-plane direction of the card is provided in a stripe shape. 16. An adhesive is provided in a stripe shape on one of the two opposing supports, and the adhesive is provided on the remaining one of the supports at a predetermined position between the two opposing supports. A method of manufacturing an IC card, characterized in that a component including an IC module consisting of an IC chip and an antenna is provided on the substrate, and the components are bonded along the stripe direction. 17. An adhesive having a different elastic modulus is used, an adhesive having a high elastic modulus is used for the one-sided support, and an adhesive having a low elastic modulus is used for the remaining one-sided support. Item 17. The method for manufacturing an IC card according to Item 16. 18. An IC card in which a component including an IC module consisting of an IC chip and an antenna is placed at a predetermined position between two opposing supports and is filled with an adhesive, the IC card being adjacent to the IC chip. Has a reinforcing plate, and the adhesive to be filled is made of at least two kinds of adhesives having different elastic moduli, and the adhesive having a high elastic modulus is provided on one of the supports in an uneven shape, An IC card characterized in that an adhesive agent having a low rate is provided in the concave portion. 19. An adhesive having a high elastic modulus is provided on one of the two opposing supports, and an embossing roll is used to make unevenness, and an adhesive having a low elastic modulus is provided on the other one of the supports. , IC at a predetermined position between two opposing supports
A method of manufacturing an IC card, characterized in that parts including an IC module composed of a chip and an antenna are provided and bonded together. 20. The IC card according to claim 19, wherein an adhesive having a low elastic modulus is present on an edge portion of the reinforcing plate. 21. The filled adhesive is made of a reactive hot-melt adhesive, wherein the adhesive is a reactive hot-melt adhesive, claim 12, claim 14, claim 14, claim 15, and claim 1.
The IC card according to claim 8 or claim 20. 22. Any one of claim 11, claim 13, claim 16, claim 17, and claim 19, wherein the filled adhesive is a reactive hot melt adhesive. A method for manufacturing the described IC card. 23. A personal identification information including a name and a face image is provided on at least one side by a sublimation heat transfer and / or melt heat transfer method or an ink jet method, and a writable writing layer is provided on at least a part thereof. Claim 9, claim 10, claim 12, claim 1
4, claim 15, claim 18, or claim 1
The IC card described in the item. 24. A transparent protective layer is provided on an upper surface on which personal identification information including a name and a face image is provided, and the transparent protective layer is made of an actinic ray curable resin. The IC card according to any one of claim 12, claim 14, claim 15, claim 18, and claim 20.