JP2005182430A - Manufacturing method of ic card, and ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve adhesion and to prevent a card air bubble, for improving durability. <P>SOLUTION: In this manufacturing method for an IC card with a multilayer configuration, the IC card is manufactured by applying an adhesive between a first sheet material and a second sheet material, and charging an inlet having an IC module formed on a support body into an adhesive layer thereof. An adhesion between the inlet and the first sheet material or the second sheet material when charging the inlet having the IC module is ≥0.1 (N/10 mm) and ≤2.0 (N/10 mm). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  This invention includes a driver's license including an IC module, identification card, passport, alien registration card, library card, cash card, credit card, employee card, employee card, membership card, medical card, etc. The present invention relates to a manufacturing method of IC cards such as cards and student ID cards, and IC cards.

  Conventionally, an IC card is formed by inserting an IC module formed on a circuit board on which an IC chip and an antenna are mounted between two sheet materials, and using a moisture curable adhesive, a UV curable adhesive, a two-component mixed adhesive, or the like. In general, it is produced by stamping in a card shape after bonding and curing (for example, Patent Documents 1 to 3).

Among these adhesives, a flexible moisture curable adhesive is preferably used in order to give the card flexibility in terms of durability.
JP 2002-79618 A (first to sixth pages, FIG. 1) JP-A-5-278320 (first to fifth pages, FIGS. 1 to 6) JP-A-8-238876 (first to eighth pages, FIG. 1)

  Conventionally, when producing an IC card, an inlet is applied after an adhesive is applied. However, when using an inlet using a film type sheet that is generally used, it is difficult to bond the entire surface simultaneously when placing the inlet on the applied adhesive because the inlet itself is not rigid. In addition, a gap is generated on a part of the lower surface, and a portion that does not adhere is generated. As a result, the inlet becomes wrinkled and irregularities occur.

  Further, for example, when a moisture curable adhesive is used, the gas generated by the reaction accumulates in a portion that is not in close contact, and this becomes a bubble and appears on the surface of the IC card, causing deterioration of the surface property.

  Further, even when it does not appear on the surface of the IC card, a small float is generated, and when it is used as an IC card, if a bending force is applied, cracks and peeling occur due to that part, and the function as a card cannot be satisfied. As a result, serious problems have arisen.

  Previously, a method for creating a sheet by controlling the tackiness of an adhesive has been disclosed in Japanese Patent Application Laid-Open No. 2000-194814. However, only the conditions for bonding the front and back sheets are defined, and the IC card inlet is used. No method has been shown for the purpose of improving the adhesion. Further, JP 2002-138269, JP 2000-322538, and the like show a method for improving tackiness by specifying tackiness, but a method for improving manufacturing stability when an inlet is used is shown. Was not.

  SUMMARY OF THE INVENTION The present invention has been made in view of such points, and it is an object of the present invention to provide an IC card manufacturing method and an IC card that can improve adhesion and prevent card air bubbles, thereby improving durability. Yes.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

In the first aspect of the present invention, an adhesive is applied between the first sheet material and the second sheet material, and an inlet having an IC module formed on the support is loaded in the adhesive layer. In the method of manufacturing a multi-layer IC card manufactured as described above,
The adhesion force with the first sheet material or the second sheet material when the inlet having the IC module is loaded is 0.1 (N / 10 mm) or more and 2.0 (N / 10 mm) or less. This is a method for manufacturing an IC card.

  The invention according to claim 2 is the IC card according to claim 1, wherein the inlet is in the form of a film, and the value of the arithmetic mean height Ra of the surface is 0.02 μm or more and 50 μm or less. It is a manufacturing method.

  According to a third aspect of the present invention, when the inlet is loaded and the first sheet material and the second sheet material are bonded together, the first sheet material and the second sheet immediately before bonding are combined. 3. The IC card manufacturing method according to claim 1, wherein the adhesive force applied to the surface of the adhesive is 6 (N / 10 mm) or more.

  The invention according to claim 4 is characterized in that after heating the adhesive surface of the first sheet material, the upper portion of the inlet is pressurized and bonded to the second sheet material. An IC card manufacturing method according to any one of the above items.

  The invention according to claim 5 is characterized in that the pressure member is heated and the pressure member is a roller, and is bonded to the second sheet material after the pressure is applied. An IC card manufacturing method according to any one of the above items.

  The invention according to claim 6 is characterized in that, after the inlet supply section has arranged the inlet, at least a part of the upper surface of the inlet is pressurized. This is a manufacturing method of the IC card.

The invention according to claim 7 creates a bonded product by the IC card manufacturing method according to claim 1 to claim 6,
Before punching out the bonded product into a card shape, the bonded product is cut into a sheet-like sheet.

The invention according to claim 8 creates a bonded product by the IC card manufacturing method according to claims 1 to 6,
2. The IC card manufacturing method according to claim 1, wherein before the bonded product is punched into a card shape, format printing is performed on a surface of the bonded product that is not printed.

The invention according to claim 9 is an IC card manufactured by the IC card manufacturing method according to claims 1 to 6,
The IC card has an image receiving layer on at least one side of the first sheet material or the second sheet material, and is provided with personal identification information including a name and a face image by a thermal transfer method or an ink jet method, and can be written on at least a part. An IC card characterized in that a writing layer is provided.

  The invention described in claim 10 is characterized in that a transparent protective layer is provided on an upper surface provided with personal identification information including the name and face image, and the transparent protective layer is made of an actinic ray curable resin. It is an IC card of description.

  The invention according to claim 11 is the IC card according to claim 9 or 10, wherein the IC chip of the IC card does not exist at a position overlapping the face image portion.

  The invention according to claim 12 is the IC card according to any one of claims 9 to 11, wherein the IC card is a non-contact type.

  According to a thirteenth aspect of the present invention, in the IC card according to any one of the ninth to twelfth aspects, the surface of the IC card has a planar unevenness of a chip peripheral portion within ± 10 μm. It is.

  With the above configuration, the present invention has the following effects.

  In the invention according to claim 1, when the inlet having the IC module is loaded, the adhesion with the first sheet material or the second sheet material is 0.1 (N / 10 mm) or more and 2.0 (N / 10 mm) or less, which is a preferable adhesive force when the inlet is disposed. And when adhering after arrange | positioning an inlet, the one where adhesive force is higher is preferable.

  In the invention according to claim 2, when the inlet is in the form of a film, and the value of the arithmetic average height Ra of the surface is 0.02 μm or more and 50 μm or less, when the inlet is placed on the applied adhesive Depending on the film form, the entire surface can be bonded at the same time, and the surface has a predetermined roughness by defining the value of the arithmetic average height Ra of the surface, and it has a rough texture and improves the bite with the adhesive. Can be improved. In the invention according to claim 3, when the first sheet material and the second sheet material are bonded together, the surface of the adhesive applied on the first sheet material and the second sheet material immediately before the bonding is bonded. Adhesive strength is 6 (N / 10mm) or more, before bonding, the inlet can be pushed in so as to adhere closely without gaps, the adhesion is improved, and the float generated between the inlet and the adhesive surface is reduced, Air bubbles can be prevented from being mixed.

  In the invention according to claim 4, by heating the adhesive surface of the first sheet material and pressurizing the upper portion of the inlet and bonding it to the second sheet material, the inlet can be pushed into close contact without any gap. Adhesion is improved, and floating generated between the inlet and the adhesive surface can be reduced, and bubbles can be prevented from being mixed.

  In the invention according to claim 5, the pressure member is heated and the pressure member is a roller, and the pressure-sensitive adhesive member is adhered to the second sheet material after pressurization by rotation of the roller so that the inlet is closely adhered. It is possible to push into the adhesive, improve the adhesion, reduce the float generated between the inlet and the adhesive surface, and prevent air bubbles from entering.

  In the invention of claim 6, after the inlet supply unit has arranged the inlet, by pressing at least a part of the upper surface of the inlet, the floating generated between the inlet and the adhesive surface is reduced, and bubbles are mixed in. It becomes possible to prevent.

  In the invention described in claim 7, before the bonded product is punched out into a card shape, the bonded product is cut into a single sheet, so that the handling is easy and the punching accuracy is improved.

  In the invention described in claim 8, before the bonded product is punched out into a card shape, format printing is performed on the non-printed surface of the bonded product, thereby facilitating handling and improving the accuracy of the format printing. .

  According to the ninth aspect of the present invention, the personal identification information including the name and face image by the thermal transfer method or the ink jet method is provided on the image receiving layer, and writing is possible on at least a part of the first sheet material or the second sheet material. By providing a layer, it can be used as a license, identification card, passport, alien registration card, library card, cash card, credit card, employee card, employee card, employee card, membership card, medical card, student card, etc. It can be preferably used.

  In the invention of claim 10, the transparent protective layer is made of an actinic ray curable resin on the upper surface on which the personal identification information including the name and face image is provided, so that the personal identification information including the name and face image is formed by the transparent protective layer. Protected and durable.

  In the invention according to the eleventh aspect, since the IC chip of the IC card does not exist at the position overlapping the face image portion, the smoothness of the surface is improved and the printability is improved.

  In the invention described in claim 12, since the IC card is a non-contact type and excellent in safety, it can be used for applications requiring high confidentiality of data and anti-counterfeiting.

  In the invention of claim 13, the surface of the IC card has a planar unevenness of the chip peripheral portion within ± 10 μm, the surface smoothness is improved, and the printability is improved.

  Hereinafter, an IC card manufacturing method and an IC card embodiment according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the invention, and the meaning of the term of the present invention is not limited to this.

  FIG. 1 is a schematic configuration diagram of an IC card creation process.

  In this IC card production process, a long sheet-shaped first sheet material (back sheet) 1 is provided in the first sheet material supply section A, and a long sheet-shaped second sheet material (front sheet). 2 is provided in the second sheet material supply unit B. An adhesive is supplied from the adhesive supply unit C to the second sheet material 2 to be applied, heated by the adhesive heating unit D, and sent to the inlet supply unit E.

  In the inlet supply portion E, an inlet 3 of components including an IC chip and an IC module having an antenna is supplied and placed at a predetermined position of the second sheet material 2, and the second sheet material 2 is moved to the back roller portion F. Send to.

  The first sheet material 1 is supplied with an adhesive from the adhesive supply unit G, applied, heated by the adhesive heating unit H, and sent to the back roller unit F.

  The back roller portion F includes a temperature-adjustable laminating roller 4, and the first sheet material 1 and the second sheet material 2 are bonded together using the laminating roller 4. The temperature difference between the rollers 4a and 4b of the laminating roller 4 is 0 ° C. or higher and 100 ° C. or lower. In this embodiment, the second sheet material 2 has an image receiving layer, the first sheet material 1 has a writing layer, and the rollers 4a and 4b have a roller temperature on the image receiving layer side. The temperature is lower than the temperature of the roller.

  A heating unit I is disposed at a subsequent stage of the back roller unit F, and after being bonded by the back roller unit F, the heating unit I is heated by the pair of rollers 5a and 5b. Thus, before bonding the 1st sheet material 1 and the 2nd sheet material 2, the adhesive layer coated with the sheet material is reheated and sent to the caterpillar press part J.

  The back roller unit F, the heating unit I, and the caterpillar press unit J are arranged with the caterpillar press unit J on the same line of bonding, and the caterpillar press unit J has a heating press unit J1 and a cooling press unit J2. After heating and pressing, cooling and pressing are performed. After being heated and pressurized and cooled and pressurized by the caterpillar press part J, the bonded product is sent to the cutting part K. In the cutting part K, the bonded product is cut into a sheet. After that, it is sent to the punching part L and punched into a card shape. Before punching into a card shape at this punching portion L, format printing is performed on one of the first sheet material 1 and the second sheet material 2.

  Prior to punching into a card shape, the bonded product is cut into a single sheet, handling is easy, and punching accuracy is improved. Further, by performing format printing before punching into a card shape, handling is easy and the accuracy of format printing is improved.

  FIG. 2 is a cross-sectional view of an image forming body of an IC card bonded product. The IC card base material of the IC card bonded product includes an electronic component 3 a having a predetermined thickness between the first sheet material 1 and the second sheet material 2. The electronic component 3a includes an antenna 3a1, an IC chip 3a2, and the like, and an IC module of the electronic component 3a is provided in the inlet 3. This is a laminated structure in which the inlet 3 is disposed between the first sheet material 1 and the second sheet material 2 and laminated with the adhesive layers 6 and 7 interposed therebetween. The IC chip 3a2 is covered with a reinforcing plate 3b, and the reinforcing plate 3b has a larger shape than the IC chip 3a2 and protects the IC chip 3a2.

  The first sheet material 1 or the second sheet material 2 has an image receiving layer 8a on at least one surface, in this embodiment, on one surface of the second sheet material 2, and the name and face by the thermal transfer method or the ink jet method. Personal identification information 8b including an image is provided. In addition, a transparent protective layer 8c is provided on the upper surface provided with personal identification information 8b including a name and a face image by transferring a transfer foil, and the transparent protective layer 8c is made of an actinic ray curable resin. By providing the transparent protective layer 8c on the upper surface on which the personal identification information 8b is provided, the personal identification information 8b is protected and durability is improved. In this embodiment, a writable writing layer 9 a is provided on one side of the first sheet material 1.

  As described above, the personal identification information 8b including the name and face image by the thermal transfer method or the ink jet method is provided on the image receiving layer 8a of the IC card, and the writing layer 9a capable of writing is provided. It can be preferably used for certificate, passport, alien registration card, library card, cash card, credit card, employee card, employee card, membership card, medical card and student card.

  Further, since the IC chip 3a2 does not exist at a position overlapping the face image portion, the surface smoothness is improved and the printability is improved. The planar unevenness of the chip peripheral portion is within ± 10 μm, and by defining the flat unevenness of the chip peripheral portion of the IC card, the surface smoothness is improved and the printability is improved.

  In addition, the IC card has an IC module, is a non-contact card, and is excellent in safety. Therefore, the IC card can be used for applications that require high confidentiality of data and prevention of forgery and alteration.

  In this embodiment, an adhesive is applied between the first sheet material 1 and the second sheet material 2, and an IC module formed on the support 3c is enclosed in the adhesive layers 6 and 7. This is an IC card having a multilayer structure. The IC module formed on the support 3c in the adhesive layers 6 and 7 is configured as shown in FIGS. 3 is a plan view of the IC module, FIG. 4 is a side view of the inlet, and FIG. 5 is a plan view of the inlet.

  In this embodiment, the adhesive force with the first sheet material 1 or the second sheet material 2 when the inlet 3 having an IC module is loaded is 0.1 (N / 10 mm) or more and 2.0 (N / 10 mm) or less, which is a preferable adhesive force when the inlet 3 is disposed. And when adhering after arrange | positioning the inlet 3, it is preferable that the adhesive force is high.

  The inlet 3 is in the form of a film, and the surface arithmetic average height Ra is 0.02 μm or more and 50 μm or less. When the inlet 3 is placed on the applied adhesive, the entire surface is simultaneously formed depending on the film form. It can be bonded, and by defining the value of the arithmetic average height Ra of the surface, there is a predetermined roughness on the surface, it can be rough and better bite with the adhesive to improve adhesion .

  Further, when the first sheet material 1 and the second sheet material 2 are bonded together, the adhesion force of the adhesive surface applied on the first sheet material 1 and the second sheet material 2 immediately before the bonding is increased. 6 (N / 10 mm) or more. Before this bonding, the adhesive strength is 6 (N / 10 mm) or more, so that the inlet 3 can be pushed into the adhesives 6 and 7 so as to be intimately adhered, and the adhesiveness is improved. It is possible to reduce the float generated between the surface of the agent and prevent bubbles from being mixed.

  Also, the adhesive surface of the second sheet material 2 is heated by the adhesive heating part D, the inlet 3 is supplied from the inlet supply part E and loaded, and the adhesive sheet heating part H adheres the first sheet material 1. After heating the coating surface, the top of the inlet is pressurized by the back roller part F and bonded to the second sheet material 2 so that the inlet 3 can be pushed into the adhesive layers 6 and 7 so as to be in close contact with each other. It is possible to improve the property, reduce the float generated between the inlet 3 and the adhesive surface, and prevent the mixing of bubbles.

  Further, in this embodiment, the back roller portion F is configured by the temperature-adjustable laminating roller 4, the pressure member is heated, and the pressure member is a roller. By sticking to the sheet material 2, the inlet 3 can be pushed into the adhesive layers 6 and 7 so as to be in close contact with each other, the adhesion is improved, and the float generated between the inlet 3 and the adhesive surface is reduced. It becomes possible to prevent the mixing of bubbles.

  In addition, after supplying and arranging the inlet 3 from the inlet supply unit E, pressurization of at least a part of the upper surface of the inlet 3 reduces the floating generated between the inlet 3 and the adhesive surface, thereby preventing air bubbles from being mixed in. It becomes possible to prevent.

  6 and 7 are cross-sectional views of the bonded product. In the bonded product of the embodiment of FIG. 6, a sheet support 3 c is used for the inlet 3, and the IC chip 3 a 2 is disposed on the second sheet 2 side. In the bonded product of the embodiment of FIG. 7, the nonwoven fabric support 3 c is used for the inlet 3, and the IC chip 3 a 2 is arranged on the first sheet 1 side.

Next, the configuration of the present invention will be described in detail.
[Tackiness when placing and bonding inlets]
If the tackiness when placing the inlet is high, when the inlet is placed accurately, the sheet material is bent, such as irregularities on the surface of the sheet material of the first sheet material or the second sheet material, and the position is slightly shifted. In some cases, it is difficult to correct, so that tackiness is preferably small. However, if tackiness is lost, it is not preferable because the arranged inlet is displaced due to the shaking caused by the conveyance of the sheet material. Therefore, a preferable adhesion force when the inlet is disposed is 0.1 N / 10 cm or more and 2.0 N / 10 cm or less. When the sheet material is bonded to the other sheet after the inlet is disposed, the higher the adhesion, the better the adhesion between the sheet materials. This preferable adhesion is 6N or more, more preferably 10N or more.

[Inlet push-in]
In order to push the inlet into the adhesive on the sheet material, it is effective to increase the adhesiveness of the inlet after the inlet is placed and then the inlet is pushed by the head portion that has been holding the inlet. The pressing is performed immediately after leaving the inlet supply unit, but the adhesive is preferable because it is easy to press. By performing the pushing, it is possible to reduce the float generated between the inlet and the surface of the adhesive and to prevent the mixing of bubbles. It is also an effective means to control the temperature of the portion into which the inlet is pushed in advance, and the adhesion to the adhesive can be improved.

[Sand mat processing (surface roughness)]
Generally, applying fine irregularities on the surface of an inlet film or the like is called sand mat processing, and a processing method of applying irregularities by hitting fine sand against the surface of the film is used. It is possible to adjust the degree of unevenness according to the amount and speed of hitting sand. It is possible to remove only the printed pattern part by printing the antenna pattern etc. with water-based ink prior to sand mat processing, and then performing sand mat processing and washing with water in the final process. It is.

  The rougher the surface of the inlet sheet, the better the bite of the adhesive, and the better the adhesion. In this invention, the surface roughness is preferably 0.02 μm or more and 50 μm or less in terms of arithmetic average height (Ra). Preferably they are 0.02 micrometer or more and 20 micrometers or less, More preferably, they are 0.02 micrometer or more and 10 micrometers or less.

[Inlet base material]
As the sheet base material of the film type inlet used, PET (polyethylene terephthalate), PET-G, PEN (polyethylene naphthalate), vinyl chloride, PC (polycarbonate), TAC (triacetyl cellulose), acrylic, paper, YUPO In the present invention, PET, PET-G, and PEN are preferable from the viewpoint of mechanical strength, dimensional stability, and solvent resistance, and more preferably PET or PET from the viewpoint of transparency, workability, and cost. PET-G.

[Inlet sheet adhesion]
When a gap occurs between the film-type inlet and the adhesive that bonds the first sheet material and the second sheet material, and stress such as bending is applied when the card is formed In this case, peeling occurs from the gap, which is not preferable because durability is lowered.

  About the sheet | seat adhesion degree of an inlet, the surface was image | photographed by 2000 times with the high magnification lens using the digital HF microscope VH-604 by Keyence Corporation, the area of the adhesion part was calculated | required, and the adhesion degree was computed from the following formula. .

The part which was not closely_contact | adhering was able to observe the state which floated because of the space | gap.
(Area of intimate contact / total area) × 100 (1)

[Break elongation of adhesive]
The breaking elongation of the adhesive means that when the adhesive is continuously pulled at a constant speed, the adhesive is torn at a certain point and breaks. It is the elongation rate of the adhesive stretched up to that time. Generally, when the breaking elongation is small, it is easy to cut when cutting with a scissors-like blade, and when the breaking elongation is large, the elongation until the adhesive is cut is large, so it is difficult to cut when cutting with a scissors-like blade. . On the other hand, when an adhesive is used as a part of the card substrate, when the IC card is bent or folded, it is preferable that the value of the elongation at break is large and flexible.

  When card cutting is performed by the punch die method, it is ideal that the breaking elongation is small and the breaking elongation at the completion of curing of the adhesive is large. The preferable range of the breaking elongation at the time of cutting is 5% or more and 500% or less, and more preferably 50% or more and 400% or less. The breaking elongation at the completion of complete curing is preferably 150% or more and 1500% or less, and more preferably 250% or more and 950% or less.

[Elastic modulus of adhesive]
When the adhesive is deformed by applying an external force, the stress generated by the external force and the strain generated by the deformation are proportional to each other in a range where the deformation is not so large (Hooke's law). The elastic modulus of the adhesive is obtained by using the proportional constant at this time as the elastic modulus. That is, the elastic modulus C is expressed by C = (stress) / (strain). If the elastic modulus is high, cutting with a blade such as scissors is easy to cut, but on the other hand, the adhesive becomes hard and the card durability is lowered. On the other hand, when the elastic modulus is low, the adhesive protrudes from the cross section during cutting, and when the card is formed, the cross sectional shape deteriorates and the appearance deteriorates. A preferred range of the elastic modulus of the adhesive is at 30 kgf / mm ² or more 100 kgf / mm ² or less, more preferably 40 kgf / mm ² or more 80 kgf / mm ² or less.

[Back roll temperature control]
In this invention, the laminate first roll for laminating the first sheet material and the second sheet material has a temperature adjusting mechanism, and the temperature of this roll is preferably 40 ° C. or higher and 90 ° C. or lower. Examples of the temperature adjusting mechanism include a method of electrically heating the roll, blowing hot air into the roll, and circulating a temperature-controlled liquid. A method of circulating hot water is simple and preferable. A more preferable temperature range is 50 ° C. or higher and 90 ° C. or lower.

  In addition, in order to prevent a temperature drop of the coated adhesive, it is preferable to attach a heating device for reheating before the coated adhesive is stuck to the counterpart sheet. The temperature of the heating device is preferably 40 ° C. or higher and 120 ° C. or lower, more preferably 50 ° C. or higher and 120 ° C. or lower.

[Environment during lamination]
Normally, when laminating together, the adhesive can be applied without adjusting the environmental humidity and temperature, and the curing of the adhesive proceeds, but when using a moisture curable adhesive, If the work is performed in an environment where temperature and humidity are applied, the curing speed of the adhesive is increased, and the complete curing of the adhesive is accelerated. As an environment at the time of preparation, the temperature is preferably 20 ° C. or more and 50 ° C. or less, and the humidity is preferably 70% or more and 100% or less.

[Storage environment for laminated products after lamination]
The adhesive is applied, and the sheet-like bonded product is stored until the adhesive is cured. The storage environment of the bonded product is preferably a temperature of 20 ° C. or more and 50 ° C. or less and a humidity of 40% or more and 100% or less. If the temperature and humidity are below these values, curing of the adhesive will not proceed, and if the temperature is above this range, firing will occur in the adhesive and the bonded product will swell.

  About 3 days later, the peel-off strength between the laminated products will be 1500 g / 2.5 cm or more, and even if the laminated products are carried or cut, the bonded products will be distorted or bent. Disappear. Thereafter, the adhesive is completely cured over 1 to 4 weeks.

[Metal plate sandwiched between sheets]
When a laminated sheet-like bonded product has a circuit or IC chip inside, it will be uneven and it will be difficult to stack vertically, so if you put a strong flat metal plate every several bonded products The unevenness on the surface of the bonded product can be canceled and the bonded product can be stacked vertically without bending. The interval between the metal plates is preferably 1 or more and 400 or less, preferably 1 or more and 200 or less. Is more preferable.

[Load applied to the bonded product]
In order to improve the adhesiveness of the two bonded products, a certain amount of load is applied when storing them, since the adhesive in the sheet-like bonded product immediately after lamination has not been cured. is required. If the applied load is too large, the bonded product may be distorted or the IC chip or the like inside the bonded product may be damaged. It is preferred load applied to the bonded product is 2 kg / m ² or more 1500 kg / m ² or less.

  In this invention, when producing a card substrate of a card-size bonded product, as a manufacturing method, for example, the first sheet material and the second sheet material are bonded via an adhesive, and are laminated after bonding. A method of shaping the bonded sheet base material into a card size is selected. As a method for shaping the card size, a punching method or a cutting method is mainly selected.

[Punching method]
In the present invention, it is preferable to use a punch die type blade and a hollow blade as the type of blade. The punch die method referred to here is a method in which a die having a pair of upper and lower sides is used, and the bonded product is cut at an angle of the upper and lower blades of around 90 degrees. The angle of the punch die type cutting blade is preferably 80 ° or more and 100 ° or less, and more preferably 85 ° or more and 95 ° or less.

  The hollow blade method is a blade for punching a bonded product with a blade from above, and the angle of the blade when punching is about 30 degrees. The angle of the cutting blade of the hollow blade preventing group is preferably 20 ° or more and 40 ° or less, and more preferably 25 ° or more and 35 ° or less.

  Since the punch die method has a simple blade structure, it is suitable for punching a large amount of bonded products, but it is difficult to punch a bonded product having a high elongation at break.

  On the other hand, since the hollow blade has an acute angle, it is possible to punch a bonded product of any breaking elongation, but it is inferior to the punch die method in terms of durability and the blade enters diagonally. Since there exists a possibility that the image receiving layer and writing layer which are applied to the bonded product may break, the preferable blade angle is about 30 °.

[Judgment of complete curing]
After curing of the bonded product using the moisture curable adhesive of the example is when the isocyanate group contained in the moisture curable adhesive has reacted 95% or more. The product is cut into a card shape, and it can be determined whether or not the reaction is completed based on whether or not blistering due to generation of carbon dioxide gas occurs when heat treatment at 90 ° C. or higher is performed. In order to know the progress of the reaction, it can be examined by measuring an infrared absorption spectrum and quantifying the amount of isocyanate group (NCO group) from the spectrum intensity.

[Coating viscosity of adhesive]
When the adhesive coating viscosity is less than 5000 mPs at the time of laminating and producing a bonded product, a large number of bubbles are generated when the cards are bonded together, the planar unevenness is deteriorated, and when the adhesive viscosity is larger than 40000 mPs, the adhesive Since the applicability is deteriorated, the planar unevenness is deteriorated. In addition to the planar unevenness, a problem that the card surface strength after curing is reduced occurs. Therefore, it is preferably 5000 mPs or more and 30000 mPs or less, more preferably 7000 mPs or more and 20000 mPs or less. The coating temperature is preferably 140 ° C. or lower, more preferably 130 ° C. or lower.

[MDI (diphenylmethane diisocyanate)]
The amount of MDI is preferably less than 1%. MDI is the official name diphenylmethane diisocyanate. The shape is usually solid, boiling point 190 ° C. pseudo solid point 39 ° C. flash point 220 ° C. vapor pressure 160 ° C., and less corrosive at room temperature.

[IC card base material adhesive]
As the bonding material of the present invention, it is preferable to use a hot melt adhesive, a thermoplastic resin, or the like. For example, as the hot melt adhesive, a commonly used one can be used. Examples of the main component of the hot melt adhesive include ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, and polyolefin. However, in the present invention, a moisture curable adhesive is specifically preferable among the low temperature adhesives.

  As reactive hot melt adhesives, moisture curable materials are disclosed in JP 2000-036026, JP 2000-21278, JP 2000-21855, and JP 2002-175510. Any of these adhesives may be used, and materials that are not particularly limited can be used as long as low-temperature bonding can be performed.

  The thickness of the adhesive is preferably 100 to 600 μm, more preferably 150 to 500 μm, and still more preferably 150 μ to 450 μm in terms of the thickness including the electronic component.

  In addition, when the viscosity at 120 ° C. is smaller than 5000 mPs, many bubbles are generated when the IC card is bonded, the planar unevenness is deteriorated, and when larger than 20000 mPs, the applicability of the adhesive is deteriorated. , Planar unevenness deteriorates. Since the problem that the card | curd surface intensity | strength after hardening falls, and problems, such as a burr | flash and a beard, generate | occur | produce, Preferably it is 7000 mPs or more and 20000 mPs or less.

[Electronic parts]
The electronic component refers to an information recording member, specifically, an IC chip that electrically stores information of a user of the electronic card and a coiled antenna body connected to the IC chip. The IC chip is only a memory or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member.

  The IC module has an antenna coil, but when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). There are known methods using industrial anisol, etc.) or soldering methods, but any method may be used.

  In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the shearing force due to the flow of the resin causes the joint to come off or the surface smoothness due to the flow or cooling of the resin. In order to eliminate the damage and lack of stability, a resin layer is previously formed on the substrate sheet, and the electronic component is sealed with a porous resin film or porous foam to enclose the component in the resin layer. It is preferably used in the form of a conductive resin film, a flexible resin sheet, a porous resin sheet or a non-woven sheet. For example, a method described in JP-A-11-105476 can be used.

  Further, since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip.

  The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.

[Method of providing electronic component between first sheet material and second sheet material]
In this invention, in order to provide a predetermined electronic component between the first sheet material and the second sheet material, a heat bonding method, an adhesive bonding method, and an injection molding method are known as manufacturing methods. However, it may be bonded by any method. Further, the first sheet material and the second sheet material may be subjected to format printing or information recording either before or after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, It can be formed by any method such as an ink jet method, a sublimation transfer method, an electrophotographic method, and a heat melting method.

  The manufacturing method of the IC-mounted card base material of the present invention is as follows: JP-A-2000-036026, JP-A-2000-21855, JP-A-2000-21278, JP-A-10-316959, JP-A-11-5964, etc. An installation method is disclosed. Any bonding method, coating method, and the like can be used, and the present invention is not particularly limited.

  Moreover, as a method of arranging an adhesive member at a specific position, it can be manufactured by applying an adhesive at a predetermined position by a screen printing method, a gravure printing method or the like. In addition, when a hot melt adhesive is used, it can be applied to each arrangement by applying the adhesive from the nozzle in a bead shape with a hand gun type hot melt applicator.

  Alternatively, the adhesive processed into a film shape is cut to be placed in a predetermined arrangement, and after being placed in each arrangement, it can be bonded by heating and pressing.

[Sheet material for IC card substrate]
Examples of the support for the first sheet material or the second sheet material include, for example, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene. Polyfluorinated ethylene resins such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6 and nylon 6.6, polyvinyl chloride, vinyl chloride / Vinyl acetate copolymer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, vinyl polymer such as polyvinyl alcohol, vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, Life Biodegradable resins such as water-soluble polyvinyl alcohol, biodegradable cellulose acetate, biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, polymethyl methacrylate, polyethyl methacrylate, ethyl polyacrylate, Acrylic resins such as polybutyl acrylate, synthetic resin sheets such as polystyrene, polycarbonate, polyarylate, and polyimide, or paper such as fine paper, thin paper, glassine paper, and sulfuric acid paper, single layer such as metal foil, or these 2 A laminate having more than one layer is exemplified. The thickness of the substrate of the present invention is 30 to 300 μm, desirably 50 to 200 μm.

  In this invention, from the viewpoint of card base material transportability due to heat shrinkage and warping of the support, the thermal shrinkage rate at 150 ° C./30 min as a sheet material in addition to the low-temperature adhesive is 1.2% or less in the longitudinal direction (MD). The width (TD) is preferably 0.5% or less. Further, an easy-contact process may be performed on the substrate for post-processing to improve adhesion, and an antistatic process may be performed for chip protection. Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Crisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

  The second sheet material may be provided with a cushion layer in addition to the image receiving layer in order to form a face image of the card user. An image element is provided on the surface of the personal authentication card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided. It may be a card.

[Lamination]
At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the base material and the adhesion of a predetermined electronic component between the first sheet material and the second sheet material. It is preferable to manufacture by a laminate method or the like. The heating is preferably 10 to 180 ° C, more preferably 30 to 150. The pressurization is preferably 1.0 to 300 kgf / cm ² , more preferably 1.0 to 200 kgf / cm ² . If the pressure is higher than this, the IC chip will be damaged. The heating and pressurizing time is preferably 0.001 to 90 seconds, more preferably 0.001 to 60 seconds. If the time is longer than this, the production efficiency is lowered.

  The sheet for an IC card having an IC module having an IC chip and an antenna in the adhesive layer is stored under a predetermined condition in which the first sheet material and the second sheet material are bonded together via an adhesive. Thereafter, the IC card sheet is supplied to the punching die, and the IC card is manufactured by punching the IC card from the IC card sheet with the punching die. In this case, an authentication identification image or a bibliographic item may be recorded before punching.

[Method of applying transfer foil onto IC card]
Transfer of the transfer foil onto the transfer material is usually performed using a means capable of applying pressure while heating, such as a thermal head, a heat roller, or a hot stamp machine.

[Image-receiving layer that accepts sublimation or thermal diffusible dye image by thermal transfer recording method]
The image receiving layer in the second sheet material can be formed of a binder and various additives.

  The image-receiving layer in the present invention forms a gradation information-containing image by a sublimation type thermal transfer method, and forms a character information-containing image by a sublimation type thermal transfer method or a melt type thermal transfer method. The adhesion of the hot-melt ink must be good as well as the dyeability of the sublimable dye. In order to impart such special properties to the image receiving layer, it is necessary to appropriately adjust the types of binders and various additives and their blending amounts as described later.

  Hereinafter, the components forming the image receiving layer will be described in detail.

  As the binder for the image receiving layer in the present invention, a conventionally known binder for a sublimation type thermal transfer recording image receiving layer can be appropriately used. As the main binder, various binders such as vinyl chloride resin, polyester resin, polycarbonate resin, acrylic resin, polystyrene resin, polyvinyl acetal resin, and polyvinyl butyral resin can be used.

  However, if there is a practical requirement for the image formed by the present invention (for example, a predetermined heat resistance is required for the issued ID card), the binder's so as to satisfy such a requirement item. It is necessary to consider the type or combination. Taking heat resistance of the image as an example, if heat resistance of 60 ° C. or higher is required, it is preferable to use a binder having a Tg of 60 ° C. or higher in consideration of bleeding of the sublimable dye.

  Further, it is preferable to add a release agent to the image receiving layer. As an effective mold release agent, those compatible with the binder to be used are preferable, and specifically, modified silicone oil and modified silicone polymer are typical, for example, amino-modified silicone oil, epoxy-modified silicone oil, polyester-modified silicone. Examples thereof include oil, acrylic-modified silicone resin, and urethane-modified silicone resin. Of these, the polyester-modified silicone oil is particularly excellent in that it prevents fusion with the ink sheet but does not hinder the secondary processability of the image receiving layer. The secondary processability of the image-receiving layer refers to a writing property with magic ink, a laminating property that causes a problem when protecting a formed image, and the like. In addition, fine particles such as silica are also effective as a release agent. When secondary workability is not a problem, the use of a curable silicone compound is also effective as a measure for preventing fusion. Ultraviolet curable silicone, reaction curable silicone, and the like are available, and a great mold release effect can be expected.

  The image-receiving layer in the present invention is a coating method in which an image-receiving layer coating solution prepared by dispersing or dissolving the forming component in a solvent is prepared, and the image-receiving layer coating solution is applied to the surface of the support and dried. Can be manufactured by.

  The thickness of the image receiving layer formed on the surface of the support is generally 1 to 50 μm, preferably about 2 to 10 μm. In the present invention, a cushion layer or a barrier layer may be provided between the support and the image receiving layer. When the cushion layer is provided, there is little noise, and an image corresponding to the image information can be transferred and recorded with good reproducibility. Examples of the material constituting the cushion layer include urethane resin, acrylic resin, ethylene resin, polypropylene resin, butadiene rubber, epoxy resin, and photocurable resin described in JP-A-2002-222403. The thickness of the cushion layer is usually 1 to 50 μm, preferably 3 to 30 μm.

  In the present invention, an information carrier layer composed of format printing can be provided on the image receiving layer.

  An information carrier comprising a format print represents an information carrier provided with at least one selected from a plurality of identification information and book information. Specifically, a ruled line, a company name, a card name, and notes Indicates the issuer's phone number.

  For the formation of an information carrier consisting of format printing, use the “lithographic printing technology”, “new printing technology overview”, “offset printing technology”, “plate making / printing slightly understandable picture book” published by Japan Printing Technology Association, etc. It can be formed using the general inks described, and is formed of ink such as carbon in photocurable ink, oil-soluble ink, solvent-type ink, and the like.

  In some cases, watermark printing, holograms, fine prints, etc. may be used to prevent visual counterfeiting, and the printed material, hologram, barcode, matte pattern, fine prints, ground pattern, uneven pattern are used as the anti-counterfeiting prevention layer. Select timely, visible light absorbing color material, ultraviolet absorber, infrared absorber, fluorescent whitening material, metal deposition layer, glass deposition layer, bead layer, optical change element layer, pearl ink layer, neighboring pigment layer, It is also possible to provide the front sheet by printing or the like from an antistatic layer or the like.

[Writing layer]
The writing layer is a layer that allows writing on the back surface of the IC card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155. The writing layer is formed on a first sheet material in which a plurality of layers are not laminated. Addition of a material that improves slipperiness, such as wax, to the writing layer is effective in preventing damage and wear when rubbed. As the additive, polyethylene wax is preferably used.

[IC card creation method]
Here, an example of a method for producing an IC card of the present invention using a hot melt adhesive will be given. In producing the IC card, first, a hot melt adhesive is applied to a predetermined thickness on the front and back sheet materials with an applicator. As a coating method, a normal method such as a roller method, a T-die method, or a die method is used. In the case of coating in the form of stripes in the present invention, there is a method of intermittently opening the T-die slit, but it is not limited thereto. After bonding with a press or the like, it is punched into a predetermined shape and cut into a card shape to form a card. When a reactive adhesive is used as the adhesive, it is cut into a card shape after curing for a predetermined time. Another effective means is a method of making a hole for supplying moisture necessary for reaction around the card size of a bonded product bonded for promoting curing.

[Example 1]
EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, the aspect of this invention is not limited to this. In the following, “part” means “part by weight”.

[Create adhesive]
The adhesives used are the existing products and prototypes. Macroplast QR3460 made by Henkel
2. Macroplast QR5110 made by Henkel
3. Sdyne 9632 manufactured by Sekisui Chemical Co., Ltd.
4). Sdyne 2013MK manufactured by Sekisui Chemical Co., Ltd.
The above compound was applied to the adhesive supply section and coated under the above conditions.

<Creation of first sheet material (back sheet)>
U2L98W low heat yield grade 188 μm manufactured by Teijin DuPont Films Ltd. was used as a front sheet and a back sheet.
(Create writing layer)
The first writing layer forming coating solution, the second writing layer forming coating solution, and the third writing layer forming coating solution having the following composition were applied and dried in this order on the support 188 μm of the back sheet. The writing layer was formed by laminating so as to be 5 μm, 15 μm, and 0.2 μm.
<First writing layer forming coating solution>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black Trace amount Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second writing layer forming coating solution>
4 parts of polyester resin [Toyobo Co., Ltd .: Bironal MD1200]
Silica 5 parts Titanium dioxide particles [manufactured by Ishihara Sangyo Co., Ltd .: CR80] 1 part 90 parts of water <third writing layer forming coating solution>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sanmide 55] 5 parts Methanol 95 parts The center line average roughness of the obtained writing layer was 1.34 μm.
(Form format printing layer on the writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

<Creation of second sheet material (front sheet)>
U2L98W low heat yield grade manufactured by Teijin DuPont Films Ltd. was used as a front sheet and a back sheet. The thickness of the PET sheet is 188 μm on both sides.
(Create a table sheet)
A second sheet material (front sheet 1) formed by sequentially coating and drying a cushion layer and an image receiving layer comprising the following composition on a support 188 μm of the front sheet was formed.
(Photo-curing cushion layer) Film thickness 10μm
Urethane acrylate oligomer (Shin Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (Shin Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone ( Ciba Specialty Chemicals: Irgacure 184) 5 parts 100 parts of methyl ethyl ketone The actinic ray curable compound after application was dried at 90 ° C./30 sec and then photocured with a mercury lamp (300 mJ / cm ² ).
(Image receiving layer)
The first image-receiving layer forming coating solution, the second image-receiving layer forming coating solution and the third image-receiving layer forming coating solution having the following composition are applied and dried in this order on the cushion layer, and each thickness is 0. The image-receiving layer was formed by laminating so as to be 2 μm, 2.5 μm, and 0.5 μm.
<First image-receiving layer forming coating solution>
9 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BL-1]
Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second image-receiving layer forming coating solution>
6 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming third image-receiving layer>
Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitech E1000]
Urethane-modified ethylene acrylic acid copolymer 8 parts [manufactured by Toho Chemical Co., Ltd .: Hitec S6254]
Methyl cellulose [manufactured by Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part Water 90 parts (formation of information carrier consisting of format printing layer)
Format printing (employee ID, name) was performed on the image receiving layer by an offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
(Transparent resin layer formation)
The printing ink which consists of the following composition was mixed with the roll mill, and printing ink was created. Printing was performed on the image receiving layer by an offset printing method. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.
(Transparent resin layer composition 1)
Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dirocure 1173 (manufactured by Ciba Specialty Chemicals) 5 parts trimethylolpropane acrylate 10 parts (preparation of IC concealment layer)
By the resin convex printing method, watermark printing was performed on the outermost surface of the support opposite to the image receiving layer surface. The printing pattern was performed in either FIG. 8 or FIG. The printing printing ink was printed with UV black ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp. The film thickness was 1.0 μm.
[Used inlet]
Sand mat processing was applied to S series Tetron film manufactured by Teijin DuPont Films, and the surface roughness was adjusted as shown in Table 1. Further, an aluminum foil having a thickness of 10 μm was vapor-deposited on the film, and then an etching process was performed as in the form of an antenna wire. An IC chip, a reinforcing plate, and the like were placed on the base sheet thus obtained to obtain an IC card inlet.

<Creation of IC card image recording material>
Using the first sheet material (back sheet) shown in FIG. 10 and the second sheet material (surface sheet) shown in FIG. 11, the IC-mounted card substrate and IC card with an image receiving layer shown in FIG. An IC card base material was prepared using a base material preparation apparatus.

  An IC card base material creation as an embodiment will be described. FIG. 12 is a schematic configuration diagram showing an IC card base material creating apparatus.

  In the IC card base material creation device of the present invention, a long sheet-like first sheet material (back sheet) is set in the first sheet material supply unit, and a second sheet material (front sheet) of a single wafer sheet is set. Was set in the second sheet material supply section, and the adhesive was put into each adhesive supply section.

  Adhesive is supplied to the second sheet material from a moisture-curing type adhesive supply unit under nitrogen at a specific temperature by a T-die coating method, and an electronic component composed of FIGS. 4 and 5 having a thickness of 270 μm is supplied as an inlet. The second sheet material was conveyed by the second sheet conveying member. In order to prevent the temperature of the adhesive from lowering, the heating member using a heating and pressing roll was heated and heated.

An adhesive is supplied to the first sheet material by a T-die coating method from a moisture curable adhesive supply section under nitrogen at a specific temperature, and a moisture curable adhesive is applied to the first sheet material and the second sheet material. A composite composed of electronic components is bonded by a heat and pressure roll (pressure 3 kg / cm ² , roll surface temperature 70 ° C.) and a film thickness control roll, and a bonded product of an IC card base plate controlled to 740 μm is created. did.

  In the embodiment, in the present invention, at least the pressing of the inlet into the adhesive layer surface by pressing the supply unit head immediately after the inlet supply to the inlet and the pressing of the inlet into the adhesive layer surface by the “pressing roll” shown in FIG. One was implemented.

  In the cutting step, it is preferable to perform decorative cutting after the initial curing of the adhesive and the adhesion to the electronic component support have been sufficiently performed. In consideration of cutting properties, the adhesive does not necessarily need to be completely cured. The produced bonded product is conveyed by an IC-mounted card base material conveyance unit, cut into a sheet by 65 cm length with a rotary cutter, and then used as a punching device as shown in FIG. An image card for a size IC card could be obtained.

  When there was no format printing part on the front and back surfaces of the finished card substrate, the logo and OP varnish were printed sequentially by a resin letterpress printing method with a card printer. Further, the conditions for producing the IC card substrate of the present invention and the conditions such as the moisture curable adhesive, the adhesive application temperature, and the temperature at the time of bonding the adhesive are listed in the table.

  The IC card base material creating apparatus shown in FIG. 12 is a one-liquid adhesive type, but a two-liquid type adhesive using the IC card base material creating apparatus shown in FIG. 13 can also be used. The two-component adhesive of the IC card base material making apparatus shown in FIG. 13 includes a liquid A supply unit and a liquid B supply unit, and is obtained by mixing and mixing the liquid A and the liquid B in the mixing unit. Air bubbles are removed from the adhesive at the defoaming section and supplied to the respective adhesive supply sections.

  The IC card base material creating apparatus shown in FIG. 14 is a one-component adhesive type as shown in FIG. 12, but a push roll is arranged at the rear stage of the inlet supply section, and the inlet is made of the second sheet material by the push roll. It is pushed into the adhesive and sent to the laminating part of the laminate.

  In this cutting process, a card punching machine shown in FIGS. 15 and 16 is used. In this embodiment, the card punching machine is constituted by a punching die device, FIG. 15 is an overall schematic perspective view of the punching die device, and FIG. 16 is a front end view of the main part of the punching die device. It is.

  This punching die apparatus includes a punching die having an upper blade 110 and a lower blade 120, and the upper blade 110 includes a punching punch 111 provided with a relief 141 inside the outer extension, and the lower blade 120. Has a punching die 121. An IC card having the same size as the die hole 122 is punched by lowering the punch 111 for punching into a die hole 122 provided at the center of the punching die 121. For this reason, the size of the punch 111 for punching is slightly smaller than the size of the die hole 122. A blade whose upper cutting blade has an angle close to a right angle is generally called a punch die, and a blade having an acute angle is called a hollow blade. The punch die method is usually a drop-off method, but a hollow blade is often provided with an underlay without being removed.

In this example, a punch die method in which the angle of the cutting blade was 90 ° C. was used.
[IC card creation method]
[Method of describing authentication identification image and attribute information image on IC card]
(Creation of ink sheet for sublimation thermal transfer recording)
A 6 μm-thick polyethylene terephthalate sheet with anti-fusing processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta and cyan were obtained.
<Coating liquid for yellow ink layer formation>
Yellow dye (MSY Yellow manufactured by Mitsui Toatsu Dye Co., Ltd.) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Coating liquid for forming a magenta ink layer>
Magenta dye (MS Magenta, manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts 5.5 parts of polyvinyl acetal [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate modified polystyrene 2 parts [Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution>
Cyan dye (Nippon Kayaku Co., Ltd. Kayaset Blue 136) 3 parts Polyvinyl acetal 5.6 parts [Electrochemical Industry Co., Ltd .: Denkabutyral KY-24]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
20 parts of methyl ethyl ketone (preparation of ink sheet for melt type thermal transfer recording)
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.
<Ink layer forming coating solution>
Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemicals: EV40Y]
Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries, Ltd .: Tamanol 521] 5 parts Methyl ethyl ketone 90 parts (formation of face image)
The image receiving layer or transparent resin portion, the information printing portion and the ink side of the sublimation type thermal transfer recording ink sheet are overlapped, and the output is 0.23 W / dot and the pulse width is 0.3 to 4 using the thermal head from the ink sheet side. A human image having gradation in the image was formed on the image receiving layer by heating under conditions of 5 ms and a dot density of 16 dots / mm. In this image, the dye and the nickel of the image receiving layer form a complex.
(Formation of character information)
The transparent resin part and the ink side of the melt type thermal transfer recording ink sheet are overlapped, and the condition of output 0.5 W / dot, pulse width 1.0 ms, dot density 16 dots / mm using the thermal head from the ink sheet side The character information was formed on the IC card image recording body by heating with.

  The face image and attribute information are provided as described above.

[Create IC card surface protection foil]
(Preparation of transfer foil 1)
A transfer foil 1 was prepared by laminating the following composition on a release layer of a polyethylene terephthalate film 2 having a thickness of 25 μm provided with a release layer of a 0.1 μm fluororesin layer.
(Actinic ray curable compound)
Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink surfactant F-179 0.25 part <intermediate layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts after coating Curing of the curing agent was performed at 50 ° C. for 24 hours.
<Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts ( Creation of transfer foil 2)
The following composition was laminated | stacked on the mold release layer of the 25-micrometer-thick polyethylene terephthalate film 2 which provided the mold release layer of the 0.1 micrometer fluororesin layer, and the actinic-light curable transfer foil 2 was produced.
(Actinic ray curable compound)
Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink surfactant F-179 0.25 part <intermediate layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts after coating Curing of the curing agent was performed at 50 ° C. for 24 hours.
<Barrier layer forming coating solution> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 1 part Toughtex M-1913 (Asahi Kasei) 8 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1 part Methyl ethyl ketone 90 parts <Adhesive layer forming coating Liquid> Film thickness 0.5μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitech S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts Image A pressure of 150 kg / cm ² using a heat roller having a diameter of 5 cm and a rubber hardness of 85 was heated to a surface temperature of 200 ° C. using the transfer foil 1 and the transfer foil 2 having the above-described configuration on the image receiving body on which characters were recorded. Then, heat was applied for 1.2 seconds, and transfer was performed in the order of transfer foil 1 and transfer foil 2. The transfer was performed using the IC card making apparatus shown in FIG.

  FIG. 17 shows a card printer as an IC card creation device. In the card printer, a card base material supply unit 10 and an information recording unit 20 are arranged at an upper position, and a transparent protective layer and / or optical are arranged at a lower position. A change element transfer layer application part / or resin layer application part 70 is arranged, and thereafter a transparent protective layer and / or an optical change element transfer layer application part / or resin layer application part 70 are arranged, and a card is used as an image recording body. create.

  In the card base material supply unit 10, for example, a plurality of card base materials 50 that have been cut into pieces in advance to write the personal information of the card user created in FIG. Stocked up. In this example, the card substrate 50 includes a support and an image receiving layer, and the card substrate 50 is automatically supplied one by one from the card substrate supply unit 10 at a predetermined timing.

  In the information recording unit 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged correspondingly. While the card substrate 50 is being moved by thermal transfer using a thermal transfer sheet such as a yellow ribbon, magenta ribbon, or cyan ribbon, an image area having a gradation such as a photo of the card user is recorded in a predetermined area of the image receiving layer. Is done.

Further, a character ribbon cassette 31 and a recording head 32 are arranged, and authentication identification information such as a name and a card issuance date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon, and an image recording layer is formed. In this information recording unit 20, a gradation information image is formed on the image receiving layer by heating imagewise, and the recording head condition when forming the image is pressurized in the range of 0.01 to 0.3 kg / cm ² , The head is formed at a temperature of 50 to 500 ° C.

  In the transparent protective layer and / or the optical change element transfer layer applying unit / or the resin layer applying unit 70, a transfer foil cassette 71 is arranged, and a thermal transfer head 72 is arranged corresponding to the transfer foil cassette 71. The optical change element transfer foil 43 and / or the transparent protective transfer foil 64 and the curable transfer foil 66 are transferred, and an optical change element transfer layer and / or a transparent protective transfer layer and a curable protective layer-containing transfer layer are provided.

  The card obtained as described above was subjected to card printing using a commercially available printing machine.

The evaluation of this example is shown below.
Evaluation of physical properties [Evaluation of adhesion]
As for the degree of adhesion, the surface was photographed with a high magnification lens at a magnification of 2000 using a digital HF microscope VH-604 manufactured by Keyence Corporation, the area of the adhesion part was obtained, and the degree of adhesion was calculated from the following formula.

  The part which was not closely_contact | adhering was able to observe the state which floated because of the space | gap.

(Area of close contact / total area) × 100
The adhesion is preferably in the range of 70 to 100%, more preferably 75 to 100%.

[Peel strength measurement]
The laminated sheet material is cut into a width of 2.5 cm, and the unbonded portion of the end of the laminated sheet material is gripped using the FUDO RHEO METER NRM-2002J manufactured by Fudo Kogyo Co., Ltd. The maximum strength until peeling was measured. A desirable value is 1500 g / 2.5 cm or more. When it was outside the measurement range, the sheet width to be cut was narrowed and measured, and converted to 2.5 cm. [Card cutting]
A punch die or a hollow blade was placed on the card punching machine shown in FIGS. 15 and 16 and punched into a card form, and then the card cross section was observed and evaluated in five stages. A result of 4 or more is a preferable result.
5: No burrs or adhesive sticking out of the base material on the card cross section, and the cross section is smooth.
4: No burrs or adhesive sticking out of the base material on the card cross section.
3: There is no burr of the base material on the card cross section, but the adhesive protrudes and the cross section is rough.
2: The burr | flash of a base material generate | occur | produces in the card | curd cross section, the adhesive has protruded, and a cross section becomes rough.
1: The base material burr | flash generate | occur | produced in the card | curd cross section, and the adhesive has protruded greatly.

[Card durability]
As shown in FIG. 18, the personal authentication card created to the end as described above has a long side direction every 125 times so that the long side direction of the card is 35 mm and the short side direction of the card is 15 mm. A total of 1000 tests were performed in the short side direction under the condition of a period of 30 / min. Thereafter, the IC function was confirmed with a commercially available reader / writer, and evaluation was performed in five stages. A result of 4 or more is a preferable result.
5: No deformation and no problem with IC function.
4: Although there is some deformation, there is no problem in the IC function.
3: There is no deformation or somewhat, but the IC function is lost.
2: It is greatly deformed and the IC function is lost.
1: The IC function is lost due to bending.

[Card impact]
Using a device as shown in FIG. 19, a test was made to freely drop 50 g of a rope with a radius of 1 cm on the created IC card, and the height at which the IC chip was damaged was determined. The higher the height, the higher the impact resistance. A card having an impact force of 20 cm or more was set to a practical level.

The results are shown in Table 1.
Table 1

  From the results of Table 1, in this invention, in comparison with the comparative example, the card durability, the protective foil adhesion, the card physical property, the adhesive physical property, and the solvent resistance are excellent, and the effect of the invention is recognized. It is done.

  In the present invention, an adhesive is applied between a first sheet material and a second sheet material, and an IC module formed on a support is enclosed in the adhesive layer. ICs such as licenses such as built-in car licenses, ID card, passport, alien registration card, library card, cash card, credit card, employee ID card, employee ID card, employee ID card, membership card, medical card and student ID card Applicable to card and IC card manufacturing methods.

It is a schematic block diagram of the creation process of an IC card. It is sectional drawing of the image formation body of an IC card. It is a top view of an IC module. It is a side view of an inlet. It is a top view of an inlet. It is sectional drawing of the bonded product of an IC card. It is sectional drawing of the bonded product of another IC card. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows the printing pattern of watermark printing on the support body outermost surface opposite to an image receiving layer surface. It is a figure which shows a 1st sheet material (back sheet). It is a figure which shows a 2nd sheet material (surface sheet). It is a schematic block diagram which shows an IC card base material preparation apparatus. It is a schematic block diagram which shows an IC card base material preparation apparatus. It is a schematic block diagram which shows an IC card base material preparation apparatus. 1 is an overall schematic perspective view of a punching die device. It is a front end view of the principal part of a punching die apparatus. It is a figure which shows the card printer as an IC card production apparatus. It is a figure explaining a card | curd durability test. It is a figure explaining a card impact test.

Explanation of symbols

1 First sheet material (back sheet)
2 Second sheet material (front sheet)
DESCRIPTION OF SYMBOLS 3 Inlet 3a Electronic component 3a1 Antenna 3a2 IC chip 3b Reinforcement board 6,7 Adhesive layer 8a Image receiving layer 8b Personal identification information 8c Transparent protective layer 9a Writing layer A 1st sheet material supply part B 2nd sheet material supply part C , G Adhesive supply part D, H Adhesive heating part E Inlet supply part F Back roller part I Heating part J Caterpillar press part K Cutting part L Punching part

Claims (13)

An IC having a multilayer structure manufactured by applying an adhesive between the first sheet material and the second sheet material, and charging the adhesive layer with an inlet having an IC module formed on a support. In the card manufacturing method,
The adhesion force with the first sheet material or the second sheet material when the inlet having the IC module is loaded is 0.1 (N / 10 mm) or more and 2.0 (N / 10 mm) or less. An IC card manufacturing method characterized by the above. 2. The IC card manufacturing method according to claim 1, wherein the inlet is in a film form, and the value of the arithmetic average height Ra of the surface is 0.02 [mu] m to 50 [mu] m. When the inlet is loaded and the first sheet material and the second sheet material are bonded together, the surface of the adhesive applied on the first sheet material and the second sheet material immediately before the bonding The IC card manufacturing method according to claim 1, wherein the adhesive strength of the IC card is 6 (N / 10 mm) or more. The IC card according to any one of claims 1 to 3, wherein an upper portion of the inlet is pressed after the adhesive surface of the first sheet material is heated and bonded to the second sheet material. Manufacturing method. The IC card according to any one of claims 1 to 3, wherein the pressing member is heated, and the pressing member is a roller, and is bonded to the second sheet material after pressing. Manufacturing method. 4. The IC card manufacturing method according to claim 1, wherein at least a part of an upper surface of the inlet is pressurized after the inlet supply unit arranges the inlet. 5. Create a bonded product by the IC card manufacturing method according to claim 1 to claim 6,
A method of manufacturing an IC card, comprising cutting the bonded product into a single sheet before punching the bonded product into a card. Create a bonded product by the IC card manufacturing method according to claim 1 to claim 6,
The method for producing an IC card according to claim 1, wherein format printing is performed on a non-printed surface of the bonded product before punching the bonded product into a card shape. An IC card manufactured by the IC card manufacturing method according to claim 1 to claim 6,
The IC card has an image receiving layer on at least one side of the first sheet material or the second sheet material, and is provided with personal identification information including a name and a face image by a thermal transfer method or an ink jet method, and can be written on at least a part. An IC card having a writing layer. 10. The IC card according to claim 9, wherein a transparent protective layer is provided on an upper surface on which personal identification information including the name and face image is provided, and the transparent protective layer is made of an actinic ray curable resin. The IC card according to claim 9 or 10, wherein an IC chip of the IC card does not exist at a position overlapping a face image portion. The IC card according to claim 9, wherein the IC card is a non-contact type. 13. The IC card according to claim 9, wherein the surface of the IC card has a planar unevenness of a chip peripheral portion within ± 10 μm.

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