JP2007072829A - Reinforcing plate of ic chip - Google Patents

Reinforcing plate of ic chip Download PDF

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JP2007072829A
JP2007072829A JP2005260202A JP2005260202A JP2007072829A JP 2007072829 A JP2007072829 A JP 2007072829A JP 2005260202 A JP2005260202 A JP 2005260202A JP 2005260202 A JP2005260202 A JP 2005260202A JP 2007072829 A JP2007072829 A JP 2007072829A
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reinforcing plate
chip
antenna wire
contact
antenna
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Yoshiharu Hino
吉晴 日野
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Maxell Seiki Ltd
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Maxell Seiki Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent an antenna wire from being broken or cut by the corner part of a reinforcing plate to which an IC chip is fixed. <P>SOLUTION: To the reinforcing plate 1, the IC chip 6 to which the antenna wire 11 of an antenna coil 7 is joined is fixed. Of four sides at the outer peripheral edge of the reinforcing plate 1, at the corner parts on the upper side of two sides 12 with which the antenna wire 11 is brought into contact, chamfering by pressing is executed as a contact mitigation means so as to prevent the corner parts from being in contact with the antenna wire 11 in a sharp state. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、ＩＣチップを補強して保護するための補強板に関する。   The present invention relates to a reinforcing plate for reinforcing and protecting an IC chip.

メモリなどを有するＩＣチップと、このＩＣチップに接合したアンテナ線とを内蔵していて、リーダーライターと無線通信することでデータの読み取りや書き込みなどを行うＩＣカードが知られている。   There is known an IC card that incorporates an IC chip having a memory and the like, and an antenna wire joined to the IC chip, and performs reading and writing of data by wireless communication with a reader / writer.

前記ＩＣカードでは、薄型化が要請されており、これに伴って曲げ強度が小さくなる傾向にある。このため、前記ＩＣカードにあっては撓み変形などが生じ易く、この撓み変形によってＩＣチップが破損するおそれがある。この対策としては、特許文献１・２に示すエッチング加工や打ち抜き加工によって、ステンレス鋼製の補強板を形成し、この補強板にＩＣチップを固定することが考えられる。   The IC card is required to be thin, and along with this, the bending strength tends to decrease. For this reason, the IC card is likely to be bent and deformed, and the IC chip may be damaged by the bent deformation. As a countermeasure, it is conceivable that a stainless steel reinforcing plate is formed by etching or punching shown in Patent Documents 1 and 2, and an IC chip is fixed to the reinforcing plate.

特開平７−２０２１０４号公報（段落番号０００３−０００４、図４）Japanese Patent Laid-Open No. 7-202104 (paragraph numbers 0003-0004, FIG. 4) 特開平１０−５６１１８号公報（段落番号０００２、図６）Japanese Patent Laid-Open No. 10-56118 (paragraph number 0002, FIG. 6)

前記エッチング加工では、オーバーエッチングなどによって前記補強板の外周縁などに鋭利なエッジが形成され、また打ち抜き加工では、前記補強板の外周縁などに鋭利なバリが生じる。このため、ＩＣカードの製造工程などにおいて、前記エッジやバリがアンテナ線と接触して、アンテナ線が破損したり切断したりすることがある。特に、補強板がステンレス鋼などの金属の場合には、補強板とアンテナ線とがショートしてアンテナ特性が劣化し、リーダーライターとの正常な無線通信が困難になる。   In the etching process, a sharp edge is formed on the outer peripheral edge of the reinforcing plate by over-etching or the like, and in the punching process, a sharp burr is generated on the outer peripheral edge of the reinforcing plate. For this reason, in the IC card manufacturing process or the like, the edge or burr may come into contact with the antenna wire, and the antenna wire may be damaged or cut. In particular, when the reinforcing plate is a metal such as stainless steel, the reinforcing plate and the antenna wire are short-circuited to deteriorate the antenna characteristics, and normal wireless communication with the reader / writer becomes difficult.

本発明の目的は、アンテナ線の破損や切断を生じないＩＣチップの補強板を提供することにある。   An object of the present invention is to provide a reinforcing plate for an IC chip that does not damage or cut the antenna wire.

本発明は、図１に示すごとく、アンテナ線１１を接合したＩＣチップ６が固定される補強板１であって、補強板１の外周縁には、少なくともアンテナ線１１が接触する角部分に、該角部分が鋭利な状態でアンテナ線１１に接触することを防止する接触緩和手段を施してあることを特徴とする。   As shown in FIG. 1, the present invention is a reinforcing plate 1 to which an IC chip 6 to which an antenna wire 11 is joined is fixed. At the outer peripheral edge of the reinforcing plate 1, at least a corner portion where the antenna wire 11 contacts, Contact relaxation means for preventing the corner portion from coming into contact with the antenna wire 11 in a sharp state is provided.

接触緩和手段は、前記角部分への面取り加工で形成された接触面１３であってもよく、また少なくとも前記角部分を覆う被覆体であってもよい。   The contact relaxation means may be a contact surface 13 formed by chamfering the corner portion, or may be a covering covering at least the corner portion.

接触緩和手段は、図６および図７に示すごとく、アンテナ線１１が接触する周縁部１２からＩＣチップ６側へ形成された切り欠き１９と、切り欠き１９の上側に配された柔軟性を有するテープ２０とで形成してあってもよい。   As shown in FIGS. 6 and 7, the contact relaxation means has a notch 19 formed on the IC chip 6 side from the peripheral edge 12 with which the antenna wire 11 contacts, and a flexibility disposed on the upper side of the notch 19. It may be formed with the tape 20.

本発明によれば、補強板１の角部分が鋭利な状態でアンテナ線１１に接触することが防止されるので、エッチング加工によって角部分に生じた鋭利なエッジや、打ち抜き加工によって角部分に生じた鋭利なバリがアンテナ線１１と接触して、該アンテナ線１１が破損したり、切断したりすることを確実に防止できる。   According to the present invention, since the corner portion of the reinforcing plate 1 is prevented from coming into contact with the antenna wire 11 in a sharp state, the sharp edge generated in the corner portion by etching processing or the corner portion by punching processing is generated. It is possible to reliably prevent the sharp burr from coming into contact with the antenna wire 11 and damaging or cutting the antenna wire 11.

補強板１がステンレス鋼などの金属の場合には、アンテナ線１１が破損することが防止されることで補強板１とアンテナ線１１とのショートが確実に防止され、該ショートによるアンテナ特性の劣化を防止できて、正常な無線通信を確実に行える。   When the reinforcing plate 1 is made of a metal such as stainless steel, the antenna wire 11 is prevented from being damaged, so that a short circuit between the reinforcing plate 1 and the antenna wire 11 is reliably prevented, and the antenna characteristics are deteriorated due to the short circuit. Can be prevented and normal wireless communication can be performed reliably.

（実施例１） 図１ないし図４は、本発明に係る補強板の実施例１を示しており、補強板１は、図４に示すごとくインレット２内に配された状態でＩＣカード３に埋設される。インレット２は、前記補強板１の他に、図２に示すごとく、可撓性を有するシート状の基板５・５と、メモリや通信制御部などを有するＩＣチップ６と、ＩＣチップ６に接合したアンテナコイル７とを含む。補強板１は、縦横の寸法を2.５mm、厚さ寸法を１２０μｍとした。 (Embodiment 1) FIGS. 1 to 4 show Embodiment 1 of a reinforcing plate according to the present invention. The reinforcing plate 1 is placed in an IC card 3 in a state of being arranged in an inlet 2 as shown in FIG. Buried. In addition to the reinforcing plate 1, the inlet 2 is joined to the IC chip 6 as shown in FIG. 2, a flexible sheet-like substrate 5, 5, an IC chip 6 having a memory, a communication control unit, and the like. Antenna coil 7. The reinforcing plate 1 has a vertical and horizontal dimension of 2.5 mm and a thickness dimension of 120 μm.

ＩＣチップ６は、接着剤や両面テープなどで補強板１の上面に接着固定する。補強板１とＩＣチップ６とアンテナコイル７とは基板５・５間に配される。インレット２の表裏に、図４に示すごとく可撓性を有する外装シート９・９をそれぞれ積層することで、ＩＣカード３が成形される。基板５・５および外装シート９・９は、合成樹脂や不織布などからなる。   The IC chip 6 is bonded and fixed to the upper surface of the reinforcing plate 1 with an adhesive or a double-sided tape. The reinforcing plate 1, the IC chip 6, and the antenna coil 7 are disposed between the substrates 5 and 5. The IC card 3 is molded by laminating flexible exterior sheets 9 and 9 on the front and back of the inlet 2 as shown in FIG. The substrates 5 and 5 and the exterior sheets 9 and 9 are made of synthetic resin or nonwoven fabric.

ＩＣチップ６は、図２に示すごとく平面視で正方形状になっており、上面の対角位置にバンプ１０・１０がそれぞれ設けられている。バンプ１０・１０は、半田やニッケルや金などをＩＣチップ６の上面にメッキすることで形成する。アンテナコイル７は、銅線をポリエチレンテレフタレート樹脂（ＰＥＴ）やポリウレタン樹脂などで被覆したアンテナ線１１で形成してあり、このアンテナ線１１が、ＩＣチップ６を囲む四重の螺旋状に配される。アンテナ線１１は、加熱圧着によってバンプ１０・１０に接合される。   The IC chip 6 has a square shape in plan view as shown in FIG. 2, and bumps 10 and 10 are provided at diagonal positions on the upper surface. The bumps 10 and 10 are formed by plating the upper surface of the IC chip 6 with solder, nickel, gold, or the like. The antenna coil 7 is formed of an antenna wire 11 in which a copper wire is covered with polyethylene terephthalate resin (PET), polyurethane resin, or the like, and this antenna wire 11 is arranged in a quadruple spiral shape surrounding the IC chip 6. . The antenna wire 11 is joined to the bumps 10 and 10 by thermocompression bonding.

補強板１は、ステンレス鋼の薄板に対してエッチング加工を施すことで形成される。図１および図３に示すごとく、補強板１の外周縁の四辺のうち、アンテナ線１１が接触する二辺１２・１２の上側の角部分には、プレスによる面取り加工が施されて、断面円弧状の接触面（接触緩和手段）１３・１３が形成される。   The reinforcing plate 1 is formed by performing etching on a stainless steel thin plate. As shown in FIG. 1 and FIG. 3, among the four sides of the outer peripheral edge of the reinforcing plate 1, the corners on the upper sides of the two sides 12, 12 with which the antenna wire 11 contacts are chamfered by a press so Arc-shaped contact surfaces (contact relaxation means) 13 and 13 are formed.

つまり、前記エッチング加工では、オーバーエッチングなどによって補強板１の外周縁に鋭利なエッジが形成され易い。この鋭利なエッジにアンテナ線１１が接触すると、アンテナ線１１に傷が付いてアンテナ線１１の破損や切断などを招いてしまう。そこで、プレスによる面取り加工で補強板１の角部分を丸く変形させ、これによって前記角部分が鋭利な状態でアンテナ線１１に接触することを防止して、アンテナ線１１の破損や切断などを防いでいる。   That is, in the etching process, a sharp edge is easily formed on the outer peripheral edge of the reinforcing plate 1 by over-etching or the like. When the antenna wire 11 comes into contact with this sharp edge, the antenna wire 11 is scratched and the antenna wire 11 is damaged or cut. Therefore, the corner portion of the reinforcing plate 1 is rounded by chamfering by pressing, thereby preventing the corner portion from coming into contact with the antenna wire 11 in a sharp state and preventing the antenna wire 11 from being damaged or cut. It is out.

補強板１は、以下のステップを経て製造される。
（第１ステップ） ステンレス鋼の薄板上にフォトレジストを塗布したのちに、所定のマスクパターンで露光する。次いで、強アルカリ性の現像液で現像して前記マスクパターンに応じた所定の部分を除去して、エッジング用マスクを前記薄板上に形成する。前記エッジング用マスクは、１枚の薄板に対して縦横に多数の補強板１を形成するように設定してある。 The reinforcing plate 1 is manufactured through the following steps.
(First Step) After applying a photoresist on a stainless steel thin plate, exposure is performed with a predetermined mask pattern. Next, development is performed with a strong alkaline developer to remove a predetermined portion corresponding to the mask pattern, and an edging mask is formed on the thin plate. The edging mask is set so as to form a large number of reinforcing plates 1 vertically and horizontally with respect to one thin plate.

（第２ステップ） 酸性の薬液に前記薄板を浸漬してエッジングを行ったのちに、前記エッジング用マスクを除去するとともに前記薄板を洗浄する。この際、各補強板１と前記薄板の残余部分とは、微小幅の連結片で接続されている。 (Second Step) After immersing the thin plate in an acidic chemical solution, the edging mask is removed and the thin plate is washed. At this time, each reinforcing plate 1 and the remaining portion of the thin plate are connected by a connecting piece having a very small width.

（第３ステップ） プレスによって各補強板１の二辺１２・１２の角部分が面取り加工されるとともに、前記連結片がそれぞれ切断されて各補強板１が前記薄板の残余部分からそれぞれ切り離される。なお、各補強板１に残る前記連結片の断片は、前記切り離し後に除去される。 (Third Step) The corners of the two sides 12 and 12 of each reinforcing plate 1 are chamfered by pressing, and the connecting pieces are cut to separate the reinforcing plates 1 from the remaining portions of the thin plate. In addition, the piece of the connection piece remaining on each reinforcing plate 1 is removed after the separation.

この後、ＩＣチップ６を補強板１に固定し、ＩＣチップ６のバンプ１０・１０にアンテナコイル７の両端のアンテナ線１１をそれぞれ接合する。   Thereafter, the IC chip 6 is fixed to the reinforcing plate 1, and the antenna wires 11 at both ends of the antenna coil 7 are joined to the bumps 10 and 10 of the IC chip 6, respectively.

ステンレス鋼の薄板に対して打ち抜き加工を施して補強板１を形成してもよい。この場合でも、補強板１の二辺１２・１２の上側の角部分には、前記面取り加工が施される。つまり、前記打ち抜き加工でも補強板１の外周縁には鋭利なバリが形成され易いため、面取り加工を施して断面円弧状の接触面１３・１３を形成することで、アンテナ線１１が傷付くことを防ぐことになる。   The reinforcing plate 1 may be formed by punching a stainless steel thin plate. Even in this case, the chamfering process is performed on the upper corners of the two sides 12 and 12 of the reinforcing plate 1. That is, sharp burr is easily formed on the outer peripheral edge of the reinforcing plate 1 even in the punching process, and the antenna wire 11 is damaged by chamfering to form the contact surfaces 13 and 13 having a circular arc shape in cross section. Will prevent.

前記補強板１の角部分は、研削などによって面取り加工を施して前記接触面１３・１３を形成してもよく、補強板１の外周縁を全てに対して面取り加工を施してもよい。前記接触面１３は傾斜面であってもよい。   The corner portions of the reinforcing plate 1 may be chamfered by grinding or the like to form the contact surfaces 13 and 13, or the entire outer peripheral edge of the reinforcing plate 1 may be chamfered. The contact surface 13 may be an inclined surface.

（実施例２） 実施例２では、図５に示すごとく、補強板１の上面中央にＩＣチップ６を収容する凹部１５を設けてあるとともに、該凹部１５から補強板１の外周縁まで４本の溝１６を形成してある。各溝１６には、アンテナ線１１がそれぞれ入り込む。ＩＣチップ６は、凹部１５の底面に接着剤や両面テープなどで接着固定する。凹部１５および各溝１６は、プレス加工で形成される。 Example 2 In Example 2, as shown in FIG. 5, a recess 15 that accommodates the IC chip 6 is provided in the center of the upper surface of the reinforcing plate 1, and four from the recess 15 to the outer peripheral edge of the reinforcing plate 1. The groove 16 is formed. The antenna wire 11 enters each groove 16. The IC chip 6 is bonded and fixed to the bottom surface of the recess 15 with an adhesive or a double-sided tape. The recess 15 and each groove 16 are formed by pressing.

実施例２では、補強板１の二辺１２・１２の上側の角部分のうち、各溝１６においてアンテナ線１１が接触する角部分に、プレスによって面取り加工が施されて断面円弧状の接触面１３が形成されている。つまり、前記第１ステップと前記第２ステップとの工程が行われたのち、プレス加工により、各補強板１の凹部１５および溝１６が形成され、さらに前記各溝１６の角部分が面取り加工される。この後、前記連結片が切断されて、各補強板１が前記薄板の残余部分からそれぞれ切り離される。その他の点は、実施例１と同じであるので説明を省略する。   In the second embodiment, of the corner portions on the upper sides of the two sides 12 and 12 of the reinforcing plate 1, the corner portions where the antenna wires 11 are in contact with each groove 16 are chamfered by pressing so that the contact surface has a circular arc cross section. 13 is formed. That is, after the steps of the first step and the second step are performed, the concave portions 15 and the grooves 16 of the reinforcing plates 1 are formed by pressing, and the corner portions of the grooves 16 are chamfered. The Thereafter, the connecting piece is cut and each reinforcing plate 1 is cut off from the remaining portion of the thin plate. Since the other points are the same as those of the first embodiment, description thereof is omitted.

凹部１５および溝１６は、ハーフエッチング加工で形成してもよい。この場合でも、前記各溝１６の角部分が、プレスによって面取り加工される。   The recess 15 and the groove 16 may be formed by half etching. Even in this case, the corners of the grooves 16 are chamfered by pressing.

（実施例３） 実施例３では、接触面１３・１３を形成することに代えて、図６および図７に示すごとく、アンテナ線１１が接触する補強板１の二辺１２・１２からＩＣチップ６側へ向けて、平面視でＵ字状の切り欠き１９を四箇所に形成してある。また補強板１の上面には、補強板１の外周縁より内側にテープ２０を接着固定してある。テープ２０は、柔軟性を有する合成樹脂などからなる。切り欠き１９は、エッチング加工やプレス加工で形成される。 (Example 3) In Example 3, instead of forming the contact surfaces 13 and 13, as shown in FIGS. 6 and 7, the IC chip is formed from the two sides 12 and 12 of the reinforcing plate 1 with which the antenna wire 11 contacts. Toward the 6 side, U-shaped notches 19 are formed at four locations in plan view. A tape 20 is bonded and fixed to the upper surface of the reinforcing plate 1 inside the outer peripheral edge of the reinforcing plate 1. The tape 20 is made of a synthetic resin having flexibility. The notch 19 is formed by etching or pressing.

実施例３では、テープ２０が、各切り欠き１９におけるＩＣチップ６側の上面を覆っており、図７に示すごとく、アンテナ線１１が各切り欠き１９の縁に接触することを防いでいる。ＩＣチップ６は、テープ２０の上面に接着固定してある。なお、テープ２０を四角の枠状に形成し、その枠内でＩＣチップ６が補強板１の上面に接着固定するようにしてもよい。   In Example 3, the tape 20 covers the upper surface of each notch 19 on the IC chip 6 side, and the antenna wire 11 is prevented from coming into contact with the edge of each notch 19 as shown in FIG. The IC chip 6 is bonded and fixed to the upper surface of the tape 20. The tape 20 may be formed in a square frame shape, and the IC chip 6 may be bonded and fixed to the upper surface of the reinforcing plate 1 in the frame.

アンテナ線１１が接触する補強板１の二辺１２・１２の上側の角部分に、ゴムなどの被覆体（接触緩和手段）を貼り付けて該角部分を覆ってもよく、また被覆体で補強板１の全体を覆ってもよい。   A cover (contact mitigation means) such as rubber may be attached to the upper corners of the two sides 12 and 12 of the reinforcing plate 1 with which the antenna wire 11 is in contact, and the corners may be covered. The entire plate 1 may be covered.

補強板１は、アルミニウムや銅などの金属、プラスチック、セラミックあるいはガラスなどで形成されてもよい。アンテナ線１１は、銅線を合成樹脂などで被覆して形成してもよく、アルミニウム板や銅板などをエッチング加工して形成してもよく、銀ペーストなどを基板５に印刷して形成してもよい。   The reinforcing plate 1 may be formed of a metal such as aluminum or copper, plastic, ceramic or glass. The antenna wire 11 may be formed by covering a copper wire with a synthetic resin or the like, or may be formed by etching an aluminum plate or a copper plate, or may be formed by printing a silver paste or the like on the substrate 5. Also good.

実施例１の補強板の斜視図The perspective view of the reinforcement board of Example 1. インレットの斜視図Inlet perspective view 図２のＡ−Ａ線断面図AA line sectional view of FIG. ＩＣカードの斜視図IC card perspective view 実施例２の補強板の斜視図The perspective view of the reinforcement board of Example 2 実施例３の補強板の平面図The top view of the reinforcement board of Example 3 実施例３の補強板を用いたＩＣカードの縦断側面図Longitudinal side view of an IC card using the reinforcing plate of Example 3

符号の説明Explanation of symbols

１ 補強板
６ ＩＣチップ
１１ アンテナ線
１２ 補強板の外周縁の辺
１３ 接触面
１９ 切り欠き
２０ テープ DESCRIPTION OF SYMBOLS 1 Reinforcing plate 6 IC chip 11 Antenna wire 12 Side edge of reinforcing plate 13 Contact surface 19 Notch 20 Tape

Claims (4)

アンテナ線を接合したＩＣチップが固定される補強板であって、
前記補強板の外周縁には、少なくとも前記アンテナ線が接触する角部分に、該角部分が鋭利な状態で前記アンテナ線に接触することを防止する接触緩和手段を施してあることを特徴とするＩＣチップの補強板。 A reinforcing plate to which an IC chip joined with an antenna wire is fixed,
The outer peripheral edge of the reinforcing plate is provided with contact relaxation means for preventing at least a corner portion where the antenna wire comes into contact with the antenna wire in a state where the corner portion is sharp. IC chip reinforcement plate. 前記接触緩和手段が、前記角部分への面取り加工で形成された接触面である請求項１記載のＩＣチップの補強板。   The reinforcing plate for an IC chip according to claim 1, wherein the contact relaxation means is a contact surface formed by chamfering the corner portion. 前記接触緩和手段が、少なくとも前記角部分を覆う被覆体である請求項１記載のＩＣチップの補強板。   2. The IC chip reinforcing plate according to claim 1, wherein the contact relaxation means is a covering that covers at least the corner portion. 前記接触緩和手段が、前記アンテナ線が接触する周縁部から前記ＩＣチップ側へ形成された切り欠きと、前記切り欠きの上側に配された柔軟性を有するテープとで形成されている請求項１記載のＩＣチップの補強板。   2. The contact relaxation means is formed of a notch formed from a peripheral edge where the antenna wire contacts to the IC chip side, and a flexible tape disposed on the upper side of the notch. A reinforcing plate for the IC chip as described.
JP2005260202A 2005-09-08 2005-09-08 Reinforcing plate of ic chip Pending JP2007072829A (en)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
EP2187344A1 (en) 2008-11-17 2010-05-19 Fujitsu Limited Radio-frequency identification tag
JP2015197875A (en) * 2014-04-03 2015-11-09 凸版印刷株式会社 non-contact communication medium

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JPH11296642A (en) * 1998-04-10 1999-10-29 Hitachi Ltd Ic card
JP2003141490A (en) * 2001-10-31 2003-05-16 Konica Corp Ic card and method of manufacturing ic card
JP2003288568A (en) * 2002-03-27 2003-10-10 Toppan Forms Co Ltd Contactless ic label
JP2005004429A (en) * 2003-06-11 2005-01-06 Kyodo Printing Co Ltd Contactless ic card and ic module

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JPH11296642A (en) * 1998-04-10 1999-10-29 Hitachi Ltd Ic card
JP2003141490A (en) * 2001-10-31 2003-05-16 Konica Corp Ic card and method of manufacturing ic card
JP2003288568A (en) * 2002-03-27 2003-10-10 Toppan Forms Co Ltd Contactless ic label
JP2005004429A (en) * 2003-06-11 2005-01-06 Kyodo Printing Co Ltd Contactless ic card and ic module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2187344A1 (en) 2008-11-17 2010-05-19 Fujitsu Limited Radio-frequency identification tag
US8002195B2 (en) 2008-11-17 2011-08-23 Fujitsu Limited Radio-frequency identification tag
US8286888B2 (en) 2008-11-17 2012-10-16 Fujitsu Limited Radio-frequency identification tag
JP2015197875A (en) * 2014-04-03 2015-11-09 凸版印刷株式会社 non-contact communication medium

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